TWI715399B - Antenna module and electronic device - Google Patents
Antenna module and electronic device Download PDFInfo
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- TWI715399B TWI715399B TW108148737A TW108148737A TWI715399B TW I715399 B TWI715399 B TW I715399B TW 108148737 A TW108148737 A TW 108148737A TW 108148737 A TW108148737 A TW 108148737A TW I715399 B TWI715399 B TW I715399B
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Abstract
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本發明是有關於一種天線模組及電子裝置,且特別是有關於一種具有電磁波屏蔽層的天線模組及具有此天線模組的電子裝置。The present invention relates to an antenna module and an electronic device, and more particularly to an antenna module with an electromagnetic wave shielding layer and an electronic device with the antenna module.
近年來,智慧型手機(smart phone)、平板電腦(tablet PC)及筆記型電腦(notebook computer)等電子裝置之運作速度不斷地提高,連帶地電子裝置內之電子元件產生的雜訊亦不斷地增加。詳細而言,電子裝置中的電子元件在工作時通常會產生電磁波,此電磁波會成為干擾電子裝置內之天線的雜訊而導致天線收發訊號能力有所降低。In recent years, the operating speed of electronic devices such as smart phones, tablet PCs, and notebook computers has continued to increase, and the noise generated by electronic components in electronic devices has also continued to increase. increase. In detail, the electronic components in the electronic device usually generate electromagnetic waves during operation, and the electromagnetic waves will become noise that interferes with the antenna in the electronic device, resulting in a decrease in the ability of the antenna to transmit and receive signals.
據此,許多電子裝置中設置了電磁波屏蔽結構於電子元件上,以對電子元件發出的電磁波進行屏蔽或將其接地宣洩。然而,效能越高的電子裝置具有越多會產生大量雜訊的電子元件,從而需設置大量的電磁波屏蔽結構來對這些電子元件進行屏蔽,然此舉大幅增加了電子裝置的製造成本。Accordingly, many electronic devices are equipped with electromagnetic wave shielding structures on the electronic components to shield the electromagnetic waves emitted by the electronic components or to ground them. However, electronic devices with higher performance have more electronic components that generate a large amount of noise, so a large number of electromagnetic wave shielding structures need to be provided to shield these electronic components. However, this greatly increases the manufacturing cost of the electronic device.
本發明提供一種天線模組,具有良好的訊號收發能力且可降低電子裝置的製造成本。The invention provides an antenna module, which has good signal transceiving capabilities and can reduce the manufacturing cost of an electronic device.
本發明提供一種電子裝置,其天線模組具有良好的訊號收發能力且其製造成本低。The present invention provides an electronic device whose antenna module has good signal receiving and sending capabilities and has a low manufacturing cost.
本發明的天線模組包括一天線及一電磁波屏蔽層。天線具有一接地部。電磁波屏蔽層覆蓋於至少部分接地部上。The antenna module of the present invention includes an antenna and an electromagnetic wave shielding layer. The antenna has a ground part. The electromagnetic wave shielding layer covers at least part of the grounding part.
本發明的電子裝置包括一裝置主體及一天線模組。天線模組包括一天線及一電磁波屏蔽層。天線配置於裝置主體且具有一接地部。電磁波屏蔽層覆蓋於至少部分接地部上。The electronic device of the present invention includes a device body and an antenna module. The antenna module includes an antenna and an electromagnetic wave shielding layer. The antenna is disposed on the main body of the device and has a grounding portion. The electromagnetic wave shielding layer covers at least part of the grounding part.
在本發明的一實施例中,上述的電磁波屏蔽層的材質為吸波材料。In an embodiment of the present invention, the material of the aforementioned electromagnetic wave shielding layer is a wave-absorbing material.
在本發明的一實施例中,上述的天線更具有一輻射部及一饋入部,電磁波屏蔽層不覆蓋輻射部及饋入部。In an embodiment of the present invention, the above-mentioned antenna further has a radiating part and a feeding part, and the electromagnetic wave shielding layer does not cover the radiating part and the feeding part.
在本發明的一實施例中,上述的天線為環形天線。In an embodiment of the present invention, the above-mentioned antenna is a loop antenna.
在本發明的一實施例中,上述的至少部分接地部的電流密度小於天線的其他部分的電流密度。In an embodiment of the present invention, the current density of at least part of the grounding portion described above is less than the current density of other parts of the antenna.
基於上述,本發明在天線的接地部上覆蓋有電磁波屏蔽層,藉以降低天線受到雜訊影響的程度。藉此,不需在電子裝置的多個電子元件上分別設置電磁波屏蔽結構,而可降低電子裝置的製造成本。Based on the above, in the present invention, the grounding part of the antenna is covered with an electromagnetic wave shielding layer, so as to reduce the degree to which the antenna is affected by noise. Therefore, there is no need to separately provide electromagnetic wave shielding structures on the multiple electronic components of the electronic device, and the manufacturing cost of the electronic device can be reduced.
圖1是本發明一實施例的電子裝置的局部結構俯視示意圖。請參考圖1,本實施例的電子裝置100包括一裝置主體110及一天線模組120。裝置主體110例如是筆記型電腦的主機或其他種類的電子裝置的機體,其包括一機殼112、配置於機殼112內的一主機板114及配置於主機板114上的多個電子元件116(示意性繪示出兩個)。電子元件116可包括中央處理器(Central Processing Unit,CPU)及繪圖處理器(graphics processing unit,GPU)等,本發明不對此加以限制。天線模組120配置於裝置主體110的外殼112內而鄰近主機板114。圖1僅示意性地繪示天線模組120,以下說明天線模組120的具體結構。FIG. 1 is a schematic top view of a partial structure of an electronic device according to an embodiment of the invention. Please refer to FIG. 1, the
圖2是圖1的天線模組的俯視圖。圖3是圖2的天線的俯視圖。請參考圖2及圖3,本實施例的天線模組120包括一天線122及一電磁波屏蔽層124。天線122配置於裝置主體110(繪示於圖1)且包括相連接的一輻射部122a、一饋入部122b及一接地部122c。電磁波屏蔽層124覆蓋於接地部122c上且不覆蓋輻射部122a及饋入部122b,電磁波屏蔽層124的材質例如是非導電的吸波材料,其例如以貼附的方式而配置於接地部122c上。Fig. 2 is a top view of the antenna module of Fig. 1. Fig. 3 is a plan view of the antenna of Fig. 2. 2 and 3, the
如上述般在天線122的接地部122c上覆蓋有電磁波屏蔽層124,可降低天線122受到雜訊影響的程度。藉此,不需在電子裝置100的多個電子元件116上分別設置電磁波屏蔽結構,而可降低電子裝置100的製造成本。As described above, the
進一步而言,本實施例的天線122如圖2所示為環形天線(loop antenna),其主要藉時變電流激發電磁場,電流大多集中在輻射部122a及饋入部122b處,使得接地部122c的電流密度小於天線122的其他部分的電流密度。因此,將電磁波屏蔽層124覆蓋於接地部122c而非覆蓋於輻射部122a及饋入部122b,可避免電磁波屏蔽層124的設置導致天線122的訊號收發效率下降。此外,接地部122c通常具有大面積的金屬平面,在未利用電磁波屏蔽層124覆蓋接地部122c的情況下,接地部122c易與裝置主體110內的金屬元件產生近場電容耦合效應而將電子元件116產生的雜訊大量傳遞至天線122。因此,如上述般在接地部122c上覆蓋有電磁波屏蔽層124,既不會過度影響天線122的正常功能,又可大幅降低雜訊對天線122產生的不良影響。Furthermore, the
圖4繪示散熱結構配置於圖1的天線模組的上方。舉例來說,如圖4所示,在散熱結構118(例如為散熱鰭片組及/或熱管)配置於天線模組120上方的情況下,若未利用電磁波屏蔽層124覆蓋接地部122c,則大面積的接地部122c易與散熱結構118如上述般產生近場電容耦合效應而影響天線122的正常功能。如圖2所示般在接地部122c上配置電磁波屏蔽層124,可有效抑制所述近場電容耦合效應的產生。FIG. 4 shows that the heat dissipation structure is disposed above the antenna module of FIG. 1. For example, as shown in FIG. 4, when the heat dissipation structure 118 (for example, a heat dissipation fin group and/or a heat pipe) is disposed above the
在其他實施例中,可依據對天線122之電流分佈的實際測量而決定電磁波屏蔽層124在接地部122c上的覆蓋範圍。舉例來說,若接地部122c的部分區域具有較高的電流密度,則電磁波屏蔽層124可僅覆蓋接地部122c的具有較低電流密度的區域。In other embodiments, the coverage of the electromagnetic
在本實施例中,電磁波屏蔽層124例如是導磁率約為110的吸波材料,其厚度例如約為2毫米。然本發明不對此加以限制,電磁波屏蔽層124可具有其他適當大小的導磁率及厚度。In this embodiment, the electromagnetic
表1列出了天線122於未設置電磁波屏蔽層124之情況及有設置電磁波屏蔽層124之情況,在各個方向(圖4所示的方向D1~D4)上之特定距離(如25公尺)處的訊號強度及訊號傳送/接收速度。如表1所示,天線122的訊號強度未因電磁波屏蔽層124之配置而降低,且天線122的訊號傳送/接收速度因電磁波屏蔽層124之配置而有明顯提升。
圖5是天線有設置電磁波屏蔽層及未設置電磁波屏蔽層的雜訊強度比較圖,其中A對應於未設置電磁波屏蔽層124,B對應於有設置電磁波屏蔽層124。如圖5所示,在設置了電磁波屏蔽層124之後,天線122在2.4G頻段接收到的雜訊強度下降了約5dBm。FIG. 5 is a comparison diagram of the noise intensity of the antenna with and without the electromagnetic wave shielding layer, where A corresponds to the electromagnetic
綜上所述,本發明在天線的接地部上覆蓋有電磁波屏蔽層,藉以降低天線受到雜訊影響的程度。藉此,不需在電子裝置的多個電子元件上分別設置電磁波屏蔽結構,而可降低電子裝置的製造成本。In summary, in the present invention, the grounding part of the antenna is covered with an electromagnetic wave shielding layer, so as to reduce the degree to which the antenna is affected by noise. Therefore, there is no need to separately provide electromagnetic wave shielding structures on the multiple electronic components of the electronic device, and the manufacturing cost of the electronic device can be reduced.
100:電子裝置
110:裝置主體
112:機殼
114:主機板
116:電子元件
118:散熱結構
120:天線模組
122:天線
122a:輻射部
122b:饋入部
122c:接地部
124:電磁波屏蔽層
D1~D4:方向
100: electronic device
110: Device body
112: Chassis
114: Motherboard
116: electronic components
118: heat dissipation structure
120: Antenna Module
122:
圖1是本發明一實施例的電子裝置的局部結構俯視示意圖。 圖2是圖1的天線模組的俯視圖。 圖3是圖2的天線的俯視圖。 圖4繪示散熱結構配置於圖1的天線模組的上方。 圖5是天線有設置電磁波屏蔽層及未設置電磁波屏蔽層的雜訊強度比較圖。 FIG. 1 is a schematic top view of a partial structure of an electronic device according to an embodiment of the invention. Fig. 2 is a top view of the antenna module of Fig. 1. Fig. 3 is a plan view of the antenna of Fig. 2. FIG. 4 shows that the heat dissipation structure is disposed above the antenna module of FIG. 1. Fig. 5 is a comparison diagram of the noise intensity of an antenna with and without an electromagnetic wave shielding layer.
120:天線模組 120: Antenna Module
122:天線 122: Antenna
122a:輻射部 122a: Radiation Department
122b:饋入部 122b: Infeed
122c:接地部 122c: Grounding part
124:電磁波屏蔽層 124: Electromagnetic wave shielding layer
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Citations (2)
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CN201498593U (en) * | 2009-04-02 | 2010-06-02 | 鸿富锦精密工业(深圳)有限公司 | Printing antenna and electronic equipment employing same |
CN103811854A (en) * | 2012-11-05 | 2014-05-21 | 富士通株式会社 | Antenna apparatus |
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CN201498593U (en) * | 2009-04-02 | 2010-06-02 | 鸿富锦精密工业(深圳)有限公司 | Printing antenna and electronic equipment employing same |
CN103811854A (en) * | 2012-11-05 | 2014-05-21 | 富士通株式会社 | Antenna apparatus |
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