TWI678776B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a casing, a fan, a cover plate, a pulley mechanism, and a driving unit. The casing is formed with an opening, the fan is disposed in the casing and corresponds to the opening, and the cover is movably disposed on the casing, wherein when the cover is in a closed position, the cover covers the foregoing At least part of the opening. The pulley mechanism is connected to the cover plate and the housing, and the driving unit is disposed on the housing and connected to the pulley mechanism. The driving unit drives the cover to move from the closed position to an open position relative to the housing through the pulley mechanism, so that the fan can be exposed to one side of the heat sink through the opening.

Description

Heat sink

The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device with a movable cover.

A fan is usually installed inside the existing cooling pad of a notebook computer for cooling the notebook computer. One of the common notebook cooling pads P1 is shown in Fig. 1. In order to consider the safety during use, A grid structure G is provided above the internal fan of the computer cooling pad P1 to prevent users from accidentally touching the fan and being injured.

Referring to FIG. 2 again, another form of the notebook computer cooling pad P2 is not provided with a grid structure, but the fan F is directly exposed at the opening H on the upper surface of the notebook computer cooling pad P2. It should be understood that although the cooling pad P2 of the notebook computer shown in FIG. 2 can achieve the advantages of less obstructed airflow and improved heat dissipation efficiency compared with the design of the grid structure, but it will cause users to When the fan is running, the fan accidentally touches the fan and is injured, so it has doubts about the safety of use.

In view of this, how to design a cooling device for a notebook computer that can take into account both heat dissipation performance and safety in use has become an important issue.

In view of the foregoing conventional problems, an embodiment of the present invention provides a heat dissipation device including a casing, a fan, a cover plate, a pulley mechanism, and a driving unit. The casing is formed with an opening, the fan is disposed in the casing and corresponds to the opening, and the cover is movably disposed on the casing, wherein when the cover is located in a closed position relative to the casing, the aforementioned The cover covers at least a part of the opening.

The pulley mechanism is connected to the cover plate and the housing, and the drive unit is disposed on the housing and is connected to the pulley mechanism. The drive unit applies a force to the pulley mechanism and drives the cover plate to oppose through the pulley mechanism. The housing is moved from the closed position to an open position, so that the fan can be exposed to one side of the heat sink through the opening.

In an embodiment, the heat dissipation device further includes an elastic element connected to the cover plate and the casing.

In an embodiment, the driving unit has a circuit board and a driving element, wherein the driving element is connected to the circuit board and the pulley mechanism, and the circuit board provides a current to the driving element to drive the pulley mechanism to drive the board. The cover is displaced relative to the housing.

In one embodiment, the driving element is made of a shape memory alloy (SMA) material.

In one embodiment, the heat sink further includes a proximity sensor, which is disposed on the housing and is electrically connected to the circuit board.

In one embodiment, the proximity sensor and the opening are located on the same side of the casing.

In an embodiment, the pulley mechanism has a movable pulley and a drawstring, the drawstring bypasses the movable pulley and connects the cover plate and the casing, and the driving element is connected to the circuit board and the movable pulley.

In an embodiment, the pulley mechanism further has a fixed pulley, the fixed pulley is fixed on the housing, and the pull rope passes around the movable pulley and the fixed pulley and forms an S-shaped structure. In addition, the foregoing driving element may have a shape memory alloy, and when the circuit board supplies a current to the driving element, the driving element may change its length.

In one embodiment, when the circuit board supplies current to the driving element, the driving element shrinks, so that the displacement of the cover plate is twice the contracted length of the driving element. In this way, not only the use safety can be considered, but It also has many advantages such as saving the space of the mechanism configuration and improving the heat dissipation effect.

In an embodiment, the heat dissipation device further includes a guide rail disposed on the housing to guide the moving pulley in the pulley mechanism to move relative to the housing to improve the stability of the pulley mechanism during operation.

In one embodiment, the aforementioned heat dissipation device further includes two cover plates, two pulley mechanisms, and two driving units. Wherein, the foregoing driving units are disposed on the casing and are respectively connected to the pulley mechanism.

In an embodiment, the aforementioned driving units respectively apply the aforementioned force to the aforementioned pulley mechanisms, and respectively drive the aforementioned cover plates to move relative to the casing through the aforementioned pulley mechanisms.

In an embodiment, the aforementioned driving element can also be replaced by a motor and a reel mechanism, wherein the circuit board can provide current to the aforementioned motor, and the pulley mechanism can be driven to move the cover plate relative to the housing through the reel mechanism, thereby The fan can be exposed at the aforementioned opening to improve heat dissipation efficiency.

Since the heat dissipation device of the present invention can expose the fan to the opening of the casing when in use, at least a part of the opening can be shielded through the cover when not in use, so that the safety in use can be taken into account at the same time. It also has many advantages, such as saving the space of the mechanism configuration and improving the heat dissipation effect.

The heat dissipation device according to the embodiment of the present invention will be described below. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific method, and are not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary artisans to whom this disclosure belongs. It is understandable that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be in an idealized or overly formal manner. Interpreted, unless specifically defined here.

The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front, or rear, are only directions referring to the attached drawings. Therefore, the directional terms used in the embodiments are used to explain and not to limit the present invention.

Please refer to FIG. 3 and FIG. 4 together. FIG. 3 shows a schematic diagram of a notebook computer C provided above the heat sink 1 according to an embodiment of the present invention, and FIG. 4 shows a schematic diagram of the heat sink in FIG. As shown in Figs. 3 and 4, the heat dissipation device 1 of this embodiment is a cooling pad of an electronic device, which can be used to carry portable electronic devices such as a notebook computer or a tablet computer. For cooling.

It can be seen from FIG. 3 that when the heat sink 1 is in an operating state, at least one fan 20 located inside the heat sink 1 can be exposed on the top side of the heat sink 1 through the opening 101 of the casing 10. Then, the heat generated in the notebook computer C can be quickly discharged through the fan 20.

It should be particularly noted that, at least one proximity sensor S (proximity sensor) is provided on the top side of the heat sink 1, such as a passive infrared sensor (PIR) or an ultrasonic sensor (ultrasonic sensor) is used to detect whether an object above the heat sink 1 approaches.

For example, when the user places the notebook computer C on the heat dissipation device 1, the proximity sensor S will sense that the notebook computer C is close to the heat dissipation device 1. At this time, the circuit can be used to control the At least one cover plate 30 (shown in FIG. 4) covering the opening 101 is opened, so that the fan 20 can dissipate heat from the notebook computer C.

On the other hand, when the user removes the notebook computer C from above the heat sink 1 without using the notebook computer C, the proximity sensor S does not detect an object approaching the heat sink 1, so it can be controlled through the circuit. The cover 30 is closed to cover at least a part of the opening 101 to prevent the user from accidentally touching the fan 20 and being injured. At the same time, it can also prevent foreign objects from entering the heat sink 1 through the opening 101 and causing damage to its internal parts.

Please refer to FIGS. 4 and 5 together, where FIG. 5 shows an exploded view of the heat dissipation device 1 in FIG. 4. As shown in FIGS. 4 and 5, the casing 10 of the heat sink 1 is mainly composed of a top case 11 and a bottom case 12, wherein the cover plate 30 and the proximity sensor S are disposed on the top case 11. The fan 20 is fixed on the bottom case 12.

Please also refer to FIGS. 6 to 7 together, where FIG. 6 shows another exploded view of the heat dissipation device 1 in FIG. 4, and FIG. 7 shows that the top case 10 is provided with a cover plate 30, a proximity sensor S, Schematic diagram of the drive unit and pulley mechanism.

As shown in FIG. 6, a plurality of through holes 121 are formed on the lower surface of the aforementioned bottom case 12, and their positions correspond to the fans 20 provided inside the bottom case 12; in addition, as can be seen from FIGS. 6 to 7 There are two movable cover plates 30 on the inner surface of the top case 11, wherein the cover plate 30 is movably connected to the top case 11 through a pulley mechanism, and the cover plate 30 is also connected to the top case 11 through an elastic element 60. When the plate 30 is in a closed position without being affected by external forces (FIGS. 6 to 7), the two cover plates 30 abut against each other and cover the aforementioned opening 101 due to the elastic force of the elastic element 60.

For example, the aforementioned elastic element 60 may be an extension spring or a torsion spring.

As can be seen from FIGS. 6 to 7, the heat sink 1 of this embodiment is provided with four pulley mechanisms. Each of the pulley mechanisms includes a pull rope 40, a movable pulley 41 that can slide relative to the top case 11, and is fixed on the top. Definite pulley 43 on the shell 11. One end portion 401 of the aforementioned pull rope 40 is connected to the top shell 11, and the other end portion 402 is connected to the cover plate 30, and the pull rope 40 bypasses the movable pulley 41 and the fixed pulley 43 in order to present an S-shaped structure; it should be understood that The two sides of each of the cover plates 30 can be driven to move outward relative to the top case 11 by a pulley mechanism respectively, so that the fan 20 can be exposed at the opening 101 to efficiently dissipate the notebook computer C. .

Please continue to refer to FIGS. 6 to 7. In the heat dissipating device 1 of this embodiment, four driving units are provided, corresponding to the aforementioned pulley mechanism. Each of the driving units includes a circuit board 50 and is electrically connected to the circuit board 50. One drive element 42. For example, the driving element 42 may be made of a shape memory alloy (SMA) material, which is used to connect the circuit board 50 and the movable pulley 41 in the pulley mechanism.

Because the driving element 42 is made of Shape Memory Alloys (SMA), when the proximity sensor S detects that the notebook computer C is close to the heat sink 1, it can be transmitted through the control circuit (not shown). The electrical signal is connected to the circuit board 50 electrically connected to it, and then the circuit board 50 can provide current to each driving element 42 to change its length according to the foregoing electrical signal (for example, the driving element 42 can be contracted), and the driving element 42 will then A force is applied to the pulley mechanism to drive the cover plate 30 to be displaced relative to the top case 11 through the pulley mechanism, and the fan 20 is exposed at the aforementioned opening 101.

Please refer to FIGS. 8, 9 and 10 together. FIG. 8 shows a schematic diagram when the driving element 42 is contracted and the pulley mechanism is driven to move the cover plate 30 to the open position relative to the top case 11, and FIG. 9 shows the driving element 42. Another schematic diagram when the pulley mechanism drives the cover plate 30 to move to the open position relative to the top case 11 after being retracted, and FIG. 10 shows a perspective view of the heat sink 1 when the cover plate 30 is moved to the open position relative to the top case 11.

As mentioned above, when the user places the notebook computer C on the heat sink 1, the proximity sensor S will detect that the notebook computer C is close to the heat sink 1 and will send electrical signals to the various circuit boards 50. At this time, the aforementioned circuit board 50 will provide current to each driving element 42 to shrink it (as shown in FIG. 9), so that the two cover plates 30 can be driven upward and downward relative to the top case 11 through the pulley mechanism. Displace to the open position, so that the fan 20 can be exposed at the aforementioned opening 101.

It should be particularly noted that, in order to improve the stability of the above-mentioned pulley mechanism during operation, four guide rails R (as shown in FIG. 9) are provided on the inner surface of the top case 11 in this embodiment for guiding each The movable pulley 41 slides inside.

Since the present embodiment presents an S-shaped structure by sequentially pulling the pull rope 40 around the movable pulley 41 and the fixed pulley 43, the displacement amount of the cover plate 30 may be twice or more than the contracted length of the driving element 42, Therefore, it can take into account many advantages such as safety in use, saving space for mechanism configuration, and improving heat dissipation effects.

In addition, in an embodiment, the aforementioned driving element 42 can also be replaced by a motor and a reel mechanism, wherein the circuit board 50 can provide current to the aforementioned motor, and the coil winding mechanism can be driven by the motor to drive the pulley mechanism to drive the two Each cover plate 30 is displaced upward and downward relative to the top case 11 to an open position, so that the fan 20 can be exposed at the aforementioned opening 101 to improve heat dissipation efficiency.

Alternatively, in one embodiment, only a single-piece cover plate 30 may be used with a corresponding drive unit, a pulley mechanism, and an elastic element, and a guide rail R may be provided on the top case 11 to guide the pulley mechanism. The movable pulley 41 in the center is displaced relative to the top case 11 so that the cover plate 30 can be switched between the aforementioned closed position and the open position, so that the heat dissipation device 1 can be used to expose the fan 20 to the opening 101 when not in use The purpose of covering the opening 101 is sometimes covered by the cover plate 30.

Although the embodiments of the present invention and its advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the technical field can make changes, substitutions and decorations without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the description. Any person with ordinary knowledge in the technical field may disclose the content from the present invention. To understand the current or future development of processes, machines, manufacturing, material composition, devices, methods and steps, as long as they can implement substantially the same functions or achieve approximately the same results in the embodiments described herein, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufacturing, material composition, devices, methods, and steps. In addition, each patent application scope constitutes a separate embodiment, and the protection scope of the present invention also includes a combination of each patent application scope and embodiment.

Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

1‧‧‧Cooling device

10‧‧‧shell

101‧‧‧ opening

11‧‧‧ top shell

12‧‧‧ bottom case

121‧‧‧through hole

20‧‧‧fan

30‧‧‧ Cover

40‧‧‧Drawstring

401‧‧‧ end

402‧‧‧End

41‧‧‧moving pulley

42‧‧‧Drive element

43‧‧‧ fixed pulley

50‧‧‧Circuit Board

60‧‧‧Elastic element

C‧‧‧ Notebook

F‧‧‧Fan

G‧‧‧ Grid Structure

H‧‧‧ opening

P1‧‧‧Notebook Cooling Pad

P2‧‧‧Notebook Cooling Pad

R‧‧‧rail

S‧‧‧ Proximity Sensor

Figure 1 shows a schematic diagram of a common notebook computer cooling pad P1. Figure 2 shows a schematic diagram of another common notebook computer thermal pad P2. FIG. 3 is a schematic diagram of a notebook computer C disposed above the heat sink 1 according to an embodiment of the present invention. FIG. 4 is a schematic diagram of the heat dissipation device 1 in FIG. 3. FIG. 5 shows an exploded view of the heat sink 1 in FIG. 4. FIG. 6 shows another exploded view of the heat sink 1 in FIG. 4. FIG. 7 is a schematic diagram of a cover 30, a proximity sensor S, a driving unit, and a pulley mechanism provided on the top case 10. FIG. 8 shows a schematic diagram when the driving element 42 is contracted and the pulley mechanism is driven to move the cover plate 30 to the open position relative to the top case 11. FIG. 9 shows another schematic diagram when the driving element 42 is contracted and the pulley mechanism is driven to move the cover plate 30 to the open position relative to the top case 11. FIG. 10 shows a perspective view of the heat sink 1 when the cover plate 30 is moved to the open position relative to the top case 11.

Claims (10)

A heat dissipation device includes: a casing formed with an opening; a fan disposed in the casing and corresponding to the opening; a cover plate movably disposed on the casing, wherein when the cover plate is opposite to the casing When the housing is in a closed position, the cover covers at least a part of the opening; a pulley mechanism connected to the cover and the housing; and a drive unit provided on the housing and connected to the pulley mechanism, wherein The driving unit applies a force to the pulley mechanism, and drives the cover plate from the closed position to an open position relative to the housing through the pulley mechanism, so that the fan is exposed to the heat sink through the opening. One side. The heat dissipation device according to item 1 of the patent application scope, wherein the heat dissipation device further comprises an elastic element connected to the cover plate and the casing. The heat dissipation device according to item 1 or 2 of the scope of patent application, wherein the driving unit has a circuit board and a driving element, wherein the driving element is connected to the circuit board and the pulley mechanism, and the circuit board provides a current to the A driving element to drive the pulley mechanism to drive the plate to displace the cover relative to the casing. The heat dissipation device according to item 3 of the patent application scope, wherein the driving element is made of a shape memory alloy material. The heat dissipation device according to item 3 of the scope of patent application, wherein the heat dissipation device further includes a proximity sensor, which is disposed on the casing and is electrically connected to the circuit board. The heat dissipation device according to item 5 of the application, wherein the proximity sensor and the opening are located on the same side of the casing. The heat dissipation device according to item 3 of the scope of patent application, wherein the pulley mechanism has a movable pulley and a draw rope, the draw rope bypasses the movable pulley and connects the cover plate and the housing, and the driving element is connected to the circuit board And the moving pulley. The heat dissipation device according to item 7 of the scope of patent application, wherein the pulley mechanism further has a certain pulley, the fixed pulley is fixed on the housing, and the pull rope passes around the movable pulley and the fixed pulley and forms an S-shaped structure . The heat dissipation device according to item 7 of the scope of the patent application, wherein the heat dissipation device further includes a guide rail disposed on the casing for guiding the movable pulley to move relative to the casing. The heat dissipation device according to item 1 of the scope of patent application, wherein the heat dissipation device further includes two cover plates, two pulley mechanisms, and two driving units, wherein the driving units are disposed on the housing and connected to the pulleys, respectively. Mechanism, and the driving units respectively apply the acting force to the pulley mechanisms, and respectively drive the cover plates to be displaced relative to the casing through the pulley mechanisms.