TWI677596B - Membrane electrode assembly and method for hydrogen evolution by electrolysis - Google Patents

Membrane electrode assembly and method for hydrogen evolution by electrolysis Download PDF

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TWI677596B
TWI677596B TW107142989A TW107142989A TWI677596B TW I677596 B TWI677596 B TW I677596B TW 107142989 A TW107142989 A TW 107142989A TW 107142989 A TW107142989 A TW 107142989A TW I677596 B TWI677596 B TW I677596B
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catalyst
gas
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liquid diffusion
diffusion layer
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TW202022161A (en
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林國興
Kuo Hsin Lin
蔡麗端
Li Duan Tsai
林有銘
Yu Ming Lin
趙文軒
Wen Hsuan Chao
黃秋萍
Chiu Ping Huang
楊秉興
Pin Hsin Yang
黃筱君
Hsiao Chun Huang
林俊男
Jiunn Nan Lin
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財團法人工業技術研究院
Industrial Technology Research Institute
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
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    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
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    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/075Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/36Hydrogen production from non-carbon containing sources, e.g. by water electrolysis

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Abstract

膜電極組包括:陽極,包括第一觸媒層於第一氣液擴散層上;陰極,包括第二觸媒層於第二氣液擴散層上;以及陰離子交換膜,夾設於陽極的第一觸媒層與陰極的第二觸媒層之間,其中第一觸媒層的化學結構為M’aM”bN2或M’cM”dCe,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,M”為Nb、Ta、或上述之組合,0.7

Figure TWI677596B_A0001
a
Figure TWI677596B_A0002
1.7,0.3
Figure TWI677596B_A0003
b
Figure TWI677596B_A0004
1.3,a+b=2,0.24
Figure TWI677596B_A0005
c
Figure TWI677596B_A0006
1.7,0.3
Figure TWI677596B_A0007
d
Figure TWI677596B_A0008
1.76,且0.38
Figure TWI677596B_A0009
e
Figure TWI677596B_A0010
3.61,其中M’aM”bN2為立方晶系,且M’cM”dCe為立方晶系或非晶。 The membrane electrode group includes: an anode including a first catalyst layer on a first gas-liquid diffusion layer; a cathode including a second catalyst layer on a second gas-liquid diffusion layer; and an anion exchange membrane sandwiched between the first Between a catalyst layer and the second catalyst layer of the cathode, the chemical structure of the first catalyst layer is M ' a M ” b N 2 or M ′ c M” d C e , where M ′ is Ni, Co , Fe, Mn, Cr, V, Ti, Cu, or Zn, M "is Nb, Ta, or a combination thereof, 0.7
Figure TWI677596B_A0001
a
Figure TWI677596B_A0002
1.7, 0.3
Figure TWI677596B_A0003
b
Figure TWI677596B_A0004
1.3, a + b = 2, 0.24
Figure TWI677596B_A0005
c
Figure TWI677596B_A0006
1.7, 0.3
Figure TWI677596B_A0007
d
Figure TWI677596B_A0008
1.76 and 0.38
Figure TWI677596B_A0009
e
Figure TWI677596B_A0010
3.61, wherein M 'a M "b N 2 is a cubic system, and M' c M" d C e is a cubic system or amorphous.

Description

膜電極組與電解產氫的方法 Membrane electrode group and method for electrolytic hydrogen production

本揭露關於膜電極組,以及採用膜電極組電解產氫的方法。 The present disclosure relates to a membrane electrode group and a method for electrolytically producing hydrogen using the membrane electrode group.

在能源短缺的現今,尋求替代能源勢在必行,而氫能為最佳的替代能源。由於環境保護的觀念,使用氫氣做為燃料符合環保期待,電解水是製造氫氣與氧氣的最簡單方式。儘管利用電解水產氫具有相當多的優點,但是在大量產氫的過程卻具有致命的缺點,即耗費相當多的能量導致不符成本。能量消耗多與過電位過大有關,而過電位與電極、電解液、及反應生成物有關。為提升電解水效率,電極扮演重要角色。降低活化能及增加反應的界面為電解水效率的重要因素。活化能降低是受電極表面催化的影響,其取決於電極材料本身催化特性。雖然貴金屬IrO2一直是最具催化效果的電極材料之一,但其價格相當昂貴。為減低成本,必須採用其他材料取代IrO2In today's energy shortage, it is imperative to seek alternative energy sources, and hydrogen is the best alternative energy source. Due to the concept of environmental protection, using hydrogen as a fuel meets environmental protection expectations. Electrolyzed water is the easiest way to produce hydrogen and oxygen. Although the use of electrolyzed water to produce hydrogen has considerable advantages, it has a fatal disadvantage in the process of producing large amounts of hydrogen, that is, it consumes a considerable amount of energy to cause cost inconsistencies. Energy consumption is mostly related to excessive overpotential, which is related to electrodes, electrolyte, and reaction products. To improve the efficiency of electrolyzed water, electrodes play an important role. Decreasing the activation energy and increasing the reaction interface are important factors for the efficiency of electrolyzed water. The decrease in activation energy is affected by the catalysis of the electrode surface, which depends on the catalytic properties of the electrode material itself. Although the noble metal IrO 2 has been one of the most catalytically effective electrode materials, it is quite expensive. To reduce costs, IrO 2 must be replaced with other materials.

綜上所述,目前需要新的觸媒組成進一步提升產氫反應(HER)與產氧反應(OER)的活性,以兼顧觸媒活性與降低成本的目的。 In summary, a new catalyst composition is currently needed to further increase the activity of the hydrogen-producing reaction (HER) and the oxygen-producing reaction (OER) in order to take into account the catalyst activity and the purpose of reducing costs.

本揭露一實施例提供之膜電極組,包括:陽極,包括第一觸媒層於第一氣液擴散層上;陰極,包括第二觸媒層於第二氣液擴散層上;以及陰離子交換膜,夾設於陽極的第一觸媒層與陰極的第二觸媒層之間,其中第一觸媒層的化學結構為M’aM”bN2或M’cM”dCe,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,M”為Nb、Ta、或上述之組合,0.7

Figure TWI677596B_D0001
a
Figure TWI677596B_D0002
1.7,0.3
Figure TWI677596B_D0003
b
Figure TWI677596B_D0004
1.3,a+b=2,0.24
Figure TWI677596B_D0005
c
Figure TWI677596B_D0006
1.7,0.3
Figure TWI677596B_D0007
d
Figure TWI677596B_D0008
1.76,且0.38
Figure TWI677596B_D0009
e
Figure TWI677596B_D0010
3.61,其中M’aM”bN2為立方晶系,且M’cM”dCe為立方晶系或非晶。 The disclosed membrane electrode group includes an anode including a first catalyst layer on a first gas-liquid diffusion layer; a cathode including a second catalyst layer on a second gas-liquid diffusion layer; and anion exchange Membrane, sandwiched between the first catalyst layer of the anode and the second catalyst layer of the cathode, wherein the chemical structure of the first catalyst layer is M ' a M " b N 2 or M' c M" d C e , Where M 'is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M "is Nb, Ta, or a combination thereof, 0.7
Figure TWI677596B_D0001
a
Figure TWI677596B_D0002
1.7, 0.3
Figure TWI677596B_D0003
b
Figure TWI677596B_D0004
1.3, a + b = 2, 0.24
Figure TWI677596B_D0005
c
Figure TWI677596B_D0006
1.7, 0.3
Figure TWI677596B_D0007
d
Figure TWI677596B_D0008
1.76 and 0.38
Figure TWI677596B_D0009
e
Figure TWI677596B_D0010
3.61, wherein M 'a M "b N 2 is a cubic system, and M' c M" d C e is a cubic system or amorphous.

在一些實施例中,上述膜電極組係浸置於鹼性水溶液中。 In some embodiments, the membrane electrode assembly is immersed in an alkaline aqueous solution.

在一些實施例中,第一觸媒層的化學結構為NiaNbbN2,0.7

Figure TWI677596B_D0011
a
Figure TWI677596B_D0012
1.51,且0.49
Figure TWI677596B_D0013
b
Figure TWI677596B_D0014
1.30。 In some embodiments, the chemical structure of the first catalyst layer is Ni a Nb b N 2 , 0.7
Figure TWI677596B_D0011
a
Figure TWI677596B_D0012
1.51, and 0.49
Figure TWI677596B_D0013
b
Figure TWI677596B_D0014
1.30.

在一些實施例中,第一觸媒層的化學結構為NicNbdCe,0.90

Figure TWI677596B_D0015
c
Figure TWI677596B_D0016
1.47,0.53
Figure TWI677596B_D0017
d
Figure TWI677596B_D0018
1.10,且0.9
Figure TWI677596B_D0019
e
Figure TWI677596B_D0020
1.9。 In some embodiments, the chemical structure of the first catalyst layer is Ni c Nb d C e , 0.90
Figure TWI677596B_D0015
c
Figure TWI677596B_D0016
1.47, 0.53
Figure TWI677596B_D0017
d
Figure TWI677596B_D0018
1.10 and 0.9
Figure TWI677596B_D0019
e
Figure TWI677596B_D0020
1.9.

在一些實施例中,第一觸媒層的化學結構為NicNbdCe,0.74

Figure TWI677596B_D0021
c
Figure TWI677596B_D0022
1.63,0.37
Figure TWI677596B_D0023
d
Figure TWI677596B_D0024
1.26,且0.38
Figure TWI677596B_D0025
e
Figure TWI677596B_D0026
1.30。 In some embodiments, the chemical structure of the first catalyst layer is Ni c Nb d C e , 0.74
Figure TWI677596B_D0021
c
Figure TWI677596B_D0022
1.63, 0.37
Figure TWI677596B_D0023
d
Figure TWI677596B_D0024
1.26 and 0.38
Figure TWI677596B_D0025
e
Figure TWI677596B_D0026
1.30.

在一些實施例中,第一觸媒層的化學結構為CocNbdCe,0.24

Figure TWI677596B_D0027
c
Figure TWI677596B_D0028
1.39,0.61
Figure TWI677596B_D0029
d
Figure TWI677596B_D0030
1.76,且0.63
Figure TWI677596B_D0031
e
Figure TWI677596B_D0032
3.61。 In some embodiments, the chemical structure of the first catalyst layer is Co c Nb d C e , 0.24
Figure TWI677596B_D0027
c
Figure TWI677596B_D0028
1.39, 0.61
Figure TWI677596B_D0029
d
Figure TWI677596B_D0030
1.76 and 0.63
Figure TWI677596B_D0031
e
Figure TWI677596B_D0032
3.61.

在一些實施例中,第二觸媒層的化學結構為MxRuyN2或MxRuy,其中M為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,0<x<1.3,0.7<y<2,x+y=2,MxRuyN2為立方晶系或非晶,且MxRuy為立方晶系。 In some embodiments, the chemical structure of the second catalyst layer is M x Ru y N 2 or M x Ru y , where M is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, 0 <x <1.3, 0.7 <y <2, x + y = 2, M x Ru y N 2 is cubic or amorphous, and M x Ru y is cubic.

在一些實施例中,第一氣液擴散層與第二氣液擴散層各自包括多孔導電層。 In some embodiments, each of the first gas-liquid diffusion layer and the second gas-liquid diffusion layer includes a porous conductive layer.

在一些實施例中,第一氣液擴散層為金屬網,而第二氣液擴散層為金屬網或碳紙。 In some embodiments, the first gas-liquid diffusion layer is a metal mesh and the second gas-liquid diffusion layer is a metal mesh or carbon paper.

在一些實施例中,第一氣液擴散層的孔徑介於40微米至150微米之間,而第二氣液擴散層的孔徑介於0.5微米至5微米之間。 In some embodiments, the pore diameter of the first gas-liquid diffusion layer is between 40 microns and 150 microns, and the pore diameter of the second gas-liquid diffusion layer is between 0.5 microns and 5 microns.

本發明一實施例提供之電解產氫的方法,包括:將膜電極組浸置於鹼性水溶液中,其中膜電極組包括:陽極,包括第一觸媒層於第一氣液擴散層上;陰極,包括第二觸媒層於第二氣液擴散層上;以及陰離子交換膜,夾設於陽極的第一觸媒層與陰極的第二觸媒層之間,其中第一觸媒層的化學結構為M’aM”bN2或M’cM”dCe,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,M”為Nb、Ta、或上述之組合,0.7

Figure TWI677596B_D0033
a
Figure TWI677596B_D0034
1.7,0.3
Figure TWI677596B_D0035
b
Figure TWI677596B_D0036
1.3,a+b=2,0.24
Figure TWI677596B_D0037
c
Figure TWI677596B_D0038
1.7,0.3
Figure TWI677596B_D0039
d
Figure TWI677596B_D0040
1.76,且0.38
Figure TWI677596B_D0041
e
Figure TWI677596B_D0042
3.61,其中M’aM”bN2為立方晶系,且M’cM”dCe為立方晶系或非晶;以及施加電位至陽極與陰極以電解鹼性水溶液,使陰極產生氫氣,並使陽極產生氧氣。 An electrolytic hydrogen production method provided by an embodiment of the present invention includes: immersing a membrane electrode group in an alkaline aqueous solution, wherein the membrane electrode group includes: an anode, including a first catalyst layer on a first gas-liquid diffusion layer; The cathode includes a second catalyst layer on the second gas-liquid diffusion layer; and an anion exchange membrane sandwiched between the first catalyst layer of the anode and the second catalyst layer of the cathode, wherein the first catalyst layer Chemical structure is M ' a M ” b N 2 or M ′ c M” d C e , where M ′ is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M ”is Nb, Ta , Or a combination of the above, 0.7
Figure TWI677596B_D0033
a
Figure TWI677596B_D0034
1.7, 0.3
Figure TWI677596B_D0035
b
Figure TWI677596B_D0036
1.3, a + b = 2, 0.24
Figure TWI677596B_D0037
c
Figure TWI677596B_D0038
1.7, 0.3
Figure TWI677596B_D0039
d
Figure TWI677596B_D0040
1.76 and 0.38
Figure TWI677596B_D0041
e
Figure TWI677596B_D0042
3.61, where M ' a M ” b N 2 is cubic and M' c M” d C e is cubic or amorphous; and applying a potential to the anode and cathode to electrolyze alkaline aqueous solution to generate hydrogen at the cathode And make the anode produce oxygen.

在一些實施例中,第二觸媒層的化學結構為MxRuyN2或MxRuy,其中M為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,0<x<1.3,0.7<y<2,x+y=2,MxRuyN2為立方晶系或非晶,且MxRuy為立方晶系。 In some embodiments, the chemical structure of the second catalyst layer is M x Ru y N 2 or M x Ru y , where M is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, 0 <x <1.3, 0.7 <y <2, x + y = 2, M x Ru y N 2 is cubic or amorphous, and M x Ru y is cubic.

在一些實施例中,第一氣液擴散層與第二氣液擴散層各自包括多孔導電層。 In some embodiments, each of the first gas-liquid diffusion layer and the second gas-liquid diffusion layer includes a porous conductive layer.

在一些實施例中,第一氣液擴散層為金屬網,而第二氣液擴散層為碳紙。 In some embodiments, the first gas-liquid diffusion layer is a metal mesh, and the second gas-liquid diffusion layer is a carbon paper.

在一些實施例中,第一氣液擴散層的孔徑介於40微米至150微米之間,而第二氣液擴散層的孔徑介於0.5微米至5微米之間。 In some embodiments, the pore diameter of the first gas-liquid diffusion layer is between 40 microns and 150 microns, and the pore diameter of the second gas-liquid diffusion layer is between 0.5 microns and 5 microns.

11‧‧‧陽極 11‧‧‧Anode

11A、15A‧‧‧氣液擴散層 11A, 15A‧‧‧‧Gas-liquid diffusion layer

11B、15B‧‧‧觸媒層 11B, 15B‧‧‧ catalyst layer

13‧‧‧陰離子交換膜 13‧‧‧ anion exchange membrane

15‧‧‧陰極 15‧‧‧ cathode

100‧‧‧膜電極組 100‧‧‧ membrane electrode group

圖1為一實施例中,膜電極組的示意圖。 FIG. 1 is a schematic diagram of a membrane electrode group in an embodiment.

圖2為一實施例中,Ru觸媒與NixRuy觸媒的OER曲線。 FIG. 2 is an OER curve of Ru catalyst and Ni x Ru y catalyst in an embodiment.

圖3為一實施例中,Ru2N2觸媒NixRuyN2觸媒的OER曲線。 FIG. 3 is an OER curve of Ru 2 N 2 catalyst Ni x Ru y N 2 catalyst in an embodiment.

圖4為一實施例中,Ru觸媒與NixRuy觸媒的HER曲線。 FIG. 4 is a HER curve of Ru catalyst and Ni x Ru y catalyst in an embodiment.

圖5為一實施例中,Ru觸媒與NixRuyN2觸媒的HER曲線。 FIG. 5 is a HER curve of Ru catalyst and Ni x Ru y N 2 catalyst in an embodiment.

圖6為一實施例中,Ni2N2觸媒與MnxRuyN2觸媒的OER曲線。 FIG. 6 is an OER curve of Ni 2 N 2 catalyst and Mn x Ru y N 2 catalyst in an embodiment.

圖7為一實施例中,Ni2N2觸媒與MnxRuyN2觸媒的HER曲線。 FIG. 7 is a HER curve of Ni 2 N 2 catalyst and Mn x Ru y N 2 catalyst in an embodiment.

圖8為一實施例中,NiaNbbN2觸媒的OER曲線。 FIG. 8 is an OER curve of a Ni a Nb b N 2 catalyst in an embodiment.

圖9為一實施例中,NicNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 9 is an OER curve of Ni c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖10為一實施例中,NicNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 10 is an OER curve of Ni c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖11為一實施例中,CocNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 11 is an OER curve of Co c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖12為一實施例中,CocNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 12 is an OER curve of Co c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖13為一實施例中,CocNbdCe觸媒與Nb0.6556C1.3444觸媒的 OER曲線。 FIG. 13 is an OER curve of Co c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖14為一實施例中,CocNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 14 is an OER curve of Co c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖15為一實施例中,CocNbdCe觸媒與Nb0.6556C1.3444觸媒的OER曲線。 FIG. 15 is an OER curve of Co c Nb d C e catalyst and Nb 0.6556 C 1.3444 catalyst in an embodiment.

圖16至圖19為實施例中,膜電極組的電流-電壓曲線。 16 to 19 are current-voltage curves of the membrane electrode group in the embodiment.

圖20為一實施例中,膜電極組長時間操作後的電流圖。 FIG. 20 is a current diagram of a membrane electrode group after a long-term operation in an embodiment.

本揭露一實施例提供之觸媒材料,其化學結構為:M’aM”bN2,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,M”為Nb、Ta、或上述之組合,0.7

Figure TWI677596B_D0043
a
Figure TWI677596B_D0044
1.7,0.3
Figure TWI677596B_D0045
b
Figure TWI677596B_D0046
1.3,且a+b=2,其中觸媒材料為立方晶系。在一實施例中,M’為Ni,M”為Nb,0.7
Figure TWI677596B_D0047
a
Figure TWI677596B_D0048
1.51,且0.49
Figure TWI677596B_D0049
b
Figure TWI677596B_D0050
1.30。若a過小(即b過大),則活性不佳。若a過大(即b過小),則活性與穩定性不佳。 The catalyst material provided by an embodiment of the present disclosure has a chemical structure of: M ′ a M ” b N 2 , where M ′ is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, M” Nb, Ta, or a combination of the above, 0.7
Figure TWI677596B_D0043
a
Figure TWI677596B_D0044
1.7, 0.3
Figure TWI677596B_D0045
b
Figure TWI677596B_D0046
1.3, and a + b = 2, where the catalyst material is cubic crystal system. In one embodiment, M 'is Ni, M "is Nb, 0.7
Figure TWI677596B_D0047
a
Figure TWI677596B_D0048
1.51, and 0.49
Figure TWI677596B_D0049
b
Figure TWI677596B_D0050
1.30. If a is too small (ie, b is too large), the activity is not good. If a is too large (ie, b is too small), the activity and stability are not good.

本發明一實施例提供之觸媒材料,其化學結構為:M’cM”dCe,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,M”為Nb、Ta、或上述之組合,0.24

Figure TWI677596B_D0051
c
Figure TWI677596B_D0052
1.7,0.3
Figure TWI677596B_D0053
d
Figure TWI677596B_D0054
1.76,且0.38
Figure TWI677596B_D0055
e
Figure TWI677596B_D0056
3.61,其中觸媒材料為立方晶系或非晶。在一實施例中,M’為Ni且M”為Nb,0.90
Figure TWI677596B_D0057
c
Figure TWI677596B_D0058
1.47,0.53
Figure TWI677596B_D0059
d
Figure TWI677596B_D0060
1.10,且0.9
Figure TWI677596B_D0061
e
Figure TWI677596B_D0062
1.9。在一實施例中,M’為Ni且M”為Nb,0.74
Figure TWI677596B_D0063
c
Figure TWI677596B_D0064
1.63,0.37
Figure TWI677596B_D0065
d
Figure TWI677596B_D0066
1.26,且0.38
Figure TWI677596B_D0067
e
Figure TWI677596B_D0068
1.30。在一些實施例中,M’為Co且M”為Nb,0.24
Figure TWI677596B_D0069
c
Figure TWI677596B_D0070
1.39,0.61
Figure TWI677596B_D0071
d
Figure TWI677596B_D0072
1.76,且0.63
Figure TWI677596B_D0073
e
Figure TWI677596B_D0074
3.61。若c過小(即d過大),則活性不佳。若c過大(即d過小),則活性與穩定性不佳。若e過小,則活性不佳。若e過大,則活性與穩定性不佳。 The catalyst material provided by an embodiment of the present invention has a chemical structure of: M ′ c M ” d C e , where M ′ is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, M” Nb, Ta, or a combination of the above, 0.24
Figure TWI677596B_D0051
c
Figure TWI677596B_D0052
1.7, 0.3
Figure TWI677596B_D0053
d
Figure TWI677596B_D0054
1.76 and 0.38
Figure TWI677596B_D0055
e
Figure TWI677596B_D0056
3.61, where the catalyst material is cubic or amorphous. In one embodiment, M 'is Ni and M "is Nb, 0.90
Figure TWI677596B_D0057
c
Figure TWI677596B_D0058
1.47, 0.53
Figure TWI677596B_D0059
d
Figure TWI677596B_D0060
1.10 and 0.9
Figure TWI677596B_D0061
e
Figure TWI677596B_D0062
1.9. In one embodiment, M 'is Ni and M "is Nb, 0.74
Figure TWI677596B_D0063
c
Figure TWI677596B_D0064
1.63, 0.37
Figure TWI677596B_D0065
d
Figure TWI677596B_D0066
1.26 and 0.38
Figure TWI677596B_D0067
e
Figure TWI677596B_D0068
1.30. In some embodiments, M 'is Co and M "is Nb, 0.24
Figure TWI677596B_D0069
c
Figure TWI677596B_D0070
1.39, 0.61
Figure TWI677596B_D0071
d
Figure TWI677596B_D0072
1.76 and 0.63
Figure TWI677596B_D0073
e
Figure TWI677596B_D0074
3.61. If c is too small (that is, d is too large), the activity is not good. If c is too large (that is, d is too small), the activity and stability are not good. If e is too small, the activity is not good. If e is too large, the activity and stability are not good.

本發明一實施例提供之觸媒材料的形成方法,包括:將M’靶材與M”靶材置於含氮氣的氛圍中,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,且M”為Nb、Ta、或上述之組合。分別提供功率至M’靶材與M”靶材;以及提供離子撞擊M’靶材與M”靶材,以濺鍍沉積M’aM”bN2於基材上,其中其中0.7

Figure TWI677596B_D0075
a
Figure TWI677596B_D0076
1.7,0.3
Figure TWI677596B_D0077
b
Figure TWI677596B_D0078
1.3,且a+b=2,其中M’aM”bN2為立方晶系。在一實施例中,含氮氣的氛圍壓力介於1mTorr至30mTorr之間。若含氮氣的氛圍壓力過低,則無法進行有效氮化反應。若含氮氣的氛圍壓力過高,則無法進行有效氮化反應。在一實施例中,含氮氣的氛圍包含載氣如氦氣、氬氣、其他合適的鈍氣、或上述之組合,且氮氣與載氣的分壓比例介於0.1-10之間。若氮氣的分壓比例過低,則無法進行有效氮化反應。若氮氣的分壓比例過高,則無法進行有效氮化反應。上述方法分別提供功率至M’靶材與M”靶材。舉例來說,提供至M’靶材的功率介於10-200W之間。若提供至M’靶材的功率過低,則觸媒材料中的M’比例過低。若提供至M’靶材的功率過高,則觸媒材料中的M’比例過高。另一方面,提供至M”靶材的功率介於10-200W之間。若提供至M”靶材的功率過低,則觸媒材料中的M”比例過低。若提供至M”靶材的功率過高,則觸媒材料中的M”比例過高。上述功率可為直流電功率或射頻功率。 A method for forming a catalyst material according to an embodiment of the present invention includes: placing an M 'target and an M "target in a nitrogen-containing atmosphere, where M' is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M "is Nb, Ta, or a combination thereof. Provide power to M 'target and M "target, respectively; and provide ion impact M' target and M" target to deposit M ' a M " b N 2 on the substrate by sputtering, of which 0.7
Figure TWI677596B_D0075
a
Figure TWI677596B_D0076
1.7, 0.3
Figure TWI677596B_D0077
b
Figure TWI677596B_D0078
1.3, and a + b = 2, where M ′ a M ” b N 2 is a cubic crystal system. In one embodiment, the atmospheric pressure containing nitrogen is between 1 mTorr and 30 mTorr. If the atmospheric pressure containing nitrogen is too low, If the nitrogen-containing atmosphere pressure is too high, the effective nitriding reaction cannot be performed. In one embodiment, the nitrogen-containing atmosphere includes a carrier gas such as helium, argon, or other suitable passivation. Gas, or a combination of the above, and the partial pressure ratio of nitrogen to the carrier gas is between 0.1-10. If the partial pressure ratio of nitrogen is too low, the effective nitriding reaction cannot be performed. If the partial pressure ratio of nitrogen is too high, Then an effective nitriding reaction cannot be performed. The above methods respectively provide power to the M 'target and the M "target. For example, the power provided to the M 'target is between 10-200W. If the power supplied to the M 'target is too low, the M' ratio in the catalyst material is too low. If the power supplied to the M 'target is too high, the M' ratio in the catalyst material is too high. On the other hand, the power supplied to the M "target is between 10-200W. If the power supplied to the M" target is too low, the M "ratio in the catalyst material is too low. If the power supplied to the M" target is too low If the power of the material is too high, the M "ratio in the catalyst material is too high. The above power can be DC power or RF power.

上述方法亦提供離子撞擊M’靶材與M”靶材,以濺鍍沉積M’aM”bN2於基材上。舉例來說,可電漿激發氮氣與載氣以形成離子,並使離子撞擊靶材。在一實施例中,基材包括多孔導電層,比如多孔的金屬網(如不鏽鋼網、鈦網、鎳網、鎳 合金網、鈮合金網、銅網、或鋁網)。多孔導電層的孔徑取決於M’aM”bN2的用途。舉例來說,若具有M’aM”bN2於其上的多孔導電層作為電解鹼性水溶液的陽極(用於OER),則多孔導電層的孔徑介於40微米至150微米之間。 The above method also provides ion impact on the M 'target and the M "target to deposit M' a M" b N 2 on the substrate by sputtering. For example, plasma can excite nitrogen and a carrier gas to form ions and cause the ions to hit the target. In one embodiment, the substrate includes a porous conductive layer, such as a porous metal mesh (such as a stainless steel mesh, a titanium mesh, a nickel mesh, a nickel alloy mesh, a niobium alloy mesh, a copper mesh, or an aluminum mesh). The pore size of the porous conductive layer depends on the use of M ' a M ” b N 2. For example, if a porous conductive layer having M' a M” b N 2 on it is used as the anode for electrolytic alkaline aqueous solution (for OER ), The pore diameter of the porous conductive layer is between 40 microns and 150 microns.

本發明一實施例提供之觸媒材料的形成方法,包括:將M’靶材、M”靶材、與碳靶材置於載氣氛圍中,其中M’為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,且M”為Nb、Ta、或上述之組合。分別提供功率至M’靶材、M”靶材、與碳靶材;以及提供離子撞擊M’靶材、M”靶材、與碳靶材,以濺鍍沉積M’cM”dCe於基材上,其中0.24

Figure TWI677596B_D0079
c
Figure TWI677596B_D0080
1.7,0.3
Figure TWI677596B_D0081
d
Figure TWI677596B_D0082
1.76,且0.38
Figure TWI677596B_D0083
e
Figure TWI677596B_D0084
3.61,其中M’cM”dCe為立方晶系或非晶。在一實施例中,載氣氛圍的壓力介於1mTorr至30mTorr之間。若載氣氛圍壓力過低,則無法形成有效結晶。若載氣氛圍壓力過高,則無法形成有效結晶。在一實施例中,載氣可為氦氣、氬氣、其他合適的鈍氣、或上述之組合。上述方法分別提供功率至M’靶材、M”靶材、與碳靶材。舉例來說,提供至M’靶材的功率介於10至200W之間。若提供至M’靶材的功率過低,則觸媒材料中的M’比例過低。若提供至M’靶材的功率過高,則觸媒材料中的M’比例過高。提供至M”靶材的功率介於10至200W之間。若提供至M”靶材的功率過低,則觸媒材料中的M”比例過低。若提供至M”靶材的功率過高,則觸媒材料中的M”比例過高。另一方面,提供至碳靶材的功率介於10至200W之間。若提供至碳靶材的功率過低,則觸媒材料中的碳比例過低。若提供至碳靶材的功率過高,則觸媒材料中的碳比例過高。上述功率可為直流 電功率或射頻功率。 A method for forming a catalyst material according to an embodiment of the present invention includes: placing an M 'target, an M "target, and a carbon target in a carrier gas atmosphere, where M' is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, and M "is Nb, Ta, or a combination thereof. Provide power to M 'target, M "target, and carbon target, respectively; and provide ion impact M' target, M" target, and carbon target to sputter deposit M ' c M " d C e On the substrate, of which 0.24
Figure TWI677596B_D0079
c
Figure TWI677596B_D0080
1.7, 0.3
Figure TWI677596B_D0081
d
Figure TWI677596B_D0082
1.76 and 0.38
Figure TWI677596B_D0083
e
Figure TWI677596B_D0084
3.61, where M ' c M ” d C e is cubic or amorphous. In one embodiment, the pressure of the carrier gas atmosphere is between 1 mTorr and 30 mTorr. If the pressure of the carrier gas atmosphere is too low, it will not be effective. Crystallization. If the atmospheric pressure of the carrier gas is too high, effective crystals cannot be formed. In one embodiment, the carrier gas can be helium, argon, other suitable inert gas, or a combination thereof. The above methods provide power to M 'Target, M' target, and carbon target. For example, the power provided to the M 'target is between 10 and 200W. If the power supplied to the M 'target is too low, the M' ratio in the catalyst material is too low. If the power supplied to the M 'target is too high, the M' ratio in the catalyst material is too high. The power supplied to the M "target is between 10 and 200W. If the power supplied to the M" target is too low, the M "ratio in the catalyst material is too low. If the power supplied to the M" target is too low High, the M "ratio in the catalyst material is too high. On the other hand, the power provided to the carbon target is between 10 and 200W. If the power provided to the carbon target is too low, the The carbon ratio is too low. If the power provided to the carbon target is too high, the carbon ratio in the catalyst material is too high. The above power can be DC power or RF power.

上述方法亦提供離子撞擊M’靶材、M”靶材、與碳靶材,以濺鍍沉積M’cM”dCe於基材上。舉例來說,可電漿激發載氣以形成離子,並使離子撞擊靶材。在一實施例中,基材包括多孔導電層,比如多孔的金屬網(如不鏽鋼網、鈦網、鎳網、鎳合金網、鈮合金網、銅網、或鋁網)。多孔導電層的孔徑取決於M’cM”dCe的用途。舉例來說,若具有M’cM”dCe於其上的多孔導電層作為電解鹼性水溶液的陽極(用於OER),則多孔導電層的孔徑介於40微米至150微米之間。 The above method also provides ion impact M 'target, M "target, and carbon target to deposit M' c M" d C e on the substrate by sputtering. For example, a plasma can be used to excite a carrier gas to form ions and cause the ions to hit a target. In one embodiment, the substrate includes a porous conductive layer, such as a porous metal mesh (such as a stainless steel mesh, a titanium mesh, a nickel mesh, a nickel alloy mesh, a niobium alloy mesh, a copper mesh, or an aluminum mesh). The pore diameter of the porous conductive layer depends on the use of M ' c M ” d C e . For example, if the porous conductive layer with M' c M” d C e on it is used as the anode for electrolytic alkaline aqueous solution (for OER ), The pore diameter of the porous conductive layer is between 40 microns and 150 microns.

在一實施例中,上述觸媒材料可用於電解產氫的膜電極組。如圖1所示,膜電極組100包括陽極11、陰極15、與陰離子交換膜13,且陰離子交換膜夾設於陽極11與陰極15之間。陽極11包括觸媒層11B於氣液擴散層11A上,而陰極15包括觸媒層15B於氣液擴散層15A上。此外。陰離子交換膜13,夾設於陽極11的觸媒層11B與陰極15的觸媒層15B之間。觸媒層11B的化學結構為M’aM”bN2或M’cM”dCe,而M’、M”、a、b、c、d、與e的定義同前述,在此不重複。 In one embodiment, the catalyst material can be used in a membrane electrode group for electrolytic hydrogen production. As shown in FIG. 1, the membrane electrode group 100 includes an anode 11, a cathode 15, and an anion exchange membrane 13, and the anion exchange membrane is sandwiched between the anode 11 and the cathode 15. The anode 11 includes a catalyst layer 11B on the gas-liquid diffusion layer 11A, and the cathode 15 includes a catalyst layer 15B on the gas-liquid diffusion layer 15A. Also. The anion exchange membrane 13 is interposed between the catalyst layer 11B of the anode 11 and the catalyst layer 15B of the cathode 15. The chemical structure of the catalyst layer 11B is M ′ a M ” b N 2 or M ′ c M” d C e , and the definitions of M ′, M ”, a, b, c, d, and e are the same as above, and here Not repeating.

在一實施例中,陰離子交換膜13可為含鹵素離子之咪唑高分子或其他合適材料。舉例來說,陰離子交換膜13可為購自Fumatech之FAS或購自Dioxide materials之X37-50。由於膜電極組100用於電解鹼性水溶液產氫,因此採用陰離子交換膜13而非其他離子交換膜。 In one embodiment, the anion exchange membrane 13 may be an imidazole polymer containing halogen ions or other suitable materials. For example, the anion exchange membrane 13 may be FAS purchased from Fumatech or X37-50 purchased from Dioxide materials. Since the membrane electrode group 100 is used to produce hydrogen from electrolytic alkaline aqueous solution, the anion exchange membrane 13 is used instead of other ion exchange membranes.

在一實施例中,氣液擴散層11A與氣液擴散層15A各自包括多孔導電層。舉例來說,氣液擴散層11A可為多孔的 金屬網(如不鏽鋼網、鈦網、鎳網、鎳合金網、鈮合金網、銅網、或鋁網)。另一方面,氣液擴散層15A可為多孔的金屬網(如不鏽鋼網、鈦網、鎳網、鎳合金網、鈮合金網、銅網、或鋁網)或多孔碳材(如碳紙或碳布)。在一實施例中,氣液擴散層11A的孔徑介於40微米至150微米之間。若氣液擴散層11A的孔徑過小,則增加質傳阻抗。若氣液擴散層11A的孔徑過大,則喪失活性面積。在一實施例中,氣液擴散層15A的孔徑介於0.5微米至5微米之間。若氣液擴散層15A的孔徑過小,則增加質傳阻抗。若氣液擴散層15A的孔徑過大,則喪失活性面積。 In one embodiment, each of the gas-liquid diffusion layer 11A and the gas-liquid diffusion layer 15A includes a porous conductive layer. For example, the gas-liquid diffusion layer 11A may be porous Metal mesh (such as stainless steel mesh, titanium mesh, nickel mesh, nickel alloy mesh, niobium alloy mesh, copper mesh, or aluminum mesh). On the other hand, the gas-liquid diffusion layer 15A may be a porous metal mesh (such as a stainless steel mesh, a titanium mesh, a nickel mesh, a nickel alloy mesh, a niobium alloy mesh, a copper mesh, or an aluminum mesh) or a porous carbon material (such as carbon paper or Carbon cloth). In one embodiment, the pore size of the gas-liquid diffusion layer 11A is between 40 microns and 150 microns. If the pore diameter of the gas-liquid diffusion layer 11A is too small, the mass transfer resistance is increased. If the pore diameter of the gas-liquid diffusion layer 11A is too large, the active area will be lost. In one embodiment, the pore size of the gas-liquid diffusion layer 15A is between 0.5 μm and 5 μm. If the pore diameter of the gas-liquid diffusion layer 15A is too small, the mass transfer resistance is increased. If the pore diameter of the gas-liquid diffusion layer 15A is too large, the active area will be lost.

在其他實施例中,陽極11的氣液擴散層11A與陰極15的氣液擴散層15A之孔徑不同及/或組成不同,或者陽極11的觸媒層11B與陰極15的觸媒層15B之元素組成或元素比例不同,端視需求而定。舉例來說,觸媒層11B的化學結構為M’aM”bN2或M’cM”dCe,而觸媒層15B的化學結構為MxRuyN2或MxRuy,其中M為Ni、Co、Fe、Mn、Cr、V、Ti、Cu、或Zn,0<x<1.3,0.7<y<2,x+y=2,MxRuyN2為立方晶系或非晶,且MxRuy為立方晶系。在此實施例中,氣液擴散層11A可為多孔金屬網,而氣液擴散層11B可為多孔碳紙,以進一步增加膜電極組在電解中的耐久性。在另一實施例中,觸媒層11B的化學結構為M’aM”bN2或M’cM”dCe,而陰極15可為市售電極。 In other embodiments, the gas-liquid diffusion layer 11A of the anode 11 and the gas-liquid diffusion layer 15A of the cathode 15 have different pore sizes and / or different compositions, or the elements of the catalyst layer 11B of the anode 11 and the catalyst layer 15B of the cathode 15 The composition or proportion of the elements is different, depending on the needs. For example, the chemical structure of the catalyst layer 11B is M ′ a M ” b N 2 or M ′ c M” d C e , and the chemical structure of the catalyst layer 15B is M x Ru y N 2 or M x Ru y , Where M is Ni, Co, Fe, Mn, Cr, V, Ti, Cu, or Zn, 0 <x <1.3, 0.7 <y <2, x + y = 2, and M x Ru y N 2 is cubic Or amorphous, and M x Ru y is cubic. In this embodiment, the gas-liquid diffusion layer 11A may be a porous metal mesh, and the gas-liquid diffusion layer 11B may be a porous carbon paper to further increase the durability of the membrane electrode group in electrolysis. In another embodiment, the chemical structure of the catalyst layer 11B is M ′ a M ″ b N 2 or M ′ c M ″ d C e , and the cathode 15 may be a commercially available electrode.

上述膜電極組可用於電解產氫。舉例來說,可將膜電極組浸置於鹼性水溶液中。舉例來說,鹼性水溶液可為NaOH、KOH、其他合適的鹼類、或上述之組合的水溶液。在一實施例中,鹼性水溶液的pH值大於14且小於15。若鹼性水溶 液的pH值過低,則導電度不佳。若鹼性水溶液的pH值過高,則溶液黏度過高。上述方法亦施加電位至陽極與陰極以電解鹼性水溶液,使陰極產生氫氣,並使陽極產生氧氣。 The membrane electrode group can be used for electrolytic hydrogen production. For example, the membrane electrode group can be immersed in an alkaline aqueous solution. For example, the alkaline aqueous solution may be an aqueous solution of NaOH, KOH, other suitable bases, or a combination thereof. In one embodiment, the pH of the alkaline aqueous solution is greater than 14 and less than 15. If alkaline water soluble If the pH of the liquid is too low, the conductivity is not good. If the pH of the alkaline aqueous solution is too high, the solution viscosity is too high. The above method also applies a potential to the anode and the cathode to electrolyze an alkaline aqueous solution, so that the cathode generates hydrogen and the anode generates oxygen.

綜上所述,本揭露實施例之觸媒符合電解鹼性水溶液產氫的需求。在OER部分,觸媒可解決習知觸媒的催化效果不佳、導電性不良、抗氧化耐蝕性低等問題。觸媒需具備高導電能力,與高OER的電化學活性。本揭露實施例的觸媒在擴散觀點中,於低溫下的晶界擴散係數遠大於體擴散係數。由於觸媒中添加的雜質原子M’可填充於晶界,可阻隔原子經由晶界擴散,以改善其效能。觸媒的快速擴散路徑如晶界等,可被某些材料填充,以阻止相鄰的材料原子經由晶界或其它缺陷擴散。藉由插入晶界縫隙的氮原子或碳原子,可大量減少原子經由晶界擴散的機會。綜上所述,採用氮原子與碳原子可增加抗氧化及材料穩定性。由於氮化物或碳化物的導電佳且兼顧活性與成本,以M”的氮化物或碳化物(與Pt活性相近)結合M’可得高導電度與電化學活性的觸媒。 In summary, the catalysts of the embodiments of the present disclosure meet the requirements for hydrogen production by electrolytic alkaline aqueous solution. In the OER part, the catalyst can solve the problems of poor catalytic performance, poor conductivity, and low oxidation and corrosion resistance of the conventional catalysts. The catalyst needs to have high conductivity and high OER electrochemical activity. In the diffusion view of the catalyst of the disclosed embodiment, the grain boundary diffusion coefficient at a low temperature is much larger than the bulk diffusion coefficient. Since the impurity atom M 'added to the catalyst can fill the grain boundaries, the atoms can be prevented from diffusing through the grain boundaries to improve its efficiency. The catalyst's fast diffusion path, such as grain boundaries, can be filled by certain materials to prevent adjacent material atoms from diffusing through the grain boundaries or other defects. By inserting nitrogen or carbon atoms in the gaps between the grain boundaries, the chance of atoms diffusing through the grain boundaries can be greatly reduced. In summary, the use of nitrogen and carbon atoms can increase oxidation resistance and material stability. Since nitride or carbide has good conductivity and balances activity and cost, combining M 'nitride or carbide (similar to Pt activity) in combination with M' can obtain a catalyst with high conductivity and electrochemical activity.

為了讓本揭露之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉數實施例配合所附圖示,作詳細說明如下: In order to make the above and other objects, features, and advantages of this disclosure more comprehensible, the following specific embodiments are described in detail with the accompanying drawings as follows:

實施例 Examples

製備例1 Preparation Example 1

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上沉積Pt觸媒。將Pt靶材置入濺鍍機台中,施加功率至Pt靶材,並將氬氣(流速為20sccm)通入機台,且機台內的壓力為30mTorr。 以氬離子撞擊Pt靶材,於室溫下進行濺鍍5至6分鐘,以形成膜厚約100nm的Pt觸媒於玻璃碳電極上,觸媒披覆量為0.042mg。 A reactive magnetron sputtering machine was used to deposit Pt catalyst on a glassy carbon electrode (5mm OD × 4mm H). The Pt target was placed in a sputtering machine, power was applied to the Pt target, and argon gas (flow rate: 20 sccm) was passed into the machine, and the pressure in the machine was 30 mTorr. The Pt target was impacted with argon ions, and sputtering was performed at room temperature for 5 to 6 minutes to form a Pt catalyst with a film thickness of about 100 nm on the glass carbon electrode, and the catalyst coating amount was 0.042 mg.

製備例2 Preparation Example 2

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的NixRuy觸媒。將Ni靶材與Ru靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10至200W之間)與Ru靶材的功率(10至200W之間),並將氬氣(流速為20sccm)通入機台,且機台內的壓力為20mTorr。以氬離子撞擊Ni靶材與Ru靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的NixRuy觸媒於玻璃碳電極上,觸媒披覆量為0.024mg。由EDS分析NixRuy觸媒,x介於約0.065至0.85之間,而y介於約1.935至1.15之間。由SEM分析NixRuy觸媒,其表面形貌為粒狀。由X射線繞射分析(XRD)分析NixRuy觸媒,其為立方晶系。另一方面,可只將Ru靶材置入濺鍍機台中,以類似參數形成膜厚約100nm的Ru觸媒於玻璃碳電極上,觸媒披覆量為0.024mg。 A reactive magnetron sputtering machine was used to deposit Ni x Ru y catalysts with different element ratios on glass carbon electrodes (5mm OD × 4mm H). Put the Ni target and Ru target into the sputtering machine, adjust the power applied to the Ni target (between 10 and 200W) and the power of the Ru target (between 10 and 200W), and argon (flow rate 20sccm) into the machine, and the pressure inside the machine is 20mTorr. The Ni target and the Ru target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Ni x Ru y catalyst with a film thickness of about 100 nm on the glass carbon electrode. The amount of catalyst coating It is 0.024 mg. The Ni x Ru y catalyst was analyzed by EDS, x was between about 0.065 and 0.85, and y was between about 1.935 and 1.15. The Ni x Ru y catalyst was analyzed by SEM, and its surface morphology was granular. The Ni x Ru y catalyst was analyzed by X-ray diffraction analysis (XRD), which is a cubic system. On the other hand, the Ru target can only be placed in a sputtering machine, and a Ru catalyst having a film thickness of about 100 nm can be formed on a glass carbon electrode with similar parameters, and the catalyst coating amount is 0.024 mg.

製備例3 Preparation Example 3

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的NixRuyN2觸媒。將Ni靶材與Ru靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10至200W之間)與Ru靶材的功率(10至200W之間),並將氮氣與氬氣(流速為20sccm)通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為20mTorr。以氬離子撞擊Ni靶材與Ru靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的NixRuyN2觸媒於玻璃碳電極上,觸媒披覆量為0.024mg。由EDS分析NixRuyN2觸媒, x介於約0.069至1.086之間,而y介於約1.931至0.914之間。由SEM分析NixRuyN2觸媒,其表面形貌為三角錐與四角錐。由XRD分析NixRuyN2觸媒,其為立方晶系或非晶。另一方面,可只將Ru靶材置入濺鍍機台中,以類似參數形成膜厚約100nm的Ru2N2觸媒於玻璃碳電極上,觸媒披覆量為0.024mg。 A reactive magnetron sputtering machine was used to deposit Ni x Ru y N 2 catalysts with different element ratios on glass carbon electrodes (5 mm OD × 4 mm H). Put the Ni target and Ru target into the sputtering machine, adjust the power applied to the Ni target (between 10 and 200W) and the power of the Ru target (between 10 and 200W), and nitrogen and argon (The flow rate is 20 sccm) into the machine, nitrogen / (argon + nitrogen) = 50%, and the pressure in the machine is 20mTorr. The Ni target and the Ru target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Ni x Ru y N 2 catalyst with a film thickness of about 100 nm on a glass carbon electrode. The coverage was 0.024 mg. The Ni x Ru y N 2 catalyst was analyzed by EDS, and x was between about 0.069 and 1.086, and y was between about 1.931 and 0.914. The Ni x Ru y N 2 catalyst was analyzed by SEM, and its surface morphology was triangular pyramid and quadrangular pyramid. The Ni x Ru y N 2 catalyst was analyzed by XRD and was cubic or amorphous. On the other hand, the Ru target can be simply placed in a sputtering machine, and a Ru 2 N 2 catalyst having a film thickness of about 100 nm can be formed on a glassy carbon electrode with similar parameters, and the coating amount of the catalyst is 0.024 mg.

實施例1 Example 1

將上述Pt、Ru、Ru2N2、NixRuy、與NixRuyN2觸媒,進行OER電化學活性測試如下。在0.1MKOH溶液中,分別取Pt、Ru、Ru2N2、NixRuy、與NixRuyN2觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,並取鉑作為輔助電極。掃瞄電壓範圍:-0.8~1V,掃描速度為50mV/s,掃瞄次數為10次。接著進行OER之CV量測,掃瞄電壓範圍:-0.8~0.1V,掃描速度為10mV/s,且掃瞄次數為5次。上述OER結果如圖2(Ru與NixRuy)與圖3(Ru2N2與NixRuyN2)所示,橫軸為相對於可逆氫電極(Reversible hydrogen electrode,RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。如圖2所示,純Ru觸媒層無OER活性,而添加Ni的Ru觸媒活性明顯提升。如圖3所示,Ru2N2觸媒活性遠高於Ru觸媒活性,而添加適量Ni的Ru2N2觸媒(即NixRuyN2觸媒)的活性可大幅提升。舉例來說,NixRuyN2的x介於0.4至1.1之間時,可具有較佳效果。部份觸媒的比較如表1所示: OER electrochemical activity tests were performed on the Pt, Ru, Ru 2 N 2 , Ni x Ru y , and Ni x Ru y N 2 catalysts as follows. In a 0.1 MKOH solution, Pt, Ru, Ru 2 N 2 , Ni x Ru y , and glassy carbon electrodes formed thereon with Ni x Ru y N 2 catalysts were used as working electrodes. Take Hg / HgO as the reference electrode and platinum as the auxiliary electrode. Scanning voltage range: -0.8 ~ 1V, scanning speed is 50mV / s, and scanning times are 10 times. Then perform CER measurement of OER. The scanning voltage range is -0.8 ~ 0.1V, the scanning speed is 10mV / s, and the scanning times are 5 times. The above OER results are shown in Fig. 2 (Ru and Ni x Ru y ) and Fig. 3 (Ru 2 N 2 and Ni x Ru y N 2 ). The horizontal axis is the potential relative to the reversible hydrogen electrode (RHE). (V), and the vertical axis represents the current density (J, mA / cm 2 ). As shown in FIG. 2, the pure Ru catalyst layer has no OER activity, and the Ru catalyst activity with Ni is significantly improved. As shown in FIG. 3, the Ru 2 N 2 catalyst activity is much higher than the Ru catalyst activity, and the activity of the Ru 2 N 2 catalyst (that is, Ni x Ru y N 2 catalyst) added with an appropriate amount of Ni can be greatly improved. For example, Ni x Ru y N 2 has a better effect when x is between 0.4 and 1.1. The comparison of some catalysts is shown in Table 1:

由表1可知,OER中的Ni0.29Ru1.71與Ni0.46Ru1.53N2觸媒的電流密度,均高於鉑膜觸媒的電流密度。不過NixRuy無抗氧化能力,因此不適於應用於OER。換言之,Ni0.46Ru1.53N2比鉑膜觸媒更適用於OER。 As can be seen from Table 1, the current densities of the Ni 0.29 Ru 1.71 and Ni 0.46 Ru 1.53 N 2 catalysts in the OER are higher than those of the platinum film catalysts. However, Ni x Ru y is not suitable for OER because it has no antioxidant ability. In other words, Ni 0.46 Ru 1.53 N 2 is more suitable for OER than platinum film catalyst.

實施例2 Example 2

將上述Pt、Ru、NixRuy、與NixRuyN2觸媒,進行HER電化學活性測試如下。在0.1MKOH溶液中,分別取Pt、Ru、Ru2N2、NixRuy、與NixRuyN2觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,並取鉑作為輔助電極。在HER量測部分,工作電極的轉速為1600rpm,掃瞄電壓範圍:0~1V,掃描速度為10mV/s,掃瞄次數為3次。上述HER結果如圖4(Ru與NixRuy)與圖5(Ru與NixRuyN2)所示,橫軸為相對於可逆氫電極(RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。如圖4所示,添加Ni的Ru觸媒(即NixRuy)活性明顯高於Ru觸媒。部份觸媒的比較如表2所示: The Pt, Ru, Ni x Ru y , and Ni x Ru y N 2 catalysts were subjected to a HER electrochemical activity test as follows. In a 0.1 MKOH solution, Pt, Ru, Ru 2 N 2 , Ni x Ru y , and glassy carbon electrodes formed thereon with Ni x Ru y N 2 catalysts were used as working electrodes. Take Hg / HgO as the reference electrode and platinum as the auxiliary electrode. In the HER measurement part, the rotating speed of the working electrode is 1600 rpm, the scanning voltage range is 0 to 1V, the scanning speed is 10 mV / s, and the scanning number is 3 times. The above HER results are shown in Fig. 4 (Ru and Ni x Ru y ) and Fig. 5 (Ru and Ni x Ru y N 2 ). The horizontal axis is the potential (V) with respect to the reversible hydrogen electrode (RHE), and the vertical axis is Current density (J, mA / cm 2 ). As shown in FIG. 4, the activity of the Ru catalyst (ie, Ni x Ru y ) added with Ni is significantly higher than that of the Ru catalyst. The comparison of some catalysts is shown in Table 2:

由上述可知,HER中的Ni0.06Ru1.93與Ni1.2Ru0.8N2觸媒的電流密度,均高於鉑膜觸媒的電流密度。換言之,Ni0.06Ru1.93與Ni1.2Ru0.8N2觸媒均比鉑膜觸媒更適用於HER。 It can be known from the above that the current density of the Ni 0.06 Ru 1.93 and Ni 1.2 Ru 0.8 N 2 catalysts in HER are higher than the current density of the platinum film catalyst. In other words, Ni 0.06 Ru 1.93 and Ni 1.2 Ru 0.8 N 2 catalysts are more suitable for HER than platinum film catalysts.

製備例4 Preparation Example 4

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的MnxRuyN2觸媒。將Mn靶材與Ru靶材置入濺鍍機台中,調整施加至Mn靶材的功率(10至200W之間)與Ru靶材的功率(10至200W之間),並將氮氣與氬氣(流速為20sccm)通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為20mTorr。以氬離子撞擊Mn靶材與Ru靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的MnxRuyN2觸媒於玻璃碳電極上,觸媒披覆量為0.024mg。由EDS分析MnxRuyN2觸媒,x介於約0.01至0.8之間,而y介於約1.2至1.99之間。由SEM分析MnxRuyN2觸媒,其表面形貌為三角錐與四角錐。由XRD分析MnxRuyN2觸媒,其為立方晶系或非晶。 A reactive magnetron sputtering machine was used to deposit Mn x Ru y N 2 catalysts with different element ratios on glass carbon electrodes (5 mm OD × 4 mm H). Put the Mn target and Ru target into the sputtering machine, adjust the power applied to the Mn target (between 10 and 200W) and the power of the Ru target (between 10 and 200W), and nitrogen and argon (The flow rate is 20 sccm) into the machine, nitrogen / (argon + nitrogen) = 50%, and the pressure in the machine is 20mTorr. The Mn target and the Ru target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Mn x Ru y N 2 catalyst with a film thickness of about 100 nm on a glass carbon electrode. The coverage was 0.024 mg. The Mn x Ru y N 2 catalyst was analyzed by EDS, and x was between about 0.01 and 0.8, and y was between about 1.2 and 1.99. The Mn x Ru y N 2 catalyst was analyzed by SEM, and its surface morphology was triangular pyramid and quadrangular pyramid. The Mn x Ru y N 2 catalyst was analyzed by XRD and was cubic or amorphous.

實施例3 Example 3

將上述MnxRuyN2觸媒,進行OER電化學活性測試如下。在0.1MKOH溶液中,取MnxRuyN2觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,工作電極的轉速為1600rpm,並取鉑作為輔助電極。掃瞄電壓範圍:-0.8~1V,掃描速度為50mV/s,掃瞄次數為10次。接著進行OER之CV量測,掃瞄電壓範圍:-0.8~0.1V,掃描速度為10mV/s,且掃瞄次數為5次。上述OER結果如圖6(Ni2N2與MnxRuyN2)所示,橫軸為相對於可逆氫電極(RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。如圖6所示,添加適量Mn的Ru2N2觸媒(即MnxRuyN2觸媒)的活性可大幅提升。舉例來說,MnxRuyN2的x介於0.3至0.7之間時,可具有較佳效果。部份觸媒的比較如表3所示:表3 The Mn x Ru y N 2 catalyst was subjected to OER electrochemical activity test as follows. In a 0.1 MKOH solution, a glassy carbon electrode formed on the Mn x Ru y N 2 catalyst was used as a working electrode. Take Hg / HgO as the reference electrode, rotate the working electrode at 1600 rpm, and take platinum as the auxiliary electrode. Scanning voltage range: -0.8 ~ 1V, scanning speed is 50mV / s, and scanning times are 10 times. Then perform CER measurement of OER. The scanning voltage range is -0.8 ~ 0.1V, the scanning speed is 10mV / s, and the scanning times are 5 times. The above OER results are shown in Fig. 6 (Ni 2 N 2 and Mn x Ru y N 2 ), the horizontal axis is the potential (V) relative to the reversible hydrogen electrode (RHE), and the vertical axis is the current density (J, mA / cm 2 ). As shown in FIG. 6, the activity of the Ru 2 N 2 catalyst (that is, Mn x Ru y N 2 catalyst) added with an appropriate amount of Mn can be greatly improved. For example, when x of Mn x Ru y N 2 is between 0.3 and 0.7, a better effect can be obtained. The comparison of some catalysts is shown in Table 3: Table 3

由表3可知,OER中的Mn0.323Ru1.677N2觸媒的電流密度高於鉑膜觸媒的電流密度。換言之,Mn0.323Ru1.677N2比鉑膜觸媒更適用於OER。 As can be seen from Table 3, the current density of the Mn 0.323 Ru 1.677 N 2 catalyst in the OER is higher than that of the platinum film catalyst. In other words, Mn 0.323 Ru 1.677 N 2 is more suitable for OER than platinum film catalyst.

實施例4 Example 4

將MnxRuyN2觸媒進行HER電化學活性測試如下。在0.1MKOH溶液中,取MnxRuyN2觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,並取鉑作為輔助電極。在HER量測部分,工作電極的轉速為1600rpm,掃瞄電壓範圍:0~1V,掃描速度為10mV/s,掃瞄次數為3次。上述HER結果如圖7所示,橫軸為相對於可逆氫電極(RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。部份觸媒的比較如表4所示: Mn x Ru y N 2 catalyst was subjected to HER electrochemical activity test as follows. In a 0.1 MKOH solution, a glassy carbon electrode formed on the Mn x Ru y N 2 catalyst was used as a working electrode. Take Hg / HgO as the reference electrode and platinum as the auxiliary electrode. In the HER measurement part, the rotating speed of the working electrode is 1600 rpm, the scanning voltage range is 0 to 1V, the scanning speed is 10 mV / s, and the scanning number is 3 times. The above HER results are shown in FIG. 7. The horizontal axis is the potential (V) with respect to the reversible hydrogen electrode (RHE), and the vertical axis is the current density (J, mA / cm 2 ). The comparison of some catalysts is shown in Table 4:

由上述可知,HER中的Mn0.079Ru1.92N2觸媒的電流密度高於鉑膜觸媒的電流密度。換言之,Mn0.079Ru1.92N2觸媒均比鉑膜觸媒更適用於HER。 From the above, it is known that the current density of the Mn 0.079 Ru 1.92 N 2 catalyst in HER is higher than that of the platinum film catalyst. In other words, Mn 0.079 Ru 1.92 N 2 catalysts are more suitable for HER than platinum film catalysts.

製備例5 Preparation Example 5

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的NiaNbbN2觸媒。將Ni靶材與Nb靶材 置入濺鍍機台中,調整施加至Ni靶材的功率(10至200W之間)與Nb靶材的功率(10至200W之間),並將氮氣與氬氣(流速為10sccm)通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材與Nb靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的NiaNbbN2觸媒於玻璃碳電極上,觸媒披覆量為0.017mg。由EDS分析NiaNbbN2觸媒,a介於約0.3128至1.5082之間,而b介於約0.5095至1.6872之間。由XRD分析NiaNbbN2觸媒,其為立方晶系。 A reactive magnetron sputtering machine was used to deposit Ni a Nb b N 2 catalysts with different element ratios on glass carbon electrodes (5 mm OD × 4 mm H). Put the Ni target and Nb target into the sputtering machine, adjust the power applied to the Ni target (between 10 and 200W) and the power of the Nb target (between 10 and 200W), and nitrogen and argon (Flow rate is 10 sccm) into the machine, nitrogen / (argon + nitrogen) = 50%, and the pressure in the machine is 5mTorr. Ni target and Nb target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Ni a Nb b N 2 catalyst with a film thickness of about 100 nm on a glass carbon electrode. The coverage was 0.017 mg. The Ni a Nb b N 2 catalyst was analyzed by EDS, a was between about 0.3128 and 1.5082, and b was between about 0.5095 and 1.6872. The Ni a Nb b N 2 catalyst was analyzed by XRD, which was a cubic crystal system.

製備例6 Preparation Example 6

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的NicNbdCe觸媒。將Ni靶材、Nb靶材、與碳靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10至200W之間)、Nb靶材的功率(10至200W之間)與碳靶材的功率(10至200W之間),並將氬氣(10sccm)通入機台,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材、Nb靶材、與碳靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的NicNbdCe觸媒於玻璃碳電極上,觸媒披覆量為0.017mg。由EDS分析NicNbdCe觸媒,c介於約0.58至1.47之間,d介於約0.53至1.42之間,而e介於約0.92至2.47之間。由XRD分析NicNbdCe觸媒,其為立方晶系或非晶。另一方面,可只將Nb靶材與碳靶材置入濺鍍機台中,以類似參數形成膜厚約100nm的Nb0.6556C1.3444觸媒於玻璃碳電極上,觸媒披覆量為0.017mg。 A reactive magnetron sputtering machine was used to deposit Ni c Nb d C e catalysts with different element ratios on glass carbon electrodes (5 mm OD × 4 mm H). Place the Ni target, Nb target, and carbon target in the sputtering machine, and adjust the power applied to the Ni target (between 10 and 200W), the power of the Nb target (between 10 and 200W), and carbon. The power of the target (between 10 and 200W), and argon (10sccm) was passed into the machine, and the pressure inside the machine was 5mTorr. Ni target, Nb target, and carbon target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Ni c Nb d C e catalyst with a film thickness of about 100 nm on a glass carbon electrode. Above, the catalyst coating amount is 0.017 mg. The Ni c Nb d C e catalyst was analyzed by EDS. C was between about 0.58 and 1.47, d was between about 0.53 and 1.42, and e was between about 0.92 and 2.47. The Ni c Nb d C e catalyst was analyzed by XRD, and it was cubic or amorphous. On the other hand, only Nb target and carbon target can be placed in the sputtering machine, and Nb 0.6556 C 1.3444 catalyst with a film thickness of about 100 nm can be formed on the glass carbon electrode with similar parameters, and the catalyst coating amount is 0.017 mg. .

製備例7 Preparation Example 7

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H) 上分別沉積不同元素比例的NicNbdCe觸媒。將Ni靶材、Nb靶材、與碳靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10至200W之間)、Nb靶材的功率(10至200W之間)與碳靶材的功率(10至200W之間),並將氬氣(10sccm)通入機台,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材、Nb靶材、與碳靶材,於室溫下進行反應式濺鍍5至6分鐘,以形成膜厚約100nm的NicNbdCe觸媒於玻璃碳電極上,觸媒披覆量為0.017mg。由EDS分析NicNbdCe觸媒,c介於約0.74至1.63之間,d介於約0.37至1.26之間,而e介於約0.38至1.30之間。由XRD分析NicNbdCe觸媒,其為立方晶系或非晶。 A reactive magnetron sputtering machine was used to deposit Ni c Nb d C e catalysts with different element ratios on glass carbon electrodes (5 mm OD × 4 mm H). Place the Ni target, Nb target, and carbon target in the sputtering machine, and adjust the power applied to the Ni target (between 10 and 200W), the power of the Nb target (between 10 and 200W), and carbon. The power of the target (between 10 and 200W), and argon (10sccm) was passed into the machine, and the pressure inside the machine was 5mTorr. Ni target, Nb target, and carbon target were impacted with argon ions, and reactive sputtering was performed at room temperature for 5 to 6 minutes to form a Ni c Nb d C e catalyst with a film thickness of about 100 nm on a glass carbon electrode. Above, the catalyst coating amount is 0.017 mg. The Ni c Nb d C e catalyst was analyzed by EDS. C was between about 0.74 and 1.63, d was between about 0.37 and 1.26, and e was between about 0.38 and 1.30. The Ni c Nb d C e catalyst was analyzed by XRD, and it was cubic or amorphous.

實施例5 Example 5

將上述Pt、NiaNbbN2、NicNbdCe、與Nb0.6556C1.3444觸媒,進行OER電化學活性測試如下。在0.1MKOH溶液中,分別取Pt、NiaNbbN2、NicNbdCe、與Nb0.6556C1.3444觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,工作電極的轉速為1600rpm,並取鉑作為輔助電極。掃瞄電壓範圍:-0.8~1V,掃描速度為50mV/s,掃瞄次數為10次。接著進行OER之CV量測,掃瞄電壓範圍:-0.8~0.1V,掃描速度為10mV/s,且掃瞄次數為5次。上述OER結果如圖8(NiaNbbN2)、圖9(NicNbdCe與Nb0.6556C1.3444)、與圖10(NicNbdCe與Nb0.6556C1.3444)所示,橫軸為相對於可逆氫電極(RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。如圖8所示,添加適量Ni的Nb2N2觸媒(即NiaNbbN2)活性明顯提升。如圖9與10所示,添加適量Ni的NbC觸媒(即NicNbdCe觸媒)的活性可大幅提升。部份觸媒的比較如表5所 示: The OER electrochemical activity test was performed on the Pt, Ni a Nb b N 2 , Ni c Nb d C e , and Nb 0.6556 C 1.3444 catalysts as follows. In a 0.1 MKOH solution, Pt, Ni a Nb b N 2 , Ni c Nb d C e , and a glass carbon electrode formed with a Nb 0.6556 C 1.3444 catalyst were used as working electrodes. Take Hg / HgO as the reference electrode, rotate the working electrode at 1600 rpm, and take platinum as the auxiliary electrode. Scanning voltage range: -0.8 ~ 1V, scanning speed is 50mV / s, and scanning times are 10 times. Then perform CER measurement of OER. The scanning voltage range is -0.8 ~ 0.1V, the scanning speed is 10mV / s, and the scanning times are 5 times. The above OER results are shown in Fig. 8 (Ni a Nb b N 2 ), Fig. 9 (Ni c Nb d C e and Nb 0.6556 C 1.3444 ), and Fig. 10 (Ni c Nb d C e and Nb 0.6556 C 1.3444 ), The horizontal axis is the potential (V) with respect to the reversible hydrogen electrode (RHE), and the vertical axis is the current density (J, mA / cm 2 ). As shown in FIG. 8, the activity of the Nb 2 N 2 catalyst (that is, Ni a Nb b N 2 ) added with an appropriate amount of Ni is significantly improved. As shown in FIGS. 9 and 10, the activity of the NbC catalyst (ie, the Ni c Nb d C e catalyst) added with an appropriate amount of Ni can be greatly improved. The comparison of some catalysts is shown in Table 5:

由表5可知,OER中的Ni1.5Nb0.5N2與Ni1.62Nb0.37C0.39觸媒的電流密度,均高於鉑膜觸媒的電流密度。換言之,Ni1.5Nb0.5N2與Ni1.62Nb0.37C0.39比鉑膜觸媒更適用於OER。 As can be seen from Table 5, the current densities of the Ni 1.5 Nb 0.5 N 2 and Ni 1.62 Nb 0.37 C 0.39 catalysts in the OER are higher than those of the platinum film catalysts. In other words, Ni 1.5 Nb 0.5 N 2 and Ni 1.62 Nb 0.37 C 0.39 are more suitable for OER than platinum film catalysts.

製備例8 Preparation Example 8

採用反應磁控濺鍍機台,在玻璃碳電極(5mm OD×4mm H)上分別沉積不同元素比例的CocNbdCe觸媒。將Co靶材、Nb靶材、與碳靶材置入濺鍍機台中,調整施加至Co靶材的功率(30-100W之間)、Nb靶材的功率(35W)與碳靶材的功率(100W),並將氬氣(10sccm)通入機台,且機台內的壓力為5mTorr。以氬離子撞擊Co靶材、Nb靶材、與碳靶材,於室溫下進行反應式濺鍍10至15分鐘,以形成膜厚約100nm的CocNbdCe觸媒於玻璃碳電極上,觸媒披覆量為0.017mg。由EDS分析CocNbdCe觸媒,c介於約0.24至1.39之間,d介於約0.61至1.76之間,而e介於約0.63至3.61之間。由XRD分析CocNbdCe觸媒,其為立方晶系或非晶。 Using a reactive magnetron sputtering machine, Co c Nb d C e catalysts with different element ratios were deposited on glass carbon electrodes (5 mm OD × 4 mm H). Place the Co target, Nb target, and carbon target into the sputtering machine, and adjust the power applied to the Co target (between 30-100W), the power of the Nb target (35W), and the power of the carbon target (100W), and argon gas (10sccm) was passed into the machine, and the pressure inside the machine was 5 mTorr. The Co target, Nb target, and carbon target were impacted with argon ions, and reactive sputtering was performed at room temperature for 10 to 15 minutes to form a Co c Nb d C e catalyst with a film thickness of about 100 nm on a glass carbon electrode. Above, the catalyst coating amount is 0.017 mg. The Co c Nb d C e catalyst was analyzed by EDS. C was between about 0.24 and 1.39, d was between about 0.61 and 1.76, and e was between about 0.63 and 3.61. The Co c Nb d C e catalyst was analyzed by XRD, and it was cubic or amorphous.

實施例6 Example 6

將上述CocNbdCe與Nb0.6556C1.3444觸媒,進行OER電化學活性測試如下。在0.1MKOH溶液中,分別取CocNbdCe與 Nb0.6556C1.3444觸媒形成其上的玻璃碳電極作為工作電極。取Hg/HgO作為參考電極,工作電極的轉速為1600rpm,並取鉑作為輔助電極。掃瞄電壓範圍:-0.8~1V,掃描速度為50mV/s,掃瞄次數為10次。接著進行OER之CV量測,掃瞄電壓範圍:-0.8~0.1V,掃描速度為10mV/s,且掃瞄次數為5次。上述OER結果如圖11至圖15(CocNbdCe與Nb0.6556C1.3444)所示,橫軸為相對於可逆氫電極(RHE)的電位(V),縱軸為電流密度(J,mA/cm2)。如圖11至圖15所示,添加適量Co的NbdCc觸媒(即CocNbdCe)活性明顯提升。 The above Co c Nb d C e and Nb 0.6556 C 1.3444 catalysts were tested for OER electrochemical activity as follows. In a 0.1MKOH solution, glass carbon electrodes formed by Co c Nb d C e and Nb 0.6556 C 1.3444 catalysts were used as working electrodes. Take Hg / HgO as the reference electrode, rotate the working electrode at 1600 rpm, and take platinum as the auxiliary electrode. Scanning voltage range: -0.8 ~ 1V, scanning speed is 50mV / s, and scanning times are 10 times. Then perform CER measurement of OER. The scanning voltage range is -0.8 ~ 0.1V, the scanning speed is 10mV / s, and the scanning times are 5 times. The above OER results are shown in Figs. 11 to 15 (Co c Nb d C e and Nb 0.6556 C 1.3444 ). The horizontal axis is the potential (V) relative to the reversible hydrogen electrode (RHE), and the vertical axis is the current density (J, mA / cm 2 ). As shown in FIG. 11 to FIG. 15, the activity of the Nb d C c catalyst (that is, Co c Nb d C e ) added with an appropriate amount of Co was significantly improved.

製備例9 Preparation Example 9

採用反應磁控濺鍍機台,在不鏽鋼網(316不銹鋼,200mesh 50mm×50mm)上沉積Ni1.5Nb0.5N2觸媒。將Ni靶材與Nb靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10-200W)與Nb靶材的功率(10-200W),並將氮氣與氬氣(流速為10sccm)通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材與Nb靶材,於室溫下進行反應式濺鍍8分鐘,以形成膜厚約300nm的Ni1.5Nb0.5N2觸媒(由EDS確認)於不鏽鋼網上,單位面積的觸媒披覆量為0.17mg/cm2。由XRD分析Ni1.5Nb0.5N2觸媒,其為立方晶系。 A reactive magnetron sputtering machine was used to deposit a Ni 1.5 Nb 0.5 N 2 catalyst on a stainless steel mesh (316 stainless steel, 200 mesh 50 mm × 50 mm). Put the Ni target and Nb target into the sputtering machine, adjust the power applied to the Ni target (10-200W) and the power of the Nb target (10-200W), and nitrogen and argon (flow rate is 10 sccm) ) Into the machine, nitrogen / (argon + nitrogen) = 50%, and the pressure in the machine is 5mTorr. Ni target and Nb target were impacted with argon ions, and reactive sputtering was performed at room temperature for 8 minutes to form a Ni 1.5 Nb 0.5 N 2 catalyst (confirmed by EDS) with a film thickness of about 300 nm on a stainless steel net. The area covered by the catalyst was 0.17 mg / cm 2 . The Ni 1.5 Nb 0.5 N 2 catalyst was analyzed by XRD, and it was a cubic crystal system.

實施例7 Example 7

取市售之PtC(HISPEC 13100,Johnson Matthey)塗佈於H23C8(Freudenberg)碳紙上作為HER的陰極,陰極觸媒的單位面積披覆量控制為1.8mg/cm2。取製備例9之Ni1.5Nb0.5N2-不鏽鋼網作為OER的陽極,並將陰離子交換膜X37-50(購自Dioxide Materials)夾設於陰極與陽極的觸媒層之間,以形成膜電極組。將膜電極組浸置於2M的KOH溶液中,進行電化學活性測試如下。掃瞄電壓範圍:1.3~2.2V,掃描速度為50mV/s。上述膜電極組的電流-電壓曲線如圖16所示,在2V時可產生10.2A的電流,整個測試系統的阻抗為27mΩ。上述膜電極組的每分鐘衰變率為0.001%。 A commercially available PtC (HISPEC 13100, Johnson Matthey) was coated on H23C8 (Freudenberg) carbon paper as a cathode of HER, and the coating amount per unit area of the cathode catalyst was controlled to 1.8 mg / cm 2 . Take Ni 1.5 Nb 0.5 N 2 -stainless steel mesh of Preparation Example 9 as the anode of OER, and sandwich an anion exchange membrane X37-50 (purchased from Dioxide Materials) between the cathode and the catalyst layer of the anode to form a membrane electrode group. The membrane electrode group was immersed in a 2M KOH solution, and the electrochemical activity test was performed as follows. Scanning voltage range: 1.3 ~ 2.2V, scanning speed is 50mV / s. The current-voltage curve of the above-mentioned membrane electrode group is shown in Fig. 16. At 2V, a current of 10.2A can be generated, and the impedance of the entire test system is 27mΩ. The above-mentioned membrane electrode group has a decay rate per minute of 0.001%.

製備例10 Preparation Example 10

採用反應磁控濺鍍機台,在不鏽鋼網(316不銹鋼,200mesh 50mm×50mm)上沉積Ni1.62Nb0.37C0.39觸媒。將Ni靶材、Nb靶材、與碳靶材置入濺鍍機台中,調整施加至Ni靶材的功率(10-200W)、Nb靶材的功率(10-200W)、與碳靶材的功率(10-200W),並將氬氣(流速為10sccm)通入機台,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材、Nb靶材、與碳靶材,於室溫下進行反應式濺鍍8分鐘,以形成膜厚約300nm的Ni1.62Nb0.37C0.39觸媒(由EDS確認)於不鏽鋼網上,單位面積的觸媒披覆量為0.17mg/cm2。由XRD分析Ni1.62Nb0.37C0.39觸媒,其為立方晶系或非晶。 A reactive magnetron sputtering machine was used to deposit Ni 1.62 Nb 0.37 C 0.39 catalyst on a stainless steel mesh (316 stainless steel, 200 mesh 50 mm × 50 mm). Put the Ni target, Nb target, and carbon target into the sputtering machine, and adjust the power applied to the Ni target (10-200W), the power of the Nb target (10-200W), and the carbon target. Power (10-200W), and argon gas (flow rate: 10 sccm) is passed into the machine, and the pressure in the machine is 5mTorr. Ni target, Nb target, and carbon target were impacted with argon ions, and reactive sputtering was performed at room temperature for 8 minutes to form a Ni 1.62 Nb 0.37 C 0.39 catalyst (confirmed by EDS) with a film thickness of about 300 nm. On the stainless steel net, the catalyst coating amount per unit area was 0.17 mg / cm 2 . XRD analysis of Ni 1.62 Nb 0.37 C 0.39 catalyst, which is cubic or amorphous.

實施例8 Example 8

取市售之PtC(HISPEC 13100,Johnson Matthey)塗佈於H23C8(Freudenberg)碳紙上作為HER的陰極,陰極觸媒的單位面積披覆量控制為1.8mg/cm2,製備例10之Ni1.62Nb0.37C0.39-不鏽鋼網作為OER的陽極,並將陰離子交換膜X37-50(購自Dioxide Materials)夾設於陰極與陽極的觸媒層之間,以形成膜電極組。將膜電極組浸置於2M的KOH溶液中,進行電化學活 性測試如下。掃瞄電壓範圍:1.3~2.2V,掃描速度為50mV/s。上述膜電極組的電流-電壓曲線如圖17所示,在2V時可產生10.2A的電流,整個測試系統的阻抗為33mΩ。上述膜電極組的每分鐘衰變率為0.02%。 A commercially available PtC (HISPEC 13100, Johnson Matthey) was coated on H23C8 (Freudenberg) carbon paper as a cathode of HER. The coating amount per unit area of the cathode catalyst was controlled to 1.8 mg / cm 2 , and Ni 1.62 Nb in Preparation Example 10 0.37 C 0.39 -The stainless steel mesh is used as the anode of the OER, and an anion exchange membrane X37-50 (purchased from Dioxide Materials) is sandwiched between the cathode and the catalyst layer of the anode to form a membrane electrode group. The membrane electrode group was immersed in a 2M KOH solution, and the electrochemical activity test was performed as follows. Scanning voltage range: 1.3 ~ 2.2V, scanning speed is 50mV / s. The current-voltage curve of the above-mentioned membrane electrode group is shown in FIG. 17. At 2V, a current of 10.2A can be generated, and the impedance of the entire test system is 33mΩ. The above-mentioned membrane electrode group has a decay rate per minute of 0.02%.

比較例1 Comparative Example 1

取市售的PtC(HISPEC 13100,Johnson Matthey)塗佈於H23C8(Freudenberg)碳紙上作為HER的陰極,陰極觸媒的單位面積披覆量控制為1.8mg/cm2,市售之DSA不溶性陽極(IrO2/RuO2-Ti mesh,佳榮能源科技股份有限公司)作為OER的陽極,並將陰離子交換膜X37-50(購自Dioxide Materials)夾設於陰極與陽極的觸媒層之間,以形成膜電極組。將膜電極組浸置於2M的KOH溶液中,進行電化學活性測試如下。掃瞄電壓範圍:1.3~2.2V,掃描速度為50mV/s。上述膜電極組的電流-電壓曲線如圖18所示,在2V時可產生10.6A,整個測試系統的阻抗為40mΩ。上述膜電極組的每分鐘衰變率為0.0087%。 A commercially available PtC (HISPEC 13100, Johnson Matthey) was coated on H23C8 (Freudenberg) carbon paper as the cathode of the HER. The coverage per unit area of the cathode catalyst was controlled to 1.8 mg / cm 2. A commercially available DSA insoluble anode ( IrO 2 / RuO 2 -Ti mesh (Jiarong Energy Technology Co., Ltd.) as the anode of OER, and an anion exchange membrane X37-50 (purchased from Dioxide Materials) is sandwiched between the cathode and the catalyst A membrane electrode group is formed. The membrane electrode group was immersed in a 2M KOH solution, and the electrochemical activity test was performed as follows. Scanning voltage range: 1.3 ~ 2.2V, scanning speed is 50mV / s. The current-voltage curve of the above membrane electrode group is shown in FIG. 18, which can generate 10.6A at 2V, and the impedance of the entire test system is 40mΩ. The above-mentioned membrane electrode group has a decay rate per minute of 0.0087%.

實施例7、實施例8、與比較例1的膜電極組比較如表6所示: Example 7 and Example 8 are compared with the membrane electrode group of Comparative Example 1 as shown in Table 6.

由表6可知,實施例的Ni1.5Nb0.5N2觸媒與 Ni1.62Nb0.37C0.39觸媒的活性,遠高於市售的陽極觸媒的活性。 It can be seen from Table 6 that the activities of the Ni 1.5 Nb 0.5 N 2 catalyst and Ni 1.62 Nb 0.37 C 0.39 catalyst in the examples are much higher than those of the commercially available anode catalysts.

製備例11 Preparation Example 11

採用反應磁控濺鍍機台,在不鏽鋼網(316不銹鋼,200mesh,50mm×50mm)上沉積Ni0.75Ru1.25N2觸媒。將Ni靶材與Ru靶材置入濺鍍機台中,調整施加至Ni靶材的功率(150W)與Ru靶材的功率(100W),並將氮氣與氬氣通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材與Ru靶材,於室溫下進行反應式濺鍍8分鐘,以形成膜厚約300nm的Ni0.75Ru1.25N2觸媒(由EDS確認)於不鏽鋼網上,單位面積的觸媒披覆量為0.17mg/cm2。由SEM分析Ni0.75Ru1.25N2觸媒,其表面形貌為三角錐與四角錐。由XRD分析Ni0.75Ru1.25N2觸媒,其為立方晶系或非晶。 A reactive magnetron sputtering machine was used to deposit a Ni 0.75 Ru 1.25 N 2 catalyst on a stainless steel mesh (316 stainless steel, 200 mesh, 50 mm × 50 mm). Put the Ni target and Ru target into the sputtering machine, adjust the power applied to the Ni target (150W) and the power of the Ru target (100W), and pass nitrogen and argon into the machine. Nitrogen / ( Argon + Nitrogen) = 50%, and the pressure in the machine is 5mTorr. The Ni target and the Ru target were impacted with argon ions, and reactive sputtering was performed at room temperature for 8 minutes to form a Ni 0.75 Ru 1.25 N 2 catalyst (confirmed by EDS) with a thickness of about 300 nm on a stainless steel net. The area covered by the catalyst was 0.17 mg / cm 2 . Ni 0.75 Ru 1.25 N 2 catalyst was analyzed by SEM. Its surface morphology was triangular pyramid and quadrangular pyramid. XRD analysis of Ni 0.75 Ru 1.25 N 2 catalyst, which is cubic or amorphous.

實施例9 Example 9

取製備例11之Ni0.75Ru1.25N2-不鏽鋼網作為HER的陰極,製備例9之Ni1.5Nb0.5N2-不鏽鋼網作為OER的陽極,並將陰離子交換膜X37-50(購自Dioxide Materials)夾設於陰極與陽極的觸媒層之間,以形成膜電極組。將膜電極組浸置於2M的KOH溶液中,進行電化學活性測試如下。掃瞄電壓範圍:1.3~2.2V,掃描速度為50mV/s。上述膜電極組在1.87V時可產生10.5A的電流,整個測試系統的阻抗為12mΩ。上述膜電極組的每分鐘衰變率為0.0057%。 Ni 0.75 Ru 1.25 N 2 -stainless steel mesh of Preparation Example 11 was used as the cathode of HER, Ni 1.5 Nb 0.5 N 2 -stainless steel mesh of Preparation Example 9 was used as the anode of OER, and anion exchange membrane X37-50 (purchased from Dioxide Materials ) Is sandwiched between the cathode and anode catalyst layers to form a membrane electrode group. The membrane electrode group was immersed in a 2M KOH solution, and the electrochemical activity test was performed as follows. Scanning voltage range: 1.3 ~ 2.2V, scanning speed is 50mV / s. The above membrane electrode group can generate a current of 10.5A at 1.87V, and the impedance of the entire test system is 12mΩ. The above-mentioned membrane electrode group has a decay rate per minute of 0.0057%.

製備例12 Preparation Example 12

採用反應磁控濺鍍機台,在碳紙H23C8(freudenberg,50mm×50mm)上沉積Ni0.75Ru1.25N2觸媒。將Ni靶材與Ru靶材置 入濺鍍機台中,調整施加至Ni靶材的功率(150W)與Ru靶材的功率(100W),並將氮氣與氬氣通入機台,氮氣/(氬氣+氮氣)=50%,且機台內的壓力為5mTorr。以氬離子撞擊Ni靶材與Ru靶材,於室溫下進行反應式濺鍍8分鐘,以形成膜厚約300nm的Ni0.75Ru1.25N2觸媒(由EDS確認)於碳紙H23C8上,單位面積的觸媒披覆量為0.17mg/cm2。由SEM分析Ni0.75Ru1.25N2觸媒,其表面形貌為三角錐與四角錐。由XRD分析Ni0.75Ru1.25N2觸媒,其為立方晶系或非晶。 A reactive magnetron sputtering machine was used to deposit Ni 0.75 Ru 1.25 N 2 catalyst on carbon paper H23C8 (freudenberg, 50mm × 50mm). Put the Ni target and Ru target into the sputtering machine, adjust the power applied to the Ni target (150W) and the power of the Ru target (100W), and pass nitrogen and argon into the machine. Nitrogen / ( Argon + Nitrogen) = 50%, and the pressure in the machine is 5mTorr. Ni target and Ru target were impacted with argon ions, and reactive sputtering was performed at room temperature for 8 minutes to form a Ni 0.75 Ru 1.25 N 2 catalyst (confirmed by EDS) with a film thickness of about 300 nm on carbon paper H23C8 The catalyst coating amount per unit area was 0.17 mg / cm 2 . Ni 0.75 Ru 1.25 N 2 catalyst was analyzed by SEM. Its surface morphology was triangular pyramid and quadrangular pyramid. XRD analysis of Ni 0.75 Ru 1.25 N 2 catalyst, which is cubic or amorphous.

實施例10 Example 10

取製備例12之Ni0.75Ru1.25N2-碳紙作為HER的陰極,製備例9之Ni1.5Nb0.5N2-不鏽鋼網作為OER的陽極,並將陰離子交換膜X37-50(購自Dioxide Materials)夾設於陰極與陽極的觸媒層之間,以形成膜電極組。將膜電極組浸置於2M的KOH溶液中,進行電化學活性測試如下。掃瞄電壓範圍:1.3~2.2V,掃描速度為50mV/s。上述膜電極組的電流-電壓曲線如圖19所示,在1.96V時可產生10.5A的電流,整個測試系統的阻抗為17mΩ。上述膜電極組的每分鐘衰變率為0.000035%。控制膜電極組的電位為2V並持續操作48小時,其電流穩定如圖20所示。換言之,Ni0.75Ru1.25N2-碳紙可抵抗還原反應,Ni1.5Nb0.5N2-不鏽鋼網可抵抗氧化反應,且Ni0.75Ru1.25N2-碳紙與Ni1.5Nb0.5N2-不鏽鋼網均可抵抗鹼腐蝕。 Take Ni 0.75 Ru 1.25 N 2 -carbon paper of Preparation Example 12 as the cathode of HER, Ni 1.5 Nb 0.5 N 2 -Stainless steel mesh of Preparation Example 9 as the anode of OER, and anion exchange membrane X37-50 (purchased from Dioxide Materials ) Is sandwiched between the cathode and anode catalyst layers to form a membrane electrode group. The membrane electrode group was immersed in a 2M KOH solution, and the electrochemical activity test was performed as follows. Scanning voltage range: 1.3 ~ 2.2V, scanning speed is 50mV / s. The current-voltage curve of the above membrane electrode group is shown in FIG. 19, and a current of 10.5A can be generated at 1.96V, and the impedance of the entire test system is 17mΩ. The above-mentioned membrane electrode group has a decay rate per minute of 0.000035%. The potential of the membrane electrode group was controlled to be 2V and the operation was continued for 48 hours, and the current was stable as shown in FIG. 20. In other words, Ni 0.75 Ru 1.25 N 2 -carbon paper can resist reduction reaction, Ni 1.5 Nb 0.5 N 2 -stainless steel mesh can resist oxidation reaction, and Ni 0.75 Ru 1.25 N 2 -carbon paper and Ni 1.5 Nb 0.5 N 2 -stainless steel mesh Can resist alkali corrosion.

實施例7、實施例9、與實施例10的膜電極組比較如表7所示:表7 Example 7 and Example 9 are compared with the membrane electrode group of Example 10 as shown in Table 7: Table 7

由表7可知,陰極的觸媒層採用Ni0.75Ru1.25N2觸媒可大幅提高觸媒活性。此外,陰極的Ni0.75Ru1.25N2觸媒形成於碳紙上時,可進一步改善膜電極組的耐久性。 As can be seen from Table 7, the use of Ni 0.75 Ru 1.25 N 2 catalyst in the catalyst layer of the cathode can greatly improve the catalyst activity. In addition, when the cathode Ni 0.75 Ru 1.25 N 2 catalyst is formed on carbon paper, the durability of the membrane electrode group can be further improved.

雖然本揭露已以數個實施例揭露如上,然其並非用以限定本揭露,任何本技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作任意之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present disclosure has been disclosed above in several embodiments, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the technical field can make any changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of this disclosure shall be determined by the scope of the appended patent application.

Claims (13)

一種膜電極組,包括:一陽極,包括一第一觸媒層於一第一氣液擴散層上;一陰極,包括一第二觸媒層於一第二氣液擴散層上;以及一陰離子交換膜,夾設於該陽極的該第一觸媒層與該陰極的該第二觸媒層之間,其中該第一觸媒層的化學結構為M’aM”bN2或M’cM”dCe,其中M’為Ni或Co,M”為Nb,0.7a1.7,0.3b1.3,a+b=2,0.24c1.7,0.3d1.76,且0.38e3.61,其中M’aM”bN2為立方晶系,且M’cM”dCe為立方晶系或非晶,以及其中該第二觸媒層的化學結構為MxRuyN2或MxRuy,其中M為Ni或Mn,0<x<1.3,0.7<y<2,x+y=2,MxRuyN2為立方晶系或非晶,且MxRuy為立方晶系。A membrane electrode group includes: an anode including a first catalyst layer on a first gas-liquid diffusion layer; a cathode including a second catalyst layer on a second gas-liquid diffusion layer; and an anion An exchange membrane is sandwiched between the first catalyst layer of the anode and the second catalyst layer of the cathode, wherein the chemical structure of the first catalyst layer is M ' a M " b N 2 or M' c M ” d C e , where M ′ is Ni or Co, M” is Nb, 0.7 a 1.7, 0.3 b 1.3, a + b = 2, 0.24 c 1.7, 0.3 d 1.76 and 0.38 e 3.61, where M ' a M ” b N 2 is cubic, and M ′ c M” d C e is cubic or amorphous, and wherein the chemical structure of the second catalyst layer is M x Ru y N 2 or M x Ru y , where M is Ni or Mn, 0 <x <1.3, 0.7 <y <2, x + y = 2, M x Ru y N 2 is cubic or amorphous, and M x Ru y is a cubic crystal system. 如申請專利範圍第1項所述之膜電極組,係浸置於一鹼性水溶液中。The membrane electrode group described in item 1 of the scope of patent application is immersed in an alkaline aqueous solution. 如申請專利範圍第1項所述之膜電極組,其中該第一觸媒層的化學結構為NiaNbbN2,0.7a1.51,且0.49b1.30。The membrane electrode group according to item 1 of the scope of patent application, wherein the chemical structure of the first catalyst layer is Ni a Nb b N 2 , 0.7 a 1.51, and 0.49 b 1.30. 如申請專利範圍第1項所述之膜電極組,其中該第一觸媒層的化學結構為NicNbdCe,0.90c1.47,0.53d1.10,且0.9e1.9。The membrane electrode group according to item 1 of the scope of patent application, wherein the chemical structure of the first catalyst layer is Ni c Nb d C e , 0.90 c 1.47, 0.53 d 1.10 and 0.9 e 1.9. 如申請專利範圍第1項所述之膜電極組,其中該第一觸媒層的化學結構為NicNbdCe,0.74c1.63,0.37d1.26,且0.38e1.30。The membrane electrode group according to item 1 of the scope of patent application, wherein the chemical structure of the first catalyst layer is Ni c Nb d C e , 0.74 c 1.63, 0.37 d 1.26 and 0.38 e 1.30. 如申請專利範圍第1項所述之膜電極組,其中該第一觸媒層的化學結構為CocNbdCe,0.24c1.39,0.61d1.76,且0.63e3.61。The membrane electrode group according to item 1 of the scope of patent application, wherein the chemical structure of the first catalyst layer is Co c Nb d C e , 0.24 c 1.39, 0.61 d 1.76 and 0.63 e 3.61. 如申請專利範圍第1項所述之膜電極組,其中該第一氣液擴散層與該第二氣液擴散層各自包括多孔導電層。The membrane electrode group according to item 1 of the patent application scope, wherein each of the first gas-liquid diffusion layer and the second gas-liquid diffusion layer includes a porous conductive layer. 如申請專利範圍第1項所述之膜電極組,其中該第一氣液擴散層為金屬網,而該第二氣液擴散層為金屬網或碳紙。The membrane electrode assembly according to item 1 of the scope of the patent application, wherein the first gas-liquid diffusion layer is a metal mesh and the second gas-liquid diffusion layer is a metal mesh or carbon paper. 如申請專利範圍第7項所述之膜電極組,其中該第一氣液擴散層的孔徑介於40微米至150微米之間,而該第二氣液擴散層的孔徑介於0.5微米至5微米之間。The membrane electrode assembly according to item 7 of the application, wherein the pore diameter of the first gas-liquid diffusion layer is between 40 microns and 150 microns, and the pore diameter of the second gas-liquid diffusion layer is between 0.5 microns and 5 Between micrometers. 一種電解產氫的方法,包括:將一膜電極組浸置於一鹼性水溶液中,其中該膜電極組包括:一陽極,包括一第一觸媒層於一第一氣液擴散層上;一陰極,包括一第二觸媒層於一第二氣液擴散層上;以及一陰離子交換膜,夾設於該陽極的該第一觸媒層與該陰極的該第二觸媒層之間,其中該第一觸媒層的化學結構為M’aM”bN2或M’cM”dCe,其中M’為Ni或Co,M”為Nb,0.7a1.7,0.3b1.3,a+b=2,0.24c1.7,0.3d1.76,且0.38e3.61,其中M’aM”bN2為立方晶系,且M’cM”dCe為立方晶系或非晶,以及其中該第二觸媒層的化學結構為MxRuyN2或MxRuy,其中M為Ni或Mn,0<x<1.3,0.7<y<2,x+y=2,MxRuyN2為立方晶系或非晶,且MxRuy為立方晶系;以及施加一電位至該陽極與該陰極以電解該鹼性水溶液,使該陰極產生氫氣,並使該陽極產生氧氣。A method for electrolytic hydrogen production, comprising: immersing a membrane electrode group in an alkaline aqueous solution, wherein the membrane electrode group includes: an anode including a first catalyst layer on a first gas-liquid diffusion layer; A cathode includes a second catalyst layer on a second gas-liquid diffusion layer; and an anion exchange membrane sandwiched between the first catalyst layer of the anode and the second catalyst layer of the cathode , Wherein the chemical structure of the first catalyst layer is M ' a M " b N 2 or M' c M" d C e , where M 'is Ni or Co, and M "is Nb, 0.7 a 1.7, 0.3 b 1.3, a + b = 2, 0.24 c 1.7, 0.3 d 1.76 and 0.38 e 3.61, where M ' a M ” b N 2 is cubic, and M ′ c M” d C e is cubic or amorphous, and wherein the chemical structure of the second catalyst layer is M x Ru y N 2 or M x Ru y , where M is Ni or Mn, 0 <x <1.3, 0.7 <y <2, x + y = 2, M x Ru y N 2 is cubic or amorphous, and M x Ru y is a cubic crystal system; and a potential is applied to the anode and the cathode to electrolyze the alkaline aqueous solution so that the cathode generates hydrogen and the anode generates oxygen. 如申請專利範圍第10項所述之電解產氫的方法,其中該第一氣液擴散層與該第二氣液擴散層各自包括多孔導電層。The method for electrolytic hydrogen production according to item 10 of the application, wherein the first gas-liquid diffusion layer and the second gas-liquid diffusion layer each include a porous conductive layer. 如申請專利範圍第10項所述之電解產氫的方法,其中該第一氣液擴散層為金屬網,而該第二氣液擴散層為金屬網或碳紙。According to the method of electrolytic hydrogen production described in item 10 of the scope of the patent application, wherein the first gas-liquid diffusion layer is a metal mesh and the second gas-liquid diffusion layer is a metal mesh or carbon paper. 如申請專利範圍第10項所述之電解產氫的方法,其中該第一氣液擴散層的孔徑介於40微米至150微米之間,而該第二氣液擴散層的孔徑介於0.5微米至5微米之間。The method for electrolytic hydrogen production according to item 10 of the application, wherein the pore diameter of the first gas-liquid diffusion layer is between 40 microns and 150 microns, and the pore diameter of the second gas-liquid diffusion layer is between 0.5 microns To 5 microns.
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