TWI670503B - Photoelectric characteristics and appearance detection system of crystal grains - Google Patents

Photoelectric characteristics and appearance detection system of crystal grains Download PDF

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TWI670503B
TWI670503B TW107131042A TW107131042A TWI670503B TW I670503 B TWI670503 B TW I670503B TW 107131042 A TW107131042 A TW 107131042A TW 107131042 A TW107131042 A TW 107131042A TW I670503 B TWI670503 B TW I670503B
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die
detection
electrical
detecting
appearance
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TW107131042A
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TW202011035A (en
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徐榮祥
楊勇峰
薛永亮
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駿曦股份有限公司
大陸商河北聖源光電股份有限公司
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Abstract

本發明提供一種晶粒之光電特性及外觀檢測系統,包含有第一外觀檢測裝置進行晶粒正面檢測,移動裝置提取晶粒進行移動,第二外觀檢測裝置進行晶粒背面檢測,第一電性檢測裝置設置在滑軌裝置,以進行晶粒的第一電性檢測,第二電性檢測裝置進行晶粒的第二電性檢測,第三外觀檢測裝置設在滑軌裝置,以使第二電性檢測裝置位在第一、第三外觀檢測裝置間,第三外觀檢測裝置進行晶粒的側面檢測,檢測後將晶粒移至分類。本發明結合光學檢測及電性檢測,藉此一併檢測晶粒的光電特性及外觀,以增加檢測的速度。The invention provides a photoelectric characteristic and appearance detecting system for a crystal grain, comprising: a first appearance detecting device for detecting a front side of a die, a moving device extracting a die to move, and a second appearance detecting device for detecting a back surface of the die, the first electrical property The detecting device is disposed on the rail device for performing the first electrical detection of the die, the second electrical detecting device performs the second electrical detection of the die, and the third appearance detecting device is disposed on the rail device to enable the second The electrical detecting device is located between the first and third appearance detecting devices, and the third appearance detecting device performs side detection of the crystal grains, and after the detection, the crystal grains are moved to the classification. The invention combines optical detection and electrical detection, thereby detecting the photoelectric characteristics and appearance of the crystal grains together to increase the detection speed.

Description

晶粒之光電特性及外觀檢測系統Photoelectric characteristics and appearance detection system of crystal grains

本發明係關於一種檢測系統,特別係一種利用光學及電性進行晶粒之光電特性及外觀檢測系統。The present invention relates to a detection system, and more particularly to a system for detecting photoelectricity and appearance of a crystal grain by optical and electrical properties.

雷射,可以應用在雷射光譜、測距、雷達、切割或光纖通訊等用途中,無論在醫學、工業、軍事等領域,皆有龐大的用途。雷射又可區分數種種類,其中又以雷射二極體的體積最小及成本最低,只要在裝置中加入極小的電池,就足以驅動使用雷射。Laser can be used in laser spectroscopy, ranging, radar, cutting or fiber-optic communication, and it has a huge use in medical, industrial, military and other fields. The laser can also be classified into a variety of types, of which the laser diode has the smallest volume and the lowest cost, as long as a very small battery is added to the device, it is enough to drive the laser.

因此,雷射二極體可以廣泛應用在各種電子產品中,例如智慧型手機、平板電腦等,可以做為感測器使用或是3D立體影像偵測。正也因為雷射二極體應用在這些高精密的電子產品中,在加上雷射二極體自身體積非常小,對於良率量測的過程,也是相當不容易。Therefore, the laser diode can be widely used in various electronic products, such as smart phones, tablets, etc., and can be used as a sensor or 3D stereo image detection. It is also because the laser diode is used in these high-precision electronic products, and the laser diode itself is very small in volume, which is not easy for the process of yield measurement.

現今,為了測試雷射二極體的穩定性,避免在生產中毀損而造成發光不穩定的現象,通常會進行雷射二極體的光電特性檢測,藉由此一量測結果過濾出良率低的產品,以進行汰除。但目前進行檢測的方式,除了光電特性外,也並未發展出有效檢測雷射二極體晶粒外觀的方式,多半是透過人工方式進行粗略的檢測。Nowadays, in order to test the stability of the laser diode and avoid the phenomenon of unstable illumination caused by damage in production, the photoelectric characteristic detection of the laser diode is usually performed, and the yield is filtered by the measurement result. Low product to eliminate. However, the current detection method, in addition to the photoelectric characteristics, has not developed a way to effectively detect the appearance of the laser diode grains, and most of them are roughly detected by manual means.

如此一來,容易在光電特性檢測沒問題的雷射二極體晶粒中,因為有外觀缺陷未被即時發現,日後用在裝置中,可能因為外觀的缺陷造成使用上的不穩定。As a result, in the laser diode die which is not problematic in the detection of the photoelectric characteristics, since the appearance defect is not immediately found, it is used in the device in the future, and the use instability may be caused by the defect of the appearance.

本發明為了改善現今檢測雷射二極體晶粒的檢測環境,提出一種結合光學檢測及電性檢測晶粒之光電特性及外觀檢測系統,以提高雷射二極體的良率。In order to improve the detection environment of laser diodes in the present invention, a photoelectric detection and appearance detection system combining optical detection and electrical detection of crystal grains is proposed to improve the yield of the laser diode.

本發明的主要目的係在提供一種晶粒之光電特性及外觀檢測系統,結合光學檢測以偵測晶粒的外觀,以及利用電性檢測裝置檢測晶粒的光電特性,以在一道製程中同時完成二種檢測。The main object of the present invention is to provide a photoelectric detection and appearance detection system for a crystal grain, which combines optical detection to detect the appearance of a crystal grain, and an electrical detection device for detecting the photoelectric characteristics of the crystal grain to be simultaneously completed in one process. Two kinds of tests.

本發明的另一目的係在提供一種晶粒之光電特性及外觀檢測系統,在電性檢測時,可以同時檢測光功率以及光波長,以精準量測晶粒的光電特性,以及在進行外觀檢測時,除了晶粒的正面外,還提供有背面及側面的檢測,足以減少許多檢測之時間與成本。Another object of the present invention is to provide a photoelectric detecting and appearance detecting system for a crystal grain, which can simultaneously detect optical power and light wavelength during electrical detection, accurately measure photoelectric characteristics of the crystal grain, and perform appearance inspection. In addition to the front side of the die, back and side inspections are provided, which is sufficient to reduce the time and cost of many inspections.

為了達到上述的目的,本發明提供一種晶粒之光電特性及外觀檢測系統,包含有第一外觀檢測裝置具有第一光學檢測器及吸盤,第一光學檢測器位在吸盤上方,吸盤可置放晶粒供第一光學檢測器進行晶粒的正面檢測,移動裝置可提取檢測後的晶粒正面進行移動,第二外觀檢測裝置底部具有第二光學檢測器,以使移動裝置提取晶粒移動時,經由第二光學檢測器進行晶粒的背面檢測,滑軌裝置具有滑軌及移載元件,移載元件設置在滑軌上,以承載移動裝置承載之晶粒,以使其在滑軌上移動,第一電性檢測裝置設置在滑軌裝置,且具有第一轉盤及第一電性檢測組件,第一轉盤可轉動至滑軌裝置承載晶粒,第一轉盤再將晶粒轉回至第一電性檢測組件進行第一電性檢測,檢測後,第一轉盤再將晶粒移回滑軌裝置,第二電性檢測裝置設置在滑軌裝置,並位在第一電性檢測裝置一側,第二電性檢測裝置具有第二轉盤及第二電性檢測組件,第二轉盤可轉動至滑軌裝置承載晶粒,第二轉盤再將晶粒轉回至第二電性檢測組件進行第二電性檢測,檢測後,第二轉盤再將晶粒移回滑軌裝置,第三外觀檢測裝置設置在滑軌裝置,以使第二電性檢測裝置位在第一電性檢測裝置及第三外觀檢測裝置間,第三外觀檢測裝置具有第三轉盤及第三光學檢測器,第三轉盤可轉動至滑軌裝置承載晶粒,第三轉盤再將晶粒轉回至第三光學檢測器進行晶粒之側面檢測,檢測後,第三轉盤再將晶粒移回滑軌裝置,以使移載元件將晶粒移至分類。In order to achieve the above object, the present invention provides a photoelectric characteristic and appearance detecting system for a crystal grain, comprising: a first appearance detecting device having a first optical detector and a suction cup, wherein the first optical detector is located above the suction cup, and the suction cup can be placed The die is used for the front side detection of the die by the first optical detector, the moving device can extract the detected front side of the die to move, and the second appearance detecting device has a second optical detector at the bottom for the moving device to extract the die moving Performing back surface detection of the die via the second optical detector, the slide rail device has a slide rail and a transfer component, and the transfer component is disposed on the slide rail to carry the die carried by the mobile device so as to be on the slide rail Moving, the first electrical detecting device is disposed on the rail device, and has a first turntable and a first electrical detecting component, the first turntable can be rotated to the sliding rail device to carry the die, and the first turntable turns the die back to The first electrical detecting component performs the first electrical detection. After the detecting, the first rotating wheel moves the die back to the sliding rail device, and the second electrical detecting device is disposed in the sliding rail device, and is located at the first On the side of the electrical detecting device, the second electrical detecting device has a second turntable and a second electrical detecting component, the second turntable can be rotated to the sliding rail device to carry the die, and the second turntable turns the die back to the second The electrical detecting component performs a second electrical detection. After the detecting, the second rotating wheel moves the die back to the sliding rail device, and the third appearance detecting device is disposed on the sliding rail device, so that the second electrical detecting device is located at the first Between the electrical detecting device and the third appearance detecting device, the third appearance detecting device has a third turntable and a third optical detector, the third turntable can be rotated to the slide rail device carrying the die, and the third turntable turns the die back The third optical detector performs side detection of the die. After the detection, the third turntable moves the die back to the slide device to move the die to the classification.

在本發明中,還包含有第一對位裝置位在滑軌裝置上,第一對位裝置係將移動裝置所移動至滑軌裝置上之晶粒,以進行對位檢測以及調整位移。In the present invention, the first alignment device is further disposed on the slide rail device, and the first alignment device moves the mobile device to the crystal grains on the slide rail device to perform alignment detection and adjust displacement.

在本發明中,還包含有第二對位裝置位在滑軌裝置上,第二對位裝置係將進行完第一電性檢測之晶粒,以進行對位檢測以及調整位移。In the present invention, the second alignment device is further disposed on the slide rail device, and the second alignment device is configured to perform the first electrical detection of the crystal grains for performing the alignment detection and adjusting the displacement.

在本發明中,還包含有第三對位裝置位在滑軌裝置上,第三對位裝置係將進行完第二電性檢測之晶粒,以進行對位檢測以及調整位移。In the present invention, the third alignment device is further disposed on the slide rail device, and the third alignment device is configured to perform the second electrical detection of the crystal grains for performing the alignment detection and adjusting the displacement.

在本發明中,還包含有第四對位裝置位在滑軌裝置上,第四對位裝置係將進行完側面檢測之晶粒,以進行對位檢測以及調整位移,再使移載元件將晶粒移至分類。In the present invention, the fourth alignment device is further disposed on the slide rail device, and the fourth alignment device is configured to perform the side detection of the crystal grains to perform the alignment detection and the displacement adjustment, and then the transfer component will be The grains are moved to the classification.

在本發明中,第一電性檢測在第一溫度下進行電流、功率及波長的第一電性檢測,例如在20~40℃,第二電性檢測在第二溫度下進行電流、功率及波長的第二電性檢測,例如在70~100℃。In the present invention, the first electrical detection performs a first electrical detection of current, power, and wavelength at a first temperature, for example, at 20 to 40 ° C, and the second electrical detection performs current, power, and at a second temperature. The second electrical detection of the wavelength, for example at 70~100 °C.

在本發明中,第一電性檢測裝置及第二電性檢測裝置還包含有光功率量測器及光譜分析儀,以檢測晶粒的光電特性及波長。In the present invention, the first electrical detecting device and the second electrical detecting device further comprise an optical power measuring device and a spectrum analyzer for detecting the photoelectric characteristics and the wavelength of the crystal grains.

在本發明中,移動裝置係為具有吸嘴的機械擺臂。In the present invention, the mobile device is a mechanical swing arm having a nozzle.

在本發明中,第三光學檢測器具有二光學鏡頭,二光學鏡頭係面對面設置,當晶粒位載二光學鏡頭間,利用光學鏡頭進行晶粒的側面檢測。In the present invention, the third optical detector has two optical lenses, and the two optical lenses are disposed face to face. When the crystal grain is carried between the two optical lenses, the optical lens is used to perform side detection of the crystal grains.

底下藉由具體實施例配合所付的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

隨著光通訊的快速發展,以及有關光纖設備用戶的普及化,並且還伴隨著未來通訊系統相應產生的光纖光纜、光組件、模組或設備等配套產業之需求和供給,將會逐漸到達高峰,在這之間,有關雷射二極體的需求也會逐漸增高。因此,本發明提供了快速、有效且節省時間及成本的晶粒之光電特性及外觀檢測系統。With the rapid development of optical communication, as well as the popularization of users of optical fiber equipment, and with the demand and supply of fiber optic cable, optical components, modules or equipment and other supporting industries corresponding to the future communication system, it will gradually reach the peak. In the meantime, the demand for laser diodes will gradually increase. Accordingly, the present invention provides a photoelectric feature and appearance detection system for a die that is fast, efficient, and time- and cost-effective.

首先,請參照本發明第一圖、第二圖及第三圖所示,一種晶粒之光電特性及外觀檢測系統10包含有一第一外觀檢測裝置12、一第二外觀檢測裝置14、一第三外觀檢測裝置16、一移動裝置18、一滑軌裝置20、一第一電性檢測裝置22、一第二電性檢測裝置24、一第一對位裝置26、一第二對位裝置28、一第三對位裝置30及一第四對位裝置32。第一外觀裝置12係位在整個檢測系統10的最前端,第一外觀裝置12旁邊設置有第二外觀檢測裝置14,而第二外觀檢測裝置14則設在滑軌裝置20的最前端,第二外觀檢測裝置14旁邊還設有移動裝置18,移動裝置18相對滑軌裝置20之一側設有第一對位裝置26,第一對位裝置26旁依序設有第二對位裝置28、第三對位裝置30及第四對位裝置32,且本實施例中,第一對位裝置26、第二對位裝置28、第三對位裝置30及第四對位裝置32皆設在滑軌裝置20的同一側。移動裝置18另一邊則設有第一電性檢測裝置22,其對應滑軌裝置20設置在第二對位裝置28前方,而第一電性檢測裝置22另一邊設有第二電性檢測裝置24,其也對應滑軌裝置20設置在第三對位裝置30前方,第二電性檢測裝置24另一邊設有第三外觀檢測裝置16,其亦對應滑軌裝置20設置在第四對位裝置32的前方。滑軌裝置20以第二外觀檢測裝置14為最前端時,滑軌裝置20的最尾端還可設置一分類裝置34。First, referring to the first, second, and third figures of the present invention, a photoelectric characteristic and appearance detecting system 10 for a die includes a first appearance detecting device 12, a second appearance detecting device 14, and a first The three appearance detecting device 16, a moving device 18, a rail device 20, a first electrical detecting device 22, a second electrical detecting device 24, a first alignment device 26, and a second alignment device 28 a third alignment device 30 and a fourth alignment device 32. The first appearance device 12 is located at the foremost end of the entire detection system 10, the second appearance detecting device 14 is disposed beside the first appearance device 12, and the second appearance detecting device 14 is disposed at the foremost end of the rail device 20, A mobile device 18 is further disposed beside the appearance detecting device 14 . The mobile device 18 is provided with a first alignment device 26 on one side of the slide rail device 20 , and the second alignment device 28 is disposed adjacent to the first alignment device 26 . The third aligning device 30 and the fourth aligning device 32, and in the embodiment, the first aligning device 26, the second aligning device 28, the third aligning device 30, and the fourth aligning device 32 are all provided On the same side of the rail assembly 20. The other side of the mobile device 18 is provided with a first electrical detecting device 22, the corresponding rail device 20 is disposed in front of the second alignment device 28, and the second electrical detecting device 22 is provided with a second electrical detecting device on the other side. 24, which is also disposed in front of the third alignment device 30 corresponding to the rail device 20, and a third appearance detecting device 16 is disposed on the other side of the second electrical detecting device 24, which is also disposed in the fourth alignment position corresponding to the rail device 20. The front of the device 32. When the rail device 20 has the second appearance detecting device 14 as the foremost end, a sorting device 34 may be disposed at the end of the rail device 20.

承接上段,說明完本發明中各裝置的位置關係後,接著詳細說明各裝置中所具有的元件,在第一外觀檢測裝置12中還具有一第一光學檢測器122及一吸盤124,第一光學檢測器122係位在吸盤124上方,且吸盤124的上方係可置放至少一晶粒36,本實施例中係以複數晶粒36為例說明,本發明不限置吸盤124上的晶粒36數量,本實施例的晶粒36係為雷射二極體晶粒;第二外觀檢測裝置14的底部具有一第二光學檢測器142,第二光學檢測器142係可位於移動裝置18自吸盤124至滑軌裝置20的移動軌跡中,且在本實施例中的移動裝置18係為具有吸嘴的機械擺臂;滑軌裝置20中還具有一滑軌202及一移載元件204,移載元件204設置在滑軌202上;第一電性檢測裝置22具有第一轉盤222及第一電性檢測組件224,第一轉盤222的位置係位於第一電性檢測組件224及滑軌202間;第二電性檢測裝置24具有一第二轉盤242及一第二電性檢測組件244,第二轉盤242係位於第二電性檢測組件244及滑軌202間;第三外觀檢測裝置16具有一第三轉盤162及一第三光學檢測器164,第三轉盤162係位於第三光學檢測器164及滑軌202間,在本實施例中,第三光學檢測器164係可具有二光學鏡頭166,此二光學鏡頭166係可為面對面設置,但本發明不以此光學鏡頭166的數量及擺設位置為發明的限制,例如光學鏡頭166也經由轉動調整照射角度,例如第三圖所示,此時係可以一光學鏡頭166做為偵測之用。After the description of the positional relationship of the devices in the present invention is completed, the components of each device are described in detail. The first appearance detecting device 12 further includes a first optical detector 122 and a suction cup 124. The optical detector 122 is positioned above the suction cup 124, and at least one of the crystal grains 36 is disposed above the suction cup 124. In the embodiment, the plurality of crystal grains 36 are taken as an example, and the present invention is not limited to the crystal on the suction cup 124. The number of the particles 36, the die 36 of the present embodiment is a laser diode die; the bottom of the second appearance detecting device 14 has a second optical detector 142, and the second optical detector 142 is located at the mobile device 18. The moving device 18 in the present embodiment is a mechanical swing arm having a nozzle; the slide device 20 further has a slide rail 202 and a transfer member 204. The first electrical detecting device 22 has a first rotating plate 222 and a first electrical detecting component 224. The position of the first rotating plate 222 is located at the first electrical detecting component 224 and sliding. Between the rails 202; the second electrical detecting device 24 has a The second turntable 242 and the second electrical detection component 244 are disposed between the second electrical detection component 244 and the slide rail 202. The third appearance detection device 16 has a third turntable 162 and a third optical detection. The third optical detector 164 is disposed between the third optical detector 164 and the sliding rail 202. In this embodiment, the third optical detector 164 can have two optical lenses 166, and the two optical lenses 166 can be face to face. Although the invention does not limit the number of optical lenses 166 and the position of the arrangement, for example, the optical lens 166 also adjusts the illumination angle via rotation, for example, as shown in the third figure, in which case an optical lens 166 can be used as a detector. For measurement purposes.

詳細說明本發明各裝置中之元件後,接續說明本發明的作動方式,仍請參照本發明第一圖、第二圖及第三圖所示,首先本發明的檢測系統10可以是獨立運作的機台,或是與其它機台(例如其它製程)相關的機台,可以獨立具有一如電腦般的控制系統或是與其它機台共用,本發明不限制控制的技術手段。本發明在作動一開始,晶粒36係先放置在第一外觀檢測裝置12的吸盤124上,並藉由第一光學檢測器122由上往晶粒36的正面進行正面檢測,同時第一外觀檢測裝置12還可包含有一頂升元件126,利用頂升元件126將晶粒36自藍膜中分離。進行正面檢測後,利用移動裝置18將晶粒36自吸盤124的藍膜取出,本發明雖不限制在吸盤124上晶粒36數量,但移動裝置18一次僅利用吸嘴取出一顆晶粒36,此時移動裝置18係利用吸嘴提取晶粒36的正面,以將晶粒36移向第二外觀檢測裝置14。當晶粒36之正面藉由移動裝置18提取時,移動至第二外觀檢測裝置14後,藉由第二光學檢測器142由下往晶粒36的背面進行背面檢測。當進行完背面檢測後,移動裝置18再將晶粒36移向滑軌裝置20,在晶粒36要置放在移載元件204之前,可以先藉由移動裝置18以移動到一轉正元件38,其係可轉正晶粒36的位置,接著在放置於滑軌202上的移載元件204上,並利用第一對位裝置26對校正後的晶粒36進行對位檢測,並且晶粒36若產生位置偏移,可以同時調整位移,當晶粒36位置校正後,移載元件204再自滑軌202上進行移動,例如滑軌裝置20利用線性馬達以使移載元件204於滑軌202移動。After the components in the various devices of the present invention are described in detail, the operation mode of the present invention will be described hereinafter. Referring to the first, second and third figures of the present invention, the detection system 10 of the present invention may be independently operated. The machine, or the machine associated with other machines (such as other processes), can independently have a computer-like control system or be shared with other machines, and the present invention does not limit the technical means of control. At the beginning of the operation of the present invention, the die 36 is first placed on the chuck 124 of the first appearance detecting device 12, and is firstly detected by the first optical detector 122 from the front side of the die 36, while the first appearance The detection device 12 can also include a jacking element 126 that separates the die 36 from the blue film by the jacking element 126. After the front side detection, the die 36 is taken out from the blue film of the chuck 124 by the moving device 18. Although the present invention does not limit the number of the crystal grains 36 on the chuck 124, the moving device 18 uses only the nozzle to take out one die 36 at a time. At this time, the mobile device 18 extracts the front surface of the die 36 using the nozzle to move the die 36 toward the second appearance detecting device 14. When the front side of the die 36 is extracted by the moving device 18, after moving to the second appearance detecting device 14, the second optical detector 142 performs backside detection from the back side of the die 36. After the backside inspection is performed, the mobile device 18 moves the die 36 to the track assembly 20, and before the die 36 is placed in the transfer component 204, it can be moved to the positive component 38 by the mobile device 18. The position of the positive die 36 can be rotated, then placed on the transfer element 204 on the slide 202, and the aligned die 36 is aligned by the first alignment device 26, and the die 36 If a positional offset occurs, the displacement can be adjusted simultaneously. After the position of the die 36 is corrected, the transfer element 204 is again moved from the slide 202. For example, the slide assembly 20 utilizes a linear motor to move the transfer element 204 to the slide 202. mobile.

承接上段,移載元件204會先將校正位置後的晶粒36移向第一電性檢測裝置22對應滑軌202的接近位置,此時請同時參照第四圖,第一轉盤222可藉由自身的轉動元件40向滑軌202方向轉180度,以呈現第五圖所示之樣式,第一轉盤222則可至移載元件204的位置承載其上的晶粒36,第一轉盤222再轉180度回到原來的位置,如第二圖所示之。當回到初始位置後,第一電性檢測組件224還可具有一探針226,利用探針226對晶粒36進行第一電性檢測,例如第一電性檢測組件224係在第一溫度:20~40℃間,進行電流、功率及波長的第一電性檢測,本發明不限制第一電性檢測組件224是否用探針226進行檢測,而第一電性檢測組件224還可以包含一光功率量測器及光譜分析儀(圖中未示),本實施例所利用之光功率量測器係可為Keithley 2602B型態之電流電壓光功率量測器,以作為雷射二極體脈波測試系統提供雷射二極體所需要的電流脈波,提供電流,例如脈衝電流最大5安培或直流電流最大1安培,以收集晶粒36的光電流及電壓,並經由運算後,藉由曲線圖得知功率,以及光譜分析儀係為Anritsu MS9740A型態之光譜儀,可以覆蓋600奈米至750奈米的光譜分析,以進行光學分辯率及高速測量,以提供波型數據供參考。當進行完上述之第一電性檢測後,第一轉盤222在如第四圖所示之方式,向上轉動180度,以將晶粒36帶回至移載元件204,同時,第二對位裝置28會對進行完第一電性檢測的晶粒36,於移載元件204上進行對位檢測以及調整位移。In the upper section, the transfer component 204 first moves the die 36 after the correction position to the proximity position of the corresponding electrical rail device 22 corresponding to the slide rail 202. At this time, please refer to the fourth figure, the first turntable 222 can be used by The rotating member 40 rotates 180 degrees toward the slide rail 202 to assume the pattern shown in the fifth figure. The first turntable 222 can carry the die 36 thereon to the position of the transfer member 204. The first turntable 222 Turn 180 degrees back to the original position, as shown in the second picture. After returning to the initial position, the first electrical detecting component 224 can further have a probe 226 for performing a first electrical detection on the die 36 by using the probe 226, for example, the first electrical detecting component 224 is at the first temperature. The first electrical detection of current, power, and wavelength is performed between 20 and 40 ° C. The present invention does not limit whether the first electrical detection component 224 is detected by the probe 226, and the first electrical detection component 224 may further include An optical power measuring device and a spectrum analyzer (not shown), the optical power measuring device used in this embodiment can be a Keithley 2602B type current-voltage optical power measuring device, as a laser diode The body pulse wave test system provides the current pulse wave required by the laser diode to provide a current, for example, a pulse current of up to 5 amps or a direct current of up to 1 amp to collect the photocurrent and voltage of the die 36, and after calculation, The power is obtained from the graph, and the spectrum analyzer is an Anritsu MS9740A spectrometer that can cover spectral analysis from 600 nm to 750 nm for optical resolution and high-speed measurement to provide waveform data for reference. . After performing the first electrical detection described above, the first turntable 222 is rotated 180 degrees upward in the manner as shown in the fourth figure to bring the die 36 back to the transfer component 204, and at the same time, the second alignment The device 28 performs alignment detection and adjustment of displacement on the transfer element 204 for the die 36 that has undergone the first electrical detection.

接著,移載元件204再將晶粒36移到第二電性檢測裝置24對應滑軌202的接近位置,此時第二轉盤242如同第一轉盤222,具有如第四圖所示之轉動元件40以及第五圖之第一轉盤222的轉動方式,向滑軌202方向轉180度,以承載移載元件204上的晶粒36,再轉回如第二圖所示之原位置,第二電性檢測組件244上亦可具有一探針246,並利用探針246對晶粒36進行第二電性檢測,本實施例中第二電性檢測組件244與上述第一電性組件224相似,皆包含一光功率量測器及光譜分析儀,例如Keithley 2602B型態之電流電壓光功率量測器及Anritsu MS9740A型態之光譜儀,差別在於第二電性檢測組件244係在第二溫度:70~100℃進行電流、功率及波長的第二電性檢測,因為雷射二極體會因為發光時間長而產生熱,故需要在不同溫度下進行電性檢測。當進行完上述的第二電性檢測後,第二轉盤242再向上轉180度以將晶粒36帶回至移載元件204。接著,利用第三對位裝置30對進行完第二電性檢測後的晶粒36,於移載元件204上進行對位檢測及調整位移。Then, the transfer component 204 moves the die 36 to the proximity position of the corresponding electrical rail device 24 corresponding to the slide rail 202. At this time, the second turntable 242 is like the first turntable 222, and has the rotating component as shown in the fourth figure. 40 and the first turntable 222 of the fifth figure rotates 180 degrees in the direction of the slide rail 202 to carry the die 36 on the transfer component 204, and then return to the original position as shown in the second figure, the second The electrical detection component 244 can also have a probe 246 and perform a second electrical detection on the die 36 by using the probe 246. In this embodiment, the second electrical detection component 244 is similar to the first electrical component 224. Each includes an optical power meter and an optical spectrum analyzer, such as a Keithley 2602B type current-voltage optical power meter and an Anritsu MS9740A type spectrometer, with the difference that the second electrical detecting component 244 is at the second temperature: The second electrical detection of current, power and wavelength is performed at 70~100 °C. Because the laser diode generates heat due to long illumination time, it is necessary to perform electrical detection at different temperatures. After the second electrical detection described above is performed, the second turntable 242 is further rotated 180 degrees to bring the die 36 back to the transfer member 204. Next, the third alignment device 30 performs the alignment detection and the adjustment displacement on the transfer element 204 after the second electrical detection of the die 36.

當晶粒36進行完二種不同溫度之光電性檢測後,再藉由移載元件204將晶粒36移至第三外觀檢測裝置16對應滑軌202的接近位置,此時第三轉盤162也如同第一轉盤222,具有如第四圖所示之轉動元件40及第五圖之第一轉盤222的轉動方式向滑軌202方向轉180度,以承載移載元件204上的晶粒36,再轉回如第二圖所示之原位置,利用第三光學檢測器164之二光學鏡頭166進行晶粒36的側面檢測。檢測後,再利用第三轉盤162將晶粒36移回滑軌裝置20上的移載元件204,此時利用第四對位裝置32將進行完側面檢測的晶粒36,於移載元件204上進行對位檢測以及調整位移,當確認晶粒36的位置沒有偏移後,再藉由移載元件204將晶粒36移至分類裝置34進行分類,晶粒36於在每一站別進行外觀或是電性檢測時,可以即時將檢測結果傳輸至如電腦的控制系統,以將檢測結果進行分析比對,以在分類裝置34進行不同層級的分類,例如良品、次良品、劣品等分類,然而上述的說明係以晶粒36最好情況下的檢測,假設晶粒36有正面缺陷或是背面缺陷或是電性有缺陷時,可以直接跳過上述的後續檢測,直接進入分類裝置34中。After the die 36 performs the photoelectricity detection of the two different temperatures, the die 36 is moved by the transfer component 204 to the position corresponding to the slide rail 202 of the third appearance detecting device 16, and the third turntable 162 is also Like the first turntable 222, the rotation of the rotating member 40 as shown in the fourth figure and the first turntable 222 of the fifth figure is rotated 180 degrees toward the slide rail 202 to carry the die 36 on the transfer member 204. Turning back to the original position as shown in the second figure, the side detection of the die 36 is performed by the second optical lens 166 of the third optical detector 164. After the detection, the die 36 is moved back to the transfer component 204 on the slide device 20 by the third turntable 162. At this time, the die 36 on which the side detection is performed is performed by the fourth alignment device 32 on the transfer component 204. The alignment detection and the adjustment of the displacement are performed. After confirming that the position of the die 36 is not offset, the die 36 is moved to the sorting device 34 by the transfer member 204 for classification, and the die 36 is performed at each station. In appearance or electrical detection, the detection result can be immediately transmitted to a control system such as a computer to analyze and compare the detection results to perform classification at different levels in the classification device 34, such as good products, sub-goods, inferior products, etc. Classification, however, the above description is based on the best case detection of the die 36. If the die 36 has a front defect or a back defect or is electrically defective, the subsequent detection can be skipped directly and directly entered into the sorting device. 34.

上述的實施例,係先以單一晶粒的檢測為例說明,但本發明晶粒之光電特性及外觀檢測系統,一次不限制只能進行一顆晶粒的檢測,例如當第一顆晶粒進行完正面檢測後,移向背面檢測時,第一外觀檢測裝置上可以進行第二顆晶粒的正面檢測,當第一顆背面檢測完移至滑軌裝置時,第二顆可以移至第二外觀檢測裝置進行背面檢測,此時,第一外觀檢測裝置可以進行第三顆晶粒的正面檢測,當每一顆晶粒往後移至另一站別檢測時,就可以此類推,進行新的晶粒檢測,以使本發明的檢測系統在作動時,可以每一站別皆有晶粒進行檢測或是移動。The above embodiments are described by taking the detection of a single crystal grain as an example. However, the photoelectric characteristics and appearance detection system of the present invention can be used to detect only one crystal grain at a time, for example, when the first crystal grain is used. After the front side detection is performed, when the back side detection is performed, the front side of the second crystal grain can be detected on the first appearance detecting device, and when the first back surface is detected and moved to the rail device, the second piece can be moved to the first The second appearance detecting device performs back surface detection. At this time, the first appearance detecting device can perform front detecting of the third crystal grain. When each crystal grain is moved backward to another station for detecting, the pushing can be performed. The new die detection allows the detection system of the present invention to have a die for detection or movement at each station during operation.

因此,本發明可以大量進行雷射二極體晶粒的外觀及光電性之檢測,從一開始的正面檢測到最後進行分類,可以僅花費約六秒的時間,以使本發明除了可以提供晶粒的外觀檢測外,再結合不同溫度的光電特性檢測,以在一道製程中完成,節省了檢測的成本及檢測時間,並因為增加了外觀檢測,有問題的可以先剔除,而大大提升了檢測後之雷射二極體,將來應用在產品上的良率。Therefore, the present invention can perform the detection of the appearance and photoelectricity of the laser diode grains in a large amount, and from the initial detection to the final classification, it takes only about six seconds, so that the present invention can provide crystals. In addition to the appearance detection of the particles, combined with the photoelectric characteristics detection of different temperatures, it is completed in one process, which saves the cost of detection and the detection time, and because of the increased appearance detection, the problem can be eliminated first, and the detection is greatly improved. After the laser diode, the future yield on the product.

以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍。The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be covered by the scope of the present invention.

10‧‧‧檢測系統10‧‧‧Detection system

12‧‧‧第一外觀檢測裝置 12‧‧‧First appearance inspection device

122‧‧‧第一光學檢測器 122‧‧‧First optical detector

124‧‧‧吸盤 124‧‧‧Sucker

126‧‧‧頂升元件 126‧‧‧Uplift components

14‧‧‧第二外觀檢測裝置 14‧‧‧Second appearance inspection device

142‧‧‧第二光學檢測器 142‧‧‧Second optical detector

16‧‧‧第三外觀檢測裝置 16‧‧‧ Third appearance inspection device

162‧‧‧第三轉盤 162‧‧‧ Third turntable

164‧‧‧第三光學檢測器 164‧‧‧ third optical detector

166‧‧‧光學鏡頭 166‧‧‧ optical lens

18‧‧‧移動裝置 18‧‧‧Mobile devices

20‧‧‧滑軌裝置 20‧‧‧Slide device

202‧‧‧滑軌 202‧‧‧rails

204‧‧‧移載元件 204‧‧‧Transfer components

22‧‧‧第一電性檢測裝置 22‧‧‧First electrical detection device

222‧‧‧第一轉盤 222‧‧‧First turntable

224‧‧‧第一電性檢測組件 224‧‧‧First electrical detection component

226‧‧‧探針 226‧‧‧ probe

24‧‧‧第二電性檢測裝置 24‧‧‧Second electrical detection device

242‧‧‧第二轉盤 242‧‧‧Second turntable

244‧‧‧第二電性檢測組件 244‧‧‧Second electrical detection component

246‧‧‧探針 246‧‧‧ probe

26‧‧‧第一對位裝置 26‧‧‧First registration device

28‧‧‧第二對位裝置 28‧‧‧Second registration device

30‧‧‧第三對位裝置 30‧‧‧ third alignment device

32‧‧‧第四對位裝置 32‧‧‧ fourth alignment device

34‧‧‧分類裝置 34‧‧‧Classification device

36‧‧‧晶粒 36‧‧‧ grain

38‧‧‧轉正元件 38‧‧‧Transitive components

40‧‧‧轉動元件 40‧‧‧Rotating components

第一圖為本發明之俯視示意圖。 第二圖為本發明之立體圖。 第三圖為本發明部分結構之立體示意圖。 第四圖為本發明顯示第一電性檢測裝置之轉動元件之示意圖。 第五圖為本發明中第一轉盤轉動之示意圖。The first figure is a top view of the invention. The second figure is a perspective view of the present invention. The third figure is a perspective view of a partial structure of the present invention. The fourth figure is a schematic view showing the rotating elements of the first electrical detecting device according to the present invention. The fifth figure is a schematic view of the rotation of the first turntable in the present invention.

Claims (11)

一種晶粒之光電特性及外觀檢測系統,包含: 一第一外觀檢測裝置,其係具有一第一光學檢測器及一吸盤,該第一光學檢測器係位於該吸盤上方,該吸盤係可置放至少一晶粒,以供該第一光學檢測器進行該晶粒之正面檢測; 一移動裝置,其係可提取該正面檢測後之該至少一晶粒之任一該晶粒的該正面,以進行移動; 一第二外觀檢測裝置,其底部具有一第二光學檢測器,以使該移動裝置提取該晶粒之該正面移動時,經由該第二光學檢測器進行該晶粒之背面檢測; 一滑軌裝置,其係具有一滑軌及一移載元件,該移載元件係設置於該滑軌上,該移載元件係可承載該移動裝置所承載之進行完背面檢測後的該晶粒,以使該晶粒於該滑軌上移動; 一第一電性檢測裝置,其係設於該滑軌裝置,且具有一第一轉盤及一第一電性檢測組件,該第一轉盤可轉動至該滑軌裝置以承載該移載元件上之該晶粒,該第一轉盤再將該晶粒轉回至該第一電性檢測組件進行一第一電性檢測,檢測後,該第一轉盤再將該晶粒移回該滑軌裝置之該移載元件; 一第二電性檢測裝置,其係設於該滑軌裝置,並位於該第一電性檢測裝置之一側,該第二電性檢測裝置具有一第二轉盤及一第二電性檢測組件,該第二轉盤可轉動至該滑軌裝置以承載該移載元件上進行該第一電性檢測後之該晶粒,該第二轉盤再將該晶粒轉回至該第二電性檢測組件進行一第二電性檢測,檢測後,該第二轉盤再將該晶粒移回該滑軌裝置之該移載元件;以及 一第三外觀檢測裝置,其係設於該滑軌裝置,並位於該第二電性檢測裝置之一側,以使該第二電性檢測裝置位於該第一電性檢測裝置及該第三外觀檢測裝置間,該第三外觀檢測裝置具有一第三轉盤及一第三光學檢測器,該第三轉盤可轉動至該滑軌裝置以承載該移載元件上進行該第二電性檢測後之該晶粒,該第三轉盤再將該晶粒轉回至該第三光學檢測器中進行該晶粒之側面檢測,檢測後,該第三轉盤再將該晶粒移回該滑軌裝置之該移載元件,以使該移載元件將該晶粒移至分類。A photoelectric detecting and appearance detecting system for a crystal grain, comprising: a first appearance detecting device having a first optical detector and a suction cup, wherein the first optical detector is located above the suction cup, and the suction cup is detachable Having at least one die for the first optical detector to perform front detection of the die; a moving device for extracting the front side of any of the at least one die after the front side detection, For moving; a second appearance detecting device having a second optical detector at the bottom thereof for causing the moving device to extract the front side movement of the die, and performing back surface detection of the die via the second optical detector a slide rail device having a slide rail and a transfer component, wherein the transfer component is disposed on the slide rail, and the transfer component is capable of carrying the back surface inspection carried by the mobile device a first electrode and a first electrical detecting component, the first electrical detecting device is disposed on the sliding rail device, and has a first rotating wheel and a first electrical detecting component, the first The turntable can be rotated to the The track device carries the die on the transfer component, and the first turntable then turns the die back to the first electrical detection component for a first electrical detection. After the detection, the first turntable is The dies are moved back to the transfer component of the slide rail device; a second electrical detection device is disposed on the slide rail device and located on one side of the first electrical detection device, the second electrical property The detecting device has a second turntable and a second electrical detecting component, and the second rotating wheel is rotatable to the sliding rail device to carry the die on the transfer component for performing the first electrical detection, the second The turntable then turns the die back to the second electrical detection component for a second electrical detection. After the detection, the second turntable moves the die back to the transfer component of the slide rail device; and a third appearance detecting device is disposed on the rail device and located on one side of the second electrical detecting device, such that the second electrical detecting device is located in the first electrical detecting device and the third appearance Between the detecting devices, the third appearance detecting device has a third turntable and a third optical a third turntable rotatable to the slide rail device to carry the die on the transfer component for performing the second electrical detection, the third turntable rotating the die back to the third optics The side detection of the die is performed in the detector. After the detection, the third turntable moves the die back to the transfer component of the slide device to cause the transfer component to move the die to the classification. 如請求項1所述之晶粒之光電特性及外觀檢測系統,更包含一第一對位裝置,其係位於該滑軌裝置上,該第一對位裝置係將移動裝置所移動至滑軌裝置上之該晶粒,以於該移載元件上進行對位檢測以及調整位移。The photoelectric characteristics and appearance detecting system of the die of claim 1, further comprising a first alignment device located on the rail device, wherein the first alignment device moves the mobile device to the sliding rail The die on the device is used for alignment detection and displacement adjustment on the transfer component. 如請求項1所述之晶粒之光電特性及外觀檢測系統,更包含一第二對位裝置,其係位於該滑軌裝置上,該第二對位裝置係將進行完該第一電性檢測之該晶粒,以於該移載元件上進行對位檢測以及調整位移。The photoelectric characteristics and appearance detecting system of the die of claim 1, further comprising a second alignment device located on the rail device, wherein the second alignment device is to perform the first electrical property The die is detected to perform alignment detection and adjust displacement on the transfer component. 如請求項1所述之晶粒之光電特性及外觀檢測系統,更包含一第三對位裝置,其係位於該滑軌裝置上,該第三對位裝置係將進行完該第二電性檢測之該晶粒,以於該移載元件上進行對位檢測以及調整位移。The photoelectric characteristic and appearance detecting system of the die of claim 1, further comprising a third alignment device located on the rail device, wherein the third alignment device is to perform the second electrical property The die is detected to perform alignment detection and adjust displacement on the transfer component. 如請求項1所述之晶粒之光電特性及外觀檢測系統,更包含一第四對位裝置,其係位於該滑軌裝置上,該第四對位裝置係將進行完該側面檢測之該晶粒,以於該移載元件上進行對位檢測以及調整位移,再使該移載元件將該晶粒移至分類。The photoelectric characteristics and appearance detecting system of the die of claim 1, further comprising a fourth alignment device located on the rail device, wherein the fourth alignment device is to perform the side detection The die is used for the alignment detection and the displacement adjustment on the transfer component, and then the transfer component moves the die to the classification. 如請求項1所述之晶粒之光電特性及外觀檢測系統,其中該第一電性檢測係在第一溫度下進行電流、功率及波長的該第一電性檢測,而該第二電性檢測係在第二溫度下進行電流、功率及波長的該第二電性檢測。The photoelectric property and appearance detecting system of the die of claim 1, wherein the first electrical detecting performs the first electrical detection of current, power and wavelength at a first temperature, and the second electrical property The detection system performs the second electrical detection of current, power, and wavelength at a second temperature. 如請求項6所述之晶粒之光電特性及外觀檢測系統,其中該第一溫度係為20~40℃,第二溫度係為70~100℃。The photoelectric characteristics and appearance detecting system of the crystal grain according to claim 6, wherein the first temperature system is 20 to 40 ° C, and the second temperature system is 70 to 100 ° C. 如請求項1所述之晶粒之光電特性及外觀檢測系統,其中該第一電性檢測裝置及該第二電性檢測裝置各自更包含一光功率量測器及一光譜分析儀,以進行該晶粒之光電特性及波長的檢測。The optical characteristics and appearance detecting system of the die of claim 1, wherein the first electrical detecting device and the second electrical detecting device each further comprise an optical power measuring device and an optical spectrum analyzer for performing Detection of the photoelectric characteristics and wavelength of the crystal grain. 如請求項1所述之晶粒之光電特性及外觀檢測系統,其中該晶粒係為雷射二極體晶粒。The photoelectric characteristics and appearance detecting system of the crystal grain according to claim 1, wherein the crystal grain is a laser diode grain. 如請求項1所述之晶粒之光電特性及外觀檢測系統,其中該移動裝置係為一具有吸嘴之機械擺臂。The photoelectric characteristics and appearance detecting system of the die according to claim 1, wherein the moving device is a mechanical swing arm having a nozzle. 如請求項1所述之晶粒之光電特性及外觀檢測系統,其中該第三光學檢測器具有二光學鏡頭,此二光學鏡頭係面對面設置,當該晶粒位於該二光學鏡頭間,利用該二光學鏡頭進行該晶粒之該側面檢測。The photoelectric characteristic and appearance detecting system of the die of claim 1, wherein the third optical detector has two optical lenses, the two optical lenses are disposed face to face, and when the die is located between the two optical lenses, The two optical lenses perform the side detection of the die.
TW107131042A 2018-09-04 2018-09-04 Photoelectric characteristics and appearance detection system of crystal grains TWI670503B (en)

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TWM282101U (en) * 2005-05-09 2005-12-01 Chiung-Heng Tsai Improved decoration cover structure of a fluorescent tube base
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM282101U (en) * 2005-05-09 2005-12-01 Chiung-Heng Tsai Improved decoration cover structure of a fluorescent tube base
WO2011128808A1 (en) * 2010-04-15 2011-10-20 Koninklijke Philips Electronics N.V. Detection system for detecting magnetic particles
TW201241451A (en) * 2011-04-08 2012-10-16 Secron Co Ltd Method of inspecting light-emitting devices
CN102254220A (en) * 2011-04-13 2011-11-23 致茂电子(苏州)有限公司 Probe deviation detection system and method thereof of LED die point measurement machine

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