TWI704859B - Smart fan speed adjustment method, computer device, and server - Google Patents

Abstract

The disclosure provides a smart fan speed adjustment method, a computer device, and a server. The computer device includes a plurality of electronic components. The method includes: obtaining, for each electronic component, first and second temperature variation parameters; sending the first and second temperature variation parameters of each electronic component to a server, and reporting a system temperature of the computer device; updating a speed adjustment model of the computer device based on a reference speed adjustment model of the server; obtaining a current usage rate of each electronic component and accordingly inputting to the speed adjustment model for the speed adjustment model to determine a fan speed of a system fan of the computer device.

Description

Smart fan speed adjustment method, computer device and server

The invention relates to a computer fan control method, a computer device and a server, and more particularly to a smart fan speed adjustment method, a computer device and a server.

At present, the fan speed design of computer devices (for example, personal computers, e-sports computers, etc.) is mostly determined by the manufacturer in the development stage based on fan blade shape, fan blade thickness, heat flow model and other factors to estimate the correspondence between system temperature and fan speed , And record this correspondence in the firmware of the system. When the personal computer is running, the system then finds out the corresponding fan speed based on the system temperature it reads and uses the table look-up method to control the fan speed accordingly.

It can be seen from the above that the above-mentioned conventional control methods are quite dependent on the experience and judgment of the designers in the development stage, or the parameters are given based on the simulation results of the system design. However, this mechanism often has a gap with the actual use environment of the user. For example, after the PC is shipped, as the fan and other components are worn out or other components are replaced or increased, the relationship between the fan speed and the system temperature may have changed, but the corresponding relationship given at the beginning has been fixed. Cannot be changed. That is, as time evolves, the corresponding relationship between the system temperature and the fan speed that was originally given by the manufacturer no longer applies.

Therefore, for those skilled in the art, how to design a better fan speed adjustment method is really an important issue.

In view of this, the present invention provides a method for adjusting the speed of a smart fan, a computer device and a server, which can be used to solve the above technical problems.

The present invention provides a method for adjusting the speed of a smart fan, suitable for a computer device including a plurality of electronic components, including: obtaining a first temperature change parameter for each electronic component, wherein the first temperature change parameter corresponds to the computer device A preset ratio between the preset system temperature change and the preset usage rate change of each electronic component; for each electronic component, a second temperature change parameter is obtained, wherein the second temperature change parameter is related to the Multiple specific ratios between the usage rate change in multiple usage time intervals and the system temperature change of the computer device; send the first temperature change parameter and the second temperature change parameter of each electronic component to a server, and report the computer device Of a system temperature; update a speed adjustment model of the computer device based on a reference speed adjustment model on a server, wherein the reference speed adjustment model is based on the first temperature change parameter of each electronic component and the second The temperature change parameter, a plurality of third temperature change parameters and system temperature training are obtained, and the third temperature change parameter is related to a plurality of reference temperature change parameters reported by a plurality of reference computer devices to the server; obtain a current value of each electronic component The utilization rate is input to the speed adjustment model, and the speed adjustment model determines a fan speed of a system fan of the computer device.

The invention provides a computer device, which includes a plurality of electronic components, an electronic component monitoring module and a fan speed adjustment module. The electronic component monitoring module is configured to: for each electronic component, obtain a first temperature change parameter, where the first temperature change parameter corresponds to a preset system temperature change of the computer device and a preset usage rate change of each electronic component For each electronic component, obtain a second temperature change parameter, where the second temperature change parameter is related to the usage rate change of each electronic component in multiple use time intervals and the system of the computer device Multiple specific ratios between temperature changes; sending the first temperature change parameter and the second temperature change parameter of each electronic component to a server, and reporting a system temperature of the computer device. The fan speed adjustment module is configured to: update a speed adjustment model of the computer device based on a reference speed adjustment model on a server, wherein the reference speed adjustment model is based on the first temperature change parameter of each electronic component and each electronic The second temperature change parameter, the third temperature change parameter and the system temperature training of the component are obtained, and the third temperature change parameter is related to the multiple reference temperature change parameters reported to the server by multiple reference computer devices; A current usage rate of the component is input to the speed adjustment model, and the speed adjustment model determines a fan speed of the computer device.

The present invention provides a server which manages a plurality of computer devices, and each computer device includes a plurality of electronic components. The server includes a temperature parameter collection module and a model training module. The temperature parameter collection module separately collects a system temperature, a first temperature change parameter and a second temperature change parameter of each electronic component, and a reference temperature change parameter from the aforementioned computer device, wherein the aforementioned computer device includes a first computer device and Multiple reference computer devices. The model training module is configured to: based on the first temperature change parameter of each electronic component in the first computer device, the second temperature change parameter of each electronic component, and the reference temperature change parameter training corresponding to each electronic component in each reference computer device A reference speed adjustment model of the first computer device; and updating a speed adjustment model of the first computer device based on the reference speed adjustment model.

Based on the above, the server of the present invention can obtain the first temperature change parameter, the second temperature change parameter of each electronic component reported by a computer device, and the third temperature change obtained based on the reference temperature change parameter reported by other computer devices. After the parameters, the reference fan speed adjustment model is correspondingly generated and updated to the computer device accordingly. In this way, the computer device can be adapted to adjust the fan speed with a better fan speed adjustment strategy, and reduce the loss of various components.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Please refer to FIG. 1, which is a schematic diagram of a smart fan speed adjustment system according to an embodiment of the present invention. As shown in FIG. 1, the system 100 includes computer devices 11,... 1E, and a server 20. In the embodiment of the present invention, the server 20 may include a temperature parameter collection module 20a and a model training module 20b. In addition, the computer devices 11 to 1E may have the same model, and each computer device 11 to 1E may include the same components. Taking the computer device 11 as an example, it may include a first electronic component 11a, a second electronic component 11b, an electronic component monitoring module 11c, and a fan speed adjustment module 11d. Taking the computer device 1E as an example again, it may include a first electronic component 1Ea, a second electronic component 1Eb, an electronic component monitoring module 1Ec, and a fan speed adjustment module 1Ed.

In different embodiments, the first electronic component and the second electronic component in each computer device 11~1E may be a processor (such as a central processing unit, an image processor, etc.), a storage device (such as a hard disk) or other The components that have a significant influence on the system temperature of each computer device 11-1E during operation, but may not be limited to this. It should be understood that, although the computer devices 11 to 1E in the present invention have the same model, the first electronic component and the second electronic component can still be classified into grades. For example, suppose that the first electronic component 11a of the computer device 11 and the first electronic component 1Ea of the computer device 1E are both central processing units, but the first electronic component 11a can be Intel ^TM i5, and the first electronic component 1Ea can be Higher-end Intel ^TM i7 (or lower-end Intel ^TM i3), but the invention may not be limited to this.

For ease of description, the following will assume that the first electronic component and the second electronic component in each computer device 11-1E are a processor and a storage device, respectively, but they are only used as examples, and are not intended to limit the possible implementation of the present invention. In addition, in order to facilitate the description of the concept of the present invention, the computer device 11 will be mainly used as an example for the description below, and those with ordinary knowledge in the art should be able to deduce the operating mechanism of the computer devices 12 to 1E accordingly.

In the embodiment of the present invention, the first electronic component 11a of the computer device 11 may have a first temperature change parameter (which is related to factory settings) and a second temperature change parameter (which is related to the use history of the first electronic component 11a) .

= △ST _C/ △U _C，其中△ST _C為電腦裝置11的預設系統溫度變化，△U _C為第一電子元件11a的預設使用率變化。 In an embodiment, the first temperature change parameter of the first electronic component 11a may correspond to a preset ratio between a preset system temperature change of the computer device 11 and a preset usage rate change of the first electronic component 11a. In this embodiment, the first temperature change parameter of the first electronic component 11a is, for example, the difference between the usage rate change (such as the load rate change of the processor) and the system temperature change obtained by the relevant developers when it leaves the factory. The proportional relationship between the two can be a certain value and can be characterized as:

= △ST _C / △U _C , where △ST _C is the preset system temperature change of the computer device 11, and △U _C is the preset usage rate change of the first electronic component 11a.

，其中

為第一電子元件11a在第t個使用時間區間內的使用率變化與電腦裝置11的系統溫度變化之間的特定比例，

為對應於

的權重，且

至

為總和為1的遞增數列。 In one embodiment, the second temperature change parameter of the first electronic component 11a is associated with a plurality of specific ratios between the usage rate change of the first electronic component 11a in a plurality of use time intervals and the system temperature change of the computer device 11 . For example, the above use time interval may include the first use time interval to the Tth use time interval, and the second temperature change parameter of the first electronic component 11a may be characterized as:

,among them

Is the specific ratio between the change in the usage rate of the first electronic component 11a in the t-th use time interval and the system temperature change of the computer device 11,

Corresponds to

Weight, and

to

It is an increasing sequence with a sum of 1.

（即，上述遞增數列的中位數）可相應地設置為0.2，而其餘的

、

、

及

可分別以0.2-2

、0.2-

、0.2+

、0.2+2

來設定，其中

為一步階尺寸，其可由設計者依需求而定為任意數值（例如0.01），但本發明可不限於此。 For example, suppose the above use time interval is up to 1 year in total and T is 5, which means there are 5 use time intervals (that is, the first use time interval to the fifth use time interval), and each use time The interval is, for example, 0.2 (that is, 1/5) years, and the use time interval ranked later is closer to the current system time of the computer device 11. In this situation,

(That is, the median of the above-mentioned increasing sequence) can be set to 0.2 accordingly, and the rest

,

,

and

Can be 0.2-2

, 0.2-

, 0.2+

, 0.2+2

To set, where

It is a one-step size, which can be determined by the designer to any value (such as 0.01) according to requirements, but the present invention may not be limited to this.

至

設定為總和為1的遞增數列的情況下，可讓較近的使用時間區間具有較高的權重，藉以讓

更佳地反映第一電子元件11a隨著使用歷程而出現的變化，但可不限於此。 In will

to

In the case of setting as an increasing sequence with a sum of 1, the relatively recent use time interval can have a higher weight, so that

It better reflects the changes of the first electronic component 11a with the use history, but it is not limited to this.

In one embodiment, the electronic component monitoring module 11c of the computer device 11 can send the first and second temperature change parameters of the first electronic component 11a to the server 20 for the temperature parameter collection module 20a collection. In addition, the temperature parameter collection module 20a can also obtain the reference temperature change parameter of the first electronic component of each computer device 12~1E, and accordingly generate a third temperature change parameter corresponding to the first electronic component 11a (which is compared with other computer The current operation of the first electronic component of devices 12~1E is related).

，其中

為第d個參考電腦裝置的第一電子元件的參考溫度變化參數，

為對應於

的權重，且

至

的總和為1。在本發明的實施例中，各參考電腦裝置中第一電子元件的參考溫度變化參數對應於各參考電腦裝置的系統溫度變化與各第一電子元件的使用率變化之間的一當下比例。例如，對於某參考電腦裝置而言，其第一電子元件的參考溫度變化例如是此參考電腦裝置的系統溫度變化與處理器的負載率變化之間的當下比例，但可不限於此。 Specifically, in an embodiment, it is assumed that the number of computer devices 12 to 1E is D. For ease of description, the computer devices 12 to 1E are referred to as the first reference computer device to the D-th reference computer device below. In this case, the third temperature change parameter of the first electronic component 11a can be characterized as

,among them

Is the reference temperature change parameter of the first electronic component of the dth reference computer device,

Corresponds to

Weight, and

to

The sum of is 1. In the embodiment of the present invention, the reference temperature change parameter of the first electronic component in each reference computer device corresponds to a current ratio between the system temperature change of each reference computer device and the usage rate change of each first electronic component. For example, for a reference computer device, the reference temperature change of the first electronic component is, for example, the current ratio between the system temperature change of the reference computer device and the load factor change of the processor, but it is not limited to this.

可依不同的原則來設定。舉例而言，若第d個參考電腦裝置的第一電子元件的已使用時間及/或等級越接近第一電子元件11a，則對應的

可設定為越高。以下以表1為例進行說明。 參考電腦裝置 第一電子元件等級 已使用時間 c _d CW _d 1 高於第一電子元件11a 相同於第一電子元件11a 0.30 0.75 2 相同於第一電子元件11a 相同於第一電子元件11a 0.50 0.55 3 低於第一電子元件11a 長於第一電子元件11a 0.20 0.50 表1 In different embodiments,

It can be set according to different principles. For example, if the used time and/or level of the first electronic component of the d-th reference computer device is closer to the first electronic component 11a, the corresponding

Can be set higher. The following takes Table 1 as an example for description. Reference computer device First electronic component level Used time c _d CW _d 1 Higher than the first electronic component 11a Same as the first electronic component 11a 0.30 0.75 2 Same as the first electronic component 11a Same as the first electronic component 11a 0.50 0.55 3 Lower than the first electronic component 11a Longer than the first electronic component 11a 0.20 0.50 Table 1

~

可分別設定為0.3、0.5及0.2，但本發明可不限於此。 As shown in Table 1, it is assumed that there are three (ie, D is 3) reference computer devices, and the first electronic component of each reference computer device has a level higher than, the same as, and lower than the first electronic component 11a. In addition, the used time of the first electronic component of each reference computer device may be the same as, the same as, and longer than the first electronic component 11a, for example. In this situation,

~

It can be set to 0.3, 0.5 and 0.2 respectively, but the present invention is not limited to this.

，其中

及

分別為電腦裝置11的第一電子元件11a的第一溫度變化參數及第二溫度變化參數，而

、

及

為對應於

、

及

的多個特定權重。 Then, the model training module 20b of the server can generate the first weight (hereinafter referred to as CW) corresponding to the first electronic component 11a according to the first, second, and third temperature change parameters of the first electronic component 11a. In an embodiment, the first weight can be characterized as:

,among them

and

Are the first temperature change parameter and the second temperature change parameter of the first electronic component 11a of the computer device 11, and

,

and

Corresponds to

,

and

Of multiple specific weights.

Similarly, the second electronic component 11b of the computer device 11 may have a first temperature change parameter (which is related to factory settings) and a second temperature change parameter (which is related to the use history of the second electronic component 11b).

= △ST _D/ △U _D，其中△ST _D為電腦裝置11的預設系統溫度變化，△U _D為第二電子元件11b的預設使用率變化。 In an embodiment, the first temperature change parameter of the second electronic component 11b may correspond to a preset ratio between the preset system temperature change of the computer device 11 and the preset usage rate change of the second electronic component 11b. In this embodiment, the first temperature change parameter of the second electronic component 11b is, for example, the usage rate change (such as the change in the access rate of the storage device) and the system temperature change obtained by the relevant developers when it leaves the factory. The proportional relationship between can be a certain value and can be characterized as:

= △ST _D / △U _D , where △ST _D is the preset system temperature change of the computer device 11, and △U _D is the preset usage rate change of the second electronic component 11b.

，其中

為第二電子元件11b在第t個使用時間區間內的使用率變化與電腦裝置11的系統溫度變化之間的特定比例，

為對應於

的權重，且

至

為總和為1的遞增數列。

至

的相關細節可參照以上關於

至

的說明，於此不另贅述。 In an embodiment, the second temperature change parameter of the second electronic component 11b is associated with a plurality of specific ratios between the usage rate change of the second electronic component 11b in a plurality of use time intervals and the system temperature change of the computer device 11 . For example, the above use time interval may include the first use time interval to the Tth use time interval, and the second temperature change parameter of the second electronic component 11b may be characterized as:

,among them

Is the specific ratio between the change in the usage rate of the second electronic component 11b in the t-th use time interval and the system temperature change of the computer device 11,

Corresponds to

Weight, and

to

It is an increasing sequence with a sum of 1.

to

For related details, please refer to the above about

to

The description of is not repeated here.

至

設定為總和為1的遞增數列的情況下，可讓較近的使用時間區間具有較高的權重，藉以讓

更佳地反映第二電子元件11b隨著使用歷程而出現的變化，但可不限於此。 In will

to

In the case of setting as an increasing sequence with a sum of 1, the relatively recent use time interval can have a higher weight, so that

It better reflects the changes of the second electronic component 11b with the use history, but it is not limited to this.

In one embodiment, the electronic component monitoring module 11c of the computer device 11 may obtain the first and second temperature change parameters of the second electronic component 11b, and then send them to the server 20 for the temperature parameter collection module 20a collection. In addition, the temperature parameter collection module 20a can also obtain the reference temperature change parameter of the second electronic component of each computer device 12~1E, and accordingly generate a third temperature change parameter corresponding to the second electronic component 11b (which is compared with other computer The current operation status of the second electronic components of the devices 12~1E is related).

，其中

為第d個參考電腦裝置的第二電子元件的參考溫度變化參數，

為對應於

的權重，且

至

的總和為1。在本發明的實施例中，各參考電腦裝置中第二電子元件的參考溫度變化參數對應於各參考電腦裝置的系統溫度變化與各第二電子元件的使用率變化之間的一當下比例。例如，對於某參考電腦裝置而言，其第二電子元件的參考溫度變化例如是此參考電腦裝置的系統溫度變化與儲存裝置的存取率變化之間的當下比例，但可不限於此。 Specifically, in an embodiment, it is assumed that the number of computer devices 12 to 1E is D. For ease of description, the computer devices 12 to 1E are referred to as the first reference computer device to the D-th reference computer device below. In this case, the third temperature change parameter of the second electronic component 11b can be characterized as

,among them

Is the reference temperature change parameter of the second electronic component of the dth reference computer device,

Corresponds to

Weight, and

to

The sum of is 1. In the embodiment of the present invention, the reference temperature change parameter of the second electronic component in each reference computer device corresponds to a current ratio between the system temperature change of each reference computer device and the usage rate change of each second electronic component. For example, for a reference computer device, the reference temperature change of the second electronic component is, for example, the current ratio between the system temperature change of the reference computer device and the access rate change of the storage device, but it is not limited to this.

可依不同的原則來設定。相關細節可參照先前實施例中的說明，於此不另贅述。 In different embodiments,

It can be set according to different principles. For related details, please refer to the description in the previous embodiment, which will not be repeated here.

，其中

及

分別為電腦裝置11的第二電子元件11b的第一溫度變化參數及第二溫度變化參數，而

、

及

為對應於

、

及

的多個特定權重。 After that, the model training module 20b of the server 20 can generate a second weight (hereinafter referred to as DW) corresponding to the second electronic component 11b according to the first, second, and third temperature change parameters of the second electronic component 11b. In an embodiment, the second weight can be characterized as:

,among them

and

Are the first temperature change parameter and the second temperature change parameter of the second electronic component 11b of the computer device 11, and

,

and

Corresponds to

,

and

Of multiple specific weights.

In one embodiment, the model training module 20b can be used to train a reference fan speed adjustment model (for example, a reinforcement learning model) as appropriate, and it can be used to update the fan speed model on the computer device 11. In this way, the fan speed adjustment module 11d can use the fan speed model to determine the speed of the system fan of the computer device 11.

Specifically, in an embodiment, the electronic component monitoring module 11c can report the system temperature of the computer device 11 to the server 20. After that, the model training module 20b can determine whether to retrain the reference fan speed adjustment model according to whether the system temperature of the computer device 11 rises. For example, in one embodiment, if the system temperature of the computer device 11 rises, the model training module 20b may retrain the reference speed adjustment model by a punishment signal to update the first weight and the second weight. Weight, wherein the trained reference speed adjustment model corresponds to a specific fan speed, and the specific fan speed is higher than the current fan speed of the computer device 11. On the other hand, if the system temperature of the computer device 11 does not rise, the model training module 20b can maintain the reference rotation speed adjustment model through a reward signal.

、

及

）。 In one embodiment, the model training module 20b may also retrain a specific weight model (for example, another reinforcement learning model) in response to the above-mentioned penalty signal to update the above-mentioned specific weight (ie

,

and

).

Then, the model training module 20b can update the rotation speed adjustment model of the computer device 11 based on the (retrained) reference rotation speed adjustment model. In one embodiment, the model training module 20b can update the updated first weight and second weight to the rotational speed adjustment model of the computer device 11. Correspondingly, the fan speed adjustment module 11d can update the speed adjustment model of the computer device 11 based on the (retrained) reference speed adjustment model. In an embodiment, the model training module 20b may request the fan speed adjustment module 11d to perform the above-mentioned update when the computer device 11 is connected to the external network, but it is not limited to this.

、

及

），但可不限於此。 In an embodiment, the model training module 20b may also maintain the specific weight model in response to the above reward signal to maintain the above specific weight (ie

,

and

), but not limited to this.

After the speed adjustment model of the computer device 11 is updated, the fan speed adjustment module 11d can obtain the respective current usage rates of the first electronic component 11a and the second electronic component 11b (such as the load factor of the processor and/or the memory of the storage device). Fetch rate, etc.) and input to the above-mentioned speed adjustment model to determine the fan speed of the system fan of the computer device 11 based on the above-mentioned speed adjustment model. In one embodiment, the fan speed is, for example, a specific fan speed higher than the original fan speed, so as to increase the heat dissipation effect of the computer device 11.

In some embodiments, the present invention also provides a mechanism that can be used to further determine the fan speed of the system fan when the computer device 11 is turned on next time. Specifically, the model training module 20b can determine whether the above-mentioned penalty signal appears within a preset time interval (for example, 24 hours). If not, it means that the specific fan speed is sufficient to prevent the system temperature of the computer device 11 from rising. Therefore, the model training module 20b can send a first rotation speed control signal corresponding to the specific fan rotation speed to the computer device 11 to control the computer device 11 to set the system fan of the computer device 11 according to the specific fan rotation speed when it is turned on next time.

On the other hand, if the above-mentioned penalty signal occurs within the preset time interval, the model training module 20b can send a second speed control signal corresponding to a previous fan speed to the computer device 11 to control the computer device 11 when it is turned on next The system fan of the computer device 11 is set according to the aforementioned previous fan speed, wherein the aforementioned previous fan speed is the preset fan speed when the computer device 11 is turned on.

Please refer to FIG. 2, which is a method for adjusting the speed of a smart fan according to an embodiment of the present invention. The method of this embodiment can be executed by the computer device 11 of FIG. 1. The steps in FIG. 2 will be described below with the content of FIG. 1.

及

）。在步驟S220中，電子元件監控模組11c可取得第一電子元件11a及第二電子元件11b個別的第二溫度變化參數（即，

及

）。在步驟S230中，電子元件監控模組11c可發送第一電子元件11a及第二電子元件11b個別的第一溫度變化參數及第二溫度變化參數至伺服器20，並回報電腦裝置11的系統溫度。在步驟S240中，風扇轉速調整模組11d可基於伺服器20上的參考轉速調整模型更新電腦裝置11的轉速調整模型。在步驟S250中，風扇轉速調整模組11d可取得第一電子元件11a及第二電子元件11b個別的當下使用率並輸入至轉速調整模型，以由轉速調整模型據以決定電腦裝置11的系統風扇的風扇轉速。步驟S210~S250的細節可參照先前實施例中的說明，於此不另贅述。 First, in step S210, the electronic component monitoring module 11c can obtain the first temperature change parameters of the first electronic component 11a and the second electronic component 11b (ie,

and

). In step S220, the electronic component monitoring module 11c can obtain the respective second temperature change parameters of the first electronic component 11a and the second electronic component 11b (ie,

and

). In step S230, the electronic component monitoring module 11c can send the first temperature change parameter and the second temperature change parameter of the first electronic component 11a and the second electronic component 11b to the server 20, and report the system temperature of the computer device 11 . In step S240, the fan rotation speed adjustment module 11d can update the rotation speed adjustment model of the computer device 11 based on the reference rotation speed adjustment model on the server 20. In step S250, the fan rotation speed adjustment module 11d can obtain the respective current usage rates of the first electronic component 11a and the second electronic component 11b and input them into the rotation speed adjustment model to determine the system fan of the computer device 11 based on the rotation speed adjustment model. The fan speed. For details of steps S210 to S250, reference may be made to the description in the previous embodiment, which will not be repeated here.

In summary, the server of the present invention can obtain the first temperature change parameter (which is related to the factory setting) and the second temperature change parameter (which is related to the use history of each electronic component) reported by a computer device. ), and the third temperature change parameter obtained based on the reference temperature change parameter reported by the other computer device (which is related to the current operation of the electronic components of the other computer device), and then train the server according to the system temperature change of the computer device The reference fan speed adjustment model on the. After that, the server can update the trained reference fan speed adjustment model to the above-mentioned computer device, so that the computer device can adaptively adopt a more suitable fan speed adjustment strategy, thereby reducing the loss of various components in the computer device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

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:第一溫度變化參數

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:第二溫度變化參數

、

:參考溫度變化參數 S210~S250:步驟 100: System 11~1E: Computer device 11a, 1Ea: First electronic component 11b, 1Eb: Second electronic component 11c, 1Ec: Electronic component monitoring module 11d, 1Ed: Fan speed adjustment module 20: Server 20a: Temperature Parameter collection module 20b: model training module

,

: The first temperature change parameter

,

: The second temperature change parameter

,

: Reference temperature change parameters S210~S250: steps

FIG. 1 is a schematic diagram of a smart fan speed adjusting system according to an embodiment of the present invention. FIG. 2 shows a method for adjusting the speed of a smart fan according to an embodiment of the present invention.

100: System

11~1E: Computer device

11a, 1Ea: the first electronic component

11b, 1Eb: second electronic component

11c, 1Ec: electronic component monitoring module

11d, 1Ed: Fan speed adjustment module

20: server

20a: Temperature parameter collection module

20b: Model training module

CW _f , DW _f : the first temperature change parameter

CW _h , DW _h : the second temperature change parameter

CW ₁ ~ CW _D , DW ₁ ~ DW _D : Reference temperature change parameters

Claims (11)

A method for adjusting the speed of a smart fan is suitable for a computer device including a plurality of electronic components, including: obtaining a first temperature change parameter for each of the electronic components, wherein the first temperature change parameter corresponds to the computer device A preset ratio between the preset system temperature change and the preset usage rate change of each electronic component; for each electronic component, a second temperature change parameter is obtained, wherein the second temperature change parameter is associated with each A plurality of specific ratios between the preset usage rate change of the electronic component in multiple use time intervals and the preset system temperature change of the computer device; sending the first temperature change parameter and the second temperature change parameter of each electronic component The temperature change parameter is sent to a server, and a system temperature of the computer device is reported; a rotation speed adjustment model of the computer device is updated based on a reference rotation speed adjustment model on the server, wherein the reference rotation speed adjustment model is based on the server The first temperature change parameter of each of the electronic components, the second temperature change parameter of each of the electronic components, a plurality of third temperature change parameters and the system temperature are trained, and the plurality of third temperature change parameters are related to Multiple reference computer devices report multiple reference temperature change parameters to the server; obtain a current usage rate of each electronic component and input it into the rotational speed adjustment model, so that the rotational speed adjustment model determines a value of the computer device A fan speed of the system fan. For the method described in claim 1, wherein the electronic components include a processor, the first temperature change parameter of the processor is a certain value, and the first temperature change parameter of the processor is characterized as: CW _f =△ST _C /△U _C , where △ST _C is the preset system temperature change of the computer device, and △U _C is the preset usage rate change of the processor. For the method described in item 2 of the scope of patent application, the use time intervals include the first use time interval to the Tth use time interval, and the second temperature change parameter of the processor is characterized as:

, Where CW _t is the specific ratio between the usage rate change of the processor in the t-th usage time interval and the system temperature change of the computer device, cb _t is the weight corresponding to CW _t , and cb ₁ to cb _T is an increasing sequence with a sum of 1. For the method described in claim 1, wherein the electronic components include a storage device, the first temperature change parameter of the storage device is a certain value, and the first temperature change parameter of the storage device is characterized as: DW _f =△ST _D /△U _D , where △ST _D is the preset system temperature change of the computer device, and △U _D is the preset usage rate change of the storage device. For the method described in item 4 of the scope of patent application, the use time intervals include the first use time interval to the Tth use time interval, and the second temperature change parameter of the storage device is characterized as:

, Where DW _t is the specific ratio between the change in the usage rate of the storage device in the t-th use time interval and the system temperature change of the computer device, b _t is the weight corresponding to DW _t , and b ₁ to b _T is an increasing sequence with a sum of 1. For example, the method described in claim 1 further includes: responding to receiving a first speed control signal corresponding to a specific fan speed from the server, and when the computer device is turned on next time, according to the specific fan speed Set a system fan of the computer device; in response to receiving a second speed control signal corresponding to a previous fan speed from the server, when the computer device is turned on next time, the computer device is set according to the previous fan speed The system fan, wherein the previous fan speed is a preset fan speed when the computer device is turned on the next time. A computer device includes: a plurality of electronic components; an electronic component monitoring module configured to obtain a first temperature change parameter for each electronic component, wherein the first temperature change parameter corresponds to the computer A preset ratio between the preset system temperature change of the device and the preset usage rate change of each electronic component; For each of the electronic components, a second temperature change parameter is obtained, wherein the second temperature change parameter is related to the change in the preset usage rate of each of the electronic components in a plurality of use time intervals and the preset usage rate of the computer device. Set multiple specific ratios between system temperature changes; send the first temperature change parameter and the second temperature change parameter of each electronic component to a server, and report a system temperature of the computer device; a fan speed adjustment The module is configured to update a rotation speed adjustment model of the computer device based on a reference rotation speed adjustment model on the server, wherein the reference rotation speed adjustment model is based on the first temperature change of each electronic component by the server Parameters, the second temperature change parameters of each of the electronic components, a plurality of third temperature change parameters, and the system temperature training, and the plurality of third temperature change parameters are associated with a plurality of reference computer devices and reported to the server A plurality of reference temperature change parameters of the computer device; and obtain a current usage rate of each of the electronic components and input it into the speed adjustment model to determine a fan speed of a system fan of the computer device based on the speed adjustment model. A server manages multiple computer devices, each computer device includes multiple electronic components, and the server includes: a temperature parameter collection module that collects a system temperature and each electronic device from the computer devices individually A first temperature change parameter, a second temperature change parameter, and a reference temperature change parameter of the element, wherein the computer devices include a first computer device and a plurality of reference computer devices, wherein the first temperature change parameter corresponds to the Computer outfit A preset ratio between the preset system temperature change and the preset usage rate change of each electronic component, and the second temperature change parameter is related to the preset usage of each electronic component in a plurality of use time intervals A plurality of specific ratios between the rate change and the preset system temperature change of the computer device; a model training module configured to: based on the first temperature change parameter of each of the electronic components in the first computer device The second temperature change parameter of each of the electronic components, and the reference temperature change parameter of each of the electronic components in each of the reference computer devices are trained to correspond to a reference speed adjustment model of the first computer device; and based on the reference speed The adjustment model updates a speed adjustment model of the first computer device. For the server described in item 8 of the scope of patent application, the electronic components of each computer device include a first electronic component and a second electronic component, and the model training module is configured to: obtain the corresponding A first weight of the first electronic component of the first computer device; obtaining a second weight of the second electronic component corresponding to the first computer device; responding to determining that the system temperature of the first computer device rises, The reference speed adjustment model is retrained by a penalty signal to update the first weight and the second weight, wherein the reference speed adjustment model after training corresponds to a specific wind Fan speed, and the specific fan speed is higher than a current fan speed of the first computer device; in response to determining that the system temperature of the first computer device has not risen, the reference speed adjustment model is maintained by a reward signal. For the server described in item 9 of the scope of patent application, the reference computer devices include the first reference computer device to the D-th reference computer device, and the first weight is represented by: CW=a _f ×CW _f + a _h ×CW _h +a _n ×CW _n , where CW _f and CW _h are the first temperature change parameter and the second temperature change parameter of the first electronic component of the first computer device, and

, Where CW _d is the reference temperature change parameter of the first electronic component of the d-th reference computer device, c _d is the weight corresponding to CW _d , the sum of c ₁ to c _D is 1, a _f , a _h and a _n is a plurality of specific weights corresponding to CW _f , CW _h and CW _n . For the server described in item 9 of the scope of patent application, the reference computer devices include the first reference computer device to the D-th reference computer device, and the second weight is represented by: DW=a _f ×DW _f + a _h ×DW _h +a _n ×DW _n , where DW _f and DW _h are the first temperature change parameter and the second temperature change parameter of the second electronic component of the first computer device, and

, Where DW _d is the reference temperature change parameter of the second electronic component of the d-th reference computer device, c _d is the weight corresponding to DW _d , the sum of c ₁ to c _D is 1, a _f , a _h and a _n is a plurality of specific weights corresponding to DW _f , DW _h and DW _n .

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