TWI697461B - Method for processing lithium disilicate glass ceramics - Google Patents
Method for processing lithium disilicate glass ceramics Download PDFInfo
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本發明是有關於一種二矽酸鋰玻璃陶瓷(lithium disilicate glass ceramics),特別是指一種二矽酸鋰玻璃陶瓷的加工方法。 The present invention relates to a lithium disilicate glass ceramics (lithium disilicate glass ceramics), in particular to a processing method of lithium disilicate glass ceramics.
二矽酸鋰玻璃陶瓷做為牙冠重建材已是近二十多年來的趨勢之一,惟今受限於二矽酸鋰製成瓷塊的過程因其含有較低結晶度而導致二矽酸鋰玻璃陶瓷容易於外力作用下產生表面熔融、碎裂及材料移除效率不佳等問題,故現有二矽酸鋰玻璃陶瓷始終無法有所突破來因應市場主流之雷射雕銑製程工法,而僅適用於CNC車銑加工。 The use of lithium disilicate glass ceramics as a heavy building material for dental crowns has been one of the trends in the past two decades. However, the process of making porcelain blocks from lithium disilicate is limited due to its low crystallinity. Lithium silicate glass ceramics are prone to surface melting, chipping and poor material removal efficiency under the action of external forces. Therefore, the existing lithium disilicate glass ceramics have not been able to make breakthroughs to meet the mainstream laser engraving and milling process methods in the market. , And only suitable for CNC turning and milling.
參閱圖1,一種現有的二矽酸鋰玻璃陶瓷的成形方法,其包括下步驟:(A)一混合步驟11,是混合一含有二氧化矽(SiO2)粉末與氧化鋰(Li2O)粉末之混合物以形成一批粉體;(B)一模造成形步驟12,是令該批粉體填充於一成形模具(圖未示)內以初步成形出
一無結晶相的坯體;(C)兩階段熱處理步驟13,是對該無晶相的坯體施予兩階段熱處理以令該無晶相的坯體晶化成一含有一結晶度介於20%至40%間之二矽酸鋰主要晶相的二矽酸鋰玻璃陶瓷坯體;(D)一車銑加工精密成形步驟14,是採用CNC車銑加工法研磨該二矽酸鋰玻璃陶瓷坯體以精密成形出一高精密度之二矽酸鋰玻璃陶瓷坯體;及(E)一成形後熱處理步驟15,是對該高精密度之二矽酸鋰玻璃陶瓷坯體施予850℃之熱處理以成為一含有70%以上之二矽酸鋰主要晶相的二矽酸鋰玻璃陶瓷。
Referring to Figure 1, an existing method for forming lithium disilicate glass ceramics includes the following steps: (A) a mixing
根據上述可知,該現有的二矽酸鋰玻璃陶瓷因其結晶度(20%至40%)較低僅能適用於機械加工研磨,無法透過雷射雕銑達到良好的材料移除效果,致使用於牙冠產品成型上的困難。 According to the above, the existing lithium disilicate glass ceramics are only suitable for mechanical processing and grinding due to their low crystallinity (20% to 40%), and cannot achieve good material removal effects through laser engraving and milling. Difficulties in shaping dental crown products.
有鑑於此,解決前述問題乃是所屬技術領域中的相關技術人員有待突破的課題。 In view of this, solving the aforementioned problems is a subject to be broken through by relevant technicians in the technical field.
因此,本發明的目的,即在提供一種可適用於雷射雕銑加工,且具有較佳材料移除率之二矽酸鋰玻璃陶瓷的加工方法。 Therefore, the purpose of the present invention is to provide a method for processing lithium disilicate glass ceramics that is suitable for laser engraving and milling and has a better material removal rate.
於是,本發明二矽酸鋰玻璃陶瓷的加工方法,包括以下步驟:對一無結晶相的二矽酸鋰玻璃(amorphous)施予一熱處理以形成一結晶度大於等於50%之二矽酸鋰玻璃陶瓷,且定義該二矽酸鋰玻璃陶瓷具有一欲加工區;及以一脈衝式雷射對該二矽酸鋰玻璃 陶瓷加工,以移除該二矽酸鋰玻璃陶瓷之欲加工區的材料,且該脈衝式雷射的脈衝寬度小於等於10-9秒。 Therefore, the processing method of lithium disilicate glass ceramics of the present invention includes the following steps: a heat treatment is applied to an amorphous lithium disilicate glass (amorphous) to form a lithium disilicate with a crystallinity greater than or equal to 50% Glass ceramics, and define that the lithium disilicate glass ceramic has an area to be processed; and processing the lithium disilicate glass ceramic with a pulsed laser to remove the area of the lithium disilicate glass ceramic to be processed Material, and the pulse width of the pulsed laser is less than or equal to 10 -9 seconds.
本發明的功效在於:利用脈衝式雷射來對該結晶度大於等於50%的二矽酸鋰玻璃陶瓷進行加工,可避免熱傳率(thermal conductivity)較低的二矽酸鋰玻璃陶瓷因吸收雷射的熱能而蓄熱導致破裂,並藉此提升其二矽酸鋰玻璃陶瓷的移除率。 The effect of the present invention is to use a pulsed laser to process the lithium disilicate glass ceramics with a crystallinity greater than or equal to 50%, which can avoid the absorption of lithium disilicate glass ceramics with low thermal conductivity. The thermal energy of the laser causes the heat to be broken, and this improves the removal rate of the lithium disilicate glass ceramic.
21:研磨步驟 21: Grinding step
22:煅燒步驟 22: Calcination step
23:熔融步驟 23: melting step
24:成形步驟 24: forming steps
25:至少兩階段熱處理步驟 25: At least two-stage heat treatment steps
26:雷射加工步驟 26: Laser processing steps
本發明的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一流程圖,說明一種現有的二矽酸鋰玻璃陶瓷的成形方法;圖2是一流程圖,說明本發明二矽酸鋰玻璃陶瓷的加工方法的一實施例;圖3是一影像圖,說明經本發明之加工方法之一比較例1所製得之二矽酸鋰玻璃的外觀形貌;圖4是一影像圖,說明經本發明之加工方法之一比較例2所製得之二矽酸鋰玻璃陶瓷體的外觀形貌;圖5是一影像圖,說明經本發明成之加工法之一具體例1所製得之二矽酸鋰玻璃陶瓷的外觀形貌;及 圖6是一影像圖,說明經本發明之加工方法之一具體例2所製得之二矽酸鋰玻璃陶瓷的外觀形貌。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a flow chart illustrating a conventional method for forming lithium disilicate glass ceramics; FIG. 2 is a flow chart The figure illustrates an embodiment of the method for processing lithium disilicate glass ceramics of the present invention; Figure 3 is an image diagram illustrating the appearance and morphology of the lithium disilicate glass prepared by a comparative example 1 of the processing method of the present invention Figure 4 is an image diagram illustrating the appearance of a lithium disilicate glass ceramic body prepared by Comparative Example 2 of one of the processing methods of the present invention; Figure 5 is an image diagram illustrating the processing method of the present invention The appearance and morphology of the lithium disilicate glass ceramic prepared in Example 1; and FIG. 6 is an image diagram illustrating the appearance and morphology of lithium disilicate glass ceramics prepared by a specific example 2 of the processing method of the present invention.
參閱圖2,本發明二矽酸鋰玻璃陶瓷體的加工方法的一實施例,包括以下步驟:(a)一研磨步驟21、(b)一煅燒(calcinating)步驟22、(c)一熔融步驟23、(d)一成形步驟24、(e)至少兩階段熱處理步驟25,及(f)一雷射加工步驟26。
Referring to FIG. 2, an embodiment of the method for processing a lithium disilicate glass ceramic body of the present invention includes the following steps: (a) a grinding
該研磨步驟21是研磨一含有氧化矽粉末與氧化鋰粉末之混合物;其中,氧化矽對氧化鋰的一莫爾比值是大於2。
The grinding
該煅燒步驟22是以300℃至800℃的溫度對該混合物施予兩階段之0.5小時至4小時間的煅燒,以形成一批穩定性粉體。
In the
該熔融步驟23是將該批穩定性粉體設置於一高溫爐中熔融成一熔湯。
The melting
該成形步驟24是傾倒該熔湯於一經預熱至300℃至700℃間的模具中,以成形出一無氣泡、無裂痕且無結晶相的二矽酸鋰玻璃。
The forming
該至少兩階段熱處理步驟25是依序成核(nucleating)與結晶化(grain growing)該無結晶相之二矽酸鋰玻璃,以形成一結晶度大於等於50%之二矽酸鋰玻璃陶瓷,且定義該二矽酸鋰玻璃陶
瓷具有一欲加工區。具體來說,該至少兩階段熱處理步驟25中的第一次熱處理溫度是介於300℃至700℃間,其目的是在於令該無結晶相之二矽酸鋰玻璃產生晶核;該至少兩階段熱處理步驟25中的第二次熱處理溫度是介於700℃至950℃間,其目的是在於令該二矽酸鋰玻璃中的晶核持續產生晶粒成長以使其中玻璃相轉變為結晶相,藉此提高二矽酸鋰玻璃陶瓷的結晶度。此處需補充說明的是,晶粒成長(結晶化)的驅動力源自於熱能,故熱處理的溫度、時間與次數是決定該二矽酸鋰玻璃陶瓷晶相轉變的重要關鍵。
The at least two-stage
該雷射加工步驟26是以一脈衝式雷射對該二矽酸鋰玻璃陶瓷加工,以移除該二矽酸鋰玻璃陶瓷之欲加工區的材料並成形出一具有一最終外觀之二矽酸鋰玻璃陶瓷,且該脈衝式雷射的脈衝寬度小於等於10-9秒。該二矽酸鋰玻璃陶瓷之最終外觀是取決於其最終應用,舉例來說,當該二矽酸鋰玻璃陶瓷是應用於牙冠重建時,則該最終外觀是一牙冠的外觀。
The
較佳地,該研磨步驟21之氧化矽對氧化鋰的莫爾比值是介於2.1至2.5間。更佳地,該研磨步驟21中的混合物還至少含有一選自下列所構成之群組的氧化物粉末:氧化鋯(SiO2)、氧化鋁(Al2O3)、氧化鎂(MgO)、氧化鉀(K2O)及氧化磷(P2O5)。
Preferably, the molar ratio of silicon oxide to lithium oxide in the
此處須說明的是,基於二矽酸鋰玻璃陶瓷是屬於熱傳率極低的材料,一旦二矽酸鋰玻璃陶瓷因吸收熱能而無法迅速移除 時,則極為容易造成二矽酸鋰玻璃陶瓷碎裂。此外,當二矽酸鋰玻璃陶瓷的結晶度越低[即,非晶質(amorphous)的玻璃相比例越高]時,則雷射光越容易於二矽酸鋰玻璃陶瓷表面產生反射,並且亦大量穿透產生折射,致使雷射光無法聚焦於二矽酸鋰玻璃陶瓷的欲加工區的材料移除處,而造成欲加工區的材料移除處所能吸收的雷射光能相對較少,最終無法有效將材料移除;相反地,當二矽酸鋰玻璃陶瓷的結晶度越高(即,非晶質的玻璃相比例越低)時,雷射光較不易產生反射與折射,使得雷射光可以完全聚焦於二矽酸鋰玻璃陶瓷的欲加工區的材料移除處,以藉由大量的雷射光能有效將材料移除,進而達到雷射雕銑之目的。 It should be noted here that based on the lithium disilicate glass ceramic is a material with extremely low heat transfer rate, once the lithium disilicate glass ceramic cannot be quickly removed due to the absorption of heat energy It is extremely easy to cause the lithium disilicate glass ceramic to break. In addition, when the crystallinity of lithium disilicate glass ceramics is lower [that is, the phase ratio of amorphous glass is higher], the laser light is more likely to be reflected on the surface of lithium disilicate glass ceramics, and also A large amount of penetration produces refraction, so that the laser light cannot be focused on the material removal part of the lithium disilicate glass ceramic to be processed, and the material removal part of the material to be processed area can absorb relatively little laser light energy, and ultimately cannot Effectively remove materials; on the contrary, when the crystallinity of lithium disilicate glass ceramics is higher (that is, the phase ratio of amorphous glass is lower), the laser light is less likely to be reflected and refracted, so that the laser light can be completely Focus on the material removal part of the lithium disilicate glass ceramic to be processed, so that the material can be effectively removed by a large amount of laser light to achieve the purpose of laser engraving and milling.
經上段的詳細說明可知,基於高結晶度的二矽酸鋰玻璃陶瓷具有較佳的雷射光能吸收性,而為了避免本發明執行該雷射加工步驟S26時,因高結晶度的二矽酸鋰玻璃陶瓷瞬間吸收大量雷射光能而蓄熱導致材料碎裂,較佳選擇以脈衝式雷射進行加工,特別是選自奈秒雷射、皮秒雷射,或飛秒雷射;於本發明中,該至少兩階段熱處理步驟25所形成之二矽酸鋰玻璃陶瓷之結晶度較佳是介於50%至95%間。
It can be seen from the detailed description in the previous paragraph that the high crystallinity lithium disilicate glass ceramic has better laser light energy absorption. In order to avoid the present invention performing the laser processing step S26, the high crystallinity disilicate glass Lithium glass ceramics instantly absorb a large amount of laser light energy and heat storage to cause material fragmentation. It is better to choose pulsed laser for processing, especially selected from nanosecond laser, picosecond laser, or femtosecond laser; in the present invention Among them, the crystallinity of the lithium disilicate glass ceramic formed in the at least two-stage
更佳地,該雷射加工步驟S26之脈衝式雷射的掃描速度是介於600mm/sec至1000mm/sec間;該雷射加工步驟S26之脈衝式雷射對該二矽酸鋰玻璃陶瓷的單位時間移除量是介於11.8 mm3/min至60mm3/min間。 More preferably, the scanning speed of the pulsed laser in the laser processing step S26 is between 600mm/sec and 1000mm/sec; the pulsed laser in the laser processing step S26 has an effect on the lithium disilicate glass ceramic The amount of removal per unit time is between 11.8 mm 3 /min to 60 mm 3 /min.
較佳地,本發明該實施例之加工方法於該雷射加工步驟S26後還包含一加工後熱處理步驟。該加工後熱處理步驟是對該二矽酸鋰玻璃陶瓷施予500℃至800℃間之0.1小時至2小時間的熱處理,其目的是在於,消除該二矽酸鋰玻璃陶瓷於實施該雷射加工步驟S26時所累積的熱應力(thermal stress)。 Preferably, the processing method of this embodiment of the present invention further includes a post-processing heat treatment step after the laser processing step S26. The post-processing heat treatment step is to subject the lithium disilicate glass ceramic to a heat treatment between 500° C. and 800° C. for 0.1 hour to 2 hours. The purpose is to eliminate the lithium disilicate glass ceramic during the laser application. Thermal stress accumulated in the processing step S26.
參閱圖3,是本發明根據上述實施例之加工方法所成形出的一比較例1之二矽酸鋰玻璃的外觀形貌。該比較例1是二矽酸鋰玻璃(非晶質;即,100%之玻璃相),其雷射加工步驟S26是使用頻率為1183kHz之輸出功率為50W的皮秒雷射,且掃描速度為1000mm/sec。由圖3顯示可知,該二矽酸鋰玻璃(非晶質)僅能有0.38mm的加工深度,且經實施完該雷射加工步驟S26後產生破裂。 Referring to FIG. 3, it is the appearance and morphology of a lithium disilicate glass of Comparative Example 1 formed by the processing method of the above-mentioned embodiment of the present invention. This comparative example 1 is lithium disilicate glass (amorphous; that is, 100% glass phase), and its laser processing step S26 is to use a picosecond laser with a frequency of 1183kHz and an output power of 50W, and the scanning speed is 1000mm/sec. As shown in FIG. 3, it can be seen that the lithium disilicate glass (amorphous) can only have a processing depth of 0.38 mm, and cracks occur after the laser processing step S26 is performed.
參閱圖4,是本發明根據上述實施例之加工方法所成形出的一比較例2之二矽酸鋰玻璃陶瓷的外觀形貌,其雷射加工步驟S26所執行的參數是相同於該比較例1,不同處是在於,該比較例2所述二矽酸鋰玻璃陶瓷具有70%之玻璃相(非晶質)與30%之二矽酸鋰陶瓷相(結晶相)。由圖4顯示可知,該二矽酸鋰玻璃陶瓷的加工深度約0.49mm,且經實施完該雷射加工步驟S26後產生有裂痕。 Referring to FIG. 4, it is the appearance of a lithium disilicate glass ceramic of Comparative Example 2 formed by the processing method of the foregoing embodiment of the present invention. The parameters performed in the laser processing step S26 are the same as those of the Comparative Example. 1. The difference is that the lithium disilicate glass ceramic of Comparative Example 2 has 70% glass phase (amorphous) and 30% lithium disilicate ceramic phase (crystalline phase). As shown in FIG. 4, it can be seen that the processing depth of the lithium disilicate glass ceramic is about 0.49 mm, and cracks are generated after performing the laser processing step S26.
參閱圖5,是本發明根據上述實施例之加工方法所成形出的一具體例1之二矽酸鋰玻璃陶瓷的外觀形貌,其雷射加工步驟 S26所執行的參數是相同於該比較例1,不同處是在於,該具體例1之二矽酸鋰玻璃陶瓷具有50%之玻璃相(非晶質)與50%之二矽酸鋰陶瓷相(結晶相)。由圖5顯示可知,該二矽酸鋰玻璃陶瓷的加工深度可提升至0.57mm,且經實施完該雷射加工步驟S26後僅產生有微裂痕。 Referring to FIG. 5, it is the appearance of a lithium disilicate glass ceramic of specific example 1 formed by the processing method of the above-mentioned embodiment of the present invention, and its laser processing steps The parameters executed by S26 are the same as those of Comparative Example 1, except that the lithium disilicate glass ceramic of this specific example 1 has 50% glass phase (amorphous) and 50% lithium disilicate ceramic phase. (Crystal phase). As shown in FIG. 5, it can be seen that the processing depth of the lithium disilicate glass ceramic can be increased to 0.57 mm, and after the laser processing step S26 is performed, only micro cracks are generated.
參閱圖6,本發明根據上述實施例之加工方法所成形出的一具體例2之二矽酸鋰玻璃陶瓷的外觀形貌,其雷射加工步驟S26所執行的參數是相同於該比較例1,不同處是在於,該具體例2之二矽酸鋰玻璃陶瓷具有30%之玻璃相(非晶質)與70%之二矽酸鋰陶瓷相(結晶相)。由圖6顯示可知,該二矽酸鋰玻璃陶瓷的加工深度可進一步地提升至0.68mm,且經實施完該雷射加工步驟S26後的外觀形貌完整無微裂痕產生。 Referring to FIG. 6, the appearance and morphology of a lithium disilicate glass ceramic of specific example 2 formed by the processing method of the above-mentioned embodiment of the present invention, the parameters executed in the laser processing step S26 are the same as those of the comparative example 1. The difference is that the lithium disilicate glass ceramic of this specific example 2 has 30% glass phase (amorphous) and 70% lithium disilicate ceramic phase (crystalline phase). As shown in FIG. 6, the processing depth of the lithium disilicate glass ceramic can be further increased to 0.68 mm, and the appearance of the laser processing step S26 is complete without microcracks.
綜上所述,本發明二矽酸鋰玻璃陶瓷的加工方法係透過提高二矽酸鋰玻璃陶瓷的結晶度至大於等於50%,並且配合脈衝式雷射的非連續作用,以於提升雷射光能吸收率的同時避免大量熱能持續性的蓄積;如此一來,當以脈衝雷射聚焦於二矽酸鋰玻璃陶瓷的欲加工區的材料移除處時,除可防止加工過程因熱能連續性的累積而致其碎裂之問題外,更能因二矽酸鋰玻璃陶瓷的高結晶度而使雷射光能聚焦,藉此達到材料移除的較佳效果,實現本發明之目的。 In summary, the method for processing lithium disilicate glass ceramics of the present invention improves the laser light by increasing the crystallinity of lithium disilicate glass ceramics to greater than or equal to 50%, and with the discontinuous action of pulsed lasers. Energy absorption rate while avoiding the continuous accumulation of a large amount of heat energy; in this way, when the pulse laser is used to focus on the material removal part of the lithium disilicate glass ceramic to be processed, in addition to preventing the processing process due to thermal continuity In addition to the problem of fragmentation caused by the accumulation of lithium disilicate glass ceramics, the high crystallinity of the lithium disilicate glass ceramic can focus the laser light energy, thereby achieving a better effect of material removal and achieving the purpose of the present invention.
惟以上所述者,僅為本發明的實施例而已,當不能以此 限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。 However, the above are only examples of the present invention. To limit the scope of implementation of the present invention, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the patent of the present invention.
21:研磨步驟 21: Grinding step
22:煅燒步驟 22: Calcination step
23:熔融步驟 23: melting step
24:成形步驟 24: forming steps
25:至少兩階段熱處理步驟 25: At least two-stage heat treatment steps
26:雷射加工步驟 26: Laser processing steps
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CN107397683A (en) * | 2017-07-13 | 2017-11-28 | 深圳市牙尚科技有限公司 | A kind of ceramic tooth veneer and preparation method thereof |
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CN107397683A (en) * | 2017-07-13 | 2017-11-28 | 深圳市牙尚科技有限公司 | A kind of ceramic tooth veneer and preparation method thereof |
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