TWI654807B - Monolithic conductive pin structure of riser card and manufacturing method thereof - Google Patents

Abstract

A monolithic conductive pin structure of a riser card, comprising a first conductive pin set having a plurality of first conductive pins; a second conductive pin set having a plurality of second conductive pins, the second conductive leads The second connecting segment of the foot has a hollow region, and the first conductive pin group and the second conductive pin group are vertically spaced apart, and the second outer connecting piece of the second conductive pins is located at the first conductive pin Below the connecting segment, the first inner connecting pins of the first conductive pins are located in the hollow region; the molded plate is molded on the first conductive pin group and the second conductive pin group. One method of fabrication is to fabricate the aforementioned monolithic conductive pin structure. Thereby, the monolithic conductive pin structure of the riser card of the present invention can simplify the structure, simplify the process and save manufacturing costs.

Description

Monolithic conductive pin structure of riser card and manufacturing method thereof

The invention relates to a monolithic conductive pin structure of a riser card and a manufacturing method thereof, in particular to a device which can simplify the structure, simplify the process and save the manufacturing cost.

Referring to FIG. 1A to FIG. 1I, as shown in the figure, a conventional method for manufacturing a riser card 9 (Micro SD UHS-II riser card) is to first mold a first molded plate 92 to a first conductive lead. The first conductive pin set 911 of the strip 91 (shown in FIG. 1A) is then removed from the first strip frame 912 of the first conductive lead strip 91 to form a first conductive lead structure 93 (FIG. 1B). Similarly, the second molded plate 95 is molded on the second conductive pin set 941 of the second conductive lead strip 94 (as shown in FIG. 1C), and then the second conductive lead is removed. A second strip frame 942 of strip 94 is formed to form a second conductive pin structure 96 (as shown in Figure ID). The second conductive lead structure 96 is then assembled into the lower housing 97 (shown in FIG. 1E), and then the first conductive lead structure 93 is assembled to the second conductive lead structure 96 (as shown in FIG. 1F). Then, the read/write switch 98 is assembled to the lower casing 97 (as shown in FIG. 1G), and finally the upper cover 99 is assembled to the lower casing 97 (as shown in FIG. 1H) to complete the conventional riser card 9 ( As shown in Figure 1I). As described above, the two-piece conductive pin structures 93 and 96 of the conventional riser card 9 are complicated in structure, so that the assembly procedure of the conventional riser card 9 is cumbersome and the manufacturing cost is high.

Therefore, how to invent a monolithic conductive pin structure of a riser card and a manufacturing method thereof, so that the structure can be simplified, the process is simplified, and the manufacturing cost is saved, which will be actively disclosed in the present invention.

In view of the shortcomings of the above-mentioned prior art, the inventor feels that he has not perfected it, exhausted his mind and researched and overcome it, and developed a monolithic conductive pin structure of the riser card and its manufacturing method, in order to achieve Simplify the structure, simplify the process and save manufacturing costs.

To achieve the above and other objects, a first aspect of the present invention provides a monolithic conductive pin structure of a riser card, comprising: a first conductive pin set having a plurality of first conductive pins, The first conductive pins respectively have a first outer connecting piece, a first connecting portion and a first inner connecting pin; and a second conductive pin group having a plurality of second conductive pins The second conductive pins respectively have a second outer connecting piece, a second connecting piece and a second inner connecting pin connected in sequence, and the second connecting segments have a hollow area, the first conductive a pin group and a second conductive pin group are vertically stacked, the second outer connecting pieces are located below the first connecting segments, the first inner connecting pins are located in the hollow region; and a molding a first molding segment and the second connecting segments are embedded in the first conductive segment and the second conductive pin group, and the first connecting portion and the second connecting portion are embedded in the molded plate, each of the first outer connections One side of the sheet, one side of each of the second outer connecting sheets, and the first inner connecting lead Such connection pin and a second inner mold is exposed from the molded plate.

In the monolithic conductive pin structure of the above-mentioned riser card, each of the first connecting segments is arched.

In the monolithic conductive pin structure of the above-mentioned riser card, one side of each of the first outer connecting pieces and one side of each of the second outer connecting pieces are exposed on a bottom surface of the molded plate, and the first inner connecting The pins and the second inner connecting pins are exposed on the top surface of the molded plate.

In the monolithic conductive pin structure of the above-mentioned riser card, the molded plate has a plurality of first conductive pin shunt holes and a plurality of second conductive pin shunt holes, each of the first conductive pins The shunt punch is located between the adjacent two first conductive pins, and the first conductive pins are shunted and the second The conductive pin group is misaligned, and each of the second conductive pin shunt holes is located between the adjacent two second conductive pins, and the second conductive pin shunt holes are misaligned with the first conductive pin group .

A second aspect of the present invention provides a method of fabricating a monolithic conductive pin structure of a riser card, which is a monolithic conductive pin structure of the riser card as described above, the manufacturing method comprising the following steps (1) providing a first conductive lead strip and a second conductive lead strip, the first conductive lead strip having a first strip frame and the first conductive pin set connected to each other, The second conductive lead strip has a second strip frame and the second conductive pin set connected to each other; (2) the first conductive lead strip is spaced apart from the second conductive lead strip Laminating, the second outer connecting pieces are located below the first connecting segments, the first inner connecting pins are located in the hollow region; (3) molding the molded plate to the first conductive lead The first connecting segment and the second connecting segments are embedded in the molding plate, one side of each of the first outer connecting pieces, and each of the second outer connecting pieces One side, the first inner connecting pins and the second inner connecting pins are exposed on the molding plate; (4) puncturing adjacent a connection point of the first conductive pin to separate the two first conductive pins, and to break the connection point of the adjacent two second conductive pins to separate the second conductive pins; and (5) to remove the first a strip frame and the second strip frame.

In the manufacturing method of the monolithic conductive pin structure of the above-mentioned riser card, each of the first connecting segments is arched.

In the manufacturing method of the monolithic conductive pin structure of the above-mentioned riser card, one side of each of the first outer connecting pieces and one side of each of the second outer connecting pieces are exposed on the bottom surface of the molded plate, the same An inner connecting pin and the second inner connecting pin are exposed on a top surface of the molded plate.

In the manufacturing method of the monolithic conductive pin structure of the above-mentioned riser card, when the connection point of the adjacent two first conductive pins is broken to separate the two first conductive pins, the molded plate is formed The first conductive pins are shunted, and when the connection points of the adjacent two second conductive pins are broken to separate the second conductive pins, the molded plate is formed with the second conductive leads. The foot is shunted.

Thereby, the monolithic conductive pin structure of the riser card of the present invention and the manufacturing method thereof can simplify the structure, simplify the process and save the manufacturing cost.

1‧‧‧First conductive lead strip

11‧‧‧First Conductive Pin Set

111‧‧‧First conductive pin

1111‧‧‧First outer connecting piece

1112‧‧‧First connection segment

1113‧‧‧First internal connection pin

1114‧‧‧ Connection point

12‧‧‧First material frame

2‧‧‧Second conductive lead strip

21‧‧‧Second conductive lead set

211‧‧‧Second conductive pin

2111‧‧‧Second outer connecting piece

2112‧‧‧Second connection

2113‧‧‧Second internal connection pin

2114‧‧‧ Connection point

212‧‧‧ hollow area

22‧‧‧Second material frame

3‧‧‧Molded molding plate

31‧‧‧First conductive pin shunt punch

32‧‧‧Second conductive pin shunting

4‧‧‧ Lower case

41‧‧‧Outer connection hole

5‧‧‧Reading and writing switch

6‧‧‧Upper cover

61‧‧‧ Plug interface

9‧‧‧Issue Riser

91‧‧‧First conductive lead strip

911‧‧‧First Conductive Pin Set

912‧‧‧First material frame

92‧‧‧First molded plate

93‧‧‧First conductive lead structure

94‧‧‧Second conductive lead strip

941‧‧‧Second conductive lead set

942‧‧‧Second material frame

95‧‧‧Second molding plate

96‧‧‧Second conductive pin structure

97‧‧‧ Lower case

98‧‧‧Reading and writing switch

99‧‧‧Upper cover

1A to 1I are schematic views showing a method of manufacturing a conventional adapter card.

2 is a schematic view showing the first conductive pin group and the second conductive pin group before assembly according to a preferred embodiment of the present invention.

3 is a schematic view showing the assembled first conductive lead set and second conductive lead set in accordance with a preferred embodiment of the present invention.

4 is a schematic view showing a molding of a molded plate on a first conductive pin group and a second conductive pin group in a preferred embodiment of the present invention.

FIG. 5 is a schematic view showing a top view of a monolithic conductive pin structure according to a preferred embodiment of the present invention. FIG.

6 is a schematic view showing a bottom view of a monolithic conductive pin structure according to a preferred embodiment of the present invention.

FIG. 7 is a plan view of FIG. 5. FIG.

8 is a schematic view showing a monolithic conductive pin structure assembled to a lower case in accordance with a preferred embodiment of the present invention.

9 is a schematic view of a read/write switch assembled to a lower case in accordance with a preferred embodiment of the present invention.

FIG. 10 is a schematic view showing a cover body assembled to a lower case according to a preferred embodiment of the present invention. FIG.

FIG. 11 is a schematic view showing a top view of a riser card according to a preferred embodiment of the present invention. FIG.

FIG. 12 is a schematic view showing the bottom view of the adapter card according to a preferred embodiment of the present invention. FIG.

In order to fully understand the object, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: Please refer to FIG. 2 to FIG. As shown, the first aspect of the present invention provides a single-chip conductive pin structure of a riser card (compatible with UHS-I and UHS-II Micro SD), which includes a first conductive lead. The foot set 11, a second conductive pin set 21 and a molded plate 3, the riser card is the size of the SD card. The first conductive pin group 11 has a plurality of first conductive pins 111, and the first conductive pins 111 respectively have a first outer connecting piece 1111, a first connecting segment 1112 and a first An inner connecting pin 1113, the first inner connecting pin 1113 is for electrically connecting a UHS-I Micro SD card or a UHS-II Micro SD card; the second conductive pin group 21 has a plurality of second conductive The second conductive pin 211 has a second outer connecting piece 2111, a second connecting piece 2112 and a second inner connecting pin 2113. The second inner connecting pin is sequentially connected to the second conductive pin 211. 2113 is also used to electrically connect the UHS-I Micro SD card or the UHS-II Micro SD card, the second connecting segments 2112 have a hollow region 212, and the second connecting segments 2112 can be laterally expanded and expanded. The first conductive pin group 11 is vertically spaced apart from the second conductive pin group 21, and the second outer connecting pieces 2111 are located below the first connecting segments 1112 and located at the first outer connecting piece 1111 and the Between the first inner connecting pins 1113, the first inner connecting pins 1113 are located in the hollow region 212 and are located at the same Between the two outer connecting pieces 2111 and the second inner connecting pins 2113; the molding plate 3 is molded on the first conductive pin group 11 and the second conductive pin group 21, the first The connecting portion 1112 and the second connecting portion 2112 are embedded in the molding plate 3, one surface of each of the first outer connecting pieces 1111, one side of each of the second outer connecting pieces 2111, and the first inner connecting pins. 1113 and the second inner connecting pins 2113 are exposed to the molded plate 3.

As described above, since the first conductive pin group 11 and the second conductive pin group 21 of the monolithic conductive pin structure of the riser card of the present invention are vertically stacked, the single card of the present invention is The chip conductive pin structure can mold the first conductive pin group 11 and the second conductive pin group 21 together by a single molded plate 3. In addition, the pins of the first conductive pins 111 and the second conductive pins 211 that are grounded may be independent or independent. Thereby, the monolithic conductive pin structure of the riser card of the present invention can be simplified, thereby simplifying the process of the monolithic conductive pin structure of the riser card of the present invention and saving manufacturing cost.

Referring to FIG. 2 and FIG. 3, in the single-chip conductive pin structure of the above-mentioned riser card, each of the first connecting segments 1112 may be arched. Thereby, each of the first connecting segments 1112 can be concave so that the second outer connecting pieces 2111 can be located below the first connecting segments 1112 and located at the first outer connecting pieces 1111 and the same Between the inner connecting pins 1113, the first inner connecting pins 1113 can be located in the hollow region 212 and between the second outer connecting pieces 2111 and the second inner connecting pins 2113.

Referring to FIG. 5 and FIG. 6 , as shown in the figure, in the monolithic conductive pin structure of the above-mentioned riser card, one side of each of the first outer connecting pieces 1111 and one side of each of the second outer connecting pieces 2111 are Exposed to the bottom surface of the molded plate 3, the first inner connecting pins 1113 and the second inner connecting pins 2113 are exposed on the top surface of the molded plate 3. Therefore, the first outer connecting piece 1111 and the second outer connecting piece 2111 can facilitate external electrical connection of the external device, and the first inner connecting pin 1113 and the second inner connecting pin 2113 can be easily The UHS-I Micro SD card or the UHS-II Micro SD card is internally connected.

Please refer to FIG. 2 to FIG. 7. As shown in the figure, in the monolithic conductive pin structure of the above-mentioned riser card, the molded plate 3 may have a plurality of first conductive pin shunt holes 31 and a plurality of Two conductive Pin shunt punch 32. Each of the first conductive pin shunting holes 31 is located between the adjacent two first conductive pins 111 to break the joint 1114 between the adjacent two first conductive pins 111, thereby making adjacent The two first conductive pins 111 are separated from each other without short circuit during use; in addition, the first conductive pin shunt holes 31 are misaligned with the second conductive pin group 21 to avoid punching. The second conductive pin group 21 is destroyed. Each of the second conductive pin shunting holes 32 is located between the adjacent two second conductive pins 211 to break the connection 2114 between the adjacent two second conductive pins 211, thereby making adjacent The second conductive pins 211 are indeed separated from each other without short circuit during use; in addition, the second conductive pin shunt holes 32 are misaligned with the first conductive pin group 11 to avoid punching. The first conductive pin group 11 is destroyed.

Please refer to FIG. 8 to FIG. 12 . As shown in the figure, the monolithic conductive pin structure of the riser card of the present invention can be disposed with a read/write switch 5 on the lower casing 4 of the riser card, followed by an upper cover. The second outer connecting piece 1111 and the second outer connecting piece 2111 can be connected to the at least one outer connecting hole 41 of the lower case 4 by the lower outer cover 4 and the second outer connecting piece 2111. External devices are connected to external devices. In addition, a UHS-I Micro SD card or a UHS-II Micro SD card (not shown) can be inserted into the riser card via the plug connector 61 of the upper cover 6 to electrically connect the first internal connection leads. Foot 1113 and the second internal connection pins 2113.

Referring to FIG. 2 to FIG. 7, as shown in the figure, a second aspect of the present invention provides a method for manufacturing a monolithic conductive pin structure of a riser card, which is manufactured as described above. A chip type conductive pin structure, the adapter card is a size of an SD card, and the manufacturing method comprises the following steps: (1) providing a first conductive pin strip 1 and a second conductive pin strip 2, The first conductive lead strip 1 has a first strip frame 12 and a first conductive lead set 11 connected to each other, and the second conductive lead strip 2 has a second strip frame 22 connected to each other and a second conductive pin group 21, the first tape frame 12 is expandable Connecting a plurality of sets of first conductive pin groups 11 , the second tape frame 22 being expandably connected to the plurality of sets of second conductive pin sets 21 , the first conductive pin sets 11 having a plurality of first conductive pins 111 , The first conductive pins 111 respectively have a first outer connecting piece 1111, a first connecting portion 1112 and a first inner connecting pin 1113. The first inner connecting pins 1113 are electrically connected. a UHS-I Micro SD card or a UHS-II Micro SD card, the second conductive pin group 21 has a plurality of second conductive pins 211, and the second conductive pins 211 respectively have a second connected in sequence The outer connecting piece 2111, the second connecting piece 2112 and a second inner connecting pin 2113 are also used for electrically connecting the UHS-I Micro SD card or the UHS-II Micro SD card. The second connecting section 2112 can be laterally folded and expanded to have a hollow area 212; (2) the first conductive lead strip 1 and the second conductive lead strip 2 are vertically stacked, the same The second outer connecting piece 2111 is located below the first connecting segments 1112 and is located at the first outer connecting piece 1111 and the first inner connecting pins 1113. The first inner connecting pins 1113 are located between the second outer connecting piece 2111 and the second inner connecting pins 2113; (3) the plastic molding plate 3 is molded. Forming the first conductive pin group 11 and the second conductive pin group 21, the first connecting segments 1112 and the second connecting segments 2112 are embedded in the molded plate 3, each of the first outer One side of the connecting piece 1111, one side of each of the second outer connecting pieces 2111, the first inner connecting pins 1113 and the second inner connecting pins 2113 are exposed on the molded plate 3; (4) is broken The connection point 1114 of the adjacent two first conductive pins 111 is to separate the two first conductive pins 111 to avoid short circuit of the two first conductive pins 111 during use, and to break adjacent two second conductive leads. a connection point 2114 of the foot 211 to surely separate the second conductive pin 211 to prevent the second conductive pin 211 from being short-circuited during use; and (5) removing the first tape frame 12 and the second tape frame twenty two.

As described above, since the manufacturing method of the monolithic conductive pin structure of the riser card of the present invention causes the first conductive pin group 11 and the second conductive pin group 21 to be vertically stacked, the turn of the present invention The manufacturing method of the single-chip conductive pin structure of the card can mold the first conductive pin group 11 and the second conductive pin group 12 together by a single molding plate 3. In addition, the pins of the first conductive pins 111 and the second conductive pins 211 that are grounded may be independent or independent. Thereby, the monolithic conductive pin structure of the riser card of the present invention can be simplified, thereby simplifying the process of the monolithic conductive pin structure of the riser card of the present invention and saving manufacturing cost.

Referring to FIG. 2 and FIG. 3, in the single-chip conductive pin structure of the above-mentioned riser card, each of the first connecting segments 1112 may be arched. Thereby, each of the first connecting segments 1112 can be concave so that the second outer connecting pieces 2111 can be located below the first connecting segments 1112 and located at the first outer connecting pieces 1111 and the same Between the inner connecting pins 1113, the first inner connecting pins 1113 can be located in the hollow region 212 and between the second outer connecting pieces 2111 and the second inner connecting pins 2113.

Referring to FIG. 5 and FIG. 6 , in the manufacturing method of the monolithic conductive pin structure of the above-mentioned riser card, one side of each of the first outer connecting pieces 1111 and each of the second outer connecting pieces 2111 One side is exposed on the bottom surface of the molded plate 3, and the first inner connecting pins 1113 and the second inner connecting pins 2113 are exposed on the top surface of the molded plate 3. Therefore, the first outer connecting piece 1111 and the second outer connecting piece 2111 can facilitate external electrical connection of the external device, and the first inner connecting pin 1113 and the second inner connecting pin 2113 can be easily The UHS-I Micro SD card or the UHS-II Micro SD card is internally connected.

Please refer to FIG. 2 to FIG. 7. As shown in the figure, in the manufacturing method of the monolithic conductive pin structure of the above-mentioned riser card, when the connection point 1114 of the adjacent two first conductive pins 111 is broken to separate. The first conductive pin shunt hole 31 is formed by the first conductive pin shunt hole 31 and the second conductive pin group. 21 misalignment to avoid damage when punching a second conductive pin group 21; when the connection point 2114 of the adjacent two second conductive pins 211 is broken to separate the second conductive pins 211, the molded plate 3 is formed with the second conductive leads The second branch pin punching hole 32 is offset from the first conductive pin group 11 to avoid damaging the first conductive pin group 11 during punching.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

Claims (8)

A monolithic conductive pin structure of a riser card, comprising: a first conductive pin set having a plurality of first conductive pins, the first conductive pins respectively having a first outer connection a connecting piece, a first connecting segment and a first inner connecting pin; a second conductive pin group having a plurality of second conductive pins, wherein the second conductive pins respectively have a second connected in sequence An outer connecting piece, a second connecting piece and a second inner connecting pin, wherein the second connecting section has a hollow area, and the first conductive pin set and the second conductive pin set are vertically spaced apart, and the like a second outer connecting piece is located below the first connecting segments, the first inner connecting pins are located in the hollow region; and a molded plate is molded on the first conductive pin group and the first a pair of conductive pins, the first connecting segments and the second connecting segments are embedded in the molding plate, one side of each of the first outer connecting pieces, one side of each of the second outer connecting pieces, the first An inner connecting pin and the second inner connecting pin are exposed to the molded plate. The monolithic conductive pin structure of the riser card of claim 1, wherein each of the first connecting segments is arched. The one-piece conductive pin structure of the adapter card of claim 1, wherein one side of each of the first outer connecting pieces and one side of each of the second outer connecting pieces are exposed on a bottom surface of the molded plate, The first inner connecting pin and the second inner connecting pin are exposed on the top surface of the molding plate. The monolithic conductive pin structure of the riser card of claim 1, wherein the molded plate has a plurality of first conductive pin shunt holes and a plurality of second conductive pin shunt holes, each of which The first conductive pin shunt hole is located between the adjacent two first conductive pins, and the first conductive pin shunt hole is misaligned with the second conductive pin group, and each of the second conductive pins The shunt punch is located between the adjacent two second conductive pins, and the second conductive pin shunt holes are misaligned with the first conductive pin group. A manufacturing method of a monolithic conductive pin structure of a riser card, which is a monolithic conductive pin structure of the riser card according to claim 1, the manufacturing method comprising the following steps: (1) providing a a first conductive lead strip and a second conductive lead strip, the first conductive lead strip having a first strip frame and the first conductive pin set connected to each other, the second conductive pin The tape has a second strip frame and the second conductive pin set connected to each other; (2) the first conductive pin strip and the second conductive pin strip are vertically stacked, the second The outer connecting piece is located below the first connecting segments, the first inner connecting pins are located in the hollow region; (3) the molding plate is molded on the first conductive pin group and the second a conductive lead set, the first connecting section and the second connecting sections are embedded in the molding plate, one side of each of the first outer connecting pieces, one side of each of the second outer connecting pieces, the first The inner connecting pin and the second inner connecting pin are exposed on the molding plate; (4) breaking the connection point of the adjacent two first conductive pins to separate the two first conductive pins, and breaking the connection point of the adjacent two second conductive pins to separate the second conductive pins; And (5) removing the first tape frame and the second tape frame. The monolithic conductive pin structure of the riser card of claim 5, wherein each of the first connecting segments is arched. The manufacturing method of claim 5, wherein one side of each of the first outer connecting sheets and one side of each of the second outer connecting sheets are exposed on a bottom surface of the molded board, the first inner connecting pins and the The second inner connecting pin is exposed on the top surface of the molded plate. The manufacturing method of claim 5, wherein the molding plate is formed with the first conductive pins when the connection points of the adjacent two first conductive pins are broken to separate the two first conductive pins. The shunt punching, when the connection points of the adjacent two second conductive pins are broken to separate the second conductive pins, the molding plate is formed with the second conductive pin shunt holes.