TWI661347B - Touch module - Google Patents

Abstract

The invention provides a touch module for preventing cracks in a touch sensing film, which includes a touch sensing film, a scratch-resistant hardened layer, a flexible circuit board, and a carrier. The scratch-resistant hardened layer is connected to the touch sensing film through an optical adhesive layer and has a first thickness. The flexible circuit board is electrically connected to the touch sensing film through an anisotropic conductive film. The carrier is disposed on the other surface of the flexible circuit board. The anisotropic conductive film, the flexible circuit board, and the carrier have a second thickness. The difference between the first thickness and the second thickness is less than 20 microns.

Description

Touch module

The technology of the present invention relates to the field of touch devices, and particularly to a touch module that prevents cracks in the touch sensing film.

Touch screen, as a simple and convenient way of human-computer interaction, has been widely used in all aspects of daily life. According to the principle of touch sensing, touch screens are mainly divided into resistive, capacitive, and surface infrared touch screens. Among them, the capacitive touch screen has the advantages of simple structure, high light transmittance, resistance to friction, resistance to environmental humidity and temperature changes, long service life, and multi-touch. Therefore, it has gradually become the mainstream of the touch screen market.

With the continuous development of technology, the thickness of capacitive touch screens is becoming thinner and thinner to meet the requirements of thinning and thinning of mobile terminals. Therefore, the capacitive touch screen has begun to use a thin film capacitive touch screen having a panel glass and a thin film touch sensor attached to the panel glass. In the process of preparing a thin film capacitive touch screen, the metal grid sensing film can be punched by laminating it with other components through optical glue. However, in the process of punching, there are breaks due to the thickness of each component. Poor, it is easy to cause cracks in the touch sensing circuit and cause failure. As shown by the arrow in FIG. 1, there is still room for improvement.

The main object of the present invention is to provide a touch module that prevents cracks in the touch sensing film, so that the touch sensing circuit does not break during bonding. In order to achieve the above object, the present invention adopts the following technical means to achieve it. Among them, the present invention provides a touch module for preventing cracks in the touch sensing film, including: a touch sensing film, a scratch-resistant hardened layer, a A flexible circuit board and a carrier. The touch sensing film has a first surface and a second surface. The scratch-resistant hardened layer is connected to the first surface through an optical adhesive layer, and the scratch-resistant hardened layer and the optical adhesive layer have a first thickness. A pad region is provided on one surface of the flexible circuit board, the pad region is electrically connected to the first surface through an anisotropic conductive film, and the scratch-resistant hardened layer is spaced from the flexible circuit board by a gap. The carrier is disposed on the other surface of the flexible circuit board and corresponds to the pad region. The anisotropic conductive film, the flexible circuit board, and the carrier have a second thickness. The difference between the first thickness and the second thickness is less than 20 microns.

In one embodiment of the present invention, the touch sensing film is a metal grid sensing film.

In an embodiment of the invention, the carrier is a heat-resistant material, and its heat resistance is greater than 150 degrees Celsius.

In one embodiment of the present invention, the transmittance of the carrier is greater than 50 percent.

In an embodiment of the invention, a contact range of the carrier and the flexible circuit board has a first width, and a contact range of the anisotropic conductive film and the flexible circuit board has a second width. The length is greater than the length of the second width.

In an embodiment of the present invention, the material of the carrier includes polyimide.

In one embodiment of the present invention, the gap is not greater than 0.7 mm.

In an embodiment of the present invention, the second surface has a second optical adhesive layer for adhering the touch sensing film to a display, wherein the display is a liquid crystal display module.

1‧‧‧ touch sensing film

11‧‧‧ film

12‧‧‧Drive electrode

13‧‧‧sensing electrode

14‧‧‧ the first surface

15‧‧‧ second surface

2‧‧‧Scratch-resistant hardened layer

3‧‧‧flexible circuit board

31, 33‧‧‧ surface

32‧‧‧ pad area

4‧‧‧ Carrier

5‧‧‧ Optical Adhesive Layer

6‧‧‧Anisotropic conductive film

7‧‧‧second optical adhesive layer

8‧‧‧ Wheel

W1‧‧‧First thickness

W2‧‧‧Second thickness

L1‧‧‧first width

L2‧‧‧Second width

L3‧‧‧ third width

L4‧‧‧ Fourth width

D‧‧‧ Clearance

FIG. 1 is a schematic diagram of cracks in a touch sensing circuit.

FIG. 2 is a schematic structural diagram of an embodiment of a touch module according to the present invention.

FIG. 3 is a schematic structural diagram of another embodiment of a touch module according to the present invention.

In order to achieve the above-mentioned object and effect, the technical means and structure adopted by the present invention, the following is a detailed description of the features and functions of an embodiment of the present invention, which is fully understood, but it should be noted that the content does not constitute Limitations of the invention.

Please refer to FIG. 2, which is a schematic structural diagram of an embodiment of a touch module according to the present invention. The present invention provides a touch module for preventing cracks in a touch sensing film, which includes a touch sensing film 1, a scratch-resistant hardened layer 2, a flexible circuit board 3, and a carrier 4.

The touch sensing film 1 has a first surface 14 and a second surface 15. The touch sensing film 1 may be a metal grid sensing film, including a film 11, a driving electrode (Tx) 12, and a sensor. Electrode (Rx) 13.

The scratch-resistant hardened layer 2 may be a resin material (PET) after being subjected to a surface hardening treatment, for example, a silicon-based layer is coated on the surface of the resin material. The scratch-resistant hardened layer 2 is connected to the first surface 14 through an optical adhesive layer 5. In one embodiment of the present invention, the scratch-resistant hardened layer 2 is connected to the first surface 14 by a stamping method. The scratch-resistant hardening layer 2 and the optical adhesive layer 5 have a first thickness W1.

The flexible circuit board 3 has a bonding pad area 32 on one surface 31 thereof. The bonding pad area 32 is electrically connected to the first surface 14 through an anisotropic conductive film (ACF) 6. For transmitting the touch signal of the touch sensing film 1. The anisotropic conductive film 6 is synthesized from resin and conductive particles to connect two different substrates and electronic circuits. The anisotropic conductive film 6 has thin lines, a simple process, good moisture resistance, adhesion, conductivity, and insulation. function. Wherein, the scratch-resistant hardening layer 2 and the flexible circuit board 3 are separated by a gap D, and the gap D is a fitting tolerance, which is not greater than 0.7 mm.

The carrier 4 is disposed on the other surface 33 of the flexible circuit board 3, and is disposed only in a region of the bonding pad region 32. The carrier 4 is a transparent material or a semi-transparent material, and needs to be made of a heat-resistant material. The material may include polyimide, and its heat resistance is greater than 150 degrees Celsius in response to the FOG (FPC on glass) process. In addition, the light transmittance of the carrier 4 needs to be greater than 50 percent in order to monitor the process of the pad process and the breakage of the conductive particles. Wherein, the anisotropic conductive film 6, the flexible circuit board 3 and the carrier 4 have a second thickness W2, and the difference between the first thickness W1 and the second thickness W2 is less than 20 microns.

In an embodiment of the present invention, the contact range of the carrier 4 and the flexible circuit board 3 has a first width L1, and the contact range of the anisotropic conductive film 6 and the flexible circuit board 3 has a second width L2. The length of the first width is greater than the length of the second width, which can improve the stability of the touch module during punching.

In an embodiment of the present invention, the second surface 15 further has a second optical adhesive layer 7, and the second optical adhesive layer 7 can be coated on the second surface 15 through the roller 8 to make the touch The sensing film 1 is adhered to a display (not shown), and the display may be a liquid crystal display module or a backlight module.

Please refer to FIG. 3, which is a schematic structural diagram of another embodiment of a touch module according to the present invention. In another embodiment of the present invention, the carrier 4 is also disposed on the other surface 33 of the flexible circuit board 3, and extends along the edge of the flexible circuit board 3 toward the scratch-resistant hardening layer 2. The contact range between the carrier 4 and the flexible circuit board 3 has a third width L3, and the contact range between the anisotropic conductive film 6 and the flexible circuit board 3 has a fourth width L4, and the third width L3 The length is greater than the length of the fourth width L4. Through the above structure, the touch module can be made more stable during punching.

Therefore, referring to all the drawings, the present invention provides a touch module for preventing cracks in the touch sensing film. Compared with conventional technology, the touch module is provided with a translucent material below the pad area of the flexible circuit board. The gap between the flexible circuit board and the scratch-resistant hardened layer is made up, and the defect of the touch sensing circuit breaking due to the thickness gap during the subsequent bonding process of the touch module is improved.

Through the above detailed description, it can fully show that the purpose and efficacy of the present invention are progressive in implementation, have great industrial utility value, and are new inventions that have never been seen on the market today, and fully meet the requirements of invention patents , Apply according to law. The above description is only the preferred embodiments of the present invention, and it does not limit the implementation and protection scope of the present invention. For those skilled in the art, they should be able to realize that the use of the description and illustrated content of the present invention can make Solutions obtained by equivalent substitutions and obvious changes should all be included in the protection scope of the present invention.

Claims (9)

A touch module includes: a touch sensing film having a first surface and a second surface; a scratch-resistant hardened layer connected to the first surface through an optical adhesive layer, and the scratch-resistant hardened layer And the optical adhesive layer has a first thickness; a flexible circuit board having a pad region on one surface thereof, the pad region is electrically connected to the first surface through an anisotropic conductive film, and the scratch-resistant hardening A layer is separated from the flexible circuit board by a gap; and a carrier is disposed on the other surface of the flexible circuit board and corresponds to the pad area, the anisotropic conductive film, the flexible circuit board, and the carrier The body has a second thickness; wherein the difference between the first thickness and the second thickness is less than 20 microns. The touch module according to item 1 of the patent application scope, wherein the touch sensing film is a metal grid sensing film. The touch module according to item 1 of the scope of patent application, wherein the carrier is a heat-resistant material, and its heat resistance is greater than 150 degrees Celsius. The touch module according to item 1 of the scope of patent application, wherein the light transmittance of the carrier is greater than 50 percent. The touch module according to item 1 of the scope of patent application, wherein the contact range of the carrier and the flexible circuit board has a first width, and the contact range of the anisotropic conductive film and the flexible circuit board has a first width. Two widths, the length of the first width is greater than the length of the second width. The touch module according to item 1 of the scope of patent application, wherein the material of the carrier comprises polyimide. The touch module according to item 1 of the scope of patent application, wherein the gap is not greater than 0.7 mm. The touch module according to item 1 of the patent application scope, wherein the second surface has a second optical adhesive layer for adhering the touch sensing film to a display. The touch module according to item 8 of the patent application scope, wherein the display is a liquid crystal display module.