TWI696206B - Electron ray generation device and electron ray application device - Google Patents

Abstract

An object of the present invention is to provide an electron ray generation device and an electron ray application device that are easy to maintain.

The electron beam generating device includes a vacuum chamber, a photocathode support, an activation container, and a power transmission member in the chamber. The photocathode support can move relatively to the activation container.

Description

Electron ray generation device and electron ray application device

The present invention relates to an electron beam generator (electron beam generator) and an electron beam applicator (electron beam applicator), in particular to an electron beam generator (photocathode holder) capable of relatively moving against an activated container And electron beam application device.

For the electron beam source (GaAs photocathode electron beam source) using a photocathode of a GaAs semiconductor, the following contributions have been made to the field of accelerator science: as spin polarization with a high degree of polarization ( spin polarization) basic particles of electron beam sources, physics experiments of hadrons (precision measurement of Weinberg angle), high brightness (luminance) that can repeat short pulses with high height and large current InfraRed Free Electron Laser (InfraRed Free Electron Laser) generation of 1kW of electron beam source, etc.

Further, the GaAs type photocathode electron beam source is used as an accelerator for the next-generation radiation light source and can be used at a low emissance The area occupied by the bit space) is a powerful candidate for a high-current high-brightness electron beam source, and the linear next-generation accelerator project "International Linear Collider Project" near the mystery of the birth of the universe. It is considered to be the only practical high-performance spin-polarized electron beam source.

On the other hand, for the miniaturization of semiconductor devices or the advancement of functional materials, the measurement of electrical properties and magnetic properties within the structure are combined with detailed structural analysis or elemental analysis on an atomic scale It is considered indispensable. For this requirement, the next generation of observation technology and measurement technology that surpass the existing performance are required. Among them, the high performance of the electron beam source as an element technology is indispensable. From the point of view of the performance of high repetitive short pulse, high brightness and high spin polarization, the GaAs photocathode electron beam source is regarded as a powerful electron beam source for the next generation electron microscope.

The GaAs type photocathode electron beam source system utilizes negative electron affinity (Negative Electron Affinity (the following may describe "negative electron affinity" as "NEA")) (negative electron affinity surface: the vacuum level becomes Lower than the bottom of the conduction band). By using the NEA surface, electrons that have been excited from the valence band light to the potential level at the bottom of the conduction band can thus be taken out into the vacuum as electron beams. Figure 1 shows the concept of electron beam generation from a GaAs photocathode electron beam source, which can explain the phenomenology of the three-step model of (1) excitation process (2) diffusion process (3) extraction process ( Refer to Non-Patent Document 1).

(1) The excitation light is injected into the photocathode to excite the valence band electrons to the conduction band (excitation process).

(2) The electron system excited by the conduction band diffuses to the surface (diffusion process).

(3) The electron system that has reached the surface pulls out the surface barrier as a tunnel into the vacuum (extraction process).

In GaAs semiconductors, there is an electron affinity (Electron Affinity; EA) of about 4 eV (the energy difference between the vacuum level and the conduction band bottom). In order to form the NEA surface state, the following process is necessary.

(1) First, a p-type doping GaAs semiconductor is heated in a vacuum to remove surface impurities such as oxides or carbides for cleaning. In this way, band bending can be caused in the surface area, and the vacuum level can be reduced by about half of the semiconductor bandgap (φ B).

(2) Next, in order to obtain a tiny photocurrent on the crystal surface, cesium is first vapor-deposited as shown in FIG. 2, and then, each time the photocurrent is saturated, cesium vapor deposition and oxygen addition are repeatedly repeated until the Until the maximum photocurrent is obtained. According to this method, the NEA surface state can be formed by lowering the remaining vacuum level (φ D) (see Non-Patent Document 1).

In addition, the NEA surface state refers to a case where the energy level of the vacuum level of the photocathode is set to a state lower than the energy level of the bottom of the conduction band according to the above procedure. However, even if the energy level of the vacuum level of the photocathode is higher than the energy level of the bottom of the conduction band, electrons can be released from the photocathode into the vacuum. Also, even if the photocathode is processed into After the surface state of NEA, if the electrons are continuously released, there will be the following situation: the energy level of the vacuum level of the photocathode returns from a lower level than the energy level at the bottom of the conduction band to a high level and releases electrons. Therefore, when a photocathode is used as an electron beam source, although it is preferable to reduce the energy level of the vacuum level of the photocathode as much as possible, it is not necessary to set or maintain the NEA surface state. Therefore, the "electron affinity reduction process" in the present invention refers to a process for reducing the energy level of the vacuum level of the photocathode to a level capable of releasing electrons. In the following, the "electron affinity reduction process" is described as "EA surface treatment", and the energy level of the photocathode vacuum level is reduced to a state where electrons can be released by the "electron affinity reduction process" The case described as "EA surface".

The EA surface deteriorates due to the adsorption of trace amounts of residual gas such as H ₂ O, CO, CO ₂ , or the backflow of ionized residual gas toward the EA surface. Therefore, in order to take out the electron beam from the photocathode stably for a long period of time, in order to handle and maintain, ultra-high vacuum is necessary. In addition, the amount of electrons that can be taken out of the photocathode that has been surface-treated with EA is limited. After a certain amount of electron beams are released, it is necessary to subject the photocathode surface to EA surface treatment again.

A conventional electron gun using a photocathode that has been surface-treated by EA includes at least a EA surface-processing chamber (chamber), an electron gun chamber, and a photocathode that has been surface-treated by EA. As mentioned above, The photocathode after the EA surface treatment must be EA treated in an ultrahigh vacuum to maintain the ultrahigh vacuum state and be loaded into the electron gun without being exposed to outside air. In addition, after a certain period of time, it is necessary to perform the EA surface treatment again, but Conventionally, the EA surface treatment chamber and the electron gun chamber must be set separately. The reason is that although the conventional EA surface treatment is a method of directly depositing surface treatment material on the photocathode in the chamber, if EA surface treatment is performed in the same chamber, the EA surface treatment material will adhere to the electron gun chamber and Various devices in the chamber, especially the EA surface treatment material that has been attached near the electrode, will cause the electric field to release dark current, which significantly reduces the function of the electron gun.

However, in the case where the EA surface treatment chamber and the electron gun chamber are separately provided, first two chambers set to an ultra-high vacuum state are required, and furthermore, a photoelectric chamber that has been processed in the EA surface treatment chamber is required. Since the cathode is continuously transported to the electron gun chamber while maintaining an ultra-high vacuum state, there is a problem that the electron gun device will be very large. In addition, due to the need to move the EA surface-treated photocathode from the EA surface treatment chamber while maintaining ultra-high vacuum, install it into the electron gun chamber, and move and install it from the electron gun chamber when the photocathode is EA surface-treated again Due to the EA surface treatment chamber, it is necessary to design the device precisely and appropriate operation to prevent the photocathode from falling off during transportation, and there is a problem that the device management becomes complicated.

Therefore, in order to solve the above problems, Patent Document 1 (Japanese Patent No. In No. 5808021), an activation container for processing to reduce the electron affinity of the photocathode material is placed in a vacuum chamber. That is, in Patent Document 1, a chamber for generating electron beams and a chamber for performing EA surface treatment are shared.

[Prior Technical Literature]

[Patent Literature]

Patent Literature 1: Japanese Patent No. 5808021.

[Non-patent literature]

Non-Patent Literature 1: MRS-J NEWS, Vol. 20, No. 2, May 2008.

In addition, Patent Document 1 describes a drive structure provided to change the position of the photocathode support. In Patent Document 1, a drive structure such as a motor is attached to the activation container or the inside of the vacuum chamber.

However, when the motor is arranged in the vacuum chamber, the following problems occur. First, in the process of setting the vacuum chamber to a high vacuum state, it is necessary to heat the vacuum chamber (for example, about 200 degrees Celsius), but the motor or the magnet may be weakened by this heating or the like. In the case of a motor failure, the vacuum state in the vacuum chamber must be released to repair or deliver the motor change. It takes a long time (for example, one week) to set the vacuum chamber to a high vacuum state. Therefore, if a motor failure is found after the high vacuum state is realized, the preparation work that takes a long time to realize the high vacuum state becomes in vain because of the repair or exchange of the motor. Second, the motor system includes magnetic field generating members such as magnets. Therefore, the orbit of the electrons taken out of the photocathode material will be distorted by the magnetic field generating member.

Therefore, an object of the present invention is to provide an electron beam generating device and an electron beam applying device which are easy to maintain. In addition, any additional object of the present invention is to provide the following electron beam generating device and electron beam application device: the electron beam generating device in which the activation container is arranged in the vacuum chamber is not provided with a motor for generating a magnetic field in the vacuum chamber It is possible to suppress the deviation of the orbit of the electron beam from the desired orbit.

As shown below, the present invention relates to electron beam generating devices and electron beam applications.

(1) An electron ray generating device, comprising: a vacuum chamber; a photocathode support, which is arranged in the vacuum chamber to support the photocathode material; an activation container, which is arranged in the vacuum chamber, Supporting a surface treatment material that reduces the electron affinity of the aforementioned photocathode material; and a power transmission member in the chamber, which is arranged in the aforementioned vacuum chamber Inside, the drive force is transmitted to the photocathode support or the activation container; the photocathode support is capable of relatively moving against the activation container.

(2) The electron beam generating device according to (1) above, further comprising: an energy generating section for generating mechanical energy for driving the power transmission member in the chamber; the energy generating section is arranged in the vacuum Outside the chamber.

(3) The electron beam generating device according to (2) above, wherein the energy generating unit is a driving source or a manual operation member.

(4) The electron beam generating device according to any one of (1) to (3) above, further comprising an external power transmission member disposed outside the vacuum chamber; the external power transmission member and The power transmission member in the chamber is connected via a holeless wall of the vacuum chamber to transmit power.

(5) The electron beam generating device as described in (4) above, wherein the power transmission member outside the chamber transmits the driving force purely mechanically to the power transmission member inside the chamber.

(6) The electron beam generating device according to any one of (1) to (5) above, wherein the power transmission member in the chamber is disposed at a position that has been deviated from the center of the center axis of the photocathode support.

(7) The electron beam generating device as described in any one of (1) to (6) above, further comprising: a guide member arranged in the vacuum chamber and along the first direction Extension; the guide member guides the movement of the power transmission member in the chamber along the first direction.

(8) The electron beam generating device according to any one of (1) to (7) above, wherein the power transmission member in the chamber has: a rotating member; and a conversion mechanism that converts the rotation of the rotating member into The linear movement of the photocathode support or the activation container.

(9) The electron beam generating device described in any one of (1) to (8) above, further comprising: an anode, which has been disposed in the vacuum chamber; and a shield, It is used to suppress the discharge from the protrusions in the vacuum chamber; the shield is arranged between the anode and at least a part of the power transmission member in the chamber.

(10) The electron ray generating device as described in any one of (1) to (9) above, wherein the activation container has a first hole capable of supplying electrons or electrons released from the photocathode material or The photocathode material passes through; and the second hole is inserted through the power transmission member in the chamber.

(11) The electron beam generating device according to any one of (1) to (10) above, wherein the vacuum chamber includes a telescopic portion; the photocathode support or the foregoing is moved by expanding and contracting the telescopic portion Activation container.

(12) The electron beam generating device according to (11) above, wherein the telescopic portion is a part of a body portion constituting the vacuum chamber, or is mounted on the top of the vacuum chamber.

(13) The electron beam generating device according to (1) above, further comprising: an energy generating section for generating thermal energy for driving the power transmitting member in the chamber.

(14) An electron ray application device including the electron ray generation device described in any one of (1) to (13); the electron ray application device Department of electron guns, free electron laser accelerators, electron microscopes, electron beam holography (electron beam holography) devices, electron beam drawing devices, electron beam diffraction (electron beam diffraction) devices, electron beam inspection devices, electron beam metal deposition modeling Device, electron beam lithography device, electron beam processing device, electron beam hardening device, electron beam sterilization device, electron beam sterilization device, plasma generation device, atomic element generation device, spin Polarized electron ray generation device, cathode luminescence device or backlight electron spectroscopic device.

According to the present invention, it is possible to provide an electron ray generation device and an electron ray application device which are easy to maintain.

1‧‧‧ Electron ray generator

2‧‧‧Vacuum chamber

3‧‧‧Photocathode support

3a‧‧‧Back

3b‧‧‧rod

3c‧‧‧Female screw part

3d‧‧‧heater

4‧‧‧Activated container

5‧‧‧Power transmission mechanism

5a‧‧‧Outdoor power transmission member

5b‧‧‧Power transmission member in the chamber

7‧‧‧Energy Generation Department

7a‧‧‧Drive source

7b‧‧‧Manually operated components

10‧‧‧Electronic gun

11‧‧‧EA surface treatment chamber

12‧‧‧Electronic gun chamber

13‧‧‧Transport structure

20、20a‧‧‧Body

21‧‧‧Top

21a‧‧‧Flange

22, 26‧‧‧ Telescopic Department

24‧‧‧No hole wall

28‧‧‧Second flange part

30‧‧‧Electrical insulating member

42‧‧‧Supporting member

44-1‧‧‧First hole

44-2‧‧‧Second hole

45‧‧‧ hole

52‧‧‧Guiding member

53‧‧‧axis

54‧‧‧Universal joint

58‧‧‧First flange part

58c‧‧‧Screw hole

58d‧‧‧Through hole

59‧‧‧Screw rod

60a, 60b‧‧‧Import terminal

60a1, 60b1‧‧‧End in the vacuum area

60a2‧‧‧Outer end of vacuum area

61a, 61b, 61c ‧‧‧ bare wire

62‧‧‧First terminal block

63‧‧‧Second terminal block

64‧‧‧Contact

72‧‧‧Operation knob

74‧‧‧Telescopic tube

76‧‧‧ cylinder

78‧‧‧ Piston

80‧‧‧Light source

81‧‧‧light through the window

82‧‧‧Anode

83‧‧‧Power Department

88‧‧‧Shield

88a‧‧‧Outer surface

91‧‧‧Vacuum pump

92‧‧‧Gas supply device

95‧‧‧Heating structure

96‧‧‧cut

97‧‧‧Direction control structure

98‧‧‧Direction control board

100‧‧‧Electronic ray application device

220‧‧‧Inner tube

222‧‧‧Outer cylinder

224‧‧‧membrane

531‧‧‧ First axis

532‧‧‧Second axis

533‧‧‧rotating member

533c‧‧‧Male screw

541‧‧‧The first universal joint

542‧‧‧Second universal joint

580‧‧‧Guiding member

A‧‧‧Photocathode material

AR, AR’‧‧‧ region

AX1‧‧‧Central axis

AX2‧‧‧rotation axis

B‧‧‧Surface treatment materials

C1‧‧‧ Room 1

C2‧‧‧Second Room

D1‧‧‧arrow

P‧‧‧Pump

P ₀ ‧‧‧Internal pressure

P ₁ , P ₂ ‧‧‧ pressure

V‧‧‧Valve

Z‧‧‧ direction

FIG. 1 shows the concept of electron beam generation from a GaAs type photocathode electron beam source.

Fig. 2 shows the formation order of the surface state of EA.

3 is a schematic cross-sectional view of the electron beam generating device in the first embodiment.

4 is a schematic cross-sectional view of the electron beam generating device in the first embodiment.

5 is a schematic cross-sectional view showing an example of a driving source.

FIG. 6 is a conceptual diagram showing an example of a telescopic section.

7 is a schematic cross-sectional view of an electron beam generating device in a second embodiment.

FIG. 8A is an enlarged view of the area AR in FIG. 7.

Fig. 8B is an enlarged view of the area AR' in Fig. 7.

9 is a schematic cross-sectional view of an electron beam generating device in a third embodiment.

(A) in FIG. 10 and (b) in FIG. 10 are diagrams schematically showing an example of a heating structure.

FIG. 11 is a diagram schematically showing an example of a direction control structure.

12 is a diagram schematically showing an example of the arrangement of electrodes.

FIG. 13 is a functional block diagram of an electron beam application device.

Hereinafter, referring to the drawings, the electron beam generating device 1 and the electron beam applying device 100 in the embodiment will be described in detail. In addition, in this specification, the same or similar symbols are attached to members having the same function. In addition, there may be cases where duplicate descriptions are omitted for components that have been given the same or similar symbols.

(Definition of direction)

In this specification, the direction in which the photocathode support 3 moves toward the first hole 44-1 of the activation container 4 is defined as the Z direction. It is also possible to travel the electrons emitted from the photocathode (photocathode material) instead. The direction is defined as the Z direction. Although the Z direction is, for example, a vertically downward direction, the Z direction is not limited to the vertically downward direction.

(Outline of the first embodiment)

The electron beam generating device 1 in the first embodiment will be described with reference to FIGS. 3 to 6. 3 and 4 are schematic cross-sectional views of the electron beam generating device 1 in the first embodiment. FIG. 5 is a schematic cross-sectional view showing an example of the driving source 7a. FIG. 6 is a conceptual diagram showing an example of a telescopic section. 3 shows the position of the photocathode support 3 when performing the EA surface treatment, and FIG. 4 shows the position of the photocathode support 3 when performing the electron beam generation process. In FIG. 4, the hatched portion indicates the vacuum area in the vacuum chamber 2. Further, in FIG. 4, the arrow D1 indicates the direction in which the electrons emitted from the photocathode (that is, the photocathode material A) travel.

The electron beam generating device 1 is a device that generates electron beams in a vacuum atmosphere. The vacuum atmosphere is realized in the vacuum chamber 2. Incidentally, the electron beam generating device 1 may be a device that generates electron beams at a high voltage. In this case, the direction of the electrons released from the photocathode depends on the electric field in the vacuum chamber when the high voltage is applied.

The electron beam generating device 1 includes a vacuum chamber 2, a photocathode support 3, an activation container 4, and a chamber power transmission member 5b arranged in the vacuum chamber.

The vacuum chamber 2 is a member for forming a vacuum atmosphere in the electron beam generating device 1. When the electron beam generating device 1 is used, the internal pressure of the vacuum chamber 2 is set to, for example, 10 ^-5 Pa or less. In order to reduce the internal pressure of the vacuum chamber 2, a vacuum pump 91 is used. The vacuum pump 91 is prepared separately from the electron beam generating device 1, for example, and is connected to the electron beam generating device 1 via piping. In addition, a gas supply device 92 may be connected to the vacuum chamber 2 via piping, and the gas supply device 92 may supply gas for EA surface treatment. The gas supplied by the gas supply device 92 is, for example, oxygen, NF ₃ , N ₂ or the like.

The shape of the vacuum chamber 2 is not particularly limited, and the shape of the vacuum chamber 2 is, for example, a cylindrical shape. In the example shown in FIG. 3, the vacuum chamber 2 includes a body portion 20, a top portion 21, and a bottom portion. The material of the vacuum chamber 2 is, for example, metal such as stainless steel, titanium, mu-metal, non-metal such as glass, sapphire, and ceramic.

The photocathode support 3 is arranged in the vacuum chamber 2 to support the photocathode material A. In the example shown in FIG. 3, the photocathode support 3 is disposed in the activation container 4, and the activation container 4 is disposed in the vacuum chamber 2.

The photocathode support 3 can move relatively to the activation container 4. When the photocathode support 3 is in the position shown in FIG. 3, the active The surface treatment material B supported by the sexualization container 4 is activated (vaporized), whereby the surface treatment material B can be vapor-deposited on the photocathode material A. In addition, when the photocathode support 3 is in the position shown in FIG. 4, the photocathode material A supported by the photocathode support 3 is irradiated with light, whereby electrons (electron rays) can be generated from the photocathode material A.

In addition, the material of the photocathode support 3 is not particularly limited. For example, molybdenum, titanium, tantalum, stainless steel, or the like can be used as the material of the photocathode support 3.

In addition, the photocathode material A used to form the photocathode is not particularly limited as long as it can be surface-treated with EA. As the photocathode material A, for example, group III-V semiconductor materials and group II-V semiconductor materials are exemplified. Specifically, examples include AlN, Ce ₂ Te, GaN, K ₂ CsSb, AlAs, GaP, GaAs, GaSb, InAs, and the like. Other examples of the metal as the photocathode material A are given, and specific examples include Mg, Cu, Nb, LaB ₆ , SeB ₆ , and Ag. By subjecting the photocathode material A to EA surface treatment, a photocathode can be produced. In the case of using a photocathode in which the photocathode material A has been used, it becomes possible to select electron excitation light in the near ultraviolet-infrared wavelength region corresponding to the gap energy of the semiconductor. Moreover, by selecting the material and structure of the semiconductor, the performance of the electron beam source (quantum yield, durability, monochromaticity, time response, spin polarization) corresponding to the application of the electron beam becomes feasible. Therefore, the light source for electronic excitation is not limited to high output (watt level)-high frequency (hundreds of MHz)-short pulse (hundreds of femto seconds) laser. Even relatively low-cost laser diodes (laser diodes) have become capable of beam generation with unprecedented high performance.

When the electron beam generating device 1 is used, the photocathode material A is irradiated with light. The photocathode material A emits electrons when it receives light. In the example shown in FIG. 4, the released electrons move in the Z direction by the voltage applied between the photocathode support 3 and the anode 82.

The photocathode material A is arranged at a position where the photocathode material A can be irradiated with light. In the example shown in FIG. 4, the photocathode material A is arranged on the bottom surface of the photocathode support 3.

In the examples described in FIGS. 3 and 4, in order to move the photocathode support 3 between the position shown in FIG. 3 and the position shown in FIG. 4, the photocathode support 3 is given a driving force .

The activation container 4 is arranged in the vacuum chamber 2 to support the surface treatment material B that reduces the electron affinity of the photocathode material A. The surface treatment material B is activated (vaporized) in the activation container 4. Next, the activated (vaporized) surface treatment material B is vapor-deposited on the photocathode material A.

The activation container 4 includes a first hole 44-1. The first hole 44-1 is able A hole through which the photocathode material A supported by the photocathode support 3 passes, or a hole through which electrons released from the photocathode material A can pass. The size of the first hole 44-1 only needs to be at least a size through which electrons can pass. From the viewpoint of ease of processing, or from the viewpoint of easy adjustment of the positional relationship between the electrons released from the photocathode material A and the first hole 44-1, the diameter of the first hole 44-1 is, for example, 1 nm More than 10mm or less, more preferably 50μm or more and 5mm or less. In addition, when the photocathode material A is exposed to the outside of the activation container 4 through the first hole 44-1 (see FIG. 4), the size of the first hole 44-1 may be larger than the upper limit of the above-mentioned numerical range.

The material of the activation container 4 is not particularly limited. For example, a heat-resistant material such as glass, molybdenum, ceramics, sapphire, titanium, tungsten, tantalum, stainless steel, etc. (e.g., a heat-resistant material that can withstand heat of 300°C or higher, more preferably a heat of 400°C) can be used as the activation container 4 Material.

The shape of the activation container 4 is not particularly limited. The shape of the activation container 4 should just be a shape which can support the surface treatment material B inside. The shape of the activation container 4 is, for example, a cylindrical shape.

The inside of the activation container 4 and the outside of the activation container 4 are communicated through the first hole 44-1 or other holes 45. Therefore, the internal pressure of the activation container 4 is substantially equal to the external pressure of the activation container 4. Since the activation container 4 is disposed in the vacuum chamber 2, the interior of the activation container 4 is also maintained in a vacuum state when the electron beam generating device 1 is used.

When the electron beam generating device 1 is used, the photocathode material A emits electrons. Since the amount of electrons that can be taken out from the photocathode material A is limited, it is necessary to subject the photocathode surface to EA surface treatment again. In the electron beam generating apparatus 1 of the embodiment, both electron beam generation and EA surface treatment can be performed in a single vacuum chamber 2. That is, in the state shown in FIG. 3, if the activation container 4 or the surface treatment material B itself is heated to activate (vaporize) the surface treatment material B, the surface treatment material B is vapor-deposited on the photocathode material A. In this way, EA surface treatment can be performed. In the state shown in FIG. 4, if the photocathode material A is irradiated with light, electron beams can be generated.

In this specification, the surface treatment material B means a material capable of subjecting the photocathode material to EA surface treatment. The surface-treated material B is not particularly limited as long as it can be subjected to EA surface treatment. For example, Li, Na, K, Rb, Cs, Te, Sb, etc. are exemplified as elements constituting the surface treatment material B. In addition, among the aforementioned elements, Li, Na, K, Rb, and Cs ignite spontaneously and cannot be stored or used. Therefore, it is necessary for Li, Na, K, Rb, and Cs to be used in the form of a composite element of these elements or a compound containing these elements. On the other hand, when used in the form of a compound, it is necessary to prevent impurity gas from being generated during the vapor deposition of the aforementioned elements. Therefore, when an element selected from Li, Na, K, Rb, and Cs is used as the surface treatment material B, it is preferably used in combination with the following reducing agent: suppression of Cs ₂ CrO ₄ and Rb ₂ CrO ₄ , Na ₂ CrO ₄ , K ₂ CrO ₄ and other compounds and the reducing agent generated by the impurity gas. The surface treatment material B is vaporized in the activation container 4 using a heating structure, and is vapor-deposited on the photocathode material A.

In the examples shown in FIGS. 3 and 4, the activation container 4 is fixed to the inner wall surface of the vacuum chamber 2 and cannot move relative to the wall surface of the vacuum chamber 2. Then, the driving force is transmitted from the power transmission member 5 b in the chamber to the photocathode support 3, and the photocathode support 3 moves relative to the activation container 4. In addition, as in the third embodiment described later, the activation container 4 may be fixed in the vacuum chamber 2 via the support member. Alternatively, the photocathode support 3 may be fixed to the wall surface of the vacuum chamber 2, and the driving force may be transmitted from the power transmission member 5b in the chamber to the activation container 4. In this case, the activation container 4 moves relative to the photocathode support 3.

The power transmission member 5b in the chamber is arranged in the vacuum chamber 2 and is a member for transmitting the driving force to the photocathode support 3 or the activation container 4. In the first embodiment, the power transmission member 5b in the chamber is a non-magnet (non-magnet) member. In the example shown in FIG. 3, the number of power transmission members 5b in the chamber disposed in the vacuum chamber 2 is one, and the power transmission member 5b in the one chamber is a non-magnetic member. When the number of power transmission members 5b in the chamber disposed in the vacuum chamber 2 is N (in addition, "N" is a natural number of 1 or more), the power transmission members 5b in the N chambers are non-magnetic members. In addition, a non-magnetic member means a member that is not permanently magnetized, or a member that is weakly permanently magnetized even if it is permanently magnetized. Since the magnetic field (or weak magnetic field) is not generated, it is not appropriate for the photocathode material. A component that has a slight influence on the electron beam trajectory of electrons released from the material or on the electron beam trajectory of electrons released from the photocathode material. In the first embodiment, metals such as copper, titanium, stainless steel, and aluminum that cannot be permanently magnetized are used as the material of the power transmission member 5b in the chamber. In addition, in the first embodiment, in the case where a permanently magnetizable metal such as iron or nickel is used as the material of at least a part of the power transmission member 5b in the chamber, the member is arranged so The location of the impact.

In the first embodiment, the power transmission member 5b in the chamber is preferably a non-magnetic member. Therefore, the power transmission member 5b in the chamber does not substantially affect the orbit of the electron beam. This suppresses the deviation of the orbit of the electron beam from the desired orbit.

(A configuration example arbitrarily added in the first embodiment)

3 to 6, an example of a configuration that can be additionally adopted in the first embodiment will be described.

(Configuration example 1)

The configuration example 1 will be described with reference to FIG. 3. The configuration example 1 relates to a configuration example of the energy generating unit 7.

In the example shown in FIG. 3, the energy generating unit 7 generates mechanical energy for driving the power transmission member 5b in the chamber. Next, with energy The mechanical energy generated by the forming unit 7 is transmitted to the power transmission member 5b inside the chamber via the power transmission member 5a outside the chamber. In this way, the power transmission member 5b in the chamber is driven (in other words, the power transmission member 5b in the chamber moves). In addition, the power transmission member 5b in the chamber moves to give the photocathode support 3 a driving force. As a result, the photocathode support 3 moves relative to the activation container 4. As mentioned above, the "chamber power transmission member 5b" in this specification means a member for "transmitting" the mechanical energy generated by the energy generating section 7 to the photocathode support 3, and is different from A drive structure that generates a driving force by itself, such as a motor. In addition, in the example shown in FIG. 3, the power transmission member 5b and the photocathode support 3 in the chamber are one member manufactured by integral molding. Instead, the power transmission member 5b and the photocathode support 3 in the chamber may be individually manufactured, and the two may be connected via any coupling structure.

In the example shown in FIG. 3, the energy generating unit 7 is a drive source 7a for generating mechanical energy. The drive source 7a is, for example, an actuator. The actuator is, for example, an actuator driven by fluid pressure (pneumatic actuator, hydraulic actuator, etc.), an electric actuator, or a solenoid actuator.

FIG. 5 shows an example in which the drive source 7a is an actuator driven by fluid pressure. In the example shown in FIG. 5, the actuator includes a cylinder 76 and a piston 78. The piston 78 is arranged inside the cylinder 76 and is connected to the end of the telescopic portion 22 such as bellows. Piston 78 also has The function of the non-porous wall 24 connected to the telescopic portion 22. The piston 78 is moved by the fluid such as air and oil being supplied from the pump P into the first chamber C1 of the cylinder 76, or is discharged by being discharged from the first chamber C1 by fluid such as air and oil. The piston 78 is connected to the power transmission member 5b in the chamber. Therefore, when the piston 78 moves, the power transmission member 5b in the chamber also moves.

In the example shown in FIG. 5, the cylinder 76 includes a first chamber C1 and a second chamber C2. Further, the piston 78 by the differential pressure P2 of the lines within the pressure within the first chamber C1 P ₁ and the second chamber C2 to be driven. In addition, P ₀ is the internal pressure in the vacuum chamber 2. In the example shown in FIG. 5, the pressure-receiving surfaces of the cylinder 76 and the piston 78 have at least a function as a power transmission member outside the chamber.

In addition, a valve V is arranged in the piping for connecting the pump P and the first chamber C1, and the flow rate of the fluid flowing in the piping is adjusted by the valve V.

In the case of using an actuator as the driving source 7a, it is easy to position the photocathode support 3 at a desired position. In order to position the photocathode support 3 at a desired position, for example, to control the flow rate of the fluid supplied to the fluid pressure actuator, the current supplied to the electric actuator, or the solenoid actuator The current, etc.

In the configuration example 1, the energy generating unit 7 (more specifically, the driving source 7 a) is arranged outside the vacuum chamber 2. Therefore, even when the energy generating section 7 includes a magnetic field generating member such as a magnet, the magnetic field generating member The interference of the sub-ray trajectory also stops to a minimum. In addition, when the energy generating unit 7 does not include a magnetic field generating member, the energy generating unit 7 does not interfere with the electron beam trajectory.

Moreover, in the configuration example 1, since the energy generating part 7 (more specifically, the driving source 7a) is disposed outside the vacuum chamber 2, even when the temperature inside the vacuum chamber 2 becomes high temperature, The temperature rise of the energy generating unit 7 is suppressed. Therefore, the energy generating unit 7 is less likely to malfunction. Further, it is assumed that in the case where the energy generation unit 7 has failed, the repair of the energy generation unit 7 is also easy. For example, even if the failure of the energy generation unit 7 is determined after the vacuum chamber 2 has reached the high vacuum state, the energy generation unit 7 can be repaired while maintaining the high vacuum state in the vacuum chamber 2 as usual.

In addition, in the configuration example 1, the energy generator 7 (more specifically, the drive source 7a) is a linear actuator. Instead, the energy generating section 7 may also be a rotary actuator. In this case, a mechanism that converts the rotational driving force of the rotary actuator into a linear motion of the photocathode support can be provided. Furthermore, in the configuration example 1, the energy generating unit 7 may be a manual operation member instead of a driving source such as an actuator. In this case, mechanical energy is generated by human power.

In addition, in Configuration Example 1, an example in which the driving force is applied to the photocathode support tool and the photocathode support tool moves relative to the activation container has been described. Instead, it can be set to give a driving force and activity to the activation container The chemical container moves relative to the photocathode support. In this case, in the description of the above configuration example 1, the "photocathode support" and the "activation container" may be changed to the "activation container" and the "photocathode support", respectively.

(Configuration example 2)

The configuration example 2 will be described with reference to FIG. 3. Configuration example 2 is a configuration example of the power transmission mechanism 5.

In the configuration example 2, the energy generation unit 7 applies a driving force to the photocathode support 3 via the power transmission mechanism 5. As a result, the photocathode support 3 moves relative to the activation container 4. In the example shown in FIG. 3, the power transmission mechanism 5 includes a shaft disposed between the energy generating section 7 and the photocathode support 3.

In addition, the power transmission mechanism 5 is not limited to the shaft. The power transmission mechanism 5 may be a gear mechanism, a screw mechanism, a link mechanism, a crank mechanism, a universal joint, or other joint mechanisms, or a combination including these.

In the example shown in FIG. 3, part of the power transmission mechanism 5 (for example, shaft) is arranged inside the vacuum chamber 2, and part of the power transmission mechanism 5 (for example, shaft) is arranged outside the vacuum chamber 2. In other words, the power transmission mechanism 5 includes: a power transmission member 5a outside the chamber, which is arranged outside the vacuum chamber; The power transmission member 5b in the chamber is arranged in the vacuum chamber. Furthermore, the power transmission member 5a outside the chamber and the power transmission member 5b inside the chamber are connected via the non-porous wall 24 of the vacuum chamber 2 to transmit power. In addition, the power transmission member 5b inside the chamber may be referred to as a first power transmission member, and the power transmission member 5a outside the chamber may be referred to as a second power transmission member.

When a part of the power transmission mechanism 5 is inserted into the through-hole provided in the vacuum chamber, even if a seal member is provided to the through-hole, the deterioration of the vacuum degree in the vacuum chamber cannot be avoided. On the other hand, in the configuration example 2, the power transmission member 5a outside the chamber and the power transmission member 5b inside the chamber are connected via the non-porous wall 24 of the vacuum chamber 2 to transmit power. Therefore, the degree of vacuum in the vacuum chamber does not deteriorate.

As shown in FIG. 3, the electron beam generating apparatus 1 may also include a guide member 52 for guiding the movement of the power transmission member 5b in the chamber. In the example shown in FIG. 3, the guide member 52 extends in the first direction (for example, the Z direction), and guides the movement of the power transmission member 5b in the chamber in the first direction. Due to the presence of the guide member 52, the tilt of the photocathode support 3 is suppressed when the photocathode support 3 moves. In the example shown in FIG. 3, the guide member 52 is fixed to the vacuum chamber 2 (more specifically, the upper end of the guide member 52 is fixed to the top 21 of the vacuum chamber 2).

In addition, from the viewpoint of suppressing the tilt of the photocathode support 3, the number of the guide members 52 is preferably two or more. However, the guide member 52 The number can also be one.

In the example shown in FIG. 3, the central axis of the power transmission member 5 b in the chamber coincides with the central axis AX1 of the photocathode support 3. Therefore, the power transmission mechanism 5 can be simplified.

In the configuration example 2, an example in which the power transmission mechanism 5 transmits the driving force from the energy generation unit 7 to the photocathode support 3 is described. Alternatively, it may be provided that the power transmission mechanism 5 transmits the power from the energy generation unit to the activation container 4. In this case, in the description of the above configuration example 2, the "photocathode support" and the "activation container" may be changed to the "activation container" and the "photocathode support", respectively.

In addition, in the configuration example 2, the movement of the power transmission member 5b in the chamber is a movement in the direction of the Z direction. In other words, the power transmission member 5b in the chamber does not move in a direction perpendicular to the Z direction. Therefore, the power transmission mechanism 5 can be simplified. In addition, since the power transmission member 5b in the chamber does not move in a direction perpendicular to the Z direction, the degree of freedom of arrangement of other constituent elements in the vacuum chamber 2 is high. Alternatively, in Configuration Example 2, the chamber power transmission member 5b may be provided to be movable in a direction perpendicular to the Z direction.

(Configuration example 3)

The configuration example 3 will be described with reference to FIGS. 3 to 6. Composition example 3 A configuration example of the telescopic section 22. In Configuration Example 3, the vacuum chamber 2 includes the expansion and contraction portion 22. Furthermore, in the configuration example 3, the photocathode support 3 is moved by expanding and contracting the expansion and contraction portion 22 using the driving force from the energy generating portion 7.

When the vacuum chamber 2 includes the telescopic portion 22, the photocathode support 3 in the vacuum chamber 2 can be driven by changing the volume of the vacuum chamber 2. In addition, due to the presence of the telescopic portion 22, the degree of vacuum in the vacuum chamber 2 does not deteriorate.

In the example shown in FIG. 3, the telescopic portion 22 includes a telescopic tube (bellows member). Moreover, one end of the telescopic portion 22 is connected to the power transmission mechanism 5 (more specifically, the non-porous wall 24), and the other end of the telescopic portion 22 is connected to the vacuum chamber 2 (more specifically, the vacuum chamber 2 flange part 21a). In the example shown in FIG. 3, the expansion and contraction portion 22 is provided on the top 21 of the vacuum chamber 2. When both the expansion and contraction part 22 and the energy generation part 7 are arrange|positioned at the ceiling 21 of the vacuum chamber 2, the whole structure of the electron beam generator 1 can be simplified.

In addition, the arrangement and structure of the telescopic portion 22 are not limited to the example shown in FIG. 3. For example, as shown in FIG. 6, the telescopic portion 22 may be configured by the inner tube 220, the outer tube 222, and the film 224 connecting the inner tube 220 and the outer tube 222.

In the configuration example 3, the power transmission mechanism 5 The example in which the driving force of 7 is transmitted to the photocathode support 3 is described. Alternatively, the power transmission mechanism 5 may transmit the driving force from the energy generating unit to the activation container 4. In this case, in the description of the above configuration example 3, the "photocathode supporter" and the "activation container" may be renamed as the "activation container" and the "photocathode supporter", respectively.

(Configuration example 4)

The configuration example 4 will be described with reference to FIGS. 3 and 4. The configuration example 4 is a configuration example regarding the arrangement of the light source 80.

In Configuration Example 4, the light source 80 is arranged outside the vacuum chamber 2. The light from the light source 80 is irradiated to the photocathode material A through the light transmission window 81 arranged on the wall of the vacuum chamber 2. In the example shown in FIG. 3, the light transmission window 81 is arranged closer to the Z direction side than the photocathode support 3. Alternatively, the light source 80 may be arranged closer to the opposite side of the Z direction than the photocathode support. That is, it may be configured to input light from the back surface 3a side of the photocathode support 3 (that is, the surface side opposite to the surface where the photocathode material A is disposed). In this case, the photocathode support 3 may be provided with a hole through which light can pass or a light-transmitting material (for example, a transparent material). Further, in the example shown in FIG. 3, although the light source 80 is arranged outside the vacuum chamber 2, when the light from the optical fiber (optical fiber) is irradiated toward the photocathode material A, the light exit end of the fiber Can also be placed in the vacuum chamber 2 (the light exit end of the fiber can also be replaced (Arranged outside the vacuum chamber).

(Configuration example 5)

A configuration example 5 will be described with reference to FIGS. 3 and 4. Configuration example 5 is a configuration example of the anode 82 and the power supply section 83.

In Configuration Example 5, the electron beam generating device 1 includes: an anode 82; and a power supply unit 83 that applies a voltage between the anode 82 and the photocathode support 3 (cathode electrode). The anode 82 system is arranged in the vacuum chamber 2, and the power supply unit 83 system is arranged outside the vacuum chamber 2. In the example shown in FIG. 3, the anode of the power supply unit 83 is electrically connected to the anode 82, and the cathode of the power supply unit 83 is electrically connected to the photocathode support 3 via the power transmission member 5 b in the chamber. That is, the power transmission member 5b in the chamber also has a function as a conductive member.

In the first embodiment, any of the above configuration examples 1 to 5 may be adopted. In the first embodiment, any two of the above configuration examples 1 to 5 may be used instead. For example, in the first embodiment, the following configuration examples may be adopted: configuration examples 1, 2; configuration examples 1, 3; configuration examples 1, 4; configuration examples 1, 5; configuration examples 2, 3; configuration example 2, 4; configuration examples 2, 5; configuration examples 3, 4; configuration examples 3, 5 or configuration examples 4, 5. In the first embodiment, any three or more of the above configuration examples 1 to 5 may be used instead.

In addition, in the case where a high voltage is applied between the anode 82 and the photocathode support 3, an electrical insulating member may be used to form a part of the constituent members of the electron beam generating device as required. The electrical insulating member may be made of a well-known insulating material such as ceramics. In the example shown in FIG. 3, an electrical insulating member 30 is provided between the power transmission member 5a and the non-porous wall 24 outside the chamber; and the container for accommodating the power transmission mechanism 5 is also formed by the electrical insulating member 30 . In addition, the position of the electrical insulating member 30 shown in FIG. 3 is only an example, as long as it is outside the circuit formed by the "power supply unit 83-anode 82-photocathode support 3", it is possible to prevent electricity from being supported by the anode 82 and the photocathode. The place where the circuit flowing between the tools 3 is generated can be set no matter where it is. For example, a part of the body portion of the vacuum chamber 2 may be formed with an electrically insulating material. In the example shown in FIG. 3, although the power supply unit 83 is connected to the anode 82 and the power transmission member 5b in the chamber, as long as the circuit of the "power supply unit 83-anode 82-photocathode support 3" can be formed, Connect to other components. For example, it may be configured such that one end of the power supply 83 is connected to the flange portion 21a, and is electrically connected to the photocathode support 3 via the guide member 52 and the power transmission member 5b in the chamber. In addition, although not shown in FIG. 3, a circuit for heating the surface treatment material B may be formed in addition to the circuit formed by the “power supply unit 83-anode 82-photocathode support 3 ”. For this circuit, for example, it is sufficient to fix the introduction terminal to the flange portion 21 a and connect the end portion of the introduction terminal inside the vacuum region and the heating structure (described later) of the surface treatment material B with a wire. In addition, a heater for heating the photocathode may be provided in the photocathode support 3. In the case where a heater is provided, for example, as long as the introduction terminal is fixed to the flange portion 21a and Connect the end of the lead-in terminal inside the vacuum area to the heater with a wire. In addition, a resin with a large amount of gas released cannot be used in an ultra-high vacuum. Therefore, as an electric wire, it is preferable to use a tube made of an insulating material such as ceramics or a bead insulator, etc., instead of an electric wire covered with resin in accordance with demand for bare metal exposed wires.

The following situations are feasible in the atmosphere: (1) An oxide film is easily formed on the surface of the metal, whereby the coefficient of friction between the metals is kept low; (2) The friction coefficient is further reduced by using lubricating oil. On the other hand, in the ultra-high vacuum environment, the following conditions that easily cause abrasion or fixation are prepared: (3) When the oxide film is removed due to friction, because the oxide film cannot be remade, it causes metal to metal Agglutination, which causes a significant increase or fixation of the friction coefficient; (4) Unable to use lubricating oil that will cause contamination in the vacuum container; (5) Heat due to the absence of convection (of gas or lubricating oil) It is communicated that heat release is not performed and the temperature of the swinging part rises. Therefore, regarding a member arranged in a vacuum region so as to be in relatively movable contact with other members, one or both of the members that move relatively can also be produced by surface treatment or a non-metallic material.

In the first embodiment, a combination of relatively moving members may include, for example, a chamber power transmission member 5b and a guide member 52, a chamber power transmission member 5b, and a flange portion 21a.

As a surface treatment, as long as the aggregation of metals does not occur, The friction coefficient can be reduced without particular limitation, and examples thereof include DLC (Diamond like carbon; diamond-like carbon) coating, TiN coating, TiCN coating, CrN coating, and S-AH coating. The non-metallic material is not particularly limited as long as it has resistance in a high-temperature vacuum environment, and examples include ceramics and C/C composite materials (carbon/carbon composite).

(Second embodiment)

The second embodiment will be described with reference to FIGS. 7 to 9. 7 is a schematic cross-sectional view of the electron beam generating device 1 in the second embodiment. FIG. 8A is an enlarged view of the area AR in FIG. 7. Fig. 8B is an enlarged view of the area AR' in Fig. 7.

In the second embodiment, the specific configurations of the power transmission mechanism 5 and the energy generation unit 7 are different from the specific configurations of the power transmission mechanism and the energy generation unit in the first embodiment. Therefore, in the second embodiment, the power transmission mechanism 5 and the energy generating unit 7 will be mainly described, and the description of other structures will be omitted.

In the example shown in FIG. 7, the power transmission member 5 b in the chamber is arranged at a position that is off-center from the center axis AX1 of the photocathode support 3. In this case, it becomes possible to introduce light from the light source 80 from the back surface 3a side of the photocathode support 3 to the photocathode material A. In addition, in order to introduce light from the light source 80 from the back surface 3a side of the photocathode support 3 to the photocathode material A, it is preferable that the rod 3b of the photocathode support 3 has The light introduction hole is preferably composed of a light-transmitting material (transparent material).

In the example shown in FIG. 7, the light source 80 is arranged outside the vacuum chamber 2. Therefore, the light source 80 is not exposed to the harsh environment in the vacuum chamber 2. In addition, when the light source 80 is arranged outside the vacuum chamber 2, at least a part of the vacuum chamber 2 may be constituted by a light-transmitting material (for example, a transparent material). Next, it is only necessary to introduce the light from the light source 80 into the vacuum chamber 2 through the light-transmitting material.

In the second embodiment, the arrangement of the light source 80 is not limited to the example shown in FIG. 7. The light source 80 may also be arranged in the vacuum chamber 2. In addition, the position of the light source 80 may be the same as the position of the light source in the first embodiment.

In the example shown in FIG. 7, the power transmission member 5b in the chamber includes: a rotation member 533 capable of rotating about an axis parallel to the first direction (Z direction); and a conversion mechanism that converts the rotation of the rotation member 533 into photoelectric The linear movement of the cathode support 3 (for example, movement in the first direction). In the example shown in FIG. 7, the conversion mechanism is a male screw portion 533c provided on the rotating member 533 and a female screw portion 3c provided on the photocathode support 3. The male screw portion 533c and the female screw portion 3c are screwed to each other.

Further, in the example shown in FIG. 7, the power transmission member in the chamber The 5b system includes a universal joint 54. Therefore, the degree of freedom of arrangement of the power transmission mechanism 5 is improved. In the example shown in FIG. 7, the power transmission member 5 b in the chamber includes two universal joints 54. However, the number of universal joints 54 provided in the power transmission member 5b in the chamber is not limited to two. The number of universal joints 54 may be one, or more than three. In addition, although the example shown in FIG. 7 shows an example in which a universal joint is used as the power transmission member 5b in the chamber, any member may be used as long as it can transmit power in the chamber. For example, a wire made of metal or the like may be used as a member that transmits rotation in the same way as a universal joint.

In the example shown in FIG. 7, an example in which a voltage is applied between the flange portion 21 a and the anode 82 is shown. When a high-energy electron beam is necessary, a high voltage may be applied between the anode and the cathode. At this time, if there is a protrusion in the vacuum chamber 2, there is a possibility that a discharge is generated from the protrusion. In the power transmission member 5b in the chamber, the portion protruding from the second hole 44-2 of the activation container 4 may also become a protrusion that causes discharge. Therefore, the electron beam generating device 1 may also include a shield 88 for suppressing discharge from the protrusions in the vacuum chamber 2 as required.

In the example shown in FIG. 7, a part of the power transmission member 5 b in the chamber is covered by the activation container 4, and the portion of the power transmission member 5 b in the chamber that is exposed outside the activation container 4 is opposed to the shield 88 The anode 82 is hidden. In other words, the shield 88 is disposed at least a part of the anode 82 and the power transmission member 5b in the chamber (specifically, the power transmission in the chamber Among the members 5b exposed between the parts of the activation container 4 outside). Therefore, generation of discharge from the power transmission member 5b in the chamber is suppressed.

The shape and arrangement of the shield 88 are arbitrary as long as the discharge of power from the power transmission member 5b in the chamber can be suppressed. In the example shown in FIG. 7, the outer surface 88a of the shield 88 is a smooth curved surface. In addition, there is no corner portion on the outer surface 88a of the shield 88.

It is preferable to use a material that does not easily cause discharge as the material of the shield 88. The material of the shield 88 is, for example, titanium, molybdenum, stainless steel, TiN, or the like. The surface of the shield 88 may also be coated with titanium, molybdenum, stainless steel, TiN, or the like.

In the example shown in FIG. 7, the activation container 4 has a function as a first shield covering a part of the power transmission member 5b in the chamber, and a shield 88 has a second shield covering the other part of the power transmission member 5b in the chamber Function. In addition, as in the first embodiment, when the entire power transmission member 5b in the chamber is covered by the activation container 4, the shield 88 having the function of the second shield may be omitted. Furthermore, in the case of the second embodiment, if the applied voltage is low, there is less concern about discharging, so the shield 88 may be omitted.

An example of the energy generating unit 7 in the second embodiment will be described with reference to FIG. 8A. FIG. 8A is an enlarged view of the area AR in FIG. 7.

In the example shown in FIG. 8A, the energy generating unit 7 is a manual operation member 7b. In the example shown in FIG. 8A, if the operation knob 72 of the manual operation member 7b is rotated, the power transmission member 5a outside the chamber will rotate around the rotation axis AX2. If the power transmission member 5a outside the chamber rotates around the rotation axis AX2, the non-porous wall 24 revolves around the rotation axis AX2. In addition, since the non-porous wall 24 is fixed to the telescopic tube 74, it cannot rotate. If the non-perforated wall 24 revolves around the rotation axis AX2, the first axis 531 of the power transmission member 5b in the chamber will rotate around the rotation axis AX2. In this way, the driving force (in other words, mechanical energy) from the energy generation unit 7 is transmitted to the power transmission member 5b inside the chamber via the power transmission member 5a outside the chamber.

In addition, in the examples shown in FIGS. 7 and 8A, the power transmission member 5a outside the chamber and the power transmission member 5b inside the chamber are also passed through the non-porous wall 24 of the vacuum chamber 2 in the same manner as the configuration example 2 of the first embodiment. Connected to convey power. Therefore, the degree of vacuum in the vacuum chamber 2 does not deteriorate.

In the example shown in FIG. 7, the power transmission member 5 b in the chamber includes a plurality of shafts 53 and a plurality of universal joints 54. More specifically, the rotation of the first shaft 531 is transmitted to the second shaft 532 via the first universal joint 541. In addition, the rotation of the second shaft 532 is transmitted to the third shaft (rotating member 533) via the second universal joint 542. Next, by rotating the third axis (rotating member 533), the photocathode support 3 moves linearly.

The second embodiment achieves the same effect as the first embodiment.

In addition, in some embodiments including the second embodiment, when the power transmission member 5b in the chamber is disposed at a position deviated from the center axis of the photocathode support 3, the degree of freedom of arrangement of the light source and the like is improved .

Further, in several embodiments including the second embodiment, the power transmission member 5b in the chamber includes a rotation member 533 and a conversion mechanism for converting the rotation of the rotation member into the linear movement of the photocathode support 3 Next, positioning control of the photocathode support 3 becomes easy.

In addition, in some embodiments including the second embodiment, when the power transmission member 5b in the chamber includes a universal joint, the degree of freedom of arrangement of the power transmission mechanism including the power transmission member 5b in the chamber is improved.

Further, in some embodiments including the second embodiment, when the electron beam generating device 1 includes the shield 88, generation of discharge from the power transmission member 5b in the chamber and the like is suppressed.

Furthermore, in several embodiments including the second embodiment, when the power transmission member 5a outside the chamber and the power transmission member 5b inside the chamber are connected to transmit power through the non-porous wall 24 of the vacuum chamber 2, The deterioration of the degree of vacuum in the vacuum chamber is effectively suppressed.

In addition, in the second embodiment, the power transmission mechanism 5 is explained in the future. An example in which the driving force from the energy generation unit is transmitted to the photocathode support 3. Alternatively, the power transmission mechanism 5 may transmit the driving force from the energy generation unit to the activation container 4.

In addition, in the second embodiment, an example in which the energy generating unit 7 is the manual operation member 7b is described. Alternatively, the operation knob 72 or the like may be driven by a motor, a rotary actuator, or the like. In this case, the energy generating unit 7 in the second embodiment becomes the driving source 7a.

In the second embodiment, similar to the first embodiment, one or both of the relatively movable members can be produced by surface treatment or non-metallic material in the second embodiment in the relative arrangement of members that can move relative to other members in the vacuum area. The combination of relatively moving members in the second embodiment includes, for example, the first shaft 531 and the flange portion 21a, the male screw portion 533c and the female screw portion 3c, the guide member 52, and the rod 3b.

In the second embodiment, a circuit for heating the surface treatment material B and a circuit for supplying electricity to the heater for heating the photocathode may be provided in the same manner as the first embodiment. 8B is an enlarged view of the area AR' in FIG. 7 and is a diagram showing another example of a circuit for supplying power to the heater. As described above, the wires used to form the circuit are preferably bare wires. On the other hand, if a member that is movable in the vacuum area is connected to the member with a bare wire, the bare wire also becomes movable in the vacuum area, and there is a possibility of short circuit or disconnection due to contact with other members. Therefore, it can also be set The contact method electrically connects the relatively moving member and the form of the member.

The example of connection by the contact method will be described more specifically with reference to FIG. 8B. The example shown in FIG. 8B includes: the lead-in terminal 60a; the first terminal block 62; the second terminal block 63; the connecting portion 64, which connects the first terminal block 62 and the second terminal block 63 in a contact manner; and the bare The wires 61a and 61b connect these members. The lead-in terminal 60a is penetrated and fixed so as to be insulated from the flange portion 21a, and can be connected to the electric wire at the inner end portion 60a1 of the vacuum area and the outer end portion 60a2 of the vacuum area. The first terminal block 62 is fixed so that one end is insulated from the flange portion 21a. The end portion 60a1 in the vacuum region of the lead-in terminal 60a and the first terminal block 62 are connected by a bare wire 61a. The second terminal block 63 is fixed to the photocathode support 3. The first terminal block 62 is provided with a contact portion 64 that contacts the second terminal block 63. The contact portion 64 is preferably formed of a material having a urging force such as a leaf spring or a coil that can constantly contact the second terminal block 63. In addition, the contact portion 64 may be provided so as to be provided on the second terminal block 63 and contact the first terminal block 62. Furthermore, the second terminal block 63 and the heater 3d are connected by the bare wire 61b, whereby the electric current can be moved to the heater 3d from the outside of the vacuum chamber. In addition, the heating structure (described later) of the surface treatment material B may be connected to the end portion 60b1 in the vacuum region of the introduction terminal 60b using the bare wire 61c, and the introduction terminal 60b is penetrated so as to be insulated from the flange portion 21a. fixed. In the embodiment shown in FIG. 8B, the relatively moved first terminal block 62 and the second terminal block 63 are contacted and energized by the contact portion 64, and the bare wire 61a to the bare wire 61c are connected to members and members that will not move relatively . Therefore, in the figure In the embodiment shown in 8B, there is no possibility that the bare wire arranged in the vacuum area comes into contact with other members to short-circuit or break the wire. In addition, the embodiment shown in FIG. 8B can also adopt the first embodiment. In addition, the embodiment shown in FIG. 8B shows an example of a specific aspect of the contact method, as long as it is a member and a member that move in a contact manner and move relatively while being energized, other embodiments may be used.

(Third Embodiment)

The third embodiment will be described with reference to FIG. 9. 9 is a schematic cross-sectional view of the electron beam generating device 1 in the third embodiment.

In the third embodiment, the difference from the electron beam generating device in the first embodiment is that the telescopic portion 26 constitutes a part of the body portion of the vacuum chamber 2. In the third embodiment, the specific configurations of the activation container 4, the power transmission mechanism 5, and the energy generation unit 7 are different from the specific configurations of the activation container, the power transmission mechanism, and the energy generation unit in the first embodiment. Therefore, in the third embodiment, the expansion and contraction section 26, the activation container 4, the power transmission mechanism 5, and the energy generating section 7 will be mainly described, and descriptions of other configurations that will be redundant will be omitted.

Referring to FIG. 9, in the third embodiment, the telescopic portion 26 (for example, a telescopic tube) constitutes a part of the body portion of the vacuum chamber 2. More specifically, the telescopic portion 26 is arranged between the first flange portion 58 connected to the vacuum chamber 2 and the second flange portion 28 connected to the vacuum chamber 2, and the first flange portion 58 is connected to the second flange portion 28. Therefore, the first flange portion 58 can move relatively to the second flange portion 28.

When the first flange portion 58 relatively moves against the second flange portion 28, the power transmission member 5 b in the chamber that moves together with the first flange portion 58 also relatively moves against the second flange portion 28. As a result, the photocathode support 3 connected to the power transmission member 5b in the chamber moves relative to the activation container 4.

In the example shown in FIG. 9, the power transmission member 5b in the chamber is a shaft. In addition, the power transmission member 5b and the photocathode support 3 in the chamber are one member that is integrally formed. Alternatively, the power transmission member 5b and the photocathode support 3 in the chamber may be separately manufactured, and the two may be connected via an arbitrary coupling structure.

In the example shown in FIG. 9, the power transmission member 5b in the chamber is fixed to the top of the vacuum chamber 2 (more specifically, the flange 21a at the top). Alternatively, the power transmission member 5b in the chamber may also be fixed to the body portion 20 of the vacuum chamber 2.

Next, the power transmission member 5a and the energy generator 7 outside the chamber will be described. In the example shown in FIG. 9, the power transmission member 5 a outside the chamber includes a first flange portion 58 connected to the vacuum chamber 2. In the example shown in FIG. 9, the power transmission member 5 a outside the chamber includes a screw rod 59. Moreover, the first flange portion 58 is provided with a screw hole 58 c for screwing with the screw rod 59. therefore, When the screw rod 59 is rotated about the central axis of the screw rod, the first flange portion 58 moves linearly (for example, in the Z direction). As a result, the distance between the first flange portion 58 and the second flange portion 28 changes, and the expansion and contraction portion 26 expands and contracts.

In the example shown in FIG. 9, the screw rod 59 is connected to the energy generating unit 7. In the example shown in FIG. 9, the energy generating unit 7 is a manual operation member 7b. Furthermore, when the operation knob 72 of the manual operation member 7b is operated, the screw rod 59 rotates about the central axis of the screw rod. In addition, the body portion 20a may be an electrically insulating member.

As shown in FIG. 9, the electron beam generating device 1 may include a guide member 580 (for example, a guide bar) that guides the movement of the first flange portion 58. In the example shown in FIG. 9, the guide member 580 is arranged to penetrate the through hole 58 d of the first flange portion 58. The number of the guide member 580 may be one, or may be two or more.

In the third embodiment, the vacuum chamber 2 includes the expansion and contraction portion 26. Therefore, by changing the volume of the vacuum chamber 2, the power transmission member 5b (and the photocathode support 3) in the chamber in the vacuum chamber 2 can be moved. In addition, even if the volume of the vacuum chamber 2 is changed, the degree of vacuum in the vacuum chamber 2 will not deteriorate.

Next, the activation container 4 will be described. In the example shown in Figure 9, The activation container 4 is attached to the vacuum chamber 2 via the support member 42. In the example shown in FIG. 9, the activation container 4 is suspended and supported by a plurality of support members 42.

The activation container 4 is provided with: a first hole 44-1, through which the photocathode material A or electrons released from the photocathode material A can pass. In addition, the activation container 4 includes a second hole 44-2 through which the power transmission member 5b in the chamber is inserted. In the example shown in FIG. 9, the second hole 44-2 is provided on the surface opposite to the surface where the first hole 44-1 is provided. More specifically, the first hole 44-1 is provided on the lower surface of the activation container 4, and the second hole 44-2 is provided on the upper surface of the activation container 4. Alternatively, like the activation container in the second embodiment, the second hole 44-2 may be provided on the side of the activation container 4 (see FIG. 7).

In the example shown in FIG. 9, the activation container 4 is supported by the vacuum chamber 2 via the support member 42. Therefore, the size of the activation container 4 can be set smaller than the size of the activation container in the first embodiment. In addition, the support member 42 preferably supports the activation container 4 from the side opposite to the side where the anode 82 is disposed. In other words, it is preferable that the activation container 4 is arranged between the support member 42 and the anode 82. Since the activation container 4 is arranged between the support member 42 and the anode 82, the discharge from the support member 42 is suppressed.

The third embodiment achieves the same effect as the first embodiment.

In addition, in several embodiments including the third embodiment, when the telescopic portion 26 (for example, the telescopic tube) constitutes a part of the body portion of the vacuum chamber 2, it becomes possible to simply expand and contract the telescopic portion The power transmission member 5b in the chamber moves. In addition, since the movement of the power transmission member 5b in the chamber is limited to linear movement, the power transmission mechanism 5 can be simplified.

Further, in several embodiments including the third embodiment, when the activation container 4 is mounted in the vacuum chamber 2 via the support member 42, the volume of the activation container 4 can be reduced.

In addition, in some embodiments including the third embodiment, in addition to the first hole 44-1, the activation container 4 may include a second hole 44-2 into which the power transmission member 5b in the chamber is inserted. In this case, there is a possibility that the surface treatment material B is released out of the activation container 4 via the second hole 44-2. Therefore, the outer diameter of the photocathode support 3 can be additionally increased, whereby the surface treatment material B is not easily released from the second hole 44-2.

In addition, in the third embodiment, the example in which the power transmission mechanism 5 transmits the driving force from the energy generation unit 7 to the photocathode support 3 has been described. Alternatively, the power transmission mechanism 5 may transmit the driving force from the energy generation unit 7 to the activation container 4.

Furthermore, in the third embodiment, the energy generating unit 7 has been manually operated An example of member 7b is described. Alternatively, the operation knob 72 or the like may be driven by a motor, a rotary actuator, or the like. In this case, the energy generating unit 7 in the third embodiment is the driving source 7a.

(Change example 1 of power transmission mechanism)

The power transmission mechanism 5 in the embodiment may be a power transmission mechanism for converting the vibration of the power transmission member outside the chamber into the movement of the power transmission member inside the chamber. In this case, a vibration source (driving source) such as an ultrasonic motor may be used as the energy generating unit 7.

(Change example 2 of power transmission mechanism)

In the above-described first to third embodiments and modification 1 of the power transmission mechanism, the example in which the power transmission member outside the chamber transmits the driving force purely mechanically to the power transmission member inside the chamber has been described. Alternatively, at least a part of the transmission of the driving force of the power transmission member in the chamber may be carried out in a non-mechanical manner.

In Modification 2 of the power transmission mechanism, the driving force of the power transmission member in the chamber is thermally transmitted. For example, suppose that a shape memory alloy is used to constitute the power transmission member in the chamber. In this case, by applying heat to the power transmission member in the chamber, the power transmission member in the chamber composed of the shape memory alloy can be expanded and contracted. As a result, the photocathode support 3 or the activation container 4 connected to the power transmission member in the chamber moves. In this way, the photocathode support 3 will face the activation vessel 4 phase On mobile.

In addition, in Variation 2 of the power transmission mechanism, the energy generation unit is constituted by a heat source. In addition, the energy generation unit (heat source) generates heat energy that drives the power transmission member in the chamber. In addition, the heat source may be arranged inside the vacuum chamber or outside the vacuum chamber.

(Change example 3 of power transmission mechanism)

In the above-described first to third embodiments and modification 1 of the power transmission mechanism, the example in which the power transmission member outside the chamber transmits the driving force purely mechanically to the power transmission member inside the chamber has been described. In addition, in Modification 2 of the power transmission mechanism, an example has been described in which the driving force is transmitted thermodynamically to the power transmission member in the chamber. Alternatively, at least a part of the transmission of the driving force of the power transmission member in the chamber may be carried out magnetically or electromagnetically.

In Modification 3, the power transmission member outside the vacuum chamber 2 includes a magnet, and the power transmission member inside the vacuum chamber includes a ferromagnetic material drawn by the magnet. In this case, by moving the power transmission member outside the chamber, the power transmission member inside the chamber can be moved.

In addition, in Variation 3 of the power transmission mechanism, as the energy generating section 7, a mechanism for power transmission outside the chamber by human power may be employed The manual operation member for moving the parts may be a driving source for moving the power transmission member outside the chamber by non-human force. In addition, in Modification 3, the magnet system is disposed outside the vacuum chamber 2. Therefore, the interference of the magnet on the orbit of the electron beam is kept to a minimum.

Various power transmission mechanisms have been explained in the above-mentioned embodiments and modified examples. However, from the viewpoint of reducing the influence on the trajectory of the electron beam generated by the electron beam generating device 1 as much as possible and from the viewpoint of accurately positioning the photocathode support 3 relative to the activation container 4 as much as possible In view of this, the power transmission mechanism is preferably a purely mechanical power transmission mechanism. In other words, it is preferable that the power transmission member outside the chamber transmits the driving force purely mechanically to the power transmission member inside the chamber. In the third embodiment, in the vacuum area, there is no member arranged so as to be able to slightly contact with relative movement. Therefore, as in the first embodiment, it is sufficient to form a circuit for heating the surface treatment material B and a circuit for energizing the heater, wherein the heater is used to heat the photocathode.

(Other structures that can be adopted in the embodiment)

With reference to FIGS. 10 to 12, other configurations that can be adopted in the above embodiments will be described.

(Heating structure)

The heating structure for activating the surface treatment material B will be described with reference to (a) in FIG. 10 and (b) in FIG. 10. (A) in Figure 10 and (B) in FIG. 10 is a diagram schematically showing an example of a heating structure.

The heating structure 95 heats and vaporizes the surface treatment material B. The heating structure 95 may indirectly heat the surface treatment material B disposed inside by heating the entire activation container 4, or it may directly heat only the surface treatment material B. As the former method, a method of arranging a heating structure such as an electric heating coil in the activation container 4 or heating the entire vacuum chamber 2 using an electric heating coil, a lamp heater or the like to heat the activation container 4. Heating method, etc.

In addition, as shown in (a) and (b) of FIG. 10, a method using the surface treatment material B combined with a heating structure can be cited as the latter method. (A) in FIG. 10 shows an example in which the heating structure 95 is incorporated in the surface treatment material B. In the example described in (a) of FIG. 10, a heating structure 95 such as a heating wire is inserted in the center of the surface treatment material B, and a longitudinal cut 96 is formed in the surface treatment material B. When the heating structure 95 is energized, as shown in (b) of FIG. 10, the cut 96 becomes large due to heating, and the vaporized gas of the surface treatment material B is released from the enlarged cut 96. At this time, the vaporized gas system of the surface treatment material B is released directionally from the cut 96, so that the vaporized gas can be directed only in the direction of the photocathode material A.

(Direction control structure)

Referring to FIG. 11, the surface treatment material B (surface The direction control structure 97 of the flying direction of the gasification gas of the processing material B) will be described. FIG. 11 is a diagram schematically showing an example of the direction control structure 97.

In the example shown in FIG. 11, two direction control plates 98 are arranged so as to sandwich the surface treatment material B. Moreover, the angle at which the vaporized surface treatment material B is scattered is set to be adjustable at an angle greater than 0 degrees and less than 90 degrees with respect to the surface connecting the end portions of the first holes 44-1. In addition, the number of direction control boards 98 is not limited to two. The number of the direction control board 98 may be one, or more than three.

(Configuration of electrode)

An example of the arrangement of electrodes will be described with reference to FIG. 12. 12 is a diagram schematically showing an example of the arrangement of electrodes.

In the above embodiment, an example of the bipolar structure in which the photocathode is negative and the anode 82 is positive has been described. Alternatively, as shown in FIG. 12, the activation container 4 may be formed by using a conductive material, and the photocathode support 3 may be used without contacting the activation container 4, thereby being used as a three-pole structure . In the case of using a three-pole structure, the voltage VA of the photocathode and the voltage VB of the activation container 4 are set to VA≠VB, and both VA and VB may be 0V or less.

(EA surface treatment method)

An example of the EA surface treatment method of the photocathode material A disposed in the electron beam generating device 1 in the embodiment will be described. The EA surface treatment method is executed in the following order (1) to (3), for example. In addition, during the EA surface treatment, the relative positional relationship between the photocathode support 3 and the activation container 4 is set to, for example, the positional relationship shown in FIG. 3, the positional relationship shown in FIG. 7, or the positional relationship shown in FIG. The positional relationship shown in.

(1) The photocathode support 3 supporting the photocathode material A is heated in vacuum at 300° C. to 700° C. for 10 minutes to 1 hour to remove and clean surface impurities such as oxides or carbides. The heating temperature and time are appropriately adjusted according to the photocathode material used. By this, it is possible to bend the energy band of the photocathode material A, and lower the vacuum level by about half of the energy band gap (φ B) of the semiconductor used to form the photocathode.

(2) The surface treatment material B is vapor-deposited so that a minute photocurrent can be obtained on the crystal surface of the photocathode material A. After that, whenever the photocurrent is saturated, the vapor deposition of the surface treatment material B and the gas such as oxygen, NF ₃ , N _2, etc. according to the demand are alternately repeated until the maximum photocurrent is obtained. By this method, the residual vacuum level (φ D) is reduced, whereby the EA surface state can be formed. The gas is added, for example, by spraying the gas supplied from the gas supply device 92 to the photocathode material A. In addition, in the case where a plurality of types of surface treatment materials B, such as Cs, Te, Cs, and Sb, are vapor-deposited on the photocathode material A, the addition of gas is not necessary.

(3) After releasing electrons for a certain period of time, by performing the above (2) EA surface reprocessing.

(Electron ray application device)

The electron beam application device 100 will be described with reference to FIG. 13. 13 is a functional block diagram of the electron beam application device 100.

The electron beam application device 100 is a device that causes electrons generated by the electron beam generating device 1 to fly in a desired direction. The electron ray application device 100 may be a device that irradiates electrons toward a target.

The electron beam application device 100 includes the electron beam generating device 1. The electron beam application device 100 is, for example, an electron microscope such as an electron gun, a free electron laser accelerator, a transmission electron microscope or a scanning electron microscope, an electron beam hologram imaging device, an electron beam drawing device, an electron beam diffraction device, an electron beam Inspection device, electron ray metal deposition modeling device (3D printer), electron ray lithography device, other electron ray processing devices (bridging, polymerization, deposition, etching), surface modification (surface modification), etc.), electron beam hardening device, electron beam sterilization device, electron beam sterilization device, plasma generation device, atomic element (radical) generation device, spin polarized electron beam generation device, analysis Devices (cathode light emitting devices, backlight electron spectroscopic devices), etc. In each of the above-mentioned devices, a configuration other than the electron beam generating device 1 may be a known or well-known configuration. Therefore, the description of each device is omitted.

The present invention is not limited to the above-mentioned embodiments, and each embodiment can be appropriately changed or modified within the scope of the technical idea of the present invention. In addition, any constituent elements used in each embodiment, each configuration example, and each modification example can be combined with other embodiments, and any constituent elements in each embodiment can be omitted.

(Industry availability)

The use of the electron beam generating device and the electron beam application device of the present invention can facilitate maintenance. Therefore, it is useful for a manufacturer who manufactures an electron ray generation device and an electron ray application device, and a manufacturer who uses an electron ray generation device and an electron ray application device to process electron rays.

1‧‧‧ Electron ray generator

2‧‧‧Vacuum chamber

3‧‧‧Photocathode support

3a‧‧‧Back

4‧‧‧Activated container

5‧‧‧Power transmission mechanism

5a‧‧‧Outdoor power transmission member

5b‧‧‧Power transmission member in the chamber

7‧‧‧Energy Generation Department

7a‧‧‧Drive source

20‧‧‧Body

21‧‧‧Top

21a‧‧‧Flange

22‧‧‧Telescopic Department

24‧‧‧No hole wall

30‧‧‧Electrical insulating member

44-1‧‧‧First hole

45‧‧‧ hole

52‧‧‧Guiding member

80‧‧‧Light source

81‧‧‧light through the window

82‧‧‧Anode

83‧‧‧Power Department

91‧‧‧Vacuum pump

92‧‧‧Gas supply device

A‧‧‧Photocathode material

AX1‧‧‧Central axis

B‧‧‧Surface treatment materials

Z‧‧‧ direction

Claims (14)

An electron ray generating device includes: a vacuum chamber; a photocathode support, which is arranged in the vacuum chamber to support the photocathode material; and an activation container, which is arranged in the vacuum chamber and supports the A surface treatment material with reduced electron affinity of the photocathode material; and a power transmission member in the chamber, which is arranged in the vacuum chamber and transmits a driving force to the photocathode support or the activation container; the photocathode support is capable of Move relative to the activation container; the power transmission member in the chamber is only arranged in the vacuum area of the vacuum chamber, and only in the vacuum area by the energy generating part arranged outside the vacuum chamber Driven by the generated energy. The electron beam generating device according to claim 1, further comprising: the energy generating part for generating mechanical energy for driving the power transmission member in the chamber; and the energy generating part is arranged in the vacuum chamber outer. The electron beam generating device according to claim 2, wherein the energy generating unit is a driving source or a manual operation member. The electron beam generating device according to any one of claims 1 to 3, further comprising: a power transmission member outside the chamber, which is disposed outside the vacuum chamber; a power transmission member outside the chamber and a power inside the chamber The transmission member is connected via the non-porous wall of the aforementioned vacuum chamber to transmit power. The electron beam generating device according to claim 4, wherein the power transmission member outside the chamber transmits the driving force purely mechanically to the power transmission member inside the chamber. The electron beam generating device according to any one of claims 1 to 3, wherein the power transmission member in the chamber is arranged at a position that has been deviated from the center of the center axis of the photocathode support. The electron beam generating device according to any one of claims 1 to 3, further comprising: a guide member arranged in the vacuum chamber and extending along the first direction; the guide member guides the aforementioned Movement of the power transmission member in the chamber along the aforementioned first direction. The electron beam generating device according to any one of claims 1 to 3, wherein the power transmission member in the chamber includes: a rotating member; and a conversion mechanism that converts the rotation of the rotating member into the photocathode support or The linear movement of the aforementioned activation container. The electron beam generating device according to any one of claims 1 to 3, further comprising: an anode, which has been disposed in the vacuum chamber; and a shield, which is used to suppress protrusions from the vacuum chamber Discharge occurs; the shield is disposed between the anode and at least a portion of the power transmission member in the chamber. The electron beam generating device according to any one of claims 1 to 3, wherein the activation container has: a first hole capable of passing electrons released from the photocathode material or the photocathode material; And the second hole is inserted through the power transmission member in the chamber. The electron beam generating device according to any one of claims 1 to 3, wherein the vacuum chamber includes a telescopic part; the photocathode support or the activation container is moved by expanding and contracting the telescopic part. The electron beam generating device according to claim 11, wherein the retractable portion constitutes a part of the body portion of the vacuum chamber or is mounted on the top of the vacuum chamber. The electron beam generating device according to claim 1, further comprising: the energy generating unit for generating thermal energy for driving the power transmission member in the chamber. An electron ray application device includes the electron ray generation device described in any one of claims 1 to 3; the aforementioned electron ray application device is an electron gun, a free electron laser accelerator, an electron microscope, an electron ray hologram imaging device, an electron Ray tracing device, electron ray diffraction device, electron ray inspection device, electron ray metal deposition modeling device, electron ray lithography device, electron ray processing device, electron ray hardening device, electron ray sterilization device, electron ray sterilization device, electronic A pulp generating device, an atomic element generating device, a spin polarized electron beam generating device, a cathode light emitting device, or a back light electron spectroscopic device.

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