TWI706910B - 電子功能構件與製造電子功能構件的方法 - Google Patents

電子功能構件與製造電子功能構件的方法 Download PDF

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TWI706910B
TWI706910B TW104101760A TW104101760A TWI706910B TW I706910 B TWI706910 B TW I706910B TW 104101760 A TW104101760 A TW 104101760A TW 104101760 A TW104101760 A TW 104101760A TW I706910 B TWI706910 B TW I706910B
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component
electronic
functional layer
functional
electronic component
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TW104101760A
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TW201534553A (zh
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安德亞斯 庫格勒
魯本 法爾
克里斯提娜 貝爾蕭
烏爾立希 沙夫
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德商羅伯特博斯奇股份有限公司
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    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract

一種電子功能構件及一種電子功能構件的製造方法。該電子功能構件包括藉由立體印刷程序嵌入該功能構件的電子構件。該立體印刷程序除了能包覆該電子構件外，亦能在成形及機械特性方面對該功能構件進行個別調整。此外還以適當方式將該電子構件的電接頭導引至該功能構件的表面。

Description

電子功能構件與製造電子功能構件的方法
本發明係有關一種電子功能構件及其製造方法。
已知有為防止受損或受到污染而嵌入塑膠的電子元件及電路組。此類構件一般以常用的噴塗法、射出成型法或模製法製成。
此外，最近亦已知有用來製造立體構件的立體(3D)印刷法。其中立體印刷機係以立體資料模型為基礎透過逐步添加或塗覆材料來產生物體。
德國專利申請DE 10 2011 078 757 A1揭露一種在立體印刷機上印刷立體元件的方法。為此需將用於待印刷構件的模型資料及品質屬性以及關於欲使用之立體印刷機所需滿足的要求的證書保存在可攜式儲存介質中。若儲存介質及立體印刷機的證書相符，便將模型資料傳輸給印刷機並由立體印刷機製作出期望的立體元件。
本發明第一方面提出一種電子功能構件，包括基本元件，該 基本元件包括電絕緣承載層；電子構件，該電子構件設於該基本元件上且包括電接頭；及功能層，該功能層在立體印刷程序中被套印於該基本元件上且包括連接元件，該連接元件設計用於在該電子構件的電接頭與該功能層的外表面間形成電連接。
本發明另一方面提出一種製造電子功能構件的方法，包括以下步驟：提供包含電絕緣承載層的基本元件；將包含電接頭的電子構件設置到該基本元件上；在該基本元件上立體印刷功能層以及在該套印功能層內設置用於在該電子構件的電接頭與該功能層的外表面間形成電連接的連接元件。
本發明的基本理念係藉由立體印刷程序將電子構件整合於功能構件。藉由將電子構件整合於以立體印刷法製成的元件並且用導電通路對該元件的內部及表面進行結構化，可實現MID構件(MID=Molded Interconnect Device，模塑互連器件)樣式的全新結構形式。藉由將電子元件與以立體印刷法製成的元件連接，可將機械功能及電氣功能集中實現在一個功能構件中。其中，立體印刷程序在需要形成複雜的立體結構時亦能實現特別靈活的製程。
立體印刷程序無需使用諸如射出成型模等昂貴工具，故而能以低成本製造出單個構件或者進行件數較少的小批量製造。
此外，立體印刷法還能為功能構件內部的導電通路實現複雜佈線。具體而言，藉此亦能實現傳統技術無法實現或極難實現的線路交叉及類似佈線。
此外還能為電子功能構件有效裝配關鍵構件，例如接頭間距 極小的積體電路或微電機械系統等等。如此便能以極佳的程序穩定性及更低的生產成本製造電子功能構件。
該功能構件的基本元件可包括電絕緣承載層。特定言之，亦可藉由立體印刷法已製成該基本元件。在此情況下，基本元件可透過該立體印刷程序而已明確具有相應的幾何形狀，該幾何形狀與該功能構件所應具有的結構形式相適配。藉此方式亦可使該功能構件的基本元件獲得一定功能。如此，該基本元件自身亦用作該功能構件的功能層。
根據實施例，該電子功能構件進一步包括接觸元件，該接觸元件設於該功能層的外表面上且與該電子構件的電接頭及該功能層的外表面間的電連接電性相連。藉由在電子功能構件的外表面設置該接觸元件，電子功能構件可與外部接頭實現電接觸。如此便可以特別簡單的方式實現電子功能構件的可靠接觸。
根據實施例，該基本元件包括與該電子構件的電接頭電性相連的導電結構。透過該導電結構，在電子功能構件內部便已能接觸電子構件的電接頭。藉此亦能接觸接頭間距極小的構件。該導電結構能提供足夠大的連接面來實現進一步接觸。具體來說，該導電結構能擴展該電構件較窄的接頭間距，從而與連接元件實現電接觸。
根據實施例，該功能層包括設於該電子構件與該功能層的外表面間的透明塑膠及/或導光體。該透明塑膠及/或導光體在電構件與功能層外表面間形成完整的光學連接。透過該透明塑膠及導光體可在電子構件與周圍環境間形成光學連接。藉此可由電子構件向周圍環境發送光信號及/或由周圍環境向電子構件及電子功能構件內部輸送光信號。該導光體及透明 塑膠分別可被相關光譜穿透。該相關光譜具體亦可包括紫外線與紅外線。
根據實施例，該功能層具有設於該電子構件與該功能層的外表面間的通道結構。該通道結構可為連通功能層外表面與電子構件的空腔。此通道結構中具體可通氣體及/或流體。透過該通道結構，電子構件得以接觸到來自於周圍環境的物質並在此期間偵測一或數個環境參數。
根據實施例，該電子構件包括感測器。透過該感測器可偵測一或數個環境參數並提供與偵測到的參數相對應的電信號。藉此例如可偵測環境溫度、氣體或液體壓力、氣體濃度、亮度或類似參數。
根據實施例，該電子構件包括微電機械系統(MEMS)。微電機械系統係將電子元件與機械元件集於一身的構件。本發明藉由立體印刷法及與之相適的電接觸而實現的構造，一方面能防止微電機械系統受到環境因素影響，同時亦能對功能構件進行適當的結構化以實現微電機械系統與周圍環境的機械相互作用。
根據實施例，該功能層內整合有導熱性及/或剛度高於該功能層的其他元件。該其他元件例如可為金屬薄膜或金屬板。藉由整合散熱體或類似元件形式的元件，能使電子構件得到特別有效的散熱。此外，該元件的增強剛度還能進一步穩定功能構件並防止其機械過載。
根據該製造電子功能構件的方法的實施例，該在該功能層內設置連接元件的步驟包括以下步驟：在該功能層的外表面與該電子構件的電接頭間設置孔口；以及用導電材料充填該設置成的孔口。藉此可在電子構件與功能層外表面間形成未在立體印刷程序中形成的電連接。
以下參照所附圖式說明本發明的其他優點及實施方式。
2:電子功能構件
10:基本元件
10a:頂面
11:基體
12:電絕緣薄膜
20:電子構件
21:電接頭/連接元件
22:導電結構
30:功能層
30a:外表面
31:連接元件/電連接
32:接觸元件
35:光學連接
36:通道結構
37:其他元件/穩定元件/穩定板
38:其他元件/冷卻元件
100:方法
110:步驟
120:步驟
130:步驟
140:步驟
圖1為根據實施例的電子功能構件示意圖；圖2為根據另一實施例的電子功能構件示意圖；圖3為根據又一實施例的電子功能構件示意圖；及圖4為根據實施例的電子功能構件的製造方法流程圖。
圖1為根據第一實施例的電子功能構件示意圖。其中該電子功能構件包括基本元件10、具有電接頭21的電子構件20及功能層30。功能層30內設用於在電子構件20的接頭21與功能層外表面30a間建立電連接的連接元件31。其中外表面30a不僅限於圖1所示的頂面，而是還包括側面及底面上視情況而自由可及的區域，只要功能層30亦延伸至此區域。
基本元件10為一電絕緣承載層。其中例如可藉由立體印刷法已製成基本元件10。藉此可使基本元件10精準符合預期要求，尤其與後續待整合的電子構件20精準匹配。舉例而言，如此便已可在基本元件10中設置凸起、凹坑或空腔。
在基本元件10後續用以設置電子構件20的頂面10a上進一步設有導電結構22。該等導電結構22例如可在立體印刷基本元件10期間便已被整合於基本元件10。為此可在用電絕緣材料印刷基本元件10的同時進一步印刷導電結構22。作為替代方案，亦可採用任意一種其他方法來在基本元件10上設置導電結構。例如可藉由沈積法、冷氣噴塗、噴射塗覆法、導電物質二維印刷或導電結構的替代性設置方法來製造該等導電結構。其 中，基本元件10上的導電結構22與電子構件10的接頭21相匹配，從而可在電子構件20的接頭21與導電結構22間實現電接觸。
而後將電子構件20設置到設有導電結構22的基本元件10上並視情況將電子構件20固定。在此過程中，電子構件20的電接頭21與導電結構22間亦形成電連接。該電接觸例如可透過導電膠合或其他電接觸方法而實現。
將電子構件20設置到基本元件10上並在電子構件20的接頭21與導電結構22間建立電連接後，在立體印刷程序中對此結構進行套印，從而在設有電子構件20的基本元件10上形成功能層30。透過該立體印刷程序形成該電子功能構件最終應具有的幾何形狀。藉由在印刷程序中對功能層30進行適當的結構化與成形處理，還可同時形成功能層30的機械功能。此機械功能例如可包括與該功能構件的期望用途相適的預定外部幾何形狀。視情況亦可形成可動或撓性機械元件。
在立體印刷功能層30期間，亦可在功能層30中形成由導電結構22的預定位置延伸至功能層30的外表面30a的孔口。可在接下來的後續製程中用導電材料如金屬或其他導電物質充填此等孔口。藉此方式在導電結構22與功能層30的外表面30a間形成連接元件31。由此可透過該連接元件31在外表面30a與電子構件20特別是電子構件20的電接頭21間建立電連接。
若在立體印刷期間未在導電結構22與功能層外表面30a間為功能層30形成孔口，作為替代方案則亦可於後續製程中在功能層30內設置此孔口。例如可藉由雷射鑽孔法或類似方法在功能層30內設置此孔口。 此情況下亦可在設置孔口後用導電物質充填之，以便能在導電結構22與功能層外表面30a間形成電連接。
根據另一替代方案，還可在立體印刷期間便已將其他導電通路整合於功能層30。該等其他導電通路同樣可在導電結構22與功能層30的外表面30a間實現電連接。此外亦可在功能層30內部設置導電通路。立體印刷程序的較高靈活度允許形成複雜的立體導電通路，其亦能在導電結構22的單個點之間建立連接。
在功能層30的外表面30a上進一步設有與連接元件31電性相連的接觸元件32。該等接觸元件32提供足夠大的電接觸面以形成該功能構件的電接頭。其中可藉由任意一種方法設置接觸元件32。例如可藉由雷射直接成型(LDS)及接下來的電鍍來設置接觸元件32。亦可採用噴射塗覆法、電漿塗覆法或類似方法。亦可在立體印刷期間便已設置接觸元件32。
電子構件20可為任意一種電子構件。電子構件20例如可為積體電路(IC)。針對接頭間距極小的構件，可透過導電結構22及/或連接元件31擴展此較窄的接頭間距，藉此可在功能層外表面30a上提供接頭間距足夠大的接觸元件32以接觸該電子功能構件。
此外，亦可採用例如微電機械系統(MEMS)作為電子構件20，微電機械系統除電子功能外還提供機械功能。基本元件10及功能層30能有效防止此等微電機械系統受到外部影響。與此同時，可在立體印刷功能層30期間以適當方式使功能層30與微電機械系統的機械功能相匹配。
圖2為另一實施例的示意圖。此圖所示的電子功能構件2的構造與圖1所示的構造大體一致。為清楚起見，此圖中未示出電連接31 及接觸元件32。
本實施例中的電子功能構件在功能層30中包括設於電構件20與功能層30的外表面30a間的光學連接35。此光學連接35例如可為導光體或透明塑膠。該導光體或透明塑膠可在立體印刷期間便已被設置在功能層30中。例如可在電子構件20上安裝導光體，隨後在立體印刷功能層30期間用印刷材料將該導光體嵌入功能層30。作為替代方案，亦可在電子構件20上直接印刷透明塑膠。其中，該導光體或透明塑膠較佳與需要在電子構件20與周圍環境之間交換的光的波長相適配。電子構件20例如可為發光構件如發光二極體或類似構件。作為替代方案，電子構件20亦可為從周圍環境接收光並加以評估的構件。例如亮度感測器或攝影機元件。該設於功能層外表面30a與構件20間的光學連接亦可構造為以適當方式將來自於周圍環境的光聚焦於電子構件20或使發射光發生散射的光學透鏡或透鏡狀結構。
作為補充或替代方案，功能層30亦可具有通道結構36。此通道結構36可為電子構件20與功能層外表面30a之間的一孔口。透過該通道結構36例如可向電子構件20輸送氣體或流體或者導引其從電子構件20旁邊流過。由此，電子構件20亦能接觸到來自於該電子功能構件之周圍環境的物質。舉例而言，藉此可利用該電子功能構件偵測氣體壓力，分析從旁流過的氣體或流體中是否存在一或數種預定物質，或者測定物質濃度或其他環境參數，例如溫度或類似參數。必要時亦可在印刷功能層30期間在功能層30內嵌入分析氣體或流體所需要的助劑，例如有機物質或類似物質。
此外亦可藉由電子構件20透過合適的微電機械系統使該氣 體或流體在通道結構36中發生運動以形成流動。
為此所需的通道結構36可在立體印刷功能層30期間便已形成。此外，通道結構36亦可完全或至少部分藉由合適的後續方法如雷射鑽孔或類似方法而形成。
作為補充或替代方案，功能層30還可具有任意其他元件37、38。例如可將剛度高於功能層30的穩定元件37整合於功能層30。此元件例如可為由金屬或硬質塑膠構成的板體。透過該整合於功能層30的穩定板37可提高功能層30及整個電子功能構件的穩定性。藉此可防止敏感的電構件20受損。
作為替代方案，該其他元件亦可為導熱性高於功能層30的冷卻元件38。其例如可為金屬薄膜、散熱體或類似元件。透過導熱性更高的冷卻元件38可對該電子功能構件特別是電子構件20進行有效散熱。
圖3示出電子功能構件20的另一替代實施方式。該電子功能構件與前述電子功能構件大體一致。本實施方式中的基本元件10由電絕緣薄膜12形成。與前述實施例相似，在該電絕緣薄膜12上同樣設有用以與電子構件20的連接元件21形成電連接的導電結構22。其中例如可藉由覆晶安裝技術將電子構件設於薄膜12上並與導電結構22連接。其中，薄膜12上用以連接電子構件20的連接元件21的接觸面上較佳塗佈有貴金屬，以便能形成有效電連接。其中亦可採用替代方法來將電子構件20設於電絕緣薄膜12上並與導電結構22實現接觸。
為了保護上述結構，可進一步在此結構上覆蓋圖中未示出的保護膜。而後可將以上述方式製備好的薄膜12連同電子構件20一起設置到 預先製備好的基體11上。較佳用合適的壓印工具將薄膜12壓印於基體11上。基體11例如可為在立體印刷程序中製成的基體11。基體11的製造方法可類似於前文聯繫圖1所說明之基本元件10的製造方法，其中在此情況下，基體11不必具有導電結構。在圖3所示的實施例中，導電結構22已設於薄膜12上。
將薄膜12連同電子構件20一起設於基體11上後，繼續以類似於前述實施例的方式構建功能層30及連接元件31。
除前述實施例中所描述的用以將電子構件20設於基本元件10或基體11上的平坦表面10a、11a外，亦可採用任意形狀的表面，例如弧形、彎曲或結構化表面。藉此能進一步最佳化成形與空間需求方面的靈活度。此外具體在為基本元件10或功能層30使用延性材料或可塑性變形的材料之情況下，還能實現該電子功能構件進一步的後續變形。
圖4為根據本發明實施例的電子功能構件之製造方法100的流程圖。
在步驟110中提供包含電絕緣承載層的基本元件10。而後在基本元件10上設置與電子構件20的接頭21相匹配的導電結構22。在接下來的步驟120中將包含電接頭21的電子構件20設置到基本元件10上。隨後在步驟130中以立體印刷法在基本元件10上套印功能層30。步驟140係在套印功能層30內設置用於在電子構件20的接頭21與功能層30的外表面30a間形成電連接的連接元件31。其中亦可間接透過基本元件10上的導電結構22來形成電子構件20的接頭21間的連接。
根據實施方式，可在步驟130中的立體印刷期間便已設置用 於在基本元件10上的導電結構22與功能層30的外表面30a間形成連接的孔口。此情況下可藉由用導電物質充填空腔來形成連接元件31。
若在立體印刷期間無法或僅能部分形成此等空腔，則亦可藉由合適的用以形成孔口的其他步驟來實現此等空腔。此點例如可透過雷射鑽孔程序或類似程序而實現。此情況下亦在形成孔口後用導電物質充填之。
最後可在另一步驟中在功能層外表面30a上安裝接觸元件32，該等接觸元件與連接元件31電性相連且提供足夠大的接觸面以形成該電子功能構件的電接頭。
綜上所述，本發明係有關一種電子功能構件及一種電子功能構件的製造方法。該電子功能構件包括藉由立體印刷程序嵌入該功能構件的電子構件。該立體印刷程序除了能包覆該電子構件外，亦能在成形及機械特性方面對該功能構件進行個別調整。此外還以適當方式將該電子構件的電接頭導引至該功能構件的表面。
10:基本元件
10a:頂面
20:電子構件
21:電接頭/連接元件
22:導電結構
30:功能層
30a:外表面
31:連接元件/電連接
32:接觸元件

Claims (9)

  1. 一種電子功能構件，包括：基本元件(10)，該基本元件包括電絕緣承載層；電子構件(20)，該電子構件設於該基本元件(10)上且包括電接頭(21)；及功能層(30)，該功能層在立體印刷程序中被套印於該基本元件(10)上且有一連接元件(31)已預先設入到該功能層中，該連接元件設計用於在該電子構件(20)的電接頭(21)與該功能層(30)的側面(30a)間形成電連接，且其中該電子構件(20)包括感測器。
  2. 如申請專利範圍第1項之電子功能構件，且其包括接觸元件(32)，該接觸元件設於該功能層(30)的側面(30a)上且與該電子構件(20)的電接頭(21)及該功能層(30)的側面(30a)間的電連接(31)電性相連。
  3. 如申請專利範圍第1或2項之電子功能構件，其中該基本元件(10)包括與該電子構件(20)的電接頭(21)電性相連的導電結構(22)。
  4. 如申請專利範圍第1或2項之電子功能構件，其中該功能層(30)包括設於該電子構件(20)與該功能層(30)的外表面(30a)間的透明塑膠及/或導光體。
  5. 如申請專利範圍第1或2項之電子功能構件，其中該功能層(30)具有設於該電子構件(20)與該功能層(30)的外表面(30a)間的通道結構(36)。
  6. 如申請專利範圍第1或2項之電子功能構件，且其包括其他元件(37, 38)，該其他元件整合於該功能層(30)且具有高於該功能層的導熱性及/或剛度。
  7. 如申請專利範圍第1或2項之電子功能構件，其中該電子構件(20)包括微電機械系統(MEMS)。
  8. 一種製造如前述申請專利範圍第1至8項任一項之電子功能構件的方法，包括以下步驟：提供(110)包含電絕緣承載層的基本元件(100)；將包含電接頭(21)的電子構件(20)設置(120)到該基本元件(10)上；在該電絕緣基本元件(10)上立體印刷(130)放式印刷上功能層(30)；以及在該套印功能層(30)內設置(140)用於在該電子構件(20)的電接頭(21)與該功能層(30)的一側面(30a)間形成電連接的連接元件(31)。
  9. 如申請專利範圍第9項之方法，其中設置(140)該運接元件(31)的步驟包括以下步驟：在該功能層(30)的外表面(30a)與該基本元件(10)間設置孔口；以及用導電材料充填該設置成的孔口。
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