TWI702888B - Circuit board and electronic device - Google Patents
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Description
本發明是有關於一種線路板及電子裝置。The invention relates to a circuit board and an electronic device.
目前,穿戴式裝置發展快速,包含了智慧型手環、手錶、頭戴顯示裝置、穿戴衣等,應用層面越來越廣,不僅應用於醫療、娛樂等領域,更在一般生活、運動休閒中佔有一席之地。At present, wearable devices are developing rapidly, including smart bracelets, watches, head-mounted display devices, wearables, etc., with more and more applications, not only in medical, entertainment and other fields, but also in general life, sports and leisure To have a role to play.
將可拉伸的線路板應用於穿戴式裝置,可使穿戴式裝置對人體狀態的量測更精準,且使其更舒適地被使用者穿戴。然而,所述線路板的線路結構易因拉伸而損壞、斷裂,導致其電阻值急遽升高而影響其正常效能。Applying a stretchable circuit board to a wearable device can make the wearable device more accurate in measuring the state of the human body and make it more comfortable to be worn by the user. However, the circuit structure of the circuit board is easily damaged or broken due to stretching, resulting in a sudden increase in its resistance value and affecting its normal performance.
本發明提供一種線路板及電子裝置,使線路板的線路結構不易因線路板的拉伸而損壞、斷裂。The invention provides a circuit board and an electronic device, so that the circuit structure of the circuit board is not easily damaged or broken due to the stretching of the circuit board.
本發明的線路板包括一基板及至少一線路結構。基板具有多個第一開槽,各第一開槽沿一第一軸線延伸,各第一開槽沿第一軸線的長度大於各第一開槽沿其他方向的長度。線路結構配置於基板上且包括多個弧狀區段及多個延伸區段。各弧狀區段連接於兩延伸區段之間而使線路結構為迂迴狀。線路結構與各第一開槽之間具有間隙而使各第一開槽及基板的部分表面被線路結構暴露。各第一開槽位於相鄰的兩延伸區段之間,各第一開槽的第一軸線通過對應的弧狀區段。The circuit board of the present invention includes a substrate and at least one circuit structure. The substrate has a plurality of first slots, each of the first slots extends along a first axis, and the length of each first slot along the first axis is greater than the length of each first slot along other directions. The circuit structure is disposed on the substrate and includes a plurality of arc sections and a plurality of extension sections. Each arc-shaped section is connected between the two extension sections to make the circuit structure in a circuitous shape. There is a gap between the circuit structure and each of the first slots, so that each of the first slots and part of the surface of the substrate are exposed by the circuit structure. Each first slot is located between two adjacent extension sections, and the first axis of each first slot passes through the corresponding arc-shaped section.
本發明的電子裝置包括一線路板及兩電子元件。線路板包括一基板及至少一線路結構。基板具有多個第一開槽,各第一開槽沿一第一軸線延伸,各第一開槽沿第一軸線的長度大於各第一開槽沿其他方向的長度。線路結構配置於基板上且包括多個弧狀區段及多個延伸區段。各弧狀區段連接於兩延伸區段之間而使線路結構為迂迴狀。線路結構與各第一開槽之間具有間隙而使各第一開槽及基板的部分表面被線路結構暴露。各第一開槽位於相鄰的兩延伸區段之間,各第一開槽的第一軸線通過對應的弧狀區段。兩電子元件藉由線路板而彼此電性連接。The electronic device of the present invention includes a circuit board and two electronic components. The circuit board includes a substrate and at least one circuit structure. The substrate has a plurality of first slots, each of the first slots extends along a first axis, and the length of each first slot along the first axis is greater than the length of each first slot along other directions. The circuit structure is disposed on the substrate and includes a plurality of arc sections and a plurality of extension sections. Each arc-shaped section is connected between the two extension sections to make the circuit structure in a circuitous shape. There is a gap between the circuit structure and each of the first slots, so that each of the first slots and part of the surface of the substrate are exposed by the circuit structure. Each first slot is located between two adjacent extension sections, and the first axis of each first slot passes through the corresponding arc-shaped section. The two electronic components are electrically connected to each other through the circuit board.
基於上述,在本發明的線路板中,線路結構與基板的開槽之間具有間隙,亦即,線路結構並非完全覆蓋基板的表面,而是僅覆蓋基板的部分表面,使得線路結構不會過於鄰近基板的第一開槽。如此一來,當線路板被拉伸時,基板的第一開槽的末端產生的應力集中不會直接傳遞至線路結構,而可有效避免線路結構因線路板的拉伸而損壞、斷裂。此外,第一開槽的延伸軸線(即所述第一軸線)通過對應的弧狀區段,使得弧狀區段鄰近第一開槽的末端,從而可藉由無尖角的弧狀區段來進一步降低應力集中的程度。Based on the above, in the circuit board of the present invention, there is a gap between the circuit structure and the slot of the substrate, that is, the circuit structure does not completely cover the surface of the substrate, but only covers part of the surface of the substrate, so that the circuit structure is not too much. The first slot adjacent to the substrate. In this way, when the circuit board is stretched, the stress concentration generated at the end of the first slot of the substrate will not be directly transmitted to the circuit structure, and the circuit structure can be effectively prevented from being damaged or broken due to the stretching of the circuit board. In addition, the extension axis of the first slot (that is, the first axis) passes through the corresponding arc-shaped section, so that the arc-shaped section is adjacent to the end of the first slot, so that the arc-shaped section without sharp corners can be used. To further reduce the degree of stress concentration.
為讓本發明的上述特徵能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features of the present invention more obvious and comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
圖1是本發明一實施例的線路板的俯視圖。圖2是圖1的線路板的局部放大圖。請參考圖1及圖2,本實施例的線路板100包括一基板110及至少一線路結構120(繪示為多個)。基板110具有多個第一開槽110a,各第一開槽110a沿一第一軸線A1延伸,各第一開槽110a沿第一軸線A1的長度大於各第一開槽110a沿其他方向的長度。各線路結構120配置於基板110上且包括多個弧狀區段122及多個延伸區段124。各弧狀區段122連接於兩延伸區段124之間而使線路結構120為迂迴狀,各第一開槽110a位於相鄰的兩延伸區段124之間。線路板100可藉由這些第一開槽110a及這些弧狀區段122的變形而沿垂直於第一軸線A1的方向X被拉伸,據以提供一維的拉伸效果。Fig. 1 is a top view of a circuit board according to an embodiment of the present invention. Fig. 2 is a partial enlarged view of the circuit board of Fig. 1. Please refer to FIG. 1 and FIG. 2, the
如圖1及圖2所示,線路結構120與基板110的各第一開槽110a之間具有間隙而使各第一開槽110a及基板110的部分表面被線路結構120暴露。亦即,線路結構120並非完全覆蓋基板110的表面,而是僅覆蓋基板110的部分表面,使得線路結構120不會過於鄰近基板110的第一開槽110a。如此一來,當線路板110被拉伸時,基板110的第一開槽110a的末端產生的應力集中不會直接傳遞至線路結構120,而可有效避免線路結構120因線路板110的拉伸而損壞、斷裂。As shown in FIGS. 1 and 2, there is a gap between the
此外,在本實施例中,各第一開槽110a的延伸軸線(即第一軸線A1)通過對應的弧狀區段122,使得弧狀區段122鄰近第一開槽110a的末端,從而可藉由無尖角的弧狀區段122來進一步降低應力集中的程度。In addition, in this embodiment, the extension axis (ie, the first axis A1) of each
在本實施例中,基板110的各第一開槽110a例如是狹縫而為直線形開槽,線路結構120的各延伸區段124是沿直線方向延伸,且各相鄰的兩延伸區段124相互平行。各第一開槽110a沿第一軸線A1的長度L與相鄰的兩第一開槽110a沿垂直於第一軸線A1的方向的距離x的比值L/x例如大於5,以維持穩定的拉伸特性。In this embodiment, each
本發明不對開槽的形式加以限制,以下藉由圖3至圖7對此舉例說明。The present invention does not impose restrictions on the form of the slot, which is illustrated below with reference to FIGS. 3 to 7.
圖3是本發明另一實施例的線路板的局部放大圖。如圖3所示,基板110’的各第一開槽110a1為橢圓形開槽以提供二維的拉伸效果,且線路結構120’的連接於弧狀區段122’的相鄰的兩延伸區段124’順應第一開槽110a1的形狀而相互傾斜。圖4至圖8繪示本發明其他實施例的線路板。如圖4所示,各第一開槽110a2為菱形開槽以提供二維的拉伸效果。如圖5所示,彼此相交的直線形的第一開槽110a3、110a4,其延伸方向相互垂直以提供二維的拉伸效果。如圖6所示,彼此不相交的直線形的第一開槽110a5、110a6,其延伸方向相互垂直以提供二維的拉伸效果。如圖7及圖8所示,彼此相交的直線形的第一開槽110a7、110a8,其延伸方向相異且傾斜以提供二維的拉伸效果,其中圖8與圖7的不同處在於,圖8中更多的第一開槽110a7、110a8依序相連成為連續的開槽結構。在其他實施例中,第一開槽可為長方形開槽、六角形開槽或其他形狀的開槽,本發明不對此加以限制。Fig. 3 is a partial enlarged view of a circuit board according to another embodiment of the present invention. As shown in FIG. 3, each first slot 110a1 of the substrate 110' is an elliptical slot to provide a two-dimensional stretching effect, and the circuit structure 120' is connected to two adjacent extensions of the arc-shaped section 122' The sections 124' are inclined to each other in accordance with the shape of the first slot 110a1. 4 to 8 show circuit boards according to other embodiments of the invention. As shown in FIG. 4, each first slot 110a2 is a diamond-shaped slot to provide a two-dimensional stretching effect. As shown in FIG. 5, the linear first slots 110a3 and 110a4 that intersect each other have extending directions perpendicular to each other to provide a two-dimensional stretching effect. As shown in FIG. 6, the linear first slots 110a5, 110a6 that do not intersect each other have their extending directions perpendicular to each other to provide a two-dimensional stretching effect. As shown in FIGS. 7 and 8, the linear first grooves 110a7 and 110a8 that intersect each other have different extension directions and are inclined to provide a two-dimensional stretching effect. The difference between FIG. 8 and FIG. 7 is that: More first slots 110a7 and 110a8 in FIG. 8 are connected in sequence to form a continuous slot structure. In other embodiments, the first slot may be a rectangular slot, a hexagonal slot or other shapes of slots, which is not limited in the present invention.
在其他實施例中,可將多種具有不同設計參數的線路結構及晶片、被動電子元件或主動電子元件整合於同一基板,以下藉由圖9及圖10對此舉例說明。In other embodiments, a variety of circuit structures and chips with different design parameters, passive electronic components or active electronic components can be integrated on the same substrate. This is illustrated below with reference to FIGS. 9 and 10.
圖9是本發明另一實施例的線路板的俯視圖。在圖9的線路板200中,基板210及其第一開槽210a與線路結構220A、220B、220C的配置與作用方式類似前述實施例的基板及其第一開槽與線路結構的配置與作用方式,於此不再贅述。圖9所示實施例與前述實施例的不同處在於,分別具有不同設計參數的線路結構220A、220B、220C及對應的第一開槽210a分別配置於基板210不同區域,其中線路結構220A、220C及對應的第一開槽210a的形式例如相似於圖1所示的線路結構120及對應的第一開槽110a的形式,線路結構220B及對應的第一開槽210a的形式例如相似於圖3所示的線路結構120’及對應的第一開槽110a1的形式,且線路結構220A的第一開槽210a的長度與相鄰的兩第一開槽210a的距離的比值(如同前述的比值L/x)小於線路結構220C的所述比值且大於線路結構220B的所述比值。也就是說,所述設計參數之不同包含了開槽的形狀之不同及線路結構的所述比值之不同。舉例來說,線路結構220A的第一開槽210a的長度與相鄰的兩第一開槽210a的距離的比值例如是13,線路結構220B的所述比值例如是8,線路結構220C的所述比值例如是17,然本發明不以此為限。再者,所述設計參數也可包括各第一開槽110a沿第一軸線A1的長度L與相鄰的兩第一開槽110a沿平行於第一軸線A1的方向的距離y的比值L/y,本發明不對此加以限制。Fig. 9 is a top view of a circuit board according to another embodiment of the present invention. In the
從而,線路板200在線路結構220A處具有中等程度的拉伸效果,在線路結構220B處具有較小程度的拉伸效果且具有二維拉伸效果,且在線路結構220C處具有較大程度的拉伸效果。舉例來說,可將線路結構220A、220B、220C配置為分別對應於使用者的肩膀、二頭肌、手肘,以符合肩膀所需的中等程度的拉伸效果、二頭肌所需的較小程度的拉伸效果及二維拉伸效果、手肘所需的較大程度的拉伸效果。本發明不對此加以限制。Therefore, the
圖10是本發明另一實施例的線路板的俯視圖。在圖10的線路板300中,基板310及其第一開槽310a與線路結構320A、320B、320C的配置與作用方式類似圖9的基板210及其第一開槽210a與線路結構220A、220B、220C的配置與作用方式,於此不再贅述。圖10所示實施例與圖9所示實施例的不同處在於,線路板300更包括一晶片330,晶片330配置於基板310上且電性連接於線路結構320A、320B。其中,晶片330為不可拉伸的元件,亦即,圖10所示的線路板300整合了可拉伸結構與不可拉伸結構。晶片330可替換為電阻、電容、電感等被動元件或電晶體等不同於被動元件的主動元件,本發明不對此加以限制。Fig. 10 is a top view of a circuit board according to another embodiment of the present invention. In the
圖11是本發明另一實施例的多個線路板拼接的示意圖。在圖11的線路板400、500中,基板410及其第一開槽410a與線路結構420的配置與作用方式與基板510及其第一開槽410a與線路結構520的配置與作用方式類似前述實施例的基板及其第一開槽與線路結構的配置與作用方式,於此不再贅述。圖10所示實施例與前述實施例的不同處在於,線路板400及線路板500分別以不同的方向配置而相互拼接,以在使用者身體的相鄰部位提供不同方向的拉伸效果。FIG. 11 is a schematic diagram of splicing multiple circuit boards according to another embodiment of the present invention. In the
圖12是本發明另一實施例的線路板的俯視圖。圖13是圖12的線路板沿I-I線的剖面圖。為使圖式較為清楚,圖13以簡略的方式示意性地繪示線路結構620。在圖12的線路板600中,基板610及其第一開槽610a與線路結構620的配置與作用方式類似前述實施例的基板及其第一開槽與線路結構的配置與作用方式,於此不再贅述。圖12所示實施例與前述實施例的不同處在於,線路板600更包括一保護層640及一支撐結構650,保護層640及支撐結構650的材質例如皆為絕緣材料。保護層640配置於基板610上而遮蔽線路結構620,避免線路結構620直接接觸外界物體而損壞。支撐結構650支撐於基板610與保護層640之間以使保護層640與基板610之間具有間距,所述間距讓基板610及其第一開槽610a在拉伸變形時於方向Z不會被保護層640限制而能夠順利變形。Fig. 12 is a top view of a circuit board according to another embodiment of the present invention. Fig. 13 is a cross-sectional view of the circuit board of Fig. 12 along the line I-I. To make the drawing clearer, FIG. 13 schematically illustrates the
圖14是本發明另一實施例的線路板的俯視圖。圖15繪示圖14的第一開槽及線路結構的分佈範圍縮減。在圖14及圖15的線路板700中,基板710及其第一開槽710a與線路結構720的配置與作用方式類似前述實施例的基板及其第一開槽與線路結構的配置與作用方式,於此不再贅述。圖14所示實施例與圖15所示實施例彼此之間的差異如下述。圖14的第一開槽710a及線路結構720在基板710的中間區域具有較大的分佈範圍,此配置方式可提升線路板700的拉伸變形能力,從而降低線路板700拉伸時的塑性應變。圖15的第一開槽710a及線路結構720在基板710的中間區域具有較小的分佈範圍,此配置方式可縮減呈迂迴狀的線路結構720的分佈範圍,從而降低線路板700的初始電阻。在設計上,可選擇以圖14所示方式配置以降低所述塑性應變,或可選擇以圖15所示方式配置以降低所述初始電阻。Fig. 14 is a top view of a circuit board according to another embodiment of the present invention. FIG. 15 shows that the distribution range of the first slot and circuit structure of FIG. 14 is reduced. In the
以下藉由表1(拉伸一次的結果)對圖14所示實施例與圖15所示實施例的所述塑性應變、所述初始電阻及基於所述初使電阻的電阻變化率以有限元素模擬軟體之計算結果進行比較。
如上列表1所示,圖14所示實施例的第一開槽710a的長度與相鄰的兩第一開槽710a的距離的比值L/x(如同前述的比值L/x)相同於圖15所示實施例的所述比值,例如皆為10。此外,圖14所示實施例及圖15所示實施例的沿方向Y的第一開槽710a的數量例如皆為6.5個。在此前提之下,基於圖14所示實施例的所述填滿配置方式與圖15所示實施例的所述未填滿配置方式之差異,圖14的線路板700於拉伸時的最大塑性應變為1.55%,低於圖15的線路板700於拉伸時的最大塑性應變為4.91%。並且,圖14的線路板700的初始電阻為21.18Ω,高於圖15的線路板700的初始電阻為13.40Ω。此外,圖14的線路板700於拉伸時的電阻變化率為1.42%,高於圖15的線路板700於拉伸時的電阻變化率為0.12%。As shown in Table 1 above, the ratio L/x (like the aforementioned ratio L/x) of the length of the
圖16是本發明另一實施例的線路板的俯視圖。圖17是圖16的線路板的局部放大圖,其中圖17對應於圖16的區域R1。在圖16及圖17所示實施例中,基板810及其第一開槽810a與線路結構820的配置與作用方式類似前述實施例的基板及其第一開槽與線路結構的配置與作用方式,於此不再贅述。圖16及圖17所示實施例與前述實施例的不同處在於,線路板800更包括多個連接線路860,各連接線路860連接於兩線路結構820之間而使這些線路結構820及這些連接線路860共同構成迂迴狀結構。基板810更具有多個第二開槽810b,各第二開槽810b位於相鄰的兩線路結構820之間,各第二開槽810b沿垂直於第一軸線A1的一第二軸線A2延伸。線路板800可藉由這些第二開槽810b及這些連接線路860的變形而沿垂直於第二軸線A2的方向被拉伸。也就是說,在圖16及圖17所示實施例中,除了各線路結構820自身如圖17所示為迂迴狀而可配合第一開槽810a提供方向X的拉伸效果,多個線路結構820及多個連接線路860亦共同構成迂迴狀結構,而可配合第二開槽810b提供方向Y的拉伸效果。Fig. 16 is a top view of a circuit board according to another embodiment of the present invention. FIG. 17 is a partial enlarged view of the circuit board of FIG. 16, wherein FIG. 17 corresponds to the area R1 of FIG. 16. In the embodiment shown in FIGS. 16 and 17, the configuration and function of the
圖18繪示本發明一實施例的線路板經拉伸測試所得的電阻變化率,其測試條件為拉伸量10%及拉伸時間為6000秒內(1000次重複拉伸測試),且其例如對應於類似圖14所示的線路板700。如圖18所示,本發明之實施例的線路板經過長時間拉伸後,其電阻變化率維持在5%以下,由此可知,本發明之實施例藉由將線路結構設計為非完全覆蓋基板的表面,可有效降低其被拉伸時的電阻變化率。FIG. 18 shows the resistance change rate of a circuit board obtained by a tensile test according to an embodiment of the present invention. The test condition is that the tensile amount is 10% and the tensile time is within 6000 seconds (1000 repeated tensile tests), and For example, it corresponds to a
圖19是本發明一實施例的電子裝置的示意圖。如圖19所示,兩電子元件52、54可藉由上述實施例的線路板100而彼此電性連接,從而構成電子裝置50。電子裝置50例如是穿戴式電子裝置,而兩電子元件52、54可為所述穿戴式電子裝置的人體狀態量測元件、資訊顯示元件或其他種類的元件,本發明不對此加以限制。在其他實施例中,兩電子元件52、54可藉由上述其他任一實施例的線路板而彼此電性連接,本發明不對此加以限制。FIG. 19 is a schematic diagram of an electronic device according to an embodiment of the invention. As shown in FIG. 19, the two
本發明不對線路板的相鄰兩開槽之間的線路結構數量加以限制,以下以圖11所示線路板400為例對此加以說明。圖20是圖11的線路板的局部放大圖,其中圖20對應於圖11的區域R2。如圖20所示,兩線路結構420並列且延伸於相鄰的兩第一開槽410a之間。在其他實施例中,可將更多數量的線路結構並列且延伸於相鄰的兩第一開槽410a之間,本發明不對此加以限制。The present invention does not limit the number of circuit structures between two adjacent slots of the circuit board. The
圖21是圖22的線路板沿II-II線的剖面圖。為使圖式較為清楚,圖21以簡略的方式示意性地繪示線路結構420。線路板400更包括一保護層440,保護層440的材質例如皆為絕緣材料,其配置於基板410上而遮蔽線路結構420,避免線路結構420直接接觸外界物體而損壞。圖21的保護層440與圖13的保護層640的不同處在於,保護層440直接覆蓋於基板410及線路結構420上,而非如同圖13的保護層640藉由支撐結構650而被撐離於基板610及線路結構620。此外,圖21的保護層440可具有第三開槽440a,用以提供可拉伸效果。Fig. 21 is a cross-sectional view of the circuit board of Fig. 22 along line II-II. To make the drawing clearer, FIG. 21 schematically depicts the
進一步而言,在其他實施例中,線路板可為多層結構,且上述並列的線路結構可分別位於線路板的不同層,以下藉由圖式對此舉例說明。圖22是本發明另一實施例的線路板的剖面圖。圖23是圖22的線路板的部分結構俯視圖。圖24是圖22的線路板的部分結構仰視圖。為使圖式較為清楚,圖22以簡略的方式示意性地繪示線路結構920A、920B,且圖23及圖24未繪示出保護層940A、940B。請參考圖22至圖24,本實施例的部分線路結構920A及另一部分線路結構920B分別配置於基板910的相對兩表面,保護層940A、940B分別配置於基板910的相對兩表面,且線路結構920A、920B分別被保護層940A、940B遮蔽。線路結構920B藉由導通孔950而電性連接至線路結構920A所在表面的接墊。在其他實施例中,可不配置導通孔950,並於線路結構920B所在表面配置對應的接墊。Furthermore, in other embodiments, the circuit board may have a multi-layer structure, and the above-mentioned parallel circuit structures may be located on different layers of the circuit board, as illustrated by the following diagrams. Fig. 22 is a cross-sectional view of a circuit board according to another embodiment of the present invention. Fig. 23 is a top view of a partial structure of the circuit board of Fig. 22. Fig. 24 is a bottom view of a partial structure of the circuit board of Fig. 22. In order to make the drawing clearer, FIG. 22 schematically illustrates the
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
50‧‧‧電子裝置
52、54‧‧‧電子元件
100、200、300、400、500、600、700、800‧‧‧線路板
110、110’、210、310、410、510、610、710、810‧‧‧基板
110a、110a1、110a2、110a3、110a4、110a5、110a6、110a7、110a8、210a、310a、410a、510a、610a、710a、810a‧‧‧第一開槽
120、120’、220A、220B、220C、320A、320B、320C、420、520、620、720、820、920A、920B‧‧‧線路結構
122、122’‧‧‧弧狀區段
124、124’‧‧‧延伸區段
330‧‧‧晶片
440、640、940A、940B‧‧‧保護層
440a‧‧‧第三開槽
650‧‧‧支撐結構
810b‧‧‧第二開槽
860‧‧‧連接線路
950‧‧‧導通孔
A1‧‧‧第一軸線
A2‧‧‧第二軸線
L‧‧‧長度
R1、R2‧‧‧區域
X、Y、Z‧‧‧方向
x、y‧‧‧距離50‧‧‧
圖1是本發明一實施例的線路板的俯視圖。 圖2是圖1的線路板的局部放大圖。 圖3是本發明另一實施例的線路板的局部放大圖。 圖4至圖8繪示本發明其他實施例的線路板。 圖9是本發明另一實施例的線路板的俯視圖。 圖10是本發明另一實施例的線路板的俯視圖。 圖11是本發明另一實施例的多個線路板拼接的示意圖。 圖12是本發明另一實施例的線路板的俯視圖。 圖13是圖12的線路板沿I-I線的剖面圖。 圖14是本發明另一實施例的線路板的俯視圖。 圖15繪示圖14的第一開槽及線路結構的分佈範圍縮減。 圖16是本發明另一實施例的線路板的俯視圖。 圖17是圖16的線路板的局部放大圖。 圖18繪示本發明一實施例的線路板經拉伸測試所得的電阻變化率。 圖19是本發明一實施例的電子裝置的示意圖。 圖20是圖11的線路板的局部放大圖。 圖21是圖20的線路板沿II-II線的剖面圖。 圖22是本發明另一實施例的線路板的剖面圖。 圖23是圖22的線路板的部分結構俯視圖。 圖24是圖22的線路板的部分結構仰視圖。Fig. 1 is a top view of a circuit board according to an embodiment of the present invention. Fig. 2 is a partial enlarged view of the circuit board of Fig. 1. Fig. 3 is a partial enlarged view of a circuit board according to another embodiment of the present invention. 4 to 8 show circuit boards according to other embodiments of the invention. Fig. 9 is a top view of a circuit board according to another embodiment of the present invention. Fig. 10 is a top view of a circuit board according to another embodiment of the present invention. FIG. 11 is a schematic diagram of splicing multiple circuit boards according to another embodiment of the present invention. Fig. 12 is a top view of a circuit board according to another embodiment of the present invention. Fig. 13 is a cross-sectional view of the circuit board of Fig. 12 along the line I-I. Fig. 14 is a top view of a circuit board according to another embodiment of the present invention. FIG. 15 shows that the distribution range of the first slot and circuit structure of FIG. 14 is reduced. Fig. 16 is a top view of a circuit board according to another embodiment of the present invention. Fig. 17 is a partial enlarged view of the circuit board of Fig. 16. FIG. 18 shows the resistance change rate of a circuit board obtained by tensile testing according to an embodiment of the present invention. FIG. 19 is a schematic diagram of an electronic device according to an embodiment of the invention. Fig. 20 is a partial enlarged view of the circuit board of Fig. 11. Fig. 21 is a cross-sectional view of the circuit board of Fig. 20 along line II-II. Fig. 22 is a cross-sectional view of a circuit board according to another embodiment of the present invention. Fig. 23 is a top view of a partial structure of the circuit board of Fig. 22. Fig. 24 is a bottom view of a partial structure of the circuit board of Fig. 22.
100‧‧‧線路板 100‧‧‧Circuit board
110‧‧‧基板 110‧‧‧Substrate
110a‧‧‧第一開槽 110a‧‧‧First slot
120‧‧‧線路結構 120‧‧‧Line structure
122‧‧‧弧狀區段 122‧‧‧Arc Section
124‧‧‧延伸區段 124‧‧‧Extended section
A1‧‧‧第一軸線 A1‧‧‧First axis
X、Y、Z‧‧‧方向 X, Y, Z‧‧‧direction
Claims (23)
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