TWI653464B - Reflective large field of view mobile phone optical module - Google Patents

Abstract

A reflective large angle of view mobile phone optical module includes a detector including a light receiving surface and having a hole in the center as a diaphragm; a low dispersion optical plate coupled to the detector The light-receiving side is integrated into an optical three-dimensional wafer (3D IC) module, and the surface of the optical plate corresponding to the light-receiving surface is a reflecting surface, and the other surface of the reflecting surface is a coating surface, and the reflecting surface can image the image. On the detector, light enters the optical plate through the hole, returns to the detector and collects light through the reflective surface, and the distortion of the image can be processed by the distortion image correction method after the digital data is processed by the distortion image correction method. Distorted image. The optical module of the invention needs to be multi-lens into a single lens, and the lens is characterized by a low dispersion material, which can be used in an optical module before a smart phone charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS); Therefore, the invention can reduce the volume of the optical module and become an optical three-dimensional chip module, which is integrated in the smart phone motherboard, which can reduce the assembly cost and provide a large-angle image.

Description

Reflective large field of view mobile phone optical module

The invention relates to a reflective large-angle-angle mobile phone optical module, in particular to a multi-lens into a single lens, and the lens is characterized by a low-dispersion material, in particular, the optical module can be reduced in size and become an optical three-dimensional The chip module, integrated in the smart phone motherboard, reduces assembly costs and provides a large angle image.

With the rise of social networks, the camera function of smart phones has become increasingly prominent. A powerful camera not only allows users to quickly share what they see, but also adds a lot of new fun. In 2014, with the upgrade resolution rate of smart phones, the camera function of mobile phones has also been enriched accordingly, becoming a selling point of mobile phone differentiation. The 8 megapixel camera behind it is replaced by 13 million pixels, which is a big technological advancement in the shooting section. Basically, the functions of the mobile phone camera include the following modules: optical components composed of mobile phone camera components and ISP panels. The optical component includes a lens, a Complementary Metal Oxide Semiconductor (CMOS) sensor, an infrared filter, and a motor control section. Future mobile optics have the following main trends: 1. The lens size becomes larger, so that a larger aperture can be obtained; 2. The lens group is increased from the previous four to five or six, but the result is a heavier camera assembly. , affects auto focus. It is expected that the new iPhone will try to increase the ratio of dual lens use. If the yield is improved, the proportion of iPhone with dual lens will increase from 15% in the second half of 2017 to 50% in the second half of 2017. The iPhone will be fully replaced with dual lenses, and the Android camp will also join the dual lens ranks. View the layout of patents in various countries, use the US patent in the SMART CELLULAR PHONE sensing module, search for the lens and cell phone (Cellular phone) and sensor (Sensor) and Cellular phone. The application for the theme is increasing year by year, actively investing in research and development, and using temperature, pressure, and physiological sensor chips as mobile phone trends. The mobile phone case uses a magnifying glass, a mobile phone lens cover, a zoom lens, and a thin camera lens. trend. After analysis, there is no similar patent for the current 3D IC (3D IC) mobile phone optoelectronic module. If the technology of 3D IC of photoelectric module is introduced at this time, in addition to the optical design, it is replaced by reflection, plus China. The development of reflective 3D IC optoelectronic modules with competitive advantages in IC chips, packages, and 3D ICs can be accomplished. For example, Samsung has begun manufacturing 3D IC modules, which produce a 16G NAND gate layer using TSV technology, but its optical receiving angle is small and uneven, resulting in uneven brightness at all angles. Optical efficiency is low. In summary, at present, smart phones use full-refraction optical modules, and are multi-lens or more lenses, and each lens uses a plurality of spherical and aspheric mirror groups, such as four to six, Occupying a large amount of space for smart phones, not only is the bulky, the structure of the lens more and more complicated, it is difficult to manufacture and assemble, and the precision of the mechanism is high during assembly, resulting in high manufacturing cost. Therefore, the user-like user cannot meet the needs of the user to effectively reduce the size of the optical module, reduce the assembly cost, and provide a large-angle image in actual use.

The main object of the present invention is to overcome the above problems encountered in the prior art and to provide a single lens that requires the original optical module to be multi-lens, and the lens is characterized by a low dispersion material, which can be used in a smart phone charge coupled device. (Charge Couple Device, CCD) or CMOS optical module, and the optical module can be integrated into the process of the detector to form an optical three-dimensional chip module, and the distortion of the image can be corrected by the distortion image correction method. The digital processing is outputted into an undistorted image; thereby, the invention can reduce the volume of the optical module and become an optical three-dimensional chip module, which is integrated in the smart phone motherboard, which can reduce the assembly cost and provide a large reflection angle of the large-angle image. Field of view mobile phone optical module. For the purpose of the above, the present invention is a reflective large-angle-angle mobile phone optical module, which can be used on a smart phone, comprising: a detector comprising a light-receiving surface and having a through-center in the center The aperture is used as a diaphragm; and a low-dispersion optical sheet is bonded to the light-receiving side of the detector to be integrated into an optical three-dimensional wafer (3D IC) module, and the optical sheet is reflective to the surface of the light-receiving surface The other surface of the reflective surface is a coated surface, and the reflective surface can image an image on the detector, and the light passes through the hole and enters the optical plate, and returns to the detector through the reflective surface. Light imaging, and the distortion of the image can be processed by the distortion image correction method to output the original data into an undistorted image. In the above embodiment of the invention, the reflecting surface is formed by a planar, spherical, aspherical, or binary optical surface of a semiconductor process. In the above embodiment of the present invention, the optical three-dimensional chip module can be integrated on the motherboard of the smart phone. In the above embodiment of the present invention, an optical module before a smart phone charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) can be used. In the above embodiment of the present invention, the diameter of the hole of the detector is 150 μm ± 20%. In the above embodiment of the invention, the thickness of the detector is 100 μm ± 20%. In the above embodiment of the present invention, the optical sheet is a glass material having an Abbe number higher than 98. In the above embodiment of the invention, the optical sheet has a curvature of 750 μm ± 20%. In the above embodiment of the invention, the effective focal length of the optical sheet is 500 μm ± 20%. In the above embodiment of the invention, the overall size is 1500 μm ± 20%. In the above embodiment of the present invention, the optical three-dimensional chip module further includes a digital logic unit disposed on an electronic component and coupled to the coated surface of the optical plate to form an optical three-dimensional chip package module. In the above embodiment of the present invention, the digital logic unit is selected from the group consisting of a Digital Signal Processing (DSP) and a Micro Electro Mechanical Systems (MEMS) device. In the above embodiment of the invention, the electronic component is a package substrate or a printed circuit board. In the above embodiment of the present invention, the optical three-dimensional chip module is coupled to the electronic component by a dual in-line package (DIP). In the above embodiment of the present invention, the optical three-dimensional wafer module can be formed into a two-dimensional array, and after digital processing, a light field camera is formed. In the above embodiment of the present invention, the optical three-dimensional chip module can obtain a global image with an angle of view greater than 150°.

Please refer to FIG. 1 to FIG. 5 for a schematic view of a first embodiment of the present invention, a schematic view of a large field of view of the present invention, a schematic structural view of a second embodiment of the present invention, and a third embodiment of the present invention. A schematic diagram of the structure of the embodiment and a schematic diagram of the distortion image correction of the present invention. As shown in the figure, the present invention is a reflective large-angle-angle mobile phone optical module, which can be used on a smart phone, and includes a detector 11 and an optical plate 12. The thickness of the detector 11 mentioned above is 100 μm±20%, and includes a light-receiving surface 111 having a through hole 112 as a diaphragm at the center, and the diameter of the hole 112 is 150 μm±20%. The optical sheet 12 is a low dispersion material having an Abbe number higher than 98, such as a sheet of glass or other optical material. The optical sheet 12 has an effective focal length of 500 μm±20% (ie, the thickness of the optical sheet 12) and has a curvature of 750 μm±20%, which is bonded to the light receiving surface 111 side of the detector 11 to be integrated into an optical body. The surface of the optical plate 12 corresponding to the light receiving surface 111 is a reflecting surface 121, and the other surface of the reflecting surface 121 is a plating surface 122. The reflecting surface 121 is a flat surface or a spherical surface. A non-spherical, or binary optical surface of a semiconductor process that images an image onto the detector 11. The optical three-dimensional wafer module 1 further includes a digital logic unit 13 for image processing, which is disposed on an electronic component (not shown) and coupled to the coating surface 122 of the optical sheet 12, as shown in FIG. The optical three-dimensional chip module 1 can be coupled to the electronic component by a dual in-line package (DIP) to form an optical three-dimensional chip package module 1a, as shown in FIG. The pin of the optical three-dimensional chip package module 1a is a small DIP-8 type pin, and the optical three-dimensional chip package module 1a uses DIP to complete its packaging process. In addition, to be used on a multi-lens, the optical three-dimensional wafer module 1 can be formed into a two-dimensional array, which is digitally processed to become a structure of a light field camera, and outputs an image, as shown in FIG. The digital logic unit 13 is selected from the group consisting of a digital signal processing (DSP) and a micro electro mechanical system (MEMS) device; the electronic component is a package substrate or a printed circuit. board. For example, a new reflective large-angle-angle mobile phone optical module is constructed by the above disclosed structure, and the overall size is 1500 μm±20%. In one embodiment, the optical three-dimensional package wafer carrier 1a can be integrated on a motherboard of a smart phone, so that the reflective large-angle field mobile phone optical module can be applied to a smart phone charge coupled device (Charge Couple Device). , CCD) or Complementary Metal Oxide Semiconductor (CMOS) optical module. When used, as shown in Figure 1, a reflective lens for a smart phone is shown. Light from different directions passes through the aperture (ie, the hole 112) into the optical plate 12, returns through the reflective surface 121, and enters the detector 11 for concentrating imaging. , obtaining a global image with an angle of view greater than 150°; as shown in Figure 2, the incident light in all directions with a large field of view angle is 170° (±80°), which has been shown to allow optical reception to approach 180° . The image obtained after imaging is deformed, and the image can be corrected by the distortion image correction method, and the original data is digitally processed and output into an undistorted image, as shown in FIG. The method for correcting the distortion image is described in detail in the patent application previously filed by the inventor, and is not described herein. The hole 112 in the detector 11 can be compensated by the DSP operation to compensate the hole 112, and the image frame is interpolated by interpolation. In summary, the present invention is a reflective large-angle-angle mobile phone optical module, which can effectively improve various shortcomings of the conventional use, and the original optical module needs to have multiple lenses into a single lens, and the lens is characterized by low dispersion material, An optical module in front of a smart phone charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS), and the optical module can be integrated with the process of the detector The optical three-dimensional chip module is formed, and the distortion of the image can be processed by the distortion image correction method to digitally process the original data into an undistorted image; thereby, the invention can reduce the volume of the optical module and become an optical three-dimensional chip module, and integrate In the smart phone motherboard, the assembly cost can be reduced, and the large-angle image can be provided, so that the life of the invention can be improved, more practical, and more in line with the requirements of the user, and indeed meets the requirements of the invention patent application, File a patent application. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.

Optical 3D chip module 1 Optical 3D chip package module 1a Detector 11 Light receiving surface 111 Hole 112 Optical sheet 12 Reflecting surface 121 Coating surface 122 Digital logic unit 13

Fig. 1 is a schematic view showing the structure of a first embodiment of the present invention. Figure 2 is a schematic view of the large field of view of the present invention. Fig. 3 is a schematic view showing the structure of a second embodiment of the present invention. Figure 4 is a schematic view showing the structure of a third embodiment of the present invention. Figure 5 is a schematic diagram of distortion image correction of the present invention.

Claims (15)

A reflective large angle of view mobile phone optical module can be used on a smart phone, comprising: a detector comprising a light receiving surface and having a through hole in the center as a diaphragm; and a low The dispersive optical plate is bonded to the light receiving surface side of the detector to be integrated into an optical three-dimensional wafer (3D IC) module, and the surface of the optical plate corresponding to the light receiving surface is a reflecting surface, and the reflecting surface is opposite to the reflecting surface. A surface is a coated surface, and the reflective surface can image the image on the detector, and the light enters the optical plate through the hole, and returns to the detector to collect and image by the reflective surface, and the distortion of the image can be distorted The image correction method performs digital processing on the original data and outputs the image as an undistorted image. The optical three-dimensional chip module further includes a digital logic unit disposed on an electronic component and coupled to the coated surface of the optical sheet. Forming an optical three-dimensional chip package module. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the reflective surface is formed by a planar optical surface, a spherical surface, an aspheric surface, or a binary optical surface of a semiconductor process. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the optical three-dimensional chip module can be integrated on a motherboard of the smart phone. The reflective large-angle-angle mobile phone optical module according to the first aspect of the patent application can be used in a smart phone charge coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor). Optical module in front of CMOS). The reflective large-angle-angle mobile phone optical module according to claim 1 of the patent application scope, The diameter of the detector is 150 μm ± 20%. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the detector has a thickness of 100 μm±20%. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the optical plate is a glass material having an Abbe number higher than 98. The reflective large angle of view mobile phone optical module according to claim 1, wherein the optical plate has a curvature of 750 μm ± 20%. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the effective focal length of the optical plate is 500 μm±20%. According to the scope of claim 1, the reflective large-angle-angle mobile phone optical module has an overall size of 1500 μm±20%. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the digital logic unit is selected from a digital signal processing (DSP) and a micro-electromechanical system (Micro) Electro Mechanical Systems, MEMS) group of devices. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the electronic component is a package substrate or a printed circuit board. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the optical three-dimensional chip module is combined with the electronic in a dual in-line package (DIP) Component. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the optical three-dimensional chip module can form a two-dimensional array and form a light field camera after digital processing. The reflective large-angle-angle mobile phone optical module according to claim 1, wherein the optical three-dimensional chip module can obtain a global image with an angle of view greater than 150°.