TWI702892B - Electronic device - Google Patents

Abstract

An electronic device comprises a housing, and a fan connection member. The housing comprises a bottom plate having a motherboard mounting area. The fan connection member is disposed on the bottom plate and an orthogonal projection of the fan connection member on the bottom plate partially overlaps with the motherboard mounting area. The fan connection member includes a base and a fan seat. The fan seat is pivoted on the base. The fan connection member has a working state and a maintenance state. When the fan connection member is in the working state, the orthogonal projection of the fan connection member has a first overlap area on the motherboard mounting area. When the fan connecting member is in a maintenance state, the orthogonal projection of the fan connection member has a second overlap area on the motherboard mounting area. The first overlap area is larger than the second overlap area.

Description

Electronic device

The invention relates to an electronic device, particularly an electronic device with a fan connecting member.

With the development of the Internet, specific project models will be designed for specific professional needs, and different models will need to develop exclusive motherboards. But the development cost of the motherboard is very high and very complicated. Therefore, if a motherboard that can be shared can be designed, system development costs will be reduced.

In order to be able to use the same motherboard on different chassis, various institutional restrictions must be resolved. For example, when the size of the case is limited (such as 27 inches), the space above the fan connector of the motherboard is not enough to accommodate the fan module, and other parts of the case can be used to install the fan module The position and the fan connector are misaligned and have a certain distance, so the fan module cannot be directly connected to the fan connector, resulting in the inability to share the motherboard.

The present invention is to provide an electronic device to solve the problem that the fan module cannot be directly connected to the fan connector due to the limitation of the size of the casing, resulting in the inability to share the motherboard.

The electronic device disclosed in an embodiment of the present invention includes a casing and a fan connecting member. The casing includes a bottom plate, and the bottom plate has a motherboard mounting area. The fan connecting member is arranged on the bottom plate and the fan connecting member is in an orthogonal projection of the bottom plate and the motherboard mounting area Partially overlapped. The fan connecting member includes a base and a fan seat. The fan base is pivoted on the base. The fan connecting member has a working state and a maintenance state. When the fan connecting member is in the working state, the orthogonal projection of the fan connecting member on the bottom plate and the main board installation area has a first overlapping area. When the fan connecting member is in the maintenance state, the orthogonal projection of the fan connecting member on the bottom plate and the motherboard installation area has a second overlapping area. The first overlap area is larger than the second overlap area.

The electronic device disclosed in an embodiment of the present invention includes a casing, a fan connecting member, a motherboard, a memory, a central processing unit, and a fan module. The casing includes a bottom plate. The bottom plate has a motherboard installation area. The fan connecting member is arranged on the bottom plate, and an orthogonal projection of the fan connecting member on the bottom plate partially overlaps the mounting area of the motherboard. The fan connecting member includes a base and a fan seat. The fan base is pivoted on the base. The motherboard is arranged in the motherboard installation area. The fan base is electrically connected to the motherboard, and part of the motherboard is located between the base and the bottom plate. The fan module is arranged on the fan base. The fan connecting member has a working state and a maintenance state. When the fan connecting member is in the working state, the orthogonal projection of the fan connecting member on the bottom plate and the main board installation area has a first overlapping area. When the fan connecting member is in the maintenance state, the orthogonal projection of the fan connecting member on the bottom plate and the motherboard installation area has a second overlapping area. The first overlap area is greater than the second overlap area.

According to the electronic device disclosed in the above-mentioned embodiments of the present invention, the electronic device includes a fan connecting member having a base and a fan base. The fan base is pivoted on the base and can pivot relative to the base, thereby enabling the fan connecting member to have working conditions and maintenance status. In this way, by arranging the fan module on the fan base that can pivot relative to the base, the problem that the fan module cannot be directly installed on the motherboard due to the size limitation of the chassis is solved, resulting in the inability to share the motherboard.

The above description of the content of the present invention and the description of the following embodiments are used To demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

100: chassis

110: bottom plate

111: Motherboard installation area

120: The first side panel

121: The first side panel main body

122: first side guide

123: First side fastening structure

130: second side panel

131: Second side panel main body

132: Second side guide

133: second side fastening structure

140: top plate

200: Fan connection member

210: Base

211: base body

212: open

213: Fixed part

220: fan seat

221: Fan base body

222: first side

223: The first switch control

224: second side

225: The second switch control

226: first guide hole

227: second guide hole

230: connecting part

240: stress parts

241: Stress Body

242: Force End

243: Support end

300: The first connection module

310: The main body of the first connection module

320: first guide

330: The first card solid structure

331: first hole

332: first guiding convex

400: second connection module

410: The second connection module body

420: second guide

430: The second clamping structure

431: second hole

432: Second guiding convex

1230: side hole

1230’: side hole

1231: Side guide protrusion

1231’: Side guide protrusion

2260: The first limit segment

2261: First release section

2270: second limit segment

2271: Second release section

S1, S2: electronic device

S: housing space

500: Motherboard

600: Fan module

700: memory

800: CPU cooling module

900: central processing unit

FIG. 1 is a schematic diagram of an electronic device and its opened top plate according to the first embodiment of the present invention.

2 is an exploded view of the electronic device according to the first embodiment of the present invention with the top plate removed.

FIG. 3 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG.

4A is a cross-sectional view of the electronic device of the first embodiment of FIG. 1. FIG.

4B is a cross-sectional view of the electronic device of the first embodiment of FIG. 1. FIG.

FIG. 5 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG.

FIG. 6 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG.

FIG. 7A is a cross-sectional view of the electronic device of the first embodiment of FIG. 1. FIG.

FIG. 7B is a cross-sectional view of the electronic device of the first embodiment of FIG. 1. FIG.

FIG. 8 is a schematic diagram of the electronic device according to the second embodiment of the present invention with the top plate removed.

9 is a cross-sectional view of the electronic device according to the second embodiment of the invention.

10 is a cross-sectional view of the electronic device according to the second embodiment of the invention.

The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with the relevant art can easily understand the related purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic diagram of an electronic device and its opened top plate according to the first embodiment of the present invention. 2 is an exploded view of the electronic device according to the first embodiment of the present invention with the top plate removed. The wiring is not shown in the diagrams of this case, so as to concisely and clearly present the characteristics of the present invention.

As shown in FIGS. 1 and 2, the electronic device S1 includes a casing 100, a fan connection member 200, a first connection module 300 and a second connection module 400, a motherboard 500, a fan module 600, and Memory 700, a CPU heat dissipation module 800, and a CPU 900. The fan connecting member 200, the first connecting module 300 and the second connecting module 400, the motherboard 500, and the fan module 600 are located in the casing 100. The memory 700 and the central processing unit 900 are provided on the motherboard 500. The CPU heat dissipation module 800 is arranged on the CPU 900.

The casing 100 includes a bottom plate 110, a first side plate 120, a second side plate 130 and a top plate 140. The bottom plate 110 and the top plate 140 are arranged opposite to each other. The first side plate 120 and the second side plate 130 stand between the bottom plate 110 and the top plate 140 and connect the bottom plate 110 and the top plate 140. The bottom plate 110 has a double-layer structure composed of an inner mounting layer 110A and a protective outer layer 110B. The installation inner layer 110A is located between the protective outer layer 110B and the top plate 140. The mounting inner layer 110A of the bottom plate 110 has a motherboard mounting area 111, and the motherboard mounting area 111 faces the top plate 140.

In this embodiment, the fan connecting member 200 is disposed on the installation inner layer 110A of the bottom plate 110, and the fan connecting member 200 is interposed between the first side plate 120 and the second side plate 130. In other embodiments, the fan connecting member 200 is detachably disposed on the main board 500. The fan connecting member 200 includes a base 210, a fan base 220, and a connecting portion 230. And a stress piece 240. The base 210 is disposed on the mounting inner layer 110A of the bottom plate 110 and spans a portion of the motherboard mounting area 111. The orthogonal projection of the base 210 on the bottom plate 110 and the motherboard mounting area 111 partially overlap. The connecting portion 230 serves as a pivot to pivotally connect the base 210 and the fan base 220 so that the fan base 220 can pivot relative to the base 210 so that the fan connecting member 200 has a working state and a maintenance state. The stress member 240 is disposed on the connecting portion 230. There is an accommodating space S below the fan base 220 and the installation inner layer 110A of the bottom plate 110, and the base 210 is located outside the accommodating space S.

In detail, the base 210 includes a base body 211 and two fixing parts 213. The base body 211 spans part of the motherboard installation area 111. The two fixing parts 213 are respectively located at opposite ends of the base body 211. The fan connecting member 200 is detachably disposed on the installation inner layer 110A of the bottom plate 110 by the two fixing portions 213. The base body 211 has a plurality of openings 212. The openings 212 are used to correspond to the fan power connector 510 of the motherboard 500 and other connectors. The number of openings 212 can be adjusted according to the number of connectors on the motherboard.

The fan base 220 includes a fan base body 221, a first side portion 222, a first switch control member 223, a second side portion 224, and a second switch control member 225. The first side portion 222 stands at one end of the fan base body 221. The first switch control member 223 is movably disposed on the first side portion 222 and has a closed state and an open state. The closed state and the open state of the first switch control member 223 will be described in detail later. The first switch control member 223 is, for example, a plunger. The fan base 220 has a first guide hole 226. The first guide hole 226 penetrates the first side portion 222. The first guide hole 226 includes a first limiting section 2260 and a first releasing section 2261 that are connected, and the first releasing section 2261 is closer to the fan base main body 221 than the first limiting section 2260.

The second side portion 224 stands on the opposite end of the fan base body 221. That is, the first side portion 222 and the second side portion 224 are respectively standing on two opposite ends of the fan base body 221. The second switch control member 225 is movably disposed on the second side portion 224. The second switch control member 225 is, for example, a plunger. The fan base 220 also has a second guide hole 227. The second guide hole 227 penetrates the second side portion 224. The second guide hole 227 includes a second limiting section 2270 and a second releasing section 2271 that are connected, and the second releasing section 2271 is closer to the fan base main body 221 than the second limiting section 2270. The structures of the second switch control member 225 and the second guide hole 227 and the structures of the first switch control member 223 and the first guide hole 226 are mirror images of each other.

The connecting portion 230 connects the base body 211 and the fan base body 221. The number of connection parts 230 is two. There is a channel between two adjacent connecting parts 230 for the passage of lines (such as lines for high-speed transmission) (not shown), and the lines can pass through the aforementioned opening 212 and be inserted into the fan power connector of the motherboard 500 510. In other embodiments, the number of the connecting parts 230 can be set as required. In this embodiment, the structure of the connecting portion 230 is a pivot pin. In another embodiment, the connecting portion 230 can be any structure that can rotate the fan base 220 relative to the base 210.

The stress member 240 includes a stress main body 241, a force application end 242 and a support end 243. The stress main body 241 is disposed at the connecting portion 230. The force application end 242 is connected to a force application surface F1 of the fan base 220. The supporting end 243 is connected to a supporting surface F2 of the base 210. When the fan connecting member 200 is working, the force application surface F1 is the surface of the fan base 220 facing away from the base plate 110 and directly connected to the base 210, and the supporting surface F2 is the surface of the base 210 facing away from the base plate 110 and directly connected to the fan base 220. In this embodiment, the stress member 240 is a torsion spring. In other embodiments, the stress member 240 may be any material that can provide prestress to enable the fan base 220 to rotate relative to the base 210. element. In another embodiment, the stress member 240 may not be provided on the connecting portion 230.

In this embodiment, the first connection module 300 is detachably disposed on the first side plate 120, and the first connection module 300 is located between the fan connection member 200 and the first side plate 120. The fan connection member 200 is detachably disposed on the first connection module 300 via the first side portion 222.

The first connection module 300 includes a first connection module main body 310, a first guiding portion 320 and a first fixing structure 330. The first guiding part 320 protrudes from the first connection module main body 310. The first fixing structure 330 is disposed on the first connection module main body 310.

The first guide portion 320 is disposed relative to the first guide hole 226. When the fan base 220 pivots relative to the base 210, the first guide portion 320 extends into the first guide hole 226 to guide the fan base 220 to rotate relative to the base 210. In this embodiment, the first guiding portion 320 is a pin. In other embodiments, the first guide portion 320 may be any structure that protrudes from the first connection module body 310 and extends into the first guide hole 226.

The first fixing structure 330 includes a first hole 331 and a first guiding protrusion 332. The first switch control member 223 can move along the first guide protrusion 332. In another embodiment, the first fastening structure 330 is any structure that can be fastened to the first switch control member 223. In another embodiment, the structures of the first fixing structure 330 and the first switch control member 223 are interchangeable.

The second connection module 400 includes a second connection module main body 410, a second guide portion 420 and a second fixing structure 430. The second fixing structure 430 includes a second hole 431 and a second guiding protrusion 432. Since the position of the second connection module 400 is opposite to the first connection module 300, and the structure of the second connection module 400 is similar to that of the first connection module 300 The structures are mirror images of each other, so the detailed structure of the second connection module 400 will not be repeated.

The motherboard 500 is disposed on the motherboard installation area 111, and a part of the motherboard 500 is located between the base body 211 and the bottom plate 110. The motherboard 500 may include components such as a circuit board, a central processing unit installation interface, an adapter card, a first network interface, a signal connection board, a memory installation interface, and a fan power connector 510. The fan power connector 510 is arranged at the front of the motherboard 500 next to the front of the motherboard 500. The fan base 220 is electrically connected to the fan power connector 510 of the motherboard 500 through the opening 212.

The memory 700 and the central processing unit 900 are disposed on the motherboard 500 and located in the accommodating space S between the fan base body 221 and the motherboard 500. The central processing unit 900, the memory 700, and the fan power connector 510 are all located at the front of the motherboard 500. The fan module 600 is disposed on the fan base body 221 and is electrically connected to the fan power connector 510 of the motherboard 500 through the fan base body 221. In other embodiments, the components located in the accommodating space S may only have the memory 700 or only the central processing unit 900.

Next, in the first embodiment of the present invention, the switching method of the fan connecting member 200 between the working state and the maintenance state will be described. Please refer to Figure 3 to Figure 7.

FIG. 3 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG. 4A and 4B are cross-sectional views of the electronic device of the first embodiment of FIG. 1. FIG. 5 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG. FIG. 6 is a partial enlarged view of the electronic device of the first embodiment of FIG. 1. FIG. 7A and 7B are cross-sectional views of the electronic device of the first embodiment of FIG. 1. Since the structure and operation of the second switch control member 225, the second guide portion 420, and the second guide hole 227 are mirror images of the first switch control member 223, the first guide portion 320, and the first guide hole 226, respectively , Therefore, only the combination of the first switch control member 223, the first guide portion 320, and the first guide hole 226 The structure and operation are described, and the structure and operation of the second switch control member 225, the second guide portion 420, and the second guide hole 227 will not be repeated.

3, 4A, and 4B, when the fan connecting member 200 is in a working state, the fan base 220 is located at a working position P1. At this time, the first switch control member 223 can be in a locked state or an unlocked state. When the first switch control member 223 is in the locked state, the end of the first switch control member 223 extends into the first hole 331 to restrict the rotation of the fan base 220 relative to the base 210.

The first guiding portion 320 is located at the first limiting section 2260 of the first guiding hole 226, and the first guiding portion 320 interferes with the wall of the first limiting section 2260 away from the fan base body 221, thereby restricting the fan The angle at which the base 220 rotates toward the bottom plate 110 ensures that the fan base body 221 does not rotate too much toward the bottom plate 110 to occupy the accommodating space S. The lower surface F3 of the fan base 220 is higher than the upper surface F4 of the base 210. The connecting portion 230 is located between the lower surface F5 of the base 210 and the upper surface F6 of the fan base 220. The accommodating space S is formed between the lower surface F3 of the fan base 220 and the upper surface F7 of the bottom plate 110, and the fan base 220 covers the accommodating space S. The orthogonal projection of the fan connecting member 200 on the bottom plate 110 and the motherboard mounting area 111 has a first overlap area E1. The extension surface A of the upper surface F6 of the fan base 220 and the extension surface B of the upper surface F7 of the bottom plate 110 have a first included angle, and the first included angle approaches 0 degrees. In other words, the upper surface F6 of the fan base 220 and the upper surface F7 of the bottom plate 110 are approximately parallel.

Next, referring to FIGS. 5 to 7B, when the user wants to change the fan connecting member 200 from the working state to the maintenance state, the first switch control part 223 must be pulled to turn the first switch control part 223 from the locked state. It is not locked state. When the first switch control member 223 is in the unlocked state, the end of the first switch control member 223 does not extend into the first hole 331, Therefore, the fan base 220 can rotate relative to the base 210. Then, the prestress provided to the fan base 220 through the deformation of the stress main body 241, the force application end 242 and the support end 243 of the stress member 240 makes the fan base 220 rotate relative to the base 210 from the working position P1 to the maintenance position P2. Thereby, the position of the fan base 220 can be rotated relative to the base 210 without manual operation.

During the rotation of the fan base 220 from the working position P1 to the maintenance position P2, the first guiding portion 320 moves along the first guiding hole 226, and the first limiting section 2260 of the first guiding hole 226 passes through the first The first release section 2261 of the guide hole 226 is separated from the first guide hole 226. In this way, the first side portion 222 is released from the locked state with the first connection module main body 310.

As shown in FIGS. 6, 7A and 7B, when the fan connecting member 200 is in a maintenance state, the fan base 220 is located at a maintenance position P2. The accommodation space S and the memory 700 or the central processing unit 900 disposed in the accommodation space S are not shielded by the fan base 220. The orthogonal projection of the fan connecting member 200 on the bottom plate 110 and the motherboard mounting area 111 has a second overlapping area E2. The first overlapping area E1 is larger than the second overlapping area E2. The extension surface A of the upper surface F6 of the fan base 220 and the extension surface B of the upper surface F7 of the bottom plate 110 have a second included angle θ, the second included angle θ is greater than the first included angle, and the second included angle θ is greater than the first included angle. The difference is greater than 45 degrees. In another embodiment, the difference between the second included angle θ and the first included angle may be between 45 degrees and 90 degrees. In yet another embodiment, the difference between the second included angle θ and the first included angle may be between 75 degrees and 90 degrees.

In this way, when the user needs to maintain the memory 700 or the central processing unit 900 in the accommodating space S below the fan base 220, the fan base 220 can be rotated relative to the base 210, so that the Storage space S in the memory 700 And the CPU 900 is exposed. Therefore, in the first embodiment of the present invention, the user does not need to disassemble the fan base 220 of the fan connecting member 200 in order to maintain the memory 700 or the central processing unit 900.

During the rotation of the fan base 220 from the maintenance position P2 to the working position P1, the first guide portion 320 enters the first guide hole 226 through the first release section 2261 of the first guide hole 226, and then the first guide The portion 320 moves along the first guiding hole 226 to the first limiting section 2260 of the first guiding hole 226. In this way, the first side portion 222 and the first connection module main body 310 are fastened to each other. At the same time, the end of the first switch control member 223 moves along the first guiding protrusion 332 and is pressed by the first guiding protrusion 332. When the end of the first switch control element 223 passes through the edge of the first guiding protrusion 332, the end of the first switch control element 223 extends into the first hole 331, whereby the first switch control element 223 can restrict the fan base 220 from being opposed to each other. The base 210 rotates.

Refer to Figure 8. 8 is a schematic diagram of the electronic device according to the second embodiment of the present invention after the top plate is removed. The electronic device of the second embodiment is similar to the electronic device of the first embodiment, and only the differences will be described below, and the similarities will not be repeated. The electronic device S2 of the present invention includes a casing 100, a fan connecting member 200, a motherboard 500, a memory 700, a central processing unit 900 and a fan module 600. The fan connecting member 200 is located in the casing 100. In other words, the electronic device S2 of the second embodiment does not include the first connection module 300 and the second connection module 400. The first side portion 222 of the fan connecting member 200 is detachably disposed on the first side plate 120. The second side portion 224 of the fan connecting member 200 is detachably disposed on the second side plate 130.

The first side plate 120 includes a first side plate main body 121 and a first side guide portion 122 and a first side securing structure 123. The first side securing structure 123 is disposed on the first side plate main body 121. The first side guide 122 protrudes from the first side plate main body 121.

The first side guide portion 122 is disposed opposite to the first guide hole 226. The first side guide 122 slides on the first guide hole 226. The first side guide 122 is a pin. In other embodiments, the first side guide 122 may be any structure protruding from the first side plate main body 121.

The first side securing structure 123 includes a side hole 1230 and a side guiding protrusion 1231. The side hole 1230 is located in the side guide protrusion 1231. The first switch control member 223 moves along the side guide protrusion 1231.

The second side plate 130 includes a second side plate main body 131, a second side guide portion 132 and a second side fixing structure 133. The second side securing structure 133 includes a side hole 1230' and a side guide protrusion 1231'. The structures of the second side securing structure 133, the second side guide portion 132, the side hole 1230', and the side guide protrusion 1231' are respectively the same as the first side securing structure 123, the first side guide portion 122, the side hole 1230 and The side guiding protrusions 1231 are arranged mirror images of each other, so the structure thereof will not be repeated.

Refer to Figure 9 and Figure 10. 9 is a cross-sectional view of the electronic device according to the second embodiment of the present invention in a working state. 10 is a cross-sectional view of the electronic device according to the second embodiment of the present invention in a maintenance state. The fan connecting member 200 of the electronic device S2 of the second embodiment has a working state and a maintenance state similar to those of the first embodiment. Only the differences will be described below, and the similarities will not be repeated. Therefore, you can refer to FIGS. 4A, 4B, 7A, and 7B at the same time. Furthermore, due to the structure and operation of the second switch control member 225, the second side guide portion 132, and the second guide hole 227, respectively, the first switch control member 223, the first side guide portion 122, and the first guide hole 226 They are mirror images of each other, so only the junction of the first switch control member 223, the first side guide 122, and the first guide hole 226 will be described below. The structure and operation are described, and the structure and operation of the second switch control member 225, the second side guide portion 132, and the second guide hole 227 will not be repeated.

As shown in FIG. 9, when the fan connecting member 200 is in a working state, the fan base 220 is located at a working position P1. When the first switch control member 223 is in the locked state, the end of the first switch control member 223 extends into the side hole 1230 to restrict the rotation of the fan base 220 relative to the base 210. The first side guide 122 is located in the first limit section 2260 of the first guide hole 226 and the first side guide 122 interferes with the wall surface of the first limit section 2260 away from the fan base body 221. . The orthogonal projection of the fan connecting member 200 on the bottom plate 110 and the motherboard mounting area 111 has a first overlap area E1. The extension surface A of the upper surface F6 of the fan base 220 and the extension surface B of the upper surface F7 of the bottom plate 110 have a first included angle, and the first included angle approaches 0 degrees.

When the fan connecting member 200 changes from the working state to the maintenance state, the first switch control part 223 must first be pulled to turn the first switch control part 223 from the locked state to the non-locked state. When the first switch control member 223 is in the unlocked state, the end of the first switch control member 223 does not extend into the side hole 1230, so the fan base 220 can rotate relative to the base 210. During the rotation of the fan base 220 from the working position P1 to the maintenance position P2, the first side guide 122 moves along the first guide hole 226, and the first limit section 2260 of the first guide hole 226 passes through the first The first release section 2261 of the guide hole 226 is separated from the first guide hole 226. In this way, the first side portion 222 is released from the locked state with the first side plate main body 121.

As shown in FIG. 10, when the fan connecting member 200 is in a maintenance state, the fan base 220 is located at a maintenance position P2. The orthogonal projection of the fan connecting member 200 on the bottom plate 110 and the motherboard mounting area 111 has a second overlapping area E2. The first overlapping area E1 is larger than the second overlapping area E2. The extension surface A of the upper surface F6 of the fan base 220 is connected to the upper surface of the bottom plate 110 The extension surface B of the surface F7 has a second included angle θ, the second included angle θ is greater than the first included angle, and the difference between the second included angle θ and the first included angle is greater than 45 degrees. The accommodation space S and the memory 700 or the central processing unit 900 disposed in the accommodation space S are not shielded by the fan base 220.

The action of turning the fan connecting member 200 from the maintenance state to the working state in the second embodiment of the present invention is an action corresponding to the fan connecting member 200 of the first embodiment turning from the maintenance state to the working state. Please refer to the first implementation. The relevant content in the example and FIGS. 4A, 4B, 7A and 7B will not be repeated here.

The electronic device disclosed in the above embodiment includes a fan connecting member having a base and a fan base. The fan base is pivoted on the base and can pivot relative to the base, thereby enabling the fan connecting member to have a working state and a maintenance state. As a result, by arranging the fan module on the fan base that can pivot relative to the base, the problem that the fan module cannot be directly installed on the motherboard due to the size limitation of the chassis is solved, resulting in the inability to share the motherboard.

Although the present invention is disclosed in the foregoing embodiments as described above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

100: chassis

110: bottom plate

111: Motherboard installation area

120: The first side panel

130: second side panel

140: top plate

200: Fan connection member

300: The first connection module

400: second connection module

500: Motherboard

600: Fan module

700: memory

800: CPU cooling module

Claims (10)

An electronic device includes: a casing including a bottom plate, the bottom plate having a motherboard mounting area; and a fan connecting member, the fan connecting member is arranged on the bottom plate and an orthogonal projection of the fan connecting member on the bottom plate Partially overlaps the motherboard mounting area, the fan connecting member includes a base and a fan base, the fan base is pivoted on the base; wherein the fan connecting member has a working state and a maintenance state, when the fan connecting member In the working state, the orthogonal projection of the fan connecting member on the bottom plate and the motherboard mounting area has a first overlap area. When the fan connecting member is in the maintenance state, the fan connecting member is on the bottom plate. The orthogonal projection has a second overlap area with the motherboard mounting area, and the first overlap area is larger than the second overlap area. For the electronic device described in claim 1, wherein the casing further includes two side plates, the bottom plate is arranged between the side plates, each of the side plates has a fastening structure, and the fan base includes a fan base The main body, a first switch control element, and a second switch control element. The first switch control element and the second switch control element are respectively disposed at two opposite ends of the fan base main body. When the fan connecting member is in the working state At this time, the first switch control element and the second switch control element are respectively fixed to the fixing structures. For the electronic device described in item 1 of the scope of patent application, the casing further includes two side panels and two connecting modules. The bottom plate is arranged between the side panels, and each of the connecting modules is detachably arranged on the side panels. The side plate, the connection modules are located between the side plates, each of the connection modules has a fastening structure, and the fan base includes a fan base body, a first side, a first switch control element, and a second Side and a second switch control element, the first side Standing at two opposite ends of the fan base body with the second side portion, the first switch control member and the second switch control member are respectively disposed on the first side portion and the second side portion, when the fan is connected When the component is in the working state, the first switch control part and the second switch control part are respectively fixed to the fixing structures. The electronic device described in item 3 of the scope of patent application, wherein the main body of the fan base has a first guide hole and a second guide hole, the first guide hole and the second guide hole are respectively located in the first guide hole One side portion and the second side portion; each of the connection modules includes a connection module body and a guide portion protruding from the connection module body, the guide portions are slidably located in the first guide hole and In the second guide hole. The electronic device described in item 1 of the patent application, wherein when the fan connection member is in the working state, a lower surface of the fan base is higher than an upper surface of the base, and the lower surface of the fan base and the An accommodating space is formed between an upper surface of the bottom plate, and the fan seat covers the accommodating space; when the fan connecting member is in the maintenance state, the accommodating space is exposed. The electronic device described in item 1 of the scope of patent application, wherein when the fan connecting member is in the working state, an upper surface of the fan base and the bottom plate have a first angle; when the fan connecting member is in the maintenance state At this time, the upper surface of the fan base and the bottom plate have a second included angle, the second included angle is greater than the first included angle, and the difference between the second included angle and the first included angle is greater than 45 degrees. According to the electronic device described in claim 1, wherein the fan connecting member further includes a stress member, the stress member includes a stress body, a force end and a support end, the force end is connected to the fan base A force application surface, the supporting end is connected to a piece of the base The supporting surface is a surface of the fan base facing away from the bottom plate, and the supporting surface is a surface of the base facing away from the bottom plate. An electronic device includes: a casing including a bottom plate, the bottom plate having a motherboard mounting area; and a fan connecting member, the fan connecting member is arranged on the bottom plate and an orthogonal projection of the fan connecting member on the bottom plate Partially overlapping with the motherboard mounting area, the fan connecting member includes a base and a fan base, the fan base is pivoted to the base; a motherboard is arranged in the motherboard mounting area of the base, the fan base is electrically Is connected to the motherboard, and part of the motherboard is located between the base and the bottom plate; and a fan module is arranged on the fan base, wherein the fan connecting member has a working state and a maintenance state, when the fan When the connecting member is in the working state, the orthogonal projection of the fan connecting member on the bottom plate and the motherboard mounting area has a first overlap area. When the fan connecting member is in the maintenance state, the fan connecting member is on the bottom plate. The orthogonal projection and the motherboard mounting area have a second overlap area, and the first overlap area is larger than the second overlap area. For the electronic device described in item 8 of the scope of patent application, when the fan connecting member is in the working state, a lower surface of the fan base is higher than an upper surface of the base, and the lower surface of the fan base and the bottom plate An accommodating space is formed between one of the upper surfaces, and the fan base covers the accommodating space. When the fan connecting member is in the maintenance state, the accommodating space is exposed. The electronic device described in item 8 of the scope of patent application, wherein when the fan connecting member is in the working state, the fan base is in a working position, and an upper surface of the fan base and the bottom plate have a first angle; when When the fan connecting member is in the maintenance state, the wind The fan base is located at a maintenance position, the upper surface of the fan base and the bottom plate have a second included angle, the second included angle is greater than the first included angle, and the difference between the second included angle and the first included angle is greater than 45 degrees.

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