TWI707627B - Burn-in apparatus with enhance structure and method for using the same - Google Patents

Abstract

The invention discloses a burn-in apparatus having at least one burn-in socket mounted on a circuit board. The burn-in socket includes a socket assembly mounted to the circuit board for receiving a processor and a frame mounted to the circuit board in a position corresponding to the socket assembly. The frame holds a fan in order to define a flow path vertical to the circuit board.

Description

Burn-in device with structure strengthening and its use method

The present invention relates to a burn-in device for processor testing, in particular to a structure-strengthened burn-in device and a method of use thereof.

The packaged integrated circuit (IC) usually needs a certain period of burn in test to ensure that the IC product can operate in a harsh environment. The first figure shows a schematic diagram of a known burn-in device. The packaged processor (100) is housed in a base assembly (102) fixed on the circuit board (101) and electrically connected to a plurality of contacts (not shown). A cover assembly (103) equipped with a plurality of heat dissipation units presses the processor (100) and contacts the surface of the processor (100) with a thermal contact part. The cover assembly (103) is a pressing member, which will produce stress on the processor (100) and the circuit board (101) in the burn-in test, and improper stress may cause damage to the processor or deformation of the circuit board. During the burn-in test, the heat generated by the processor (100) is transferred to the package surface and released into the air via the heat dissipation unit of the cover assembly (103), such as the surface of the heat sink. With the advent of the 5G and AI era, the burn-in test has become more stringent, that is, the burn-in temperature will increase.

However, the heat dissipation mechanism designed above may not meet the advanced burn-in test. In fact, according to experience, about 30% of the heat generated by a processor undergoing burn-in testing will be transferred to the package surface, while the other 70% will be concentrated on the bottom of the processor. In other words, the cover assembly (103) It can only deal with 30% of the heat of the processor at most, and the rest must be removed by the body of the base assembly (102). Although not shown, there is a considerable space inside the base assembly (102) that requires high-density signal lines, and there is not enough space to accommodate more heat dissipation units. During the burn-in test, the heat accumulated at the bottom of the processor has a limited effect on being dissipated.

Therefore, it is necessary to develop a means to improve the heat dissipation capacity of the bottom of the burning device. Preferably, the heat dissipation capacity of the base assembly also needs to be improved.

The invention provides a burn-in device, which has at least one burn-in base and a circuit board. The circuit board has a front and a back. The burn-in base includes: a base assembly with a base for accommodating a processor A accommodating space of the base assembly is connected to the front side of the circuit board; and a structural frame fixed on the back of the circuit board and opposite to the accommodating space of the base assembly, the structure The frame holds a fan that defines a fluid path perpendicular to the back of the circuit board.

In a specific embodiment, the burning base further includes: a cover assembly pivotally connected to the base assembly, and the cover assembly has a thermal contact portion configured to act as the cover assembly When covering the base assembly, it contacts the processor in the accommodating space.

In a specific embodiment, the base assembly has an outer seat and an inner seat, the inner seat defines the accommodating space and the inner seat is accommodated in the outer seat, and the inner seat has a plurality of first notches The outer seat has a plurality of second notches, and the first notches and the second notches define a plurality of lateral heat dissipation paths of the processor.

In a specific embodiment, the base assembly has an outer seat and an inner seat, the inner seat defines the accommodating space and the inner seat is accommodated in the outer seat, and the inner seat has a first notch, The outer seat has a plurality of second notches, the first notches are adjacent to the second notches, and the second notches divide the lateral heat dissipation path of the first notch.

In a specific embodiment, the structural frame has an outer wall and an inner wall, the structural frame extends from the outer wall with a plurality of fixing arms connected to the back of the circuit board, and the inner wall of the structural frame defines a hollow to accommodate the fan.

Another object of the present invention is to provide a method of using a burn-in device, including: providing a burn-in base on the front of a circuit board, the burn-in base includes a base assembly and a cover assembly, the base assembly A processor is accommodated and the processor is pressed by the cover assembly; a structural frame is provided on the back of the circuit board relative to the pressing position of the cover assembly, and the structural frame holds a fan, and the fan defines a vertical A fluid path on the back of the circuit board; providing a test signal to the burn-in base to test the processor; and providing a control signal to the fan to control the speed.

In a specific embodiment, the cover assembly further has a temperature sensing unit for generating a sensing signal, and the method further includes: generating the control signal based on the sensing signal.

100: processor

101: circuit board

102: base assembly

103: cover assembly

200: Burn the base

210: base assembly

211: Outer Block

212: inner seat

213: bottom plate

214: Spring

215: The first gap

216: The second gap

220: cover assembly

221: Thermal Contact

300: circuit board

301: positive

302: Back

400: structure frame

401: Outer Wall

402: Inner Wall

403: fixed arm

500: Fan

The first figure shows the prior art schematic diagram of the burn-in device.

The second figure shows a side sectional view (open) of the burning device of the present invention.

The third figure shows a side sectional view (closed) of the burning device of the present invention.

The fourth figure shows another side cross-sectional view of the burning device of the present invention (closed).

The fifth figure shows a top view of the burn-in base of the present invention (without cover assembly).

The sixth figure shows a perspective view (opened) of the burning device of the present invention.

The seventh figure shows the structural frame of the burning device of the present invention.

The embodiments of the present invention will be described below with reference to schematic diagrams of ideal embodiments of the present invention. The shapes and settings in these illustrations will vary depending on manufacturing technology, design and/or tolerances It's different. Therefore, the embodiments described in the text of the present invention should not be regarded as being used to limit the structure of the present invention to specific elements or shapes, and should include any difference in shape caused by manufacturing.

The second figure and the third figure respectively show a side sectional view of an embodiment of the burning device of the present invention in the opened and closed state. The burn-in device of the present invention has at least one burn-in base (200, only one is shown in the figure) and a circuit board (300). The packaged chip or processor to be tested is subjected to a so-called burn-in test in the burn-in base (200) to evaluate the heat resistance of the processor. The circuit board (300) has a front side (301) and a back side (302). The burn-in base (200) is connected to the circuit board (300) for signals, and a signal source (not shown) transmits the burn-in test signal to the processor through the signal connection to perform the test. This embodiment discloses a burn-in base (200) with a pressing member, which mainly includes a base assembly (210) and a cover assembly (220) pivotally connected to the base assembly (210). A bottom of the base assembly (210) is fixedly connected to the front surface (301) of the circuit board (300) and the bottom of the base assembly (210) has a plurality of metal contacts for electrically connecting wires of the circuit board. A top of the base assembly (210) is configured to accommodate a processor of an appropriate size, and a plurality of metal contacts are configured to be electrically connected to the processor at the top. The metal contacts at the fixed part and the bottom of the base assembly (210) are also in an electrical connection relationship, for example, via wires or via holes.

The cover assembly (220) is connected to the base assembly (210) via a rotating shaft, and selectively covers the top of the base assembly (210). When closed, the cover assembly (220) covers the top of the base assembly (210) and contacts the packaging surface of the processor to assist heat dissipation. The cover assembly (220) may have multiple heat dissipation units, such as heat sinks, heat pipes, fans, heat spreaders, etc. As shown in the figure, the cover assembly (220) has a thermal contact portion (221), which contacts the processor package surface on the top of the base assembly (210) with an appropriate area. The thermal contact part (221) is made of high thermal conductivity material, and can be further connected to other heat dissipation units, such as heat pipes, heat sinks (heat dissipation fins) and fans, so that the heat above the processor during the burn-in process can be )exclude.

In order to make the thermal contact portion (221) of the cover assembly (220) effectively contact the packaging surface, the base assembly (210) can be further equipped with a pressing assembly (not shown) to ensure that the cover assembly (220) is covered In the right place. In order to avoid excessive pressure, the pressing assembly may include an elastic member. For example, the pressing assembly may be a lever pivotally connected to the base assembly (210), and the rotating shaft at the connection may be equipped with a buffer spring. The cover assembly (220) also has a temperature sensing unit (not shown), which can be disposed on the thermal contact portion (221) to generate a sensing signal according to the temperature of the thermal contact portion (221).

The burning machine base of the present invention also includes a structural frame (400), which is fixed on the back side (302) of the circuit board (300) and opposite to the machine base assembly (210). Specifically, the structural frame (400) is located at a position relative to the pressing direction of the cover assembly (220). The size of the structure frame (400) is appropriately selected to prevent the circuit board (300) from being pressed and deformed. Referring to the seventh figure, an embodiment of the structural frame (400) of the burning device of the present invention is shown. The structural frame (400) has an outer wall (401) and an inner wall (402). The structural frame (400) is basically a rectangular frame, and a plurality of fixed arms (403) connected to the back of the circuit board (302) extend from the outer wall (401), and the inner wall (402) defines a hollow to accommodate a fan ( 500), the signal is connected to a controller (not shown) on the circuit board, whereby the fan (500) defines a fluid path perpendicular to the back side (302) of the circuit board. In other words, the heat accumulated at the bottom of the processor, the bottom of the base assembly (210) or the circuit board (300) can be removed more efficiently, and the protection of the base assembly (210) and the circuit board (300) is improved. Alternatively, a single hollow may not be limited to accommodating a single fan (500), and more fans side by side or stacked together are also feasible. Although not shown, in some embodiments, the structure frame (400) may be configured to have multiple hollows to accommodate more fans (500).

The fourth figure illustrates another side sectional view of the burning device of the present invention. The base assembly (210) has an outer seat (211), an inner seat (212) and a bottom plate (213). The inner seat (212) is accommodated in the outer seat (211), and the inner seat (212) defines an accommodating space for the processor to be tested, and has a plurality of metal contact. The bottom plate (213) is accommodated in the outer seat (211) and located below the inner seat (212). The inner seat (212) is connected to and suspended above the bottom plate (213) via a plurality of springs (214). Therefore, the pressed processor can get buffer. In addition, the wires between the inner seat (212) and the bottom plate (213) can also be configured to have an elastic structure to avoid being damaged by being pressed. The bottom plate (213) may be provided with fixing pins (not shown) to facilitate the fixing to the circuit board (300).

The fifth figure shows a top view of the burning machine base of the present invention (the cover assembly is omitted). As shown in the figure, the inner seat (212) has a plurality of metal contact arrays. In addition, the inner seat (212) has a pair of first notches (214) which communicate with the accommodating space of the processor under test and extend laterally to the outer seat (211). The outer seat (211) has two second notches (216) relative to the first notch (215), which communicate with the first notch (215) and extend laterally to the outside of the outer seat (211). As shown in the figure, the first notch (215) and the corresponding second notch (216) define multiple lateral heat dissipation paths of the processor under test. These structures and their defined heat dissipation paths can be shown more clearly in Figure 6, as shown by the arrows. Accordingly, the burn-in base of the present invention can also improve the lateral heat dissipation capability.

During the test using the burn-in device of the present invention, a controller or a signal source will provide a test signal to the burn-in base via the circuit board. At the same time, the controller can provide a control signal to start the fan. As the temperature of the processor to be tested increases, the temperature sensing unit in the thermal contact portion of the cover assembly will transmit a sensing signal to the controller. The controller can generate a control signal based on the sensing signal and determine the speed of the motor.

400: structure frame

401: Outer Wall

402: Inner Wall

403: fixed arm

500: Fan

Claims (7)

A burn-in device has at least one burn-in base and a circuit board. The circuit board has a front and a back. The burn-in base includes: a base assembly with a housing for accommodating a processor Space, a bottom of the base assembly is connected to the front of the circuit board; and a structural frame fixed on the back of the circuit board and opposite to the accommodating space of the base assembly, the structural frame holds A fan to remove the heat accumulated on the circuit board. The burn-in device according to claim 1, wherein the burn-in base further comprises: a cover assembly pivotally connected to the base assembly, and the cover assembly has a thermal contact portion, the thermal contact portion being It is configured to contact the processor in the accommodating space when the cover assembly covers the base assembly. The burning device according to claim 1, wherein the base assembly has an outer seat and an inner seat, the inner seat defines the accommodating space and the inner seat is accommodated in the outer seat, and the inner seat has A plurality of first notches, the outer seat has a plurality of second notches, the first notches and the second notches define a plurality of lateral heat dissipation paths of the processor. The burning device according to claim 1, wherein the base assembly has an outer seat and an inner seat, the inner seat defines the accommodating space and the inner seat is accommodated in the outer seat, and the inner seat has A first notch, the outer seat has a plurality of second notches, the first notch is adjacent to the second notches, and the second notches divide the lateral heat dissipation path of the first notch. The burning device according to claim 1, wherein the structural frame has an outer wall and an inner wall, the structural frame extends from the outer wall with a plurality of fixed arms connected to the back of the circuit board, and the inner wall of the structural frame defines a Hollow out to accommodate the fan. A method for using a burn-in device includes: providing a burn-in base on the front of a circuit board, the burn-in base includes a base assembly and a cover assembly, the base assembly accommodates a processor and the The processor is pressed by the cover assembly; a structural frame is provided on the back of the circuit board relative to the pressing position of the cover assembly, and the structural frame holds a fan that defines a vertical to the back of the circuit board Fluid path; providing a test signal to the burn-in base to test the processor; and providing a control signal to the fan to control the speed. The method according to claim 6, wherein the cover assembly further has a temperature sensing unit for generating a sensing signal, and the method further includes: generating the control signal based on the sensing signal.

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