TWI715429B - Liquid crystal panel cutting device and liquid crystal panel cutting method - Google Patents
Liquid crystal panel cutting device and liquid crystal panel cutting method Download PDFInfo
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一種液晶面板切割裝置,用於切割液晶面板,液晶面板包括上板、下板及液晶夾層,液晶面板切割裝置包含:第一刀具、第二刀具及控制構件,第一刀具具有彼此相隔一距離的二第一刀輪,第二刀具具有一第二刀輪,第一刀具與第二刀具為彼此相向且第二刀輪位於該等第一刀輪之間,控制構件訊號連接第一刀具及第二刀具,控制構件控制第一刀具沿重力方向向下切割上板,以及控制第二刀具反向於重力方向向上切割下板。經由本發明的液晶面板切割裝置,解決先前技術的材料浪費以及生產成本損耗的問題。本發明並提供一種液晶面板切割方法。 A liquid crystal panel cutting device is used for cutting liquid crystal panels. The liquid crystal panel includes an upper plate, a lower plate and a liquid crystal interlayer. The liquid crystal panel cutting device includes a first cutter, a second cutter and a control member. The first cutter has a distance from each other. Two first cutter wheels, the second cutter has a second cutter wheel, the first cutter and the second cutter are opposite to each other, the second cutter wheel is located between the first cutter wheels, and the control member signals connect the first cutter and the second cutter Two cutters, the control component controls the first cutter to cut the upper plate downwards in the direction of gravity, and controls the second cutter to cut the lower plate upwards against the direction of gravity. The liquid crystal panel cutting device of the present invention solves the problems of material waste and production cost loss in the prior art. The invention also provides a method for cutting a liquid crystal panel.
Description
本發明係關於一種切割裝置以及切割方法,更特別的是關於一種液晶面板切割裝置以及液晶面板切割方法。 The invention relates to a cutting device and a cutting method, and more particularly to a liquid crystal panel cutting device and a liquid crystal panel cutting method.
液晶面板通常包含兩片基板以及夾合在中間的液晶。如圖1所示,當液晶面板L欲進行裁切時,傳統的方法是利用兩個刀具T有些錯位地分別切割上板L1與下板L3,以將液晶面板L分成左右兩個部件。一般來說,切口朝下的右邊部件為面積較小的邊緣部分,且液晶受到重力的影響,右邊部件的液晶夾層L2的液晶會自切口滲漏,因此右邊部件通常將被捨棄而無法使用。當圖1的兩個刀具T錯位配置時,則會變成左邊部件被捨棄而無法使用。由於裁切後的液晶面板不適合翻面,因此傳統的裁切方法並無法將大的液晶面板裁切成數片小的液晶面板,若以傳統的裁切方法將大的液晶面板裁切成數片小的液晶面板將會造成材料的浪費以及生產成本的損耗。 A liquid crystal panel usually includes two substrates and a liquid crystal sandwiched between them. As shown in FIG. 1, when the liquid crystal panel L is to be cut, the traditional method is to use two cutters T to cut the upper plate L1 and the lower plate L3 with some misalignment, so as to divide the liquid crystal panel L into left and right parts. Generally speaking, the right part with the cut down is a small edge part, and the liquid crystal is affected by gravity. The liquid crystal of the liquid crystal interlayer L2 of the right part will leak from the cut, so the right part will usually be discarded and cannot be used. When the two tools T in Fig. 1 are misplaced, the left part is discarded and cannot be used. Since the cut liquid crystal panel is not suitable for turning over, the traditional cutting method cannot cut the large liquid crystal panel into several small liquid crystal panels. If the traditional cutting method is used to cut the large liquid crystal panel into several A small LCD panel will cause waste of materials and loss of production costs.
因此,為解決習知液晶面板的裁切的種種問題,本發明提出一種液晶面板切割裝置以及液晶面板切割方法。 Therefore, in order to solve various problems in the cutting of conventional liquid crystal panels, the present invention provides a liquid crystal panel cutting device and a liquid crystal panel cutting method.
為達上述目的及其他目的,本發明提出一種液晶面板切割裝置,用於切割一液晶面板,該液晶面板包括一上板、一下板及一設置於該上板及該下板之間的液晶夾層,該液晶面板切割裝置包含:一第一刀具,具有彼此 相隔一距離的二第一刀輪;一第二刀具,具有一第二刀輪,該第一刀具與該第二刀具為彼此相向且該第二刀輪位於該等第一刀輪之間;以及一控制構件,訊號連接該第一刀具及該第二刀具,該控制構件控制該第一刀具沿一重力方向向下切割該上板,以及控制該第二刀具反向於該重力方向向上切割該下板。 To achieve the above and other objectives, the present invention provides a liquid crystal panel cutting device for cutting a liquid crystal panel. The liquid crystal panel includes an upper plate, a lower plate, and a liquid crystal interlayer disposed between the upper plate and the lower plate , The liquid crystal panel cutting device includes: a first cutter, with each other Two first cutter wheels separated by a distance; a second cutter having a second cutter wheel, the first cutter and the second cutter are facing each other and the second cutter wheel is located between the first cutter wheels; And a control member for signal connection with the first cutter and the second cutter, the control member controls the first cutter to cut the upper plate downward along a gravity direction, and controls the second cutter to cut upwards in the opposite direction to the gravity direction The lower board.
於本發明之一實施例中,該第二刀具被設置為可相對該第一刀具而沿一水平方向滑移。 In an embodiment of the present invention, the second tool is configured to be slidable in a horizontal direction relative to the first tool.
於本發明之一實施例中,該第二刀具的第二刀輪在一水平方向上固定設置於該第一刀具的二第一刀輪之間。 In an embodiment of the present invention, the second cutter wheel of the second cutter is fixedly arranged between the two first cutter wheels of the first cutter in a horizontal direction.
於本發明之一實施例中,該等第一刀輪彼此相隔1公釐。 In an embodiment of the present invention, the first cutter wheels are separated by 1 mm from each other.
於本發明之一實施例中,該第一刀具更包括一刀輪間距調整構件,該刀輪間距調整構件連接該等第一刀輪以及該控制構件,該刀輪間距調整構件經由該控制構件調整該等第一刀輪的間距。 In an embodiment of the present invention, the first tool further includes a cutter wheel spacing adjusting member connected to the first cutter wheels and the control member, and the cutter wheel spacing adjusting member is adjusted via the control member The distance between the first cutter wheels.
於本發明之一實施例中,更包括一液晶面板感測構件,該液晶面板訊號連接該控制構件,該液晶面板感測構件感測是否有該液晶面板置放於該第一刀具及該第二刀具之間。 In one embodiment of the present invention, it further includes a liquid crystal panel sensing component, the liquid crystal panel signal is connected to the control component, and the liquid crystal panel sensing component senses whether the liquid crystal panel is placed on the first cutter and the first cutter. Between two tools.
本發明又提出一種液晶面板切割方法,其以一液晶面板切割裝置切割一液晶面板,該液晶面板包括一上板、一下板及一設置於該上板及該下板之間的液晶夾層,該液晶面板切割裝置包括一第一刀具及一第二刀具,該第一刀具及該第二刀具彼此相向,且該第一刀具具有彼此相隔一距離的二第一刀輪,該第二刀具具有一第二刀輪,該第二刀輪位於該等第一刀輪之間,該液晶面板切割方法包含下列步驟:使該第一刀具沿一重力方向向下切割該上板;使該第二刀具反向於該重力方向向上切割該下板,該下板的切痕位於該上板的二 切痕之間;移除該上板的二切痕之間的部位;依照該第二刀具所產生的切痕將該液晶面板分為二個液晶面板部件;以及密封該二個液晶面板部件的切割邊緣。 The present invention further provides a method for cutting a liquid crystal panel. A liquid crystal panel cutting device is used to cut a liquid crystal panel. The liquid crystal panel includes an upper plate, a lower plate, and a liquid crystal interlayer disposed between the upper plate and the lower plate. The liquid crystal panel cutting device includes a first cutter and a second cutter. The first cutter and the second cutter face each other, and the first cutter has two first cutter wheels separated by a distance from each other. The second cutter has a The second cutter wheel is located between the first cutter wheels. The liquid crystal panel cutting method includes the following steps: making the first cutter cut the upper plate downward in a direction of gravity; making the second cutter Cut the lower plate upwards opposite to the direction of gravity, and the cut marks of the lower plate are located on the two sides of the upper plate. Between the cut marks; remove the part between the two cut marks of the upper plate; divide the liquid crystal panel into two liquid crystal panel parts according to the cut marks produced by the second cutter; and seal the two liquid crystal panel parts Cut the edges.
於本發明之一實施例中,更包含下列步驟:感測是否有該液晶面板置放於該第一刀具及該第二刀具之間。 In an embodiment of the present invention, the method further includes the following steps: sensing whether the liquid crystal panel is placed between the first cutter and the second cutter.
藉此,本發明的液晶面板切割裝置以及液晶面板切割方法,可使被切割的液晶面板的液晶不外漏,而使被裁切的兩個液晶面板部件都能投於後續的生產製造,不造成材料浪費,並降低生產成本。 Thereby, the liquid crystal panel cutting device and the liquid crystal panel cutting method of the present invention can prevent the liquid crystal of the cut liquid crystal panel from leaking, so that the two liquid crystal panel parts that are cut can be used for subsequent production. Cause material waste and reduce production costs.
100:液晶面板切割裝置 100: LCD panel cutting device
100a:液晶面板切割裝置 100a: LCD panel cutting device
1:第一刀具 1: The first tool
11:第一刀輪 11: The first knife wheel
12:刀輪間距調整構件 12: Cutter wheel spacing adjustment component
2:第二刀具 2: Second tool
21:第二刀輪 21: Second knife wheel
3:控制構件 3: control component
4:液晶面板感測構件 4: LCD panel sensing component
d:距離 d: distance
G:重力方向 G: direction of gravity
H:水平方向 H: horizontal direction
L:液晶面板 L: LCD panel
L1:上板 L1: Upper plate
L2:液晶夾層 L2: Liquid crystal interlayer
L3:下板 L3: Lower board
M:膠體 M: colloid
T:刀具 T: Tool
S101:步驟 S101: Step
S102:步驟 S102: Step
S103:步驟 S103: steps
S104:步驟 S104: Step
S105:步驟 S105: Step
S106:步驟 S106: Step
圖1係為先前技術的液晶面板切割示意圖。 FIG. 1 is a schematic diagram of cutting a liquid crystal panel in the prior art.
圖2係為根據本發明實施例之液晶面板切割裝置之示意圖。 FIG. 2 is a schematic diagram of a liquid crystal panel cutting device according to an embodiment of the invention.
圖3係為根據本發明實施例之液晶面板切割步驟之示意圖一。 FIG. 3 is a first schematic diagram of a liquid crystal panel cutting step according to an embodiment of the present invention.
圖4係為根據本發明實施例之液晶面板切割步驟之示意圖二。 FIG. 4 is a schematic diagram of the second step of cutting a liquid crystal panel according to an embodiment of the present invention.
圖5係為根據本發明實施例之液晶面板切割步驟之示意圖三。 5 is a schematic diagram of the third step of cutting a liquid crystal panel according to an embodiment of the present invention.
圖6係為根據本發明實施例之液晶面板切割步驟之示意圖四。 FIG. 6 is a fourth schematic diagram of the cutting step of a liquid crystal panel according to an embodiment of the present invention.
圖7係為根據本發明實施例之液晶面板切割方法之流程圖。 FIG. 7 is a flowchart of a method for cutting a liquid crystal panel according to an embodiment of the present invention.
圖8係為根據本發明另一實施例之液晶面板切割裝置之示意圖。 FIG. 8 is a schematic diagram of a liquid crystal panel cutting device according to another embodiment of the invention.
圖9係為根據本發明又一實施例之第一刀具之示意圖。 Fig. 9 is a schematic diagram of a first cutter according to another embodiment of the present invention.
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後:
如圖1所示,本發明實施例之液晶面板切割裝置100,用於切割一液晶面板L。液晶面板L包括一上板L1、一下板L3及一設置於上板L1及下板L3之間的液晶夾層L2。在本實施例中,上板L1及下板L3分別為薄膜電晶體(Thin-Film Transistor,TFT)陣列基板以及彩色濾光片(Color Filter,CF)。然而本發明不限於此,上板L1及下板L3可為任何可夾合容置液晶夾層L2的板狀構件。
In order to fully understand the present invention, a detailed description of the present invention is given with the following specific embodiments and accompanying drawings. Those skilled in the art can understand the purpose, features and effects of the present invention from the content disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of patent application of the present invention. The description is as follows:
As shown in FIG. 1, the liquid crystal
液晶面板切割裝置100包含:一第一刀具1、一第二刀具2及一控制構件3。
The liquid crystal
第一刀具1具有彼此相隔一距離的二第一刀輪11。
The
第二刀具2具有一第二刀輪21,第一刀具1與第二刀具2被設置為彼此相向且第二刀輪21位於二第一刀輪11之間。換句話說,二第一刀輪11及第二刀輪21的刀鋒為彼此相向。
The
控制構件3訊號連接第一刀具1及第二刀具2,控制構件3控制第一刀具1沿一重力方向G向下切割上板L1,以及控制第二刀具2反向於重力方向G而向上切割下板L3。
The
接下來請參考圖3至圖7,以說明使用本發明的液晶面板切割裝置100切割液晶面板L的液晶面板切割方法。
Next, please refer to FIG. 3 to FIG. 7 to illustrate the liquid crystal panel cutting method for cutting the liquid crystal panel L using the liquid crystal
如圖3所示,首先,如步驟S102,控制構件3控制第一刀具1的二第一刀輪11沿重力方向G向下切割上板L1,而在上板L1留下平行的兩道切痕(如虛線所示),該平行方向為垂直紙面。
As shown in FIG. 3, first, in step S102, the
如步驟S103,控制構件3並控制第二刀具2的第二刀輪21反向於重力方向G向上切割下板L3,且下板L3的切痕位於上板L1的二道切痕之間。
In step S103, the
接著,如步驟S104及圖4所示,移除上板L1的二道切痕之間的部位。 Then, as shown in step S104 and FIG. 4, the part between the two cuts of the upper plate L1 is removed.
如步驟S105及圖5所示,依照第二刀具2所產生的切痕將液晶面板L分為二個液晶面板部件。由於液晶夾層L2都有下方的下板L3所承托,因此液晶不外漏。
As shown in step S105 and FIG. 5, the liquid crystal panel L is divided into two liquid crystal panel components according to the cut marks produced by the
最後,如步驟S106及圖6所示,以膠體M密封二個液晶面板部件的切割邊緣。膠體M可以是紫外線硬化膠或任何常規使用的膠體,且本發明不限於此。 Finally, as shown in step S106 and FIG. 6, the cut edges of the two liquid crystal panel components are sealed with glue M. The colloid M may be an ultraviolet curable glue or any conventionally used colloid, and the present invention is not limited thereto.
經由本發明的液晶面板切割裝置100以及液晶面板切割方法,可使被切割的液晶面板L的液晶不外漏,而使被裁切的兩個液晶面板部件都能投於後續的生產製造,不造成材料浪費,並降低生產成本。
Through the liquid crystal
進一步地,在一個實施例中,如圖2所示,第二刀具2具有較高的自由度,其被設置為可相對第一刀具1沿一水平方向H滑移。水平方向H為垂直於重力方向G的方向。在進行液晶面板裁切作業時,控制構件3調整第二刀具2的第二刀輪21的位置,使第二刀輪21在水平方向H位於二第一刀輪11之間調整
位置。另外,第二刀具2的第二刀輪21可藉由線性馬達、液壓缸或氣壓缸的帶動而於水平方向H上調整位置。再者,第一刀具1的二第一刀輪11亦可藉由線性馬達、液壓缸或氣壓缸的帶動而於水平方向H上調整位置。
Further, in one embodiment, as shown in FIG. 2, the
進一步地,在一個相反的實施例中,如圖8所示,液晶面板切割裝置100a的第二刀具2的第二刀輪21在水平方向H上固定設置於第一刀具1的二第一刀輪11之間。換句話說,第二刀輪21只能沿著重力方向G或反向於重力方向G移動,其在水平方向H上與二第一刀輪11的位置關係是固定好的,進行裁切作業時,不需要仰賴控制構件3重新調整第二刀具2的第二刀輪21的位置。
Further, in an opposite embodiment, as shown in FIG. 8, the
進一步地,在一個實施例中,第一刀具1的二第一刀輪11彼此相隔1公釐以減少材料的浪費,然而本發明不限於此。
Further, in one embodiment, the two
進一步地,在一個實施例中,如圖9所示,第一刀具1更包括一刀輪間距調整構件12,刀輪間距調整構件12連接第一刀具1的二第一刀輪11以及控制構件3。刀輪間距調整構件12依據控制構件3的指示,調整第一刀具1的二第一刀輪11的距離d。刀輪間距調整構件12例如是步進馬達與齒輪或螺桿的組合,利用馬達正轉或反轉的方式相應地調整二第一刀輪11的距離d。然而本發明不限於此,本發明亦可以利用其他的機械手段例如線性馬達、液壓缸或氣壓缸而調整二第一刀輪11的距離d。
Further, in one embodiment, as shown in FIG. 9, the
進一步地,在一個實施例中,如圖2所示,液晶面板切割裝置100更包括一液晶面板感測構件4,液晶面板感測構件4訊號連接控制構件3。如圖7的步驟S101所示,液晶面板感測構件4感測是否有液晶面板L置放於第一刀具1及第二刀具2之間。若有,則控制構件3執行後續的液晶面板切割方法。在本實施例中,液晶面板感測構件4是接觸式感測構件,被觸碰時則發送訊號給
控制構件3。然而本發明不限於此,液晶面板感測構件4亦可以是其他形式或利用其他科學原理的感測構件,例如光學感測構件、電學感測構件、或其他種類的力學感測構件。
Further, in one embodiment, as shown in FIG. 2, the liquid crystal
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed in the above embodiments. However, those skilled in the art should understand that the embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
100:液晶面板切割裝置 100: LCD panel cutting device
1:第一刀具 1: The first tool
11:第一刀輪 11: The first knife wheel
2:第二刀具 2: Second tool
21:第二刀輪 21: Second knife wheel
3:控制構件 3: control component
4:液晶面板感測構件 4: LCD panel sensing component
G:重力方向 G: direction of gravity
H:水平方向 H: horizontal direction
L1:上板 L1: Upper plate
L2:液晶夾層 L2: Liquid crystal interlayer
L3:下板 L3: Lower board
Claims (6)
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TW109103192A TWI715429B (en) | 2020-02-03 | 2020-02-03 | Liquid crystal panel cutting device and liquid crystal panel cutting method |
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TW109103192A TWI715429B (en) | 2020-02-03 | 2020-02-03 | Liquid crystal panel cutting device and liquid crystal panel cutting method |
Publications (2)
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TWI715429B true TWI715429B (en) | 2021-01-01 |
TW202131398A TW202131398A (en) | 2021-08-16 |
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Country Status (1)
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TW (1) | TWI715429B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1386891A1 (en) * | 2001-04-02 | 2004-02-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
US20070164072A1 (en) * | 2003-01-29 | 2007-07-19 | Yoshitaka Nishio | Substrate dividing apparatus and method for dividing substrate |
TWM465404U (en) * | 2013-02-05 | 2013-11-11 | Tian Yu Technology Co Ltd | Special shape multi-blade cutting machine |
-
2020
- 2020-02-03 TW TW109103192A patent/TWI715429B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1386891A1 (en) * | 2001-04-02 | 2004-02-04 | Mitsuboshi Diamond Industrial Co., Ltd. | Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
US20070164072A1 (en) * | 2003-01-29 | 2007-07-19 | Yoshitaka Nishio | Substrate dividing apparatus and method for dividing substrate |
TWM465404U (en) * | 2013-02-05 | 2013-11-11 | Tian Yu Technology Co Ltd | Special shape multi-blade cutting machine |
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TW202131398A (en) | 2021-08-16 |
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