TWI693136B - Polarizer with different shape having hole and manufacturing method thereof - Google Patents

Polarizer with different shape having hole and manufacturing method thereof Download PDF

Info

Publication number
TWI693136B
TWI693136B TW108106766A TW108106766A TWI693136B TW I693136 B TWI693136 B TW I693136B TW 108106766 A TW108106766 A TW 108106766A TW 108106766 A TW108106766 A TW 108106766A TW I693136 B TWI693136 B TW I693136B
Authority
TW
Taiwan
Prior art keywords
cutter
holes
buffer layer
polarizer
forming
Prior art date
Application number
TW108106766A
Other languages
Chinese (zh)
Other versions
TW202031443A (en
Inventor
林長毅
陳建琦
Original Assignee
凌巨科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凌巨科技股份有限公司 filed Critical 凌巨科技股份有限公司
Priority to TW108106766A priority Critical patent/TWI693136B/en
Application granted granted Critical
Publication of TWI693136B publication Critical patent/TWI693136B/en
Publication of TW202031443A publication Critical patent/TW202031443A/en

Links

Images

Abstract

A manufacturing method of a polarizer with different shape having a hole includes steps below is provided. Providing a knife mold, a buffer layer, and an optical film assembly. The knife mold includes a base and a knife. The base includes a plurality of stamping parts having a pore. The pore is substantially located in a center of gravity of the corresponding stamping part. The knife is disposed on the base. The knife includes a first knife and a second knife. The first knife forms a plurality of closed structures on a surface of the base to define the plurality of stamping parts. The second knife surrounds the pore. The plurality of closed structures have a different shape. Proceeding a stamping process to the buffer layer and the optical film assembly by the knife mold, and the polarizer with different shape having the hole is formed. During a period of the stamping process, the buffer layer is located between the polarizer and the optical film assembly. The buffer layer has a compression force of 0.03~0.035 Mpa after proceeding the stamping process. A polarizer with different shape having a hole is also provided.

Description

具有孔洞的異形偏光片及其形成方法Special-shaped polarizer with holes and forming method thereof

本發明是有關於一種偏光片及其形成方法,且特別是有關於一種具有孔洞的異形偏光片及其形成方法。 The present invention relates to a polarizer and a method for forming the same, and in particular to a polarizer with holes and a method for forming the same.

偏光片的形成方法通常是使其與其他膜層組合成光學膜片組後,再對此光學膜片組進行沖壓製程。然而,由各自具有不同硬度的多層膜組成的光學膜片組在經沖壓後,會因此多層膜各自產生的應力不同而使得形成的偏光片產生翹曲及龜裂的問題,而降低良率。 The forming method of the polarizer is usually to combine it with other film layers to form an optical film group, and then perform a stamping process on the optical film group. However, after the punching of the optical film group composed of multilayer films each having a different hardness, the stress generated by the multilayer films will be different, and the polarizer formed will have warpage and cracking problems, thereby reducing the yield.

本發明提供一種具有孔洞的異形偏光片及其形成方法,藉由此方法形成的異形偏光片具有平整的表面。 The invention provides a shaped polarizer with holes and a method for forming the same. The shaped polarizer formed by this method has a flat surface.

本發明的具有孔洞的異形偏光片的形成方法包括以下步驟。首先,提供刀模、緩衝層以及包括偏光膜的光學膜片組。刀模包括基座以及刀具。基座包括具有小孔的多個沖壓部。小孔實 質上位於對應的沖壓部的重心。刀具設置於所述基座上。刀具包括第一刀具以及第二刀具。第一刀具於基座的表面上形成多個封閉結構以定義出多個沖壓部。第二刀具圍繞小孔。多個封閉結構的形狀為異形。接著,藉由刀模對緩衝層以及光學膜片組進行沖壓製程,以形成多個具有孔洞的異形偏光片。在進行沖壓製程時,緩衝層位於刀模以及光學膜片組之間。緩衝層於進行沖壓製程後的壓縮力為0.03~0.035Mpa。 The method for forming a special-shaped polarizer with holes according to the present invention includes the following steps. First, provide a knife mold, a buffer layer, and an optical film group including a polarizing film. The cutter mold includes a base and a cutter. The base includes a plurality of punched portions with small holes. Xiao Kongshi It is qualitatively located at the center of gravity of the corresponding punching part. The cutter is arranged on the base. The tool includes a first tool and a second tool. The first cutter forms a plurality of closed structures on the surface of the base to define a plurality of stamping parts. The second cutter surrounds the small hole. The shapes of the multiple closed structures are irregular. Next, the buffer layer and the optical film group are stamped by a knife mold to form a plurality of shaped polarizers with holes. During the stamping process, the buffer layer is located between the knife mold and the optical film group. The compression force of the buffer layer after the stamping process is 0.03~0.035Mpa.

在本發明的一實施例中,上述的多個封閉結構的形狀為對稱或非對稱的幾何圖形。 In an embodiment of the present invention, the shapes of the plurality of closed structures are symmetrical or asymmetrical geometric figures.

在本發明的一實施例中,上述的第一刀具與第二刀具的高度為0.9~1.2mm。 In an embodiment of the present invention, the height of the above-mentioned first cutter and the second cutter is 0.9-1.2 mm.

在本發明的一實施例中,上述的第一刀具與第二刀具為雙斜刀,且第一刀具與第二刀具的刀身傾斜角為30度。 In an embodiment of the invention, the first cutter and the second cutter are double oblique cutters, and the inclination angle of the blades of the first cutter and the second cutter is 30 degrees.

在本發明的一實施例中,在藉由刀模對緩衝層以及光學膜片組進行沖壓製程的步驟中,刀模設置於第一平台上,光學膜片組設置於刀模上方,且提供第二平台,藉由使第一平台朝第二平台的方向移動以進行沖壓製程。 In an embodiment of the present invention, in the step of punching the buffer layer and the optical film group by the knife mold, the knife mold is disposed on the first platform, the optical film group is disposed above the knife mold, and provides The second platform moves the first platform toward the second platform to perform the stamping process.

在本發明的一實施例中,上述的緩衝層為泡綿。 In an embodiment of the invention, the buffer layer is foam.

在本發明的一實施例中,上述的緩衝層的厚度為0.7~1.5mm。 In an embodiment of the invention, the thickness of the buffer layer is 0.7-1.5 mm.

在本發明的一實施例中,上述的光學膜片組包括以此順序堆疊的四分之一波長膜、二分之一波長膜、偏光膜以及保護膜。 In an embodiment of the invention, the above-mentioned optical film set includes a quarter-wave film, a half-wave film, a polarizing film, and a protective film stacked in this order.

在本發明的一實施例中,上述的光學膜片組更包括光控制膜,且四分之一波長膜位於光控制膜與二分之一波長膜之間。 In an embodiment of the invention, the above-mentioned optical film set further includes a light control film, and the quarter-wave film is located between the light control film and the half-wave film.

在本發明的一實施例中,上述的光學膜片組更包括增亮膜,且增亮膜位於偏光膜與保護膜之間。 In an embodiment of the invention, the above optical film set further includes a brightness enhancement film, and the brightness enhancement film is located between the polarizing film and the protective film.

在本發明的一實施例中,上述的異形偏光片具有的孔洞的輪廓與第二刀具的刀面對應。 In an embodiment of the invention, the profile of the hole of the above-mentioned shaped polarizer corresponds to the blade surface of the second cutter.

本發明的具有孔洞的異形偏光片例如是由上述的具有孔洞的異形偏光片的形成方法形成。 The shaped polarizer with holes of the present invention is formed, for example, by the method for forming the shaped polarizer with holes described above.

在本發明的一實施例中,上述的孔洞的斷面為具有垂直孔洞的孔徑的亮面帶,且亮面帶貫穿孔洞的兩邊緣。 In an embodiment of the present invention, the cross-section of the hole is a bright surface band having an aperture of the vertical hole, and the bright surface band penetrates both edges of the hole.

基於上述,本發明藉由選用合適的緩衝層(例如其於進行沖壓製程後的壓縮力為0.03~0.035Mpa)以使包括偏光膜的光學膜片組於進行沖壓製程時產生的應力被吸收,藉此可使形成的異形偏光片避免翹曲及龜裂而具有平整的表面。 Based on the above, the present invention selects a suitable buffer layer (for example, the compression force after the stamping process is 0.03~0.035Mpa) so that the stress generated by the optical film group including the polarizing film during the stamping process is absorbed, Thereby, the formed shaped polarizer can avoid warpage and cracks and have a flat surface.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

10:刀模 10: knife mold

100:基座 100: Dock

100a:沖壓部 100a: stamping department

100b:小孔 100b: small hole

200:刀具 200: Tool

210:第一刀具 210: the first tool

212、222:內刀面 212, 222: inner blade surface

214、224:外刀面 214, 224: outer blade surface

220:第二刀具 220: second cutter

300:緩衝層 300: buffer layer

400a:光學膜片組 400a: Optical diaphragm group

410a:保護膜 410a: protective film

420:偏光片 420: polarizer

420a:偏光膜 420a: Polarizing film

420b:孔洞 420b: holes

430a:二分之一波長膜 430a: Half-wavelength film

440a:四分之一波長膜 440a: quarter wave film

450a:光控制膜 450a: light control film

460a:增亮膜 460a: Brightening film

1000:第一平台 1000: the first platform

2000:第二平台 2000: Second platform

A-A’:剖線 A-A’: section line

H1:高度 H1: height

H2、H3:厚度 H2, H3: thickness

L:孔徑 L: aperture

S100、S110、S120、S130:步驟 S100, S110, S120, S130: steps

圖1A為本發明的一實施例的刀模的俯視示意圖。 FIG. 1A is a schematic top view of a knife mold according to an embodiment of the invention.

圖1B為依據圖1A的剖線A-A’的剖面示意圖。 FIG. 1B is a schematic cross-sectional view taken along line A-A' of FIG. 1A.

圖2為本發明的一實施例的具有孔洞的異形偏光片的形成方 法的流程圖。 FIG. 2 is a forming method of a shaped polarizer with holes according to an embodiment of the invention Flow chart.

圖3為本發明的一實施例的光學膜片組於進行沖壓時的示意圖。 3 is a schematic diagram of an optical film assembly according to an embodiment of the present invention when punching.

圖4A為本發明的一實施例的光學膜片組的剖面示意圖。 4A is a schematic cross-sectional view of an optical film assembly according to an embodiment of the invention.

圖4B為本發明的另一實施例的光學膜片組的剖面示意圖。 4B is a schematic cross-sectional view of an optical film assembly according to another embodiment of the invention.

圖5為本發明的一實施例的具有孔洞的異形偏光片的俯視示意圖。 FIG. 5 is a schematic top view of a shaped polarizer with holes according to an embodiment of the invention.

在附圖中,為了清楚起見,放大了層、膜、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的構件。應當理解,當諸如層、膜或區域的構件被稱為在另一構件“上”或“連接到”另一構件時,其可以直接在另一構件上或與另一構件連接,或者中間構件可以也存在。相反,當構件被稱為“直接在另一構件上”或“直接連接到”另一構件時,不存在中間構件。 In the drawings, the thickness of layers, films, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same components. It should be understood that when a member such as a layer, film, or region is referred to as being “on” or “connected to” another member, it can be directly on or connected to the other member, or intervening members It can also exist. In contrast, when a component is referred to as being "directly on" or "directly connected to" another component, there are no intervening components.

圖1A為本發明的一實施例的刀模的俯視示意圖。圖1B為依據圖1A的剖線A-A’的剖面示意圖。圖2為本發明的一實施例的具有孔洞的異形偏光片的形成方法的流程圖。圖3為本發明的一實施例的光學膜片組於進行沖壓時的示意圖。 FIG. 1A is a schematic top view of a knife mold according to an embodiment of the invention. FIG. 1B is a schematic cross-sectional view taken along line A-A' of FIG. 1A. FIG. 2 is a flowchart of a method for forming a shaped polarizer with holes according to an embodiment of the invention. 3 is a schematic diagram of an optical film assembly according to an embodiment of the present invention when punching.

請同時參照圖1A、圖1B、圖2以及圖3,本實施例的具有孔洞的異形偏光片的形成方法例如具有以下步驟,但本發明不以此為限。 Please refer to FIG. 1A, FIG. 1B, FIG. 2 and FIG. 3 at the same time. For example, the method for forming a shaped polarizer with holes in this embodiment has the following steps, but the invention is not limited thereto.

在步驟S100中,提供刀模10。 In step S100, the knife mold 10 is provided.

刀模10可例如用於沖切製程中以裁切板材,在本實施例中,刀模10用於裁切包括偏光膜420a的光學膜片組400a。在一些實施例中,刀模10包括基座100以及刀具200。基座100以及刀具200例如是由相同的材料製作而成。亦即,基座100以及刀具200可例如是一體成型。 The knife mold 10 can be used, for example, in a die cutting process to cut a plate. In this embodiment, the knife mold 10 is used to cut an optical film group 400a including a polarizing film 420a. In some embodiments, the knife mold 10 includes a base 100 and a knife 200. The base 100 and the cutter 200 are made of the same material, for example. That is, the base 100 and the cutter 200 may be integrally formed, for example.

在一些實施例中,刀具200包括第一刀具210以及第二刀具220。第一刀具210以及第二刀具220例如為雙斜刀。亦即,第一刀具210以及第二刀具220各自具有兩個刀面。詳細地說,第一刀具210例如具有內刀面212以及外刀面214,且第二刀具220亦例如具有內刀面222以及外刀面224。此處的內刀面212(或內刀面222)是意指第一刀具210(或第二刀具220)中彼此面對的刀面,外刀面214(或外刀面224)是意指與內刀面212(或內刀面222)相對的刀面。第一刀具210以及第二刀具220例如具有實質上相同的高度。在一些實施例中,第一刀具210以及第二刀具220的高度H1為0.9~1.2mm。較佳地,第一刀具210以及第二刀具220的高度H1為1.2mm。第一刀具210以及第二刀具220亦例如具有實質上相同的刀身傾斜角。在一些實施例中,第一刀具210以及第二刀具220的刀身傾斜角為30度。 In some embodiments, the cutter 200 includes a first cutter 210 and a second cutter 220. The first cutter 210 and the second cutter 220 are, for example, double diagonal cutters. That is, the first cutter 210 and the second cutter 220 each have two cutter faces. In detail, the first cutter 210 has, for example, an inner cutter surface 212 and an outer cutter surface 214, and the second cutter 220 also has, for example, an inner cutter surface 222 and an outer cutter surface 224. Here, the inner blade surface 212 (or the inner blade surface 222) means the blade surfaces facing each other in the first cutter 210 (or the second cutter 220), and the outer blade surface 214 (or the outer blade surface 224) means the The blade surface opposed to the inner blade surface 212 (or the inner blade surface 222). The first cutter 210 and the second cutter 220 have substantially the same height, for example. In some embodiments, the height H1 of the first cutter 210 and the second cutter 220 is 0.9-1.2 mm. Preferably, the height H1 of the first cutter 210 and the second cutter 220 is 1.2 mm. The first cutter 210 and the second cutter 220 also have substantially the same blade tilt angle, for example. In some embodiments, the blade tilt angle of the first cutter 210 and the second cutter 220 is 30 degrees.

基座100例如具有由刀具200所定義出的多個沖壓部100a。詳細地說,刀具200設置於基座100的一表面上且以環繞一個區域的周圍的方式而設置,亦即,刀具200可於基座100的 一表面上形成封閉結構。在一些實施例中,第一刀具210於基座100的一表面上形成多個封閉結構,亦即,上述的每一封閉結構為沖壓部100a。在本實施例中,刀模10具有十個沖壓部100a,但本發明不以此為限。在一些實施例中,基座100的厚度H2為0.8mm~1.3mm。 The base 100 has, for example, a plurality of punching portions 100 a defined by the cutter 200. In detail, the cutter 200 is disposed on a surface of the base 100 and surrounds an area, that is, the cutter 200 can be disposed on the base 100 A closed structure is formed on one surface. In some embodiments, the first cutter 210 forms a plurality of closed structures on a surface of the base 100, that is, each of the above-mentioned closed structures is a stamping portion 100a. In this embodiment, the die 10 has ten stamping portions 100a, but the invention is not limited thereto. In some embodiments, the thickness H2 of the base 100 is 0.8 mm to 1.3 mm.

沖壓部100a(即,封閉結構)的形狀例如是配合板材經沖切製程後欲形成的形狀而定義。在一些實施例中,沖壓部100a的形狀為異型,其例如為對稱或非對稱的幾何圖形。在本實施例中,沖壓部100a的形狀為八邊形。因此,經使用本實施例的刀模10進行沖切製程而形成的異形偏光片亦具有八邊形的形狀,但本發明不以此為限。在一些實施例中,每一沖壓部100a具有小孔100b。小孔100b實質上位於沖壓部100a的重心,且例如被第二刀具220圍繞。亦即,第二刀具220也於基座100的一表面上形成多個封閉結構。因此,通過本實施例的刀模10進行沖切製程而形成的異形偏光片亦具有實質上位於其重心的孔洞。此外,由於沖壓部100a具有小孔100b,因此異形偏光片在經裁切的過程於其孔洞附近產生的碎屑可由小孔100b排出,以提升製程的便利性。 The shape of the punching portion 100a (ie, the closed structure) is defined, for example, according to the shape to be formed after the sheet material is subjected to the punching process. In some embodiments, the shape of the stamping portion 100a is irregular, which is, for example, a symmetrical or asymmetrical geometric figure. In this embodiment, the shape of the punching portion 100a is an octagon. Therefore, the shaped polarizer formed by the die-cutting process using the die 10 of this embodiment also has an octagonal shape, but the invention is not limited thereto. In some embodiments, each punching portion 100a has a small hole 100b. The small hole 100b is located substantially at the center of gravity of the punching portion 100a, and is surrounded by the second cutter 220, for example. That is, the second cutter 220 also forms a plurality of closed structures on a surface of the base 100. Therefore, the shaped polarizer formed by the die-cutting process of the knife mold 10 of this embodiment also has a hole substantially at the center of gravity. In addition, since the punching portion 100a has a small hole 100b, the debris generated in the vicinity of the hole of the shaped polarizer during the cutting process can be discharged from the small hole 100b to improve the convenience of the manufacturing process.

在步驟S110中,提供緩衝層300。 In step S110, a buffer layer 300 is provided.

緩衝層300可例如用於沖切製程中來緩和因光學膜片組400a本身的特性於裁切時造成的應力問題。此外,緩衝層300亦可用於防止刀模10與光學膜片組400a進行不當的接觸,而可延長刀模10的使用時間。緩衝層300可例如使用泡棉、微細胞聚合 物或各種型式的封閉及非封閉氣室的可壓縮材等材料製成。在本實施例中,緩衝層300的材料為泡棉。在一些實施例中,緩衝層300的厚度H3為0.7~1.5mm。較佳地,緩衝層300的厚度H3為1.5mm。 The buffer layer 300 can be used, for example, in the punching process to alleviate the stress caused by the characteristics of the optical film group 400a during cutting. In addition, the buffer layer 300 can also be used to prevent the blade die 10 from making improper contact with the optical film group 400a, thereby prolonging the use time of the blade die 10. The buffer layer 300 can use, for example, foam or micro cell polymerization It is made of compressible materials such as closed or non-closed air chambers and other types of materials. In this embodiment, the material of the buffer layer 300 is foam. In some embodiments, the thickness H3 of the buffer layer 300 is 0.7-1.5 mm. Preferably, the thickness H3 of the buffer layer 300 is 1.5 mm.

在步驟S120中,提供光學膜片組400a。 In step S120, an optical film group 400a is provided.

圖4A為本發明的一實施例的光學膜片組的剖面示意圖。圖4B為本發明的另一實施例的光學膜片組的剖面示意圖。 4A is a schematic cross-sectional view of an optical film assembly according to an embodiment of the invention. 4B is a schematic cross-sectional view of an optical film assembly according to another embodiment of the invention.

請參照圖4A以及圖4B,光學膜片組400a例如具有由多層膜彼此堆疊的結構,且約具有0.2~0.8mm的厚度。在一些實施例中,光學膜片組400a可包括以此順序堆疊的光控制膜450a、四分之一波長膜440a、二分之一波長膜430a、偏光膜420a以及保護膜410a,但本發明不以此為限。在另一些實施例中,光學膜片組400a可包括以此順序堆疊的四分之一波長膜440a、二分之一波長膜430a、偏光膜420a、增亮膜460a以及保護膜410a,但本發明不以此為限。 4A and 4B, the optical film group 400a has, for example, a structure in which multiple films are stacked on each other, and has a thickness of about 0.2 to 0.8 mm. In some embodiments, the optical film group 400a may include a light control film 450a, a quarter-wave film 440a, a half-wave film 430a, a polarizing film 420a, and a protective film 410a stacked in this order, but the present invention Not limited to this. In other embodiments, the optical film group 400a may include a quarter-wave film 440a, a half-wave film 430a, a polarizing film 420a, a brightness enhancement film 460a, and a protective film 410a stacked in this order. The invention is not limited to this.

在步驟S130中,藉由刀模10對緩衝層300以及光學膜片組400a進行沖壓製程,以形成多個具有孔洞的異形偏光片。 In step S130, the buffer layer 300 and the optical film group 400a are stamped by the knife mold 10 to form a plurality of shaped polarizers with holes.

請參照圖3,在進行沖壓製程時,緩衝層300是放置於刀模10以及光學膜片組400a之間。由於光學膜片組400a是由各自具有不同硬度的多層膜組成,因此,光學膜片組400a在經沖壓後會因此多層膜各自產生的應力不同而產生翹曲的問題。為解決上述問題,本實施例通過選用合適的緩衝層300吸收上述應力,以 避免形成的異形偏光片產生翹曲。緩衝層300所具有的材料及厚度已詳述於實施例中,於此不再贅述。在本實施例中,緩衝層300的厚度H3大於刀具200的高度H1。在一些實施例中,緩衝層300於進行沖壓製程後的壓縮力為0.03~0.035Mpa。當緩衝層300於進行沖壓製程後的壓縮力在上述範圍時,可確保緩衝層300將光學膜片組400a經沖壓後產生的應力完全吸收。 Please refer to FIG. 3, during the stamping process, the buffer layer 300 is placed between the knife mold 10 and the optical film group 400a. Since the optical film group 400a is composed of multilayer films each having a different hardness, the optical film group 400a may have a problem of warpage due to different stresses generated by the multilayer films after being punched. In order to solve the above problems, in this embodiment, an appropriate buffer layer 300 is selected to absorb the above stress, so as to Avoid warping of the formed polarizer. The material and thickness of the buffer layer 300 have been described in detail in the embodiments, and will not be repeated here. In this embodiment, the thickness H3 of the buffer layer 300 is greater than the height H1 of the tool 200. In some embodiments, the compression force of the buffer layer 300 after the stamping process is 0.03~0.035Mpa. When the compression force of the buffer layer 300 after performing the stamping process is within the above range, it can be ensured that the buffer layer 300 completely absorbs the stress generated by the optical film group 400a after stamping.

藉由刀模10對緩衝層300以及光學膜片組400a進行沖壓製程例如具有以下步驟。首先,將刀模10設置於第一平台1000上,且將緩衝層300以及光學膜片組400a設置於刀模10的上方。接著,提供第二平台2000,第二平台2000例如是沖壓平台。之後,使第一平台1000朝第二平台2000的方向移動,以使緩衝層300先接觸到刀模10後經壓縮。當刀模10接觸光學膜片組400a而使其經沖壓時,緩衝層300因經壓縮而在刀模10與光學膜片組400a之間產生0.03~0.035Mpa的壓縮力,以抵銷來自光學膜片組400a產生的應力。基於此,可避免形成的異形偏光片產生翹曲而變形。在另一些實施例中,亦可使第一平台1000朝第二平台2000的方向移動,本發明不以此為限。 The stamping process of the buffer layer 300 and the optical film group 400a by the knife mold 10 includes, for example, the following steps. First, the knife mold 10 is placed on the first platform 1000, and the buffer layer 300 and the optical film group 400a are placed above the knife mold 10. Next, a second platform 2000 is provided, which is, for example, a stamping platform. After that, the first platform 1000 is moved in the direction of the second platform 2000, so that the buffer layer 300 first contacts the knife mold 10 and then is compressed. When the die 10 contacts the optical film group 400a and is punched, the buffer layer 300 generates a compressive force of 0.03~0.035Mpa between the die 10 and the optical film group 400a due to compression to offset the The stress generated by the diaphragm group 400a. Based on this, it is possible to prevent the formed polarizer from being warped and deformed. In other embodiments, the first platform 1000 can also be moved in the direction of the second platform 2000, and the present invention is not limited thereto.

圖5為本發明的一實施例的具有孔洞的異形偏光片的示意圖。 FIG. 5 is a schematic diagram of a shaped polarizer with holes according to an embodiment of the invention.

請參照圖5,本實施例的具有孔洞420b的異形偏光片420是藉由前述的製造方法所形成。異形偏光片420的形狀可例如為對稱或非對稱的幾何圖形,其視刀模10具有的沖壓部100a的形 狀而定。在本實施例中,異形偏光片420的形狀為八邊形。異形偏光片420具有的孔洞420b的孔徑L例如為1.8mm~3.0mm。孔洞420b是經刀模10第二刀具220裁切所形成,因此,孔洞420b的輪廓會與第二刀具220的內刀面222對應。詳細地說,孔洞420b的斷面為具有垂直該孔洞420b的孔徑的亮面帶,且該亮面帶貫穿孔洞420b的兩邊緣。本實施例的異形偏光片420通過使用合適的緩衝層300於經前述的沖壓製程後而形成,其中緩衝層300於進行沖壓製程後的壓縮力為0.03~0.035Mpa。基於此,本實施例的異形偏光片420可避免翹曲而具有平整的表面。此外,本實施例的異形偏光片420具有的孔洞420b亦藉由進行上述的沖壓製程後一併形成,藉此可減少製程步驟,以降低製造成本。 Please refer to FIG. 5. The shaped polarizer 420 having a hole 420b in this embodiment is formed by the aforementioned manufacturing method. The shape of the special-shaped polarizer 420 may be, for example, a symmetrical or asymmetrical geometric figure, which depends on the shape of the punching portion 100a of the knife die 10 Depending on the situation. In this embodiment, the shape of the shaped polarizer 420 is an octagon. The hole diameter 420b of the hole 420b of the shaped polarizer 420 is, for example, 1.8 mm to 3.0 mm. The hole 420b is formed by cutting the second cutter 220 of the die 10, so the outline of the hole 420b corresponds to the inner blade surface 222 of the second cutter 220. In detail, the cross section of the hole 420b is a bright band with an aperture perpendicular to the hole 420b, and the bright band passes through both edges of the hole 420b. The shaped polarizer 420 of this embodiment is formed by using a suitable buffer layer 300 after the aforementioned stamping process, wherein the compressive force of the buffer layer 300 after the stamping process is 0.03~0.035Mpa. Based on this, the shaped polarizer 420 of this embodiment can avoid warpage and have a flat surface. In addition, the holes 420b of the shaped polarizer 420 of this embodiment are also formed by performing the above-mentioned stamping process, thereby reducing the number of process steps and reducing the manufacturing cost.

綜上所述,本發明藉由選用合適的緩衝層(例如其於進行沖壓製程後的壓縮力為0.03~0.035Mpa)以使包括偏光膜的光學膜片組於進行沖壓製程時產生的應力被吸收,藉此可使形成的異形偏光片避免翹曲而具有平整的表面。此外,本發明的異形偏光片具有的孔洞也藉由進行上述的沖壓製程後一併形成,藉此可減少製程步驟,以降低製造成本。 In summary, the present invention selects a suitable buffer layer (for example, the compression force after the stamping process is 0.03~0.035Mpa) so that the stress generated by the optical film group including the polarizing film during the stamping process is Absorption, so that the formed shaped polarizer can avoid warping and have a flat surface. In addition, the holes of the shaped polarizer of the present invention are also formed by performing the above-mentioned stamping process, thereby reducing the number of process steps and reducing the manufacturing cost.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

S100、S110、S120、S130:步驟 S100, S110, S120, S130: steps

Claims (13)

一種具有孔洞的異形偏光片的形成方法,包括: 提供刀模,其中所述刀模包括: 基座,包括具有小孔的多個沖壓部,其中所述小孔實質上位於對應的沖壓部的重心;以及 刀具,設置於所述基座上,其中所述刀具包括第一刀具以及第二刀具,所述第一刀具於所述基座的表面上形成多個封閉結構以定義出所述多個沖壓部,且所述第二刀具圍繞所述小孔,其中所述多個封閉結構的形狀為異形; 提供緩衝層; 提供包括偏光膜的光學膜片組;以及 藉由所述刀模對所述緩衝層以及所述光學膜片組進行沖壓製程,以形成多個具有所述孔洞的所述異形偏光片, 其中在進行所述沖壓製程時,所述緩衝層位於所述刀模以及所述光學膜片組之間,且 所述緩衝層於進行所述沖壓製程後的壓縮力為0.03~0.035Mpa。 A method for forming a shaped polarizer with holes, including: A knife mold is provided, wherein the knife mold includes: The base includes a plurality of punching parts having small holes, wherein the small holes are located substantially at the center of gravity of the corresponding punching parts; and A cutter is provided on the base, wherein the cutter includes a first cutter and a second cutter, the first cutter forms a plurality of closed structures on the surface of the base to define the plurality of stamping parts , And the second cutter surrounds the small hole, wherein the shapes of the plurality of closed structures are irregular; Provide a buffer layer; Providing an optical diaphragm set including a polarizing film; and Performing a stamping process on the buffer layer and the optical film group by the knife mold to form a plurality of the shaped polarizers having the holes, During the stamping process, the buffer layer is located between the knife mold and the optical film group, and The compression force of the buffer layer after performing the stamping process is 0.03~0.035Mpa. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述多個封閉結構的形狀為對稱或非對稱的幾何圖形。The method for forming a shaped polarizer with holes as described in item 1 of the patent application scope, wherein the shapes of the plurality of closed structures are symmetrical or asymmetrical geometric figures. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述第一刀具與所述第二刀具的高度為0.9~1.2 mm。The method for forming a shaped polarizer with holes as described in item 1 of the patent application range, wherein the heights of the first cutter and the second cutter are 0.9-1.2 mm. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述第一刀具與所述第二刀具為雙斜刀,且所述第一刀具與所述第二刀具的刀身傾斜角為30度。The method for forming a shaped polarizer with holes as described in item 1 of the patent application scope, wherein the first cutter and the second cutter are double oblique cutters, and the first cutter and the second cutter The blade tilt angle is 30 degrees. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中在藉由所述刀模對所述緩衝層以及所述光學膜片組進行所述沖壓製程的步驟中,所述刀模設置於第一平台上,所述光學膜片組設置於所述刀模上方,且提供第二平台,藉由使所述第一平台朝所述第二平台的方向移動以進行所述沖壓製程。The method for forming a shaped polarizer with holes as described in item 1 of the patent application scope, wherein in the step of performing the stamping process on the buffer layer and the optical film group with the knife mold, the The knife mold is disposed on the first platform, the optical film set is disposed above the knife mold, and a second platform is provided, which is performed by moving the first platform in the direction of the second platform Describe the stamping process. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述緩衝層為泡綿。The method for forming a shaped polarizer with holes as described in item 1 of the patent application range, wherein the buffer layer is foam. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述緩衝層的厚度為0.7~1.5 mm。The method for forming a shaped polarizer with holes as described in item 1 of the patent application, wherein the thickness of the buffer layer is 0.7 to 1.5 mm. 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述光學膜片組包括以此順序堆疊的四分之一波長膜、二分之一波長膜、所述偏光膜以及保護膜。The method for forming a shaped polarizer with holes as described in item 1 of the patent application range, wherein the optical film group includes a quarter-wave film, a half-wave film, and the polarized light stacked in this order Membrane and protective film. 如申請專利範圍第8項所述的具有孔洞的異形偏光片的形成方法,其中所述光學膜片組更包括光控制膜,所述四分之一波長膜位於所述光控制膜與所述二分之一波長膜之間。The method for forming a shaped polarizer with holes as described in item 8 of the patent application range, wherein the optical film group further includes a light control film, and the quarter-wavelength film is located between the light control film and the Between half-wavelength films. 如申請專利範圍第8項所述的具有孔洞的異形偏光片的形成方法,其中所述光學膜片組更包括增亮膜,所述增亮膜位於所述偏光膜與所述保護膜之間。The method for forming a shaped polarizer with holes as described in item 8 of the patent application range, wherein the optical film group further includes a brightness enhancement film, and the brightness enhancement film is located between the polarizing film and the protective film . 如申請專利範圍第1項所述的具有孔洞的異形偏光片的形成方法,其中所述異形偏光片具有的所述孔洞的輪廓與所述第二刀具的刀面對應。The method for forming a shaped polarizer with holes as described in item 1 of the patent application range, wherein the outline of the holes possessed by the shaped polarizer corresponds to the blade surface of the second cutter. 一種具有孔洞的異形偏光片,其使用如申請專利範圍第1項至第11項中任一項所述的具有孔洞的異形偏光片的形成方法形成。A shaped polarizer with holes is formed using the method for forming a shaped polarizer with holes as described in any one of claims 1 to 11. 如申請專利範圍第12項所述的具有孔洞的異形偏光片,所述孔洞的斷面為具有垂直所述孔洞的孔徑的亮面帶,且所述亮面帶貫穿所述孔洞的兩邊緣。As described in Item 12 of the patent application scope, the polarized polarizer with holes has a cross section of a bright surface band having an aperture perpendicular to the hole, and the bright surface band penetrates both edges of the hole.
TW108106766A 2019-02-27 2019-02-27 Polarizer with different shape having hole and manufacturing method thereof TWI693136B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108106766A TWI693136B (en) 2019-02-27 2019-02-27 Polarizer with different shape having hole and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108106766A TWI693136B (en) 2019-02-27 2019-02-27 Polarizer with different shape having hole and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI693136B true TWI693136B (en) 2020-05-11
TW202031443A TW202031443A (en) 2020-09-01

Family

ID=71896056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108106766A TWI693136B (en) 2019-02-27 2019-02-27 Polarizer with different shape having hole and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI693136B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730314A (en) * 2006-01-12 2007-08-16 Sumitomo Chemical Co Method of manufacturing optical film product
TW200834127A (en) * 2006-10-31 2008-08-16 Mitsubishi Rayon Co Method for cutting a prism sheet
TW201805095A (en) * 2016-07-22 2018-02-16 日商日東電工股份有限公司 Method for manufacturing polarizing plate and apparatus for manufacturing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200730314A (en) * 2006-01-12 2007-08-16 Sumitomo Chemical Co Method of manufacturing optical film product
TW200834127A (en) * 2006-10-31 2008-08-16 Mitsubishi Rayon Co Method for cutting a prism sheet
TW201805095A (en) * 2016-07-22 2018-02-16 日商日東電工股份有限公司 Method for manufacturing polarizing plate and apparatus for manufacturing same

Also Published As

Publication number Publication date
TW202031443A (en) 2020-09-01

Similar Documents

Publication Publication Date Title
US20180236569A1 (en) Method for producing differently shaped polarizing plate
EP3498880B1 (en) Mask plate and evaporation device
JP6505152B2 (en) Bulk acoustic wave resonator and mass acoustic wave filter with mass adjustment structure
KR102466362B1 (en) A support substrate and a method of manufacturing semiconductor packages using the same
TWI693136B (en) Polarizer with different shape having hole and manufacturing method thereof
JP2007165371A (en) Method of manufacturing semiconductor device
CA3145071A1 (en) Three-dimensional molding method
CN106684016A (en) A laminating apparatus and a system for fabricating a semiconductor device
CA2889188A1 (en) Pressure relief device having a laser-defined line of opening
TW202039396A (en) Method for manufacturing glass sheet, and glass sheet and glass sheet assembly
US6890800B2 (en) Method of manufacturing semiconductor device with ceramic multilayer board
JP2008123726A (en) Safety valve of sealed battery
KR102161092B1 (en) Method for manufacturing rupture disc using laser beam
US20230137981A1 (en) Display screen and cutting method thereof
JP5617320B2 (en) Sheet material punching
US20150373841A1 (en) Core and printed circuit board
TWI680059B (en) Fixture for bonding and method for bonding
JP4999029B1 (en) Cut and sintered ceramic sheet and manufacturing method thereof
JPS5947028A (en) Back drawing press die
JP4418373B2 (en) Semiconductor device
JP2002011697A (en) Cutting method of plastic substrate for liquid crystal display panel
KR101445959B1 (en) Mold for forming a liquid crystal display film
KR102350662B1 (en) Cutting apparatus for optical film
US11589457B2 (en) Wiring substrate
TWI586525B (en) Apparatus and method for manufacturing unit laminate rubber