TWI679519B - server - Google Patents

Abstract

A server includes a chassis, a storage module, and a motherboard. The chassis includes a bottom plate and two side plates. The two side plates stand on the bottom plate. The storage module is disposed on the bottom plate. The motherboard includes a circuit board, at least one central processing unit, a first signal amplifier board, a second signal amplifier board, an adapter card, and a third signal amplifier board. The circuit board is disposed on the bottom plate. At least one central processing unit, a first signal amplifier board and a second signal amplifier board are disposed on the circuit board. The riser card is set on the second signal amplifier board. The third signal amplification board is set on the adapter card.

Description

server

The invention relates to a server, in particular to a server with a high-density storage unit.

With the development of the Internet, the combination of servers and cloud services provided by the Internet has been rapidly spreading around the world in recent years, and the popularity of cloud services has resulted in a large amount of data to be processed by servers at an alarming rate. growing up. Therefore, the server's requirements for storage space and read / write speed of the storage unit increase with the growth of data.

However, in addition to the storage unit, the server needs to be configured with components such as the motherboard, cooling module, and expansion cards in a limited space. Therefore, it is difficult to set the number of storage units in the server to exceed the server's space limit, resulting in It is difficult to increase the density of the storage unit.

The invention is to provide a server with a high-density storage unit, so as to solve the problem that the number of storage units in the conventional server is difficult to break through the space limitation of the server, and the density of the storage unit is difficult to increase.

The server disclosed in one embodiment of the present invention includes a casing, a storage module, and a motherboard. The chassis includes a bottom plate and two side plates. The bottom plate has a first side, a second side, a third side, and a fourth side. The first side is opposite the second side. The third side and the fourth side are between the first side and the second side. The third side is opposite the fourth side. The two side plates stand on the first side and the second side, respectively. The storage module is disposed on the bottom plate. The storage module includes a set of adapters, multiple sub-assembly adapters, multiple backplanes, and multiple storage units. The assembling frame is arranged on the two side plates. The sub-assembly frame is arranged in the assembly frame. The back plates are respectively arranged in the sub-group receiving frames. The storage units are respectively detachably disposed on the sub-group adapter, and are electrically connected to the back plates located in the same sub-group adapter. The motherboard includes a circuit board, at least one central processing unit, a signal output port, a first signal amplifier board, a second signal amplifier board, a transfer card, and a third signal amplifier board. The circuit board is disposed on the bottom plate and is interposed between the storage module and the fourth side. At least one central processing unit is disposed on a side of the circuit board near the storage module. The signal output port, the first signal amplification board and the second signal amplification board are disposed on a side of the circuit board away from the storage module. The first signal amplifier board and the second signal amplifier board are perpendicular to the circuit board, and the first signal amplifier board is closer to the signal output port than the second signal amplifier board. One side. The third signal amplifier board is disposed on a side of the adapter card away from the second signal amplifier board, and the third signal amplifier board is parallel to the circuit board. The first signal amplification board, the second signal amplification board, and the third signal amplification board are electrically connected to the signal output port and the storage module.

According to the server of the above embodiment, since the assembly rack of the storage module is disposed on the two side boards, the circuit board of the main board is interposed between the storage module and the fourth side, and the third signal amplification board is disposed in parallel with the circuit board. The configuration relationship of the riser card enables the number of storage units in the server to exceed the original space limit. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and a faster read and write speed.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1-2. FIG. 1 is a perspective view of a server according to a first embodiment of the present invention. FIG. 2 is an exploded view of the server of FIG. 1.

The height H of the server 10 in this embodiment is, for example, 2U. Generally speaking, the height H of the server 10 is in units of U, and 1U is equivalent to 1.75 inches, which is also equivalent to 44.45 mm. Therefore, the height H of the server 10 in this embodiment is equivalent to 3.5 inches and 88.9 mm.

The server 10 includes a chassis 100, a storage module 200, a motherboard 300, a universal serial bus connection board 400, a thermal sensing board 500, and a light emitting board 600. The casing 100 includes a bottom plate 110 and two side plates 120. The bottom plate 110 has a first side 111, a second side 112, a third side 113, and a fourth side 114. The first side 111 is opposite to the second side 112. The third side 113 and the fourth side 114 are interposed between the first side 111 and the second side 112. The third side 113 is opposite the fourth side 114. The two side plates 120 stand on the first side 111 and the second side 112, respectively.

The storage module 200 is disposed on the bottom plate 110. The storage module 200 includes a set of brackets 210, a plurality of sub-frames 220, a plurality of backplanes 230, and a plurality of storage units 240. The assembling frame 210 is disposed on the two side plates 120. The number of the sub-assembly frames 220 is, for example, four, and the sub-assembly frames 220 are disposed in the assembly frame 210. Each sub-assembly bracket 220 has a plurality of buckling grooves 221 on a side remote from the bottom plate 110.

The number of the back plates 230 is, for example, four, and the back plates 230 are respectively disposed in the sub-assembly frames 220.

The number of these storage units 240 is, for example, sixty-four. The storage units 240 are detachably disposed on the sub-assembly frames 220, respectively, and the back plates 230 are electrically connected to the storage units 240 located in the same sub-assembly frame 220, respectively. For example, each of the four sub-frame brackets 220 in this embodiment is provided with sixteen storage units 240. The backplane 230 in each sub-group adapter 220 is electrically connected to the sixteen storage units 240 located in the same sub-group adapter 220.

Please refer to FIG. 2 and FIG. 3. FIG. 3 is an exploded view of a storage unit of the server of FIG. 1. Each of these storage units 240 includes a hard disk rack 241, a memory card 242, an assembly board 243, a light guide rack 244, and two light emitting elements 245.

Each of the hard disk racks 241 includes a cover 2410, a snap-fit spring 2411, and a holding post 2412.

Each cover 2410 includes an upper cover portion 24100, two side cover portions 24101, a front cover portion 24102, and two guide plates 24103. In each of the masks 2410, two-side covering portions 24101 are respectively disposed on opposite sides of the upper covering portion 24100. The front cover portion 24102 is connected to the upper cover portion 24100 and the two-side cover portion 24101 and has a plurality of through grooves 24104. The two guide plates 24103 are respectively connected to the two sides of the two cover portions 24101 away from the front cover portion 24102, and the two guide plates 24103 each have a first guide side S1 and a second guide side S2 opposite to each other. The two first guiding sides S1 are connected to the two-side covering portions 24101, respectively. The distance D1 between the two first guiding sides S1 is greater than the distance D2 between the two second guiding sides S2. In this way, each storage unit 240 can be guided into the sub-assemblies 220 by two guide plates 24103. In addition, each of the two second guide sides S2 has two guide side edges 24105. The four guide side edges 24105 respectively make the two guide plates 24103 slide more smoothly on the sub-assembly brackets 220.

Each buckle spring piece 2411 includes a fixing portion 24110, a pressing portion 24111, and a buckling portion 24112. In each hard disk holder 241, a fixing portion 24110 is fixed to one of the cover portions 24101. The pressing portion 24111 and the latching portion 24112 protrude from the side covering portion 24101 fixed by the front covering portion 24102 and the fixing portion 24110, respectively.

The holding posts 2412 are disposed on the front cover portions 24102 and each have a groove 24120.

The memory cards 242 are, for example, M.3 solid-state hard disks, and the buckle springs 2411 are buckled in the buckle slots 221, so that the memory cards 242 are mounted on the sub-frames 220 through the hard disk racks 241. . In this embodiment, the memory cards 242 are M.3 solid-state hard disks, but are not limited thereto. In other embodiments, the memory cards may also be M.2 solid-state hard disks.

See Figure 4. FIG. 4 is a perspective view of an assembly plate and a light guide frame of the storage unit of FIG. 3. Each of the assembling plates 243 includes an engaging portion 2432 and an engaging protrusion 2433. The assembling plate 243 has a first engaging slot 2430 and two second engaging slots 2431. In each of the storage units 240, the engaging convex portion 2433 protrudes from the engaging portion 2432 and is engaged with the groove 24120 of the holding post 2412. The first engaging slot 2430 and the two second engaging slots 2431 are located in the engaging portion 2432.

Each of the light guide frames 244 has two first clamping blocks 2440 and two third clamping slots 2441. In each storage unit 240, one of the first clamping blocks 2440 of the light guide frame 244 is engaged with the first clamping slot 2430 of the assembly plate 243. The light guide frame 244 is engaged with the two second grooves 2431 of the assembly plate 243. The memory card 242 and the assembly plate 243 are engaged with the second and third card slots 2441 of the light guide frame 244. In this embodiment, each light guide frame 244 has two first clip blocks 2440, but it is not limited thereto. In other embodiments, each light guide frame may have only one first clip block.

In each storage unit 240, the hard disk rack 241 further includes two light guides 2413. The two light guide pillars 2413 are disposed on the light guide frame 244, and the two light guide pillars 2413 and the light guide frame 244 are, for example, a one-piece structure formed by injection molding. The two light guide posts 2413 are respectively disposed in two of the two through grooves 24104 of the front cover portion 24102. The two light-emitting elements 245 are, for example, light-emitting diodes, and are disposed on opposite sides of the memory card 242 and respectively correspond to two light-guiding pillars 2413. Specifically, the light emitted by the two light-emitting elements 245 can be transmitted to the two light-guiding pillars 2413, respectively, and the two light-guiding pillars 2413 further expose the light through the through-slot 24104.

See Figure 2. The motherboard 300 includes a circuit board 301, two central processing units 302, a signal output port 303, a first signal amplification board 304, a second signal amplification board 305, an adapter card 306, and a third signal amplification board 307. .

The circuit board 301 is disposed on the bottom plate 110 and is interposed between the storage module 200 and the fourth side 114. In addition, each of these backplanes 230 includes a circuit substrate 231 and a power connector 232. In each backplane 230, a power connector 232 is disposed on a side of the circuit substrate 231 away from the bottom plate 110, and the power connector 232 is electrically connected to the circuit board 301.

The two central processing units 302 are disposed on a side of the circuit board 301 near the storage module 200. The signal output port 303 is, for example, a network interface, and the signal output port 303, the first signal amplifier board 304, and the second signal amplifier board 305 are disposed on a side of the circuit board 301 away from the storage module 200. The motherboard 300 in this embodiment includes two central processing units 302, but is not limited thereto. In other embodiments, the motherboard may also include only one central processing unit.

The first signal amplifier board 304 and the second signal amplifier board 305 are, for example, perpendicular to the circuit board 301, and the first signal amplifier board 304 is closer to the signal output port 303 than the second signal amplifier board 305. The riser card 306 is disposed on a side of the second signal amplification board 305 away from the first signal amplification board 304. The third signal amplification board 307 is disposed on a side of the adapter card 306 away from the second signal amplification board 305, and the third signal amplification board 307 is, for example, parallel to the circuit board 301.

In addition, each of these backplanes 230 further includes a plurality of signal connectors 233. In each backplane 230, the signal connectors 233 are disposed on a side of the circuit substrate 231 away from the base plate 110, and the number of the signal connectors 233 is, for example, two. The first signal amplification board 304, the second signal amplification board 305, and the third signal amplification board 307 are electrically connected to the signal output port 303 and the signal connector 233 of each backplane 230 in the storage module 200. In this way, when the signal output port 303 receives data data from the Internet, the data data amplified by the signal amplification boards 304, 305, and 307 can be transmitted to the storage module 200 for storage. In contrast, the data stored in the storage module 200 can also be amplified by the signal amplification boards 304, 305, and 307, and then transmitted to the Internet through the signal output port 303.

The universal serial bus connection board 400, the thermal sensing board 500, and the light-emitting board 600 are electrically connected to the motherboard 300. The universal serial bus connection board 400 is used to make the data in the server 10 easy to read and input. The thermal sensing board 500 is used to monitor the working temperature in the server 10 to maintain a good thermal cycle of the server 10. The light-emitting board 600 is used to display different working states of the server 10.

Please refer to FIGS. 5, 6 and 7. FIG. 5 is a schematic cross-sectional view of a storage unit of the server of FIG. 1. FIG. 6 is a schematic cross-sectional view of the storage unit of FIG. 5 from another perspective. FIG. 7 is a schematic cross-sectional view of the storage unit of FIG. 6 along another cut line. As shown in FIG. 5, in each storage unit 240, the protruding portion 2433 of the assembly plate 243 is caught in the groove 24120 of the holding post 2412. In addition, the light guide frame 244 is engaged with two second grooves 2431 of the assembly plate 243. As shown in FIG. 6, the two light guide posts 2413 are respectively disposed in the two through grooves 24104. In each storage unit 240, one of the first clamping blocks 2440 of the light guide frame 244 is engaged with the first clamping slot 2430 of the assembly plate 243. As shown in FIG. 7, the memory card 242 and the assembly plate 243 are engaged with two third card slots 2441 of the light guide frame 244.

In this way, the assembly board 243 and the light guide bracket 244 can fix the memory card 242 to the hard disk holder 241 in multiple directions, so that the memory card 242 is more stably installed on the hard disk holder 241. In addition, the structural cooperation between the hard disk holder 241, the assembly plate 243, and the light guide bracket 244 also plays a fool-proof role when the memory card 242 is installed on the hard disk holder 241 to prevent the storage card 242 or the hard disk holder 241 from being damaged. The structure was destroyed by inserting the memory card 242 backward.

Please refer to FIG. 2, FIG. 3 and FIG. 8. FIG. 8 is a schematic perspective view of the storage module of the server of FIG. 1 when an ion assembly is disassembled in some storage units. When the user wants to remove the storage unit 240 from the ion assembly bracket 220, he only needs to hold the holding post 2412 with one hand and press the pressing part 24111 of the snap spring 2411 with the other hand, so that the snap of the snap spring 2411 The buckling portion 24112 is separated from the buckling groove 221 of the sub-assembly bracket 220. In this way, the storage unit 240 can be taken out from the sub-assembly receiving frame 220, and each storage unit 240 can be independently disassembled.

In addition, since each of the sub-frames 220 has a back plate 230 independent of other sub-frames 220, each sub-frame 220 can independently transmit signals to and from the motherboard 300. Therefore, in addition to the feature that each of the storage units 240 can be independently disassembled on the sub-frame adapter 220, the four-sub-frame adapter 220 also modularizes the storage module 200 into four small modules that can operate independently, allowing users to more Use the server 10 flexibly.

Furthermore, if there is no storage unit 240 in the sub-frame adapter 220, the user may set a protective sheet 20 on the sub-frame adapter 220 to provide a protection function that prevents foreign objects from entering the sub-frame adapter 220 and affecting the operation of the backplane 230. For example, in the storage module 200 of FIG. 8, only one of the four sub-frames 220 is provided with the storage unit 240, so the other three sub-frames 220 without the storage unit 240 are provided. There are protective sheets 20.

When the user wants to install the storage unit 240 on the sub-assembly receiving frame 220, the user only needs to push the storage unit 240, and the two guide plates 24103 guide the storage unit 240 into the sub-assembly receiving frame 220, so that the card The buckling portion 24112 of the buckle piece 2411 is locked in the buckling groove 221 of the sub-group receiving frame 220, so that the storage unit 240 can be fixed to the sub-group receiving frame 220, and the memory card 242 is inserted into the back plate 230. The corresponding relationship between the snap springs 2411 and the snap grooves 221 facilitates the memory card 242 to play a foolproof role when inserted into the back plate 230 to prevent the structure of the memory card 242 or the back plate 230 from being damaged due to the reverse insertion of the memory card 242.

According to the server of the above embodiment, since the assembly rack of the storage module is disposed on the two side boards, the circuit board of the main board is interposed between the storage module and the fourth side, and the third signal amplification board is disposed in parallel with the circuit board. The configuration relationship of the riser card enables the number of storage units in the server to exceed the original space limit. In this way, the density of the storage unit can be increased, so that the server has a larger storage space and a faster read and write speed.

In addition, through the corresponding structural design between the sub-frame and the hard disk rack, not only the storage units in the sub-frame can be independently operated, but also the fool-proof function when the storage unit is inserted into the backplane. In this way, the user can adjust the number of storage units in the sub-assembly shelf in a simple and convenient manner according to personal needs, and can also prevent the backplane or the structure of the storage unit from being damaged due to the reverse insertion of the storage unit on the backplane.

In addition, through the structural cooperation of the assembly plate, the light guide frame and the hard disk rack, not only can the storage card be fixed to the hard disk rack in multiple directions, but the storage card can be more stably installed on the hard disk rack, and the storage unit can also be stored. When installed in the hard disk rack, it plays a fool-proof role, and prevents the storage unit or the structure of the hard disk rack from being damaged due to the reverse insertion of the storage unit into the hard disk rack.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in similar arts can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of patent protection of an invention shall be determined by the scope of patent application attached to this specification.

10‧‧‧Server

100‧‧‧chassis

110‧‧‧ floor

111‧‧‧first side

112‧‧‧Second side

113‧‧‧ third side

114‧‧‧ fourth side

120‧‧‧Side

200‧‧‧Storage Module

210‧‧‧group receiving frame

220‧‧‧ Sub-group receiving frame

221‧‧‧Snap slot

230‧‧‧ back plate

231‧‧‧circuit board

232‧‧‧Power connector

233‧‧‧Signal connector

240‧‧‧Storage Unit

241‧‧‧HDD Rack

2410‧‧‧Mask

24100‧‧‧ Upper cover

24101‧‧‧ side cover

24102‧‧‧Front cover

24103‧‧‧Guide plate

24104‧‧‧through groove

24105‧‧‧Guide side edge

2411‧‧‧Snap Shrapnel

24110‧‧‧Fixed section

24111‧‧‧Pressing section

24112‧‧‧Snap

2412‧‧‧Grip

2413‧‧‧light guide

24120‧‧‧Groove

242‧‧‧Memory Card

243‧‧‧Assembly board

2430‧‧‧First card slot

2431‧‧‧Second Card Slot

2432‧‧‧ Engagement Department

2433‧‧‧Card convex

244‧‧‧light guide

2440‧‧‧The first card block

2441‧‧‧Third Card Slot

245‧‧‧Light-emitting element

300‧‧‧ Motherboard

301‧‧‧circuit board

302‧‧‧Central Processing Unit

303‧‧‧Signal output port

304‧‧‧The first signal amplifier board

305‧‧‧second signal amplifier board

306‧‧‧Transfer Card

307‧‧‧The third signal amplifier board

400‧‧‧ universal serial bus connection board

500‧‧‧ thermal sensor board

600‧‧‧light-emitting board

20‧‧‧ protective sheet

S1‧‧‧first guide side

S2‧‧‧Second Guide Side

D1, D2‧‧‧ distance

H‧‧‧ height

FIG. 1 is a perspective view of a server according to a first embodiment of the present invention. FIG. 2 is an exploded view of the server of FIG. 1. FIG. 3 is an exploded view of a storage unit of the server of FIG. 1. FIG. 4 is a perspective view of an assembly plate and a light guide frame of the storage unit of FIG. 3. FIG. 5 is a schematic cross-sectional view of a storage unit of the server of FIG. 1. FIG. 6 is a schematic cross-sectional view of the storage unit of FIG. 5 from another perspective. FIG. 7 is a schematic cross-sectional view of the storage unit of FIG. 6 along another cut line. FIG. 8 is a schematic perspective view of the storage module of the server of FIG. 1 when an ion assembly is disassembled in some storage units.

Claims (10)

A server includes: a chassis including a bottom plate and two side plates, the bottom plate having a first side, a second side, a third side, and a fourth side, the first side being opposite to the second side, The third side and the fourth side are between the first side and the second side, the third side is opposite to the fourth side, and the two side plates stand on the first side and the second side, respectively; A storage module, which is disposed on the bottom plate; the storage module includes a set of brackets, a plurality of sub-assembly brackets, a plurality of backplanes, and a plurality of storage units; the set of brackets is disposed on the two side plates; The sub-frames are disposed in the sub-frames, the backboards are respectively disposed in the sub-frames, the storage units are detachably disposed in the sub-frames, and the electrical connection is located at The backplane in the same sub-group adapter; and a motherboard including a circuit board, at least a central processing unit, a signal output port, a first signal amplifier board, a second signal amplifier board, and a switch Card and a third signal amplification board, the circuit board is disposed on the bottom plate and interposed between the storage module Between the group and the fourth side, the at least one central processing unit is disposed on a side of the circuit board near the storage module, and the signal output port, the first signal amplification board, and the second signal amplification board are disposed on the A side of the circuit board far from the storage module, the first signal amplifier board and the second signal amplifier board are perpendicular to the circuit board, and the first signal amplifier board is closer to the signal output port than the second signal amplifier board, The adapter card is disposed on a side of the second signal amplifier board away from the first signal amplifier board, the third signal amplifier board is disposed on a side of the adapter card away from the second signal amplifier board, and the third The signal amplifier board is parallel to the circuit board. The first signal amplifier board, the second signal amplifier board, and the third signal amplifier board are electrically connected to the signal output port and the storage module. The server according to item 1 of the scope of the patent application, wherein a plurality of signal connectors and a power connector are respectively disposed on a side of the backplanes remote from the baseboard, and the backplanes are electrically connected through the signal connectors. The first signal amplifier board, the second signal amplifier board, and the third signal amplifier board are connected, and the circuit board is electrically connected through the power connector. The server according to item 1 of the scope of patent application, wherein each of the storage units includes a hard disk rack and a storage card, each of the hard disk racks includes a cover and a snap spring, and each of the hard disks In the rack, the cover includes an upper cover portion, two side cover portions, and a front cover portion. The two side cover portions are respectively disposed on opposite sides of the upper cover portion, and the front cover portion is connected to the upper cover portion and The two-side covering portion, the buckle spring piece includes a fixing portion, a pressing portion, and a buckling portion, the fixing portion is fixed to one of the side covering portions, and the pressing portion and the buckling portion are respectively protruding from the front The cover part and the side cover part fixed by the fixing part, each side of the sub-assembly brackets away from the bottom plate has a plurality of snap grooves, and the snap springs are snapped into the snap grooves, so that The memory cards are mounted on the sub-group adapters through the hard disk shelves. The server according to item 3 of the scope of patent application, wherein each of the masks further includes two guide plates, and in each of the masks, the two guide plates are respectively connected to the two side cover portions away from the front cover. The distance between the two sides of the two guide plates connected to the two-side covering portion is greater than the distance between the two sides of the two guide plates away from the two-side covering portion. The server according to item 4 of the scope of patent application, wherein in each of the masks, the two guide plates have two guide side edges on a side far from the front cover portion, and the four guide side edges are respectively The two guide plates are more smoothly slid on the sub-assembly adapters. The server according to item 3 of the scope of patent application, wherein each of the storage units further includes an assembly board and a light guide frame. In each of the storage units, the assembly board has a first card slot and two second Card slot, the light guide frame has a first card block and two third card slots, the first card block is engaged with the first card slot, the light guide frame is engaged with the two second card slots, and the storage The card and the assembly board are engaged in the two and third card slots. The server according to item 6 of the scope of patent application, wherein each of the hard disk racks further includes a holding post, and in each of the hard disk racks, the holding post is disposed on the front cover and the holding The post has a groove. The assembly plate includes a engaging portion and a protruding portion. The first slot and the second second slot are located in the engaging portion. The protruding portion protrudes from the engaging portion. And can be engaged with the groove. The server according to item 6 of the scope of patent application, wherein in each of the hard disk racks, the hard disk rack further includes two light guide posts, the two light guide posts are disposed on the light guide rack, and the front cover portion has a plurality of Through the slot, the two light guide pillars are respectively arranged in two of the through slots. The storage unit further includes two light emitting elements, which are disposed on opposite sides of the memory card and respectively correspond to the two light guide pillars. The server described in item 3 of the scope of patent application, wherein the height of the server is 2U, the number of the sub-frames is four, and the memory cards are M.3 solid state drives or M.2 solid state Hard disks, sixteen of the storage units are provided in the four sub-set adapters. The server described in item 1 of the patent application scope further includes a universal serial bus connection board, a thermal sensing board, and a light-emitting board, the universal serial bus connection board, the thermal sensing board, and the The light-emitting board is electrically connected to the motherboard.