TWI712794B - Electronic apparatus for predicting target's life - Google Patents

Abstract

This invention provides an electronic apparatus comprising a strain member disposed on a target to measure a strain state of the target; and an electronic device that receives a signal of the strain state measured by the strain member and performs calculations based on the signal to predict a remaining life of the target; wherein a method of the calculation uses a first formula corresponding to the Larson-Miller Equation and a second formula corresponding to a total life of the target. The strain member is directly combined with the target to directly reflect a strain value of the target and accurately calculate a stress on the target for the electronic device to accurately predict the remaining life of the target using the first formula and the second formula.

Description

Electronic equipment for predicting the life of the target

The present invention relates to an electronic device for predicting the life of a target object, especially an electronic device for predicting the life of a metal object in a high temperature and high pressure environment.

At present, the domestic prediction of the creep life of power plant boiler pipes and pipelines adopts methods related to the creep process, such as the measurement technology of metallographic characteristics changes such as cavity nucleation and growth, and free carbide composition.

The conventional method for predicting the creeping process is to use a comparison table, as shown in Figure 1, to compare various factors to obtain the life possibility. For example, physical damage to level I _D, I _M changes to the microstructure level, distribution of the precipitates level I _P, A creep damage class level, it corresponds to the creep lifetime consumption from 0 to 10%.

However, the conventional method of predicting the creep process using the comparison table can only know the range of the creep life consumption, and cannot accurately know the remaining life. Therefore, it is easy to misjudge the breaking time of the boiler pipeline and cause accidents in the power plant. .

Further, if physical damage to level I _D, I _M changes to the microstructure level, distribution of the precipitates level I _P, creep damage level class F, this time to be set in a manner to be associated creep life consumption, The value is 0~70%, and it is more difficult to know the remaining life, so it is impossible to accurately predict the breaking time of the boiler pipe.

Therefore, how to overcome the shortcomings of the conventional technology is actually a technical problem that all walks of life urgently want to solve.

In view of the various deficiencies of the above-mentioned conventional technologies, the present invention provides an electronic device for predicting the life of a target, which includes: a measuring device, which includes a strain member arranged on a target to measure the strain state of the target ; And an electronic device, which is communicatively connected to the measuring device to receive the signal of the strain state measured by the measuring device, and perform calculations based on the signal to predict the remaining life of the target; wherein, the calculation method The first formula is used in conjunction with the second formula. The first formula corresponds to the Larsen Miller formula. The curve with the stress state as the ordinate and the Larsen Miller parameter as the abscissa is first simulated, and then the strain state is passed through the aforementioned The curve derives the known Larsen Miller parameters, and then establishes the relationship between the known Larsen Miller parameters and the total life and used time of the target, and the second formula corresponds to the total life of the target, the total Life is defined as the sum of the used time of the target and the remaining life.

In the aforementioned electronic equipment, the measuring device further includes a measuring host electrically connected to the strain gauge. For example, the measurement host is electrically connected to the electronic device.

In the aforementioned electronic device, the strain piece is bonded to the target by a ceramic material. For example, the strain gauge is embedded in the ceramic material.

In the aforementioned electronic device, the strain member is erected on the target by the support member. For example, the strain member is bonded to the support member by a ceramic material.

In the aforementioned electronic device, the Larsen Miller formula is P = T ( C + log t ), P represents the Larsen Miller (LM) parameter, T represents the ambient temperature, C represents the material constant, and t represents the breaking time. According to the Larson Miller formula, the electronic device pre-simulates the first curve and the second curve with the stress state as the ordinate and the Larsen Miller parameters as the abscissa. The first curve represents the initial state of the target. The second curve represents the operating state of the target.

In the aforementioned electronic device, the first formula is P '=Tzeng( C +log t ), P'represents the known Larson Miller parameter, Tzeng represents the specific coefficient, C represents the material constant, and t represents the lifetime.

It can be seen from the above that the electronic equipment for predicting the life of the target object of the present invention mainly uses the configuration of the measuring device to directly combine the strain member on the target object to directly reflect the strain amount of the target object, so that The measuring device can accurately calculate the stress experienced by the target. Therefore, in conjunction with the first formula and the second formula, the electronic device can accurately predict the remaining life of the target. Therefore, compared with the conventional technology, The electronic equipment of the present invention can effectively determine the breaking time point of the metal furnace tube or pipe of the boiler to avoid accidents.

1: electronic equipment

1a, 2a: measuring device

1b: Electronic device

10: strain gauge

11: Ceramic material

12: Measuring host

12a, 13: wire

21: Support

9: Target

f: strain direction

L1: the first curve

L2: second curve

Figure 1 is a schematic diagram of the conventional comparison table for predicting the remaining life of the target.

Figure 2 is a schematic plan view of the electronic device for predicting the life of the target object of the present invention.

Figure 2'is a partial three-dimensional schematic diagram of another embodiment of the electronic device for predicting the life of the target object of the present invention.

Figure 3 is a graph used in the calculation of the electronic device for predicting the life of the target object of the present invention.

Figure 4 is the quantization table used in the calculation of the electronic equipment for predicting the life of the target object of the present invention.

The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this manual are only used to match the contents disclosed in the manual for the understanding and reading of those familiar with the art, and are not intended to limit the implementation of the present invention Therefore, it does not have any technical significance. Any structural modification, proportional relationship change, or size adjustment should still fall within the scope of the present invention without affecting the effects and objectives that can be achieved. The technical content disclosed by the invention can be covered. At the same time, the terms "on", "first", "second" and "one" cited in this specification are only for ease of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall be regarded as the scope within which the present invention can be implemented without substantial changes to the technical content. The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.

Figure 2 is a schematic plan view of the electronic device 1 for predicting the life of the target object of the present invention. As shown in Figure 2, the electronic device 1 includes: a measuring device 1a and an electronic device 1b.

The measuring device 1a includes a strain element 10 arranged on a target 9 to measure the strain state of the target 9, wherein the target 9 is, for example, a power plant in a high temperature and high pressure environment. The boiler is used to generate steam and heat the metal furnace tube metal pipeline.

In this embodiment, the measuring device 1a further includes a measuring host 12 electrically connected to the strain member 10, which is electrically connected to the electronic device 1b through a wire 13 to transmit the strain obtained from the strain member 10 The status signal is sent to the electronic device 1b.

Furthermore, the strain piece 10 is bonded to the target 9 by a ceramic material 11. For example, the strain piece 10 is embedded in the ceramic material 11. Specifically, the strain member 10 is a sheet body, which is adhered to the target 9 by a molten ceramic layer, and after the ceramic layer is cooled and solidified, a plurality of wires are used to electrically connect the measuring host 12 12a is connected to the strain member 10, and then another molten ceramic layer is covered on the ends of the strain member 10 and the wires 12a, so that when the other ceramic layer is cooled and solidified, the strain member 10 is sandwiched between the two ceramics. Between the layers, the strain gauge 10 is embedded in the ceramic material 11.

Or, as shown in Figure 2', the strain member 10 is erected on the target 9 by the support member 21. In this embodiment, the support member 21 is a constant force structure, so that when it deforms, it The resulting force remains unchanged. For example, the strain member 10 is bonded to the support member 21 by a ceramic material 11. Specifically, the supporting member 21 is in the shape of a hoop, and the strain member 10 is adhered to the supporting member 21 by a molten ceramic layer. After the ceramic layer is cooled and solidified, the plurality is used to electrically connect the quantity The wire 12a of the main body 12 is connected to the strain gauge 10, and then another molten ceramic layer is covered on the strain gauge 10 and the ends of the wires 12a, so that when the other ceramic layer cools and solidifies, the strain gauge 10 The interlayer is between the two ceramic layers, so that the strain piece 10 is embedded in the ceramic material 11, and the ceramic material 11 is fixed on the support 21, so the strain measurement operation is performed on the measuring device 2a At this time, the support 21 can be sleeved around the target 9. That is, in the present invention, by first bonding the strain member 10 to the support member 21, it is convenient for the user to directly cover the support member 21 on the target object 9.

Therefore, when the target 9 is strained (as shown in the strain direction f in Figure 2), the strain member 10 will also be strained, and the strain member 10 will transmit the measured strain amount to the In the measurement host 12, the measurement host 12 is processed to show the stress experienced by the target 9 (the stress and strain are in a proportional relationship).

The electronic device 1b is a computer, which is communicatively connected to the measuring device 1a (e.g., electrically connected to the measuring host 12) to receive the signal of the strain state measured by the measuring device 1a, and according to the The signal is calculated to predict the remaining life of the target 9.

In this embodiment, the electronic device 1b simulates a reference material according to the Larson-Miller Equation, and then derives it according to the reference material to form the first formula corresponding to the Larson-Miller Equation. Specifically, as shown in Figure 3, the electronic device 1b is based on the Larson Miller formula, the following formula (LM), with the stress state as the ordinate and the Larsen Miller parameter as the abscissa, and the first simulation A curve L1 and a second curve L2. The first curve L1 represents the initial state of the target 9 (that is, the new metal pipe), and the second curve L2 represents the operating state of the target 9 (that is, the used的metal pipe), Figure 3 can also be quantified into a table, as shown in Figure 4.

P = T( C +log t )......................................... .........(LM), where P is the Larson Miller (LM) parameter, T is the ambient temperature, and C is the material constant, The t series represents the breaking time. Then, after the measurement host 12 actually obtains the stress σ of the target 9, the known Larson Miller parameters can be obtained from the first curve L1 and the second curve L2 in Figure 3, and then the The first formula is the formula (1) shown below: P '=Tzeng( C +log t )........................... ...(1), where P'is the known Larson Miller parameter , Tzeng series means specific coefficient, C series means material constant, t series means life. Therefore, since the two known Larson Miller parameters can be obtained from the first curve L1 and the second curve L2 in Figure 3, two sets of first formulas can be listed, as shown in the following formula (1-1) And formula (1-2): P 1'=Tzeng( C +log t ₀ ).............................. ...................(1-1); P 2'=Tzeng( C +log t ₁ )............. ....................................(1-2), where P1' is the first Curve L1 corresponds to the known Larsen Miller parameter, P2' represents the known Larsen Miller parameter corresponding to the second curve L2, t ₀ represents the total life, and t ₁ represents the remaining life.

Furthermore, the calculation method of the electronic device 1b adopts the first formula and the second formula, and the second formula corresponds to the total life of the target 9, as shown in the following formula (2): t ₀ = t _op + t ₁ ................................................ ........................(2), where t ₀ represents the total life, t _op represents the used time, and t ₁ represents the remaining Life, let the total life be defined as the sum of the used time of the target 9 and the remaining life.

Therefore, the calculation method of the electronic device 1b is a set of equation F of three unknowns (Tzeng, t ₀ , t ₁ ), namely the following formula (1-1), formula (1-2) and formula ( 2) Combination: P 1'=Tzeng( C +log t ₀ )................................. ........(1-1); P 2'=Tzeng( C +log t ₁ ).............. .....................................(1-2); t ₀ =t _op +t ₁ ................................................. .................... (2), wherein, P1 ', P2', C and t _op are known numbers.

In one embodiment, when the electronic device 1 is used, the internal pressure of the target 9 (the boiler tube or steam pipe) is 17.4Mpa, the tube wall thickness of the target 9 is 6.5mm, and the target 9 The outer diameter of the target 9 is 44.3mm, the coefficient y of the ASME (American Society of Mechanical Engineers) specification of the target 9 is 0.7, the ambient temperature of the target 9 is 650°C, and the target 9 has been in operation for 252,728 hours. First, the measuring device 1a measures the amount of strain produced by the material of the furnace tube at the moment the target 9 is operating, and the amount of strain ε measured by the strain gauge 10 is 0.0005, and then the amount of strain ε is converted into the target 9 was the stress σ, 9 suffered the stress of the measurement host 12 calculate [sigma] is an object of 87MPa (K × 0.0005 = 87MPa, wherein, K is a known value 174000). Then, the electronic device 1b corresponds the value of the stress σ to the first curve L1 and the second curve L2 shown in Fig. 3 or the quantization table in Fig. 4 to obtain two known Larson Miller parameters P1', P2' (number 22 as shown in Figure 4), and the material constant C is defined as 30 according to the material system of the target 9, so the equation F presents the following formula (F-1), formula (F -2) and formula (F-3): 30567=Tzeng(30+log t ₀ )............................. .................(F-1); 30082=Tzeng(30+log t ₁ )................. .............................(F-2); t ₀ =252728+t ₁ ........ ................................................. .....(F-3). Therefore, after the electronic device 1b is calculated, the remaining life t ₁ of the target 9 is 94877 hours, and the total life t ₀ of the target 9 is 347,605 hours.

In summary, the electronic device 1 for predicting the life of a target object of the present invention mainly uses the configuration of the measuring device 1a to directly bond the strain member 10 to the target object 9, so as to use high-temperature stress and temperature for real-time monitoring and It directly reflects the strain ε of the target 9 so that the measuring host 12 accurately calculates the stress σ of the target 9, so that the electronic device 1b can accurately predict the stress σ of the target 9 afterwards. The remaining life t ₁ of the target 9 is obtained. Therefore, compared with the conventional technology, the electronic device 1 of the present invention can more accurately and reasonably calculate the remaining life of the steam pipe material of the power plant boiler, so as to effectively determine the metal of the boiler The point of time when the furnace tube or pipeline breaks, so accidents can be avoided.

The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone who is familiar with the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.

1‧‧‧Electronic equipment

1a‧‧‧Measuring device

1b‧‧‧Electronic device

10‧‧‧Strainer

11‧‧‧Ceramic materials

12‧‧‧Measuring host

12a,13‧‧‧wire

9‧‧‧Target

f‧‧‧Strain direction

Claims (10)

An electronic device for predicting the life of a target includes: a measuring device, which includes a strain element arranged on a target, to measure the strain state of the target to obtain a signal; and an electronic device, which is communicatively connected to the The measuring device receives the signal of the strain state measured by the measuring device, and performs calculations based on the signal to predict the remaining life of the target; wherein the calculation method uses two sets of first formulas in conjunction with the first The second formula is used to perform the calculation. The first formula is derived from the Larson-Miller Equation, which first simulates the curve with the stress state as the ordinate and the Larson-Miller parameter as the abscissa , And then use the strain state to deduce the known Larsen Miller parameters through the aforementioned curve, and then establish the relationship between the known Larsen Miller parameters and the total life and used time of the target, and the second formula corresponds to The total life of the target is defined as the sum of the used time of the target and the remaining life. The electronic device described in item 1 of the scope of patent application, wherein the measuring device further includes a measuring host electrically connected to the strain gauge. The electronic device described in item 2 of the scope of patent application, wherein the measurement host is electrically connected to the electronic device. The electronic device described in item 1 of the scope of patent application, wherein the strain member is bonded to the target by a ceramic material. For the electronic device described in item 4 of the scope of patent application, wherein the strain piece is embedded in the ceramic material. The electronic device described in item 1 of the scope of patent application, wherein the strain member is erected on the target by a support member. The electronic device described in item 6 of the scope of patent application, wherein the strain member is bonded to the support member by a ceramic material. For the electronic device described in item 1 of the scope of patent application, the Larsen Miller formula is P = T ( C +log t ), P represents the Larsen Miller (LM) parameter, T represents the ambient temperature, and C represents Material constant, t represents the breaking time. The electronic device described in item 1 of the scope of patent application, wherein the electronic device is based on the Larson Miller formula, with the stress state as the ordinate and the Larsen Miller parameter as the abscissa, and the first curve and the second curve are simulated in advance. The first curve represents the initial state of the target, and the second curve represents the operating state of the target. For the electronic device described in item 1 of the scope of patent application, the first formula is P '=Tzeng( C +log t ), P'represents the known Larson Miller parameter, Tzeng represents the specific coefficient, and C represents the material Constant, t represents life.

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