TWI661481B - Laser cutting method and apparatus thereof - Google Patents

Laser cutting method and apparatus thereof Download PDF

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TWI661481B
TWI661481B TW107113074A TW107113074A TWI661481B TW I661481 B TWI661481 B TW I661481B TW 107113074 A TW107113074 A TW 107113074A TW 107113074 A TW107113074 A TW 107113074A TW I661481 B TWI661481 B TW I661481B
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metal foil
cutting
laser cutting
laser
blowing device
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TW201944478A (en
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黃萌義
熊學毅
蘇柏年
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雷科股份有限公司
黃萌義
熊學毅
蘇柏年
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Abstract

一種雷射切割方法及其設備,其切割方法主要依序透過切割、覆膜、切斷等步驟來進行金屬箔的切割,並同時配合夾持治具夾持住欲切割之金屬箔,再由位於夾持治具上方的掃瞄頭單元製造出切割用的雷射光束並開始進行切割,而在切割的過程中會同時使用上輔助吹氣裝置以及下輔助吹氣裝置將冷卻氣體噴向金屬箔,且切割的過程中還會搭配熱像儀來監控金屬箔之溫度,並依照金屬箔的溫度變化來調控上輔助吹氣裝置以及下輔助吹氣裝置的出風量。A laser cutting method and a device thereof. The cutting method mainly cuts metal foil through cutting, coating, cutting and other steps in sequence, and simultaneously holds a metal foil to be cut with a clamping jig, and then The scanning head unit above the holding jig produces a laser beam for cutting and starts cutting. During the cutting process, the upper auxiliary blowing device and the lower auxiliary blowing device are used to spray cooling gas towards the metal at the same time. Foil, and during the cutting process, a thermal imager is also used to monitor the temperature of the metal foil, and the air output of the upper auxiliary blowing device and the lower auxiliary blowing device is adjusted according to the temperature change of the metal foil.

Description

雷射切割方法及其設備Laser cutting method and equipment

本發明係有關於一種切割的方法及其設備;更詳而言之,特別係關於一種用於切割金屬箔的雷射切割方法及其設備。The invention relates to a cutting method and a device thereof; more specifically, it relates to a laser cutting method and a device for cutting a metal foil.

一般市面上的雷射加工機普遍運用在半導體、金屬、陶瓷、玻璃及其他多種材料的標記、雕刻、微加工、切割以及鑽孔,然而這些雷射加工機一旦碰到要在金屬箔上進行加工,就會受到雷射加工機本身對於金屬箔厚度以及雷射切割線寬的要求進而產生諸多限制,使金屬箔的加工品質普遍不佳甚至是無法進行加工。Generally, laser processing machines on the market are widely used in the marking, engraving, micro-machining, cutting and drilling of semiconductors, metals, ceramics, glass and other materials. However, once these laser processing machines are encountered, they need to be performed on metal foil. Processing, it will be subject to the requirements of the laser processing machine itself for the thickness of the metal foil and the laser cutting line width, which will cause a lot of restrictions, making the processing quality of the metal foil generally poor or even impossible to process.

有鑑於此,本案申請人遂依其多年從事相關領域之研發經驗,針對前述之缺失進行深入探討,並依前述需求積極尋求解決之道,歷經長時間的努力研究與多次測試,終於完成本發明。In view of this, the applicant of this case based on his many years of R & D experience in related fields, conducted in-depth discussions on the aforementioned shortcomings, and actively sought solutions based on the aforementioned needs. After a long period of hard research and multiple tests, he completed this invention.

本發明之主要目的在於提供一種能利用雷射光束在金屬箔上切割出多邊形、圓形或是螺旋的方法以及設備。The main purpose of the present invention is to provide a method and a device capable of cutting a polygon, a circle or a spiral on a metal foil by using a laser beam.

為達上述之目的,本發明雷射切割方法,係透過下列步驟所製成: A. 切割步驟:利用雷射切割設備的雷射光束在金屬箔上切割出元件的外型,而切割後的元件與金屬箔之間仍留有一處以上未切斷的微連結。 B. 覆膜步驟:從雷射切割設備中取出經過切割步驟處理過的金屬箔,並於金屬箔的其中一面覆上承載膜。 C. 切斷步驟:將完成覆膜的金屬箔放回雷射切割設備內,再利用雷射光束切斷元件與金屬箔之間的微連結,而切斷微連結後的元件仍會附著於承載膜上,最後將元件從承載膜上取下即完成雷射切割的加工。In order to achieve the above-mentioned object, the laser cutting method of the present invention is made by the following steps: A. Cutting step: using a laser beam of a laser cutting device to cut the shape of a component on a metal foil, There is still more than one uncut micro-link between the component and the metal foil. B. Laminating step: Take out the metal foil processed by the cutting step from the laser cutting equipment, and cover one side of the metal foil with a carrier film. C. Cutting step: Put the metal foil that has been coated back into the laser cutting equipment, and then use the laser beam to cut the micro-connection between the element and the metal foil, and the component after the micro-connection is still adhered to On the carrier film, the component is finally removed from the carrier film to complete the laser cutting process.

而本發明雷射切割設備,係包含有掃瞄頭單元、夾持治具、移位機構、上輔助吹氣裝置、下輔助吹氣裝置以及熱像儀。The laser cutting device of the present invention includes a scanning head unit, a clamping jig, a displacement mechanism, an upper auxiliary blowing device, a lower auxiliary blowing device, and a thermal imager.

所述掃瞄頭單元係用於製造以及發射雷射光束,並利用該雷射光束來切割金屬箔。The scanning head unit is used for manufacturing and emitting a laser beam, and uses the laser beam to cut a metal foil.

所述夾持治具設置於掃瞄頭單元下方,係用於夾持欲切割之金屬箔,該夾持治具係由上壓治具以及下壓治具所組成,而上壓治具以及下壓治具均設有凸出並用於壓合金屬箔的支柱,使金屬箔被夾持時處於騰空狀態。The clamping jig is arranged below the scanning head unit and is used for clamping the metal foil to be cut. The clamping jig is composed of an upper pressing jig and a lower pressing jig, and the upper pressing jig and The lower pressing jigs are provided with pillars protruding and used for pressing the metal foil, so that the metal foil is vacated when being clamped.

所述移位機構與夾持治具連結,該移位機構係用於固定夾持治具並使夾持治具能於水平方向移動。The shifting mechanism is connected with the clamping jig, and the shifting mechanism is used for fixing the clamping jig and enabling the clamping jig to move in a horizontal direction.

所述上輔助吹氣裝置設置於夾持治具以及掃瞄頭單元之間,該上輔助吹氣裝置係從上方將冷卻氣體吹向金屬箔之表面,藉此來將金屬箔的表面溫度控制在適當的範圍內。The upper auxiliary air blowing device is disposed between the clamping jig and the scanning head unit. The upper auxiliary air blowing device blows cooling gas from the top to the surface of the metal foil, thereby controlling the surface temperature of the metal foil. Within the proper range.

所述下輔助吹氣裝置設置於移位機構內部,該下輔助吹氣裝置係從下方將冷卻氣體吹向金屬箔之表面,藉此來將金屬箔的表面溫度控制在適當的範圍內。The lower auxiliary air blowing device is provided inside the displacement mechanism. The lower auxiliary air blowing device blows cooling gas from the bottom toward the surface of the metal foil, thereby controlling the surface temperature of the metal foil within an appropriate range.

所述熱像儀設置於雷射切割設備內能照射到金屬箔之適當位置,該熱像儀用於監控切割金屬箔時的表面溫度變化,並將溫度變化資訊回報給雷射切割設備,藉此來幫助調整上輔助吹氣裝置以及下輔助吹氣裝置的吹氣量。The thermal imager is arranged in a proper position in the laser cutting equipment that can irradiate the metal foil. The thermal imager is used to monitor the surface temperature change when cutting the metal foil and report the temperature change information to the laser cutting equipment. This helps to adjust the blowing volume of the upper auxiliary blowing device and the lower auxiliary blowing device.

本發明雷射切割方法及其設備的具有下列優點: 1. 切割金屬箔時所預留的微連結以及承載膜的運用,使切割和切斷的過程中不會有散料的情況發生。 2. 上輔助吹氣裝置、下輔助吹氣裝置以及熱像儀的搭配,使切割的過程中金屬箔能保持在最佳的切割溫度。The laser cutting method and its equipment of the present invention have the following advantages: 1. The micro-links reserved during the cutting of the metal foil and the use of the carrier film prevent the occurrence of bulk materials during the cutting and cutting process. 2. The combination of the upper auxiliary air blowing device, the lower auxiliary air blowing device and the thermal imager can keep the metal foil at the optimal cutting temperature during the cutting process.

期許本發明之目的、功效、特徵及結構能夠有更為詳盡之瞭解,茲舉較佳實施例並配合圖式說明如後。It is expected that the purpose, effects, features, and structure of the present invention can be understood in more detail. The preferred embodiments are described below with reference to the drawings.

首先請參閱圖1以及圖2,圖1為本發明雷射切割方法流程示意圖,圖2為本發明雷射切割設備剖視示意圖。First please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic flowchart of a laser cutting method according to the present invention, and FIG. 2 is a schematic cross-sectional view of a laser cutting device according to the present invention.

本發明雷射切割方法1,係透過下列步驟所製成: A. 切割步驟11:利用雷射切割設備2的雷射光束在金屬箔3上切割出元件的外型,而切割後的元件與金屬箔3之間仍留有一處以上未切斷的微連結,而該微連結能使元件仍連結於金屬箔3上,使其在切割的過程中不會有散料的情況發生,其中,切割步驟11中所使用的雷射光束可為脈衝寬度200ns以上的長脈衝雷射(long-pulsed)。 B. 覆膜步驟12:從雷射切割設備2中取出經過切割步驟 11處理過的金屬箔3,並於金屬箔3的其中一面覆上承載膜。 C. 切斷步驟13:將覆有承載膜的金屬箔3放回雷射切割設備2內,並利用雷射光束切斷元件與金屬箔3之間的微連結,而切斷微連結後的元件仍會附著於承載膜上,最後將元件從承載膜上取出即完成雷射切割的加工。The laser cutting method 1 of the present invention is made by the following steps: A. Cutting step 11: The laser beam of the laser cutting device 2 is used to cut the shape of the component on the metal foil 3, and the cut component and the There is still one or more uncut micro-links between the metal foils 3, and the micro-links can keep the components connected to the metal foils 3, so that no loose materials will occur during the cutting process. Among them, The laser beam used in the cutting step 11 may be long-pulsed with a pulse width of 200 ns or more. B. Film coating step 12: Take out the metal foil 3 treated by the cutting step 11 from the laser cutting device 2 and cover the metal foil 3 with a carrier film. C. Cutting step 13: Put the metal foil 3 covered with the carrier film back into the laser cutting device 2 and use the laser beam to cut the micro-connection between the element and the metal foil 3 to cut the micro-connection. The component will still be attached to the carrier film. Finally, the component will be removed from the carrier film to complete the laser cutting process.

另外,本發明雷射切割設備2,係包含有掃瞄頭單元 21、夾持治具22、移位機構23、上輔助吹氣裝置24、下輔助吹氣裝置25以及熱像儀26。In addition, the laser cutting device 2 of the present invention includes a scanning head unit 21, a holding jig 22, a displacement mechanism 23, an upper auxiliary blowing device 24, a lower auxiliary blowing device 25, and a thermal imager 26.

所述掃瞄頭單元21係用於製造以及發射雷射光束,並利用該雷射光束來切割金屬箔3,而該雷射光束可為脈衝寬度200ns以上的長脈衝雷射(long-pulsed)。The scanning head unit 21 is used to manufacture and emit a laser beam, and use the laser beam to cut the metal foil 3, and the laser beam may be a long-pulsed laser with a pulse width of 200 ns or more. .

所述夾持治具22設置於掃瞄頭單元21下方,係用於夾持欲切割之金屬箔3,該夾持治具22係由上壓治具221以及下壓治具222所組成,而上壓治具221以及下壓治具 222均設有凸出並用於壓合金屬箔3的支柱,使金屬箔3被夾持時處於騰空狀態。The clamping jig 22 is arranged below the scanning head unit 21 and is used to clamp the metal foil 3 to be cut. The clamping jig 22 is composed of an upper pressing jig 221 and a lower pressing jig 222. The upper pressing jig 221 and the lower pressing jig 222 are both provided with pillars that are used to press the metal foil 3, so that the metal foil 3 is vacated when it is clamped.

所述移位機構23與夾持治具22連結,該移位機構23係用於固定夾持治具22並使其能於水平方向移動。The displacement mechanism 23 is connected to the clamping jig 22, and the displacement mechanism 23 is used for fixing the clamping jig 22 and enabling it to move in a horizontal direction.

所述上輔助吹氣裝置24設置於夾持治具22以及掃瞄頭單元21之間,該上輔助吹氣裝置24係從上方將冷卻氣體吹向金屬箔3之表面,藉此來將金屬箔3的表面溫度控制在適當的範圍內,其中,該上輔助吹氣裝置24能自由調整吹氣的角度、位置以及風量,且該上輔助吹氣裝置24能吹出先集中後再散開之氣體。The upper auxiliary air blowing device 24 is disposed between the clamping jig 22 and the scanning head unit 21, and the upper auxiliary air blowing device 24 blows cooling gas from the top to the surface of the metal foil 3, so as to blow the metal The surface temperature of foil 3 is controlled within an appropriate range. Among them, the upper auxiliary blowing device 24 can freely adjust the blowing angle, position and air volume, and the upper auxiliary blowing device 24 can blow out the gas that is concentrated and then diffused. .

所述下輔助吹氣裝置25設置於移位機構23內部,該下輔助吹氣裝置25係從下方將冷卻氣體吹向金屬箔3之表面,藉此來將金屬箔3的表面溫度控制在適當的範圍內,另外該下輔助吹氣裝置25的出氣口又以喇叭狀的外型為最佳選擇,而喇叭狀的出氣口能有效將冷卻氣體均勻的吹向金屬箔3表面。The lower auxiliary air blowing device 25 is provided inside the shifting mechanism 23. The lower auxiliary air blowing device 25 blows cooling gas from below to the surface of the metal foil 3, thereby controlling the surface temperature of the metal foil 3 to be appropriate. In addition, the air outlet of the lower auxiliary air blowing device 25 is the best choice with a horn-shaped appearance, and the horn-shaped air outlet can effectively blow the cooling gas to the surface of the metal foil 3.

所述熱像儀26設置於本發明雷射切割設備2內能照射到金屬箔3之適當位置,該熱像儀26用於監控切割金屬箔3時的表面溫度變化,並將溫度變化資訊回報給雷射切割設備2,藉此來調整上輔助吹氣裝置24以及下輔助吹氣裝置25的吹氣量。The thermal imager 26 is set in a proper position in the laser cutting device 2 of the present invention and can irradiate the metal foil 3. The thermal imager 26 is used to monitor the surface temperature change when cutting the metal foil 3 and report the temperature change information. The laser cutting device 2 is used to adjust the blowing volume of the upper auxiliary blowing device 24 and the lower auxiliary blowing device 25.

有關於本發明之實施方式及相關可供參考圖式詳述如下所示:Details of the embodiments of the present invention and related reference drawings are as follows:

續請參閱圖3並搭配圖2,圖3為本發明雷射切割方法實施示意圖(一)。Please refer to FIG. 3 in combination with FIG. 2. FIG. 3 is a schematic diagram (1) of implementation of the laser cutting method of the present invention.

本發明在下列敘述中使用在銅箔上切割圓做為說明。In the following description, the present invention is described using a circle cut on a copper foil.

如步驟41所示,在進行圓的切割前需先利用夾持治具22將銅箔夾緊,並使要進行切割的銅箔部位懸浮於空中。As shown in step 41, before cutting the circle, the copper foil needs to be clamped by the clamping jig 22, and the portion of the copper foil to be cut is suspended in the air.

如步驟42所示,當確認夾持治具22夾緊銅箔後,接著就可開啟掃瞄頭單元21利用雷射光束並配合移位機構23的移動,在銅箔上切割切出圓的外型,且在切割的過程中同時使用上輔助吹氣裝置24以及下輔助吹氣裝置25朝著銅箔吹出冷卻氣體。As shown in step 42, after confirming that the clamping jig 22 clamps the copper foil, the scanning head unit 21 can be turned on to use a laser beam and cooperate with the movement of the shift mechanism 23 to cut out a circular shape on the copper foil. Appearance, and during the cutting process, the upper auxiliary blowing device 24 and the lower auxiliary blowing device 25 are used to blow the cooling gas toward the copper foil.

如步驟43所示,另外在進行切割的過程中還會同步啟用熱像儀26來全程監控切割銅箔時的表面溫度變化,並將溫度變化資訊回報給雷射切割設備2。As shown in step 43, in addition, during the cutting process, the thermal imager 26 is simultaneously activated to monitor the surface temperature change during cutting of the copper foil and report the temperature change information to the laser cutting device 2.

如步驟44所示,若在切割銅箔時熱像儀26監測到銅箔的表面溫度高於最佳切割溫度時,雷射切割設備2便會自動增強上輔助吹氣裝置24以及下輔助吹氣裝置25的吹氣量,使銅箔表面的溫度降低至適當的範圍內。As shown in step 44, if the thermal imager 26 detects that the surface temperature of the copper foil is higher than the optimal cutting temperature when cutting the copper foil, the laser cutting device 2 will automatically enhance the upper auxiliary blowing device 24 and the lower auxiliary blowing device. The blowing amount of the air device 25 reduces the temperature of the surface of the copper foil to an appropriate range.

如步驟45所示,當切割完成後圓形元件與銅箔之間仍保有一處以上未切斷的微連結,使元件不會直接從銅箔上脫落。As shown in step 45, after the cutting is completed, there is still one or more uncut micro-connections between the circular component and the copper foil, so that the component will not fall off directly from the copper foil.

續請參閱圖4並搭配圖2,圖4為本發明雷射切割方法實施示意圖(二)。Please refer to FIG. 4 in combination with FIG. 2. FIG. 4 is a schematic diagram (2) of implementation of the laser cutting method of the present invention.

如步驟51所示,接著從夾持治具22上取出經切割處理後的銅箔,並在銅箔的其中一面覆上承載膜,使該乘載膜同時包覆銅箔、元件以及微連結處。As shown in step 51, the cut copper foil is then removed from the clamping jig 22, and a carrier film is coated on one side of the copper foil, so that the carrier film simultaneously covers the copper foil, components, and micro-connections. Office.

如步驟52所示,將覆有承載膜的銅箔放回夾持治具22上,並再次啟動掃瞄頭單元21、上輔助吹氣裝置24以及下輔助吹氣裝置25,準備進行最後的切割。As shown in step 52, return the copper foil covered with the carrier film to the holding jig 22, and start the scanning head unit 21, the upper auxiliary blowing device 24, and the lower auxiliary blowing device 25 again, and prepare for the final Cutting.

如步驟53所示,再次利用掃瞄頭單元21所產生的雷射光束來切斷元件與銅箔之間的微連結,而使元件正式與銅箔分離,另外雖然元件已和銅箔分離,但覆在銅箔上的承載膜仍會將元件固定在原先的位置上,達到切斷微連結後元件不會直接從銅箔上脫落的效果。As shown in step 53, the laser beam generated by the scanning head unit 21 is used again to cut off the micro-connection between the component and the copper foil, so that the component is officially separated from the copper foil. In addition, although the component has been separated from the copper foil, but The carrier film overlaid on the copper foil will still fix the component in its original position, so that the component will not fall off the copper foil directly after the micro-connection is cut.

如步驟54所示,最後再從承載膜上將圓形元件取出即完成在銅箔上切割圓的流程。As shown in step 54, the circular element is finally removed from the carrier film to complete the process of cutting the circle on the copper foil.

綜合上述,本發明雷射切割方法及其設備其優點在於: 1. 切割金屬箔時所預留一處以上的微連結,並搭配覆在金屬箔表面的承載膜,使切割和切斷的過程中不會有散料的情況發生。 2. 同時利用上輔助吹氣裝置以及下輔助吹氣裝置並搭配熱像儀,使切割的過程中金屬箔能保持在最佳的切割溫度。To sum up, the laser cutting method and equipment of the present invention have the following advantages: 1. One or more micro-links are reserved when cutting metal foil, and the supporting film covering the surface of the metal foil is used for cutting and cutting. No bulk material will occur in the process. 2. At the same time, the upper auxiliary blowing device and the lower auxiliary blowing device are used together with a thermal imager, so that the metal foil can be maintained at the optimal cutting temperature during the cutting process.

故,本發明在同類產品中具有極佳之進步性以及實用性,同時查遍國內外關於此類結構之技術資料文獻後,確實未發現有相同或近似之構造存在於本案申請之前,因此本案應已符合『創作性』、『合於產業利用性』以及『進步性』的專利要件,爰依法提出申請之。Therefore, the present invention has excellent progress and practicability in similar products. At the same time, after reviewing domestic and foreign technical information on such structures, it was found that no identical or similar structure exists before the application in this case. Patent applications that have met the "creative", "suitable for industrial use", and "progressive" requirements should be filed in accordance with the law.

唯,以上所述者,僅係本發明之較佳實施例而已,舉凡應用本發明說明書及申請專利範圍所為之其它等效結構變化者,理應包含在本發明之申請專利範圍內。However, the above are only preferred embodiments of the present invention. For example, any other equivalent structural changes applied to the description of the present invention and the scope of patent application should be included in the scope of patent application of the present invention.

1‧‧‧雷射切割方法‧‧‧Laser cutting method

11‧‧‧切割步驟 11‧‧‧ cutting steps

12‧‧‧覆膜步驟 12‧‧‧ Laminating steps

13‧‧‧切斷步驟 13‧‧‧ cutting steps

2‧‧‧雷射切割設備 2‧‧‧laser cutting equipment

21‧‧‧掃瞄頭單元 21‧‧‧scan head unit

22‧‧‧夾持治具 22‧‧‧ holding fixture

221‧‧‧上壓治具 221‧‧‧Up Pressure Fixture

222‧‧‧下壓治具 222‧‧‧Pressing down fixture

23‧‧‧移位機構 23‧‧‧shift mechanism

24‧‧‧上輔助吹氣裝置 24‧‧‧ Upper auxiliary blowing device

25‧‧‧下輔助吹氣裝置 25‧‧‧ Lower auxiliary blowing device

26‧‧‧熱像儀 26‧‧‧ Thermal Camera

3‧‧‧金屬箔 ‧‧‧ metal foil

41、42、43、44、45‧‧‧步驟 41, 42, 43, 44, 45‧‧‧ steps

51、52、53、54‧‧‧步驟 51, 52, 53, 54‧‧‧ steps

圖1:本發明雷射切割方法流程示意圖; 圖2:本發明雷射切割設備剖視示意圖; 圖3:本發明雷射切割方法實施示意圖(一); 圖4:本發明雷射切割方法實施示意圖(二)。Figure 1: Schematic diagram of the laser cutting method of the present invention; Figure 2: Schematic sectional view of the laser cutting device of the present invention; Figure 3: Schematic diagram of the laser cutting method of the present invention (1); Figure 4: Implementation of the laser cutting method of the present invention Schematic (two).

無。no.

Claims (10)

一種雷射切割方法,係包含有下列步驟: A. 切割步驟:利用雷射切割設備的雷射光束在金屬箔上切割出元件的外型,並在切割後元件與金屬箔之間仍留有未切斷的微連結,使元件仍連結於金屬箔上; B. 覆膜步驟:從雷射切割設備中取出經過切割步驟處理過後的金屬箔,並於金屬箔的其中一面覆上承載膜; C. 切斷步驟:將完成覆膜的金屬箔放回雷射切割設備內,並利用雷射光束切斷元件與金屬箔之間的微連結,而切斷微連結後的元件仍會附著於承載膜上,最後將元件從承載膜上取下即完成雷射切割的加工。A laser cutting method includes the following steps: A. Cutting step: the shape of a component is cut on a metal foil by using a laser beam of a laser cutting device, and there is still a space between the component and the metal foil after cutting Uncut micro-links, so that the components are still connected to the metal foil; B. Laminating step: take out the metal foil treated by the cutting step from the laser cutting equipment, and cover the metal foil with a carrier film on one side; C. Cutting step: Put the metal foil that has been coated back into the laser cutting equipment, and use the laser beam to cut the micro-connection between the component and the metal foil, and the component after the micro-connection is still adhered to On the carrier film, the component is finally removed from the carrier film to complete the laser cutting process. 如請求項第1項所述之雷射切割方法,其中,該切割步驟中未切斷的微連結為一處以上。The laser cutting method according to item 1 of the claim, wherein there are more than one microlinks that are not cut in the cutting step. 如請求項第1項所述之雷射切割方法,其中,該切割步驟與切斷步驟中所使用的雷射光束脈衝寬度為200ns以上。The laser cutting method according to claim 1, wherein the laser beam pulse width used in the cutting step and the cutting step is 200 ns or more. 如請求項第1項所述之雷射切割方法,其中,該切割步驟與切斷步驟中所使用的雷射光束為長脈衝雷射(long-pulsed)。The laser cutting method according to claim 1, wherein the laser beam used in the cutting step and the cutting step is long-pulsed. 一種雷射切割設備,係包含有係掃瞄頭單元、夾持治具、移位機構、上輔助吹氣裝置以及下輔助吹氣裝置; 所述掃瞄頭單元係用於製造以及發射雷射光束,並利用該雷射光束來切割金屬箔; 所述夾持治具設置於掃瞄頭單元下方,係用於夾持欲切割之金屬箔,該夾持治具係由上壓治具以及下壓治具所組成,而上壓治具以及下壓治具均設有凸出並用於壓合金屬箔的支柱,使金屬箔被夾持時處於騰空狀態; 所述移位機構與夾持治具連結,該移位機構係用於固定夾持治具並使夾持治具能於水平方向移動; 所述上輔助吹氣裝置設置於夾持治具以及掃瞄頭單元之間,該上輔助吹氣裝置係從上方將冷卻氣體吹向金屬箔之表面,藉此來將金屬箔的表面溫度控制在適當的範圍內; 所述下輔助吹氣裝置設置於移位機構內部,該下輔助吹氣裝置係從下方將冷卻氣體吹向金屬箔之表面,藉此來將金屬箔的表面溫度控制在適當的範圍內。A laser cutting device includes a scanning head unit, a clamping jig, a displacement mechanism, an upper auxiliary blowing device and a lower auxiliary blowing device; the scanning head unit is used for manufacturing and emitting a laser Light beam, and use the laser beam to cut metal foil; the clamping jig is arranged below the scanning head unit, and is used to clamp the metal foil to be cut; the clamping jig is made of an upper pressure jig and The upper pressing fixture and the lower pressing fixture are provided with pillars protruding and used for pressing the metal foil, so that the metal foil is vacated when it is clamped; the displacement mechanism and the clamp The jig is connected, and the displacement mechanism is used for fixing the jig and enabling the jig to move in a horizontal direction; the upper auxiliary blowing device is disposed between the jig and the scanning head unit. The upper auxiliary air blowing device blows cooling gas to the surface of the metal foil from above to control the surface temperature of the metal foil within an appropriate range; the lower auxiliary air blowing device is disposed inside the displacement mechanism, and the lower The auxiliary blowing device blows cooling gas from below The surface of the metal foil, whereby the metal foil to the surface temperature is controlled within an appropriate range. 如請求項第5項所述之雷射切割設備,其中,該掃瞄頭單元所使用的雷射光束脈衝寬度為200ns以上。The laser cutting device according to claim 5, wherein the laser beam pulse width used by the scanning head unit is 200 ns or more. 如請求項第5項所述之雷射切割設備,其中,該掃瞄頭單元所使用的雷射光束為長脈衝雷射(long-pulsed)。The laser cutting device according to claim 5, wherein the laser beam used by the scanning head unit is long-pulsed. 如請求項第5項所述之雷射切割設備,其中,該上輔助吹氣裝置能以先集中後散開之方式吹出氣體,且其吹氣的角度、位置以及風量均能自由調整。The laser cutting device according to claim 5, wherein the upper auxiliary blowing device can blow out the gas in a concentrated manner and then spread out, and the blowing angle, position and air volume can be freely adjusted. 如請求項第5項所述之雷射切割設備,其中,該下輔助吹氣裝置的出氣口為喇叭狀的設計。The laser cutting device according to claim 5, wherein the air outlet of the lower auxiliary blowing device is a horn-shaped design. 如請求項第5項所述之雷射切割設備,其中,該雷射切割設備內設有熱像儀。The laser cutting device according to claim 5, wherein the laser cutting device is provided with a thermal imager.
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WO2017057844A1 (en) * 2015-09-30 2017-04-06 삼성에스디아이 주식회사 Semiconductor package and manufacturing method thereof

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* Cited by examiner, † Cited by third party
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WO2017057844A1 (en) * 2015-09-30 2017-04-06 삼성에스디아이 주식회사 Semiconductor package and manufacturing method thereof

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