TWI673890B - Laser package structure - Google Patents

Abstract

The invention relates to a laser packaging structure, which is provided with a laser light emitting element on a first substrate, and a light sensing element is provided beside the laser light emitting element. The laser light emitting element and the light sensing element system are The first substrate is electrically connected respectively, and then two composite material pieces are respectively disposed on the first substrate, and the laser light emitting element and the light sensing element are disposed between the two composite material pieces, and a second substrate is disposed On the two composite material pieces, a diffusion sheet is disposed under the second substrate with respect to the laser light emitting element, and further includes a control device, the control device electrically connects the laser light emitting element and the laser light emitting element. Light sensor, when the laser light emitting device emits a light, when the light passes through the diffusion sheet, a part of the light is reflected, and the light sensor will detect the reflected light to determine the diffusion sheet. Whether the damage is caused, and then the control device controls the intensity of the light emitted by the laser light emitting element.

Description

Laser package structure

The invention relates to a laser packaging structure, which monitors the light value of a light-emitting element through a light-sensing element, and then controls the light intensity of the light-emitting element according to the light value.

Laser diodes can be divided into two types according to their different optical resonant cavities, one is a side-emitting laser, and the other is a surface-emitting laser, and a surface-emitting laser is also called a vertical cavity surface-emitting laser. (Vertical-Cavity Surface-Emitting Laser, VCSEL for short), which can also be called a vertical cavity surface-emission laser, is a semiconductor that emits perpendicular to the top surface, and its resonant cavity and photons are in the resonant cavity The mirror surface required for back and forth resonance is not a natural lattice fracture surface formed by the process, but has been formed when the element structure is epitaxially grown. Generally surface-emitting lasers can be used for optical fiber communication, banknote detection equipment, and medical lasers. The surface-emitting laser of optical fiber communication has a circular laser type and a small divergence angle, so it is easy to align on the fiber coupling, which can save a lot of packaging costs for fiber alignment, and it can perform a large number of short distances on transmission. Information transmission. Surface-emitting lasers on banknote detection equipment have banknotes with infrared absorbing ink. After being illuminated by surface-emitting lasers with a wavelength of 850 nanometers (nm), graphics will appear on the banknotes to identify them Genuine and fake banknotes, and medical lasers are irradiated with surface-emitting lasers with a wavelength of 850 nanometers (nm). Due to the concentrated light source and high output power, they can penetrate deep into the skin and be used as components of medical cosmetic equipment.

However, during the use of the surface-emitting laser diode packaging structure, an abnormality occurs in its structure. If it is not processed immediately, the surface-emitting laser diode packaging structure will be damaged, and the most common abnormality will occur. The area is the diffuser of the surface-emitting laser diode packaging structure. If the diffuser sheet falls off or is damaged during the light-emitting process of the surface-emitting laser diode packaging structure, the surface-emitting laser will cause the surface-emitting laser. Damage to the diode packaging structure, and conventional technology to protect the diffusion sheet, it will set a groove on the carrier sheet of the surface-emitting laser diode packaging structure, and let the diffusion sheet be placed on the carrier sheet. Inside the groove, the periphery of the diffusion sheet can be protected by the carrier sheet, but this structure cannot effectively protect the diffusion sheet, it can only protect the side of the diffusion sheet, and the diffusion sheet is different from the laser light emitting element. One side will also be completely exposed, and the diffusion sheet of the conventional technology must accurately match the size of the groove on the carrier sheet. In this way, it will greatly increase the manufacturing cost and processing time.

In summary, there are many incomplete structures in the conventional surface-emitting laser diode packaging structure. Therefore, the inventor has invented a laser packaging structure after a long period of research and innovation. A laser light emitting element and a light sensing element are respectively disposed on a substrate, wherein the light sensing element is disposed on one side of the laser light emitting element, and a bearing layer is provided on the outer side of the laser light emitting element and the light sensing element, A second substrate is disposed on the carrier layer, and a diffusion sheet is disposed relative to the laser light emitting element. Under the second substrate, when the light emitted by the laser light emitting element passes through the diffusion sheet, a part of the light is reflected by the diffusion sheet, and the light sensing element will detect the intensity of the reflected light. When the intensity is greater than or less than a standard value, the light sensing element will judge whether the diffusion sheet is damaged or detached from the carrier layer, and then send a signal to a control device, so that the control device controls the laser light emitting element. The intensity of the emitted light.

The main object of the present invention is to provide a laser packaging structure. A light sensing element and a laser light emitting element are disposed on a first substrate, and the light sensing element is disposed on a side of the laser light emitting element, so that The laser light emitting element emits light. When the light passes through a diffuser, part of the light is reflected by the diffuser. The light sensing element will detect the reflected light and determine whether the diffuser causes damage. The control device controls the intensity of the light emitted by the laser light emitting element.

Another object of the present invention is to provide a laser packaging structure, in which a second substrate is disposed on two composite material pieces, and the diffusion sheet is disposed under the second substrate with respect to the laser light emitting element, so that the The second substrate can protect the diffusion sheet, which can greatly reduce the manufacturing cost of the diffusion sheet.

In order to achieve the above object, the present invention discloses a laser packaging structure including a first substrate and a laser light emitting element, which are disposed on the first substrate and are electrically connected to the first substrate. A sensing element is disposed on the first substrate and is located on the laser light emitting element. Side, two composite material pieces are respectively disposed on the first substrate, wherein the laser light emitting element and the light sensing element are provided between the two composite material pieces, and a second substrate is provided on the first substrate The two composite material pieces and a diffusion sheet are disposed under the second substrate and between the two composite material pieces, and the diffusion sheet is disposed on the second substrate with respect to the laser light emitting element. Above, it further includes a control device, which is electrically connected to the laser light emitting element and the light sensing element, respectively. When the laser light emitting element emits a light, and the light passes through the diffusion sheet, the light sensing element The light intensity of the light reflected by the diffuser can be detected, and then the control device can adjust the light intensity of the laser light emitting element.

According to an embodiment of the present invention, it is also disclosed that the control device is disposed on the first substrate.

According to an embodiment of the present invention, it is also disclosed that the control device controls the current or voltage input to the laser light emitting element, and then controls its light emission intensity.

In one embodiment of the present invention, it is also disclosed that the laser light emitting device is a surface emitting laser light emitting device.

In an embodiment of the present invention, it is also disclosed that the light of the laser light emitting element is between 83 and 75 degrees with respect to a horizontal angle.

In one embodiment of the present invention, it is also disclosed that the height of the composite material is higher than the laser light emitting element and the light sensing element.

In one embodiment of the present invention, it is also disclosed that the laser light emitting element and the light sensing element are respectively soldered to the first substrate with a polarity.

In one embodiment of the present invention, the laser packaging junction is also disclosed. The structure further includes a first wire and a second wire, one end of the first wire is electrically connected to the substrate, the other end is electrically connected to the laser light emitting element, and one end of the second wire is electrically connected to the substrate. The other end is electrically connected to the light sensing element.

In one embodiment of the present invention, it is also disclosed that the laser light emitting device is a light emitting diode chip.

The invention also discloses a laser packaging structure, which includes a first substrate and a laser light emitting element, which are disposed on the first substrate and are electrically connected to the first substrate and a light sensing element. The first substrate is disposed on the first side of the laser light-emitting element, and a carrier layer is disposed on the first substrate and looped around the laser light-emitting element and the light-sensing element. A second A substrate is disposed on the carrier layer, and a diffusion sheet is disposed below the second substrate and located in the carrier layer, and the diffusion sheet is disposed on the first part relative to the laser light emitting element. The two substrates further include a control device, which is electrically connected to the laser light emitting element and the light sensing element, respectively. When the laser light emitting element emits a light, the light passes through the diffusion sheet, the light The sensing element can detect the light intensity of the light reflected by the diffuser, and the control device can adjust the light intensity of the laser light emitting element.

In one embodiment of the present invention, it is also disclosed that the laser light emitting device is a surface emitting laser light emitting device.

1‧‧‧Laser packaging structure

2‧‧‧ substrate

22‧‧‧Polar Welding

3‧‧‧laser light emitting element

32‧‧‧light

34‧‧‧ reflected light

4‧‧‧light sensor

5‧‧‧Two composite materials

50‧‧‧ bearing layer

52‧‧‧accommodation space

6‧‧‧ diffuser

7‧‧‧control device

8‧‧‧ the first wire

82‧‧‧Second Lead

9‧‧‧ second substrate

First picture: It is a three-dimensional exploded view of a preferred embodiment of the present invention; Second picture: It is a three-dimensional exploded view of a preferred embodiment of the present invention; Third picture: It is one of the present invention Schematic diagram of the front view of the preferred embodiment; Figure A: It is a schematic diagram of the rear view of a preferred embodiment of the present invention; Figure 4: Schematic diagram of the action of a preferred embodiment of the present invention; Figure: It is a three-dimensional exploded schematic diagram of a preferred embodiment of the present invention; and Figure 6: It is a schematic diagram of the operation of a preferred embodiment of the present invention.

In order for your reviewers to have a better understanding and understanding of the features of the present invention and the effects achieved, I would like to provide better examples and detailed descriptions with the following description: The present invention is a face-shot type of conventional technology During the use of the laser diode package structure, an abnormality occurs in the structure. If it is not processed immediately, the surface-type laser diode package structure will be damaged. The most common place where the abnormality occurs is the surface. If the diffuser sheet falls off or is damaged during the light emission of the surface-emitting laser diode package structure, the diffusion plate of the laser-type laser diode package structure will cause the surface-emitting laser diode package structure. In order to protect the diffusion sheet, the conventional technology will set a groove on the carrier sheet of the surface-emitting laser diode packaging structure, and let the diffusion sheet be arranged in the groove of the carrier sheet, so that The surrounding of the diffusion sheet can be protected by the carrier sheet, but this structure will cause the diffusion sheet to only protect the diffusion sheet. Side, and must accurately match the size of the groove on the carrier sheet, which will greatly increase the manufacturing cost and processing time. Therefore, the present invention is able to detect the status of the diffusion sheet in real time, protect the diffusion sheet and protect the laser The light emitting element controls the light emission, so a laser package structure is invented, which can respectively provide a laser light emitting element and a light sensing element on a first substrate, wherein the light sensing element is disposed on the laser light emitting element. A side of the element, and a carrier layer is provided on the outer side of the laser light emitting element and the light sensing element, a second substrate is disposed on the carrier layer, and a diffusion sheet is disposed under the second substrate with respect to the laser light emitting element, After the laser light emitting element emits a light to a diffusion sheet, a part of the light is reflected by the diffusion layer. At this time, the light sensing element will detect the intensity of the reflected light, and then determine the State, then the light sensor sends a signal to a control device, so that the control device controls the intensity of the light emitted by the laser light emitting device.

First, please refer to the first figure, which is a schematic three-dimensional exploded view of a preferred embodiment of the present invention, and the second figure, which is a three-dimensional schematic view of a preferred embodiment of the present invention. It is a laser packaging structure 1, which includes a first substrate 2, a laser light emitting element 3, a light sensing element 4, two composite material pieces 5, a diffusion sheet 6 and a second substrate 9.

The laser light emitting element 3 is disposed on the first substrate 2, and the light sensing element 4 is disposed on one side of the laser light emitting element 3. The laser light emitting element 3 and the light sensing element 4 are respectively separated from each other. The first substrate 2 is electrically connected, wherein the laser light-emitting element 3 is a surface-emitting laser light-emitting element or a light-emitting diode wafer. 83 to 75 degrees, the two composite material pieces 5 are respectively disposed on the first substrate 2, and the laser light emitting element 3 and the light sensing element 4 are respectively provided between the two composite material pieces 5, the two The composite material part 5 may be an opaque or light-transmissive material. The second substrate 9 is disposed on the two composite material parts 5, and the diffusion sheet 6 is disposed on the second part relative to the laser light emitting element 3. Under the substrate 9 and between the two composite material parts 5, and the laser light emitting element 3 and the light sensing element 4 need to be arranged between the two composite material parts 5, and the two composite material parts 5 are arranged on the The height on the first substrate 2 needs to be greater than the height of the laser light emitting element 3 plus the diffusion sheet 6 and the light sensing element 4 plus the diffusion sheet 6. The two composite material pieces 5 can be regarded as a bearing layer, which further includes a A control device 7, which is electrically connected to the laser light emitting element 3 and the light sensing element 4, respectively, wherein the control device 7 can be disposed on the substrate 2 or the laser packaging structure 1 On the outer side, the laser light-emitting element 3 and the light-sensing element 4 are respectively electrically connected by wires. (The control system of the present embodiment means 7 disposed on the first substrate 2 will be described below).

Next, please continue to refer to the third diagram, which is a schematic diagram of a front view of a preferred embodiment of the present invention, and the third diagram A is a diagram of a rear view of a preferred embodiment of the present invention, and the fourth diagram, which is a diagram It is a schematic diagram of the operation of a preferred embodiment of the present invention. As shown in the figure, when the laser light emitting element 3 emits a light beam 32, the light beam 32 will pass through the diffusion sheet 6, wherein the light beam 32 is at an angle with respect to a horizontal angle. θ is between 83 and 75 degrees. When the light 32 passes through the diffusion sheet 6, a part of the light 32 is reflected by the diffusion sheet 6 to form a reflected light 34. At this time, the light sensing element 4 can pass through The light intensity of the reflected light 34 is detected to determine whether the diffusion sheet 6 is damaged or detached from the two composite material pieces 5. When the light sensing element 4 detects that the diffusion sheet 6 is detached or damaged, The light sensing element 4 sends a signal to the control device 7 and controls the intensity of the light 32 emitted by the laser light emitting element 3 by the control device 7, and the control device 7 controls the input to the laser light emitting element 3 Current or voltage to further control its light emitting intensity. In addition, the laser light emitting element 3 and the light sensing element 4 are respectively soldered 22 to the substrate 2 with a polarity, so that the laser light emitting element 3 and the light sensing The element 4 is electrically connected to the first substrate 2 respectively, and further includes a first wire 8 and a second wire 82. One end of the first wire 8 is electrically connected to the laser light emitting element 3, and the other end is electrically connected. Connected to the control device 7, one end of the second wire 82 is electrically connected to the light sensing element 4, and the other end is electrically connected to the control device 7, and when the light sensing element 4 detects that the diffusion sheet 6 is damaged or detached, it A signal can be transmitted to the control via the second wire 82 Means 7, then the control means 7 by the first wire 8 to the control input of current or voltage in the laser light emitting element 3, to further control the emission intensity of the laser light-emitting element 3 of.

Through the above-mentioned structure, after the light beam 32 emitted from the laser light emitting element 3 passes through the diffusion sheet 6, the light beam 32 is evenly diffused from the diffusion sheet 6, and it can adjust the angle inside the diffusion sheet 6, Thereby, the uniformity of the light 32 passing through the diffusion sheet 6 is adjusted, and when the light 32 passes through the diffusion sheet 6, a part of the light 32 is reflected by the diffusion sheet 6 to form the reflected light 34, and the reflected light 34 will Received by the light sensing element 4 and detecting the intensity of the reflected light 34, when the reflected light 34 is low At or above the standard value, the light sensing element 4 will judge that the diffusion sheet 6 falls off the two composite material pieces 5 or the diffusion sheet 6 is damaged, and send a signal to the control device 7 to make the control device 7 control The light emitting intensity of the laser light emitting element 3 is to achieve the safety control of the laser packaging structure, and the diffusion sheet 6 is directly disposed on the two composite material pieces 5, which does not need to be cut to a proper size again, that is, It can be directly installed on the two composite material parts 5, which can greatly reduce the processing time and reduce the manufacturing cost.

Please refer to the fifth figure, which is a three-dimensional exploded schematic diagram of another preferred embodiment of the present invention, and the sixth figure is a schematic diagram of the operation of another preferred embodiment of the present invention, in order to be more clear The operation mode of the components in the sixth figure is shown, so the sixth mode is shown in a sectional view. As shown in the figure, the present invention is a laser package structure 1 including a first The substrate 2, a laser light emitting element 3, a light sensing element 4, a carrying layer 50, a diffusion sheet 6, and a second substrate 9.

The laser light emitting element 3 is disposed on the first substrate 2, and the light sensing element 4 is disposed on one side of the laser light emitting element 3, and the light sensing element 4 is disposed on the first substrate 2. Above, the laser light emitting element 3 and the light sensing element 4 are electrically connected to the first substrate 2 respectively, wherein the laser light emitting element 3 is a surface emitting laser light emitting element or a light emitting diode wafer, which The light emitting angle is between 83 and 75 degrees with respect to a horizontal angle. The carrying layer 50 is disposed on the first substrate 2. The carrying layer 50 further includes an accommodation space 52, and the laser light emitting element 3 The light-sensing element 4 is disposed on the first substrate 2 and is located in the accommodation space 52 of the carrier layer 50. That is, the carrier layer 50 is disposed on the first substrate 2. The substrate 2 is surrounded by the laser light-emitting element 3 and the light-sensing element 4, the second substrate 9 is disposed on the carrier layer 52, and the diffusion sheet 6 is disposed on the substrate relative to the laser light-emitting element 3. The second substrate 9 is located below the receiving space 52, and the height of the supporting layer 50 disposed on the first substrate 2 needs to be greater than the height of the laser light emitting element 3 plus the diffusion sheet and the light sensing element 4 plus For the height of the diffusion sheet, in order to set the diffusion sheet 6 on the second substrate 9 and be located in the capacitance space 52 of the carrier layer 50, if the height of the composite material part 5 is too low, the diffusion sheet 6 will touch the laser light-emitting element 3 or the light-sensing element 4 so that it cannot be placed under the second substrate, wherein the carrier layer 50 may be an opaque or light-transmissive material, and further, It includes a control device 7 which is electrically connected to the laser light-emitting element 3 and the light-sensing element 4 respectively, wherein the control device 7 can be disposed on the first substrate 2 or on the mine. The outer side of the radiation packaging structure 1 is electrically connected to the laser light emitting element 3 and the light sensor by wires. To 4 (Example according to the present embodiment based the control apparatus 7 is provided on the substrate 2 will be described below).

When the laser light emitting element 3 emits a light ray 32, the light ray 32 will pass through the diffusion sheet 6, wherein the light ray 32 is between 83 and 75 degrees with respect to the horizontal angle. When the light ray 32 passes through the diffusion sheet 6, There will be a part of the light 32 reflected by the diffuser sheet 6 to form a reflected light 34, and because the carrier layer 50 is arranged around the laser light emitting element 3 and the light sensing element 4, when the light 32 is reflected by the diffuser sheet When 6 is reflected into the reflected light 34, the reflected light 34 will not be scattered by the carrier layer 50, which can ensure that it is sensed by the light sensing element 4, and then a correct judgment is generated. The light sensing element 4 can determine whether the diffusion sheet 6 is damaged or detached from the carrier layer 50 by detecting the light intensity of the reflected light 34. When the light sensing element 4 detects that the diffusion sheet 6 is detached or damaged, In this case, the light sensing element 4 sends a signal to the control device 7, and the control device 7 controls the intensity of the light 32 emitted by the laser light emitting element 3, and the control device 7 controls the input to the laser The current or voltage of the light emitting element 3 controls its light emission intensity.

In addition, the second substrate 9 is disposed on the carrier layer 50, and the diffusion sheet 6 is disposed under the second substrate 9 with respect to the laser light emitting element 3 and located in the accommodation space 52, so that the diffusion sheet 6 One side can be protected by the second substrate 9. Compared with the prior art, the diffusion sheet 6 is disposed on the carrier layer 50. This case is disposed under the second substrate 9 and located in the carrier layer 50. Delete the area of the diffusion sheet 6 that is not used, and directly place the diffusion sheet 6 under the second substrate 9, which can greatly reduce the manufacturing cost, and the light sensing element 4 is disposed on the first substrate 2. The state of the diffusion sheet 6 can be judged more accurately.

In summary, in the laser packaging structure 1, it is disposed on one side of the laser light emitting element 3 through the light sensing element 4. When the laser light emitting element 3 emits the light 32, the light 32 passes through the light During the diffusion sheet 6, a part of the light 32 will be reflected by the diffusion sheet 6, and the reflected light is the reflected light 34. The light sensing element 4 will detect the reflected light 34. When the reflected light 34 is lower than When it is higher than the standard value, it is judged whether the diffuser sheet 6 is detached or damaged, and then the light sensor element 4 sends a signal to the control device 7, and the intensity of the laser light emitting element 3 is controlled by the control device 7. Weak, through the technical features described above, this case can achieve the security control of the laser packaging structure 1.

However, the above are only preferred embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. For example, all changes and modifications of the shapes, structures, features, and spirits in accordance with the scope of the patent application for the present invention are made. Shall be included in the scope of patent application of the present invention.

Claims (11)

A laser packaging structure includes: a first substrate; a laser light-emitting element disposed on the first substrate and electrically connected to the first substrate; and a light-sensing element disposed on the first substrate. A substrate and one side of the laser light-emitting element; two composite material pieces are respectively disposed on the first substrate, wherein the laser light-emitting element and the light-sensing element are provided on the two composite material pieces A second substrate, which is disposed on the two composite material pieces; and a diffusion sheet, which is disposed below the second substrate and is located between the two composite material pieces, and the diffusion sheet is opposite to each other The laser light emitting element is disposed on the second substrate; further comprising a control device, the control device is electrically connected to the laser light emitting element and the light sensing element, respectively, when the laser light emitting element emits a light, When the light passes through the diffusion sheet, the light sensing element can detect the light intensity of the light reflected by the diffusion sheet, and then the control device adjusts the light emission intensity of the laser light emitting element. Laser package junction as described in the first patent application Structure, wherein the control device is disposed on the first substrate. According to the laser package structure described in item 1 of the scope of the patent application, wherein the control device controls the current or voltage input to the laser light emitting element, and then controls its light emitting intensity. The laser package structure according to item 1 of the scope of the patent application, wherein the laser light emitting element is a surface emitting laser light emitting element. According to the laser package structure described in the first item of the patent application scope, wherein the angle of the light of the laser light emitting element with respect to the horizontal is between 83 and 75 degrees. The laser packaging structure described in item 1 of the scope of the patent application, wherein the height of the composite material is higher than the laser light emitting element and the light sensing element. According to the laser package structure described in item 1 of the patent application scope, wherein the laser light emitting element and the light sensing element are respectively soldered to the substrate with a polarity. The laser package structure described in item 1 of the patent application scope further includes a first wire and a second wire. One end of the first wire is electrically connected to the control device, and the other end is electrically connected to the laser. For the light-emitting element, one end of the second wire is electrically connected to the control device, and the other end is electrically connected to the light-sensing element. Laser package junction as described in the first patent application Structure, wherein the laser light emitting element is a light emitting diode wafer. A laser packaging structure includes: a first substrate; a laser light-emitting element disposed on the first substrate and electrically connected to the first substrate; and a light-sensing element disposed on the first substrate. A substrate on one side of the laser light emitting element; a carrier layer disposed on the first substrate and looped around the laser light emitting element and the light sensing element; a second substrate Disposed on the carrier layer; and a diffusion sheet disposed under the second substrate and within the carrier layer, and the diffusion sheet is disposed on the second substrate with respect to the laser light emitting element; Wherein, it further includes a control device, which is electrically connected to the laser light emitting element and the light sensing element, respectively. When the laser light emitting element emits a light, the light sensing element can detect when the light passes through the diffusion sheet. The light intensity of the light reflected by the diffusion sheet is measured, and then the control device adjusts the light emission intensity of the laser light emitting element. The laser package structure according to item 10 of the patent application scope, wherein the laser light emitting device is a surface emitting laser light emitting device.