TWI666431B - A pressure-sensitive device - Google Patents

Abstract

The present invention relates to pressure touch technology, and in particular, to a pressure sensing device having a pressure-sensitive adhesive layer. The pressure sensing device includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes an adhesive layer and a nano-conductive material mixed in the adhesive layer. The pressure-sensitive adhesive layer is used to detect the resistance generated by the pressure deformation. Value changes. The manufacturing process of the pressure sensing device is simple and can greatly improve the yield of the product.

Description

Pressure sensing device

The present invention relates to pressure touch technology, and in particular, to a pressure sensing device having a pressure-sensitive adhesive layer.

At present, in the field of touch technology, a pressure sensing device for detecting the magnitude of a touch pressure is suddenly prosperous and highly sought after. Many innovative technologies around pressure sensing are increasing. At present, the pressure sensing device on the market is a pressure sensing layer specially manufactured on a substrate or a pressure sensing electrode needs to be specially arranged, and then another component is formed by an optical adhesive to form a pressure sensing device. Making its manufacturing process too complicated, too many manufacturing steps will inevitably reduce the yield of the product.

Therefore, a pressure sensing device with a simple process and a pressure sensing function is desired.

In order to overcome the problems of complicated manufacturing process and low product yield of the existing pressure sensing device, the present invention provides a pressure sensing device with a simple manufacturing process.

The solution to the technical problem of the present invention is to provide a pressure sensing device. The pressure sensing device includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes an adhesive layer and a nano-conductive material mixed in the adhesive layer. , The pressure The sensing adhesive layer is used to detect the change in resistance after being deformed by pressure.

Preferably, the electrical resistance of the pressure-sensitive adhesive layer is increased or decreased after being pressed.

Preferably, the pressure-sensitive adhesive layer is a nano-conductive material that is cured and mixed with the liquid optical adhesive layer.

Preferably, the nano-conductive material is nano-grade silver, copper, aluminum, gold, or nano-grade indium tin oxide, tin antimony oxide, indium zinc oxide, zinc aluminum oxide, or graphene, carbon nanometer. tube.

Preferably, the pressure sensing device further includes a substrate, and the pressure-sensitive adhesive layer is used to attach the substrate to another component.

Preferably, the pressure sensing device further includes a transmission line and a reception line disposed on the substrate, and the transmission line and the reception line are electrically connected to the pressure sensing adhesive layer and a detection chip, and the resistance of the pressure sensing adhesive layer is blocked. The change in value is transmitted to the detection wafer.

Preferably, the transmission line and the reception line are connected to opposite sides or two opposite corners of the pressure-sensitive adhesive layer.

Preferably, the pressure sensing device further includes a touch panel, the touch panel has a substrate, and a conductive pattern layer for detecting a touch position is formed on one surface of the substrate. The pressure-sensitive adhesive layer is used for bonding the touch panel and another component.

Preferably, the conductive pattern layer is located between the pressure-sensitive adhesive layer and the substrate, and an insulating protection layer is further provided between the conductive pattern layer and the pressure-sensitive adhesive layer to electrically insulate the layer. The conductive pattern layer and the pressure-sensitive adhesive layer.

Preferably, the pressure sensing device further includes a transmission line and a reception line disposed on the substrate at the same layer as the conductive pattern layer, and the transmission line and the reception line are guided through the insulation protection layer correspondingly. The through hole at the position is electrically connected to the pressure-sensitive adhesive layer and a detection chip, and transmits the resistance value change of the pressure-sensitive adhesive layer to the detection chip.

Preferably, the pressure sensing device further includes a pressure sensing panel, the pressure sensing panel has a substrate, and a pressure sensing electrode layer for detecting a touch pressure is formed on one surface of the substrate. The pressure-sensitive adhesive layer is used to attach the pressure-sensing panel to another element.

Preferably, the pressure-sensitive electrode layer is located between the pressure-sensitive adhesive layer and the substrate.

Preferably, the pressure-sensitive electrode layer is in contact with the pressure-sensitive adhesive layer.

Preferably, the pressure sensing electrode layer includes a plurality of pressure sensing units and a plurality of signal lines, and two ends of the pressure sensing unit are electrically connected to a chip through the signal lines.

Preferably, the pressure-sensitive adhesive layer is electrically connected to the detection chip through the pressure-sensitive electrode unit and the signal line, and the resistance change of the pressure-sensitive adhesive layer and the resistance value change of the pressure-sensitive electrode unit are superimposed and transmitted to all The detection wafer is described.

Compared with the prior art, the pressure-sensing device of the present invention uses a pressure-sensitive adhesive layer to detect the contact pressure. The pressure-sensitive adhesive layer is a new type of piezoresistive material, which includes an optical adhesive and a nano-conductive material placed therein. Material, so that it has both adhesive characteristics and touch pressure sensing characteristics. So in the pressure sensitive adhesive When the layer is used on a pressure sensing device, there is no need to separately make a pressure sensing electrode, and the original optical adhesive layer can be replaced with a pressure sensing adhesive layer to maintain the sticking function and can also replace the existing pressure sensing electrode. Sensing touch pressure.

When the pressure-sensitive adhesive layer is used in an integrated touch (OneGlassSolution; OGS) touch panel with a touch position detection function, a panel with a two-dimensional detection function can be upgraded to a panel with a three-dimensional detection function. When the pressure-sensitive adhesive layer is used in a pressure touch panel that already has a three-dimensional detection function, the function of detecting the pressure of touch can be enhanced. When the pressure-sensitive adhesive layer is used in a display panel, a display panel with pressure sensing can be formed. Therefore, the pressure-sensitive adhesive layer of this functional structure can be used in almost all laminated touch panels or display panels. It has the effect of wide application range, simple process, high yield, and good application prospect.

10‧‧‧Pressure sensing device

11‧‧‧Touch Panel

20‧‧‧Pressure sensing device

21‧‧‧Pressure sensing panel

90‧‧‧pressure sensing device

101‧‧‧ substrate (first substrate)

103‧‧‧Pressure-sensitive adhesive layer

105‧‧‧Insulation protective layer

106‧‧‧Chip

108‧‧‧through hole

109‧‧‧ conductive pattern layer

201‧‧‧ substrate (first substrate)

203‧‧‧Pressure-sensitive adhesive layer

206‧‧‧test chip

208‧‧‧Pressure sensing electrode layer

800‧‧‧ Pressure Sensitive Adhesive Layer

801‧‧‧optical glue

803‧‧‧Nano conductive material

901‧‧‧ substrate (second substrate)

903‧‧‧Pressure-sensitive adhesive layer

1051‧‧‧ Insulation protective layer boundary

1071‧‧‧First direction touch electrode signal line

1073‧‧‧Second direction touch electrode signal line

1076‧‧‧Send Line

1077‧‧‧Receiving line

1093‧‧‧First direction touch electrode

2076‧‧‧Signal cable

2081‧‧‧Pressure sensing unit

9076‧‧‧Send Line

9077‧‧‧Receiving line

Read the following detailed description and the corresponding drawings to understand the multiple aspects of this disclosure. It should be noted that many features in the drawings are not drawn according to the standard practice in the industry. In fact, the dimensions of the features can be arbitrarily increased or decreased to facilitate the clarity of the discussion.

FIG. 1 is a schematic cross-sectional structure diagram of a pressure-sensitive adhesive layer according to a first embodiment of the present invention.

FIG. 1A is a schematic cross-sectional structure diagram of a touch principle in a first state of a pressure-sensitive adhesive layer according to a first embodiment of the present invention.

FIG. 1B is a schematic cross-sectional view of a touch principle in a second state of the pressure-sensitive adhesive layer according to the first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional structure diagram of a pressure sensing device according to a second embodiment of the present invention.

3 is a schematic cross-sectional structure diagram of a pressure sensing device according to a third embodiment of the present invention.

3A-3B are schematic plan views of a pressure sensing device according to a third embodiment of the present invention.

4 is a schematic cross-sectional structure diagram of a pressure sensing device according to a fourth embodiment of the present invention.

4A is a schematic plan view of a pressure sensing device according to a fourth embodiment of the present invention.

In order to make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

Referring to FIG. 1, a pressure-sensitive adhesive layer 800 provided by the present invention is an optical adhesive layer having a certain thickness. A nano-level nano-conductive material 803 is placed inside the optical adhesive 801 to form a pressure similar to a piezoresistive material. Induction adhesive layer 800. The pressure-sensitive adhesive layer 800 is generally formed by mixing a nano-conductive material 803 in a liquid optical adhesive 801 and then coating it on other laminated structures for curing. The nano-conductive material 803 is uniformly distributed in the optical adhesive 801. In order to maintain sufficient optical adhesive 801 to ensure proper viscosity of the pressure-sensitive adhesive layer 800, its distribution rate in the optical adhesive 801 should not be greater than 70%; Ensure that there is sufficient nano-conductive material 803 and that nano-conductive material 803 is sufficient Enough electronic transitions are generated, so that a large amount of resistance signal change can be detected after pressing. The pressure-sensitive adhesive layer 800 can effectively and accurately detect the pressing pressure. The distribution rate of the nano-conductive material 803 in the optical adhesive 801 should not be less than 10%. The fraction ratio mentioned here refers to the concentration of the nano-conductive material 803 mixed in the optical glue 801 in the liquid optical glue 801 per unit volume.

Since the optical adhesive 801 is a Liquid Optical Clear Adhesive (LOCA), it has tackiness, and can be used to stick two laminations to be bonded in the same way as conventional optical adhesives.

The nano-conductive material 803 may be a strip-shaped or granular conductive material, and may be a nano-grade metal such as silver, copper, aluminum, or gold, or a nano-grade indium tin oxide (ITO), an oxide, or the like. Metal oxides such as tin antimony (Antimony Doped Tin Oxide, ATO), indium zinc oxide (IZO), aluminum zinc oxide (Aluminum Zinc Oxide, AZO), or any one of graphene and carbon nanotubes.

Please refer to FIG. 1A. In one case, when a finger is pressed on the pressure-sensitive adhesive layer 800 or other devices having the laminated structure of the pressure-sensitive adhesive layer 800, the pressed surface will deform, causing it to deform. The inner nano-conductive material 803 starts to be squeezed, and the multiple nano-conductive materials 803 are closer together. In this way, the electronic transition phenomenon between multiple nano-conductive materials 803 becomes easier and more active, which causes the resistance of the entire pressure-sensitive adhesive layer 800 to decrease. By comparing the resistance value after pressing with the resistance value of the pressure-sensitive adhesive layer 800 in the initial state, the change amount of the resistance value after pressing can be obtained, and the change amount is transmitted to the detection chip, and then the pressing force can be calculated. Size, to realize that the pressure-sensitive adhesive layer 800 can have a sensing function in the third dimension. This happens In the case where the optical glue 801 is solid and its internal structure is relatively stable, the nano-conductive material 803 cannot be displaced within the optical glue 801, and can only be deformed simultaneously with the optical glue 801.

Please refer to FIG. 1B. In another case, when a finger is pressed on the pressure-sensitive adhesive layer 800 or another device having the laminated structure of the pressure-sensitive adhesive layer 800, the pressed surface will appear the same as the above figure. Deformation. However, the inner nano-conductive material 803 is shifted to both sides after pressing, so that the density of the nano-conductive material 803 in the pressed area becomes low. In this way, the electronic transition between multiple nano-conductive materials 803 in the pressing area becomes more difficult, and the probability of the electronic transition occurring is lower, which causes the resistance of the entire pressure-sensitive adhesive layer 800 to increase. By comparing the resistance value after pressing with the resistance value of the pressure-sensitive adhesive layer 800 in the initial state, the change amount of the resistance value after pressing can be obtained, and the change amount is transmitted to the detection chip, and then the pressing force can be calculated. Size, to realize that the pressure-sensitive adhesive layer 800 can have a sensing function in the third dimension. This situation occurs when the optical gel 801 is solid or semi-solid and its internal structure is flexible. The nano-conductive material 803 can migrate in the optical gel 801. After being pressed, in addition to being deformed with the optical gel 801, it can also be deformed. The optical glue 801 moves independently.

Please refer to FIG. 2, a second embodiment of the present invention provides a pressure sensing device 90 including a substrate 901, and a pressure-sensitive adhesive layer 903 is provided on the substrate 901 for sensing touch pressure. At the same time, the substrate 901 can also be attached to other laminated structures, such as a fingerprint identification layer, a display panel layer, and an OLED light-emitting layer, so that they have a three-dimensional sensing or pressure-touch display function. A transmitting line 9076 and a receiving line 9077 are provided on a surface of the substrate 901 that is in contact with the pressure-sensitive adhesive layer 903. The transmitting line 9076 and the receiving line 9077 are pressure sensitive. The adhesive layer 903 is electrically connected to a detection chip (not shown), and is used to transmit the contact pressure information of the pressure-sensitive adhesive layer 903 to the detection chip. The transmission line 9076 and the reception line 9077 are preferably connected to opposite sides or two opposite corners of the pressure-sensitive adhesive layer 903.

In the manufacturing process of the pressure sensing device 90, a sending line 9076 and a receiving line 9077 may be formed on the periphery of one surface of the substrate 901, and then a pressure sensing is provided on the surface of the substrate 901 where the sending line 9076 and the receiving line 9077 are formed. The adhesive layer 903 is electrically connected to the transmission line 9076 and the reception line 9077. In this way, there is no need to specially arrange a pressure sensing electrode, but only a transmission line 9076 and a reception line 9077 need to be provided, and then a pressure sensing adhesive layer 903 is attached to form a pressure sensing device, which can be used to detect the magnitude of the touch pressure. The manufacturing process is simple, which can improve the yield.

In the present invention, the substrate 901 may be a rigid substrate, such as glass, tempered glass, sapphire glass, etc., or a flexible substrate, such as polyetheretherketone (PEEK), polyimide (PI), polyimide Polyethylene terephthalate (PET), polycarbonate (PC), polyethylene glycol succinate (PES), polymethyl methacrylate ( Polymethylmethacrylate (PMMA), polyvinyl chloride (Polyvinyl chloride) (PVC), polypropylene (Polypropylene; PP), and a composite of any two of them.

In one embodiment of the present invention, the substrate 901 may be a protective cover plate, which is used to provide a protection for the pressure sensing device 90, and the other surface which is not attached to the pressure-sensitive adhesive layer 903 serves as a pressure-sensitive one. Effect surface. In other embodiments of the present invention, the other surface of the substrate 901 that is not bonded to the pressure-sensitive adhesive layer 903 can also be used as a carrier substrate for other touch or display structures. To provide a planar touch electrode, a pressure sensing electrode, a display member, and the like thereon. In the following embodiments, the materials and functions of the substrate are substantially the same as those in this embodiment, and will not be described one by one.

Referring to FIG. 3, a third embodiment of the present invention provides a pressure sensing device 10 including a touch panel 11. The pressure-sensitive adhesive layer 103 is used to attach the touch panel 11 to another component (not shown). The touch panel 11 has a substrate 101 on which a conductive pattern layer 109 is formed for sensing a touch position. At the same time, the same pressure-sensitive adhesive layer 103 as in the first embodiment is coated on the conductive pattern layer 109 for sensing the touch pressure, and the touch panel 11 can also be pasted on other laminated structures, such as fingerprints. Identification layer, display panel layer, OLED light-emitting layer, etc. make them have three-dimensional sensing function. Here, an insulating protection layer 105 is also provided on the surface of the conductive pattern layer 109 to protect the conductive pattern layer 109 from oxidation and abrasion. In this embodiment, the space between the conductive pattern layer 109 and the pressure-sensitive adhesive layer 103 is further ensured. Electrical insulation.

In this embodiment, a transmission line 1076 and a reception line 1077 are provided on the same surface of the substrate 101 on which the conductive pattern layer 109 is formed. The transmission line 1076 and a reception line 1077 can be fabricated in synchronization with the conductive pattern layer 109. A through hole 108 is provided at the corresponding position of the protective layer 105, the transmission line 1076, and the reception line 1077. The pressure-sensitive adhesive layer 103 is electrically connected to the transmission line 1076 and the reception line 1077 through the through hole 108. The transmission line 1076 and the reception line 1077 are used for The contact pressure information of the pressure-sensitive adhesive layer 903 is transmitted to the detection chip.

Referring to FIG. 3A, the conductive pattern layer 109 includes a first-direction touch electrode 1093, a second-direction touch electrode 1095, a first-direction touch electrode signal line 1071, and a second-direction touch electrode signal line 1073. The first direction Touch The pole 1093 and the second-direction touch electrode 1095 are respectively used to sense the two-direction coordinate values of the touch position. The first direction touch electrode 1093 is connected to the detection chip 106 through a first direction touch electrode signal line 1071, and the second direction touch electrode 1095 is connected to the detection chip 106 through a second direction touch electrode signal line 1073. The current of the first direction touch electrode 1093 and the second direction touch electrode 1095 is detected to determine the touch position.

At the same time, the pressure-sensitive adhesive layer 103 on the conductive pattern layer 109 side is also connected to the detection chip 106 through a transmitting line 1076 and a receiving line 1077, for detecting the pressure of the pressure-sensitive adhesive layer 103. The transmission line 1076 and the reception line 1077 are preferably formed on the substrate 101 in synchronization with the first direction touch electrode signal line 1071 and the second direction touch electrode signal line 1073 in the same material.

More preferably, the transmission line 1076 and the reception line 1077 are disposed on two opposite corners of the pressure-sensitive adhesive layer 103. Of course, it can also be arranged on two pairs of edges, as shown in FIG. 3B.

The coverage area of the pressure-sensitive adhesive layer 103 is equal to the area area of the insulation protection layer 105, and the coverage area of the insulation protection layer 105 is larger than the area area of the conductive pattern layer 109. The insulating protection layer 105 completely covers the conductive pattern layer 109 and the first-direction touch electrode signal lines 1071 and the second-direction touch electrode signal lines 1073 connected thereto.

As can be seen from FIG. 3A, the boundary of the pressure-sensitive adhesive layer 103 and the boundary 1051 of the insulation protection layer exceed the surrounding edges of the conductive pattern layer 109. So that the insulating protection layer 105 can completely isolate the conductive pattern layer 109, the first direction touch electrode signal line 1071, the second direction touch electrode signal line 1073, and the pressure sense. 应 胶层 103。 The adhesive layer 103. A through hole 108 is provided only at the corresponding position of the insulation protection layer 105, the transmission line 1076, and the reception line 1077. The pressure-sensitive adhesive layer 103 is electrically connected to the transmission line 1076 and the reception line 1077 through the through hole 108. The through hole 108 It is not limited to a circular hole, and may be a long shape to increase the contact area of the pressure-sensitive adhesive layer 103 with the transmission line 1076 and the reception line 1077. In the manufacturing process of the pressure sensing device 10, it is only necessary to simultaneously form the conductive pattern layer, and simultaneously send the transmission line 1076 and the reception line 1077 with the same material, and electrically connect the pressure-sensitive adhesive layer 101 in the subsequent process to form a pressure feeling.测 装置。 Testing device. Not only is the process simple, and the yield is high, it can also save materials and processes to the greatest extent. And when the substrate 101 is a protective cover and the touch panel 11 is an integrated touch panel (OneGlassSolution, OGS) structure, the design of this embodiment implements the three-dimensional touch function in the simplest way, and has good applications. prospect.

Referring to FIG. 4, a fourth embodiment of the present invention provides a pressure-sensing device 20 further including a pressure-sensing panel 21. The pressure-sensitive adhesive layer is used to attach the pressure-sensing panel 21 to another component. The pressure sensing panel 21 includes a substrate 201, and a pressure sensing electrode layer 208 is formed on the substrate 201 for sensing a touch pressure. At the same time, the pressure-sensitive electrode layer 208 is coated with the same pressure-sensitive adhesive layer 203 as the first embodiment, which can be used to collect the touch-pressure detection signal for enhancing the touch-pressure sensing of the pressure-sensitive electrode layer 208. The pressure-sensing panel 21 can be attached to other laminated structures, such as a fingerprint recognition layer, a display panel layer, and an OLED light-emitting layer, so that they have sensitive multi-functional sensing, pressure sensing and display functions.

Referring to FIG. 4A, the pressure sensing electrode layer 208 includes a plurality of pressure sensing units 2081 and a plurality of signal lines. Each pressure sensing unit 2081 is The wires are meandering and arranged in a radial "m-shaped" pattern. When the pressure sensing unit 2081 is pressed, the pressure sensing unit 2081 is deformed and changes the resistance value. The resistance change information is transmitted through the pressure sensing unit 2081 and the connection. The signal lines 2076 at both ends of the pressure sensing unit 2081 are transmitted to the detection chip 206 for processing. Here, since the pressure-sensitive adhesive layer 203 is in contact with the pressure-sensitive electrode layer 208, the pressure signals collected by the pressure-sensitive adhesive layer 203 can be transmitted to the detection chip 206 through the pressure-sensing unit 2081 and the signal line 2076 without the need for additional settings for transmission. Line and receiving line to connect the pressure-sensitive adhesive layer 203 and the detection chip 206. In addition, for locations where the pressure sensing unit 2081 or the signal line 2076 may be disconnected or worn due to process operations, the pressure sensing adhesive layer 203 may also be electrically connected or reinforced to improve the reliability of the pressure sensing panel.

In this embodiment, the pressure-sensitive adhesive layer 203 is adhered to a surface of the pressure-sensing panel 21 and provided with the pressure-sensitive electrode layer 208. The pressure-sensitive electrode layer 208 and the pressure-sensitive adhesive layer 203 are both used to sense the touch pressure. Here, the pressure-sensitive adhesive layer 203 plays a role in enhancing the pressing pressure sensing, and the pressure-sensitive electrode layer 208 and the pressure-sensitive adhesive layer 203 are in contact with each other, and the amount of change in the contact pressure of the pressure-sensitive electrode layer 208 and the pressure-sensitive adhesive The amount of change in the contact pressure of the layer 203 can be finally calculated as the contact pressure in a superimposed manner. In this way, the sensitivity of the pressure detection can be significantly improved. In this embodiment, the pressure sensing device 20 itself has a pressure sensing unit pattern 2081 and the arrangement of the pressure sensing adhesive layer 203 can increase the sensitivity of pressure detection and increase the reliability of the pressure sensing panel without adding other processes.

Compared with the prior art, the pressure sensing device of the present invention uses a pressure-sensitive adhesive layer to detect the contact pressure. The pressure-sensitive adhesive layer is a kind of New piezoresistive materials, including optical glue and nano-conductive materials placed in it, have both adhesive properties and touch pressure sensing characteristics. Therefore, when the pressure-sensitive adhesive layer is used on a pressure-sensing device, there is no need to separately create a pressure-sensitive electrode, and the original optical adhesive layer can be replaced with a pressure-sensitive adhesive layer to maintain the function of pasting, and can also replace the existing The pressure-sensing electrode is used to sense the touch pressure.

When the pressure-sensitive adhesive layer is used in an integrated touch (OneGlassSolution; OGS) touch panel with a touch position detection function, a panel with a two-dimensional detection function can be upgraded to a panel with a three-dimensional detection function. When the pressure-sensitive adhesive layer is used in a pressure touch panel that already has a three-dimensional detection function, the function of detecting the pressure of touch can be enhanced. When the pressure-sensitive adhesive layer is used in a display panel, a display panel with pressure sensing can be formed. Therefore, the pressure-sensitive adhesive layer of this functional structure can be used in almost all laminated touch panels or display panels. It has the effect of wide application range, simple process, high yield, and good application prospect.

The above descriptions are merely preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, and improvement made within the principles of the present invention shall fall within the protection scope of the present invention.

Claims (13)

A pressure-sensing device includes: a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer including an adhesive layer and a nano-conductive material mixed in the adhesive layer, and the pressure-sensitive adhesive layer is used for detecting the deformation caused by pressure A first resistance value change generated later; a pressure-sensitive electrode layer contacting the pressure-sensitive adhesive layer, the pressure-sensitive electrode layer will generate a second resistance value change due to deformation; and a detection chip for detecting the pressure The change in the first resistance value of the adhesive layer and the change in the second resistance value of the pressure-sensing electrode layer are used to calculate the strength of the touch pressure. The pressure sensing device according to item 1 of the patent application scope, wherein a resistance after the pressure-sensitive adhesive layer is pressed is increased or decreased. The pressure sensing device according to item 1 of the application, wherein the pressure-sensitive adhesive layer is formed by curing the nano-conductive material mixed with a liquid optical adhesive layer. The pressure sensing device according to item 3 of the patent application scope, wherein the nano-conductive material is nano-grade silver, copper, aluminum, gold, or nano-grade indium tin oxide, tin antimony oxide, and indium zinc oxide , Zinc aluminum oxide, or graphene, carbon nanotube. The pressure sensing device according to item 1 of the patent application scope further includes a pressure sensing panel and a second substrate. The pressure sensing electrode layer is disposed on the pressure sensing panel. The pressure sensing adhesive layer is used for The second substrate and the pressure-sensing panel are attached to a surface on which the pressure-sensing electrode layer is disposed. The pressure sensing device according to item 5 of the scope of patent application, further comprising a transmission line and a reception line disposed on the second substrate, and the transmission line and the reception line are conductively connected to the pressure-sensitive adhesive layer and the detection chip. , Transmitting the change in the first resistance value of the pressure-sensitive adhesive layer to the detection chip. The pressure sensing device according to item 6 of the scope of patent application, wherein the transmitting line and the receiving line are connected to opposite sides or two opposite corners of the pressure-sensitive adhesive layer. The pressure sensing device according to item 1 of the patent application scope further includes a pressure sensing panel and a touch panel. The touch panel has a second substrate, and a surface of the second substrate is further provided on the surface of the second substrate. A conductive pattern layer is formed for detecting a touch position, the pressure-sensing electrode layer is disposed on the pressure-sensing panel, and the pressure-sensitive adhesive layer is used to fit the touch panel and the pressure-sensing panel. The surface of the pressure-sensing electrode layer. The pressure sensing device according to item 8 of the patent application, wherein the conductive pattern layer is located between the pressure-sensitive adhesive layer and the second substrate, and a conductive pattern layer is further provided between the conductive pattern layer and the pressure-sensitive adhesive layer. The insulating protection layer electrically insulates the conductive pattern layer and the pressure-sensitive adhesive layer. The pressure sensing device according to item 9 of the scope of patent application, further comprising a transmission line and a reception line disposed on the second substrate at the same layer as the conductive pattern layer, and the transmission line and the reception line are guided through the insulation. The through hole at the corresponding position of the protective layer is electrically connected to the pressure-sensitive adhesive layer and the detection chip, and transmits the first resistance change of the pressure-sensitive adhesive layer to the detection chip. The pressure sensing device according to item 1 of the patent application scope further includes a pressure sensing panel, wherein the pressure sensing panel includes a first substrate, the pressure sensing electrode layer is formed on the first substrate, and the pressure The sensing electrode layer is located between the pressure-sensitive adhesive layer and the first substrate. The pressure sensing device according to item 11 of the patent application, wherein the pressure sensing electrode layer includes a plurality of pressure sensing units and a plurality of signal lines, and both ends of the pressure sensing units are electrically connected to a chip through the signal lines. The pressure sensing device according to item 12 of the patent application, wherein the pressure sensing adhesive layer is electrically connected to the detection chip through the pressure sensing unit and the signal line, and the first resistance change of the pressure sensing adhesive layer and The second resistance value changes of the pressure sensing units are transmitted to the detection chip in a superimposed manner.