TWI708434B - Highly-integrated multi-antenna array - Google Patents

Abstract

The disclosure provides a highly-integrated multi-antenna array, comprising a first conductor layer, a second conductor layer, a plurality of conjoined connecting structures, a plurality of slot antennas and a conjoined slot structure. The second conductor layer is spaced apart from the first conductor layer at a first interval. The plurality of conjoined conducting structures electrically connect the first conductor layer and the second conductor layer. Each of the slot antennas includes a radiating slot structure and a signal coupling line which are partially overlapped or across each other. All of the radiating slot structures are formed at the second conductor layer. Each of the signal coupling lines is spaced apart from the second conductor layer at a coupling interval, and each of the signal coupling lines has a signal feeding point. Each of the slot antennas is excited to generate at least one resonant mode covering at least one identical first communication band. The conjoined slot structure is formed at the second conductor layer, and connects with all of the radiating slot structures.

Description

Highly integrated multi-antenna array

The technical field to which the present invention belongs relates to a highly integrated multi-antenna design, and particularly relates to a highly integrated multi-antenna array design architecture that can increase data transmission speed.

Due to the continuous improvement of wireless communication signal quality and transmission speed requirements, the rapid development of MIMO (Multi-Input Multi-Output System) multi-antenna technology has resulted. Multiple input multiple output multiple (MIMO) antenna technology has the opportunity to improve spectrum efficiency, increase channel capacity and data transmission rate, and has the opportunity to improve the reliability of communication reception signals, so it has become the development technology focus of multiple Gbps transmission rate communication systems one.

However, how can we successfully apply the multi-antenna array technology to a variety of different wireless communication devices or equipment, and achieve the advantages of good matching, high integration, thinness, and resistance to coupling interference from adjacent environments? But it is a technical challenge that is not easy to overcome, and it is also an important subject to be solved at present. Because multiple adjacent antennas operating in the same frequency band may cause mutual coupling interference and adjacent environment coupling interference, it may increase the envelope correlation coefficient (ECC, Envelop Correlation Coefficient) between multiple antennas, and cause antenna radiation characteristics to attenuate The situation happened. Therefore, the data transmission speed is reduced, and the technical difficulty of multi-antenna integrated design is increased.

Some prior art documents have proposed designing a periodic structure on the indirect ground of multiple antennas as an energy isolator to improve the energy isolation between multiple antennas and the ability to resist adjacent environment interference. However, such a design method may cause process instability, which may further increase the cost of mass production. And it may cause extra coupling current to be excited, which in turn causes the correlation coefficient between multiple antennas to increase. In addition, it is also possible to increase the overall size of the multi-antenna array, so it is less easy to apply to various wireless devices or devices.

Therefore, a design method that can solve the above-mentioned problems is needed to meet the practical application requirements of multi-antenna communication devices or equipment with high data transmission speed in the future.

In view of this, the embodiment of the present disclosure discloses a highly integrated multi-antenna array. Some practical examples based on the examples can solve the above technical problems.

According to an embodiment, the present disclosure proposes a highly integrated multi-antenna array. The highly integrated multi-antenna array includes a first conductor layer, a second conductor layer, a plurality of connected conductive structures, a plurality of slot antennas, and a connected slot structure. There is a first distance between the second conductor layer and the first conductor layer. The plurality of connected conductive structures are electrically connected to the first conductor layer and the second conductor layer. Wherein, each slot antenna has a radiation slot structure and a signal coupling line. Each of the radiation slot structure and the signal coupling line partially overlap or intersect each other. The plurality of radiation slot structures are all formed on the second conductor layer. Each of the plurality of signal coupling lines has a coupling distance with the second conductor layer, and each of the plurality of signal coupling lines has a signal feeding end. Each of the slot antennas is excited to generate at least one resonance mode, and the plurality of resonance modes cover at least one same frequency band of the first communication system. The conjoined slot structure is formed on the second conductor layer, and it communicates with the plurality of radiation slot structures.

In order to have a better understanding of the above and other contents of this case, the following examples are specially cited, in conjunction with the accompanying drawings, and detailed descriptions are as follows:

This disclosure provides an implementation example of a highly integrated multi-antenna array. The highly integrated multi-antenna array includes a first conductor layer, a second conductor layer, a plurality of connected conductive structures, a plurality of slot antennas, and a connected slot structure. There is a first distance between the second conductor layer and the first conductor layer. The plurality of connected conductive structures are electrically connected to the first conductor layer and the second conductor layer. Wherein, each slot antenna has a radiation slot structure and a signal coupling line. Each of the radiation slot structure and the signal coupling line partially overlap or intersect each other. The plurality of radiation slot structures are all formed on the second conductor layer. Each of the plurality of signal coupling lines has a coupling distance with the second conductor layer, and each of the plurality of signal coupling lines has a signal feeding end. Each of the slot antennas is excited to generate at least one resonance mode, and the plurality of resonance modes cover at least one same frequency band of the first communication system. The conjoined slot structure is formed on the second conductor layer, and it communicates with the plurality of radiation slot structures.

In order to successfully achieve high integration and thinness. The highly integrated multi-antenna array proposed by the present invention is designed by designing the plurality of radiation slot structures to be formed on the second conductor layer, and designing the plurality of conjoined conductive structures to electrically connect the first conductor layer and The second conductor layer causes the first conductor layer to successfully form a multi-antenna array radiation energy reflection layer and an adjacent coupling energy shielding layer at the same time. Therefore, the first conductor layer can successfully guide the multi-antenna array radiation energy away from The adjacent coupling energy interference. In addition, by designing each of the radiation slot structure and the signal coupling line to partially overlap or interlace each other, and designing the plurality of signal coupling lines to each have a coupling interval with the second conductor layer, The coupling distance is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band. Furthermore, a conjoined slot structure is designed to be formed on the second conductor layer, and the conjoined slot structure is connected to the plurality of radiation slot structures. In this way, the conjoined slot structure can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate for the coupling capacitance effect generated between the first conductor layer and the second conductor layer. Therefore, each of the slot antennas can be successfully excited to generate at least one well-matched resonance mode covering at least one same first communication frequency band, and the distance of the first spacing only needs to be within the lowest operating frequency of the first communication frequency band Between 0.001 wavelength and 0.038 wavelength. Therefore, the present invention can successfully achieve good matching, high integration, and thinness.

FIG. 1A is a structural diagram of a highly integrated multi-antenna array 1 according to an embodiment of the disclosure. As shown in Figure 1A, the highly integrated multi-antenna array 1 includes a first conductor layer 11, a second conductor layer 12, and a plurality of connected conductive structures 111, 112, 113, 114, 115, 116, 117 , 118 and a plurality of slot antennas 13, 14 and a conjoined slot structure 121. There is a first distance d1 between the second conductive layer 12 and the first conductive layer 11. The plurality of connected conductive structures 111, 112, 113, 114, 115, 116, 117, and 118 are all electrically connected to the first conductor layer 11 and the second conductor layer 12. The plurality of connected conductive structures 111, 112, 113, 114, 115, 116, 117, and 118 are conductor wires. Each of the slot antennas 13 and 14 has a radiation slot structure 131 and 141 and a signal coupling line 132 and 142 respectively. The radiation slot structure 131 and the signal coupling line 132 are interlaced with each other, and the radiation slot structure 141 and the signal coupling line 142 are partially overlapped with each other. The plurality of radiation slot structures 131 and 141 are all formed on the second conductor layer 12. Each of the plurality of signal coupling lines 132 and 142 has a coupling distance d3132 and d4142 between each and the second conductor layer 12. Each of the plurality of signal coupling lines 132 and 142 has a signal feeding end 1321 and 1421 respectively. The signal feed ends 1321 and 1421 are each electrically coupled to a signal source 13211, 14211, which can be impedance matching circuit, transmission line, microstrip transmission line, sandwich strip line, substrate integrated waveguide, coplanar waveguide , Amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 13, 14 is excited to generate at least one resonance mode 133, 143 (as shown in Figure 1B), and the plurality of resonance modes 133, 143 cover at least one same first communication system frequency band 17 (As shown in Figure 1B). The conjoined slot structure 121 is formed on the second conductor layer 12 and is connected to the plurality of radiation slot structures 131 and 141. The conjoined slot structure 121 is a multi-line slot structure, which is composed of two bent linear slot holes and one straight slot hole. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 17. The radiating slot structure 131 is formed on the second conductor layer 12, the signal coupling line 132 is formed on the first conductor layer 11, the radiating slot structure 131 and the signal coupling line 132 are interlaced with each other, and the signal coupling line 132 and There is a coupling distance d3132 between the second conductor layers 12. The radiating slot structure 141 is formed on the second conductor layer 12, the signal coupling line 142 is also formed on the second conductor layer 12, the radiating slot structure 141 and the signal coupling line 142 partially overlap each other, and the signal coupling There is a coupling distance d4142 between the line 142 and the second conductive layer 12. The distance between the coupling distances d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 17. The radiation slot structure 131 has an open end 1311 located at an edge 1221 of the second conductor layer 12, and the open end 1311 to the junction 12113 of the radiation slot structure 131 and the connected slot structure 121 has a slot hole The distance d1331 is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication band 17. The radiation slot structure 141 has a closed end 1412 located at an edge 1222 of the second conductor layer 12, and the closed end 1412 to the junction 12114 of the radiation slot structure 141 and the connected slot structure 121 has a closed slot. The distance d1441, the closed slot distance d1441 is between or equal to 0.05 wavelength to 0.59 wavelength of the lowest operating frequency of the first communication band 17. The length of the signal coupling lines 132 and 142 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band 17. There may be a dielectric substrate or a multilayer dielectric substrate between the second conductive layer 12 and the first conductive layer 11. The conjoined slot structure 121 can also be a linear slot structure, a square ring slot structure, a circular ring slot structure, an elliptical ring slot structure, a diamond ring slot structure, a circular slot structure, or a semicircular slot. Hole structure, elliptical slot structure, semi-elliptical slot structure, square slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure, polygon slot structure or a combination thereof.

In order to successfully achieve high integration and thinness. The highly integrated multi-antenna array 1 proposed by the present invention is designed by designing the plurality of radiation slot structures 131, 141 to be formed on the second conductor layer 12, and designing the plurality of connected conductive structures 111, 112, 113, 114, 115, 116, 117, and 118 are all electrically connected to the first conductor layer 11 and the second conductor layer 12, so that the first conductor layer 11 successfully forms a radiation energy reflection layer of a multi-antenna array at the same time. And an adjacent coupling energy shielding layer, so the first conductor layer 11 can successfully guide the radiation energy of the multi-antenna array away from adjacent coupling energy interference. In addition, by designing that each of the radiation slot structures 131, 141 and the signal coupling lines 132, 142 are partially overlapped or interlaced with each other, and designing the plurality of signal coupling lines 132, 142 to be each connected to the second There is a coupling interval d3132, d4142 between the conductor layers 12, and the distance between the coupling interval d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 17. Furthermore, a conjoined slot structure 121 is designed to be formed on the second conductor layer 12, and the conjoined slot structure 121 is connected to the plurality of radiation slot structures 131 and 141. In this way, the conjoined slot structure 121 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate the coupling capacitance effect generated between the first conductor layer 11 and the second conductor layer 12. Therefore, each of the slot antennas 13, 14 can be successfully excited to generate at least one well-matched resonance mode 133, 143 covering at least one same first communication frequency band 17, and the distance between the first spacing d1 only needs to be between the The lowest operating frequency of the first communication band 17 is between 0.001 wavelength and 0.038 wavelength. Therefore, the present invention can successfully achieve good matching, high integration and thinness.

FIG. 1B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 1 according to the embodiment of the disclosure. The return loss curve of the slot antenna 13 is 1332, the return loss curve of the slot antenna 14 is 1432, and the isolation curve of the slot antenna 13 and the slot antenna 14 is 1314. The following dimensions were selected for the experiment: the distance of the first spacing d1 was about 1.6mm; the distance of the slotted hole spacing d1331 was about 10.3 mm; the distance of the closed slot spacing d1441 was about 21.3mm; the coupling spacing d3132 The distance is about 1.6mm; the distance of the coupling interval d4142 is about 0.6mm; the length of the signal coupling line 132 is about 13mm; the length of the signal coupling line 142 is about 10 mm; the bending of the conjoined slot structure 121 The length of the broken-line slot is about 23mm; the length of the straight slot of the conjoined slot structure 121 is about 14mm. As shown in Figure 1B, the slot antenna 13 is excited to generate a well-matched resonance mode 133, and the slot antenna 14 is excited to generate a well-matched resonance mode 143. The resonance mode 133 and the resonance mode 143 cover At least one identical first communication frequency band 17. In this embodiment, the frequency range of the first communication frequency band 17 is 3400 MHz~3600 MHz, and the lowest operating frequency of the first communication frequency band 17 is 3400 MHz. As shown in Fig. 1B, the isolation curve 1314 of the slot antenna 13 and the slot antenna 14 is higher than 10dB in the first communication frequency band 17, which proves that good impedance matching and isolation performance can be achieved.

The frequency band operation and experimental data of the communication system covered in Fig. 1B are only for experimental verification of the technical effect of the embodiment of the highly integrated multi-antenna array 1 disclosed in Fig. 1A. It is not used to limit the operation, application, and specifications of the communication frequency band that the highly integrated multi-antenna array 1 of the present disclosure can cover in actual applications. The highly integrated multi-antenna array 1 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device can be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

FIG. 2A is a structural diagram of a highly integrated multi-antenna array 2 according to an embodiment of the disclosure. As shown in FIG. 2A, the highly integrated multi-antenna array 2 includes a first conductor layer 21, a second conductor layer 22, and a plurality of connected conductive structures 211, 212, 213, 214, 215, 216, 217 , 218, 219, a plurality of slot antennas 23, 24, and a conjoined slot structure 221. There is a first distance d1 between the second conductive layer 22 and the first conductive layer 21. A multilayer dielectric substrate 29 is provided between the second conductor layer 22 and the first conductor layer 21. The plurality of connected conductive structures 211, 212, 213, 214, 215, 216, 217, 218, and 219 are electrically connected to the first conductor layer 21 and the second conductor layer 22. The plurality of connected conductive structures 211, 212, 213, 214, 215, 216, 217, 218, and 219 are conductor vias. Each of the slot antennas 23 and 24 has a radiation slot structure 231 and 241 and a signal coupling line 232 and 242 respectively. The radiation slot structures 231 and 241 and the signal coupling lines 232 and 242 are interlaced with each other. The plurality of radiation slot structures 231 and 241 are all formed on the second conductor layer 22. Each of the plurality of signal coupling lines 232 and 242 has a coupling distance d3132 and d4142 between each and the second conductor layer 22. Each of the plurality of signal coupling lines 232 and 242 has a signal feeding terminal 2321 and 2421. The signal feed ends 2321, 2421 are electrically coupled to a signal source 23211, 24211, which can be impedance matching circuit, transmission line, microstrip transmission line, sandwich strip line, substrate integrated waveguide, coplanar waveguide , Amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 23, 24 is excited to generate at least one resonance mode 233, 243 (as shown in Fig. 2B), and the plurality of resonance modes 233, 243 cover at least one same first communication system frequency band 27 (As shown in Figure 2B). The conjoined slot structure 221 is formed on the second conductor layer 22 and is connected to the plurality of radiation slot structures 231 and 241. The connected slot structure 221 is a square slot structure. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 27. The radiation slot structure 231 is formed on the second conductor layer 22, and the signal coupling line 232 is integrated in the multilayer dielectric substrate 29 and is located between the first conductor layer 21 and the second conductor layer 22. The radiation slot structure 231 and the signal coupling line 232 are interlaced with each other, and there is a coupling distance d3132 between the signal coupling line 232 and the second conductor layer 22. The radiation slot structure 241 is formed on the second conductor layer 22, and the signal coupling line 242 is also integrated in the multilayer dielectric substrate 29 and is located between the first conductor layer 21 and the second conductor layer 22. The radiation slot structure 241 and the signal coupling line 242 are interlaced with each other, and there is a coupling distance d4142 between the signal coupling line 242 and the second conductor layer 22. The distance between the coupling spacings d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 27. The radiation slot structure 231 has an open end 2311 located at an edge 2221 of the second conductor layer 22, and the open end 2311 to the junction 22113 of the radiation slot structure 231 and the connected slot structure 221 has a slot hole The distance d2331 is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication band 27. The radiation slot structure 241 has an open end 2411 at an edge 2222 of the second conductor layer 22, and the open end 2411 to the junction 22114 of the radiation slot structure 241 and the conjoined slot structure 221 has a slotted hole The distance d2431 is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication frequency band 27. The length of the signal coupling lines 232 and 242 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band 27. A dielectric substrate may be provided above the second conductive layer 22, and a dielectric substrate may also be provided below the first conductive layer 21. The conjoined slot structure 221 can also be a linear slot structure, a multi-line slot structure, a square ring slot structure, a circular ring slot structure, an elliptical ring slot structure, a diamond ring slot structure, and a circular slot structure. Structure, semi-circular slot structure, elliptical slot structure, semi-elliptical slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure, polygon slot structure or a combination thereof.

FIG. 2A shows an embodiment of the highly integrated multi-antenna array 2, although the structure, shape and position arrangement of its parts are not exactly the same as the highly integrated multi-antenna array 1. However, the highly integrated multi-antenna array 2 is also formed by designing the plurality of radiation slot structures 231, 241 to be formed on the second conductor layer 22, and designing the plurality of connected conductive structures 211, 212, 213, 214, 215, 216, 217, 218, 219 are all electrically connected to the first conductor layer 21 and the second conductor layer 22, so that the first conductor layer 21 successfully forms a radiation energy reflection layer of a multi-antenna array simultaneously And an adjacent coupling energy shielding layer, so the first conductor layer 21 can successfully guide the radiation energy of the multi-antenna array away from adjacent coupling energy interference. In addition, by designing the radiation slot structures 231, 241 and the signal coupling lines 232, 242 to be interlaced with each other, and designing the plurality of signal coupling lines 232, 242 to be connected to the second conductor layer 22. There is a coupling interval d3132, d4142 therebetween, and the distance between the coupling interval d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 27. Furthermore, a conjoined slot structure 221 is designed to be formed on the second conductor layer 22, and the conjoined slot structure 221 is connected to the plurality of radiation slot structures 231 and 241. In this way, the conjoined slot structure 221 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate for the coupling capacitance effect generated between the first conductor layer 21 and the second conductor layer 22. Therefore, each of the slot antennas 23, 24 can be successfully excited to produce at least one well-matched resonance mode 233, 243 covering at least one same first communication frequency band 27 (as shown in Figure 2B), and the first distance The distance of d1 only needs to be between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 27. Therefore, the multi-antenna array 2 of the present invention can successfully achieve good matching, high integration, and thinness.

FIG. 2B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 2 according to the embodiment of the disclosure. The return loss curve of the slot antenna 23 is 2332, the return loss curve of the slot antenna 24 is 2432, and the isolation curve of the slot antenna 23 and the slot antenna 24 is 2324. The following dimensions were selected for the experiment: the distance of the first spacing d1 was about 1mm; the distance of the slotted hole spacing d2331 was about 8.2mm; the distance of the slotted hole spacing d2431 was about 8.2mm; the distance of the coupling spacing d3132 The length of the coupling distance d4142 is about 0.3 mm; the length of the signal coupling line 232 is about 15 mm; the length of the signal coupling line 242 is about 15 mm; the rectangular slot of the conjoined slot structure 221 The area of the hole structure is approximately 327.6 mm2. As shown in Figure 2B, the slot antenna 23 is excited to generate a well-matched resonance mode 233, and the slot antenna 24 is excited to generate a well-matched resonance mode 243. The resonance mode 233 and the resonance mode 243 cover At least one identical first communication frequency band 27. In this embodiment, the frequency range of the first communication frequency band 27 is 3300 MHz~3800 MHz, and the lowest operating frequency of the first communication frequency band 27 is 3300 MHz. As shown in FIG. 2B, the isolation curve 2324 of the slot antenna 23 and the slot antenna 24 is higher than 11dB in the first communication frequency band 27, which proves that good impedance matching and isolation performance can be achieved.

The frequency band operation and experimental data of the communication system covered in Fig. 2B are only for experimental verification of the technical effects of the embodiment of the highly integrated multi-antenna array 2 disclosed in Fig. 2A. It is not used to limit the operation, application, and specifications of the communication frequency band that the highly integrated multi-antenna array 2 of the present disclosure can cover in actual applications. The highly integrated multi-antenna array 2 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device can be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

FIG. 3A is a structural diagram of a highly integrated multi-antenna array 3 according to an embodiment of the disclosure. As shown in FIG. 3A, the highly integrated multi-antenna array 3 includes a first conductor layer 31, a second conductor layer 32, and a plurality of connected conductive structures 311, 312, 313, 314, 315, 316, 317 , 318, 319, 319, 3110 and a plurality of slot antennas 33, 34 and a conjoined slot structure 321. There is a first distance d1 between the second conductive layer 32 and the first conductive layer 31. There is a multilayer dielectric substrate 39 between the second conductive layer 32 and the first conductive layer 31. The plurality of connected conductive structures 311, 312, 313, 314, 315, 316, 317, 318, 319, 3110 are all electrically connected to the first conductor layer 31 and the second conductor layer 32. The plurality of connected conductive structures 311, 312, 313, 314, 315, 316, 317, 318, 319, and 3110 are conductor through holes. Wherein, each of the slot antennas 33 and 34 has a radiation slot structure 331 and 341 and a signal coupling line 332 and 342 respectively. The radiation slot structure 331 and the signal coupling line 332 are interlaced with each other, and the radiation slot structure 341 and the signal coupling line 342 are partially overlapped with each other. The plurality of radiation slot structures 331 and 341 are all formed on the second conductor layer 32. Each of the plurality of signal coupling lines 332 and 342 has a coupling distance d3132 and d4142 between each and the second conductor layer 32. Each of the plurality of signal coupling lines 332 and 342 has a signal feeding end 3321 and 3421 respectively. The signal feed ends 3321 and 3421 are electrically coupled to a signal source 33211, 34211, which can be impedance matching circuits, transmission lines, microstrip transmission lines, sandwich strip lines, substrate integrated waveguides, and coplanar waveguides. , Amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 33, 34 is excited to generate at least one resonance mode 333, 343 (as shown in Fig. 3B), and the plurality of resonance modes 333, 343 cover at least one same first communication system frequency band 37 (As shown in Figure 3B). The conjoined slot structure 321 is formed on the second conductor layer 32 and is connected to the plurality of radiation slot structures 331 and 341. The connected slot structure 321 is an elliptical annular slot structure. The elliptical ring-shaped slot structure is surrounded by the second conductor layer 32 to form an elliptical conductor area, and the elliptical conductor area can also be electrically coupled to other signal sources or circuits. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 37. The radiation slot structure 331 is formed on the second conductive layer 32, and the signal coupling line 332 is integrated in the multilayer dielectric substrate 39 and is located between the first conductive layer 31 and the second conductive layer 32. The radiation slot structure 331 and the signal coupling line 332 are interlaced with each other, and there is a coupling distance d3132 between the signal coupling line 332 and the second conductive layer 32. The radiation slot structure 341 is formed on the second conductor layer 32, and the signal coupling line 342 is also formed on the second conductor layer 32. The radiation slot structure 341 partially overlaps the signal coupling line 342, and there is a coupling distance d4142 between the signal coupling line 342 and the second conductor layer 32. The distance between the coupling spacings d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 37. The radiation slot structure 331 has an open end 3311 located at an edge 3221 of the second conductor layer 32, and the open end 3311 to the junction 32113 of the radiation slot structure 331 and the connected slot structure 321 has a slotted hole The distance d3331 is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication band 37. The radiation slot structure 341 has an open end 3411 located at an edge 3222 of the second conductor layer 32, and the open end 3411 to the junction 32114 of the radiation slot structure 341 and the connected slot structure 321 has a slotted hole The distance d3431 is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication band 37. The length of the signal coupling lines 332 and 342 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band 37. A dielectric substrate may be provided above the second conductive layer 32, and a dielectric substrate may also be provided below the first conductive layer 31. The connected slot structure 321 can also be a linear slot structure, a multi-line slot structure, a square ring slot structure, a circular ring slot structure, a diamond ring slot structure, a circular slot structure, and a semicircular slot. Hole structure, elliptical slot structure, semi-elliptical slot structure, square slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure, polygon slot structure or a combination thereof.

FIG. 3A shows an embodiment of the highly integrated multi-antenna array 3, although the structure, shape and position arrangement of its parts are not completely the same as the highly integrated multi-antenna array 1. However, the highly integrated multi-antenna array 3 is also formed by designing the plurality of radiation slot structures 331, 341 to be formed on the second conductor layer 32, and designing the plurality of connected conductive structures 311, 312, 313, 314, 315, 316, 317, 318, 319, and 3110 are all electrically connected to the first conductor layer 31 and the second conductor layer 32, so that the first conductor layer 31 successfully forms the radiation energy of a multi-antenna array simultaneously The reflective layer and an adjacent coupling energy shielding layer, so the first conductor layer 31 can successfully guide the multi-antenna array radiation energy away from adjacent coupling energy interference. In addition, by designing that each of the radiating slot structures 331, 341 and the signal coupling lines 332, 342 are all interlaced or partially overlapped with each other, and the plurality of signal coupling lines 332, 342 are designed to be connected to the second There is a coupling interval d3132, d4142 between the conductor layers 32, and the distance between the coupling intervals d3132 and d4142 is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 37. Furthermore, a conjoined slot structure 321 is designed to be formed on the second conductor layer 32, and the conjoined slot structure 321 is connected to the plurality of radiation slot structures 331 and 241. In this way, the conjoined slot structure 321 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate for the coupling capacitance effect generated between the first conductor layer 31 and the second conductor layer 32. Therefore, each of the slot antennas 33, 34 can be successfully excited to produce at least one well-matched resonance mode 333, 343 covering at least one same first communication frequency band 37 (as shown in Figure 3B), and the first distance The distance of d1 only needs to be between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 37. Therefore, the multi-antenna array 3 of the present invention can also successfully achieve good matching, high integration and thinness.

FIG. 3B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 3 according to the embodiment of the disclosure. The return loss curve of the slot antenna 33 is 3332, the return loss curve of the slot antenna 34 is 3432, and the isolation curve of the slot antenna 33 and the slot antenna 34 is 3334. The following dimensions were selected for the experiment: the distance of the first spacing d1 was about 1.6mm; the distance of the slotted hole spacing d3331 was about 8.5mm; the distance of the slotted hole spacing d3431 was about 9.3mm; the coupling spacing d3132 The distance is about 0.8mm; the distance of the coupling interval d4142 is about 0.9mm; the length of the signal coupling line 332 is about 15mm; the length of the signal coupling line 342 is about 10 mm; the ellipse of the conjoined slot structure 321 The length of the slot ring of the annular slot structure is about 62.24mm. As shown in Fig. 3B, the slot antenna 33 is excited to generate a well-matched resonance mode 333, and the slot antenna 34 is excited to generate a well-matched resonance mode 343. The resonance mode 333 and the resonance mode 343 cover At least one same first communication frequency band 37. In this embodiment, the frequency range of the first communication frequency band 37 is 3300 MHz~3800 MHz, and the lowest operating frequency of the first communication frequency band 37 is 3300 MHz. As shown in FIG. 3B, the isolation curve 3324 of the slot antenna 33 and the slot antenna 34 is higher than 10dB in the first communication frequency band 37, which verifies that good impedance matching and isolation performance can be achieved.

The frequency band operation and experimental data of the communication system covered in Fig. 3B are only for experimental verification of the technical effects of the embodiment of the highly integrated multi-antenna array 3 disclosed in Fig. 3A. It is not used to limit the operation, application, and specifications of the communication frequency band that the highly integrated multi-antenna array 3 of the present disclosure can cover in actual applications. The highly integrated multi-antenna array 3 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device may be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

FIG. 4A is a structural diagram of a highly integrated multi-antenna array 4 according to an embodiment of the disclosure. As shown in FIG. 4A, the highly integrated multi-antenna array 4 includes a first conductor layer 41, a second conductor layer 42, and a plurality of connected conductive structures 411, 412, 413, 414, 415, 416, 417 And a plurality of slot antennas 43, 44, 45, 46 and a connected slot structure 421. There is a first distance d1 between the second conductive layer 42 and the first conductive layer 41. There is a multilayer dielectric substrate 49 between the second conductive layer 42 and the first conductive layer 41. The plurality of conjoined conductive structures 411, 412, 413, 414, 415, 416, and 417 are all electrically connected to the first conductive layer 41 and the second conductive layer 42. The plurality of connected conductive structures 411, 412, 413, 414, 415, 416, and 417 are conductor vias. Each of the slot antennas 43, 44, 45, 46 has a radiation slot structure 431, 441, 451, 461 and a signal coupling line 432, 442, 452, 462. The radiation slot structures 431, 441, 451, and 461 and the signal coupling lines 432, 442, 452, and 462 are all interlaced with each other. The plurality of radiation slot structures 431, 441, 451, and 461 are all formed on the second conductive layer 42. Each of the plurality of signal coupling lines 432, 442, 452, and 462 has a coupling distance d3132, d4142, d5152, and d6162 between each and the second conductor layer 42. Each of the plurality of signal coupling lines 432, 442, 452, 462 has a signal feed-in terminal 4321, 4421, 4521, 4621. The signal feed-in terminals 4321, 4421, 4521, and 4621 are electrically coupled to a signal source 43211, 44211, 45211, 46211, and the signal sources 43211, 44211, 45211, 46211 can be impedance matching circuits, transmission lines, or microstrip transmission lines. , Sandwich strip line, substrate integrated waveguide, coplanar waveguide, amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 43, 44, 45, 46 is excited to generate at least one resonance mode 433, 443, 453, 463 (as shown in Figure 4B), and the plurality of resonance modes 433, 443, 453, 463 covers at least one same first communication system frequency band 47 (as shown in Fig. 4B). The conjoined slot structure 421 is formed on the second conductor layer 42 and is connected to the plurality of radiation slot structures 431, 441, 451, 461. The connected slot structure 421 is an annular slot structure. The annular slot structure surrounds the second conductor layer 42 to form a circular conductor area, and the circular conductor area can also be electrically coupled to other signal sources or circuits. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 47. The plurality of radiation slot structures 431, 441, 451, and 461 are all formed on the second conductor layer 42, and the plurality of signal coupling lines 432, 442, 452, and 462 are all integrated on the multilayer dielectric substrate 49 and located on the first conductor layer. Between the conductor layer 41 and the second conductor layer 42. The radiation slot structure 431 and the signal coupling line 432 are interlaced with each other, and there is a coupling distance d3132 between the signal coupling line 432 and the second conductive layer 42. The radiation slot structure 441 and the signal coupling line 442 are interlaced with each other, and there is a coupling distance d4142 between the signal coupling line 442 and the second conductive layer 42. The radiation slot structure 451 and the signal coupling line 452 are interlaced with each other, and there is a coupling distance d5152 between the signal coupling line 452 and the second conductive layer 42. The radiation slot structure 461 and the signal coupling line 462 are interlaced with each other, and there is a coupling distance d6162 between the signal coupling line 462 and the second conductor layer 42. The coupling distances d3132, d4142, d5152, and d6162 are between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 47. The radiation slot structure 431 has an open end 4311 located at an edge 4221 of the second conductor layer 42, and the open end 4311 to the junction 42113 of the radiation slot structure 431 and the connected slot structure 421 has a slot hole Spacing d4331. The radiation slot structure 441 has an open end 4411 located at an edge 4222 of the second conductor layer 42. The open end 4411 has a slotted hole at the junction 42114 of the radiation slot structure 441 and the connected slot structure 421 Spacing d4431. The radiation slot structure 451 has an open end 4511 located at an edge 4223 of the second conductor layer 42. The open end 4511 has a slotted hole at the junction 42115 of the radiation slot structure 451 and the conjoined slot structure 421. Spacing d4531. The radiation slot structure 461 has an open end 4611 located at an edge 4224 of the second conductor layer 42. The open end 4611 has a slotted hole at the intersection 42116 of the radiation slot structure 461 and the conjoined slot structure 421 Spacing d4631. The distances between the slotted holes d4331, d4431, d4531, and d4631 are between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication band 47. The length of the signal coupling lines 432, 442, 452, 462 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band 47. The second conductive layer 42 may have a dielectric substrate above, and the first conductive layer 41 may also have a dielectric substrate below. The conjoined slot structure 421 can also be a linear slot structure, a multi-line slot structure, a square ring slot structure, an elliptical ring slot structure, a diamond ring slot structure, a circular slot structure, and a semicircular slot structure. Structure, elliptical slot structure, semi-elliptical slot structure, square slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure, polygon slot structure or a combination thereof.

FIG. 4A shows an embodiment of the highly integrated multi-antenna array 4, although the number of slot antennas, the structure shape and position arrangement of each part are not exactly the same as the highly integrated multi-antenna array 1. However, the highly integrated multi-antenna array 4 is also formed by designing the plurality of radiation slot structures 431, 441, 451, and 461 to be formed on the second conductor layer 42, and designing the plurality of connected conductive structures 411, 412, 413, 414, 415, 416, and 417 are all electrically connected to the first conductor layer 41 and the second conductor layer 42, so that the first conductor layer 41 successfully forms a radiation energy reflection layer of a multi-antenna array at the same time. And an adjacent coupling energy shielding layer, so the first conductor layer 41 can successfully guide the radiation energy of the multi-antenna array away from adjacent coupling energy interference. In addition, by designing each of the radiation slot structures 431, 441, 451, 461 and the signal coupling lines 432, 442, 452, 462 to be interlaced with each other, and designing the plurality of signal coupling lines 432, 442, 452 and 462 each have a coupling distance d3132, d4142, d5152, d6162 between each and the second conductor layer 42, and the distance between the coupling distances d3132, d4142, d5152, and d6162 is between the lowest operating frequency of the first communication band 47 Between 0.001 wavelength and 0.035 wavelength. In addition, a conjoined slot structure 421 is designed to be formed on the second conductor layer 42, and the conjoined slot structure 421 communicates with the plurality of radiation slot structures 431, 441, 451, and 461. In this way, the conjoined slot structure 421 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate for the coupling capacitance effect generated between the first conductor layer 41 and the second conductor layer 42. Therefore, each of the slot antennas 43, 44, 45, 46 can be successfully excited to produce at least one well-matched resonance mode 433, 443, 453, 463 covering at least one same first communication frequency band 47 (as shown in Figure 4B Show), and the distance of the first spacing d1 only needs to be between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 47. Therefore, the multi-antenna array 4 of the present invention can also successfully achieve good matching, high integration and thinness.

FIG. 4B is a graph of the return loss and isolation of the highly integrated multi-antenna array 4 of the disclosed embodiment. The return loss curve of the slot antenna 43 is 4332, the return loss curve of the slot antenna 44 is 4432, the return loss curve of the slot antenna 45 is 4532, and the return loss curve of the slot antenna 46 is 4632. The isolation curve between the slot antenna 43 and the slot antenna 44 is 4344, the isolation curve between the slot antenna 44 and the slot antenna 45 is 4445, and the isolation curve between the slot antenna 45 and the slot antenna 46 is 4546 , The isolation curve between the slot antenna 43 and the slot antenna 46 is 4346. The following dimensions were selected for the experiment: the distance of the first spacing d1 was about 1 mm; the distances of the slotted hole spacings d4331, d4431, d4531, and d4631 were all about 8.15 mm; the coupling spacings d3132, d4142, d5152, and d6162 The distances are all about 0.3 mm; the lengths of the signal coupling lines 432, 442, 452, 462 are all about 15 mm; the length of the slot ring of the annular slot structure of the conjoined slot structure 421 is about 79.64 mm. As shown in Figure 4B, the slot antenna 43 is excited to produce a well-matched resonance mode 433, the slot antenna 44 is excited to produce a well-matched resonance mode 443, and the slot antenna 45 is excited to produce a well-matched resonance mode 433. In the resonance mode 453, the slot antenna 46 is excited to generate a well-matched resonance mode 463. The plurality of resonance modes 433, 443, 453, and 463 cover at least one same first communication frequency band 47. In this embodiment, the frequency range of the first communication frequency band 47 is 3300 MHz-4200 MHz, and the lowest operating frequency of the first communication frequency band 47 is 3300 MHz. As shown in Figure 4B, the isolation curves 4344, 4445, 4546, and 4346 between the plurality of slot antennas 43, 44, 45, 46 are all higher than 10dB in the first communication frequency band 47, and the verification can achieve good results The impedance matching and isolation performance.

The frequency band operation and experimental data of the communication system covered in Fig. 4B are only for experimental verification of the technical effect of the embodiment of the highly integrated multi-antenna array 4 disclosed in Fig. 4A. It is not used to limit the operation, application, and specifications of the communication frequency band that the highly integrated multi-antenna array 4 of the present disclosure can cover in actual applications. The highly integrated multi-antenna array 4 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device can be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

FIG. 5A is a structural diagram of a highly integrated multi-antenna array 5 according to an embodiment of the disclosure. As shown in FIG. 5A, the highly integrated multi-antenna array 5 includes a first conductor layer 51, a second conductor layer 52, and a plurality of connected conductive structures 511, 512, 513, 514, 515, 516, 517 , 518, 519, 5110, 5111 and a plurality of slot antennas 53, 54, 55, 56 and a connected slot structure 521. There is a first distance d1 between the second conductive layer 52 and the first conductive layer 51. There is a dielectric substrate 58 between the second conductive layer 52 and the first conductive layer 51. The plurality of connected conductive structures 511, 512, 513, 514, 515, 516, 517, 518, 519, 5110, and 5111 are electrically connected to the first conductor layer 51 and the second conductor layer 52. The plurality of connected conductive structures 511, 512, 513, 514, 515, 516, 517, 518, 519, 5110, and 5111 are conductor vias. Each of the slot antennas 53, 54, 55, and 56 has a radiation slot structure 531, 541, 551, 561 and a signal coupling line 532, 542, 552, 562, respectively. Each of the radiation slot structures 531, 541, 551, and 561 and the signal coupling lines 532, 542, 552, and 562 partially overlap each other. The plurality of radiation slot structures 531, 541, 551, and 561 are all formed on the second conductor layer 52. Each of the plurality of signal coupling lines 532, 542, 552, and 562 has a coupling distance d3132, d4142, d5152, and d6162 between each and the second conductor layer 52. The plurality of signal coupling lines 532, 542, 552, and 562 each have a signal feeding terminal 5321, 5421, 5521, 5621. The signal feed-in terminals 5321, 5421, 5521, 5621 are each electrically coupled to a signal source 53211, 54211, 55211, 56211. The signal sources 53211, 54211, 55211, 56211 can be impedance matching circuits, transmission lines, or microstrip transmission lines. , Sandwich strip line, substrate integrated waveguide, coplanar waveguide, amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 53, 54, 55, and 56 are each excited to generate at least one resonance mode 533, 543, 553, 563 (as shown in Figure 5B), and the plurality of resonance modes 533, 543, 553, 563 covers at least one same first communication system frequency band 57 (as shown in Figure 5B). The conjoined slot structure 521 is formed on the second conductor layer 52, and it communicates with the plurality of radiation slot structures 531, 541, 551, 561. The connected slot structure 521 is a square slot structure. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 57. The plurality of radiation slot structures 531, 541, 551, and 561 are all formed on the second conductor layer 52. The plurality of signal coupling lines 532, 542, 552, and 562 are also formed on the second conductor layer 52. The radiation slot structure 531 and the signal coupling line 532 partially overlap each other, and there is a coupling distance d3132 between the signal coupling line 532 and the second conductive layer 52. The radiation slot structure 541 and the signal coupling line 542 partially overlap each other, and there is a coupling distance d4142 between the signal coupling line 542 and the second conductive layer 52. The radiation slot structure 551 and the signal coupling line 552 partially overlap each other, and there is a coupling distance d5152 between the signal coupling line 552 and the second conductive layer 52. The radiation slot structure 561 and the signal coupling line 562 partially overlap each other, and there is a coupling distance d6162 between the signal coupling line 562 and the second conductive layer 52. The coupling distances d3132, d4142, d5152, and d6162 are between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band 57. The radiation slot structure 531 has a closed end 5312 located at an edge 5221 of the second conductor layer 52, and the closed end 5312 to the junction 52113 of the radiation slot structure 531 and the connected slot structure 521 has a closed slot. Spacing d5341. The radiation slot structure 541 has a closed end 5412 located at an edge 5222 of the second conductor layer 52, and the closed end 5412 to the junction 52114 of the radiation slot structure 541 and the connected slot structure 521 has a closed slot. Spacing d5441. The radiation slot structure 551 has a closed end 5512 located at an edge 5223 of the second conductor layer 52, and the closed end 5512 to the junction of the radiation slot structure 551 and the connected slot structure 521 has a closed slot 52115 Spacing d5541. The radiation slot structure 561 has a closed end 5612 located at an edge 5224 of the second conductor layer 52, and the closed end 5612 to the junction 52116 of the radiation slot structure 561 and the connected slot structure 521 has a closed slot. Spacing d5641. The distances between the closed slot holes d5341, d5441, d5541, and d5641 are all between 0.05 wavelength and 0.59 wavelength of the lowest operating frequency of the first communication band 57. The length of the signal coupling lines 532, 542, 552, 562 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band 57. The second conductive layer 52 may have a dielectric substrate above, and the first conductive layer 51 may also have a dielectric substrate below. The conjoined slot structure 521 can also be a linear slot structure, a multi-line slot structure, a square ring slot structure, a circular ring slot structure, an elliptical ring slot structure, a diamond ring slot structure, and a circular slot structure. Structure, semi-circular slot structure, elliptical slot structure, semi-elliptical slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure, polygon slot structure or a combination thereof.

FIG. 5A shows an embodiment of the highly integrated multi-antenna array 5, although the number of slot antennas, the structural shape and position arrangement of each part are not exactly the same as those of the highly integrated multi-antenna array 1. However, the highly integrated multi-antenna array 5 is also formed by designing the plurality of radiation slot structures 531, 541, 551, 561 to be formed on the second conductor layer 52, and designing the plurality of connected conductive structures 511, 512, 513, 514, 515, 516, 517, 518, 519, 5110, and 5111 are all electrically connected to the first conductor layer 51 and the second conductor layer 52, so that the first conductor layer 51 is successfully and equivalently formed at the same time. The radiation energy reflection layer of the multi-antenna array and an adjacent coupling energy shielding layer, so the first conductor layer 51 can successfully guide the multi-antenna array radiation energy away from adjacent coupling energy interference. In addition, by designing the radiation slot structures 531, 541, 551, 561 and the signal coupling lines 532, 542, 552, 562 to partially overlap each other, and designing the plurality of signal coupling lines 532, 542 , 552, and 562 each have a coupling distance d3132, d4142, d5152, d6162 between each and the second conductor layer 52, and the distance between the coupling distances d3132, d4142, d5152, and d6162 is between the lowest operating frequency of the first communication band 57 Between 0.001 wavelength and 0.035 wavelength. Furthermore, a conjoined slot structure 521 is designed to be formed on the second conductor layer 52, and the conjoined slot structure 521 communicates with the plurality of radiation slot structures 531, 541, 551, 561. In this way, the conjoined slot structure 521 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate the coupling capacitance effect generated between the first conductor layer 51 and the second conductor layer 52. Therefore, each of the slot antennas 53, 54, 55, and 56 can be successfully excited to generate at least one well-matched resonance mode 533, 543, 553, and 563 covering at least one same first communication frequency band 57 (as shown in Figure 5B). Show), and the distance of the first spacing d1 only needs to be between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band 57. Therefore, the multi-antenna array 5 of the present invention can also successfully achieve good matching, high integration and thinness.

FIG. 5B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 5 according to the embodiment of the disclosure. The return loss curve of the slot antenna 53 is 5332, the return loss curve of the slot antenna 54 is 5432, the return loss curve of the slot antenna 55 is 5532, and the return loss curve of the slot antenna 56 is 5632. The isolation curve between the slot antenna 53 and the slot antenna 54 is 5354, the isolation curve between the slot antenna 54 and the slot antenna 55 is 5455, and the isolation curve between the slot antenna 55 and the slot antenna 56 is 5556 , The isolation curve between the slot antenna 53 and the slot antenna 56 is 5356. The following dimensions were selected for the experiment: the distance between the first pitch d1 was about 1.6 mm; the distance between the closed slot pitches d5341, d5441, d5541, and d5641 were all about 17.5 mm; the coupling pitches d3132, d4142, d5152, and d6162 The distances are all about 0.5 mm; the lengths of the signal coupling lines 532, 542, 552, and 562 are all about 15 mm; the area of the rectangular slot structure of the conjoined slot structure 521 is about 106.1 mm 2. As shown in Fig. 5B, the slot antenna 53 is excited to generate a well-matched resonance mode 533, the slot antenna 54 is excited to generate a well-matched resonance mode 543, and the slot antenna 55 is excited to generate a well-matched resonance mode 543. In the resonance mode 553, the slot antenna 56 is excited to generate a well-matched resonance mode 563. The plurality of resonance modes 533, 543, 553, and 563 cover at least one same first communication frequency band 57. In this embodiment, the frequency range of the first communication frequency band 57 is 3400 MHz~3600 MHz, and the lowest operating frequency of the first communication frequency band 57 is 3400 MHz. As shown in Figure 5B, the isolation curves 5354, 5455, 5556, and 5356 between the plurality of slot antennas 53, 54, 55, 56 are all higher than 9.5dB in the first communication frequency band 57. Good impedance matching and isolation performance.

The frequency band operation and experimental data of the communication system covered in Fig. 5B are only for experimental verification of the technical effects of the embodiment of the highly integrated multi-antenna array 5 disclosed in Fig. 5A. It is not used to limit the operation, application, and specifications of the communication frequency band that the highly integrated multi-antenna array 5 of the present disclosure can cover in actual applications. The highly integrated multi-antenna array 5 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device can be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

FIG. 6 is a structural diagram of a highly integrated multi-antenna array 6 according to an embodiment of the disclosure. As shown in Figure 6, the highly integrated multi-antenna array 6 includes a first conductor layer 61, a second conductor layer 62, and a plurality of connected conductive structures 611, 612, 613, 614, 615, 616, 617 , 618 and a plurality of slot antennas 63, 64, 65, 66 and a connected slot structure 621. There is a first distance d1 between the second conductive layer 62 and the first conductive layer 61. A dielectric substrate 68 is provided between the second conductive layer 62 and the first conductive layer 61. The plurality of connected conductive structures 611, 612, 613, 614, 615, 616, 617, and 618 are all electrically connected to the first conductive layer 61 and the second conductive layer 62. The plurality of connected conductive structures 611, 612, 613, 614, 615, 616, 617, and 618 are conductor vias. Each of the slot antennas 63, 64, 65, and 66 has a radiation slot structure 631, 641, 651, 661 and a signal coupling line 632, 642, 652, 662. Each of the radiation slot structures 631, 641, 651, and 661 and the signal coupling lines 632, 642, 652, and 662 partially overlap each other. The plurality of radiation slot structures 631, 641, 651, and 661 are all formed on the second conductive layer 62. Each of the plurality of signal coupling lines 632, 642, 652, and 662 has a coupling distance d3132, d4142, d5152, and d6162 between each and the second conductor layer 62. The plurality of signal coupling lines 632, 642, 652, and 662 each have a signal feed-in terminal 6321, 6421, 6521, and 6621. The signal feed-in terminals 6321, 6421, 6521, and 6621 are each electrically coupled to a signal source 63211, 64211, 65211, 66211, the signal source 63211, 64211, 65211, 66211 can be impedance matching circuit, transmission line, microstrip transmission line , Sandwich strip line, substrate integrated waveguide, coplanar waveguide, amplifier circuit, integrated circuit chip or radio frequency module. Each of the slot antennas 63, 64, 65, 66 is excited to generate at least one resonance mode, and the plurality of resonance modes cover at least one same frequency band of the first communication system. The conjoined slot structure 621 is formed on the second conductor layer 62, and it communicates with the plurality of radiation slot structures 631, 641, 651, and 661. The connected slot structure 621 is a polygonal slot structure. The distance of the first spacing d1 is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication band. The plurality of radiation slot structures 631, 641, 651, and 661 are all formed on the second conductive layer 62. The plurality of signal coupling lines 632, 642, 652, and 662 are also formed on the second conductor layer 62. The radiation slot structure 631 and the signal coupling line 632 partially overlap each other, and there is a coupling distance d3132 between the signal coupling line 632 and the second conductive layer 62. The radiation slot structure 641 and the signal coupling line 642 partially overlap each other, and there is a coupling distance d4142 between the signal coupling line 642 and the second conductor layer 62. The radiation slot structure 651 and the signal coupling line 652 partially overlap each other, and there is a coupling distance d5152 between the signal coupling line 652 and the second conductive layer 62. The radiation slot structure 661 and the signal coupling line 662 partially overlap each other, and there is a coupling distance d6162 between the signal coupling line 662 and the second conductive layer 62. The coupling distances d3132, d4142, d5152, and d6162 are between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication band. The radiation slot structure 631 has a closed end 6312 located at an edge 6221 of the second conductor layer 62, and the closed end 6312 to the junction of the radiation slot structure 631 and the connected slot structure 621 has a closed slot 62113 Spacing d6341. The radiation slot structure 641 has an open end 6411 located at an edge 6222 of the second conductor layer 62, and the open end 6411 to the junction of the radiation slot structure 641 and the conjoined slot structure 621 has a slotted hole 62114 Spacing d6431. The radiation slot structure 651 has a closed end 6512 located at an edge 6223 of the second conductor layer 62, and the closed end 6512 to the junction of the radiation slot structure 651 and the connected slot structure 621 has a closed slot 62115 Spacing d6541. The radiation slot structure 661 has an open end 6611 located at an edge 6224 of the second conductor layer 62, and the open end 6611 to the junction of the radiation slot structure 661 and the conjoined slot structure 621 has a slotted hole 62116 Spacing d6631. The distances between the slotted holes d6431 and d6631 are between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication frequency band. The distance between each of the closed slot holes d6341 and d6541 is between 0.05 wavelength and 0.59 wavelength of the lowest operating frequency of the first communication band. The length of the signal coupling lines 632, 642, 652, 662 is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication band. A dielectric substrate may be provided above the second conductive layer 62, and a dielectric substrate may also be provided below the first conductive layer 61. The conjoined slot structure 621 can also be a linear slot structure, a multi-line slot structure, a square ring slot structure, a circular ring slot structure, an elliptical ring slot structure, a diamond ring slot structure, and a circular slot structure. Structure, semi-circular slot structure, elliptical slot structure, semi-elliptical slot structure, square slot structure, rectangular slot structure, rhombus slot structure, parallelogram slot structure or a combination thereof.

FIG. 6 shows an embodiment of the highly integrated multi-antenna array 6, although the number of slot antennas, the structural shape and position arrangement of each part are not completely the same as the highly integrated multi-antenna array 1. However, the highly integrated multi-antenna array 6 is also formed by designing the plurality of radiation slot structures 631, 641, 651, and 661 to be formed on the second conductor layer 62, and designing the plurality of connected conductive structures 611, 612, 613, 614, 615, 616, 617, and 618 are all electrically connected to the first conductor layer 61 and the second conductor layer 62, so that the first conductor layer 61 successfully forms the radiation energy of a multi-antenna array simultaneously The reflective layer and an adjacent coupling energy shielding layer, so the first conductor layer 61 can successfully guide the radiation energy of the multi-antenna array away from adjacent coupling energy interference. In addition, by designing the radiation slot structures 631, 641, 651, 661 and the signal coupling lines 632, 642, 652, 662 to partially overlap each other, and designing the plurality of signal coupling lines 632, 642 , 652, and 662 each have a coupling distance d3132, d4142, d5152, d6162 between each and the second conductor layer 62, and the distance between the coupling distances d3132, d4142, d5152, and d6162 is between the lowest operating frequency of the first communication band Between 0.001 wavelength and 0.035 wavelength. In addition, a conjoined slot structure 621 is designed to be formed on the second conductor layer 62, and the conjoined slot structure 621 is connected to the plurality of radiation slot structures 631, 641, 651, and 661. In this way, the conjoined slot structure 621 can effectively reduce the equivalent parasitic capacitance effect of the multi-antenna array, and successfully compensate for the coupling capacitance effect generated between the first conductor layer 61 and the second conductor layer 62. Therefore, each of the slot antennas 63, 64, 65, and 66 can be successfully excited to generate at least one well-matched resonance mode covering at least one same first communication frequency band, and the distance between the first spacing d1 only needs to be between the The lowest operating frequency of the first communication band is between 0.001 wavelength and 0.038 wavelength. Therefore, the multi-antenna array 6 of the present invention can also successfully achieve good matching, high integration and thinness.

The highly integrated multi-antenna array 6 of the present disclosure can be implemented in a single group or multiple groups in a communication device. The communication device can be a mobile communication device, a wireless communication device, a mobile computing device, a computer device, a telecommunication device, a base station device, and a wireless bridge. Computer or network peripheral equipment, etc.

To sum up, although this case has been disclosed as above in an embodiment, it is not intended to limit the case. Those with ordinary knowledge in the technical field of the case can make various changes and modifications without departing from the spirit and scope of the case. Therefore, the scope of protection in this case shall be subject to the scope of the attached patent application.

1, 2, 3, 4, 5, 6: Highly integrated multi-antenna array 11, 21, 31, 41, 51, 61: first conductor layer 111, 112, 113, 114, 115, 116, 117, 118, 211, 212, 213, 214, 215, 216, 217, 218, 219, 311, 312, 313, 314, 315, 316, 317, 318, 319, 3110, 411, 412, 413, 414, 415, 416, 417, 511, 512, 513, 514, 515, 516, 517, 518, 519, 5110, 5111, 611, 612, 613, 614, 615, 616, 617, 618: Siamese conduction structure 12, 22, 32, 42, 52, 62: second conductor layer 121, 221, 321, 421, 521, 621: Siamese slot structure 1221, 1222, 2221, 2222, 3221, 3222, 4221, 4222, 4223, 4224, 5221, 5222, 5223, 5224, 6221, 6222, 6223, 6224: the edge of the second conductor layer 13, 14, 23, 24, 33, 34, 43, 44, 45, 46, 53, 54, 55, 56, 63, 64, 65, 66: slot antenna 131, 141, 231, 241, 331, 341, 431, 441, 451, 461, 531, 541, 551, 561, 631, 641, 651, 661: radiation slot structure 132, 142, 232, 242, 332, 342, 432, 442, 452, 462, 532, 542, 552, 562, 632, 642, 652, 662: signal coupling line 1321, 1421, 2321, 2421, 3321, 3421, 4321, 4421, 4521, 4621, 5321, 5421, 5521, 5621, 6321, 6421, 6521, 6621: signal feed end 13211, 14211, 23211, 24211, 33211, 34211, 43211, 44211, 45211, 46211, 53211, 54211, 55211, 56211, 63211, 64211, 65211, 66211: signal source 133, 143, 233, 243, 333, 343, 433, 443, 453, 463, 533, 543, 553, 563: resonance mode 1311, 2311, 2411, 3311, 3411, 4311, 4411, 4511, 4611, 6411, 6611: open end 1412, 5312, 5412, 5512, 5612, 6312, 6512: closed end 12113, 12114, 22113, 22114, 32113, 32114, 42113, 42114, 42115, 42116, 52113, 52114, 52115, 52116, 62113, 62114, 62115, 62116: the junction of the radiation slot structure and the conjoined slot structure d1: first spacing d3132, d4142, d5152, d6162: coupling pitch d1331, d2331, d2431, d3331, d3431, d4331, d4431, d4531, d4631, d6431, d6631: slot pitch d1441, d5341, d5441, d5541, d5641, d6341, d6541: closed slot pitch 1332, 1432, 2332, 2432, 3332, 3432, 4332, 4432, 4532, 4632, 5332, 5432, 5532, 5632: Return loss curve of slot antenna 1314, 2324, 3334, 4344, 4445, 4546, 4346, 5354, 5455, 5556, 5356: isolation curve of slot antenna 17, 27, 37, 47, 57: the first communication frequency band 58, 68: Dielectric substrate 29, 39, 49: multilayer dielectric substrate

FIG. 1A is a structural diagram of a highly integrated multi-antenna array 1 according to an embodiment of the disclosure. FIG. 1B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 1 according to an embodiment of the disclosure. FIG. 2A is a structural diagram of a highly integrated multi-antenna array 2 according to an embodiment of the disclosure. FIG. 2B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 2 according to an embodiment of the disclosure. FIG. 3A is a structural diagram of a highly integrated multi-antenna array 3 according to an embodiment of the disclosure. FIG. 3B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 3 according to an embodiment of the disclosure. FIG. 4A is a structural diagram of a highly integrated multi-antenna array 4 according to an embodiment of the disclosure. FIG. 4B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 4 according to an embodiment of the disclosure. FIG. 5A is a structural diagram of a highly integrated multi-antenna array 5 according to an embodiment of the disclosure. FIG. 5B is a graph showing the return loss and isolation of the highly integrated multi-antenna array 5 according to an embodiment of the disclosure. FIG. 6 is a structural diagram of a highly integrated multi-antenna array 6 according to an embodiment of the disclosure.

1: Highly integrated multi-antenna array

11: The first conductor layer

111, 112, 113, 114, 115, 116, 117, 118: conjoined conduction structure

12: second conductor layer

121: Siamese slot structure

1221, 1222: the edge of the second conductor layer

13, 14: Slot antenna

131, 141: Radiation slot structure

132, 142: signal coupling line

1321, 1421: signal feed end

13211, 14211: signal source

1311: open end

1412: closed end

12113, 12114: The junction of the radiation slot structure and the conjoined slot structure

d1: first spacing

d3132, d4142: coupling pitch

d1331: Slotted hole spacing

d1441: spacing between closed slots

Claims (14)

A highly integrated multi-antenna array, including: A first conductor layer; A second conductor layer with a first distance between it and the first conductor layer; A plurality of connected conductive structures, all of which are electrically connected to the first conductor layer and the second conductor layer; A plurality of slot antennas, wherein each of the slot antennas has a radiation slot structure and a signal coupling line, each of the radiation slot structure and the signal coupling line partially overlap or intersect each other, and the plurality of radiation slots The hole structures are all formed in the second conductor layer, each of the plurality of signal coupling lines has a coupling interval with the second conductor layer, and each of the plurality of signal coupling lines has a signal feeding end, and each The slot antennas are each excited to generate at least one resonance mode, and the plurality of resonance modes cover at least one same first communication frequency band; and A conjoined slot structure is formed on the second conductor layer, and the conjoined slot structure communicates with the plurality of radiation slot structures. The highly integrated multi-antenna array described in claim 1 of the scope of patent application, wherein the distance of the first spacing is between 0.001 wavelength and 0.038 wavelength of the lowest operating frequency of the first communication frequency band. The highly integrated multi-antenna array described in claim 1, wherein the signal coupling line is formed on the first conductor layer, the second conductor layer, or on the first conductor layer and the second conductor layer between. The highly integrated multi-antenna array described in the first item of the scope of patent application, wherein the coupling distance is between 0.001 wavelength and 0.035 wavelength of the lowest operating frequency of the first communication frequency band. The highly integrated multi-antenna array described in the first item of the scope of patent application, wherein a dielectric substrate is provided between the second conductor layer and the first conductor layer. The highly integrated multi-antenna array described in the first item of the scope of patent application, wherein a multilayer dielectric substrate is provided between the second conductor layer and the first conductor layer. In the highly integrated multi-antenna array described in item 6 of the scope of patent application, the signal coupling line is integrated on the multilayer dielectric substrate. The highly integrated multi-antenna array described in claim 1, wherein the radiation slot structure has an open end located at an edge of the second conductor layer, and the open end is connected to the radiation slot structure and the connection The junction of the body slot structure has a slot hole pitch, and the slot hole pitch is between 0.01 wavelength and 0.29 wavelength of the lowest operating frequency of the first communication frequency band. The highly integrated multi-antenna array described in claim 1, wherein the radiation slot structure has a closed end located at an edge of the second conductor layer, and the closed end is connected to the radiation slot structure and the connection The junction of the body slot structure has a closed slot pitch, and the distance of the closed slot pitch is between 0.05 wavelength and 0.59 wavelength of the lowest operating frequency of the first communication frequency band. For the highly integrated multi-antenna array described in claim 1, wherein the length of the signal coupling line is between 0.03 wavelength and 0.33 wavelength of the lowest operating frequency of the first communication frequency band. The highly integrated multi-antenna array described in item 1 of the scope of patent application, wherein the conjoined slot structure is a linear slot structure, a multi-line slot structure, a square ring slot structure, and a circular ring slot structure , Oval ring slot structure, diamond ring slot structure, circular slot structure, semicircular slot structure, oval slot structure, semi-elliptical slot structure, square slot structure, rectangular slot structure, rhombus Slot structure, parallelogram slot structure, polygonal slot structure or a combination thereof. For the highly integrated multi-antenna array described in item 1 of the scope of patent application, the connected conductive structure is a conductor wire or a conductor through hole. For the highly integrated multi-antenna array described in the scope of the patent application, each of the signal feed-in ends is electrically coupled to a signal source. The highly integrated multi-antenna array described in item 13 of the scope of patent application, wherein the signal source is impedance matching circuit, transmission line, microstrip transmission line, sandwich strip line, substrate integrated waveguide, coplanar waveguide, amplifier circuit, and product Bulk circuit chip or RF module.

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