TWI678769B - A transparent substrate having positioning structure and assembly method of the same - Google Patents

Abstract

The invention provides a transparent substrate with a positioning structure and an assembly method thereof. The transparent substrate of the invention has at least two positioning structures, and the two positioning structures of the transparent substrate are assembled in at least two positioning portions of a casing of an electronic device, so that the transparent substrate Assembled in the case. When the transparent substrate of the present invention is assembled in a casing of an electronic device, the gap between the transparent substrate and the casing does not need to be adjusted visually by a person, and the gap between the transparent substrate and the casing is made uniform, thereby reducing assembly time.

Description

Transparent substrate with positioning structure and assembling method thereof

The invention relates to a transparent substrate and a method for assembling the same, and particularly to a method for assembling a transparent substrate with a positioning structure and a positioning structure on a transparent substrate.

Electronic devices with displays, such as smart phones, touch pads, notebook computers, LCD screens, LCD TVs, etc., usually have a transparent substrate between a housing of an electronic device and a display in the electronic device For example: glass, transparent substrate is located in front of the display, so as to avoid users from scratching or damaging the display by directly touching the display during use.

At present, in the process of assembling an electronic device, a transparent substrate is usually assembled in a casing of the electronic device, and then a display is assembled in the casing. The method of assembling the transparent substrate to the casing is to first place the transparent substrate on the casing, and then the assembler visually adjusts the gap between the transparent substrate and the casing, which easily makes the gap between the transparent substrate and the casing uneven, so the assembly It takes a lot of time to adjust the gap between the transparent substrate and the case. After the assembler adjusts the gap between the transparent substrate and the case, he must suck the transparent substrate up and away from the case, and then remove the adhesive from the case. The paper is torn off, and then the transparent substrate is moved down to the case, and the transparent substrate is adhered to the case. However, the transparent substrate is easily displaced during the upward and downward movement, and the original transparent substrate and the The uniform gap between the shells becomes an uneven gap.

In view of the above problems, the present invention provides a transparent substrate with a positioning structure and an assembling method thereof. When the transparent substrate of the present invention is assembled in a casing of an electronic device, an assembler does not need to adjust the gap between the transparent substrate and the casing visually. The gap between the transparent substrate and the casing can be less than 0.2 mm, which shortens the time for assembling the transparent substrate to the casing.

The object of the present invention is to provide a transparent substrate with a positioning structure and an assembly method thereof. The transparent substrate is provided with at least two positioning structures. When the transparent substrate is assembled in a casing of an electronic device, the two positioning structures of the transparent substrate are provided. It is directly assembled to at least two positioning parts of the casing. When the transparent substrate is assembled in the casing, the gap between the transparent substrate and the casing does not need to be adjusted visually by a person, which effectively solves the problem of uneven gaps between the transparent substrate and the casing. Furthermore, the time for assembling the transparent substrate in the casing can be reduced to achieve easy assembly.

In order to achieve the aforementioned purposes and effects, the present invention discloses a transparent substrate having a positioning structure, which includes: a transparent substrate having a first surface and a second surface, the first surface and the second surface Corresponding to the surface; and at least two positioning structures disposed on the first surface of the transparent substrate; wherein the transparent substrate is assembled in a casing of an electronic device, and each positioning structure is disposed in a positioning portion of the casing .

The invention discloses a method for assembling a transparent substrate with a positioning structure, comprising: providing a transparent substrate, the transparent substrate having a first surface and a second surface, the first surface corresponding to the second surface; setting at least A reference position on the transparent substrate; setting at least one setting position on the first surface of the transparent substrate, and calculating a position parameter between the setting position and the reference position; and providing at least one positioning structure, and according to the position parameter The positioning structure is moved to the setting position, and the positioning structure is set at the setting position.

10‧‧‧ transparent substrate

101‧‧‧first surface

1011 ‧ ‧ corner

102‧‧‧Second surface

103‧‧‧Edge

11‧‧‧ Positioning Structure

111a‧‧‧The first positioning member

111b‧‧‧Second positioning member

111c‧‧‧ Right Angle Post

1111‧‧‧Groove

11a‧‧‧First positioning structure

11b‧‧‧Second positioning structure

2‧‧‧ electronic device

21‧‧‧shell

211‧‧‧ surface

22‧‧‧Positioning Department

M1‧‧‧Marker

M2‧‧‧ intersection

M3‧‧‧center

M4‧‧‧ Midpoint

M5‧‧‧First reference position

M6‧‧‧Second reference position

P1‧‧‧Setting position

FIG. 1 is a schematic diagram of a transparent substrate according to a first embodiment of the present invention;

FIG. 2 is a side view of a transparent substrate according to the first embodiment of the present invention;

The third A to three B diagrams: FIG. 3 is a state diagram of a transparent substrate in use according to the first embodiment of the present invention;

The fourth figure: a partial enlarged view of the area A of the first figure of the present invention;

FIG. 5A is a schematic diagram of a positioning structure according to a second embodiment of the present invention;

Fifth B: It is a schematic diagram of the positioning structure of the third embodiment of the present invention;

FIG. 6 is a schematic diagram of a positioning structure of a fourth embodiment of the present invention;

FIG. 7 is a flowchart of assembling a positioning structure on a transparent substrate according to a fifth embodiment of the present invention;

Figures 8A to 8D are flowcharts of steps for assembling a positioning structure on a transparent substrate according to a fifth embodiment of the present invention;

FIG. 9A is a schematic diagram of a reference position of a sixth embodiment of the present invention;

FIG. 9B is a schematic diagram of a reference position according to a seventh embodiment of the present invention;

FIG. 9C is a schematic diagram of a reference position of an eighth embodiment of the present invention; and

Tenth figure: It is a schematic diagram of a plurality of reference positions according to the ninth embodiment of the present invention.

In order to make the reviewing committee members have a better understanding and understanding of the features of the present invention and the effects achieved, I would like to provide detailed descriptions of each embodiment and cooperation, as follows:

It is known that when a transparent substrate is to be assembled in a casing of an electronic device, the assembler visually adjusts the gap between the transparent substrate and the casing, but it is easy to make the gap between the transparent substrate and the casing uneven, and the assembler needs to re-install Adjusting the position of the transparent substrate requires more assembly time. In view of the above problems, the present invention provides a transparent substrate with a positioning structure. The transparent substrate is directly assembled to at least two positioning portions of a housing of an electronic device using at least two positioning structures, which not only achieves easy assembly, but also eliminates the need for an assembler during the assembly process. The gap between the transparent substrate and the casing can be adjusted visually to make the gap between the transparent substrate and the casing uniform (both less than 0.2 mm), effectively avoiding wasting too much time on assembly.

Please refer to the first diagram and the second diagram, which are schematic diagrams and side views of a transparent substrate according to a first embodiment of the present invention. As shown in the figure, a transparent substrate 10 is provided in this embodiment, and the transparent substrate 10 has a first surface. 101 and a second surface 102 corresponding to the first surface 101. However, the two positioning structures 11 are disposed on the first surface 101, and the two positioning structures 11 are respectively located at the corners 1011 corresponding to the first surface 101. The number of the positioning structures 11 is at least two or more. Therefore, the positioning structures 11 may be three, four, or more, and details are not described herein again.

Please refer to FIG. 3A and FIG. 3B together, which are diagrams of the use state of the transparent substrate according to the first embodiment of the present invention. As shown in the figure, when the transparent substrate 10 is to be assembled in a case of an electronic device 2 In the case of the body 21, the first surface 101 of the transparent substrate 10 having the two positioning structures 11 faces the surface 211 of the casing 21 having the two positioning portions 22, the two positioning structures 11 are aligned with the two positioning portions 22, and the two positioning structures 11 are assembled At the two positioning portions 22, a pressing machine (not shown) can be used to press the transparent substrate 10 and the casing 21, so that the transparent substrate 10 and the casing 21 are more closely attached. In the process of assembling the transparent substrate 10 in this embodiment, the assembler does not need to adjust the gap between the transparent substrate 10 and the casing 21 visually. After the transparent substrate 10 is assembled in the casing 21, the transparent substrate 10 and the casing are assembled. The gaps between the bodies 21 are uniform, effectively reducing assembly time.

The width of the gap between the transparent substrate 10 and the casing 21 in this embodiment can be less than 0.2 mm. It is mainly used to simulate the assembly of the transparent substrate 10 in the casing by using a computer device before the two positioning structures 11 and the two positioning portions 22 are provided. The body 21 is set in a state where the clearance between the transparent substrate 10 and the casing 21 is less than 0.2 mm, the position where the two positioning structures 11 are disposed on the transparent substrate 10 and the position where the two positioning portions 22 are disposed on the casing 21. Therefore, when the two positioning structures 11 and the two positioning portions 22 are respectively provided on the transparent substrate 10 and the housing 21 according to the above settings, the two positioning structures 11 provided on the transparent substrate 10 are assembled on the two positioning portions 22 provided on the housing 21, That is, the gaps between the transparent substrate 10 and the casing 21 can all be less than 0.2 mm, and there is no need to adjust visually through personnel.

Please refer to the fourth figure together, which is a partial enlarged view of the area A in the first figure of the present invention. As shown in the figure, the positioning structure 11 of this embodiment is composed of a first positioning member 111a and a second positioning member. 111b structure, the second positioning member 111b is stacked above the first positioning member 111a, the center of the second positioning member 111b corresponds to the center of the first positioning member 111a, and the width of the second positioning member 111b is smaller than the width of the first positioning member 111a In this way, the positioning structure 11 is stepped. However, the first positioning member 111a and the second positioning member 111b in this embodiment are both cylindrical. Of course, the first positioning member 111a and the second positioning member 111b in this embodiment may also be positive-angle columns (the bottom surface of the positive-angle columns is a regular polygon), and details are not described herein again. Please refer to FIGS. 5A and 5B together, which are schematic diagrams of the positioning structure of the second embodiment and the third embodiment of the present invention; as shown in the figure, the second of the positioning structure 11 of the first embodiment The positioning member 111b can also be replaced with a positive-angle post 111c (as shown in Figure 5A). Of course, the first positioning member 111a can also be replaced with a positive-angle post, and the second positioning member 111b remains unchanged. Even the positioning structure 11 only needs to be provided with the first positioning member 111a as shown in FIG. 5B. The positioning member of the positioning structure 11 of this embodiment uses a cylinder or a right angle post, which is mainly because the center position of the column or the right angle post is easy to calculate, so as to be disposed on the transparent substrate 10 in the future.

However, the positioning structure 11 of this embodiment protrudes from the first surface 101 of the transparent substrate 10, so the positioning portion 22 corresponding to the positioning structure 11 has a groove or a hole, and the shape of the positioning portion 22 and the shape of the positioning structure 11 are mutually Correspondingly, if the positioning structure 11 is a cylinder, the shape of the positioning portion 22 is circular; if the positioning structure 11 is a right-angled column, the shape of the positioning portion 22 is a regular polygon. Of course, the positioning structure 11 may also have a groove. As shown in the sixth figure, the center of the second positioning member 111b of the positioning structure 11 has a groove 1111, but the corresponding positioning portion 22 may be protruded from the surface 211 of the housing 21. Then, the positioning structure 11 is assembled to the positioning portion 22.

Please refer to FIG. 7 and FIGS. 8A to 8D, which are flowcharts and steps of assembling a positioning structure on a transparent substrate according to a fifth embodiment of the present invention. As shown in the figure, this embodiment discloses the positioning structure 11 The method for assembling on the transparent substrate 10 first performs step S10 to provide a transparent substrate 10, which is placed on an equipment machine (which can be a equipment machine with positioning function on the production line), and the equipment machine positions the transparent substrate 10, and using an optical positioning device to detect the edge of the transparent substrate 10 to generate positioning information, and transmitting the positioning information to a controller, the controller calculates the size and shape of the transparent substrate 10 according to the positioning information.

Next, step S11 is performed. As shown in FIG. 8A, a reference position is set on the transparent substrate 10. The reference position in this embodiment is a mark point M1 (such as a glass substrate Mark point, which is a mark existing on the transparent substrate 10 when it leaves the factory). Then, the optical positioning device of the equipment machine optically recognizes the mark point M1 of the transparent substrate 10 in this embodiment to generate an identification signal, and transmits the identification signal to the controller, and the controller calculates the coordinates of the mark point M1 according to the identification signal.

Next, step S12 is performed. As shown in FIG. 8B, a positioning position P1 to be positioned on the first surface 101 of the transparent substrate 10 by the positioning structure 11 is set in the controller, and the interval between the setting position P1 and the marking point M1 is calculated. The relative relationship is used to generate a position parameter. The position parameter includes at least the horizontal distance, vertical distance, linear distance, and angle of the setting position P1 relative to the mark point M1. In the above embodiment, it is described that the setting position P1 is set in a state where the gap between the transparent substrate 10 and the case 21 is less than 0.2 mm, and details are not described herein again. Then step S13 is performed. A suction nozzle of a robotic arm of the equipment machine sucks the positioning structure 11, and the optical positioning device detects the edge of the positioning structure 11 to calculate the center position of the positioning structure 11. The above embodiments have also disclosed that the positioning structure 11 is a cylinder, a right-angle column, or the above-mentioned composition, so it is easy to calculate the center position of the positioning structure 11, which is not repeated here.

Then step S14 is performed. As shown in FIG. 8C, the controller controls the movement of the robot arm according to the position parameter, so that the positioning structure 11 attracted to the suction nozzle is moved from the mark point M1 to the setting position P1, so that the center position of the positioning structure 11 corresponds. The setting position P1 is set, and the positioning structure 11 is set at the setting position P1, so that the positioning structure 11 is set on the first surface 101 of the transparent substrate 10 (as shown in FIG. 8D). Of course, the positioning structure 11 in this embodiment can also be directly moved to the setting position P1, and it is not necessary to move from the reference position (marking point M1) to the setting position P1. The method for assembling a single positioning structure 11 on the transparent substrate 10 is described above. If more positioning structures 11 are to be provided, the steps S12 to S14 are repeated. After all the positioning structures 11 are disposed on the transparent substrate 10, the positioning structures 11 are disposed on the transparent substrate 10. The corresponding positioning portion 22 assembles the transparent substrate 10 to the case 21.

The reference position of the above embodiment is the mark point M1 on the first surface 101 of the transparent substrate 10, which can be directly identified by the optical positioning device, and the reference position can also be calculated by detecting the edge 103 of the transparent substrate 10 by the optical positioning device. Location, such as the intersection M2 of the two adjacent edges 103 of the transparent substrate 10 (as shown in FIG. 9A), or the center point M3 of the transparent substrate 10 (as shown in FIG. 9B), or any edge 103 of the transparent substrate 10 The midpoint M4 (as in the ninth figure C); of course, the reference position can also be any point on the first surface 101 of the transparent substrate 10, as long as a mark can be identified by the optical positioning device at any point, it can be used as a reference position. Of course, the optical positioning device is only an embodiment, and it can be replaced with other non-optical positioning devices, and the function of calculating the coordinates of the reference position is sufficient, and details are not described herein again.

Please refer to FIG. 10, which is a schematic diagram of multiple reference positions according to the ninth embodiment of the present invention. As shown in the figure, the above embodiment only sets a single reference position on the transparent substrate 10. Of course, multiple reference positions can also be set Each positioning structure corresponds to one of a plurality of reference positions, for example, a first reference position M5 and a second reference position M6 are set on the transparent substrate 10, and a first positioning structure 11a and a second positioning structure are to be set. 11b is on the transparent substrate 10, the first positioning structure 11a is based on the first reference position M5, the second positioning structure 11b is based on the second reference position M6, and then steps S12 to S14 are performed to complete the first positioning structure 11a and the first The two positioning structures 11 b are assembled on the transparent substrate 10.

In summary, the present invention provides a transparent substrate having a positioning structure and an assembling method thereof. The transparent substrate has at least two positioning structures, and is assembled to at least two positioning portions of the housing through the two positioning structures, thereby assembling the transparent substrate to the shell. Physically, the assembling method is quite simple and shortens the time for assembling the transparent substrate to the casing. In addition, during the process of assembling the transparent substrate in the case, the assembler does not need to adjust the gap between the transparent substrate and the case visually, and the problem of uneven gap between the transparent substrate and the case does not occur due to the visual judgment of the assembler. To avoid more assembly time due to problems caused by the visual judgment of the assembler.

However, the above are only embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. For example, all changes and modifications that are equal in shape, structure, characteristics, and spirit described in the scope of the patent application for the present invention, All should be included in the patent application scope of the present invention.

The invention is truly a novel, progressive, and industrially available user, which should meet the patent application requirements stipulated by the Chinese Patent Law. No doubt, the invention patent application was submitted in accordance with the law. prayer.

Claims (17)

A transparent substrate having a positioning structure includes: a transparent substrate having a first surface and a second surface, the first surface corresponding to the second surface; and at least two positioning structures provided on the transparent substrate The first surface of the substrate; wherein the transparent substrate is assembled in a housing of an electronic device, a positioning portion is provided with a groove or a hole, the positioning structure protrudes from the first surface of the transparent substrate, and each positioning The structure is arranged on the positioning portion of the casing. The transparent substrate with a positioning structure according to item 1 of the scope of the patent application, wherein the positioning structure is a positioning member, and the positioning member is a cylinder or a right-angled column. The transparent substrate with a positioning structure according to item 1 of the scope of patent application, wherein the positioning structure includes two positioning members, the two positioning members are stacked on each other, the centers of each positioning member correspond to each other, and the width of the positioning member located above Less than the width of the positioning member located below. The transparent substrate with a positioning structure as described in item 3 of the scope of the patent application, wherein each positioning member is a cylinder or a right angle pillar. According to the transparent substrate with a positioning structure described in item 3 of the scope of the patent application, one of the two positioning members is a cylinder, and the other is a right angle column. A method for assembling a transparent substrate with a positioning structure includes: providing a transparent substrate having a first surface and a second surface, the first surface corresponding to the second surface; setting at least a reference position On the transparent substrate; setting at least one setting position on the first surface of the transparent substrate, and calculating a position parameter between the setting position and the reference position; and providing at least one positioning structure, and enabling the positioning parameter according to the position parameter The positioning structure is moved to the setting position, and the positioning structure is set at the setting position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the position parameter is a horizontal distance, a vertical distance, a linear distance, and an angle of the setting position relative to the reference position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the reference position is a mark of the transparent substrate. According to the method for assembling a transparent substrate with a positioning structure as described in item 8 of the scope of the patent application, the step of setting the reference position is to use an optical positioning device to optically identify the marked point and calculate the coordinates of the reference position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the reference position is an arbitrary point on the first surface of the transparent substrate, and a mark is marked on the arbitrary point. The method for assembling a transparent substrate with a positioning structure as described in item 10 of the scope of the patent application, wherein the step of setting the reference position uses an optical positioning device to optically identify the mark and calculate the coordinates of the reference position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the reference position is an intersection of two adjacent edges of the transparent substrate. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the reference position is a midpoint of any edge of the transparent substrate. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the reference position is a center point of the transparent substrate. The method for assembling a transparent substrate with a positioning structure according to item 12, 13, or 14 of the scope of patent application, wherein the step of positioning the reference position is to optically identify the edge of the transparent substrate with an optical positioning device, and calculate the reference The coordinates of the position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of patent application, wherein the step of providing at least one positioning structure includes: detecting an edge of the positioning structure, and calculating a center of the positioning structure so that The center of the positioning structure is set at the setting position. The method for assembling a transparent substrate with a positioning structure as described in item 6 of the scope of the patent application, wherein the step of moving the positioning structure to the setting position according to the position parameter further includes: causing the positioning structure to change from the position parameter The reference position moves to the setting position.