TWI679673B - 電漿處理裝置 - Google Patents

電漿處理裝置 Download PDF

Info

Publication number
TWI679673B
TWI679673B TW104135442A TW104135442A TWI679673B TW I679673 B TWI679673 B TW I679673B TW 104135442 A TW104135442 A TW 104135442A TW 104135442 A TW104135442 A TW 104135442A TW I679673 B TWI679673 B TW I679673B
Authority
TW
Taiwan
Prior art keywords
frequency
plasma
antenna
frequency antenna
variable capacitor
Prior art date
Application number
TW104135442A
Other languages
English (en)
Chinese (zh)
Other versions
TW201630031A (zh
Inventor
山涌純
Jun Yamawaku
松土龍夫
Tatsuo Matsudo
輿水地塩
Chishio Koshimizu
Original Assignee
日商東京威力科創股份有限公司
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司, Tokyo Electron Limited filed Critical 日商東京威力科創股份有限公司
Publication of TW201630031A publication Critical patent/TW201630031A/zh
Application granted granted Critical
Publication of TWI679673B publication Critical patent/TWI679673B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6512—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour
    • H10P14/6514—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour by exposure to a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW104135442A 2014-11-05 2015-10-28 電漿處理裝置 TWI679673B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-225241 2014-11-05
JP2014225241A JP6582391B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置

Publications (2)

Publication Number Publication Date
TW201630031A TW201630031A (zh) 2016-08-16
TWI679673B true TWI679673B (zh) 2019-12-11

Family

ID=55853446

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104135442A TWI679673B (zh) 2014-11-05 2015-10-28 電漿處理裝置
TW108140483A TW202013429A (zh) 2014-11-05 2015-10-28 電漿處理裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108140483A TW202013429A (zh) 2014-11-05 2015-10-28 電漿處理裝置

Country Status (4)

Country Link
US (1) US10325758B2 (enExample)
JP (1) JP6582391B2 (enExample)
KR (2) KR101974691B1 (enExample)
TW (2) TWI679673B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10714960B2 (en) * 2015-12-22 2020-07-14 Intel Corporation Uniform wireless charging device
CN106920732B (zh) * 2015-12-25 2018-10-16 中微半导体设备(上海)有限公司 一种电极结构及icp刻蚀机
US20190088449A1 (en) * 2017-09-21 2019-03-21 Semes Co., Ltd. Substrate treating apparatus and substrate treating method
JP7175239B2 (ja) 2018-06-22 2022-11-18 東京エレクトロン株式会社 制御方法、プラズマ処理装置、プログラム及び記憶媒体
DE102018116637A1 (de) * 2018-07-10 2020-01-16 TRUMPF Hüttinger GmbH + Co. KG Leistungsversorgungseinrichtung und Betriebsverfahren hierfür
JP7139181B2 (ja) * 2018-07-26 2022-09-20 ワイエイシイテクノロジーズ株式会社 プラズマ処理装置
WO2020141806A2 (ko) * 2018-12-31 2020-07-09 인투코어테크놀로지 주식회사 플라즈마 발생 장치 및 그 동작 방법
US11515122B2 (en) 2019-03-19 2022-11-29 Tokyo Electron Limited System and methods for VHF plasma processing
JP7579766B2 (ja) * 2020-10-06 2024-11-08 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理用コイル
US11401608B2 (en) * 2020-10-20 2022-08-02 Sky Tech Inc. Atomic layer deposition equipment and process method
CN112331546B (zh) * 2020-10-26 2024-06-21 北京北方华创微电子装备有限公司 半导体工艺设备
WO2022146648A1 (en) 2020-12-28 2022-07-07 Mattson Technology, Inc. Induction coil assembly for plasma processing apparatus
KR102323580B1 (ko) * 2021-04-01 2021-11-09 피에스케이 주식회사 플라즈마 발생 유닛 및 기판 처리 장치
JP2022185603A (ja) * 2021-06-03 2022-12-15 株式会社アルバック プラズマ処理装置
CN114171920B (zh) * 2021-12-07 2025-05-23 国开启科量子技术(北京)有限公司 一种基于低温螺旋谐振器的天线调节系统
JP7650834B2 (ja) * 2022-02-16 2025-03-25 東京エレクトロン株式会社 プラズマ処理装置
US20240347317A1 (en) * 2023-04-11 2024-10-17 Tokyo Electron Limited Method and System for Plasma Processing
US20250132128A1 (en) * 2023-10-18 2025-04-24 Tokyo Electron Limited Method and System for Plasma Process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6164241A (en) * 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
JP2010258324A (ja) * 2009-04-28 2010-11-11 Tokyo Electron Ltd プラズマ処理装置
US20110094997A1 (en) * 2009-10-27 2011-04-28 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20120031560A1 (en) * 2010-08-04 2012-02-09 Tokyo Electron Limited Plasma processing apparatus
TW201304615A (zh) * 2011-03-29 2013-01-16 Tokyo Electron Ltd 電漿處理裝置及電漿處理方法
WO2013172665A1 (ko) * 2012-05-17 2013-11-21 한양대학교 산학협력단 플라즈마 장비

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814762B2 (ja) 1975-08-25 1983-03-22 日立電線株式会社 アンテナツキケ−ブル
US5731565A (en) * 1995-07-27 1998-03-24 Lam Research Corporation Segmented coil for generating plasma in plasma processing equipment
US6045618A (en) * 1995-09-25 2000-04-04 Applied Materials, Inc. Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
JP3739137B2 (ja) * 1996-06-18 2006-01-25 日本電気株式会社 プラズマ発生装置及びこのプラズマ発生装置を使用した表面処理装置
US6441555B1 (en) * 2000-03-31 2002-08-27 Lam Research Corporation Plasma excitation coil
US7096819B2 (en) * 2001-03-30 2006-08-29 Lam Research Corporation Inductive plasma processor having coil with plural windings and method of controlling plasma density
KR101038204B1 (ko) * 2004-02-25 2011-05-31 주성엔지니어링(주) 플라즈마 발생용 안테나
US20070170867A1 (en) * 2006-01-24 2007-07-26 Varian Semiconductor Equipment Associates, Inc. Plasma Immersion Ion Source With Low Effective Antenna Voltage
US8075734B2 (en) * 2007-07-06 2011-12-13 Applied Materials, Inc. Remote inductively coupled plasma source for CVD chamber cleaning
KR101757922B1 (ko) * 2009-10-27 2017-07-14 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
US9313872B2 (en) * 2009-10-27 2016-04-12 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5781349B2 (ja) * 2011-03-30 2015-09-24 東京エレクトロン株式会社 プラズマ処理装置
WO2014073395A1 (ja) * 2012-11-09 2014-05-15 株式会社村田製作所 電気部品およびアンテナ
US20160013661A1 (en) * 2014-07-08 2016-01-14 Witricity Corporation Resonators for wireless power transfer systems

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6164241A (en) * 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
JP2010258324A (ja) * 2009-04-28 2010-11-11 Tokyo Electron Ltd プラズマ処理装置
US20110094997A1 (en) * 2009-10-27 2011-04-28 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20120031560A1 (en) * 2010-08-04 2012-02-09 Tokyo Electron Limited Plasma processing apparatus
TW201304615A (zh) * 2011-03-29 2013-01-16 Tokyo Electron Ltd 電漿處理裝置及電漿處理方法
WO2013172665A1 (ko) * 2012-05-17 2013-11-21 한양대학교 산학협력단 플라즈마 장비

Also Published As

Publication number Publication date
KR101974691B1 (ko) 2019-05-02
KR20160053824A (ko) 2016-05-13
KR20190045141A (ko) 2019-05-02
TW201630031A (zh) 2016-08-16
JP2016091812A (ja) 2016-05-23
JP6582391B2 (ja) 2019-10-02
US20160126063A1 (en) 2016-05-05
TW202013429A (zh) 2020-04-01
US10325758B2 (en) 2019-06-18
KR102033873B1 (ko) 2019-10-17

Similar Documents

Publication Publication Date Title
KR102033873B1 (ko) 플라즈마 처리 장치
TWI679672B (zh) 電漿處理裝置
US11832373B2 (en) Plasma processing apparatus
KR101852310B1 (ko) 플라즈마 처리 장치 및 플라즈마 처리 방법
CN113451100B (zh) 等离子体处理装置
US11145490B2 (en) Plasma processing method
JP2020017445A (ja) プラズマ処理装置