TWI692124B - Light emitting module packaging process - Google Patents

Abstract

A multiple color light emitting module packaging process is provided. The packaging process of light emitting module includes: provide a substrate with a plurality of position references on a top surface of the substrate; adhere a transparent membrane to the top surface of the substrate; adhere a plurality of different color light emitting devices on the top surface of the transparent membrane, wherein the plurality of different color light emitting devices is positioned by a wire bonder according to the plurality of position references, or the plurality of different color light emitting devices is formed by dicing a LED wafer positioned according to the plurality of position references with a plurality of fluorescent layers in different color formed on the LED wafer; form a light blockage layer at gaps between any two of the light emitting devices; dice the light blockage layer. The invention reduces manufacturing error and improves yield rate by fixing chips with adhesive during packaging process.

Description

Light source module packaging process

The invention relates to a packaging method of a light source module.

Light Emitting Diode (LED) has the advantages of high brightness, small size, light weight, not easy to break, low power consumption and long life, so it is widely used in various light-emitting products and display products. The principle of light emission is mainly to apply a voltage to the diode to drive the electrons in the diode to combine with the hole, and the energy generated by the combination is released in the form of light. In addition, the conventional light-emitting device mainly modifies the surface of the light-emitting diode wafer to adjust the light-emitting wavelength (color) and intensity.

In the packaging process of light-emitting diodes, a fluorescent layer, a light-blocking layer, a protective layer and other structures are formed around the chip to achieve changes in color temperature, control of the light-emitting angle, adjustment of the packaging structure, protection of the chip to extend the service life, etc. purpose.

At present, in order to improve the heat dissipation efficiency of the light emitting diode and increase the application range, how to produce a small volume light emitting diode chip is an important issue. From formal wafers, flip-chips, sub-millimeter wafers (mini LED) to micro-LEDs (micro LEDs), the size of the wafers has been reduced from hundreds of microns to tens of microns, and even micro-wafers are only 15 microns. The shrinking of the size makes the packaging process more difficult, especially due to the deviation of the placement of the wafer or the position shift due to processing, which will lead to the failure to accurately form the packaging structure layer and the inaccurate cutting, which reduces the yield of the packaging process.

In view of the above, it is necessary to provide a light source module packaging process for fixing the light-emitting device or the light-emitting diode wafer with adhesive glue during the packaging process, thereby reducing processing errors and improving the yield of the packaging process.

The packaging process of a light source module includes the following steps: providing a substrate with a plurality of position reference points on the upper surface of the substrate; adhering a transparent film to the substrate, wherein the transparent film has an upper surface and a lower surface , The lower surface contacts the upper surface of the substrate; adhere a plurality of light-emitting devices to the upper surface of the transparent film, wherein the positions of the plurality of light-emitting devices are determined based on the plurality of position reference points, each light-emitting device has a The electrode surface of the electrode and a light-emitting surface opposite to the electrode surface, the light-emitting surface of the light-emitting device contacts the upper surface of the transparent film; forming a light-blocking layer between any two of the light-emitting device gap; cutting any two of the light-emitting device The light blocking layer of the gap between the light emitting devices.

In one embodiment, the position reference point is a point, line, or closed shape that can be recognized by a die bonding machine, a placement machine, or a wafer arranging machine.

In one embodiment, the upper surface and the lower surface of the transparent film have a dip glue, and the material of the dip glue includes silicon glue, acrylic glue, UV glue, pyrolysis glue, or a mixture of any combination of the above.

In an embodiment, the plurality of light-emitting devices include at least a first color temperature light-emitting device and a second color temperature light-emitting device.

In one embodiment, the light-blocking layer includes a first light-blocking layer, and the forming of the first light-blocking layer includes the following steps: adhering the light-blocking powder particles to any two transparent films in the gap between the light-emitting devices On the surface, a first light-blocking layer is formed.

The invention also provides a packaging process for a light source module, which includes the following steps: providing a substrate with a plurality of position reference points on the upper surface of the substrate; adhering a transparent film to the substrate, wherein the transparent film has a top The surface and the lower surface, the lower surface contacts the upper surface of the substrate; adhere a wafer to the upper surface of the transparent film, wherein the position of the wafer is determined based on the plurality of position reference points, the wafer has a An electrode surface of the electrode and a light emitting surface opposite to the electrode surface, the electrode surface of the wafer contacts the upper surface of the transparent film; forming a first color temperature fluorescent layer and a second color temperature fluorescent layer on the light emitting surface; Turn the wafer over and attach the wafer to the upper surface of the transparent film, with the electrode of the wafer facing upward; cut the wafer to form a gap between a plurality of light-emitting devices and any two of the light-emitting devices; forming a resistance The light layer is in the gap; the light blocking layer is cut.

In one embodiment, the position reference point is a point, line, or closed shape that can be recognized by a wafer handling system, a die bonding machine, a placement machine, or a wafer arranging machine.

In one embodiment, the upper surface and the lower surface of the transparent film have a dip glue, and the material of the dip glue includes silicon glue, acrylic glue, UV glue, pyrolysis glue, or a mixture of any combination of the above.

In one embodiment, the packaging process described in item 1 of the patent application further includes the following steps: forming a photoresist layer on the light-emitting surface.

In one embodiment, the fluorescent layer contains no glue.

In one embodiment, the light-blocking layer includes a first light-blocking layer, and the forming of the first light-blocking layer includes the following steps: adhering the light-blocking powder particles to any two transparent films in the gap between the light-emitting devices On the surface, a first light-blocking layer is formed.

In one embodiment, the method further includes the following steps: forming a silicon dioxide layer on the sides of the plurality of light-emitting devices.

For concise and clear description, the same reference numerals are used repeatedly in different drawings to indicate corresponding or similar elements where appropriate. In addition, in order to provide a comprehensive and in-depth understanding of the embodiments described herein, many specific details are mentioned in the description. However, those skilled in the art may understand that the embodiments described herein may not operate according to these specific details. In other cases, in order not to confuse the technical features being described, some methods, processes, and components have not been described in detail. The drawing does not necessarily need to be the same as the actual size. In order to better explain the details and technical features, the proportion of specific parts of the drawings may be enlarged. The description in the specification should not be considered as limiting the scope of the embodiments described herein.

Please refer to FIG. 1 and FIG. 2 for the flowchart and schematic diagram of the light emitting device package according to the first embodiment of the present invention, which includes the following steps: Step S110, providing a substrate 1 with a position reference point 2 on the upper surface; Step S120, adhesion A transparent film 5 on the upper surface of the substrate 1; step S130, a die bonding machine adheres the light emitting surfaces 11 of the plurality of light emitting devices 10 to the upper surface of the transparent film 5 according to the position reference point 2; step S140, any two A light-blocking layer 30 is formed in the gap 40 between the light-emitting devices 10; Step S150, the light-blocking layer 30 is cut.

Please refer to step S110 of FIG. 1 and FIG. 2 to provide a substrate 1 with a position reference point 2 on its upper surface. The material of the substrate 1 may be, but not limited to, ceramic, glass, fiberglass, metal, nylon, Teflon, acrylic, or other plastic materials. The upper surface of the substrate is patterned by laser engraving, ink printing or chemical etching, as shown in FIGS. 3A and 3B. The pattern includes a plurality of position reference points 2 that can be recognized by a die bonding machine. The pattern of the position reference point 2 may be a point, a line, or a closed shape, which is used as a positioning basis when the crystal bonding machine automatically transfers the light-emitting device or the wafer.

Please refer to step S120 of FIGS. 1 and 2, a transparent film 5 is attached to the upper surface of the substrate 1. Both the upper surface and the lower surface of the transparent film 5 have glue, so that the lower surface of the transparent film 5 can adhere to the upper surface of the substrate 1, and the upper surface can adhere the light emitting device 10, so that the light emitting device 10 The position of the substrate 1 is fixed to reduce processing errors due to displacement. The material of the transparent film 5 can be polyethylene terephthalate (PET), glass fiber, nylon, Teflon, acrylic, cloth, plastic or other heat-resistant and its transparency can be recognized by the crystal bonding machine. Cover the location of reference point 2 material.

The material of the glue may be, but not limited to, silicone glue, acrylic glue, UV glue, pyrolysis glue or a mixture of any combination of the above.

Referring to step S130 of FIGS. 1 and 2, a die bonding machine adheres the light emitting surfaces 11 of the plurality of light emitting devices 10 to the upper surface of the transparent film 5 according to the position reference point 2. The light-emitting device is the product of a light-emitting diode chip or a light-emitting diode chip with an additional fluorescent layer, light-blocking layer, reflective layer, light guide layer, protective layer, or any combination of the foregoing packaging structures. The light-emitting device 10 includes an electrode surface 12 with electrodes and a light-emitting surface 11 opposite to the electrode surface 12. The electrode surface 12 of the light-emitting device 10 adheres downward to the transparent film 5 to prevent the phosphor or glue from adhering to the electrode surface during the packaging process.

In step S130, the die bonding machine is controlled by a computer, has a CCD image sensor module and a mechanical arm that can absorb the light-emitting device 10, the position reference point 2 is recognized by the CCD image sensor module, and the pendulum is controlled The mechanical arm in the form of an arm or a slide bar sucks the light emitting device 10 to a target position, and the process of sucking the light emitting device 10 and placing it to the target position can be automatically controlled. It can be understood that, the die bonding machine may also be a placement machine, a chip arranging machine, or other machinery that can automatically recognize the position reference point 2 and complete the arrangement of the light emitting device 10.

In step S130, the light-emitting device 10 may include a light-emitting device with a color temperature or higher, such as the first color temperature light-emitting device 15, the second color temperature light-emitting device 16, and the third color temperature light-emitting device 17 in FIG. The light-emitting devices 10 with different color temperatures may be light-emitting diode chips made of different materials, for example, blue light in a gallium nitride (GaN) process, green light chips, or red light in a gallium arsenide (GaAs) process; or Light emitting diode chips covered by different fluorescent layers.

The fluorescent layer includes a plurality of luminescent powder particles. The fluorescent layer may be a glue-containing fluorescent layer or a glue-free fluorescent layer. The preparation method of the glue-containing fluorescent layer is to apply a uniform mixture of luminescent powder and binder (glue) to the surface of the light-emitting diode wafer, and the glue on the glue-containing fluorescent layer may be a ring Oxygen resin or silicone materials. The preparation method of the glue-free fluorescent layer is to apply a liquid containing luminescent powder particles to the surface of the light-emitting diode wafer, and then remove the liquid to cause the luminescent powder particles to condense into a mass. The liquid is glue-free water or a volatile solvent, and the volatile solvent is selected from one of ethers, alcohols or ketones or a combination thereof. The application method of the liquid phase containing luminescent powder particles may be, but not limited to, spraying or dipping. It can be understood that the step of removing the liquid is mainly through extraction, discharge or evaporation of the liquid at a certain temperature, and the luminescent powder particles can be tightly bound together by the Van der Waals force. Another method for preparing the glue-free fluorescent layer is to make the luminescent powder particles into a non-conducting target material and form a fluorescent layer on the surface of the light-emitting diode wafer by sputtering molding.

The light-emitting powder particles can absorb light emitted by the light-emitting diode wafer to form light with a specific color temperature. Further, the light emitted by the light-emitting diode wafer that is not absorbed by the light-emitting powder particles can be mixed with the light emitted by the light-emitting powder particles to form light with a color temperature desired by the user.

In this embodiment, the luminescent powder particles include phosphor powder.

The phosphor is, for example, a sulfide phosphor or a non-sulfide phosphor. The non-sulfide phosphor powder is, for example, but not limited to, Yttrium Aluminum Garnet (YAG), Terbium Aluminum Garnet (TAG), nitride or silicate One or a combination of them.

The quantum dots are nanomaterials whose three dimensions are all below 100 nm, have quantum limiting effect, and can excite fluorescence with different color temperatures. Quantum dots absorb light waves with higher energy and produce energy step-ups. When electrons fall from a high-energy state to a low-energy state, they emit light with a longer wavelength (reddish light system), and the energy gap increases with size. Larger and smaller, so the color temperature of the fluorescent light emitted by the quantum dot can be controlled by changing its size. The types of quantum dots include metal quantum dots and non-metallic quantum dots, wherein the metal quantum dot material can be cadmium selenide, cadmium sulfide or indium phosphide, and the non-metallic quantum dot material can be graphene or graphene oxide. Metal quantum dots can be further doped with other elements or modified with groups to achieve the purpose of changing properties.

Referring to step S140 of FIGS. 1 and 2, a light blocking layer 30 is formed in the gap 40 between any two of the light emitting devices 10. The preparation method of the light blocking layer 30 is to apply a uniform mixture of light blocking powder and adhesive (adhesive) to the gap 40 between any two of the light emitting devices 10. The coating can be carried out by blade or roller printing. The material of the light-blocking powder may be insulating carbon black, insulating metal, reflective or non-reflective organic plastic, opaque ceramic powder or aluminum oxide powder made by insulating coating or coating, and light-blocking powder. The color can be black, white, gray or other colors. The adhesive may be epoxy resin, organic polymer, silicone material.

In another embodiment of step S140, the preparation method of the light-blocking layer 30 is to spray the light-blocking powder on the upper surface of the transparent film 5 located in the gap 40, and adhere the light-blocking powder by gluing to form a layer without glue The first light-blocking layer (not shown), and then apply a uniform mixture of light-blocking powder and adhesive (glue) to the gap 40 between any two light-emitting devices 10 to form a second light-blocking layer ( Not shown).

Please refer to step S150 of FIGS. 1 and 2 to cut the light blocking layer 30. After the light blocking layer 30 is formed, the light blocking layer 30 is cut to form a plurality of light source modules 100. The cutting may use a diamond knife or a laser cutting machine. The cutting reference line can be planned according to the position reference point 2 to cut accordingly.

The plurality of light source modules 100 may be separated from the transparent film 5 by heat or light, and the light source module 100 may be attached to the UV film or pyrolysis film, and transferred to the expansion film for subsequent processes.

It can be understood that the expansion film is a material commonly used in the field of crystal expansion. The material of the expansion membrane is, for example, but not limited to, paper, cloth, polyethylene terephthalate (PET), polyvinyl alcohol (PVA) and nylon (Polyamide, PA) , Polyvinyl chloride (Polyvinylchlorid, PVC), polyethylene, polypropylene, polystyrene or other resins made of film. The expansion membrane also includes an adhesive layer (not shown). The adhesive layer is, for example, a silicone film, an acrylic film or a UV film.

A person skilled in the art can understand that the UV film is coated with a specially formulated coating on the surface of a film substrate such as PET film, PVC film, PO, polyethylene-polyvinyl acetate copolymer (EVA) and the like. When the PO film substrate is used, the prepared UV film is stable, has high adhesion, and after being irradiated by the UV curing machine, the viscosity can be reduced until the light-emitting light-emitting device 10 is conveniently taken. When the PET film substrate is used, the prepared UV film can be used in a clean room, suitable for cutting wafers, glass, and ceramic plates, and can be peeled off after being irradiated with a UV light source without leaving any glue.

It can be understood by those skilled in the art that the pyrolysis film is a temporary positioning adhesive coated on the surface of the PET film substrate that can be peeled off with heat, and its composition may be composed of 2-methyl ethyl acrylate and 2-ethyl ethyl acrylate Propylene glycol, silicon oxypropylene peeling aid, titanium dioxide, barium sulfate, epoxy crosslinking agent, polymerization initiator are mixed in an appropriate ratio. After the pyrolysis film is heated to a suitable temperature, the viscosity of the positioning glue completely disappears within a certain period of time and can be easily separated.

Please refer to FIG. 4 and FIG. 5 for a flowchart and a schematic diagram of a light emitting device package according to a second embodiment of the present invention, which includes the following steps: Step S210, providing a substrate 1 with a position reference point 2 on the upper surface; Step S220, adhesion A transparent film 5 on the upper surface of the substrate 1; step S230, a wafer handling system adheres the electrode surface 9 of a wafer 7 to the upper surface of the transparent film 5 according to the position reference point 2; step S240 (step of FIG. 4 S240 includes steps S241 to S247 in FIG. 5), a fluorescent layer 20 is formed on the light-emitting surface 8 of the wafer 7, the fluorescent layer 20 includes a first color temperature fluorescent layer 21 and a second color temperature fluorescent layer 22; Step S250, flip and attach the wafer 9 to the upper surface of the transparent film 5, the electrode surface 9 of the wafer 9 is upward; Step S260, cut the wafer 9 to form a plurality of light emitting devices 10 and any two of the light emitting The gap 40 between the devices 10; Step S270, forming a light blocking layer 30 in the gap 40 between any two of the light emitting devices 10; Step S280, cutting the light blocking layer 30.

Please refer to step S210 of FIG. 4 and FIG. 5 to provide a substrate 1 with a position reference point 2 on its upper surface. It can be understood that the material and structure of the substrate 1 are the same as those described in the first embodiment, and will not be repeated here.

Please refer to step S220 of FIGS. 4 and 5 to attach a transparent film 5 to the upper surface of the substrate 1. It can be understood that the material and structure of the transparent film 5 are the same as those described in the first embodiment, and will not be repeated here.

Referring to step S230 of FIGS. 4 and 5, a wafer handling system adheres the electrode surface 9 of a wafer 7 to the upper surface of the transparent film 5 according to the position reference point 2. The wafer 7 is a light-emitting diode wafer, generally a multi-layer structure of diodes is formed on the surface of a sapphire wafer (substrate) through an epitaxial process, and electrodes are fabricated. After cutting, a plurality of light-emitting diodes can be obtained Wafer. The wafer 7 includes an electrode surface 9 with electrodes and a light-emitting surface 8 opposite to the electrode surface 9. The electrode surface 9 adheres downward to the transparent film 5 to prevent the phosphor or glue from adhering to the electrode surface during the packaging process.

The wafer handling system is controlled by a computer, has a CCD image sensor module and a mechanical arm that can absorb or capture the light-emitting diode wafer 7, and the position reference point is identified by the CCD image sensor module 2, and control the mechanical arm in the form of a swinging arm or a slide bar to suck or grab the wafer 7 to a target position. The process of sucking the wafer 7 and placing it to the target position can be automatically controlled. The wafer handling system may also be a die bonding machine, a placement machine, a wafer arranging machine, or other machinery that can automatically recognize the position reference point 2 and complete the arrangement of the wafer 7.

Referring to step S240 of FIG. 4, a fluorescent layer 20 is formed on the light-emitting surface 8 of the wafer 7. The fluorescent layer 20 includes a first color temperature fluorescent layer 21 and a second color temperature fluorescent layer 22. It can be understood that a transparent protective layer 35 may be further formed on the fluorescent layer 20.

In an implementation method, step S240 of FIG. 4 may further include steps S241 to S247 of FIG. 5.

Referring to step S241 of FIG. 5, before forming the fluorescent layer 20, a photoresist layer 6 is formed on a part of the light-emitting surface 8 that does not need to be covered by the fluorescent layer 20. The photoresist layer 6 can be removed, thereby removing the fluorescent layer 20 covering the photoresist layer 6.

Referring to step S242 of FIG. 5, the first color temperature fluorescent layer 21 is formed on the light emitting surface 8 and the photoresist layer 6, and the protective layer 35 can be further formed on the first color temperature fluorescent layer 21.

Referring to step S243 of FIG. 5, the photoresist layer 6 and the first color temperature fluorescent layer 21 and the protective layer 35 are removed together, and a part of the first color temperature fluorescent layer 21 remains.

Referring to step S244 of FIG. 5, the photoresist layer 6 is formed on the partial light-emitting surface 8, the first color temperature fluorescent layer 21 or the protective layer 35.

Referring to step S245 of FIG. 5, the second color temperature fluorescent layer 22 is formed on the light emitting surface 8 and the photoresist layer 6, and the protective layer 35 can be further formed on the second color temperature fluorescent layer 22.

Referring to step S246 of FIG. 5, the photoresist layer 6 and the second color temperature fluorescent layer 22 and the protective layer 35 thereon are removed together, and a part of the second color temperature fluorescent layer 22 remains.

Referring to step S247 of FIG. 5, the protective layer 35 is formed on the light-emitting surface 8 not covered by the fluorescent layer 20.

In steps S241 and S244, the photoresist layer 6 is formed of a photoresist. The photoresist includes a positive photoresist and a negative photoresist. The photoresist layer formed by the positive photoresist becomes exposed after exposure. Soluble, easy to remove, negative photoresist is the opposite. The material of the positive photoresist may be a phenolic (Novolac) resin, which can be dissolved by an acetic acid solvent after exposure. By exposing a hollow portion of the photomask, the photoresist layer 6 on a part of the light-emitting surface 8 can be removed, so that the fluorescent layer 20 can be directly formed on the light-emitting surface 8. When the photoresist layer 6 and the fluorescent layer 20 and the protective layer 35 on the photoresist layer 6 are to be removed together, they can be processed with a solvent and laser light. In order to avoid destroying the electrical layer of the wafer 7 during laser processing, the laser light can be blocked in two ways. One is to add a light blocking material to the photoresist, and the other is to steam after the photoresist layer 6 is formed. A layer of light blocking material is plated, and the light blocking material may be carbon black or nano metal material, and the two methods may be implemented separately or in combination.

In steps S242 and S245, the fluorescent layer 20 includes a plurality of luminescent powder particles. The light-emitting powder particles can absorb light emitted by the light-emitting diode wafer to form light with a specific color temperature. Further, the light emitted by the light-emitting diode wafer that is not absorbed by the light-emitting powder particles can be mixed with the light emitted by the light-emitting powder particles to form light with a color temperature desired by the user. The first color temperature fluorescent layer 21 and the second color temperature fluorescent layer 22 include different types of luminescent powder particles, and thus can generate light with different color temperatures.

In this embodiment, the luminescent powder particles include phosphor powder.

The phosphor is, for example, a sulfide phosphor or a non-sulfide phosphor. The non-sulfide phosphor powder is, for example, but not limited to, Yttrium Aluminum Garnet (YAG), Terbium Aluminum Garnet (TAG), nitride or silicate One or a combination of them.

The quantum dots are nanomaterials whose three dimensions are all below 100 nm, have quantum limiting effect, and can excite fluorescence with different color temperatures. Quantum dots absorb light waves with higher energy and produce energy step-ups. When electrons fall from a high-energy state to a low-energy state, they emit light with a longer wavelength (reddish light system), and the energy gap increases with size. Larger and smaller, so the color temperature of the fluorescent light emitted by the quantum dot can be controlled by changing its size. The types of quantum dots include metal quantum dots and non-metallic quantum dots, wherein the metal quantum dot material can be cadmium selenide, cadmium sulfide or indium phosphide, and the non-metallic quantum dot material can be graphene or graphene oxide. Metal quantum dots can be further doped with other elements or modified with groups to achieve the purpose of changing properties.

The fluorescent layer may be a glue-containing fluorescent layer or a glue-free fluorescent layer. The preparation method of the glue-containing fluorescent layer is to apply a uniform mixture of luminescent powder particles and a binder (glue) to the surface of the light-emitting diode chip or wafer. The glue is, for example, an epoxy resin or a silicone-based substance. The coating can be performed by blade printing or roller printing. The preparation method of the glue-free fluorescent layer is to apply a liquid containing luminescent powder particles to the surface of the light-emitting diode wafer or wafer, and then remove the liquid to make the luminescent powder particles coagulate into a block. The liquid is glue-free water or a volatile solvent, and the volatile solvent is selected from one of ethers, alcohols or ketones or a combination thereof. The application method of the liquid phase containing luminescent powder particles is, for example, but not limited to, spraying, dipping, and the like. It can be understood that the step of removing the liquid is mainly through extraction, discharge or evaporation of the liquid at a certain temperature, and the luminescent powder particles can be tightly bound together by the Van der Waals force. Another method for preparing the glue-free fluorescent layer is to make the luminescent powder particles into a non-conducting target material and form a fluorescent layer on the surface of the light-emitting diode wafer by sputtering molding.

In steps S242, S245, and S247, the protective layer 35 is used to isolate the light-emitting device 10 from the outside, so as to avoid the influence and pollution of the outside. In order to avoid affecting the light extraction efficiency, the protective layer 35 is a transparent or low-absorption material, such as resin, silicone or other materials with softer materials. The resin may be, for example, an epoxy resin having a low curing agent mixing ratio. Preferably, the quality mixing ratio of the hardener and the epoxy resin is 1:1 or 1:4. When the protective layer is applied, it can be printed by blade printing or roller printing. In this embodiment, the protective layer 35 may be formed by coating the fluorescent layer 20 with the material of the protective layer 35 after forming the fluorescent layer 20. It can be understood that the The material of the protective layer may penetrate into at least a part of the fluorescent layer 20 before curing, so that the protective layer 35 is combined with the fluorescent layer 20 after curing.

Referring again to step S250 of FIGS. 4 and 5, the wafer 9 is turned over and adhered to the upper surface of the transparent film 5 with the electrode surface 9 of the wafer 9 facing upward. The wafer 7 can be separated from the transparent film 5 by heat or light, turned upside down with the electrode surface 9 facing up and the light emitting surface 8 facing down. The wafer handling system adheres the wafer 7 according to the position reference point固定于Transparent film 5

Referring to step S260 of FIGS. 4 and 5, the wafer 9 is cut to form a plurality of light-emitting devices 10 and any two gaps 40 between the light-emitting devices 10. The plurality of light-emitting devices 10 may include a first color-temperature light-emitting device 15, a second color-temperature light-emitting device 16, and a third color-temperature light-emitting device 17 with different color temperatures. The cutting may use a diamond knife or a laser cutting machine. The cutting reference line can be planned according to the position reference point 2 to cut accordingly. The size of the gap 40 can be determined by the width of the cutting tool.

Referring to step S270 of FIGS. 4 and 5, a light blocking layer 30 is formed in the gap 40 between any two of the light emitting devices 10. The preparation method of the light-blocking layer 30 is to apply a uniform mixture of light-blocking powder and adhesive (glue) to the gap 40. The coating can be carried out by blade or roller printing. The material of the light-blocking powder may be insulating carbon black, insulating metal, reflective or non-reflective organic plastic, opaque ceramic powder or aluminum oxide powder made by insulating coating or coating, and light-blocking powder. The color can be black, white, gray or other colors. The adhesive may be epoxy resin, organic polymer, silicone material.

In another embodiment of step S270, the preparation method of the light-blocking layer 30 is to spray the light-blocking powder on the upper surface of the transparent film 5 located in the gap 40, and adhere the light-blocking powder by dipping to form a layer without glue The first light-blocking layer (not shown), and then apply a uniform mixture of light-blocking powder and adhesive (glue) to the gap 40 between any two light-emitting devices 10 to form a second light-blocking layer ( Not shown).

In another embodiment of step S270, before forming the light-blocking layer 30, a silicon dioxide layer may be formed on the side of the light-emitting device 10 by sputtering.

Referring to step S280 of FIGS. 4 and 5, the light blocking layer 30 is cut. After the light blocking layer 30 is formed, the light blocking layer 30 is cut to form a plurality of light source modules 100. The cutting may use a diamond knife or a laser cutting machine. The cutting reference line can be planned according to the position reference point 2 to cut accordingly.

The plurality of light source modules 100 may be separated from the transparent film 5 by heat or light, and the light source module 100 may be attached to the UV film or pyrolysis film, and transferred to the expansion film for subsequent processes.

It can be understood that the expansion film is a material commonly used in the field of crystal expansion. The material of the expansion membrane is, for example, but not limited to, paper, cloth, polyethylene terephthalate (PET), polyvinyl alcohol (PVA) and nylon (Polyamide, PA) , Polyvinyl chloride (Polyvinylchlorid, PVC), polyethylene, polypropylene, polystyrene or other resins made of film. The expansion membrane also includes an adhesive layer (not shown). The adhesive layer is, for example, a silicone film, an acrylic film or a UV film.

A person skilled in the art can understand that the UV film is coated with a specially formulated coating on the surface of a film substrate such as PET film, PVC film, PO, polyethylene-polyvinyl acetate copolymer (EVA) and the like. When the PO film substrate is used, the prepared UV film is stable and has high adhesive force, and after being irradiated by the UV curing machine, the viscosity can be reduced to facilitate the light-emitting light-emitting device 10. When the PET film substrate is used, the prepared UV film can be used in a clean room, suitable for cutting wafers, glass, and ceramic plates, and can be peeled off after being irradiated with a UV light source without leaving any glue.

It can be understood by those skilled in the art that the pyrolysis film is coated on the surface of the PET film substrate with a temporary positioning adhesive that can be peeled off when heated, and its composition may be composed of 2-methyl ethyl acrylate and 2-ethyl ethyl acrylate Propylene glycol, silicon oxypropylene peeling aid, titanium dioxide, barium sulfate, epoxy crosslinking agent, polymerization initiator are mixed in an appropriate ratio. After the pyrolysis film is heated to a suitable temperature, the viscosity of the positioning glue completely disappears within a certain period of time and can be easily separated.

Referring to FIG. 6, the light source module 100 includes a plurality of light-emitting devices 10. The light-emitting device 10 may include more than one light-emitting devices 15, 16, and 17 with different color temperatures. The side of each light-emitting device 10 is covered by a light-blocking layer 30 To prevent the lateral light of the plurality of light-emitting devices 10 from interfering with each other.

The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above embodiments. The above embodiments are only used to explain the scope of patent applications. However, the protection scope of the present invention is not limited to the description. Any changes or replacements that can be easily thought of by those skilled in the art within the technical scope disclosed in the present invention are included in the protection scope of the present invention.

1: substrate

2: Position reference point

5: Transparent film

6: Photoresist layer

7: Wafer

10: Light emitting device

8, 11: luminous surface

9, 12: electrode surface

15: The first color temperature light-emitting device

16: Second color temperature light-emitting device

17: Third color temperature light-emitting device

20: fluorescent layer

21: The first color temperature fluorescent layer

22: Second color temperature fluorescent layer

30: light blocking layer

35: protective layer

40: gap

100: light source module

FIG. 1 is a flowchart of a light source module packaging process according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram of the light source module packaging process of the first embodiment of the present invention.

3A and 3B are schematic diagrams of the substrate and position reference points of the present invention.

4 is a flowchart of a light source module packaging process according to a second embodiment of the invention.

5 is a schematic diagram of a light source module packaging process according to a second embodiment of the invention.

6 is a schematic diagram of the light source module of the present invention.

no

1: substrate

2: Position reference point

5: Transparent film

10: Light emitting device

11: Glowing surface

12: electrode surface

15: The first color temperature light-emitting device

16: Second color temperature light-emitting device

17: Third color temperature light-emitting device

30: light blocking layer

40: gap

100: light source module

Claims (11)

A light source module packaging process, which includes the following steps: providing a substrate with a plurality of position reference points on the upper surface of the substrate; adhering a transparent film to the substrate, wherein the transparent film has an upper surface and a lower surface , The lower surface contacts the upper surface of the substrate; a plurality of light emitting devices are adhered to the upper surface of the transparent film, wherein the positions of the plurality of light emitting devices are determined based on the plurality of position reference points, each light emitting device has a An electrode surface of the electrode and a light-emitting surface opposite to the electrode surface, the light-emitting surface of the light-emitting device contacts the upper surface of the transparent film; forming a light-blocking layer in the gap between any two light-emitting devices, the light-blocking layer It includes a first light-blocking layer, and the formation of the first light-blocking layer includes the following steps: adhering the light-blocking powder particles to the upper surface of the transparent film in the gap between any two light-emitting devices to form a glue-free first Light blocking layer; cutting the light blocking layer between any two gaps between the light emitting devices As in the packaging process described in item 1 of the scope of the patent application, the position reference point is a point, line, or closed shape that can be recognized by a die bonding machine, a placement machine, or a die-laying machine. According to the packaging process described in item 1 of the patent application scope, the upper and lower surfaces of the transparent film have adhesive glue, and the material of the adhesive glue includes silicone glue, acrylic glue, UV glue, pyrolysis glue or any of the above Combined mixture. According to the packaging process described in item 1 of the patent application scope, the plurality of light-emitting devices include at least one first color-temperature light-emitting device and a second color-temperature light-emitting device. A packaging process of a light source module, which includes the following steps: providing a substrate with a plurality of position reference points on the upper surface of the substrate; Adhering a transparent film to the substrate, wherein the transparent film has an upper surface and a lower surface, the lower surface contacts the upper surface of the substrate; adhering a wafer to the upper surface of the transparent film, wherein the position of the wafer Is determined based on the plurality of position reference points, the wafer has an electrode surface with electrodes and a light emitting surface opposite to the electrode surface, the electrode surface of the wafer contacts the upper surface of the transparent film; forming a first color temperature fluorescent A light layer and a second color temperature fluorescent layer on the light-emitting surface; flip the wafer and adhere the wafer to the upper surface of the transparent film, the electrode of the wafer faces upward; cut the wafer to form a plurality of light-emitting A gap between the device and any two of the light-emitting devices; forming a light blocking layer in the gap; cutting the light blocking layer. As in the packaging process described in item 5 of the patent application, the position reference point is a point, line, or closed shape that can be recognized by a wafer handling system, die bonding machine, chip mounter, or chip loader. According to the packaging process described in item 5 of the patent application scope, the upper and lower surfaces of the transparent film have adhesive glue, and the material of the adhesive glue includes silicone glue, acrylic glue, UV glue, pyrolysis glue or any of the above Combined mixture. The packaging process described in item 5 of the patent application scope further includes the following steps: forming a photoresist layer on the light-emitting surface. According to the packaging process described in item 5 of the patent application scope, the fluorescent layer does not contain glue. According to the packaging process described in item 5 of the patent application scope, the light-blocking layer includes a first light-blocking layer, and forming the first light-blocking layer includes the following steps: A first light-blocking layer is formed by adhering the light-blocking powder particles to the upper surface of the transparent film between any two light-emitting devices. The packaging process described in item 5 of the patent application scope further includes the following steps: forming a silicon dioxide layer on the sides of the plurality of light-emitting devices.

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