TWI692645B - Good product/non-good product classification system and method of tested IC - Google Patents

Abstract

A good product/non-good product sorting system for detected ICs is mainly used to transfer the material tray and the IC by the material tray transfer device and the IC transfer device, and a to-be-sorted area, a temporary waiting area and a non-good product area are provided for A material tray is accommodated, and the material tray contained in the temporary waiting area is moved from the area to be sorted by the material tray transferring device, and the material tray contained in the non-good product area is moved by the material tray transferring device. The waiting area moved over. In addition, in the classification method, the non-good product IC of the to-be-sorted area is moved to the tray of the non-good product area, and the vacant space left by the to-be-sorted area is filled by the good product IC of the temporary area, which can be completed IC classified operations.

Description

Good product/non-good product classification system and method of tested IC

The present invention relates to IC classification technology, and particularly refers to a system and method for classifying detected ICs according to their good products/non-good products.

my country's invention patent No. I333550, discloses a sorting technology for good/non-good products that have been tested. The case stated on page 7 of the manual that its main technical focus is that, after the inspection of the IC is completed, the tray will be moved to the third temporary area and the fourth temporary area using the third transfer device, and then reused The four shifter moves the tray to the fifth temporary area and/or the sixth temporary area, and then uses the fifth shifter to move the tray to the good product exchange area or the secondary product exchange area, and finally replace the material The device comes to exchange IC between the good product exchange area, the secondary product exchange area and the non-good product receiving area.

From the technical content of the above case, it can be seen that after the IC detection, the IC trays have up to four temporary areas (third to sixth temporary areas) before classification, and they are in the good product exchange area and the secondary product exchange area. The classification of non-good products exchange area needs to be transferred. There are also three areas here, so a total of at least seven areas and a transfer device are needed to complete the classification of IC good products/non-good products. Such a classification method is too complicated, and The design of multiple areas also causes space occupancy, making the machine of the sorter bulky.

In view of the fact that the currently known prior art is too complicated for the classification of detected ICs, not only must multiple areas be placed to place the IC tray, but also a considerable number of transfer equipment and transfer paths are required, and Because the space requirement for classification is very large, the problem is that the overall size of the machine is too large.

Based on the above problems, the present invention proposes a sorted system of good/non-good products that has detected ICs, which can solve the aforementioned prior art problems. The system includes: a tray transfer device for moving the tray, which is used for To load multiple ICs; IC transfer device to move ICs on one tray to another tray; to-be-sorted area to accommodate trays filled with ICs that have been tested but not yet classified. Contains good product IC and non-good product IC; the waiting area is used to accommodate the material tray, and the contained material tray is moved from the area to be sorted by the material tray transferring device, and the material tray is located in the waiting area Only load good product IC; and at least one non-good product area for accommodating the material tray, and the contained material tray is moved from the waiting area by the material tray transfer device, the material located in the at least one non-good product area The disc is only loaded with non-good product IC.

In addition, according to the above problems, the present invention also proposes a method for classifying non-defective products of detected ICs, which can solve the above-mentioned problems of the prior art. The method includes the following steps: A) Preparation: placing unloaded products in at least one non-good product area An empty tray with any IC; B) Feed tray: Move the tray filled with the tested IC to the area to be sorted; C) Move the non-good product IC: Move all non-good products in the tray to be sorted The good product IC is moved to the tray of the at least one non-good product area; D) The material tray is moved from the to-be-sorted area to the temporary waiting area: the tray with the good-good IC loaded in the to-be-sorted area is moved to the waiting area , And move the next tray full of tested ICs to the area to be sorted; E) Move non-good product IC: Move all non-good products ICs located on the tray of the to-be-sorted area to the at least one non-good product On the tray of the area, there is an empty space on the tray of the area to be sorted; if there is a non-good product IC on the tray of the area to be sorted and the tray of the at least one non-good product area is full, skip to step I) Otherwise, go to the next step; F) Move the good product IC: move the good product IC located on the tray of the waiting area to the empty position on the tray of the waiting area until the tray of the waiting area is full Until the good product IC; G) Move the tray full of good product IC: When the tray of the to-be-sorted area is filled with good IC, move it away from the to-be-sorted area, and then move the next tray full of tested ICs Go to the area to be sorted; H) Determine whether the tray in the waiting area is empty: If the tray in the waiting area is not empty, go back to step E); If the tray in the waiting area is empty, move Away from the tray of the at least one non-good product area, and move the empty tray of the waiting area to the at least one non-good product area, and when the number of the at least one non-good product area is greater than two, the Place an empty tray in the good product area, and return to step C); I) Move the tray full of non-good product ICs: Move the tray full of non-good product ICs away from the at least one non-good product area; J) Move the good product IC: The good product IC on the tray in the waiting area is moved to an empty position on the tray in the waiting area, and the tray in the waiting area becomes an empty tray; and K) Move the empty tray: empty the tray The tray moves to the at least one non-good product area, and returns to step C).

With the above-mentioned system and method, the present invention has an area used for exchanging trays compared to the prior art, and is sufficient for IC classification. Therefore, the space required for the classification process can be greatly saved, and the volume of the overall machine can be greatly reduced.

In order to explain the technical features of the present invention in detail, the following preferred embodiments are described below with reference to the drawings, in which:

As shown in FIG. 1, a good/non-good sorting system (10) for ICs proposed in the first preferred embodiment of the present invention is mainly composed of a tray transfer device (11) and an IC transfer device (21) , To be classified area (31), temporary waiting area (41) and non-good product area (51), including:

The material tray transfer device (11) is used to move the material tray (91), and the material tray (91) is used to load a plurality of ICs. The material tray transfer device (11) is mainly composed of fixtures, X-axis and Y-axis linear slide rails and other devices when it is implemented. Since the fixture and linear slide rails are well known, their detailed structure and assembly method I won't go into details.

The IC transfer device (21) is used to transfer the IC (92) on one tray (91) to another tray (91). The IC transfer device (21) is mainly composed of fixtures, linear slide rails and other devices when it is implemented. Since the fixtures and linear slide rails and other components are well known, the detailed structure and assembly method will not be described in detail. In addition, in actual implementation, the IC transfer device (21) and the tray transfer device (11) can be made on the same set of linear slide rails, but only on the clamping jaws, respectively, so in the scheme of this case It is only shown schematically in block diagram.

The to-be-sorted area (31) is used to accommodate a tray (91) filled with ICs (92) that have been tested and not yet sorted. These ICs (92) include good ICs (92G) and non-good ICs (92N) ).

The temporary waiting area (41) is used to accommodate the material tray (91), and the contained material tray (91) is moved from the area to be sorted (31) by the material tray transferring device (11) and is located at The tray (91) of the waiting area (41) is only loaded with good product IC (92G).

The non-good product area (51) is used for accommodating the tray (91), and the accommodated tray (91) is moved from the temporary area (41) by the tray transfer device (11) and is located in the non-conforming area The tray (91) of the good product area (51) is loaded with only non-good product IC (92N). In the first embodiment, the number of non-defective areas (51) is taken as an example. Since there is only one non-defective area (51), the non-defective areas are classified as defective products in terms of classification.

Among them, the non-defective IC (92N) located on the tray (91) of the to-be-sorted area (31) can only be moved to the tray (91) of the non-defective area (51) by the IC transfer device (21) The good product IC (92G) located on the tray (91) of the waiting area (41) can only be moved to the tray (91) of the to-be-sorted area (31) by the IC transfer device (21). When the non-defective ICs (92N) on the tray (91) in the to-be-sorted area (31) are moved to the tray (91) in the non-defective area (51), an empty space is left. The good product IC (92G) on the tray (91) in the waiting area (41) is moved over, so that the material tray (91) in the waiting area (31) is fully loaded with the good product IC (92G). In addition, the area to be sorted (31), the temporary area (41) and the non-good product area (51) can be set on the same plane on a machine (not shown), such a setting The method can make the material tray (91) and the IC (92) more convenient in transfer.

In this embodiment, there is also a good product cartridge (61) and a non-good product cartridge (62). The good product cassette (61) is used for stacking the trays (91) containing the full-load ICs (92G). The tray transfer device (11) removes the trays (91) full of the ICs (92G) from the standby The classification area (31) moves to the good product cassette (61). The non-good product cartridge (62) is used for stacking the tray (91) containing the non-good product IC (92N). The tray transfer device (11) transfers the tray (91) full of the non-good product IC (92N) from The non-good product area (51) moves to the non-good product cassette (62).

The good/non-good product classification system (10) of the tested IC in the foregoing embodiment is classified by the following classification method when it is used.

As shown in Figures 2 to 11, for the convenience of explanation, in the drawings of this case, the wide-line arrows indicate the starting and ending positions of the tray (91) movement, and the thick black-line arrows indicate the IC (92 ) The starting and ending positions of the movement, the method for classifying good products and non-good products of the tested IC of the present invention, has the following steps:

A) Preparation: As shown in Figure 1, an empty tray (91) without any IC is placed in the non-good product area (51). For example, there are 24 spaces on a tray (91) for the IC (92).

B) Feed tray: As shown in Figure 2, move the tray (91) loaded with the tested IC (92) to the area to be sorted (31). The wide line arrow in the figure indicates the tray ( 91) The direction entered from the outside is not a state where it interferes with the linear slide of the tray transfer device (11) or the IC transfer device (21). Generally speaking, a good product IC (92G) on a tray (91) full of tested ICs (92) is the majority, and only a few ICs (92) will be non-good products, that is, non-good products IC (92N) The number will be very small. Among the 100 tested ICs (92), there may be occasionally 1~2 non-good product ICs (92N). Therefore, in this embodiment, a material tray (91) will contain 1~ The status of 2 non-good products IC (92N) will be explained.

C) Move non-good product IC: As shown in Figure 3, move all non-good product ICs (92N) on the tray (91) located in the to-be-sorted area (31) to the tray (51) of the non-good product area (51) 91) on. For the first time, for example, there are 2 non-good products IC (92N) moved to the tray (91) of the non-good product area (51), so the to-be-sorted area (31) tray (91) There are 22 good ICs (92G) and 2 vacancies, and the situation of jumping back to this step from the following steps can be deduced by analogy.

D) Move the tray from the area to be sorted to the temporary area: as shown in Figure 4, move the tray (91) located in the area to be sorted (31) and also loaded with good products IC (92G) to the temporary Waiting area (41), and move the next tray (91) loaded with detected IC (92) to the waiting area (31). At this time, the material tray (91) filled with the detected IC (92) after the aforementioned first material tray and then into the to-be-sorted area (31) is the material for the second entry The disc is also loaded with good product IC (92G) and non-good product IC (92N). For example, it also has 2 non-good product IC (92N) and 22 good product IC (92G). Subsequent entry trays are deduced by analogy.

E) Move non-good product IC: As shown in Figure 5, move all non-good product ICs (92N) located on the tray (91) of the to-be-sorted area (31) to the tray of the non-good product area (51) ( 91), the material tray (91) of the to-be-sorted area (31) is left with vacancies. If there are 2 non-good product ICs (92N), there are 2 vacancies left. After multiple loops between step C) and step H), if there is a non-good product IC (92N) on the tray (91) of the area to be sorted (31) and the tray of the non-good product area (51) (91) If it is full, skip to step I), otherwise go to the next step.

F) Move good product IC: As shown in Figure 6, move the good product IC (92G) located on the tray (91) in the waiting area (41) to the tray (91) in the waiting area (31) Until the tray (91) in the area to be sorted (31) is fully loaded with good product IC (92G). At the stage of the second-entry tray to be sorted (91) mentioned above, 4 good ICs (92G) on the tray in the waiting area (41) are removed, so 4 is left Vacancies.

G) Move the tray with full-load IC products: As shown in Figure 7, when the tray (91) of the to-be-sorted area (31) is full of good products (92G), move it away from the to-be-sorted area (31) and Move to the good product cartridge (61), and then move the next tray (91) filled with the tested IC (92) to the area to be sorted (31).

H) Determine whether the tray in the non-good product area is full: Please refer to Figure 8 for the rest of the description of this step. If the tray (91) in the temporary area (41) is not empty, return to step E) to For the tray (91) to be sorted for the second time, the tray (91) located in the non-good product area (51) is loaded with only 4 non-good product ICs (92N), which also represents the current waiting area There are 4 positions left on the tray (91) of the (41) because of the removal of the good product IC (92G), which is not yet empty, that is, it should return to step E); and repeat step E) to As a result of step H), the good product IC (92G) on the tray (91) of the waiting area (41) will eventually be removed, the tray (91) is an empty tray, and the non-good product area (51) The tray (91) must be filled with non-good product IC (92N). Therefore, as shown in Figure 8, if the tray (91) of the waiting area (41) is empty, the tray (91) of the non-good product area (51) is removed and moved to the non-good product cassette (62) ), and move the empty tray (91) of the waiting area (41) to the non-good product area (51), and return to step C). As for why the tray (91) in the waiting area (41) is empty, the tray (91) in the non-good product area (51) is bound to be filled with non-good product IC (92N)? This is because all the good ICs (92G) of this empty tray (91) replenish the space after the removal of all the non-good ICs (92N) located on the tray (91) of the to-be-sorted area (31), so this The number of empty positions on the empty tray (91) will be the same as the number of non-defective ICs (92N) on the tray (91) of the non-defective area (51). Therefore, when the tray (91) of the waiting area (41) is empty, it means that all good ICs (92G) on the tray (91) of the waiting area (41) have been moved to the waiting area The reel (91) of (31), and furthermore, the reel (91) representing the non-good product IC (92N) just happens to be filled with the non-good product area (51). If the tray (91) in the non-good product area (51) is full but the non-good product IC (92N) on the tray (91) in the to-be-sorted area (31) has not been completely removed, then step E ), a judgment will occur and skip to step I) without going to this step.

I) Move the tray full of non-good products IC: As shown in Figure 9, move the tray (91) filled with non-good products IC (92N) away from the non-good product area (51) and move to the non-good product cartridge (62) At this time, the material tray (91) of the to-be-sorted area (31) has a space for removing the non-good product IC (92N), and also has the non-good product IC (92N) that has not been removed.

J) Move good product IC: As shown in Figure 10, move the good product IC (92G) located on the tray (91) of the temporary waiting area (41) to the tray (91) of the waiting area (31) In the empty space above, the tray (91) in the waiting area (41) becomes an empty tray. In this step, the reason why the tray (91) of the waiting area (41) becomes an empty tray is the same as the reason of the aforementioned step H), and will not be repeated here.

K) Move the empty tray: As shown in Figure 11, move the empty tray (91) to the non-good product area (51), and return to step C).

After sorting according to the above method, the good product IC (92G) and the non-good product IC (92N) can be concentrated on two trays (91), and stacked and stored in the good product cassette (61) and the non-good product respectively The cassette (62) completes the IC classification. It can be seen that the present invention only uses a total of three areas to be sorted (31), a temporary area (41), and a non-good product area (51) to place the material tray (91), in conjunction with the IC transfer device (21) The IC classification can be completed by moving the IC (92) and moving the tray (91) in conjunction with the tray transfer device (11). Compared with the prior art, this case has less area to exchange the material tray (91), and is enough to complete the IC classification, so it can greatly save the space required for the classification process, and thus greatly reduce the size of the overall machine.

The above description only shows that there is only one non-good product area, so only two grades of good product and bad product can be classified. However, if you want to be more detailed in the classification, for example, if you want to separate three grades of good product, secondary product and bad product, then you can set the non-good product area to two, and make a non-good product area. The good product area is regarded as the secondary product area, and the other non-good product area is regarded as the defective product area.

As shown in FIG. 12, a good/non-good product classification system (10') of a detected IC according to the second preferred embodiment of the present invention is mainly the same as the first embodiment disclosed above, except for:

The non-good product area (51') has two, which are defined as a secondary product area (511') and a defective product area (512'). For the cassette part, a primary product cassette (621') and a defective product cassette (622') can be provided correspondingly. In addition, if in practice it is deemed that the defective IC (92F) is not necessary for recycling and sorting, then Instead of installing a defective product cassette (622'), the tray containing the defective IC (92F) can be emptied and recycled. The remaining structure of the second embodiment is the same as the first embodiment disclosed above.

In the operation of this second embodiment, the difference in classification method from the aforementioned first embodiment is that the non-good product IC (92N) has to be further classified into secondary product IC (92S) and defective product IC (92F). , The non-good product area (51') also becomes the secondary product area (511') and the defective product area (512'). Therefore, in the classification step, the second embodiment is roughly the same as the aforementioned Steps A) to K) of an embodiment are the same. The following only describes the differences for the part where the non-good product area (51') becomes two:

In step A), as shown in Fig. 13, an empty tray (91') without any IC is placed in the secondary product area (511') and the defective product area (512').

In steps C) and E), as shown in Figure 14, when the non-good product IC (92N) is moved, all non-good product ICs on the tray (91') located in the area to be sorted (31') (92N) Move to the tray (91') of the secondary product area (511') or the defective product area (512') according to its grade (secondary product IC (92S) or defective product IC (92F)) on. In addition, in step E), if there is a non-good product IC (92N) on the tray (91') of the area to be sorted (31') and the tray (91') of the secondary product area (511') Or if the tray (91') of the defective product area (512') is full, skip to step I).

In step H), as shown in Fig. 15, after the good product IC (92G) on the tray (91') of the waiting area (41') is completely removed, the tray (91') is empty The tray is moved away from the tray (91') of the secondary product area (511') and the tray (91') of the defective product area (512') to the secondary product cartridge (621') ) And the defective product cartridge (622'), and move the empty tray (91') of the waiting area (41') to the secondary product area (511'), and due to the defective product area (512 ') There is no tray, so place an empty tray (91') in the defective area (512'), and return to step C). In this step H), since all good ICs (92G) on the empty tray (91') of the waiting area (41') are replenishing all trays (91' located in the waiting area (31') ) Is the space after the non-good product IC (92N) is moved, so the number of empty spaces on this empty tray (91') will be equal to the secondary products on the tray (91') of the secondary product area (511') The total number of ICs (92S) plus the number of defective ICs (92F) on the tray (91') of the defective area (512'). That is to say, if the tray (91') in the waiting area (41') is empty, and the non-good product IC (92N) has secondary product IC (92S) and bad product IC (92F) , Then the tray (91') of the secondary product area (511') and the tray (91') of the defective product area (512') will not be full; if the non-good product IC (92N) Only the secondary product IC (92S) but no defective product IC (92F), then the tray (91') of the secondary product area (511') will be full, but the defective product area (512') The tray (91') will be empty. Therefore, before moving the empty tray (91') of the temporary product to the secondary product area (511'), regardless of the tray of the secondary product area (511') and the defective product area (512') If (91') is full, move them away.

In step I), as shown in Figure 16, the tray (91') of the secondary product area (511') and the tray (91') of the defective product area (512') are moved to their corresponding The secondary product cartridge (621') and the defective product cartridge (622').

In step K), as shown in Figure 17, the empty tray (91') of the waiting area (41') is moved to the secondary product area (511'), and due to the defective product area (512 ') There is no tray, so place an empty tray (91') in the defective area (512'), and return to step C).

Through the above method, the second embodiment can achieve the effect of second-order classification (ie, secondary products and defective products) of non-good IC (92N), which is more detailed than the classification of the foregoing first embodiment.

It is worth reiterating that if more grades of non-defective IC (92N) are to be classified, only the corresponding number of non-defective areas (51') need to be planned, according to the second embodiment. Steps to achieve.

The remaining operation modes and the achievable effects of the second embodiment are the same as those in the previous embodiment, and will not be repeated here.

(10): Good product/non-good product classification system of tested IC

(11): Material tray transfer device

(21): IC transfer device

(31): Area to be classified

(41): waiting area

(51): Non-good product area

(61): Good product cartridge

(62): Non-good product cartridge

(91): feed tray

(92): IC

(92G): Good product IC

(92N): Non-good product IC

(10’): The IC's good/non-good product classification system has been tested

(31’): Area to be classified

(41’): waiting area

(51’): Non-good product area

(511’): Secondary product area

(512’): Defective area

(621’): Substandard product cartridge

(622’): defective cartridge

(91’): feeding tray

(92F): Defective IC

(92S): Substandard IC

Figure 1 is a block diagram of the first preferred embodiment of the present invention. Figure 2 is an action diagram of the first preferred embodiment of the present invention, showing the action of step B). Figure 3 is an action diagram of the first preferred embodiment of the present invention, showing the action of step C). Figure 4 is an action diagram of the first preferred embodiment of the present invention, showing the action of step D). Figure 5 is an action diagram of the first preferred embodiment of the present invention, showing the action of step E). Figure 6 is an action diagram of the first preferred embodiment of the present invention, showing the action of step F). Figure 7 is an action diagram of the first preferred embodiment of the present invention, showing the action of step G). Figure 8 is an action diagram of the first preferred embodiment of the present invention, showing the action of step H). Figure 9 is an action diagram of the first preferred embodiment of the present invention, showing the action of step I). Figure 10 is an action diagram of the first preferred embodiment of the present invention, showing the action of step J). Figure 11 is an action diagram of the first preferred embodiment of the present invention, showing the action of step K). FIG. 12 is a schematic block diagram of a second preferred embodiment of the present invention. Figure 13 is an action diagram of the second preferred embodiment of the present invention, showing the action of step A). Figure 14 is an action diagram of the second preferred embodiment of the present invention, showing the action of step C). Figure 15 is an action diagram of the second preferred embodiment of the present invention, showing the action of step H). Figure 16 is an action diagram of the second preferred embodiment of the present invention, showing the action of step I). Figure 17 is an action diagram of the second preferred embodiment of the present invention, showing the action of step K).

(10): Good product/non-good product classification system of tested IC

(11): Material tray transfer device

(21): IC transfer device

(31): Area to be classified

(41): waiting area

(51): Non-good product area

(61): Good product cartridge

(62): Non-good product cartridge

(91): feed tray

(92): IC

(92G): Good product IC

(92N): Non-good product IC

Claims (4)

A method for classifying good products/non-good products of tested ICs, including the following steps: A) Preparation: Place an empty tray without any ICs in at least one non-good product area; B) Feed tray: fill the loaded tray with the tested products Move the IC tray to the area to be sorted; C) Move the non-good product IC: Move all non-good products ICs located on the tray to be sorted to the at least one non-good product area; D) Move the tray Move from the waiting area to the waiting area: move the tray with the good product IC in the waiting area to the waiting area, and move the next tray full of tested ICs to the waiting area ; E) Move non-good product IC: Move all non-good product ICs located on the tray of the to-be-sorted area to the tray of the at least one non-good product area, leaving a blank space on the tray of the to-be-sorted area; If there is a non-good product IC on the tray of the area to be sorted and the tray of the at least one non-good product area is full, skip to step I), otherwise go to the next step; F) Move the good product IC: it will be located in the temporary The good product IC on the tray of the zone is moved to the empty position on the tray of the to-be-sorted area until the tray of the to-be-sorted area is fully loaded with the good product IC; G) The tray of the full-loaded good product IC: the tray of the to-be-sorted area When it is full of good products, move it away from the area to be sorted, and then move the next tray filled with the tested IC to the area to be sorted; H) Determine whether the tray in the temporary area is empty: if If the tray in the waiting area is not empty, return to step E); if the tray in the waiting area is empty, move away from the tray in the at least one non-good product area, and remove the empty material in the waiting area The tray moves to the at least one non-good product area, and when the number of the at least one non-good product area is greater than two, place an empty tray for the non-good product area without the tray, and return to step C); I) Move the fully loaded non-good product IC tray: move the tray filled with non-good products from the at least one non-good product area; J) Move good product IC: Move the good product IC located on the tray of the waiting area to the empty position on the tray of the waiting area, then the tray of the waiting area becomes the empty tray; and K) Move empty tray: move the empty tray to the at least one non-good product area, and return to step C). According to item 1 of the scope of patent application, the method for classifying good products/non-good products of detected ICs, in which: in step G), removing the tray filled with good ICs from the area to be classified means removing the tray from the To be sorted area moved to a good product cassette. According to item 1 of the scope of patent application, the method for classifying good products/non-good products of detected ICs, wherein: in step H) and step I), the tray filled with non-good products ICs in the at least one non-good product area is Refers to moving the material tray from the at least one non-good product area to at least one non-good product cartridge. The method for classifying good products/non-good products of tested ICs according to item 1 of the patent application scope, wherein: the at least one non-good product area in each step is a plural number, and each non-good product area is used to place a tray.

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