TWI710733B - LED lighting module - Google Patents
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Abstract
本發明旨在揭露一種發光二極體照明模組,其包含一燈座、複數照明裝置、至少一控制裝置以及一微控制器所構成。該些照明裝置設置於燈座內,並且與控制裝置、微控制器電性連接,以藉由微控制器搭配控制裝置調節該些照明裝置之光照強度是否維持預設值。The present invention aims to disclose a light-emitting diode lighting module, which includes a lamp holder, a plurality of lighting devices, at least one control device, and a microcontroller. The lighting devices are arranged in the lamp holder and are electrically connected to the control device and the microcontroller, so that the microcontroller and the control device can adjust whether the light intensity of the lighting devices maintains a preset value.
Description
本發明係有關於一種照明模組,其尤指一種以發光二極體作為照明模組之結構。The present invention relates to a lighting module, and particularly refers to a structure using a light-emitting diode as the lighting module.
習知發光二極體之封裝結構,為於一基板上設置複數發光二極體於基板上,之後再採用封裝膠將該些發光二極體封裝於基板上,如此即構成一發光二極體封裝結構。The conventional packaging structure of light-emitting diodes is to dispose a plurality of light-emitting diodes on a substrate on the substrate, and then encapsulate the light-emitting diodes on the substrate with an encapsulant, thus forming a light-emitting diode Package structure.
然而,一次性將大量發光二極體封裝於單一基板之結構上,倘若有部分發光二極體故障,或者是異常工作狀態下,將不利於相關偵測元件判斷整體發光二極體封裝結構中,哪些發光二極體已經故障而需要相關人員進行故障排除作業。However, if a large number of light-emitting diodes are packaged on a single substrate structure at one time, if some of the light-emitting diodes are faulty or under abnormal working conditions, it will not be conducive to the related detection elements to determine the overall light-emitting diode package structure , Which light-emitting diodes have failed and need relevant personnel to troubleshoot.
另外,一般設計感測器用以偵測發光二極體的發光狀況,為設置於封裝結構外部,並且採取單一感測器感測全部發光二極體之方式,偵測發光二極體之工作狀態是否正常;惟,發光二極體之工作異常的問題點眾多,採用單一感測器感測所有發光二極體容易有誤判之情形產生。同時感測器未經封裝結構保護,有可能相較於封裝在封裝結構內部之發光二極體增加損壞機率,進而影響感測整體發光二極體之精度。In addition, a sensor is generally designed to detect the light-emitting condition of the light-emitting diode, which is arranged outside the package structure, and a single sensor is used to sense all the light-emitting diodes to detect the working state of the light-emitting diode Is it normal? However, there are many problems with the abnormal operation of the light-emitting diodes, and it is easy to make misjudgments when a single sensor is used to sense all light-emitting diodes. At the same time, the sensor is not protected by the package structure, which may increase the probability of damage compared to the light-emitting diode packaged inside the package structure, thereby affecting the accuracy of sensing the overall light-emitting diode.
職是之故,本發明人鑑於上揭所衍生之問題進行改良,茲思及發明改良之意念著手研發解決方案,遂經多時之構思而有本發明之發光二極體照明模組產生,以服務社會大眾以及促進此業之發展。For this reason, the inventor of the present invention made improvements in view of the problems derived from the above disclosure, and started to develop solutions with the idea of inventing improvements. After many years of thinking, the light-emitting diode lighting module of the present invention was produced. To serve the public and promote the development of this industry.
本發明之一目的係提供一種發光二極體照明模組,其將發光二極體、感測裝置經基板、封裝體封裝成單一照明裝置,有利於控制裝置以及微控制器針對每一照明裝置之工作狀態進行調節。One object of the present invention is to provide a light-emitting diode lighting module, which encapsulates a light-emitting diode and a sensing device into a single lighting device via a substrate and a package, which is beneficial for the control device and the microcontroller to target each lighting device The working status is adjusted.
本發明之一目的係提供一種發光二極體照明模組,其將感測裝置一併封裝至照明裝置中,可以更有效提升感測單一發光二極體光亮度狀態之精準度。One object of the present invention is to provide a light-emitting diode lighting module, which encapsulates the sensing device in the lighting device, which can more effectively improve the accuracy of sensing the light brightness state of a single light-emitting diode.
本發明之一目的係提供一種發光二極體照明模組,其藉由複數照明裝置設置於燈座內,除了可以增進整體發光效能之外,更可以結合控制裝置、微控制器適當地調節每一照明裝置之發光二極體的工作效能。One of the objects of the present invention is to provide a light emitting diode lighting module, which is equipped with a plurality of lighting devices in the lamp holder. In addition to improving the overall luminous efficiency, it can also be combined with a control device and a microcontroller to properly adjust each The working efficiency of the light-emitting diode of a lighting device.
為了達成上述所指稱之各目的與功效,本發明揭露一種發光二極體照明模組,其包含: 一燈座; 複數照明裝置,設置於該燈座內,每一該照明裝置包含: 一基板; 一發光二極體,設置於該基板上; 一感測裝置,設置於該基板上以及該發光二極體之一側; 一封裝體,封裝該發光二極體以及該感測裝置於該基板; 至少一控制裝置,設置於該燈座之一側,電性連接該發光二極體,驅動該發光二極體作動產生一光照強度;以及 一微控制器,設置於該燈座之另一側,並且包含一處理裝置,該處理裝置電性連接該控制裝置以及該感測裝置,接收該感測裝置感測該光照強度產生之一感測訊號,而操控該控制裝置調節該光照強度。 In order to achieve the aforementioned objectives and effects, the present invention discloses a light-emitting diode lighting module, which includes: A lamp holder A plurality of lighting devices are arranged in the lamp holder, and each lighting device includes: A substrate; A light emitting diode arranged on the substrate; A sensing device arranged on the substrate and one side of the light emitting diode; A package body encapsulating the light emitting diode and the sensing device on the substrate; At least one control device, arranged on one side of the lamp holder, electrically connected to the light emitting diode, and driving the light emitting diode to actuate to generate a light intensity; and A microcontroller is arranged on the other side of the lamp holder and includes a processing device electrically connected to the control device and the sensing device, and receiving the sensing device to sense the light intensity to generate a sensor Measure the signal, and manipulate the control device to adjust the light intensity.
於本發明之一實施例中,其亦揭露更包含一警示裝置,設置於該微控制器之一側以及電性連接該處理裝置,該處理裝置接收該感測訊號後,判斷該發光二極體異常而產生一工作訊號傳輸至該警示裝置,該警示裝置接收該工作訊號後,傳送一警示訊號至至少一通訊裝置。In one embodiment of the present invention, it also discloses that it further includes a warning device, which is arranged on a side of the microcontroller and is electrically connected to the processing device. After receiving the sensing signal, the processing device determines the light emitting diode When the body is abnormal, a working signal is generated and transmitted to the warning device. After receiving the working signal, the warning device transmits a warning signal to at least one communication device.
於本發明之一實施例中,其亦揭露該處理裝置操控每一該控制裝置作動,經每一該控制裝置調節輸入至每一該發光二極體之電流與頻率而改變該光照強度。In an embodiment of the present invention, it is also disclosed that the processing device controls each control device to act, and the current and frequency input to each light emitting diode are adjusted by each control device to change the light intensity.
於本發明之一實施例中,其亦揭露該發光二極體為波長260nm~450nm之紫外線光發光二極體。In an embodiment of the present invention, it is also disclosed that the light emitting diode is an ultraviolet light emitting diode with a wavelength of 260 nm to 450 nm.
於本發明之一實施例中,其亦揭露更包含一溫度控制裝置,設置於該微控制器之另一側以及電性連接該處理裝置,偵測該些照明裝置產生之一光照溫度而產生一偵測訊號,該處理裝置接收該偵測訊號後,操控每一該控制裝置調節每一該發光二極體之該光照強度。In an embodiment of the present invention, it also discloses that it further includes a temperature control device disposed on the other side of the microcontroller and electrically connected to the processing device to detect a light temperature generated by the lighting devices. A detection signal. After receiving the detection signal, the processing device controls each control device to adjust the light intensity of each light-emitting diode.
於本發明之一實施例中,其亦揭露更包含至少一計數裝置,設置於該微控制器之再一側以及電性連接該處理裝置,偵測每一該照明裝置之一光照時間而產生一工作時間訊號,該處理裝置接收該工作時間訊號後,產生每一該照明裝置之一工作時間數據。In an embodiment of the present invention, it also discloses that it further comprises at least one counting device, which is arranged on the other side of the microcontroller and is electrically connected to the processing device to detect a light time of each of the lighting devices to generate A working time signal. After receiving the working time signal, the processing device generates one working time data of each lighting device.
於本發明之一實施例中,其亦揭露每一該照明裝置更包含二支架,其中之一該支架設置於該基板之一側,另一該支架設置於該基板之另一側,該封裝體設置於該二支架上,使該封裝體、該二支架以及該基板構成一容置空間,而封裝該發光二極體以及該感測裝置。In an embodiment of the present invention, it is also disclosed that each of the lighting devices further includes two brackets, one of which is disposed on one side of the substrate, the other is disposed on the other side of the substrate, and the package The body is arranged on the two supports, so that the package body, the two supports and the substrate constitute an accommodating space to package the light emitting diode and the sensing device.
於本發明之一實施例中,其亦揭露該封裝體包含二支撐座,其中之一該支撐座設置於該封裝體之一側,另一該支撐座設置於該封裝體之另一側,該二支撐座設置於該基板上,使該封裝體、該二支撐座以及該基板構成一容置室,而封裝該發光二極體以及該感測裝置。In an embodiment of the present invention, it is also disclosed that the package includes two support seats, one of the support seats is disposed on one side of the package, and the other support seat is disposed on the other side of the package. The two supporting seats are arranged on the substrate, so that the packaging body, the two supporting seats and the substrate constitute a containing chamber, and the light emitting diode and the sensing device are encapsulated.
於本發明之一實施例中,其亦揭露該封裝體為一玻璃。In an embodiment of the present invention, it is also disclosed that the package body is a glass.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識,僅佐以實施例及配合詳細之說明,說明如後:In order to enable your reviewer to have a further understanding and understanding of the features of the present invention and the effects achieved, only the examples and detailed explanations are provided, as follows:
下文中,將藉由圖式說明本發明之各種實施例,以詳細描述本發明;然而,本發明之概念可能以許多不同型式來體現,並且不應解釋為限於本文中所闡述之例式性實施例。Hereinafter, various embodiments of the present invention will be illustrated by the drawings to describe the present invention in detail; however, the concept of the present invention may be embodied in many different forms, and should not be construed as being limited to the exemplary form set forth herein. Examples.
請參閱第一圖,其為本發明發光二極體照明模組之第一實施例之結構示意圖。如圖所示,本發明第一實施例之發光二極體照明模組包含:一燈座1;複數照明裝置3,設置於燈座1內,每一照明裝置3包含:一基板30;一發光二極體32,設置於基板30上;一感測裝置34,設置於基板30上以及發光二極體32之一側;一封裝體36,封裝發光二極體32以及感測裝置34於基板30;至少一控制裝置5,設置於燈座1之一側,電性連接發光二極體32,驅動發光二極體32作動產生一光照強度320;以及一微控制器7,設置於燈座1之另一側,並且包含一處理裝置70,處理裝置70電性連接控制裝置5以及感測裝置34,接收感測裝置34感測光照強度320產生之一感測訊號340,而操控控制裝置5調節光照強度320。Please refer to the first figure, which is a schematic structural diagram of the first embodiment of the light-emitting diode lighting module of the present invention. As shown in the figure, the light-emitting diode lighting module of the first embodiment of the present invention includes: a
上述之發光二極體(Light Emitting Diode,簡稱LED)32為波長260nm~450nm之紫外線光發光二極體。The aforementioned Light Emitting Diode (LED for short) 32 is an ultraviolet light emitting diode with a wavelength of 260 nm to 450 nm.
上述之感測裝置34為光亮度流明感測器(Luminance Sensor)。The
上述之封裝體36為玻璃。The
上述之控制裝置5為發光二極體驅動器(Light Emitting Diode Driver,簡稱LED Driver ),其為驅動發光二極體32可以正常發光工作之電源調整設備。由於發光二極體32之PN結構導通特性,決定它能適應的電壓和電流變動範圍十分狹窄,稍微偏離就可能無法點亮發光二極體32,或者是造成發光效率嚴重降低,更可能進一步縮減使用壽命、發生燒毀事故等。控制裝置5(發光二極體驅動器)為可以驅使發光二極體32在最佳電壓或電流狀態下工作的電子元件。The
上述之微控制器7為單晶片,全稱單晶片微電腦(single-chip microcomputer,又稱microcontroller),泛指將中央處理器、記憶體、定時器/計數器、各式輸入輸出介面等整合在一塊積體電路晶片上的微型電腦。The above-mentioned
請一併參閱第二圖至第四圖,其為本發明發光二極體照明模組之第一實施例之作動示意圖一至三。如第二圖所示,首先由微控制器7操作控制裝置5驅動該些照明裝置3之發光二極體32工作而發光;其中,本發明第一實施例以一個控制裝置5控制複數發光二極體32工作為例進行說明。因此亦可以設計為具有複數控制裝置5,每一控制裝置5對應每一照明裝置3,而經由處理裝置70操作單一/每一控制裝置5驅動單一/每一照明裝置3之發光二極體32工作,故並不在此限。接續如第三圖所示,當照明裝置3之發光二極體32經控制裝置5驅動而開始發光時,將產生光照強度320,此時感測裝置34開始感測光照強度320而產生一感測訊號340。爾後,如第四圖所示,感測裝置34感測光照強度320產生感測訊號340後,遂將其傳輸至處理裝置70,由處理裝置70判斷每一發光二極體32之光照強度320是否符合預設值,若非如預期正常運作則操控控制裝置5調節其中之一/每一發光二極體32之光照強度320至標準值為止,如此讓照明裝置3、控制裝置5以及微控制器7周而復始運作。Please also refer to FIGS. 2 to 4, which are schematic diagrams 1 to 3 of the operation of the first embodiment of the LED lighting module of the present invention. As shown in the second figure, the micro-controller 7 operates the
本發明第一實施例之發光二極體照明模組作動時,所產生之功效為將發光二極體32、感測裝置34經基板30、封裝體36封裝成單一照明裝置3,有利於針對單一照明裝置3之工作狀態監測,而有別於傳統將大量發光二極體32封裝於單一結構內,不便於判斷部分發光二極體32異常與否之缺失。另外,經由將感測裝置34一併封裝至照明裝置3中,可以更有效感測每一發光二極體32之光亮度狀態,有別於習知將感測裝置34設置於照明裝置3外部進行感測之精準度低下,或者是不利於判斷那些發光二極體32處於異常之問題。再者,藉由複數照明裝置3設置於燈座1內,除了可以增進整體發光效能之外,將該些照明裝置3結合控制裝置5、微控制器7,亦可以適當地調節每一照明裝置3之發光二極體32的工作效率。When the light-emitting diode lighting module of the first embodiment of the present invention is activated, the effect produced is that the light-emitting
接續說明本發明第二實施例之發光二極體照明模組之實施方式。請參閱第五圖,其為本發明發光二極體照明模組之第二實施例之結構示意圖。如第五圖所示,本發明第二實施例之發光二極體照明模組與第一實施例之差異,在於更包含一警示裝置9,設置於微控制器7之一側以及電性連接處理裝置70,處理裝置70接收感測訊號340後,判斷一部/全部發光二極體32異常而產生一工作訊號700傳輸至警示裝置9,警示裝置9接收工作訊號700後,傳送一警示訊號90至至少一通訊裝置11。Next, the implementation of the light-emitting diode lighting module of the second embodiment of the present invention will be described. Please refer to FIG. 5, which is a schematic structural diagram of the second embodiment of the light-emitting diode lighting module of the present invention. As shown in the fifth figure, the difference between the light-emitting diode lighting module of the second embodiment of the present invention and the first embodiment is that it further includes a
承接前段並且復參閱第五圖,本發明第二實施例所增設之警示裝置9,為當處理裝置70接收每一感測訊號340後,判斷若有至少一發光二極體32之工作狀態處於異常情況時,則可即時發送工作訊號700至警示裝置9,由警示裝置9傳輸警示訊號90至通訊裝置11;其中,通訊裝置11可以為持有本發明之使用者的行動電話,或者是公司所設置之中控室,由中控室人員經操作介面接收到警示訊號90後,派遣相關人員前往維修。Continuing the previous paragraph and referring to the fifth figure again, the
請參閱第六圖,其為本發明發光二極體照明模組之第三實施例之結構示意圖。如圖所示,本發明第三實施例之發光二極體照明模組與第一實施例之差異,在於每一照明裝置3更包含二支架38,其中之一支架38設置於基板30之一側,另一支架38設置於基板30之另一側,封裝體36設置於二支架38上,使封裝體36、二支架38以及基板30構成一容置空間S,而封裝發光二極體32以及感測裝置34。Please refer to Figure 6, which is a schematic structural diagram of the third embodiment of the LED lighting module of the present invention. As shown in the figure, the difference between the light emitting diode lighting module of the third embodiment of the present invention and the first embodiment is that each
承接前段並且復參閱第六圖,本發明之第三實施例為增設二支架38於基板30上,再將封裝體36設置於二支架38上,而以基板30、二支架38以及封裝體36所圍繞構建之容置空間S,將發光二極體32、感測裝置34進行封裝,此為本發明第三實施例與第一實施例之不同封裝方式的另一種實施態樣。Continuing the previous paragraph and referring back to the sixth figure, the third embodiment of the present invention is to add two
請參閱第七圖,其為本發明發光二極體照明模組之第四實施例之結構示意圖。如圖所示,本發明第四實施例之發光二極體照明模組與第三實施例之差異,在於封裝體36包含二支撐座360,其中之一支撐座360設置於封裝體36之一側,另一支撐座360設置於封裝體36之另一側,二支撐座360設置於基板30上,使封裝體36、二支撐座360以及基板30構成一容置室S’,而封裝發光二極體32以及感測裝置34。Please refer to the seventh figure, which is a schematic structural diagram of the fourth embodiment of the light-emitting diode lighting module of the present invention. As shown in the figure, the difference between the light emitting diode lighting module of the fourth embodiment of the present invention and the third embodiment is that the
承接前段並且復參閱第七圖,本發明第四實施例為增設二支撐座360於封裝體36上,再將二支撐座360設置於基板30上,而以基板30、二支撐座360以及封裝體36所圍繞構建之容置室S’,將發光二極體32、感測裝置34進行封裝,此為本發明第四實施例與第三實施例之不同封裝方式的另一種實施態樣;其中,二支撐座360與封裝體36可以為一體成形之構造。Continuing the previous paragraph and referring back to the seventh figure, the fourth embodiment of the present invention is to add two
請參閱第八圖,其為本發明發光二極體照明模組之第五實施例之結構示意圖。如圖所示,本發明第五實施例之發光二極體照明模組與第一實施例之差異,在於更包含一溫度控制裝置13,設置於微控制器7之另一側以及電性連接處理裝置70,偵測該些照明裝置3產生之一光照溫度39而產生一偵測訊號130,處理裝置70接收偵測訊號130後,操控控制裝置5調節每一發光二極體32之光照強度320;其中,溫度控制裝置13可以為熱電偶、RTD (Resistance Temperature Detector,電阻溫度感測器)或熱敏電阻。由於照明裝置3作動時會產生熱量,為了避免燈座1所設置之該些照明裝置3之一部或全部因異常狀態,而造成整個發光二極體照明模組溫度過高。遂設置一溫度控制裝置13用以偵測該些發光二極體32之工作溫度是否正常,而搭配控制裝置5、處理裝置7來調節照明裝置3之光照強度320使工作溫度維持正常值。Please refer to Figure 8, which is a schematic structural diagram of the fifth embodiment of the light-emitting diode lighting module of the present invention. As shown in the figure, the difference between the LED lighting module of the fifth embodiment of the present invention and the first embodiment is that it further includes a
請參閱第九圖,其為本發明發光二極體照明模組之第六實施例之結構示意圖。如圖所示,本發明第六實施例之發光二極體照明模組與第一實施例之差異,在於更包含至少一計數裝置15,設置於微控制器7之再一側以及電性連接處理裝置70,偵測每一照明裝置3之一光照時間T而產生一工作時間訊號150,處理裝置70接收工作時間訊號150後,產生每一照明裝置3之一工作時間數據702,工作時間數據702可以經由處理裝置70傳輸至一使用者介面(User interface design,簡稱UI)17,以供使用者觀視目前該些照明裝置3之光照時間T是否已達該替換之壽命時數。其中,計數裝置15可以如同控制裝置5設置多個,而以每單一計數裝置15對應每單一照明裝置3,而本發明第六實施例之第九圖,茲以單一計數裝置15偵測複數照明裝置3進行說明。另外,使用者介面17可以為觸控螢幕所顯示之操作畫面,或者是電腦結合液晶螢幕所顯示之操作畫面,故並不以此為限。Please refer to FIG. 9, which is a schematic structural diagram of the sixth embodiment of the light-emitting diode lighting module of the present invention. As shown in the figure, the difference between the light-emitting diode lighting module of the sixth embodiment of the present invention and the first embodiment is that it further includes at least one
上述所說明之該些實施例的零組件可以選擇組合運用,而非限制單一實施例所包含之元件無法與其他實施例之元件組合運用。於此,即完成本發明該些實施例之發光二極體照明模組於實際使用時之技術手段,上揭此僅實際使用之若干範例,包含但不限於本發明,同本發明相同或相似概念及流程之變化皆可視同本發明。The components of the above-described embodiments can be selected and used in combination, and it does not limit that the components included in a single embodiment cannot be used in combination with the components of other embodiments. Here, the technical means of the light-emitting diode lighting modules of these embodiments of the present invention in actual use are completed. Here are a few examples of actual use, including but not limited to the present invention, which are the same as or similar to the present invention The concept and process changes can be regarded as the present invention.
本發明已確實達到所預期之使用目的與功效,並且較習知技藝為之理想、實用;惟,上述該些實施例僅針對本發明之較佳實施例進行具體說明,並非用以限定本發明之申請專利範圍。舉凡其它未脫離本發明所揭示之技術手段下,而所完成之均等變化與修飾,均應包含於本發明所涵蓋之申請專利範圍中。The present invention has indeed achieved the intended purpose and effect of use, and is ideal and practical compared to the conventional techniques; however, the above-mentioned embodiments are only specific descriptions of the preferred embodiments of the present invention, and are not intended to limit the present invention. The scope of patent application. All other equivalent changes and modifications completed without departing from the technical means disclosed in the present invention shall be included in the scope of patent applications covered by the present invention.
1:燈座
3:照明裝置
30:基板
32:發光二極體
320:光照強度
34:感測裝置
340:感測訊號
36:封裝體
360:支撐座
38:支架
39:光照溫度
5:控制裝置
7微控制器
70:處理裝置
700:工作訊號
702:工作時間數據
9:警示裝置
90:警示訊號
11:通訊裝置
13:溫度控制裝置
130:偵測訊號
15:計數裝置
150:工作時間訊號
S:容置空間
S’:容置室
T:光照時間1: Lamp holder
3: Lighting device
30: substrate
32: LED
320: light intensity
34: sensing device
340: sense signal
36: Package body
360: support seat
38: bracket
39: light temperature
5:
第一圖:其為本發明發光二極體照明模組之第一實施例之結構示意圖; 第二圖:其為本發明發光二極體照明模組之第一實施例之作動示意圖一; 第三圖:其為本發明發光二極體照明模組之第一實施例之作動示意圖二; 第四圖:其為本發明發光二極體照明模組之第一實施例之作動示意圖三; 第五圖:其為本發明發光二極體照明模組之第二實施例之結構示意圖; 第六圖:其為本發明發光二極體照明模組之第三實施例之結構示意圖; 第七圖:其為本發明發光二極體照明模組之第四實施例之結構示意圖; 第八圖:其為本發明發光二極體照明模組之第五實施例之結構示意圖;以及 第九圖:其為本發明發光二極體照明模組之第六實施例之結構示意圖。 Figure 1: It is a schematic diagram of the structure of the first embodiment of the light-emitting diode lighting module of the present invention; Figure 2: It is a schematic diagram of the operation of the first embodiment of the light-emitting diode lighting module of the present invention; Figure 3: It is a schematic diagram of the operation of the first embodiment of the LED lighting module of the present invention; The fourth figure: it is the operation schematic diagram of the first embodiment of the light-emitting diode lighting module of the present invention; Figure 5: It is a schematic structural view of the second embodiment of the light-emitting diode lighting module of the present invention; Figure 6: It is a schematic structural view of the third embodiment of the light-emitting diode lighting module of the present invention; Figure 7: It is a schematic structural view of the fourth embodiment of the light-emitting diode lighting module of the present invention; Figure 8: It is a schematic diagram of the structure of the fifth embodiment of the light-emitting diode lighting module of the present invention; and Figure 9: It is a schematic structural view of the sixth embodiment of the light-emitting diode lighting module of the present invention.
1:燈座 1: Lamp holder
3:照明裝置 3: Lighting device
30:基板 30: substrate
32:發光二極體 32: LED
320:光照強度 320: light intensity
34:感測裝置 34: sensing device
340:感測訊號 340: sense signal
36:封裝體 36: Package body
5:控制裝置 5: Control device
7:微控制器 7: Microcontroller
70:處理裝置 70: Processing device
Claims (9)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200934987A (en) * | 2008-02-01 | 2009-08-16 | Foxsemicon Integrated Tech Inc | Illuminating device |
TW201134311A (en) * | 2010-03-17 | 2011-10-01 | Darfon Electronics Corp | Lighting device and control method therefor |
TW201143505A (en) * | 2010-05-17 | 2011-12-01 | Hon Hai Prec Ind Co Ltd | Light-emitting apparatus and method for adjusting brightness of the light-emitting apparatus |
TWI658783B (en) * | 2018-12-04 | 2019-05-11 | 大葉大學 | Integrated sensing module for aseptic incubator |
TW202013763A (en) * | 2018-09-28 | 2020-04-01 | 光磊科技股份有限公司 | Ultraviolet LED packaging structure including an ultraviolet LED, a driving device, a control device and an indicator light |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200934987A (en) * | 2008-02-01 | 2009-08-16 | Foxsemicon Integrated Tech Inc | Illuminating device |
TW201134311A (en) * | 2010-03-17 | 2011-10-01 | Darfon Electronics Corp | Lighting device and control method therefor |
TW201143505A (en) * | 2010-05-17 | 2011-12-01 | Hon Hai Prec Ind Co Ltd | Light-emitting apparatus and method for adjusting brightness of the light-emitting apparatus |
TW202013763A (en) * | 2018-09-28 | 2020-04-01 | 光磊科技股份有限公司 | Ultraviolet LED packaging structure including an ultraviolet LED, a driving device, a control device and an indicator light |
TWI658783B (en) * | 2018-12-04 | 2019-05-11 | 大葉大學 | Integrated sensing module for aseptic incubator |
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