TWI687691B - Multi-probing device - Google Patents

Abstract

A probing device is applied to a probing and testing system for semiconductor or electronic components, especially to a probing and testing system that is used to input a specific gas inside. To fix a probe card at one end of the probing device, and then introducing a specific gas into the interior of the probing device before starting the probing operation, and guiding the specific gas to the area of the probe tips on a probe card by the mechanical design. A plurality of probe tips simultaneously contact a plurality of pads of a plurality of dies on the wafer, and an appropriate voltage or current is applied to perform an electrical test of dies on the wafer to ensure product quality.

Description

Multi-point test device

The invention relates to a testing device for testing electronic components, in particular a spot measuring device which can test electronic components in a specific gas atmosphere (or in a protective gas atmosphere) by using a probe card with multiple probes.

At present, most of the existing die spot measuring equipment on the market belongs to the single grain spot measuring method. The probe is placed above the die, and each probe can be slightly adjusted in space to match the pad on the die ( pads) position, the probe does not move during spot measurement, and the lower wafer performs relatively vertical vibration (contact or separation with the pad on the die) and horizontal movement (moves to the pad on the adjacent die) to complete the adjustment Spot testing of wafers. However, it takes a long time to complete the spot measurement of the entire wafer using this method (such as Taiwan Patent No. I526702 and Taiwan Patent No. I623730).

There is also a multi-point testing machine for light-emitting diodes, which uses a plurality of probes on a probe card to simultaneously contact a plurality of solder pads on a plurality of crystal grains. However, during the measurement, the power is supplied one by one in sequence, and the LEDs emit light in sequence. After receiving the light from the integrating sphere above, the optical characteristics of each LED are measured in batches in sequence. (Such as Taiwan Patent No. M444519).

The above-mentioned spot-testing devices are used for spot-testing operations in general atmospheric environment, but not for spot-testing operations in a specific fluid environment, especially for fluid-sensing wafers.

The technology disclosed is a multi-point spot measuring device, which can be applied to spot testing equipment for semiconductor or electronic components, especially to spot testing equipment for passing a specific fluid. The probe card is fixed at one end of the spot measuring device, before the spot measuring operation, a specific fluid is passed into the spot measuring device, and the specific fluid is directed to the area where the probe needle tip of the probe card is located by a mechanism design, and Multiple probe tips are used to simultaneously contact multiple pads (Pads) of multiple wafers on the wafer, and an appropriate voltage or current is applied to conduct electrical tests within the chip to ensure product quality.

The device disclosed in this technology is a point measuring device. In addition to being used for point measuring operation in a general atmospheric environment, it is particularly suitable for point measuring operation on a fluid sensing chip under a specific fluid environment. The spot testing device disclosed in this technology has a test structure, one end of the test structure can be combined with a probe card, and there is a hollow area in the test structure, and a specific fluid flows into the hollow area of the test structure after passing through the outer wall hole of the test structure. Mechanism design factors, so that specific fluid can only be directed to the other end of the outlet, this outlet is very close to the area of the probe tip of the probe card, so that the specific fluid can be fully distributed near the area where the probe tip contacts the wafer surface , And maintain a specific fluid in the contact area equivalent to the concentration level at the time of input.

In the design of the test device in this case, the specific fluid was originally designed to pass into the specific fluid from above the cavity or the side of the cavity. This input method takes a relatively long time to make the specific fluid in the vicinity of the probe tip The concentration is close to the concentration level to be achieved during spot measurement, which is relatively time-consuming and difficult to reach the fluid concentration required to be maintained during spot measurement, and the effect is relatively poor. Therefore, for further improvement, using the device invented by this technology, the specific fluid flows directly to the vicinity of the spot where the probe tip is located after passing through the test device, which can make the probe tip area reach the ideal point measurement within a few seconds. The fluid concentration is good and fast, and at the same time it can save the flow of input specific fluid.

In addition, the device also includes an inclination adjustment mechanism for adjusting the virtual plane where the probe tips of the probe cards are located, so that the plane where the probe tips are located is parallel to the wafer surface to ensure that a large number of Probe tips can all touch the pads on the surface of the die (or called wafer, chip, die) at the same time, and there will be no part of the tip that does not touch the pad on the surface of the die or excessively touch the solder on the surface of the die The phenomenon of puncturing the die pads (pads or electrode pads or contacts) caused by the pads occurs.

In addition, on the outside of the test structure in the spot testing device, an additional observation device such as a lens can be selected to observe the arrangement direction of the probe tips on the probe card and the plurality of pads corresponding to the die on the wafer ( Whether the direction of pads) is aligned with each other or not. If there is no alignment, you can adjust the moving slide and rotary slide under the wafer to move and rotate the wafer until the two are finally aligned and then slowly lower the probe card to make the probe The tip contacts the die on the wafer. Then pass the appropriate voltage or current to test the electrical characteristics of multiple dies at the same time, and then move the wafer below to complete the test operation of the entire wafer one by one.

Based on the above concept, the present disclosure provides a test device for testing a fluid sensing chip, coupled to a cavity, the test device is configured to pass a specific fluid, the test device includes a test structure, an inclination adjustment Mechanism, a telescopic airtight element (such as bellows, but not limited to bellows, the following description is convenient, replaced by the word bellows) and a probe card. The bellows is flexibly coupled to the test structure. The test structure has an inner hollow region and an outer wall, wherein the inner hollow region has an outlet, and the outer wall has an inlet to communicate with the inner hollow region.

The present disclosure provides a testing device for testing wafers, especially for testing A testing device for fluid sensing wafers. For specific embodiments of the present invention, please refer to the drawings to further illustrate the technical content of the present invention.

10: grain

101: solder pad

12: Probe

121,221: Needle tip

20: plural grains

201: plural pads

22: complex probe

30,50: test device

39,59: specific fluid

300,500: test structure

302,502: sidewall opening

303,503: upper opening

304: Transparent objects

305,505: lower opening

390,590: specific fluid direction

31,51: Z axis drive shaft

33,53: Inclination adjustment mechanism

32,52: cavity

34,54: Bellows

35,55: fluid line

37,57: Probe card

36: imaging device

370,570: complex probe

38,58: Wafer

321,521: Vacuum suction cup

322,522: heating device

323,523: Multi-axis slide table

301,501: hollow area

30’, 50’: Test equipment

306, 506: outer wall

307,507: gap

This disclosure can be gained a deeper understanding through the detailed description of the following figures: The first figure is a schematic diagram of single die spot measurement according to the preferred embodiment of the present invention.

The second figure is a schematic diagram of multi-point testing of multiple die in the preferred embodiment of the present invention.

The third figure A is a schematic diagram of the test structure of the preferred embodiment of the present invention.

The third figure B is a cross-sectional view of a multi-point test device according to a preferred embodiment of the present invention (designated representative figure in this case)

The fourth figure is a schematic diagram of a test device that can be applied to a fluid sensing wafer according to a preferred embodiment of the present invention.

The fifth figure A is a schematic diagram of a test structure of another preferred embodiment of the present invention.

Fifth figure B is a cross-sectional view of a multi-point test device according to a preferred embodiment of the present invention (second embodiment)

FIG. 6 is a schematic diagram of another preferred embodiment of the present invention that can be applied to a fluid sensing wafer testing device.

Please refer to the drawings of the present invention to read the following detailed description. The drawings of the present invention are by way of example to introduce various embodiments of the present invention and to understand how to implement the present invention. The embodiments of the present invention provide sufficient content for those skilled in the art to implement the embodiments disclosed in the present invention, or to implement the embodiments derived from the contents disclosed in the present invention. It should be noted that these embodiments are not mutually exclusive, and some embodiments can be combined with one or more other embodiments to form new embodiments, that is, the implementation of the present invention is not limited to The embodiments disclosed below.

Please refer to the first figure, which is a schematic diagram of single-die 10-point measurement according to a preferred embodiment of the present invention Figure. When performing the spot testing operation on the die on the wafer, the spot testing operation can be performed on only a single die 10, and a single die 10 followed by a die 10 are sequentially performed on the spot testing operation to gradually complete the entire wafer test. A plurality of pads 101 are distributed on the single die 10, and the tip 121 of the probe 12 is respectively touched and scratched through the oxide layer, as shown in the first picture, and then a voltage or current is applied to measure the electricity in the die 10性性。 Sexual characteristics. Although the single-point test is more accurate and convenient, it is conceivable that it takes a long time to complete the test of all die on the entire wafer. Please refer to the second figure, which is a schematic diagram of a multi-point test for a plurality of die 20 in a preferred embodiment of the present invention. Each die has a plurality of pads. The arrangement of the plurality of die 20 and the arrangement of the plurality of probes 22 are as follows: Shown in the second picture. In order to allow the probe tips 221 of the plurality of probes 22 to simultaneously contact the plurality of pads 201, some adjustment elements need to be added to adjust the working plane of the plurality of probe tips.

Please refer to the third figure A, which is a schematic diagram of a test structure 300 according to a preferred embodiment of the present invention. Please refer to the third figure B, which is a schematic diagram of a test device 30 that can be applied to a fluid sensing wafer according to a preferred embodiment of the present invention. Please refer to the fourth figure, which is a schematic diagram of a test apparatus 30' that can be applied to a fluid sensing wafer according to a preferred embodiment of the present invention. In the fourth figure, the test structure 300 can be installed in the cavity 32. In the third image B, the test device 30 is preferably a one-point measuring device, which includes a test structure 300, a probe card 37, an inclination adjustment mechanism 33, a retractable airtight element 34 (such as a bellows , Not limited to this, bellows are used in place of instructions below) and so on. In the third image A, the test structure 300 has a hollow region 301 inside, and the hollow region 301 is preferably tapered (funnel shaped) and has a small lower opening 305. The test structure 300 also has a side wall opening 302 on the outer side wall that can communicate inwardly to the hollow region 301. An upper opening 303 is added above the hollow area 301 for the imaging device 36 (such as a lens and a camera, but not limited to this). There is a transparent object 304 between the hollow area 301 and the upper opening 303 as an isolation, such as a transparent lens, to prevent the specific fluid 39 from escaping and guiding the specific fluid 39 toward the lower end of the hollow area 301 口305.

Please refer to the second picture, the third picture A~B, and the fourth picture at the same time. Fix the flange of the welding bellow 34 of the test device 30 above the cavity 32 with screws. The flange contains The O-ring is pressed against the surface of the cavity 32 to prevent leakage of gas. The hollow area 301 of the test structure 300 is hollow, and both ends have openings 303, 305 sleeved in the bellows 34, the upper flange (flange) is fixedly locked with the bellows flange, and the flange contains an O-ring to prevent fluid Escape. A part of the test structure 300 penetrates into the cavity 32. The probe card 37 contains a plurality of probes 370. The probe card 37 is fixed to the bottom of the test structure 300 from below. The tilt adjustment mechanism 33 is installed above the test structure 300 and is fixed on the flange of the test structure 300 with screws. Before the system is ready for spot testing, the wafer 38 is placed on the vacuum chuck 321. The wafer 38 moves from the multi-axis slide 323 under the vacuum chuck 321 from the outside to the probe card 37 Below, the alignment key on the wafer 38 is used for alignment, and the wafer 38 is aligned with the multi-axis slide table 323. A heating device 322 is installed under the vacuum chuck 321, which can heat the vacuum chuck 321 to the working temperature (for example, between 25 and 400 degrees Celsius, different fluid sensing chips have different working temperatures). 38 is directly placed on the vacuum chuck 321, so the wafer 38 is also indirectly heated to the operating temperature after heat absorption due to thermal conduction. An imaging device is additionally arranged above the test structure 300, and the lens 36 in the imaging device can be extended (or not extended) into the upper opening 303 in the test structure 300 according to actual needs, and the lens is focused through the transparent lens 304 A plurality of pads (pads or electrode pads or contacts) 201 of a plurality of crystal grains 20 on the circle 38, and then the Z-axis drive shaft 31 and the inclination angle adjustment mechanism 33 drive the entire test device 30 downward.

When the test device 30 is driven downward by the Z-axis drive shaft 31, the amount of displacement of the drop is absorbed by the bellows 34 in the test device 30 being compressed, because the bellows 34 itself has good sealing and expansion properties. When the tip of the plurality of probes 370 gradually contacts the die pads on the wafer 38 At 201, the probes on the probe card 37 can be seen more and more clear in the area observed in the lens 36, and then the X-axis and Y-axis positions of the wafer 38 can be slightly adjusted, The tip of the pin is placed in the center of the plural pads 201 as much as possible, and then the probe card 37 is slowly lowered until the tip of the plural probes 370 comes into contact with the plural plural pads 201, and then scratches the oxide layer on the pad 201. If it is found from the lens 36 that the arrangement of the needle tips of the plurality of probes 370 and the corresponding arrangement of the pads 201 are not equidistant or that the needle tip is obviously inclined, then use the adjustment screw in the inclination adjustment mechanism 33 to adjust the inclination angle to ensure the adjustment. The tip of the row probe 370 can simultaneously contact the die on the wafer 38. Because the testing device 30 includes the bellows 34, the bellows 34 itself has good sealing and stretchability, so it can absorb the inclination adjustment mechanism 33 after adjusting the inclination angle and still maintain airtightness.

Next, the specific fluid 39 is passed through the fluid line 35 from the outside of the cavity 32, and the specific fluid 39 is sprayed toward the sidewall opening 302 in the test structure 300. Because the transparent structure 304 is closed above the test structure 300, the specific fluid injected 39 is blocked by the transparent object 304, so it turns to flow downward. The fluid flow direction 390 of the specific fluid 39 is shown in the fourth figure. The specific fluid 39 flows out of the test structure 300 through the lower opening 305 of the test structure 300 and continues toward Downstream to the tip of the plurality of probes 370 and the plurality of pads 201 of the die on the wafer 38, the vicinity of this area is filled with the specific fluid 39, and the concentration is approximately equivalent to the fluid concentration at the time of input. The time required to input the specific fluid 39 from the external container into the test device 30 to the needle tip area of the plurality of probes 370 on the probe card 37 takes only a few seconds. If the specific fluid 39 is directly poured into the cavity 32, and the cavity 32 is slowly filled with the specific fluid 39, it will take a relatively long time after calculation and evaluation, about several minutes to tens of minutes, depending on the cavity 32 Depending on the size, it is necessary to wait until the tip of the plurality of probes 370 and the area of the plurality of pads 201 of the die are filled with the specific fluid 39, and wait until the concentration of the specific fluid 39 reaches the desired concentration for the spot test. The advantage of using the test device 30 of the present disclosure is that Quickly reach the fluid concentration required for standard testing. At this time, the input current or voltage is controlled by an external circuit to measure the electrical characteristics of the die, so as to test whether the sensitivity and correctness of the fluid sensing chips meet the original design specifications. The Z-axis driving shaft 31 rapidly vibrates up and down at a small distance (for example, about 100 μm to 1000 μm). At this time, the tip of the plural probe 370 and the plural pads 201 of the die on the wafer 38 are in rapid contact or separation. Together with the translation and rotation of the XY θ axis of the multi-axis slide table below, the multi-chip (array) spot measurement operation of all the dies on the wafer 38 can be quickly completed.

Please refer to the second picture, the third picture A~B, and the fourth picture at the same time. The telescopic airtight element 34 can be looped outside the outer wall 306 of the test structure 300 and maintain a gap 307 with the outer wall 306 of the test structure 300. The test structure 300, the tilt adjustment mechanism 33, and the telescopic airtightness element are combined with each other, and the combination method includes: the test structure 300 is respectively combined with the telescoping airtightness element and the tilt adjustment mechanism 33 Either the telescopic airtight element is combined with the test structure 300 and the tilt adjustment mechanism 33; or the tilt angle adjustment mechanism 33 is combined with the telescopic air tight element 34 and the test structure 300, respectively; The specific fluid may be at least one of CO, H ₂ S, H ₂ , NH ₃ , C ₂ H ₅ OH, or other fluids, such as a protective gas, such as N ₂ , but not limited thereto .

Please refer to the fifth figure A, which is a schematic diagram of a test structure 500 according to another preferred embodiment of the present invention. Please refer to the fifth diagram B, which is a schematic diagram of a test device 50 according to another preferred embodiment of the present invention. Please refer to the sixth figure, which is a schematic diagram of another preferred embodiment of the present invention that can be applied to a fluid sensing wafer test device 50'. In the sixth figure, the test structure 500 can be installed on the cavity 52. In the fifth diagram B, the test device 50 is preferably a one-point measuring device, which includes a test structure 500, a probe card 57, an inclination adjustment mechanism 53, and a retractable airtight element (such as a bellows 54 ,Do not In this limit, the bellows 54 will be used instead of the description below) and so on. In the fifth diagram A, the test structure 500 has a hollow region 501 inside, and the hollow region 501 is preferably tapered (funnel shaped) and has a small lower opening 505. The test structure 500 further has a side wall opening 502 on the outer side wall that can communicate inwardly to the hollow region 501. Above the hollow area 501 is a closed area, which blocks the flow of the specific fluid 59 upward, so as to prevent the specific fluid 59 from flowing out and guide the specific fluid 59 toward the lower opening 505 of the hollow area 501.

Please refer to the second picture, the fifth picture A~B, and the sixth picture at the same time, the flange (flange) of the bellows 54 of the testing device 50 is screwed on the cavity 52, the flange contains The O-ring is pressed against the surface of the cavity 52 to prevent leakage of gas. The test structure 500 is nested in the corrugated tube 54 and the upper flange is fixedly locked with the corrugated tube flange. A part of the test structure 500 penetrates into the cavity 52 and the probe card 57 contains a plurality of probes 570. The probe card 57 is fixed to the bottom of the test structure 500 from below. The tilt adjustment mechanism 53 is installed above the test structure 500 and is fixed to the upper flange of the test structure 500 with screws. Before the system is ready for spot testing, the wafer 58 is placed on the vacuum chuck 521. The wafer 58 is moved from the multi-axis slide 523 below the vacuum chuck 521 from the outside to the probe card 57. Below, the alignment key on the wafer 58 is used for alignment, and the wafer 58 is aligned with the multi-axis slide table 523. A heating device 522 is installed under the vacuum chuck 521 of the wafer 58 to heat the vacuum chuck 521 to the working temperature (for example, between 25-400 degrees Celsius, different fluid sensing chips have different working temperatures), Since the wafer 58 is directly placed on the vacuum chuck 521, the wafer 58 is also indirectly heated to the operating temperature after heat absorption due to thermal conduction. A high-magnification magnifier group (not shown in the figure) is set up outside the cavity 52 to focus on the needle tip area of the plurality of probes 570 of the wafer probe card 57 through the transparent window of the cavity 52. Then, the Z-axis drive shaft 51 and the inclination adjustment mechanism 53 drive the entire test device 50 downward

When the test device 50 is driven downward by the Z-axis drive shaft 51, the amount of the downward displacement is absorbed by the bellows 54 in the test device 50 being compressed, because the bellows 54 itself has good sealing and expansion properties. When the tip of the plurality of probes 570 gradually contacts the pad 201 of the die on the wafer 58, the probe on the probe card 57 and the wafer can be seen from the area observed in the high-magnification magnifier group The pads of the die are getting clearer and clearer, and then the X-axis and Y-axis positions of the wafer 58 can be slightly adjusted, and the tip of the plural probe 570 can be placed as far as possible in the center of each plural solder pad 201, and then slowly lowered The probe card 57 until the tip of the plurality of probes 570 comes into contact with each of the plurality of pads 201, and then scratches the oxide layer on the pad 201. If the arrangement of the needle tips of the multiple probes 570 and the corresponding arrangement of the pads 201 are not equidistant from the high-magnification magnifier group, or if the needle tips are relatively inclined, then use the adjustment screw in the inclination adjustment mechanism 53 to adjust the inclination angle , To ensure that the tips of the entire row of probes 570 can simultaneously contact the die on the wafer 58. Since the testing device 50 includes the bellows 54 and the bellows 54 itself has good sealing and stretchability, it can absorb the inclination of the inclination adjusting mechanism 53 and still maintain airtightness after adjustment.

Next, the specific fluid 59 is passed through the fluid line 55 from the outside of the cavity 52, and the specific fluid 59 is sprayed toward the side wall opening 502 in the test structure 500. Because the upper part of the test structure 500 is a closed area, the injected specific fluid 59 turns Downward flow, the flow direction of the specific fluid 59 flows as shown in the fifth figure, the specific fluid 59 flows out of the test structure 500 through the lower opening 505 of the test structure 500 and continues to flow downward to the tip of the plurality of probes 570 and the wafer The plural pads 201 of the die on the 58 are filled with the specific fluid 59 near the area, and the concentration is approximately equivalent to the fluid concentration at the time of input. The time required to input the specific fluid 59 from the external container into the test device 50 to the needle tip area of the plural probes 570 on the probe card 57 only takes a few seconds. If the specific fluid 59 is directly poured into the cavity 52, and the cavity 52 is slowly filled with the specific fluid 59, it will cost after calculation and evaluation A relatively long time, from several minutes to several tens of minutes, depending on the size of the cavity 52, can only wait until the tip of the plurality of probes 570 and the area of the plurality of pads 201 of the die are filled with the specific fluid 59, and have to wait The concentration of the specific fluid 59 reaches the desired concentration required for the spot test. The advantage of using the testing device 50 of the present disclosure is that the fluid concentration required for standard testing can be quickly reached. At this time, the input current or voltage is controlled by an external circuit to measure the electrical characteristics of the die, thereby testing whether the sensitivity and accuracy of the fluid sensing chips meet the original design specifications. The Z-axis drive shaft 51 rapidly vibrates up and down at a small distance (about 100 μm to 1000 μm). At this time, the tip of the multiple probe 570 and the multiple pads 201 of the die on the wafer 58 are in rapid contact or separation, and then cooperate The translation and rotation of the XY θ axis of the multi-axis slide table under the wafer can quickly complete the multi-chip (array) spot measurement operation of all the dies on the wafer 58.

Most of the embodiments disclosed herein will be of benefit to those skilled in the art to have the teachings presented in the above description and related drawings. Therefore, I should understand that the present disclosure is not limited to the specific embodiments disclosed, and that variations and other embodiments are intended to be included within the scope of the following patent applications.

30: Test device

300: test structure

33: Tilt adjustment device

34: Retractable airtight components

37: Probe card

301: Hollow area

302: sidewall opening

305: lower opening

306: outer wall

Claims (12)

A testing device for testing an electronic component, comprising: a testing structure with an inner hollow area and an outer wall, the inner hollow area has a side wall opening and a lower end opening; a retractable airtight component is arranged On the outside of the test structure; an inclination adjustment mechanism; and a probe card, which is arranged at the lower end opening of the test structure, wherein a specific fluid enters the inner hollow area from the side wall opening and flows out from the lower end opening and flows toward the Probe card. The test device as described in item 1 of the patent application range, wherein the electronic component is a semiconductor chip. The test device as described in item 1 of the patent application range, wherein the electronic component is a fluid sensing chip. The test device as described in item 1 of the patent application scope, wherein the telescopic airtight element is a bellows. The test device as described in item 1 of the patent application scope, wherein the telescopic airtight element is looped to the outside of the test structure and maintains a gap with the outside of the test structure. The test device as described in item 1 of the patent application scope, wherein a plurality of probes are installed on the probe card. The test device as described in item 1 of the patent application scope, wherein the telescopic airtight element absorbs the displacement caused by the external force of the test structure while maintaining the airtightness of the test device. The test device as described in item 1 of the patent application scope, wherein the retractable gas-tight element absorbs the amount of movement caused by the tilt angle adjustment mechanism during tilt angle adjustment while retaining the test device Airtightness. The test device as described in item 1 of the patent application scope, wherein the tilt angle adjustment mechanism can adjust the tilt angle of the probe card in a linked manner. The test device as described in item 1 of the patent application scope, wherein the test structure is respectively combined with the telescopic airtight element and the inclination adjustment mechanism. The test device as described in item 1 of the patent application scope, wherein the telescopic airtight element is respectively combined with the test structure and the tilt adjustment mechanism. The test device as described in item 1 of the patent application scope, wherein the inclination adjustment mechanism is respectively combined with the retractable airtight element and the test structure.

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