TWI677048B - Substrate holding device and substrate inspection device - Google Patents

Abstract

An object of the present invention is to provide a device and a method for holding a substrate by correcting the warpage and bending of a substrate that is warped and warped, even if the outer area of the substrate to be processed is relatively narrow.

The invention relates to a substrate holding device, which is a substrate holding device, and includes: a frame body having an opening larger than a processing target area set on a substrate; and a guide portion supporting at least 3 points outside the processing target area; The positioning and holding portion is positioned and held by pressing the outer edge of the substrate from the outside to the inside from at least 3 directions; and the guide portion and the positioning and holding portion are disposed so as to surround the outer edge of the substrate, respectively. The contact portion is inclined toward the inside of the substrate throughout the upper end portion and the lower end portion.

Description

Substrate holding device and substrate inspection device

The present invention relates to a substrate holding device for processing a substrate (for example, applying a film, exposing, developing, etching, processing, etc., or inspecting a substrate or positioning a substrate) to a substrate. In particular, the present invention relates to a holding device and method that allow only a substrate that is in contact with and held on the outside of the processing target area that is set inside the substrate, that is, the outer periphery of the substrate, and a substrate inspection device including the same.

According to the previous, in a silicon wafer defect inspection device, it is held by a wafer mounting table that supports a tapered portion provided at the edge of the wafer or an edge portion (that is, the outer periphery of the substrate) that does not affect the defect inspection range ( For example, Patent Document 1).

In addition, in a device for inspecting defects, dirt, and the like on a surface of a semiconductor wafer, a glass substrate, and the like, a plurality of fixed restricting members, a plurality of movable restricting members arranged opposite to each other, and a negative pressure are used to attract the outer peripheral portion of the substrate. The suction mechanism on the lower surface holds the substrate (for example, Patent Document 2).

Furthermore, in a device for inspecting the front and back of a silicon wafer, a technology has been proposed in which a robot arm having a guide roller is used to hold the outer periphery of the wafer, and the wafer can be prevented from bending due to its own weight by setting the wafer to a vertical state For example, Patent Document 3).

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-8392

[Patent Document 2] Japanese Patent Laid-Open No. 2003-27155

[Patent Document 3] Japanese Unexamined Patent Publication No. 11-219990

However, in the case of the prior art, since the holding of the flat substrate is a prerequisite, it is impossible to perform a desired treatment on a substrate that is liable to warp and bend.

For example, in the technology of Patent Document 1, if a substrate that is prone to warping and bending is placed, any one of the substrate end portions will float, and the substrate may be shifted or detached from the placement table when it is moved. .

On the other hand, in the technique of Patent Document 2, if a substrate that is prone to warping and bending is placed, any one of the outer peripheral portions will float, and a gap will be generated to prevent adsorption. If a wide range is required for adsorption, interference with the inspection target area may occur.

On the other hand, in the technique of Patent Document 3, even if it is possible to prevent the substrate from being bent due to its own weight, it is not possible to correct the substrate that has warped and warped from the beginning.

Therefore, an object of the present invention is to provide a device and a method for holding a substrate while correcting the warpage and bending of a substrate that has warped and bent, even if the outer region of the substrate to be processed is relatively narrow.

In order to solve the above problems, an aspect of the present invention is a substrate holding device, which is a substrate holding device, and includes: a guide portion that supports at least 3 points outside the processing target area set on the substrate; the substrate The holding portion is configured to hold the substrate by pressing the outer edge of the substrate from the outside to the inside from at least three directions by the substrate holding member, and the guide portion and the substrate holding member respectively surround the outer edge of the substrate. It is arranged that the substrate holding member has a position where the outer edge of the substrate is restricted in a vertical direction. Position restriction section.

In another aspect of the present invention, a substrate holding method is a method for holding a substrate, and using at least three guide portions arranged to surround the outer edge of the substrate, while making the outer edge of the substrate Along the inner side surface of the guide portion, the outer edge of the substrate or the lower surface portion of the outer edge is brought close to contact the lower end portion of the guide portion, and is arranged so as to surround the outer edge of the substrate and is in contact with the substrate. The portion in contact with the outer edge is a member inclined toward the inner side of the substrate throughout the upper end portion and the lower end portion, and is pressed inward from the outer side of the outer edge of the substrate from at least 3 directions.

According to these aspects, when the substrate is pressed near the outer edge of the substrate, the inclined upper end of the substrate holding member is not as close as the lower end to approach the substrate to correct warping and bending of the outer edge of the substrate.

Furthermore, another aspect of the present invention is a substrate inspection apparatus including a substrate holding device including a frame body having an opening larger than a processing target area set on the substrate, and The guide portion and the substrate holding portion are connected via the frame; the illumination portion irradiates illumination light to an inspection target portion set on the substrate; an imaging portion that photographs the inspection target portion set on the substrate; and an inspection portion that The inspection target site is inspected based on an image captured by the imaging unit; and the illumination unit and the imaging unit are disposed to face each other with the inspection target site interposed therebetween.

According to this aspect, when the substrate holding portion approaches and presses the outer edge of the substrate, the inclined upper end portion and the lower end portion of the substrate holding portion are approached to correct warping and bending of the outer edge of the substrate. Then, the substrate is held in this state, and a specific inspection is performed.

Correction can be performed even if the outer area of the outer periphery of the substrate that can be processed is narrow The substrate is held by warping and bending of the substrate where warpage and bending occur.

1‧‧‧ substrate holding device (for round substrate)

1A‧‧‧ substrate holding device (for round substrate)

1B‧‧‧ substrate holding device (for rectangular substrate)

2‧‧‧ frame

2B‧‧‧Frame

3‧‧‧Guide

3A‧‧‧Guide

3B‧‧‧Guide

4‧‧‧ substrate holding section

4B‧‧‧ substrate holding section

20‧‧‧ opening

21‧‧‧Frame Department

30‧‧‧Guide body

31‧‧‧ the upper end of the guide

32‧‧‧Guide body

33‧‧‧ inside side of guide

34‧‧‧ the lower end of the guide

35‧‧‧ The part where the guide is in contact with the outer edge of the substrate

40‧‧‧ substrate holding member

41‧‧‧ Upper end of substrate holding member

42‧‧‧ bottom end of substrate holding member

43‧‧‧ Inside surface of substrate holding member

45‧‧‧ The part where the substrate holding member is in contact with the outer edge of the substrate

50‧‧‧ Positioning reference side reciprocating mechanism

51‧‧‧Standby position

52‧‧‧ reference position

53‧‧‧arrow (direction of reciprocating movement)

54‧‧‧Mechanical brake

55‧‧‧ Positioning and pressing side reciprocating mechanism

56‧‧‧Standby position

57‧‧‧ substrate pressing position

58‧‧‧ Arrow (direction of reciprocating movement)

90‧‧‧ substrate inspection device

91‧‧‧Lighting Department

92‧‧‧ Camera Department

93‧‧‧ Inspection Department

94‧‧‧illumination light (through illumination light)

95‧‧‧ Inspection target site

96‧‧‧ Light after passing through the subject

W‧‧‧ substrate (processing object, round)

We‧‧‧ outer edge of substrate

Wfc‧‧‧ Orientation Plane

Wi‧‧‧ substrate (inspection object)

Wp‧‧‧Processing area

Wq‧‧‧ Inspection target area

Wr‧‧‧ substrate (processing object, rectangular)

Wr1‧‧‧the first reference edge of the substrate

Wr2‧‧‧The second reference edge of the substrate

FIG. 1 is a perspective view showing the overall configuration of an example of a form embodying the present invention.

Fig. 2 is a cross-sectional view showing an example of an embodiment embodying the present invention.

Fig. 3 is a cross-sectional view of a main part showing an example of a form embodying the present invention.

Fig. 4 is a plan view showing another example of the embodiment embodying the present invention.

FIG. 5 is a plan view showing the overall structure of a further embodiment of the embodiment embodying the present invention.

6 (a) to (n) are perspective views showing a modified example of the guide portion.

FIG. 7 is a schematic diagram showing the overall configuration of an example of another embodiment embodying the present invention.

Hereinafter, specific embodiments for implementing the present invention will be described using drawings.

In each figure, the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is a horizontal plane, and the Z direction is a vertical direction. The Z direction is indicated by setting the direction of the arrow to the up and the opposite direction to the down.

In the following description, a circular silicon wafer (hereinafter, simply referred to as a substrate W) is exemplified as an example of a substrate that is a specific processing target. In addition, a concave portion and a flat portion called a notch and an orientation surface exist in a part of the outer edge of the substrate W.

FIG. 1 is a perspective view showing the overall configuration of an example of a form embodying the present invention.

The substrate holding device 1 of the present invention is configured to include a frame body 2, a guide portion 3, and a substrate holding portion 4. The substrate holding device 1 is a substrate W to be held by a human hand, a transfer robot, or the like to maintain a certain posture. Furthermore, even if the substrate holding device 1 is moved or stationary during processing, the substrate holding device 1 can be continuously held in such a manner that the substrate W is not accidentally shifted or dropped off, and the holder is released after completing the designated processing.

The housing 2 is used to hold the substrate W in a fixed posture, and is used for installation. A member such as a guide 3 described later is mounted. The housing 2 is provided with an opening portion 20 having the outer edge We of the substrate W or the outer edge of the processing target region Wp provided on the substrate W as an inner edge, and is configured to allow specific processing of the substrate W. . In FIG. 1, the upper and lower surfaces of the frame body 2 are shown in a state of being arranged approximately horizontally.

When the substrate W is placed on the substrate holding device 1, the guide portion 3 restricts the position in the horizontal direction so that the outer edge We of the substrate W is contained within a specific range, and restricts the position of the outer edge We of the substrate W above and below. Positioner. The guide portion 3 is configured to support at least three points outside the processing target region Wp of the substrate W. Furthermore, the guide part 3 is arrange | positioned so that the outer edge We of the board | substrate W may be enclosed, and is attached to the housing 2. In FIG. 1, the state where the guide part 3 is arrange | positioned in the state which surrounds the outer edge We of the board | substrate W is shown in 4 places.

Specifically, the guide portion 3 has a substantially L-shaped outer shape, and includes a member supporting the outer edge We or the outer surface of the lower edge of the substrate W from below, and a member extending vertically above. Furthermore, the upper end of the member extending vertically above is referred to as the upper end portion 31 of the guide; and the member from the outer edge We of the support substrate W or the lower surface portion of the outer edge is referred to as the lower end of the guide portion 34; the upper end portion 31 of the guide portion and the lower end portion 34 of the guide portion are referred to as a guide body portion 32; and the side surface on the substrate W side of the guide body portion 32 is referred to as an inner side surface 33 of the guide portion. It should be noted that the lower end portion 34 of the guide portion is disposed so as to face the inside of the substrate W.

A specific interval (so-called gap) is set between the inner side surface 33 of each guide portion and the outer edge We of the substrate W. The lower end portion 34 of the guide portion is disposed on the inner side of the substrate W from the outer edge We of the substrate W in the horizontal direction and on the outside of the processing target region Wp of the substrate W. The lower end portion 34 of each guide portion is viewed from above and below, and the portions that are in contact with the upper surface or the outer edge We of the substrate W are arranged substantially on the same horizontal plane (that is, the surface parallel to the upper and lower surfaces of the frame 2). It also has a function of restricting the position in the vertical direction so that the substrate W does not move further downward.

Therefore, even if warping and bending occur on the substrate W, the It is important that the guide portion 3 is supported outside the processing target region Wp of the substrate W by at least three points of the guide portions 3 arranged in four places.

FIG. 2 is a cross-sectional view showing an example of a specific embodiment of the present invention, and shows a cross-sectional view of each part of the substrate holding device 1 shown in FIG. 1 as viewed from the y direction.

FIG. 3 is a cross-sectional view of a main part showing an example of the embodiment embodying the present invention, showing details of the positional relationship between one of the substrate holding portions 4 and the outer edge We of the substrate W of the present invention.

The substrate holding unit 4 holds the outer edge We of the substrate W at a predetermined position in order to perform a specific process after the substrate W is placed on the substrate holding device 1. Further, the substrate holding portion 4 includes a position restricting portion that restricts the outer edge We of the substrate W in a vertical direction.

The position restricting portion may be formed of a substrate holding member 40 having a substantially cylindrical shape and a shape that is recessed toward the outside of the substrate W midway in the vertical direction. The portion 45 of the substrate holding member 40 that contacts the outer edge We of the substrate W extends across the upper end portion 41 and the lower end portion 42 of the substrate holding member, and is inclined toward the inside of the substrate W to become a recessed portion 43 in the middle. In addition, the upper end portion 41 of the substrate holding member 40 is disposed at a position higher than the portion 45 in contact with the outer edge We of the substrate W, and the lower end portion 42 is disposed at a portion 45 more than the portion 45 in contact with the outer edge We of the substrate W. The size and shape are arranged in a lower position in the Z direction.

A plurality of these substrate holding members 40 are arranged in a state surrounding the outer edge We of the substrate W. Furthermore, the substrate holding unit 4 is configured to include a plurality of substrate holding members 40 that are in direct contact with the outer edge We of the substrate W, and a mechanism for moving the substrate holding member 40 (described in detail later). The substrate holding unit 4 is configured to hold the substrate by pressing the outer edge We of the substrate W from the outside to the inside from the plurality of substrate holding members 40 from at least three directions.

In the substrate holding device 1, when the recesses 43 of the substrate holding members 40 are used to hold the substrate W, the outer edge We of the substrate W is restricted to be positioned on the same plane (XY plane in FIGS. 1 to 3). Position in the Z direction, and the upper end portion 41 and the lower end portion 42 of the substrate holding member The design arrangement is such that the substrate W is arranged in a shape outside the processing target region Wp set on the substrate W when the substrate W is held. It should be noted that the same plane as used herein refers to a state in which flatness is ensured to such a degree that a specific process can be performed on the substrate W.

Thereby, even if the substrate W is warped or bent, the substrate holding member 40 can be moved to the inside of the substrate W, and the outer edge We of the substrate W can be restricted to the upper end portion 41 to the lower end of the substrate holding member 40 in the vertical direction. Between the parts 42, the sides restrict the position so as to be concentrated on the center of the recessed part 43. Therefore, the substrate W can be held in the substrate holding portion 4 in a state where the warpage and bending of the substrate W are corrected.

As a mechanism for moving the substrate holding member 40 in the substrate holding portion 4, the following configuration can be exemplified. That is, the configuration includes a positioning reference side reciprocating mechanism 50 and a positioning pressing side reciprocating mechanism 55. The positioning reference side reciprocating mechanism 50 and the positioning pressing side reciprocating mechanism 55 are respectively disposed at positions facing each other across the substrate W, and are respectively mounted on the housing 2. In the form of holding the circular substrate W, a set of a positioning reference side reciprocating mechanism 50 for moving at least two substrate holding members 40 and a positioning pressing side reciprocating mechanism 55 for moving the substrate holding members 40 may be included.

The positioning reference side reciprocating mechanism 50 moves the at least two substrate holding members 40 between the standby position 51 (illustrated by a solid line) and the reference position 52 (illustrated by a dotted line). More specifically, the positioning reference side reciprocating mechanism 50 can be exemplified by an actuator that reciprocates by air pressure, oil pressure, and the like, a rotary motor and a ball bolt that can be controlled from an external device, and a linear motor (so-called electric Actuator) and so on.

In addition, the standby position 51 is a position where the upper end portion 41 of at least two substrate holding members are located outside the outer edge We of the substrate W, respectively. On the other hand, the reference position 52 refers to a position where at least two substrate holding members 40 and the substrate W are in contact with each other when the substrate W is held.

The waiting machine position 51 and the reference position 52 can be set by adjusting the position of the mechanical brake 54 or set as the positioning stop position based on the encoder.

The positioning and pressing side reciprocating mechanism 55 moves the substrate holding member 40 between the standby position 56 (illustrated by a solid line) and the substrate pressing-in position 57 (illustrated by a dotted line). The standby position 56 refers to a position where the upper end portion 41 of the substrate holding member is positioned further outside than the outer edge We of the substrate W. On the other hand, the substrate press-in position 57 is a position where the substrate holding member 40 and the substrate W come into contact with each other when the substrate is held.

The standby position 56 and the substrate press-in position 57 can be set by adjusting the position of a mechanical brake, or set as a positioning stop position based on an encoder.

Due to such a configuration, the substrate holding unit 4 moves the substrate holding member 40 to the standby positions 51 and 56 to a state where the circular substrate W can be placed or taken out, and moves the substrate holding member 40 to the reference position 52. The substrate press-in position 57 may be a state where the outer edge We of the substrate W is held at a predetermined position (that is, a switching operation is performed).

[Variation]

Fig. 4 is a plan view showing another example of the embodiment embodying the present invention.

FIG. 4 shows an example of a substrate holding device 1A that holds a substrate W having a circular outer edge. The substrate holding device 1A is a modification of the substrate holding device 1 described above, and includes six guide portions 3A. These guide portions 3A are arranged in three groups in a combination of two as one in the vicinity of both sides of the substrate holding member 40 arranged at three places. Due to this structure, the substrate holding device 1A can prevent the outer edge We of the substrate W from drooping drastically when holding the thin and easily deformable substrate W, and the substrate holding member 40 can surely sandwich the outer edge We of the substrate W to hold the substrate. W.

[Application example to rectangular substrate]

FIG. 5 is a plan view showing the overall structure of a further embodiment of the embodiment embodying the present invention. FIG. 5 shows an example of a substrate holding device 1B that holds a substrate Wr having a rectangular outer edge. The substrate holding device 1B is configured to include a housing 2B, a guide portion 3B, and a substrate holding portion 4B. This substrate holding device 1B is different from the substrate holding device 1 that holds the above-mentioned circular substrate W, and holds a rectangular substrate Wr. The rectangular substrate Wr is a chamfer applied to identify the direction called the orientation plane Wfc. The long side of the side sandwiching it is called the substrate. The first reference side Wr1 and the short side are referred to as the second reference side Wr2 of the substrate.

In the substrate holding device 1B, the frame 2B, the guide portion 3B, and the substrate holding portion 4B have substantially the same functions as those of the frame 2, the guide portion 3, and the substrate holding portion 4 of the substrate holding device 1 described above, so the same parts are omitted. Explain, but describe the different parts in detail.

The housing 2B is provided with an opening portion 20B having an outer edge of the substrate Wr or an outer edge more than the processing target region Wp provided on the substrate Wr as an inner edge.

The guide part 3B is supported at two places on the first reference sheet Wr1 side of the substrate Wr, one place is supported on the second reference sheet Wr2 side, on the side opposite to the first reference sheet Wr1, and opposite to the second reference sheet Wr2 The sides are arranged so as to support one place each.

The substrate holding portion 4B is configured to have two places on the first reference sheet Wr1 side of the substrate Wr, one of the second reference sheet Wr2 sides, the side opposite to the first reference sheet Wr1, and the second reference sheet Wr2 One of the opposite sides is pressed inward from the outside of the substrate Wr.

The substrate holding portion 4B includes a positioning reference side reciprocating mechanism 50 disposed on the first reference piece Wr1 side of the substrate Wr, and a positioning pressing side reciprocating mechanism 55 disposed on the side opposite to the first reference piece Wr1; The positioning reference side reciprocating mechanism 50B is arranged on the second reference piece Wr2 side of the substrate Wr, and the positioning pressing side reciprocating mechanism 55B is arranged on the side opposite to the second reference piece Wr2.

Due to such a configuration, the substrate holding portion 4B is moved to the standby positions 51 and 56 so that the rectangular substrate Wr can be placed or taken out, and the substrate holding member 40 is moved to the reference. The position 52 and the substrate press-in position 57 can be set to hold the outer edge We of the substrate Wr at a predetermined position (that is, to perform a switching operation).

Furthermore, in the above, it is shown that in order to hold the rectangular substrate Wr, the positioning reference side reciprocating mechanism 50 and 50B and the positioning pressing side reciprocating mechanism 55, which can move the substrate holding member 40 independently of the X direction or the Y direction, are shown. Composition of 55B. However, the form for holding the rectangular substrate Wr is not limited to such a configuration, and may be configured to include a method for moving the substrate holding member 40 to the diagonal direction of the substrate Wr (that is, the XY composite direction). The positioning reference side reciprocating mechanism and the positioning pressing side reciprocating mechanism are constituted.

[Shape of the guide]

FIG. 6 is a perspective view showing a modified example of the guide portion.

In FIGS. 6 (a) to (n), as examples of variations of the guide portion 3 that can be used in the form shown in FIGS. 1 to 5, guide portions 3 a to 3 n of various shapes are exemplified respectively.

More specifically, regarding the guide portion 3a, the guide body portion 32a is set from the lower end surface 34a side of the guide portion to the upper side (that is, the upper end portion 31a side of the guide portion), and the inner side surface 33a of the guide portion is directed to the outside of the substrate W. Slanted shape. The same applies to the guide portions 3b to 3f. In this case, the shapes of such guide portions 3a to 3f are collectively referred to as "outwardly-shaped L-shaped outer shapes." In addition, a portion of the lower end portions 34a to 34f of the guide portion that is in contact with the outer edge We of the substrate is formed in a shape that projects horizontally toward the inside of the substrate.

Furthermore, the shape of the guide portions 3a to 3f is not limited to this. As shown in the guide portions 3g to 3n, a portion of the lower end portions 34g to 34n of the guide portion that is in contact with the outer edge We of the substrate may be set to the substrate. Shapes that slope downward and protrude from the inside, including these are called "outside L-shaped outer shapes." At this time, the lower end portion of the guide portion is inclined downward so that it can be accommodated between the upper end portion 41 and the lower end portion 42 of the substrate holding member when the substrate holding portions 4 and 4B hold the substrates W and Wr. In this way, if the portion of the lower end portion of the guide portion that is in contact with the outer edge We of the substrate is inclined downward, it is preferable to prevent the accumulation of particles.

When implementing the present invention, it is preferable to set the guide portion to an "outwardly L-shaped outer shape". With such a shape, when the substrate W is transferred, the gap between the outer edge We of the substrate and the upper end portion 31 of the guide portion is large at the beginning, but as the substrate W is moved along the inner side surface of the guide portion 33 and approaching the lower end portion 34 of the guide portion, the gap gradually narrows. Then, when the outer edge We of the substrate contacts the lower end portion 34 of the guide portion, there can be no gap or very little gap. Therefore, when the substrate outer edge We is held by the plurality of substrate holding members 40, the positional displacement of the substrate W can be eliminated or the amount of positional displacement can be extremely small.

[Description of holding action]

The operation flow when the substrate is held by the substrate holding device will be described in detail.

The substrate holding section 4 moves the substrate holding member 40 to the standby positions 51 and 56 in advance.

Then, while bringing the outer edge We of the substrate to be processed along the inner surface side of the guide portion 3, the outer edge or the lower surface portion of the outer edge of the substrate is brought close to the lower end portion of the guide portion and brought into contact.

Thereafter, a plurality of substrate holding members 40 arranged so as to surround the outer edge of the substrate are pressed inward from the outside of the substrate outer edge We, respectively. At this time, if the substrate W has a circular arc shape, the substrate holding members 40 press the substrate W from at least three directions. On the other hand, if the substrate W has a rectangular outer edge, the plurality of substrate holding members 40 press at least two places on the first reference side, one place on the second reference side, and opposite sides of the first reference side. 1 on the side and 1 on the side opposite to the second reference side.

[Application to substrates of other shapes]

In the above, the case where the outer edge is a circular-arc-shaped substrate W and the outer edge is a rectangular-shaped substrate Wr represents specific examples of the housings 2 and 2B, the guide portions 3 and 3A, and the substrate holding portions 4 and 4B, respectively. However, when the present invention is applied, the shape of the substrate to be processed is not limited to these, and may be other shapes (for example, triangle, hexagon, octagon, oval, etc.). Furthermore, as long as the shape of the outer edges of the substrates is determined, the shape, arrangement, number, etc. of the frame body, the guide portion, and the substrate holding portion may be determined. The arrangement should support at least 3 points of guidance outside the processing target area of the substrate. And includes a substrate holding portion that presses the substrate from the outside to the inside with the substrate holding member 40 from at least three directions.

Furthermore, in the above, the structure including the frame bodies 2 and 2B having an opening larger than the processing target area is exemplified, and these frame bodies 2 and 2B connect the guide portions 3, 3A, 3B and the substrate holding portion. Composition of 4, 4B. With such a structure, specific processing can be performed on the processing target area set on the lower surface of the substrate. However, if the processing from the lower surface of the substrate is not required, and only the processing from the upper surface of the substrate is required, it is not necessary to set a frame with an opening portion, and only the guide portion 3, 3A is made of a plate or the like. And 3B are connected to the substrate holding portions 4 and 4B.

[Application Example to Inspection Device]

FIG. 7 is a schematic diagram showing the overall configuration of an example of another embodiment embodying the present invention.

FIG. 7 shows the overall configuration of a substrate inspection device 90 according to the present invention. The substrate inspection device 90 includes the substrate holding device 1 described above, an illumination section 91, an imaging section 92, and an inspection section 93. This substrate inspection device 90 is designed to correct the warpage and bending of the substrate Wi when the substrate Wi (hereinafter, simply referred to as the "substrate Wi") to be inspected is moved or stationary without accidentally shifting or falling off. A specific inspector is performed outside the state holding inspection target area Wq (one of the types of processing target areas described above).

The illuminating unit 91 is a person who irradiates the illuminating light 94 to the inspection target portion 95 set on the substrate Wi. The illuminating unit 91 uses, for example, LED lighting or halogen lighting as a light source, and irradiates visible light, infrared light, or ultraviolet light.

The imaging unit 92 captures an image of the inspection target portion 95 set on the substrate Wi. The imaging unit 92 is a person who incorporates an area sensor such as a CCD, CMOS, or a line sensor as an imaging element, and outputs an image signal or data corresponding to a captured image to an external device.

The inspection unit 93 inspects the inspection target site based on an image captured by the imaging unit. The inspection unit 93 is configured by, for example, a machine (hardware) called an image processing unit and a program (software) that executes the same. The inspection unit 93 inputs image signals or data output from the imaging unit 92, performs specific image processing, and performs Detection and counting of foreign objects, detection of pattern defects, etc.

In addition, the illumination section 91 and the imaging section 92 are arranged to face each other across the inspection target portion of the substrate Wi, and can illuminate the illumination target 94 with the inspection light portion 95 inside the inspection target area Wq defined in the substrate Wi to pass through. The light 96 of the inspection target portion 95 is photographed. At this time, the inner edge of the opening portion 20 of the frame body 2 is outside the inspection target area Wq defined in the substrate Wi. Therefore, since the illumination light and the light passing through the inspection target portion 95 do not interfere with the frame body 2, the substrate inspection device 90 can inspect the inspection target area specified in the substrate Wi The domain of Wq.

In addition, the substrate detection device of the present invention is not limited to the above-mentioned configuration, but may be in the following forms.

1) The substrate holding device is fixedly arranged on the device frame to hold the substrate Wi, and the illumination section 91 and the imaging section 92 are moved.

2) The lighting unit 91 and the imaging unit 92 are fixedly arranged on the device frame, and the substrate holding device holding the substrate Wi is moved.

3) The illuminating unit is configured to irradiate illumination light from the entire opening of the frame of the substrate holding device, and is fixed to the device frame together with the substrate holding device to move the imaging unit 92.

Further, examples of the mechanism for moving the above-mentioned parts include a combination of a rotary motor and a ball bolt that can be controlled from an external device, a linear motor, and the like.

Due to such a configuration, the substrate inspection device of the present invention holds the outside of the inspection target area with the substrate holding member during a comprehensive inspection using transmitted illumination light throughout the entire inspection target area, even if it is not present in the previous inspection device. Corresponding warped and bent substrates can also be inspected in a corrected state.

Claims (7)

A substrate holding device is a substrate holding device, and includes: a guide portion supporting at least 3 points outside of a processing target region of the substrate set at least 3 points; and a substrate holding portion which moves a substrate holding member from at least 3 directions The outer edge of the substrate is pressed from the outside to the inside to thereby hold the substrate; and the guide portion and the substrate holding member are disposed so as to surround the outer edge of the substrate. The substrate holding member includes the outer edge of the substrate. The position restricting portion whose position is restricted in the vertical direction, wherein the outer edge of the substrate to be held is an arc shape; and the substrate holding portion is such that any three positions on the outer edge of the substrate are directed from the outside to the outside by the substrate holding member. The inside press includes a positioning reference side reciprocating mechanism that presses two of the three places on the outer edge of the substrate to a standby position outside the outer edge of the substrate and a portion in contact with the substrate. Reciprocating movement between the positioning reference position of the substrate; positioning the pressing-side reciprocating mechanism, which presses one of the three places on the outer edge of the substrate 2 other than the above one another, to become more than the standby position outside the edge of the substrate, and a portion of the substrate in contact with the pressed becomes relatively reciprocating motion between a position of the substrate inside the outside edge of the substrate. A substrate holding device is a substrate holding device, and includes: a guide portion supporting at least 3 points outside of a processing target region of the substrate set at least 3 points; and a substrate holding portion which moves a substrate holding member from at least 3 directions The outer edge of the substrate is pressed from the outside to the inside to thereby hold the substrate; and the guide portion and the substrate holding member are disposed so as to surround the outer edge of the substrate. The substrate holding member includes the outer edge of the substrate. The position limiting portion whose position is restricted in the vertical direction, wherein the outer edge of the substrate to be held is rectangular; and the substrate holding portion uses the substrate holding member to place at least two of the first reference side of the substrate, One of the second reference side of the substrate, one of the opposite sides of the first reference side, and one of the opposite sides of the second reference side are pressed inward from outside the outer edge of the substrate And includes: a positioning reference side reciprocating mechanism, which presses two places on the first reference side and one place on the second reference side that presses the outer edge of the substrate, and The contacting portion becomes a reciprocating motion between a standby position outside the outer edge of the substrate, or a portion in contact with the substrate, ie, a reference position in contact with the outer edge of the substrate; and positioning the reciprocating mechanism on the pressing side, which presses the above 1 place on the opposite side of the first reference edge and 1 place on the opposite side of the second reference edge on the outer edge of the substrate, and the portion in contact with the substrate becomes a standby position outside the outer edge of the substrate And the part in contact with the substrate becomes a reciprocating movement between the substrate pressing position of the substrate inside the outer edge of the substrate. A substrate holding device is a substrate holding device, and includes: a guide portion supporting at least 3 points outside of a processing target region of the substrate set at least 3 points; and a substrate holding portion which moves a substrate holding member from at least 3 directions The outer edge of the substrate is pressed from the outside to the inside to thereby hold the substrate; and the guide portion and the substrate holding member are disposed so as to surround the outer edge of the substrate. The substrate holding member includes the outer edge of the substrate. And the substrate holding device includes a frame having an opening larger than a processing target area set on the substrate, and the guide portion and the substrate holding portion are connected via the frame; An illuminating unit that irradiates illumination light to an inspection target portion set on the substrate; an imaging unit that photographs an inspection target portion set on the substrate; and an inspection unit that inspects the inspection target portion based on an image captured by the imaging portion And the illumination unit and the imaging unit are disposed to face each other with the inspection target portion interposed therebetween. A substrate holding device is a substrate holding device, and includes: a guide portion supporting at least 3 points outside of a processing target region of the substrate set at least 3 points; and a substrate holding portion which moves a substrate holding member from at least 3 directions The outer edge of the substrate is pressed from the outside to the inside to thereby hold the substrate; and the guide portion and the substrate holding member are disposed so as to surround the outer edge of the substrate. The substrate holding member includes the outer edge of the substrate. The position limiting portion whose position is restricted in the vertical direction; wherein the outer edge of the substrate to be held is a circular arc; and the substrate holding portion is such that any three positions of the outer edge of the substrate are directed from the outside to the outside by the substrate holding member. The inside press includes a positioning reference side reciprocating mechanism that presses two of the three places on the outer edge of the substrate to a standby position outside the outer edge of the substrate and a portion in contact with the substrate. Reciprocating movement between the positioning reference position of the substrate; positioning the pressing-side reciprocating mechanism, which presses one of the three places on the outer edge of the substrate Other than the two places mentioned above, it moves back and forth between a standby position that is outside the outer edge of the substrate, and a portion that is in contact with the substrate becomes a substrate press-in position that is inside the outer edge of the substrate; and the above The substrate holding device includes a frame having an opening larger than the processing target area set on the substrate, and the guide portion and the substrate holding portion are connected via the frame; the lighting portion is directed toward an inspection target set on the substrate. The part is irradiated with illumination light; the imaging part captures the inspection target part set on the substrate; and the inspection part inspects the inspection target part based on the image captured by the imaging part; and the illumination part is separated from the imaging part. Arranged to face the inspection object. A substrate holding device is a substrate holding device, and includes: a guide portion supporting at least 3 points outside of a processing target region of the substrate set at least 3 points; and a substrate holding portion which moves a substrate holding member from at least 3 directions The outer edge of the substrate is pressed from the outside to the inside to thereby hold the substrate; and the guide portion and the substrate holding member are disposed so as to surround the outer edge of the substrate. The substrate holding member includes the outer edge of the substrate. The position limiting portion whose position is restricted in the vertical direction, wherein the outer edge of the substrate to be held is rectangular; and the substrate holding portion uses the substrate holding member to place at least two of the first reference side of the substrate, One of the second reference side of the substrate, one of the opposite sides of the first reference side, and one of the opposite sides of the second reference side are pressed inward from outside the outer edge of the substrate And includes: a positioning reference side reciprocating mechanism, which presses two places on the first reference side and one place on the second reference side that presses the outer edge of the substrate, and The contacting portion becomes a reciprocating motion between a standby position outside the outer edge of the substrate, or a portion in contact with the substrate, ie, a reference position in contact with the outer edge of the substrate; and positioning the reciprocating mechanism on the pressing side, which presses the above 1 place on the opposite side of the first reference edge and 1 place on the opposite side of the second reference edge on the outer edge of the substrate, and the portion in contact with the substrate becomes a standby position outside the outer edge of the substrate And the part in contact with the substrate becomes a reciprocating motion between the substrate pressing position of the substrate inside the outer edge of the substrate; and the substrate holding device includes a frame body having an opening larger than the processing target area set on the substrate And the guide portion and the substrate holding portion are connected via the frame body; the illumination portion irradiates illumination light to the inspection target portion set on the substrate; the imaging portion which photographs the inspection target portion set on the substrate; and inspection Based on the image captured by the imaging unit, inspecting the inspection target site; and the illumination unit and the imaging unit are opposed to each other via the inspection target site. Configuration. The substrate holding device according to any one of claims 1 to 5, wherein the above-mentioned guide portion is formed in an outwardly L-shaped outer shape, and includes a lower end portion that supports the outer edge or the lower surface of the outer edge of the substrate. A guide body portion that is inclined from an inner side of the lower end portion side to an upper end portion side toward an outer side of the substrate. According to the substrate holding device of claim 6, wherein the angle of the guide body portion inclined outward is set to 5 to 60 degrees.