TWI656752B - Antenna device and mobile terminal - Google Patents
Antenna device and mobile terminal Download PDFInfo
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- TWI656752B TWI656752B TW106112281A TW106112281A TWI656752B TW I656752 B TWI656752 B TW I656752B TW 106112281 A TW106112281 A TW 106112281A TW 106112281 A TW106112281 A TW 106112281A TW I656752 B TWI656752 B TW I656752B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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Abstract
本發明為一種天線裝置,包括金屬外殼、主機板、射頻收發電路和匹配電容,金屬外殼開設微縫帶,微縫帶具有相對設置的第一開放端和第一閉合端,第一開放端位於金屬外殼的邊緣上,第一閉合端位於微縫帶之遠離第一開放端的位置,微縫帶設有多條並排間隔設置的微縫;主機板設置縫隙,將主機板部分分隔成上部和下部,射頻收發電路設置於下部,匹配電容電連接於射頻收發電路和主機板的上部之間,射頻收發電路的輻射信號經微縫帶輻射出去。本發明還提供一種移動終端。本發明既利於射頻收發電路的信號輻射,又降低了金屬外殼的非金屬占比。The invention relates to an antenna device, which comprises a metal casing, a main board, a radio frequency transceiver circuit and a matching capacitor. The metal casing is provided with a micro slit belt, and the micro slit belt has a first open end and a first closed end, and the first open end is located at On the edge of the metal casing, the first closed end is located away from the first open end of the microslit belt, and the micro slit belt is provided with a plurality of micro slits arranged side by side; the main board is provided with a slit to divide the main board part into an upper part and a lower part. The RF transceiver circuit is disposed at the lower portion, and the matching capacitor is electrically connected between the RF transceiver circuit and the upper portion of the motherboard, and the radiation signal of the RF transceiver circuit is radiated through the micro slit tape. The invention also provides a mobile terminal. The invention not only benefits the signal radiation of the radio frequency transceiver circuit, but also reduces the non-metal ratio of the metal casing.
Description
本發明涉及天線技術領域,尤其涉及一種天線裝置和移動終端。The present invention relates to the field of antenna technologies, and in particular, to an antenna device and a mobile terminal.
隨著科技的發展及使用者對電子產品的信號要求越來越高,目前市面上的手機等具有天線的移動終端很多選用金屬殼體,以保證使用強度的同時,滿足質感,提升用戶的體驗感。眾所周知,金屬為信號屏蔽材料,為避免金屬外殼信號屏蔽影響天線效率作用,通常殼體會採用金屬與非金屬結合,而為了利於天線信號的輻射,非金屬的比重比較大,其影響了移動終端的結構。With the development of technology and the increasing demands of users on the signal of electronic products, many mobile terminals with antennas such as mobile phones on the market currently use metal casings to ensure the intensity of use, satisfy the texture and enhance the user experience. sense. As is known to all, the metal is a signal shielding material. In order to avoid the effect of the signal shielding of the metal casing on the efficiency of the antenna, the casing usually adopts a combination of metal and non-metal, and in order to facilitate the radiation of the antenna signal, the proportion of the non-metal is relatively large, which affects the mobile terminal. structure.
本發明所要解決的技術問題在於提供一種天線裝置和移動終端,能夠提高移動終端的外觀整體性。The technical problem to be solved by the present invention is to provide an antenna device and a mobile terminal, which can improve the overall appearance of the mobile terminal.
本發明提供了一種天線裝置,包括金屬外殼、主機板、射頻收發電路和匹配電容,所述金屬外殼開設微縫帶,所述微縫帶具有相對設置的第一開放端和第一閉合端,所述第一開放端位於所述金屬外殼的邊緣上,所述第一閉合端位於所述微縫帶遠離所述第一開放端的位置處,以使所述微縫帶將所述金屬外殼部分分隔,所述微縫帶設有多條並排間隔設置的微縫;所述主機板設置縫隙,所述縫隙將所述主機板部分分隔成上部和下部,所述射頻收發電路設置於所述主機板的下部,所述匹配電容電連接於所述射頻收發電路和所述主機板的上部之間,所述射頻收發電路的輻射信號經所述微縫帶輻射出去。The present invention provides an antenna device including a metal casing, a motherboard, a radio frequency transceiver circuit, and a matching capacitor. The metal casing has a micro slit tape, and the micro slit tape has a first open end and a first closed end disposed opposite to each other. The first open end is located on an edge of the metal casing, and the first closed end is located at a position of the microslit belt away from the first open end such that the micro slit tape will be the metal outer casing portion Separating, the microslit strip is provided with a plurality of micro slits arranged side by side; the motherboard is provided with a slit, the slit partitions the main board into upper and lower portions, and the radio frequency transceiver circuit is disposed on the host In a lower portion of the board, the matching capacitor is electrically connected between the radio frequency transceiver circuit and an upper portion of the motherboard, and a radiation signal of the radio frequency transceiver circuit is radiated through the micro slit tape.
其中,所述縫隙正對所述微縫帶。Wherein the gap is opposite to the micro slit tape.
其中,所述縫隙具有相對設置的第二開放端和第二閉合端,所述第二開放端位於所述主機板的邊緣上,所述第二閉合端位於所述縫隙遠離所述第二開放端的的位置處。Wherein the slit has oppositely disposed second open ends and second closed ends, the second open end is located on an edge of the motherboard, and the second closed end is located at the gap away from the second open The position of the end.
其中,所述天線裝置還包括阻抗匹配電路,所述阻抗匹配電路電連接於所述射頻收發電路和所述匹配電容之間。The antenna device further includes an impedance matching circuit electrically connected between the radio frequency transceiver circuit and the matching capacitor.
其中,所述天線裝置還包括開關和設置於所述下部的接地點,所述開關電連接於所述上部和所述下部的接地點之間。Wherein, the antenna device further includes a switch and a grounding point disposed at the lower portion, the switch being electrically connected between the grounding point of the upper portion and the lower portion.
其中,所述主機板與所述金屬外殼接地連接,且所述金屬外殼接地連接的位置圍繞所述微縫帶設置。Wherein, the motherboard is grounded to the metal casing, and the location of the metal casing ground connection is disposed around the microslit belt.
其中,所述金屬外殼接地連接的位置接地點的數量為3~8個。The number of grounding points of the ground connection of the metal casing is 3-8.
其中,所述金屬外殼包括相對設置的一對長邊和一對短邊,一對所述短邊連接在一對所述長邊之間,所述第一開放端位於一條所述長邊上,所述第一閉合端沿著所述短邊的延伸方向延伸。Wherein the metal casing comprises a pair of long sides and a pair of short sides which are oppositely disposed, a pair of the short sides are connected between a pair of the long sides, and the first open end is located on one of the long sides The first closed end extends along an extending direction of the short side.
其中,所述微縫的縫寬為0.01mm~0.5mm。Wherein, the slit width of the micro slit is 0.01 mm to 0.5 mm.
其中,所述微縫的數量為2~5條。Wherein, the number of the micro slits is 2 to 5.
其中,所述微縫中設置非信號屏蔽材料。Wherein, the non-signal shielding material is disposed in the micro slit.
另一方面,本發明還提供了一種移動終端,包括天線裝置。In another aspect, the present invention also provides a mobile terminal comprising an antenna device.
其中,所述移動終端還包括前殼組件,所述金屬外殼設置於所述前殼組件上形成容置空間,所述主機板位於所述容置空間,且所述主機板與所述前殼組件接地連接。The mobile terminal further includes a front shell assembly, the metal shell is disposed on the front shell assembly to form an accommodating space, the main board is located in the accommodating space, and the main board and the front shell Component ground connection.
其中,所述前殼組件開設前殼縫隙,所述前殼縫隙正對所述主機板的縫隙。The front shell assembly defines a front shell gap, and the front shell gap faces a gap of the main board.
相較於現有技術,本發明具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
在本發明實施例中的天線裝置和移動終端通過在金屬外殼上設置具有第一開放端和第一閉合端的微縫帶,既利於主機板上的射頻收發電路的信號輻射,又降低了金屬外殼的非金屬占比,提高了移動終端的外觀整體性。The antenna device and the mobile terminal in the embodiment of the present invention not only facilitate the signal radiation of the radio frequency transceiver circuit on the motherboard but also reduce the metal casing by providing the micro slit tape having the first open end and the first closed end on the metal casing. The non-metal ratio increases the overall appearance of the mobile terminal.
下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,所屬技術領域中具有通常知識者在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without the creative work are all within the scope of the present invention.
本發明實施例的描述中,需要理解的是,術語“左側”“右側”“上側”“下側”“長”“短”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是暗示或指示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In the description of the embodiments of the present invention, it is to be understood that the orientation or positional relationship indicated by the terms “left side”, “right side”, “upper side”, “lower side”, “long”, “short”, etc. is based on the orientation or position shown in the drawings. The present invention is to be construed as being limited to the invention and is not intended to be construed as a limitation of the invention.
本發明涉及一種移動終端,該移動終端包括天線裝置,移動終端可以是任何具備通信和存儲功能的設備,例如:平板電腦、手機、電子閱讀器、遙控器、個人計算機(Personal Computer,PC)、筆記型電腦、車載設備、網絡電視、可穿戴設備等具有網絡功能的智能設備。移動終端包括天線裝置。天線裝置包括金屬外殼和設置有射頻收發電路和匹配電容的主機板,其中,金屬外殼通常作為移動終端的後蓋,其內部容納電池及主機板。The present invention relates to a mobile terminal, which includes an antenna device, and the mobile terminal can be any device having communication and storage functions, such as a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), A smart device with network capabilities such as notebook computers, car devices, Internet TVs, and wearable devices. The mobile terminal includes an antenna device. The antenna device comprises a metal casing and a motherboard provided with a radio frequency transceiver circuit and a matching capacitor, wherein the metal casing is generally used as a back cover of the mobile terminal, and the inside thereof accommodates the battery and the motherboard.
請一併參閱圖1至圖3,為本發明提供實施例提供的一種移動終端100,移動終端100包括天線裝置1,天線裝置1包括金屬外殼11、主機板12、射頻收發電路13和匹配電容14,金屬外殼11開設微縫帶111形成淨空區域,射頻收發電路13通過匹配電容14電連接於主機板12上,射頻收發電路13發出的輻射信號經微縫帶111輻射出去,利於天線裝置1的信號輻射。Referring to FIG. 1 to FIG. 3 , a mobile terminal 100 is provided. The mobile terminal 100 includes an antenna device 1 . The antenna device 1 includes a metal casing 11 , a motherboard 12 , a radio frequency transceiver circuit 13 , and a matching capacitor . 14. The metal casing 11 defines a micro-slit strip 111 to form a clearance area, and the RF transceiver circuit 13 is electrically connected to the motherboard 12 through the matching capacitor 14. The radiation signal emitted by the RF transceiver circuit 13 is radiated through the micro-slit strip 111, which is beneficial to the antenna device 1. Signal radiation.
在本實施例中,請參照圖2,金屬外殼11包括相對設置的一對長邊和一對短邊,一對短邊連接在一對長邊之間。其中,一對長邊包括第一長邊L1和第二長邊L2,一對短邊包括於第一短邊S1和第二短邊S2。In the present embodiment, referring to FIG. 2, the metal casing 11 includes a pair of long sides and a pair of short sides which are oppositely disposed, and a pair of short sides are connected between a pair of long sides. The pair of long sides includes a first long side L1 and a second long side L2, and the pair of short sides are included in the first short side S1 and the second short side S2.
在本實施例中,微縫帶111的數量為一個。微縫帶111具有相對設置的第一開放端S3和第一閉合端S4,第一開放端S3位於金屬外殼11的邊緣上,第一閉合端S4位於微縫帶111遠離第一開放端S3的位置處,以使微縫帶111將金屬外殼11部分分隔。其中,微縫帶111設有多條並排間隔設置的微縫111a。可以理解的,第一開放端S3位於第一長邊L1上,第一閉合端S4沿著第一短邊S1的延伸方向延伸,且靠近第一短邊S1,而多條微縫111a則沿著第一長邊L1的延伸方向並排設置,通過將微縫帶111設置為上述結構,進一步提高金屬外殼11的金屬占比,從而提高金屬外殼11和移動終端100的外觀整體性。可以理解的,微縫111a為長矩形孔。可以理解的,微縫111a中可以設置非信號屏蔽材料111b,具體的,非信號屏蔽材料111b為塑膠,在進一步提高金屬外殼11的外觀整體性的同時又使得金屬外殼11具有較佳的防水性能。當然,在其它實施例中,微縫帶111的數量還可以為兩個、三個或者更多個,根據實際所需設置在金屬外殼11上。當然,在其它實施例中,第一開放端S3還可以位於第一短邊S1上,第一閉合端S4沿著第一長邊L1的方向延伸。當然,在其它實施例中,微縫111a還可以為波浪形、閃電狀、長橢圓形等。In the present embodiment, the number of the micro slit tapes 111 is one. The microslit strip 111 has a first open end S3 and a first closed end S4, the first open end S3 is located on the edge of the metal casing 11, and the first closed end S4 is located away from the first open end S3. The position is such that the microslit tape 111 partially separates the metal casing 11. The microslit tape 111 is provided with a plurality of micro slits 111a arranged side by side. It can be understood that the first open end S3 is located on the first long side L1, the first closed end S4 extends along the extending direction of the first short side S1, and is close to the first short side S1, and the plurality of micro slits 111a are along The extending direction of the first long side L1 is arranged side by side, and by providing the micro slit tape 111 in the above-described configuration, the metal ratio of the metal casing 11 is further increased, thereby improving the appearance integrity of the metal casing 11 and the mobile terminal 100. It can be understood that the micro slit 111a is a long rectangular hole. It can be understood that the non-signal shielding material 111b can be disposed in the micro slit 111a. Specifically, the non-signal shielding material 111b is plastic, which further improves the appearance integrity of the metal casing 11 while making the metal casing 11 have better waterproof performance. . Of course, in other embodiments, the number of the microslit strips 111 may also be two, three or more, which are disposed on the metal casing 11 according to actual needs. Of course, in other embodiments, the first open end S3 may also be located on the first short side S1, and the first closed end S4 extends along the direction of the first long side L1. Of course, in other embodiments, the micro slits 111a may also be wavy, lightning, oblong, or the like.
優選的,微縫111a的縫寬為0.01 mm~0.5mm,本實施例中,微縫111a的縫寬為0.06mm,使得微縫111a肉眼不可視,進一步提高金屬外殼11的外觀整體性。Preferably, the slit width of the micro slit 111a is 0.01 mm to 0.5 mm. In the present embodiment, the slit width of the micro slit 111a is 0.06 mm, so that the micro slit 111a is invisible to the naked eye, and the appearance integrity of the metal casing 11 is further improved.
優選的,微縫111a的數量為2~5條,本實施例中,微縫111a的數量為3條,利於主機板12的輻射。Preferably, the number of the micro slits 111a is 2 to 5. In the embodiment, the number of the micro slits 111a is three, which is advantageous for the radiation of the motherboard 12.
在本實施例中,請參照圖3,主機板12上設置縫隙12a,縫隙12a將主機板部分分隔成上部12b和下部12c,射頻收發電路13設置於主機板12的下部12c,匹配電容14電連接於射頻收發電路13和主機板12的上部12b之間,以激勵縫隙12a形成縫隙天線,再通過射頻收發電路13將輻射信號通過微縫帶111輻射出去。具體的,主機板12與金屬外殼11間隔設置,且主機板12正對金屬外殼11。In this embodiment, referring to FIG. 3, the motherboard 12 is provided with a slot 12a. The slot 12a divides the motherboard portion into an upper portion 12b and a lower portion 12c. The RF transceiver circuit 13 is disposed on the lower portion 12c of the motherboard 12, and the matching capacitor 14 is electrically connected. It is connected between the RF transceiver circuit 13 and the upper portion 12b of the motherboard 12 to form a slot antenna by the excitation slot 12a, and then radiates the radiation signal through the micro slit tape 111 through the RF transceiver circuit 13. Specifically, the motherboard 12 is spaced apart from the metal casing 11 and the motherboard 12 faces the metal casing 11.
可以理解的,縫隙12a正對微縫帶111,使得射頻收發電路13的信號能夠更佳的通過微縫帶111輻射出去,提高天線裝置1的輻射效率。It can be understood that the slit 12a faces the microslit strip 111 so that the signal of the radio frequency transceiver circuit 13 can be radiated better through the micro slit strip 111, thereby improving the radiation efficiency of the antenna device 1.
優選的,縫隙12a具有相對設置的第二開放端S7和第二閉合端S8,第二開放端S7位於主機板12的邊緣上,第二閉合端S8位於縫隙12a遠離第二開放端S7的位置處。其中,主機板12被縫隙12a隔成上部12b和下部12c,主機板12包括相對設置的左側邊S4和右側邊S5,第二開放端S7位於左側邊S4上,第二閉合端S8沿著遠離左側邊S4的方向延伸,縫隙12a的結構與微縫帶111的結構相同。請參照圖1,當主機板12正對金屬外殼11時,由於縫隙12a的結構與微縫帶111的結構相同,使得主機板12正對金屬外殼11時,縫隙12a在金屬外殼11上的正投影與微縫帶111重合,即縫隙12a正對微縫帶111,使得縫隙12a與匹配電容14形成縫隙天線,且該縫隙天線的信號能夠通過射頻收發電路13較佳的從微縫帶111中輻射出去,進一步提高天線裝置1和移動終端100的天線性能。當然,在其他實施例中,縫隙的尺寸跟微縫帶的尺寸可以不相同。當然,在其它實施例中,縫隙12a在金屬外殼11上的正投影可以與微縫帶111部分重合。Preferably, the slit 12a has a second open end S7 and a second closed end S8 disposed opposite to each other, the second open end S7 is located on the edge of the motherboard 12, and the second closed end S8 is located at a position away from the second open end S7 of the slit 12a. At the office. The main board 12 is partitioned into an upper portion 12b and a lower portion 12c by a slit 12a. The main board 12 includes a left side S4 and a right side S5 which are oppositely disposed. The second open end S7 is located on the left side S4, and the second closed end S8 is away from the left side. The direction of the left side S4 extends, and the structure of the slit 12a is the same as that of the micro slit tape 111. Referring to FIG. 1, when the motherboard 12 is facing the metal casing 11, since the structure of the slit 12a is the same as that of the microslit belt 111, so that the motherboard 12 faces the metal casing 11, the slit 12a is positive on the metal casing 11. The projection coincides with the microslit strip 111, that is, the slit 12a faces the micro slit strip 111, so that the slit 12a and the matching capacitor 14 form a slot antenna, and the signal of the slot antenna can pass through the RF transceiving circuit 13 preferably from the micro slit tape 111. Radiation out further improves the antenna performance of the antenna device 1 and the mobile terminal 100. Of course, in other embodiments, the size of the slits may be different from the size of the microslit strips. Of course, in other embodiments, the orthographic projection of the slit 12a on the metal casing 11 may partially coincide with the microslit strip 111.
優選的,天線裝置1還包括阻抗匹配電路15,阻抗匹配電路15電連接於射頻收發電路13和匹配電容14之間。通過在射頻收發電路13和匹配電容14之間設置阻抗匹配電路15,使得阻抗匹配電路15能夠進一步與匹配電容14的內部阻抗互相適配,從而使得射頻收發電路13接收或輸出的信號為最大功率。Preferably, the antenna device 1 further includes an impedance matching circuit 15 electrically connected between the RF transceiver circuit 13 and the matching capacitor 14. By providing the impedance matching circuit 15 between the RF transceiver circuit 13 and the matching capacitor 14, the impedance matching circuit 15 can be further adapted to the internal impedance of the matching capacitor 14, so that the signal received or output by the RF transceiver circuit 13 is the maximum power. .
優選的,天線裝置1還包括開關16和設置於下部的接地點17,開關16電連接於上部12b和下部12c的接地點17之間。其中,根據實際所需,在縫隙12a的對應位置上設置開關16和主機板12上設置接地點17,以調制主機板12上的頻帶,當開關16斷開時,匹配電容14激勵出的信號沿著縫隙12a的第二開放端S7至第二閉合端S8的方向在縫隙12a的周邊傳遞,此時主機板12的工作頻帶為高頻帶;當開關16閉合時,信號通過開關16直接接地,在第二閉合端S8的長度方向短路,此時主機板12的工作頻帶為低頻帶,綜上,通過將開關16和接地點17設置在主機板12上來調制主機板12的頻帶,以滿足移動終端100內部各種元器件對不同頻帶的需求,從而提高天線裝置1和移動終端100的天線性能。Preferably, the antenna device 1 further includes a switch 16 and a ground point 17 disposed at a lower portion, the switch 16 being electrically connected between the upper portion 12b and the ground point 17 of the lower portion 12c. Wherein, according to actual needs, the switch 16 is disposed at the corresponding position of the slot 12a and the grounding point 17 is disposed on the motherboard 12 to modulate the frequency band on the motherboard 12. When the switch 16 is turned off, the signal excited by the matching capacitor 14 is modulated. The direction along the second open end S7 to the second closed end S8 of the slit 12a is transmitted at the periphery of the slit 12a. At this time, the operating frequency band of the motherboard 12 is a high frequency band; when the switch 16 is closed, the signal is directly grounded through the switch 16. Short-circuited in the length direction of the second closed end S8, at this time, the operating frequency band of the motherboard 12 is a low frequency band. In summary, the frequency band of the motherboard 12 is modulated by disposing the switch 16 and the grounding point 17 on the motherboard 12 to satisfy the movement. The requirements of various components within the terminal 100 for different frequency bands improve the antenna performance of the antenna device 1 and the mobile terminal 100.
在本發明實施例中的天線裝置1和移動終端100通過在金屬外殼11上設置具有第一開放端S3和第一閉合端S4的微縫帶111,既利於主機板12的信號輻射,又降低了金屬外殼11的非金屬占比,提高了移動終端100的外觀整體性。The antenna device 1 and the mobile terminal 100 in the embodiment of the present invention are provided with the micro slit tape 111 having the first open end S3 and the first closed end S4 on the metal casing 11, which is beneficial to the signal radiation of the motherboard 12 and is reduced. The non-metal ratio of the metal casing 11 improves the overall appearance of the mobile terminal 100.
進一步的,主機板12與金屬外殼11接地連接,且金屬外殼11接地連接的位置112圍繞微縫帶111設置。Further, the motherboard 12 is grounded to the metal casing 11 and the position 112 of the metal casing 11 connected to the ground is disposed around the microslit belt 111.
在本實施例中,主機板12與金屬外殼11接地,通過使主機板12形成地,而使得金屬外殼11形成天線裝置1的輻射部,可以理解的,金屬外殼11接地連接的位置112圍繞於微縫帶111均勻設置,使得金屬外殼11圍繞微縫帶111的部分作為輻射體輻射出的信號更為均勻,進一步提高天線裝置1的天線性能。可以理解的,金屬外殼11接地連接的位置的數量為3~8個,能夠進一步保證金屬外殼11成為輻射體之後的天線性能。其中,金屬外殼11接地連接的位置112為3個,其均勻圍繞微縫帶111周圍設置,以使金屬外殼11能夠形成輻射性能較佳的輻射體。In the present embodiment, the motherboard 12 is grounded to the metal casing 11, and the metal casing 11 is formed into a radiating portion of the antenna device 1 by forming the motherboard 12, and it can be understood that the position 112 of the metal casing 11 connected to the ground is surrounded by The microslit tape 111 is evenly disposed such that the portion of the metal casing 11 that surrounds the microslit belt 111 as a radiation body is more uniform, further improving the antenna performance of the antenna device 1. It can be understood that the number of positions where the metal casing 11 is grounded is 3-8, which can further ensure the antenna performance after the metal casing 11 becomes a radiator. Wherein, the metal casing 11 is grounded at a position 112 of three, which is uniformly disposed around the microslit belt 111, so that the metal casing 11 can form a radiator with better radiation performance.
進一步的,請參照圖1,移動終端100還包括前殼組件2,金屬外殼11設置於前殼組件2上形成容置空間D,主機板12位於容置空間D,且主機板12與前殼組件2接地連接。Further, referring to FIG. 1 , the mobile terminal 100 further includes a front casing assembly 2 . The metal casing 11 is disposed on the front casing assembly 2 to form an accommodation space D. The motherboard 12 is located in the accommodation space D, and the motherboard 12 and the front casing Component 2 is grounded.
在本實施例中,前殼組件2包括前殼和屏組件(未圖示),屏組件設置於前殼上,屏組件被前殼遮擋的部分為非顯示區,屏組件不被前殼遮擋的部分為顯示區域,其一般能夠進行顯示和觸控操作。前殼組件2的非顯示面與主機板12接地,使得前殼組件為主機板12提供零電勢,即前殼組件2為用於提供零電勢給主機板12接地點的地極,主機板12相對於金屬外殼11則作為金屬外殼11的地,使得金屬外殼11成為天線裝置1的另一個輻射體,而前殼組件2在作為總地的同時亦形成天線裝置1的另一個輻射體,進一步提高天線裝置1的輻射性能。In this embodiment, the front casing assembly 2 includes a front casing and a screen assembly (not shown). The screen assembly is disposed on the front casing, and the portion of the screen assembly that is blocked by the front casing is a non-display area, and the screen assembly is not blocked by the front casing. The part is a display area, which is generally capable of display and touch operations. The non-display surface of the front case assembly 2 is grounded to the motherboard 12 such that the front case assembly provides a zero potential for the motherboard 12, that is, the front case assembly 2 is a ground for providing a zero potential to the ground point of the motherboard 12, and the motherboard 12 The metal casing 11 becomes the other radiator of the antenna device 1 with respect to the metal casing 11, and the front casing assembly 2 also forms the other radiator of the antenna device 1 as a whole, further The radiation performance of the antenna device 1 is improved.
可以理解的,前殼組件2開設前殼縫隙2a,該前殼縫隙2a正對縫隙12a,以保證縫隙12a被激勵的信號能夠更佳的通過前殼縫隙2a輻射出去。具體的,前殼組件2接地連接的位置圍繞前殼縫隙2a均勻設置,該前殼組件2接地連接的位置與金屬外殼11接地連接的位置112對應。前殼縫隙2a在主機板12上的正投影與主機板12的縫隙重合或者部分重合,以使前殼組件2形成天線裝置1的另一個輻射部,使得天線裝置1的信號能夠從前殼組件2輻射出去,從而進一步提高天線裝置1的輻射性能。It can be understood that the front casing assembly 2 opens the front casing slit 2a, and the front casing slit 2a faces the slit 12a to ensure that the signal excited by the slit 12a can be radiated better through the front casing slit 2a. Specifically, the position of the ground connection of the front case assembly 2 is uniformly disposed around the front case slot 2a, and the position of the ground connection of the front case assembly 2 corresponds to the position 112 of the metal case 11 being grounded. The orthographic projection of the front case slit 2a on the main board 12 coincides or partially overlaps with the slit of the main board 12, so that the front case assembly 2 forms another radiating portion of the antenna device 1, so that the signal of the antenna device 1 can be transmitted from the front case assembly 2 Radiation is emitted to further improve the radiation performance of the antenna device 1.
以上對本發明實施例進行了詳細介紹,本文中應用了具體個例對本發明的原理及實施方式進行了闡述,以上實施例的說明只是用於幫助理解本發明的方法及其核心思想;同時,對於本領域的一般技術人員,依據本發明的思想,在具體實施方式及應用範圍上均會有改變之處,綜上,本說明書內容不應理解為對本發明的限制。The embodiments of the present invention have been described in detail above, and the principles and implementations of the present invention are described in detail herein. The description of the above embodiments is only for helping to understand the method of the present invention and its core ideas; The present invention is not limited by the scope of the present invention, and the details of the present invention are not limited by the scope of the present invention.
100‧‧‧移動終端100‧‧‧Mobile terminal
111‧‧‧微縫帶111‧‧‧Microslit tape
D‧‧‧容置空間D‧‧‧ accommodating space
1‧‧‧天線裝置1‧‧‧Antenna device
2‧‧‧前殼組件2‧‧‧Front shell assembly
2a‧‧‧前殼縫隙2a‧‧‧ front shell gap
11‧‧‧金屬外殼11‧‧‧Metal casing
12‧‧‧主機板12‧‧‧ motherboard
12a‧‧‧縫隙12a‧‧‧ gap
13‧‧‧射頻收發電路13‧‧‧RF Transceiver Circuit
S1‧‧‧第一短邊S1‧‧‧ first short side
S2‧‧‧第二短邊S2‧‧‧ second short side
S3‧‧‧第一開放端S3‧‧‧ first open end
S4‧‧‧第一閉合端S4‧‧‧ first closed end
S5‧‧‧右側邊S5‧‧‧ right side
S7‧‧‧第二開放端S7‧‧‧ second open end
S8‧‧‧第二閉合端S8‧‧‧ second closed end
L1‧‧‧第一長邊L1‧‧‧First long side
L2‧‧‧第二長邊L2‧‧‧ second long side
112‧‧‧接地連接的位置112‧‧‧ Location of ground connection
111a‧‧‧微縫111a‧‧‧Micro-seam
111b‧‧‧非信號屏蔽材料111b‧‧‧Non-signal shielding material
12b‧‧‧上部12b‧‧‧ upper
12c‧‧‧下部12c‧‧‧ lower
14‧‧‧匹配電容14‧‧‧Matching capacitor
15‧‧‧阻抗匹配電路15‧‧‧ impedance matching circuit
16‧‧‧開關16‧‧‧ switch
17‧‧‧接地點17‧‧‧ Grounding point
為了更清楚地說明本發明的技術方案,下面將對實施方式中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本發明的一些實施方式,對於所屬技術領域中具有通常知識者來講,在不付出創造性勞動的前提下,還可以由這些附圖獲得其他的附圖。 圖1為本發明實施例的移動終端的結構示意圖; 圖2為圖1中的金屬外殼的結構示意圖; 圖3為圖1中的設置有各種電路的主機板的結構示意圖。In order to more clearly illustrate the technical solutions of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention, For those having ordinary knowledge, other drawings can be obtained from these drawings without paying creative labor. 1 is a schematic structural view of a mobile terminal according to an embodiment of the present invention; FIG. 2 is a schematic structural view of the metal casing of FIG. 1; and FIG. 3 is a schematic structural view of a motherboard provided with various circuits of FIG.
Claims (18)
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CN102522625A (en) * | 2011-11-22 | 2012-06-27 | 上海安费诺永亿通讯电子有限公司 | Antenna structure of terminal of cellphone with metallic shell |
CN103296385A (en) * | 2013-05-29 | 2013-09-11 | 上海安费诺永亿通讯电子有限公司 | Adjustable multi-band antenna system |
US20150171916A1 (en) * | 2013-12-13 | 2015-06-18 | Motorola Mobility Llc | Mobile device with antenna and capacitance sensing system with slotted metal bezel |
CN104584324A (en) * | 2014-03-28 | 2015-04-29 | 华为终端有限公司 | Structure integrating metallic housing with antenna of electronic device |
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