TWI684738B - Method and device for preventing ink volatile particles from contaminating heater in oven - Google Patents
Method and device for preventing ink volatile particles from contaminating heater in oven Download PDFInfo
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Abstract
本發明提供一種烤箱中防止油墨揮發粒子沾染加熱器的方法,包括間隔該烤箱之一入氣端所導入的常溫空氣,以排除常溫空氣與該烤箱內的循環風流直接接觸,令常溫空氣先通過該加熱器的加熱之後才接觸該烤箱內的循環風流。本發明進一步提供實施上述方法所需的一種烤箱中防止油墨揮發粒子沾染加熱器的裝置。藉此,改善傳統因常溫空氣直接接觸烤箱內的循環風流而使油墨揮發粒子沾染加熱器的問題。 The invention provides a method for preventing the volatile particles of ink from contaminating the heater in an oven, which includes spacing the room temperature air introduced into one of the air inlets of the oven to eliminate direct contact between the room temperature air and the circulating air flow in the oven, allowing the room temperature air to pass first Only after the heater is heated does it come into contact with the circulating air flow in the oven. The invention further provides a device for preventing the volatile particles of the ink from contaminating the heater in the oven required for implementing the above method. In this way, the problem that the normal temperature air directly contacts the circulating air flow in the oven and the ink volatile particles contaminate the heater is improved.
Description
本發明涉及烤箱結構,特別有關一種烤箱中防止油墨揮發粒子沾染加熱器的方法及其裝置。 The invention relates to an oven structure, in particular to a method and a device for preventing ink volatile particles from contaminating a heater in an oven.
本發明所針對的烤箱,意指工業用的烤箱,特別是用於烘烤已塗覆有易揮發粒子塗料的物件使用的烤箱。在當今的產業中,在產製例如印刷電路基板(Printed circuit board,簡稱PCB)此類物件的過程,一般會經過油墨塗裝、乾燥、烘烤、清洗等製程。其中,就是應用烤箱產生的熱溫來烘烤印刷電路基板上已塗裝的濕油墨,使得濕油墨能固化而穩定的附著於印刷電路基板上。 The oven to which the present invention is directed refers to an oven for industrial use, especially an oven used for baking objects coated with a coating of volatile particles. In today's industry, the process of producing objects such as printed circuit boards (PCBs) generally goes through processes such as ink coating, drying, baking, and cleaning. Among them, the heat temperature generated by the oven is used to bake the wet ink coated on the printed circuit board, so that the wet ink can be cured and adhere to the printed circuit board stably.
由於濕油墨在烤箱內接受熱溫烘烤的過程中,會揮發生成微小的油墨粒子,該等揮發生成的油墨粒子會對烤箱內的加熱器造成影響。 As the wet ink is heated and baked in the oven, it will volatilize to form tiny ink particles, which will affect the heater in the oven.
進一步的說,請合併參閱圖1及圖2,舉例揭示出兩款傳統烤箱的結構,說明於傳統烤箱10a、10b內都分別形成有用來烘烤物件(例如印刷電路基板)的加熱腔室11a、11b,烤箱10a、10b內還設置有連通加熱腔室11a、11b的入氣端12a、12b及排氣端13a、13b,常溫空氣經由入氣端12a、12b導入加熱腔室11a、11b內與循環風流混和,加熱腔室11a、11b內設有用來加熱循環風流的加熱器20a、20b,藉由加熱器20a、20b的加熱而使常溫空氣成為熱空氣,熱空氣在加熱腔室11a、11b內接受風輪30a、30b的驅動而生成烘烤物件用的循環風流16a、16b,且循環風流16a、16b經由排氣端13a、13b排放至外界。
Further, please refer to FIG. 1 and FIG. 2 together to illustrate the structure of two conventional ovens. It is shown that
更進一步的說,當塗佈有濕油墨的物件(例如印刷電
路基板)在加熱腔室11a、11b內烘烤時,油墨所含具揮發性的溶劑會因加熱腔室11a、11b內的高溫而揮發;舉例而言,以一般150°C為固化溫度的油墨,油墨粒子通常在80℃左右時即開始揮發,到了120℃左右油墨粒子會生成最大量的揮發,因此塗佈有濕油墨的物件在加熱腔室11a、11b內接受加熱器20a、20b由常溫烘烤至固化油墨溫度150℃的烘烤過程中,特別是當加熱腔室11a、11b的溫度達到80℃~150℃區間時,物件表面的濕油墨即會形成油墨揮發粒子散佈於加熱腔室11a、11b內,加熱腔室內11a、11b用來烘烤物件的循環風流16a、16b會帶動該油墨揮發粒子經由排氣端13a、13b過濾後排放至外界。
Furthermore, when an article coated with wet ink (such as
Road substrate) When baking in the
然而,問題點在於,當常溫空氣經由入氣端12a、12b注入加熱腔室11a、11b內時,常溫空氣會直接衝擊並且接觸到循環風流16a、16b,由於循環風流16a、16b的溫度(約在80℃~150°C之間)遠高於常溫空氣(以25℃為例),使得循環風流16a、16b與常溫空氣之間形成相當大的溫差,迫使循環風流16a、16b的溫度也隨之下降,在此情況下,循環風流16a、16b所帶動的油墨揮發粒子因溫度的驟降而凝結,進而沾染(或稱沾黏)於具有諸多通氣流道的加熱器20a、20b內。尤其甚者,當加熱器20a、20b內所附著的油墨揮發粒子過多時,會影響到加熱器20a、20b釋放熱能的效果,甚而容易造成加熱器20a、20b的熱瘀積而受損,終而遭致火災的發生。為了避免此現象發生,業者必須經常清洗或更換烤箱10a、10b內的加熱器20a、20b,但已造成設備維護上的困擾。
However, the problem is that when normal-temperature air is injected into the
因此,如何改善傳統烤箱中油墨揮發粒子沾染加熱器,便成為一項有待克服的技術問題。 Therefore, how to improve the contamination of heaters with ink volatile particles in traditional ovens has become a technical problem to be overcome.
有鑑於此,本發明所欲解決的技術課題在於:改善傳統烤箱之加熱腔室內的風流通道的結構設計,使得油墨揮發粒子不易於沾染加熱器,以延長加熱器的使用壽命。 In view of this, the technical problem to be solved by the present invention is to improve the structural design of the air flow channel in the heating chamber of the conventional oven, so that the ink volatile particles are not likely to contaminate the heater, so as to extend the life of the heater.
為此,本發明之一目的旨在提供一種烤箱中防止油 墨揮發粒子沾染加熱器的方法,包括:間隔該烤箱之一入氣端所導入的常溫空氣,以排除常溫空氣與該烤箱內的循環風流直接接觸,令常溫空氣先通過該加熱器的加熱之後才接觸該烤箱內的循環風流。 To this end, one object of the present invention is to provide an oil-preventing oven The method of contaminating the heater with ink volatile particles includes: spacing the room temperature air introduced into one of the air inlets of the oven to eliminate direct contact between the room temperature air and the circulating air flow in the oven, so that the room temperature air first passes through the heating of the heater Only in contact with the circulating air flow in the oven.
在進一步實施中,還包含排除該烤箱內的循環風流直接接觸該加熱器。 In a further implementation, it also includes excluding the circulating airflow in the oven from directly contacting the heater.
在進一步實施中,該加熱器在該烤箱內加熱常溫空氣。 In a further implementation, the heater heats normal temperature air in the oven.
在進一步實施中,該入氣端自外界強制導引常溫空氣進入該烤箱內 In a further implementation, the air inlet forcibly guides normal temperature air into the oven from the outside
上述方法可以透過一種裝置技術而獲得實現,為此,本發明之一具體實施例在於提供一種防止油墨揮發粒子沾染加熱器的烤箱裝置,其技術手段包括:一加熱腔室,形成於該烤箱內,該加熱腔室並連通該烤箱內所設置的一入氣端及一排氣端,使該加熱腔室內生成烘烤物件用的一循環風流;一進氣流道,布建於該入氣端與該加熱腔室之間,且該加熱器係配置於該進氣流道內,該進氣流道經由該入氣端導引外界的常溫空氣先接觸該加熱器而成為熱空氣之後才導入該加熱腔室內;其中,該進氣流道經由至少一隔板於該加熱腔室內間隔形成,該隔板間隔該入氣端的常溫空氣直接接觸該加熱腔室內的循環風流。 The above method can be achieved through a device technology. To this end, a specific embodiment of the present invention is to provide an oven device that prevents ink volatile particles from contaminating the heater. The technical means include: a heating chamber formed in the oven , The heating chamber is connected to an air inlet end and an exhaust end provided in the oven, so that a circulating air flow for baking objects is generated in the heating chamber; an air inlet flow channel is built in the air inlet Between the end and the heating chamber, and the heater is disposed in the intake air flow path, and the air intake flow path guides the ambient air at the outside through the air intake end first to contact the heater to become hot air. Introduced into the heating chamber; wherein the air inlet flow path is formed in the heating chamber through at least one partition, and the partition directly contacts the circulating air flow in the heating chamber with the room temperature air at the inlet end.
在進一步實施中,該隔板間隔該循環風流直接接觸該加熱器。 In a further implementation, the baffle directly contacts the heater across the circulating wind flow.
在進一步實施中,該加熱腔室內配置有一驅動熱空氣形成該循環風流的風輪。其中該風輪坐落於該入氣端與該排氣端之間。 In a further implementation, a wind wheel driving hot air to form the circulating wind flow is arranged in the heating chamber. The wind wheel is located between the inlet end and the exhaust end.
在進一步實施中,該入氣端配置有一鼓風機,該鼓風機自外界抽取常溫空氣強制導入該進氣流道內。 In a further implementation, a blower is arranged at the air inlet end, and the blower extracts normal temperature air from the outside and forcibly introduces it into the intake flow path.
根據上述技術手段,本發明的技術效果在於:藉由常溫空氣在加熱成為熱空氣之後才導入加熱腔室,使常溫空氣不 會直接接觸烤箱內的循環風流而導致循環風流的溫度驟降,能避免油墨揮發粒子因凝結而附著於加熱器,可有效的改善傳統烤箱中油墨揮發粒子容易沾染加熱器的問題。 According to the above technical means, the technical effect of the present invention is that the room temperature air is introduced into the heating chamber after being heated into hot air, so that the room temperature air is not It will directly contact the circulating air flow in the oven and cause the temperature of the circulating air flow to drop suddenly, which can prevent the volatile ink particles from adhering to the heater due to condensation, which can effectively improve the problem that the volatile ink particles in the traditional oven easily contaminate the heater.
在此所揭露的各實施例的特徵及技術效果將呈現於下方的描述與圖示中。 The features and technical effects of the embodiments disclosed herein will be presented in the description and illustration below.
10a、10b、10c、10d、 10e‧‧‧烤箱 10a, 10b, 10c, 10d, 10e‧‧‧oven
101‧‧‧內殼體 101‧‧‧Inner shell
102‧‧‧外殼體 102‧‧‧Outer shell
103‧‧‧隔熱層 103‧‧‧Insulation
11a、11b、11d、11e‧‧‧加熱腔室 11a, 11b, 11d, 11e‧‧‧Heating chamber
12a、12b、12c、12d、 12e‧‧‧入氣端 12a, 12b, 12c, 12d, 12e‧‧‧Inlet end
13a、13b、13d‧‧‧排氣端 13a, 13b, 13d‧‧‧ exhaust end
14、14e‧‧‧風流通道 14, 14e‧‧‧Air flow channel
15、15e‧‧‧導流板 15, 15e‧‧‧Baffle
16a、16b、16c、16d、 16e‧‧‧循環風流 16a, 16b, 16c, 16d, 16e‧‧‧Circulation
17c、17d、17e‧‧‧進氣流道 17c, 17d, 17e‧‧‧ intake runner
18d、18e‧‧‧隔板 18d, 18e‧‧‧ partition
20a、20b、20c、20d、20e‧‧‧加熱器 20a, 20b, 20c, 20d, 20e ‧‧‧ heater
30a、30b、30d、30e‧‧‧風輪 30a, 30b, 30d, 30e
31‧‧‧馬達 31‧‧‧Motor
40‧‧‧鼓風機 40‧‧‧Blower
S1至S3‧‧‧實施例之步驟說明 Steps from S1 to S3‧‧‧ Examples
圖1是傳統隧道式烤箱的剖示圖。 FIG. 1 is a cross-sectional view of a conventional tunnel oven.
圖2是傳統箱型烤箱的剖示圖。 2 is a cross-sectional view of a conventional box-type oven.
圖3是本發明步驟方法的流程圖。 FIG. 3 is a flowchart of the step method of the present invention.
圖4是實施圖3所示步驟S1至S3所需的烤箱基本架構圖。 FIG. 4 is a basic architecture diagram of an oven required to implement steps S1 to S3 shown in FIG. 3.
圖5是本發明第一款隧道式烤箱實施例的剖示圖。 5 is a cross-sectional view of an embodiment of the first tunnel oven of the present invention.
圖6是圖5的動作示意圖。 FIG. 6 is a schematic diagram of the operation of FIG. 5.
圖7是本發明第二款箱型烤箱實施例的剖示圖。 7 is a cross-sectional view of an embodiment of a second oven of the present invention.
圖8是圖7的動作示意圖。 FIG. 8 is a schematic diagram of the operation of FIG. 7.
請參閱圖3,揭露本發明所提供之烤箱中防止油墨揮發粒子沾染加熱器的方法,包括依序執行下列步驟S1至S3: Please refer to FIG. 3 to disclose the method for preventing the volatile ink particles from contaminating the heater in the oven provided by the present invention, which includes sequentially performing the following steps S1 to S3:
步驟S1:間隔常溫空氣與循環風流; Step S1: Separate room temperature air and circulating air flow;
請參閱圖4,說明在烤箱10c內設置一進氣流道17c,該進氣流道17c與入氣端12c相連通,外界的常溫空氣依序通過入氣端12c、進氣流道17c而導入烤箱10c內,該加熱器20c是配置於進氣流道17c內,使常溫空氣先接觸加熱器20c再接觸烤箱10c內的循環風流16c,令常溫空氣無法直接接觸到烤箱10c內的循環風流16c,能避免烤箱10c內的循環風流14c因直接接觸到常溫空氣而使溫度下降。
Referring to FIG. 4, it is illustrated that an air
步驟S2:加熱常溫空氣; Step S2: heating normal temperature air;
請再次參閱圖4,說明常溫空氣是先通過加熱器20c的加熱成為熱空氣之後,才接觸烤箱10c內的循環風流16c,因此
能避免循環風流16c的溫度下降。進一步的說,加熱器20c是設於烤箱10c內加熱常溫空氣,能避免常溫空氣在烤箱10c外加熱成為熱空氣之後,在導入烤箱10c內的過程中發生降溫損耗熱能現象,或者需求額外增設保溫管道或保溫流道,才能將熱空氣導入烤箱10c內而造成設備結構的負擔。
Please refer to FIG. 4 again, indicating that the normal temperature air is heated by the
步驟S3:接觸循環風流;請再次參閱圖4,說明入氣端12c自外界強制導引常溫空氣進入烤箱10c內,使常溫空氣通過加熱器20c接觸循環風流16c,並藉由常溫空氣進入烤箱10c內時所產生的風壓,以排除烤箱10c內的循環風流16c反向流入進氣流道17c而直接接觸加熱器20c,能避免循環風流16c所帶動的油墨揮發粒子沾染加熱器20c。
Step S3: contact with circulating air flow; please refer to FIG. 4 again, illustrating that the
另一方面,請合併參閱圖5及圖6,說明本發明之烤箱裝置的第一款較佳實施例,說明在一種隧道式烤箱上實施本發明,使上述烤箱中防止油墨揮發粒子沾染加熱器的方法可以容易地被實施。圖5及圖6所揭結構,除了包括圖4所揭露的基本架構之外,還包含了一加熱腔室11d及一進氣流道17d。其中:該加熱腔室11d是形成於烤箱10d內,該烤箱10d在實施上包含有一內殼體101及包覆該內殼體101的一外殼體102,該加熱腔室11d是形成於該內殼體101內。該內殼體101與該外殼體102之間設置有一具保溫效果的隔熱層103。進一步的說,該烤箱10d內設置有連通該加熱腔室11d的一入氣端12d及一排氣端13d,使外界的常溫空氣經由入氣端12d進入加熱腔室11d內,再經由排氣端13d離開,進而生成一循環風流16d。更進一步的說,該加熱腔室11d內設有多片導流板15,藉由導流板15在加熱腔室11d內構成一風流通道14,該風流通道14是與入氣端12d及排氣端13d相連通,該循環風流16d是沿風流通道14在加熱腔室11d內流動。
On the other hand, please refer to FIGS. 5 and 6 together to illustrate the first preferred embodiment of the oven apparatus of the present invention, and to illustrate the implementation of the present invention on a tunnel oven to prevent the volatile ink particles from contaminating the heater in the oven The method can be easily implemented. The structure disclosed in FIGS. 5 and 6 includes a
該加熱腔室11d內設置有一電熱式的加熱器20d,使
常溫空氣經由加熱器20d的加熱而成為熱空氣。該加熱腔室11d內還配置有一風輪30d,該風輪30d是坐落於入氣端12d與排氣端13d之間的風流通道14內。該風輪30d在實施上軸接一馬達31,該風輪30d經由馬達31的驅動而旋轉,能藉由風輪30d的旋轉而驅動加熱腔室11d內的熱空氣沿風流通道14流動,使熱空氣經由排氣端13d離開加熱腔室11d,進而生成烘烤物件用的循環風流16d。
An
該進氣流道17d是布建於該入氣端12d與該加熱腔室11d之間,該進氣流道17d是與風流通道14相連通,外界的常溫空氣經由入氣端12d通過進氣流道17d導入加熱腔室11d內。進一步的說,該加熱器20d是配置於進氣流道17d內,外界的常溫空氣是先接觸加熱器20d而成為熱空氣之後才導入加熱腔室11d內。
The air
該進氣流道17d在實施上是經由至少一隔板18d於該加熱腔室11d內間隔形成,該隔板18d能間隔該入氣端12d的常溫空氣直接接觸該加熱腔室11d內的循環風流16d,也能間隔該加熱腔室11d內的循環風流16d直接接觸加熱器20d,藉此,除了能避免該加熱腔室11d內的循環風流16d與常溫空氣直接接觸而維持循環風流16d的溫度,還能避免循環風流16d所帶動的油墨揮發粒子沾染加熱器20d。進一步的說,該入氣端12d配置有一鼓風機40,該鼓風機40自外界抽取常溫空氣強制導入該進氣流道17d內,使該進氣流道17d內的氣壓大於該加熱腔室11d內的的氣壓,能避免該加熱腔室11d內的循環風流16d反向流入該進氣流道17d內。
In the implementation, the
此外,請合併參閱圖7及圖8,說明本發明之烤箱裝置的第二款較佳實施例,說明在一種箱型烤箱上實施本發明,本實施例與第一款實施例的差異之處在於:兩者入氣端12d、12e設置位置的不同,其中第一款實施例的入氣端12d是設置烤箱10d的旁側,本實施例的入氣端12e是設置烤箱10e的頂部。兩者的
入氣端12d、12e雖然所設置的位置不同,均能藉由隔板18d、18e所間隔形成的進氣流道17d、17e來避免入氣端12d、12e所導入的常溫空氣直接接觸加熱腔室11d、11e內的循環風流16d、16e,且加熱腔室11d、11e內都能利用導流板15、15e間隔形成的風流通道14、14e來配置風輪30d、30e,進而維持加熱腔室11d、11e內的循環風流16d、16e之溫度,可有效防止油墨揮發粒子因凝結而沾染加熱器20d、20e的問題。
In addition, please refer to FIG. 7 and FIG. 8 together to illustrate the second preferred embodiment of the oven apparatus of the present invention and the implementation of the present invention on a box-type oven. Differences between this embodiment and the first embodiment The reason is that the positions of the air inlet ends 12d and 12e of the two are different. The
以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。因此,本發明應以申請專利範圍中限定的請求項內容為準。 The above examples merely express the preferred embodiments of the present invention, but they should not be construed as limiting the patent scope of the present invention. Therefore, the present invention shall be subject to the content of the claims defined in the scope of patent application.
S1至S3‧‧‧實施例之步驟說明 Steps from S1 to S3‧‧‧ Examples
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