TWI650257B - Light projection device - Google Patents

Abstract

The invention discloses a light projection device, which comprises a heat conducting interface unit, a light emitting unit, a first reflecting unit and a lens unit. The thermally conductive interface unit includes a first surface. The light emitting unit includes a first light emitting structure disposed on the first surface. The first reflective unit is disposed corresponding to the first light emitting structure. The lens unit corresponds to the first reflecting unit. The first surface is disposed obliquely with respect to a lens optical axis of the lens unit. Thereby, the present invention achieves the effect of improving the light collecting efficiency.

Description

Light projection device

The present invention relates to a light projection device, and more particularly to a light projection device that can be applied to a vehicle light device.

First, the existing illuminating module for locomotive or automotive headlamps can be classified into a halogen halogen lamp, a halogen lamp, or a HID lamp (High Intensity Discharge Lamp). In addition, in the "light lamp device and its light source module" patent disclosed in the TW M539600 patent, the existing tungsten halogen lamp, halogen lamp or HID lamp is replaced by a light-emitting diode (LED) as its light source. However, in this architecture, the heat dissipation and collection efficiency are not good.

Then, in the "light lamp device and its light source module" patent disclosed in the TW M536321 patent, the reflective housing 14 and the first light-emitting element 12 disposed on the substrate 11 are mainly used to generate the low beam type. And the high-beam light type is generated by the second light-emitting element 13 provided on the substrate 11. However, in the TW M536321 patent, the substrate 11 is a heat-dissipating substrate having a significant thickness, which itself does not have a conductive function. In addition, it can be understood from FIGS. 1 and 2 of the TW M536321 patent that the first light-emitting element 12 and the second light-emitting element 13 are both disposed on a ceramic substrate and then fixed on a metal circuit board (MCPCB). Then, the ceramic substrate and the first light-emitting element 12 (or the second light-emitting element 13) are placed on the substrate 11. Therefore, the heat dissipation paths of the first light-emitting element 12 and the second light-emitting element 13 sequentially pass through the ceramic substrate, the metal circuit board, the substrate, and the heat sink. Therefore, the heat dissipation path of the TW M536321 patent case is too long, so the overall heat dissipation effect is not good. Further, as is apparent from the above description, the light-emitting surface of the first light-emitting element 12 and the light-emitting surface of the second light-emitting element 13 are not the shortest distance, which causes disadvantages such as large volume and poor light-emitting efficiency. Furthermore, the load of the overall structure of the TW M536321 patent (such as the reflective casing, the shutter, the lens, and the light-emitting element) is carried on the substrate 11. In addition, the heat conduction path is also performed under the same substrate structure, and The effect of separating the heat conduction path and the load structure is effectively achieved separately. Furthermore, since the distance between the first illuminating element and the surface of the second illuminating element in the TW M536321 patent is long, in order to improve the luminous efficiency of the low beam, the illuminating surface of the first illuminating element 12 must be The vicinity of the central axis of the fixing portion 19 (reference axis), which will cause the light-emitting surface of the second light-emitting element 13 to be away from the position of the high-beam filament of the existing tungsten halogen lamp, halogen lamp or HID lamp, thereby causing the high beam lamp The luminous efficiency is poor.

Further, the substrate 11 in the TW M536321 patent is disposed parallel to the optical axis of the lens of the lens, and the light emitting surfaces of the first light emitting element 12 and the second light emitting element 13 are also disposed parallel to the optical axis of the lens of the lens. Therefore, the overall light collection efficiency of the TW M536321 patent is not good.

The technical problem to be solved by the present invention is to provide a light projection device for the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a light projection device including a thermal interface unit, a light emitting unit, a first reflecting unit, a second reflecting unit, and a lens unit. . The thermally conductive interface unit includes a first surface and a second surface relative to the first surface. The light emitting unit includes a first light emitting structure disposed on the first surface and a second light emitting structure disposed on the second surface. The first reflective unit is disposed corresponding to the first light emitting structure. The second reflective unit is disposed corresponding to the second light emitting structure. The lens unit corresponds to the first reflecting unit and the second reflecting unit.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a light projection device including a thermal interface unit, a light emitting unit, a first reflecting unit and a lens unit. The thermal interface unit includes a The first surface. The light emitting unit includes a first light emitting structure disposed on the first surface. The first reflective unit is disposed corresponding to the first light emitting structure. The lens unit corresponds to the first reflecting unit. Wherein the first surface is disposed obliquely with respect to a lens optical axis of the lens unit.

One of the advantageous effects of the present invention is that the light projection device provided by the embodiment of the present invention can improve the light collection by utilizing the technical solution that the second reflection unit is disposed corresponding to the second illumination structure. The effect of efficiency. Further, in another embodiment, it is also possible to utilize the technical solution that "the first surface is inclined with respect to a lens optical axis of the lens unit", and the effect of improving the light collecting efficiency can be achieved.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

U‧‧‧ray projection device

1‧‧‧heating unit

11‧‧‧Solution body

12‧‧‧Connecting Department

121‧‧‧First connection

122‧‧‧Second connection

13‧‧‧ Positioning parts

2‧‧‧ Thermal Interface Unit

2a‧‧‧ first surface

2b‧‧‧ second surface

21‧‧‧ Thermal Interface Body

21a‧‧‧First board

21b‧‧‧Second plate

21c‧‧‧Connected plate

22‧‧‧Insulation

23‧‧‧ Conductive layer

3‧‧‧ Carrying unit

31‧‧‧ Carrying ontology

32‧‧‧Support

321‧‧‧First support plate

322‧‧‧second support plate

33‧‧‧Lens carrier

34‧‧‧ slats

4‧‧‧First reflection unit

4a‧‧‧ first focus

4b‧‧‧second focus

41‧‧‧First reflective surface

411‧‧‧First reflecting surface

412‧‧‧Second reflective surface

4'‧‧‧second reflection unit

4a’‧‧‧ Focus, first focus

4b’‧‧‧second focus

41'‧‧‧second reflective surface

5‧‧‧Lighting unit

51‧‧‧First light-emitting structure

511‧‧‧Lighting chip

511S‧‧‧Lighting surface

512‧‧‧Substrate

52‧‧‧Second light structure

521‧‧‧Lighting chip

521S‧‧‧Lighting surface

522‧‧‧Substrate

6‧‧‧ lens unit

6a‧‧‧ lens focus

7‧‧‧Base unit

P‧‧‧reflective structure

A‧‧‧ lens optical axis

R‧‧‧ reference axis

E‧‧‧ connection

L1‧‧‧First light

L11‧‧‧first projected light

L12‧‧‧First reflected light

L2, L2', L2"‧‧‧second light

L21, L21', L21" ‧‧‧second projected light

L22, L22'‧‧‧ second reflected light

L23’, L23”‧‧‧ Third reflected light

L24’, L24”‧‧‧ fourth reflected light

G‧‧‧Predetermined distance

Θ‧‧‧predetermined angle

α‧‧‧Preset angle

11‧‧‧first tilt angle

22‧‧‧second tilt angle

H1‧‧‧first separation distance

H2‧‧‧Second separation distance

X, Y, Z‧‧ Direction

1 is a schematic perspective view of one of the ray projection devices of the first embodiment of the present invention.

2 is another schematic perspective view of a ray projection device according to a first embodiment of the present invention.

3 is a perspective exploded view of the ray projection device of the first embodiment of the present invention.

4 is another perspective exploded view of the ray projection device of the first embodiment of the present invention.

FIG. 5 is a schematic perspective cross-sectional view showing a ray projection device according to a first embodiment of the present invention.

Figure 6 is another perspective cross-sectional view of the ray projection device of the first embodiment of the present invention.

Figure 7 is a side cross-sectional view showing the VII-VII cut line of Figure 1.

FIG. 8 is a view showing a light projection of a ray projection device according to a first embodiment of the present invention; intention.

FIG. 9 is a schematic diagram of another ray projection of the ray projection device according to the first embodiment of the present invention.

Figure 10 is a schematic view of a shutter member disposed on a carrier body in the first embodiment of the present invention.

FIG. 11 is a perspective view showing a three-dimensional combination of a light projection device according to a second embodiment of the present invention.

FIG. 12 is another schematic perspective view of a light projection device according to a second embodiment of the present invention.

Fig. 13 is a partially enlarged schematic view showing a portion XIII of Fig. 8.

Figure 14 is a schematic illustration of another embodiment of Figure 13.

FIG. 15 is a schematic diagram of a light projection of a ray casting device according to a third embodiment of the present invention.

FIG. 16 is a schematic diagram of a light projection of a ray casting device according to a fourth embodiment of the present invention.

Figure 17 is a partially enlarged schematic view showing a portion XVII of Figure 16.

FIG. 18 is a schematic diagram of a light projection of a ray casting device according to a fifth embodiment of the present invention.

Fig. 19 is a partially enlarged schematic view showing the XIX portion of Fig. 18.

FIG. 20 is a schematic diagram of a light projection of a ray casting device according to a sixth embodiment of the present invention.

The following is a description of embodiments of the present invention relating to "light projection device" by way of specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are only for the sake of simplicity of illustration, not by actual size, in advance. statement. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, these elements or signals are not limited by these terms. These terms are primarily used to distinguish one element from another, or one signal and another. In addition, the term "or" as used herein may include a combination of any one or more of the associated listed items, depending on the actual situation.

[First Embodiment]

First, referring to FIG. 1 , FIG. 2 , FIG. 5 and FIG. 6 , FIG. 1 and FIG. 2 are respectively a three-dimensional combination diagram of a ray projection device U according to a first embodiment of the present invention, and FIG. 5 and FIG. 6 are respectively a third embodiment of the present invention. A schematic cross-sectional view of a light projection device U of an embodiment. The invention provides a light projection device U, which comprises a heat dissipating unit 1, a heat conducting interface unit 2, a carrying unit 3, a first reflecting unit 4, a light emitting unit 5 and a lens unit 6. For example, the light projection device U can be applied to a vehicle headlight, and the light projection device U can be coupled to a reflective structure P disposed on the vehicle (refer to FIG. 8 , the reflective structure P is currently set in the steam locomotive). The reflector on the top) is used together. That is, the light projection device U provided by the embodiment of the present invention may preferably be disposed in a lamp device having a reflective structure P.

In view of the above, further, the light projection device U provided by the present invention can be applied to the related light source structure in ECE R37 in the Regulations of United Nations Economic Commission for Europe (ECE regulations). For example, but not limited to: H4, HS1, S1, S2, S3, H1, H7 or H11, etc., in place of the existing standard halogen lamp, tungsten halogen lamp or HID lamp bulb, but the invention is not limited thereto. In other embodiments, the light projection device U provided by the present invention can also be applied to the light source structure in other vehicle lamp regulations. It should be noted that the present invention uses the specification of H4 as an example, but the application of the architecture of the present invention is not limited thereto.

Referring to FIG. 3 and FIG. 4 , please refer to FIG. 1 , FIG. 2 , FIG. 5 and FIG. 6 . FIG. 3 and FIG. 4 respectively illustrate a three-dimensional decomposition of the ray projection device U according to the first embodiment of the present invention. schematic diagram. The heat dissipation unit 1 can include a heat dissipation body 11 and a connection portion 12 connected to the heat dissipation body 11 . For example, the thermal interface unit 2 can be disposed on the connecting portion 12 of the heat dissipating unit 1, and the thermal interface unit 2 can include a first surface 2a and a second surface 2b relative to the first surface 2a. In addition, the connecting portion 12 can include a first connecting portion 121 and a second connecting portion 122. A part of the heat conducting interface unit 2 can be disposed between the first connecting portion 121 and the second connecting portion 122. Thereby, the thermal interface unit 2 can transfer heat to the heat dissipation unit 1. Preferably, in the embodiment of the present invention, the material of the thermal interface unit 2 is different from the material of the carrying unit 3, and the thermal conductivity of the thermal interface unit 2 (or thermal conductivity, such as thermal conductivity) is lower than that of the heat dissipating unit 1 The thermal conductivity of the carrier unit 3 or the thermal conductivity of the carrier unit 3 is preferred, but the invention is not limited thereto.

For example, the material of the thermal interface unit 2 may be a metal plate having a copper material, the heat dissipating unit 1 may be a metal plate having an aluminum material, and the carrying unit 3 may be a steel plate. The metal plate of the material is not limited thereto. In other embodiments, the heat conducting interface unit 2 can also be a ceramic substrate or other materials. The heat dissipating unit 1 is not limited to a metal plate with aluminum, and the carrying unit 3 does not. Limited to metal plates with steel. It should be particularly noted that, in one embodiment, the thermal interface unit 2 can be directly disposed on the connecting portion 12 on the heat dissipating body 11 so that the thermal interface unit 2 can directly transfer heat to the heat dissipating body through the connecting portion 12 . 11 on. In addition, the heat dissipation body 11 can be a heat dissipation fin or a heat dissipation cylinder, and the invention is not limited thereto. Furthermore, in other embodiments, the thermal interface unit 2 can also be a thin heat pipe having a conductive layer. In addition, it should be noted that in other embodiments, the material of the thermal interface unit 2 may be a metal having a thermal conductivity such as aluminum, silver or gold, and the material of the thermal interface unit 2 may also be It is graphite, graphite composite or high thermal conductivity pipe with phase change (such as but not limited to heat pipe or loop heat pipe, etc.), bar or sheet. That is The thermal conductivity of the thermal interface unit 2 is preferably better than the thermal conductivity of the heat dissipating unit 1 or the thermal conductivity of the carrier unit 3 in the embodiment of the present invention. In addition, since the thermal conductivity of copper is significantly better than that of aluminum, at the same thickness, the structural strength of copper is not as good as that of aluminum, and the structural strength of aluminum is not as good as that of steel. Therefore, the heat conduction interface unit 2 and the load bearing unit 3 are respectively disposed on the heat dissipation unit 1, and the material of the heat conduction interface unit 2 and the material of the load bearing unit 3 are different, and the heat conduction path member and the load bearing structure can be achieved. The effect of the separation of the two, at the same time, can also achieve a short heat transfer path, and a strong bearing structure. In addition, the material of the carrying unit 3 is preferably stronger (harder) than the material of the heat conducting interface unit 2. It is to be noted that, in other embodiments, the light projection device U provided by the present invention may further include a fan unit (not shown) disposed on the heat dissipation unit 1.

The carrier unit 3 can be disposed on the connecting portion 12 of the heat dissipating unit 1. The carrying unit 3 can include a carrying body 31, a mounting body 31, and a heat dissipating unit. A support member 32 of 1 and a lens carrier 33 disposed on the carrier body 31. For example, the support member 32 can include a first support plate 321 and a second support plate 322. One side of the first support plate 321 and a second support plate 322 can be simultaneously disposed at the connecting portion 12 of the heat dissipation unit 1. The other side of the first supporting plate 321 and the second supporting plate 322 can be engaged with the carrying body 31, for example, by screwing, but the invention is not limited thereto. In addition, in other embodiments, the support member 32 may also be integrally formed with the carrier body 31. It should be particularly noted that the support member 32 of the carrying unit 3 is directly connected to the connecting portion 12 of the heat dissipating unit 1 so that the heat dissipating unit 1 can directly provide a supporting force to the carrying unit 3 and the first one disposed on the carrying unit 3. Reflection unit 4. That is, the support member 32 of the carrying unit 3 is in direct contact with the connecting portion 12 of the heat radiating unit 1, and the supporting member 32 can be fixed to the connecting portion 12 by a screw.

In addition, please refer to Figure 1 to Figure 6, and refer to Figure 8 as appropriate. FIG. 8 is a schematic diagram of a light projection of the light projection device U. It should be noted that only the main components are shown in FIG. 8 for the sake of easy understanding of the drawing, and the shutter member 34 shown in FIG. 8 is presented in a schematic manner. . For example, the first reflection unit 4 may be disposed on the carrier body 31, and the first reflection unit 4 may have a first focus 4a and a second focus 4b corresponding to the first focus 4a. For example, the first reflecting unit 4 may be a basic ellipsoidal curved surface formed by an elliptical line segment, that is, the first reflecting unit 4 may be composed of a plurality of different elliptical curved surfaces or a single elliptical curved surface. composition. Further, the light emitting unit 5 may include a first light emitting structure 51 disposed on the first surface 2a of the heat conductive interface unit 2 and a second light emitting structure 52 disposed on the second surface 2b of the heat conductive interface unit 2, however, The setting position of the two light-emitting structures 52 is not limited thereto. In addition, the light projection device U can also selectively or not provide the second light emitting structure 52. Also. Preferably, the first light emitting structure 51 may correspond to the first focus 4a of the first reflecting unit 4. For example, the first light emitting structure 51 may be disposed at the first focus 4a of the first reflective unit 4 or adjacent to the first focus 4a of the first reflective unit 4.

As shown in FIG. 5 to FIG. 8 and FIG. 10, FIG. 10 is a schematic view of a shutter member 34 disposed on the carrying body 31 according to an embodiment of the present invention. The leading edge of the shutter member 34 can be roughly divided into left and right. On the side, there is a significant step difference between the left and right sides to form a cut-off line that conforms to the asymmetric illumination in the automotive lighting regulations. However, in other embodiments, the leading edge of the shutter member 34 can also assume a straight line to form a cut-off line of symmetrical illumination used on a two-wheeled vehicle. It should be noted that the actual structure and shape of the shutter member 34 are known to those skilled in the art, and thus the present invention will not be described herein. Furthermore, in other embodiments, the shutter member 34 may not be provided.

In addition, it should be noted that when the first light emitting structure 51 is lit, it can be used as a low beam light of the headlight, and when the first light emitting structure 51 and the second light emitting structure 52 are simultaneously illuminated, it can be used as a high beam of the headlight. light. However, in other embodiments, the first light emitting structure 51 may not be lit, and only the second light emitting structure 52 may be lit as the front. The high beam of the light. In addition, for example, the first light emitting structure 51 and the second light emitting structure 52 may be a single light emitting diode (LED), or a package structure composed of a plurality of light emitting diode chips, and the present invention does not. This is limited to this.

Further, as shown in FIG. 1 to FIG. 6, the lens unit 6 may be disposed on the carrying unit 3, and the lens unit 6 may have a lens optical axis A and a lens focus 6a on the optical axis A of the lens. Meanwhile, the lens focus 6a may correspond to the second focus 4b of the first reflection unit 4. For example, the second focus 4b of the first reflecting unit 4 may be adjacent to the lens focus 6a or coincide with the lens focus 6a such that the lens optical axis A passes through the second focus 4b of the first reflecting unit 4. In addition, the lens unit 6 can be a plano-convex lens, a lenticular lens or a lenticular lens, but the invention is not limited thereto. Preferably, the convex portion of the lens unit 6 is such that light bulges in a direction in which the light is emitted.

Then, as shown in FIG. 1 to FIG. 6, the carrying unit 3 may further include a shutter member 34 disposed on the carrying body 31, and a first light generated by the first light emitting structure 51 (refer to FIG. 8). Shown by the occlusion of the shutter member 34, a light pattern having a contour of a cut-off line segment is projected. Further, the shutter member 34 can be a cut-off plate. Thereby, after the occlusion of the shutter member 34, a compliant light distribution standard can be produced. That is to say, the cut-off line generated by the shutter member 34 is a low beam type that conforms to a vehicle headlamp rule.

It should be noted that although the thermal interface unit 2 and the carrying unit 3 are respectively disposed on the heat dissipating unit 1 to respectively form a main path for heat conduction and a load bearing structure mainly as a load. However, in order to increase the thermal conductivity and the bearing strength of the thermal interface unit 2, in other embodiments, the thermal interface unit 2 can also abut (or can be called) on the carrying unit 3 to increase the thermal conductivity of the thermal interface unit 2. The efficiency, and at the same time, increases the structural strength of the thermal interface unit 2, or has a protective effect on the thermal interface unit 2. That is, as shown in FIG. 5 and FIG. 6 , when the thermal interface unit 2 is abutted on the carrying unit 3 , the carrying body 31 of the carrying unit 3 is preferably opposite to the first surface 2 a and the second surface of the thermal interface unit 2 . Surface 2b A recess (not labeled) for accommodating the first light emitting structure 51 and the second light emitting structure 52 is formed.

Then, as shown in FIG. 1 to FIG. 6 , the ray projection device U may further include a base unit 7 , and the base unit 7 may be disposed on the connecting portion 12 of the heat dissipation unit 1 to enable the light projection device. U is set on the vehicle. In detail, the base unit 7 can conform to the specifications of the existing vehicular headlights, so that the light projecting device U can be placed on the vehicle through the base unit 7 without changing the existing headlights. A halogen lamp, a tungsten halogen lamp or a bulb in an HID lamp of the existing specification.

7 and FIG. 8 , FIG. 7 is a side cross-sectional view of the VII-VII cut line of FIG. 1 . For example, in the embodiment of FIGS. 7 and 8 , the thermal interface unit 2 Both the first surface 2a and the second surface 2b are disposed substantially in parallel. In addition, in the embodiment of FIG. 1 to FIG. 8 , the first surface 2 a may be disposed in parallel with the optical axis A of the lens, and the second surface 2 b may also be disposed in parallel with the optical axis A of the lens, but the present invention does not Limited. Further, the base unit 7 may have a reference axis R, the reference axis R is adjacent to the lens optical axis A, and the reference axis R and the lens optical axis A of the lens unit 6 are separated from each other by 0 mm (millimeter, mm) to A predetermined distance G between 10 mm. That is, the reference axis R and the lens optical axis A may coincide with each other or be separated from each other by a predetermined distance G of less than 10 mm. Additionally, the reference axis R can be disposed substantially parallel to the lens optical axis A. For example, the reference axis R of the base unit 7 is the central axis of the base unit 7, that is, the reference axis of the existing H4 and other specifications, but the invention is not limited thereto. It should be noted that the architecture of the carrier unit 3 is not shown in FIG. 8 in order to make the drawing easy to understand.

The first light ray L1 generated by the first light emitting structure 51 may include a first projected light ray L11 projected toward the first reflecting unit 4, and the first projected light ray L11 passes through the first light ray L11. a reflection of the reflection unit 4 to form a first reflected light ray L12 passing through the second focus 4b of the first reflection unit 4, and the first reflected light ray L12 generated by the first light-emitting structure can be projected to the lens unit 6 to form A low beam type that meets the vehicle headlight regulations. In addition, when the light is projected When the U is disposed corresponding to a reflective structure P in a light device (not shown), a second light L2 generated by the second light emitting structure 52 may include a first light projected toward the reflective structure P. The second projected light L21 is reflected by the reflective structure P to form a second reflected light L22. At the same time, when the first reflected light L12 and the second reflected light L22 projected by the lens unit 6 are superposed on each other, a high beam type conforming to the vehicle headlight regulations can be formed. In addition, as shown in FIG. 8 , in the embodiment of the present invention, the first projected light L11 and the second projected light L21 may be emitted substantially in opposite directions (injecting upwards and downwards), but the present invention does not Limited.

Next, please refer to FIG. 9. FIG. 9 is a schematic diagram of another ray projection of the ray projection device U. It should be noted that only the main components are shown in FIG. 9 for the sake of easy understanding of the drawing, and FIG. The shutter member 34 is presented in a schematic manner. Meanwhile, other components shown in FIG. 9 are similar to those described above, and are not described herein again. 9 and FIG. 8 , the greatest difference between the embodiment shown in FIG. 9 and the embodiment shown in FIG. 8 is that the thermal interface unit 2 provided in FIG. 9 has a step difference so that the thermal interface unit 2 It has a stepped shape.

In detail, as shown in FIG. 9, the thermal interface unit 2 further includes a thermal interface body 21, and the thermal interface body 21 can include a first plate 21a, a second plate 21b, and a first plate. A connecting plate 21c between the 21a and the second plate 21b. The first surface 2a on the first plate 21a and the second surface 2b on the second plate 21b may have a predetermined angle θ between 0 degrees and 30 degrees or between 1 and 45 degrees a predetermined angle θ between degrees, preferably, the predetermined angle θ may be between 1 and 30 degrees, that is, both the first plate 21a and the second plate 21b are inclined so that the first The first surface 2a on a plate 21a and the second surface 2b on the second plate 21b are disposed obliquely, so that the first surface 2a on the first plate 21a and the second plate 21b are located. The upper second surface 2b may have a predetermined angle θ between 1 and 45 degrees, and preferably, the predetermined angle θ may be between 1 and 30 degrees. In other words, in the embodiment of Figure 9 For example, the second surface 2b on the second plate 21b may be disposed in parallel with the optical axis A of the lens in a side view, and the first surface 2a on the first plate 21a may be opposite to the lens light. Axis A is tilted. That is, the first surface 2a on the first plate 21a and the optical axis A of the lens may have an angle between 1 and 45 degrees, and preferably, the angle may be between 1 and 30 degrees. . That is, the lens optical axis A can pass through a horizontal plane (not shown) and parallel to the horizontal plane, and the lens optical axis A can coincide with the horizontal plane, but the invention is not limited thereto.

It should be noted that although the actual architecture of the bearer unit 3 is not shown in FIG. 9, the architecture of the bearer unit 3 may be similar to the foregoing embodiment. Meanwhile, in other embodiments, the bearer unit 3 may also have a similar The stepped shape of the thermal interface body 21 is disposed along the outer shape of the thermal interface body 21 such that the first reflective unit 4 can be disposed on the carrier body 31 of the carrier unit 3 such that the first illumination structure 51 It can correspond to the first focus 4a of the first reflecting unit 4. In addition, the carrying unit 3 can be disposed on the heat dissipating unit 1 , and the carrying unit 3 can include a carrying body 31 , a supporting member 32 disposed on the carrying body 31 and connected to the heat dissipating unit 1 , and a mounting body 31 . The lens carrier 33, wherein the first reflecting unit 4 can be disposed on the carrier body 31, and the lens unit 6 can be disposed on the lens carrier 33. Thereby, the carrier unit 3 and the thermal interface unit 2 are respectively disposed on the heat dissipation unit 1. However, in other embodiments, the carrying unit 3 may also be disposed on the heat conducting interface unit 2 such that the carrying unit 3 is disposed indirectly on the heat dissipating unit 1 through the heat conducting interface unit 2.

In addition, as shown in FIG. 9, the second surface 2b of the second plate body 21b may be substantially parallel to the lens optical axis A, and the first light emitting structure 51 may be disposed on the first surface 2a of the first plate body 21a, and the second light emitting The structure 52 can be disposed on the second surface 2b of the second plate body 21b, but the position of the second light-emitting structure 52 is not limited thereto. In addition, in FIG. 9, the light emitting surfaces of the first light emitting structure 51 and the second light emitting structure 52 may all be located on the same side of the reference axis R of the base unit 7, that is, the first light emitting structure 51 and the second light emitting layer. The position of the structure 52 can be located substantially below the optical axis A of the lens. Worth explaining Yes, the position of the light emitting surface of the first light emitting structure 51 may correspond to the first focus 4a of the first reflecting unit 4, and preferably, the light emitting surface of the first light emitting structure 51 is extended to be adjacent to the second of the first reflecting unit 4. The focus 4b coincides with the second focus 4b.

Further, as shown in FIG. 9, in the embodiment of the present invention, the first reflective unit 4 corresponds to the first light emitting structure 51, and passes between the first focus 4a and the second focus 4b of the first reflective unit 4. A line E can be disposed obliquely with respect to the optical axis A of the lens, and the line E and the optical axis A of the lens can have a predetermined angle α between 0 degrees and 30 degrees.

In view of the above, in the embodiment shown in FIG. 9, the reference axis R may coincide with the lens optical axis A, substantially coincident, or be a predetermined distance G between 0 mm and 10 mm apart. In addition, the first reflective unit 4 can include a first reflective surface 41, and the first reflective surface 41 can include a first reflective surface 411 and a second reflective surface 412 coupled to the first reflective surface 411 and a connection The first reflecting surface 411 and the second reflecting surface 412 may be respectively located on opposite sides of the optical axis A of the lens, and the first reflecting surface 411 and the second reflecting surface 412 may be based on an elliptical line segment, and the composite ellipsoid is constructed. Surface. Meanwhile, the curvature of the first reflecting surface 411 and the curvature of the second reflecting surface 412 may be the same or different. That is, the first reflecting surface 411 may be located between the lens optical axis A of the lens unit 6 and the first surface 2a, and the second reflecting surface 412 is located above the optical axis A of the lens. Further, when the curvature of the first reflective surface 411 is the same as the curvature of the second reflective surface 412, a first focus of the first reflective surface 411 (not labeled in the figure, corresponding to the first focus 4a in FIG. 9) A first focus (not labeled in the figure, corresponding to the first focus 4a in FIG. 9) may coincide with each other, and both correspond to the first light emitting structure 51, and one of the first reflecting surfaces 411 The second focus (not labeled in the figure, corresponding to the second focus 4b in FIG. 9) may be mutually coupled with a second focus of the second reflective surface 412 (not labeled in the figure, corresponding to the second focus 4b in FIG. 9). Coincident, and both correspond to the lens focus 6a.

In addition, referring to FIG. 9 , in other embodiments, when the curvature of the first reflective surface 411 is different from the curvature of the second reflective surface 412 , the first reflective surface 411 It can be used as a reflector cup design for the concentrating light type, and the second reflecting surface 412 can be used as a reflector cup design for the light-expanding type, that is, the first reflecting surface 411 can be used as a complete-type hot-zone type. The second reflecting surface 412 can be used as a light-expanding light type of the non-thermal zone portion of the complete optical type. That is, the first focus of the second reflective surface 412 does not coincide with the first light emitting structure 51, or the first light emitting structure 51 is located near the first focus of the second reflective surface 412 such that the second reflective surface 412 is opposite. The first light-emitting structure 51 has the effect of light-expanding, but the invention is not limited thereto.

[Second embodiment]

First, referring to FIG. 11 and FIG. 12, FIG. 11 and FIG. 12 are schematic diagrams showing the three-dimensional combination of the ray projection device U according to the second embodiment of the present invention. It can be seen from the comparison between FIG. 11 and FIG. 12 and FIG. 1 to FIG. 4 that the maximum difference between the second embodiment and the foregoing embodiment is that the light projection device U provided by the second embodiment can directly utilize the first illumination structure 51 and the first embodiment. The position of the two light-emitting structures 52 is configured to produce a light distribution standard that complies with vehicle lighting regulations without the need to configure the lens unit 6 and the load unit 3. Further, as shown in FIG. 11 and FIG. 12 , the light projection device U can include a heat dissipation unit 1 , a heat conduction interface unit 2 , a light emitting unit 5 , and a base unit 7 . It should be noted that other elements in the second embodiment are similar to the foregoing embodiments, and are not described herein again. Meanwhile, the embodiment provided by the second embodiment can also be applied to the foregoing embodiment.

Next, referring to Fig. 13, Fig. 13 is a partially enlarged schematic view showing a portion XIII of Fig. 8 in the foregoing embodiment, and at the same time, the first reflecting unit 4 is omitted. In detail, the thermal interface unit 2 can include a thermal interface body 21, an insulating layer 22 (or dielectric layer) disposed on opposite sides of the thermal interface body 21, and a plurality of opposite sides of the thermal interface body 21. Conductive layer 23 on insulating layer 22. That is to say, the thermal interface unit 2 corresponds to a double-sided single layer structure. Further, the conductive layer 23 on one of the opposite sides of the thermal interface body 21 has a bare first surface 2a, and the conductive layer 23 on the other of the opposite sides of the thermal interface body 21 has a bare The second surface 2b is outside. At the same time, the first light emitting structure 51 and the first The two light emitting structures 52 may be disposed on the first surface 2a and the second surface 2b, respectively. In addition, it should be noted that although the embodiment of the present invention is mainly a double-sided single-layer thermal interface unit 2 as an illustration, in other embodiments, the two-layer copper substrate may be bonded by soldering. The double-sided double-sided thermal interface unit 2 is formed.

The first light emitting structure 51 can include a substrate 512 and a light emitting chip 511 disposed on the substrate 512 of the first light emitting structure 51. The second light emitting structure 52 can include a substrate 522 and An illuminating wafer 521 disposed on the substrate 522 of the second light emitting structure 52. In addition, the light-emitting chip 511 of the first light-emitting structure 51 can be electrically connected to the conductive layer 23 of one side of the heat-conducting interface body 21, and the light-emitting chip 521 of the second light-emitting structure 52 can be electrically connected to the other of the heat-conductive interface body 21. Side conductive layer 23. For example, the substrate (512, 522) can be a ceramic substrate such as, but not limited to, aluminum oxide. Thereby, the heat transfer path shown in FIG. 13 can be transmitted to the substrate (512, 522) by the light-emitting wafers (511, 521), and then transferred to the heat-conductive interface unit 2 through the substrate (512, 522), and then passed through. The thermal interface unit 2 is directly transferred to the heat dissipation unit 1.

In addition, for example, in the embodiment of the present invention, the conductive layer 23 is a commonly used conductive material, and may be copper, aluminum, silver or gold. The insulating layer 22 can be an insulating material for insulation between the heat conducting interface body 21 and the conductive layer 23. In addition, the thermal interface body 21 is a material having high thermal conductivity, and the material thereof may be the same as or different from the material of the conductive layer 23. Preferably, the thermal conductivity of the thermal interface body 21 is at least the same as or equivalent to that of the conductive layer 23, or even more. it is good. For example, the material of the thermal interface body 21 may be a metal having a thermal conductivity such as copper, aluminum, silver, or gold. The material of the thermal interface unit 2 may also be graphite or graphite composite or It is a high heat conductive pipe having a phase change (such as, but not limited to, a heat pipe or a loop heat pipe, etc.), a bar or a sheet, and the invention is not limited thereto.

Next, referring to FIG. 14, it can be seen from the comparison between FIG. 14 and FIG. 13 that the first light-emitting structure 51 and the second light-emitting structure 52 in FIG. 14 are different from those in FIG. In details, The first light emitting structure 51 and the second light emitting structure 52 in FIG. 14 do not have a substrate (512, 522), that is, the light emitting chip is directly disposed on the heat conductive interface unit 2. In other words, the first light emitting structure 51 includes a light emitting chip 511, and the second light emitting structure 52 includes a light emitting chip 521. The light emitting chip 511 of the first light emitting structure 51 is electrically connected to the conductive layer on one side of the heat conducting interface body 21. 23, the light emitting chip 521 of the second light emitting structure 52 is electrically connected to the conductive layer 23 on the other side of the heat conducting interface body 21. Thereby, the heat transfer path shown in FIG. 14 can be directly transmitted to the heat conduction interface unit 2 by the light emitting wafers (511, 512), and then directly transmitted to the heat dissipation unit 1 through the heat conduction interface unit 2.

Further, referring to FIG. 11 to FIG. 14 , in the embodiment without the lens unit 6 , the reference axis R of the base unit 7 can be located on a light emitting surface 511S and the second of the first light emitting structure 51 . Between a light-emitting surface 521S of the light-emitting structure 52, and a light-emitting surface 511S of the first light-emitting structure 51 and the reference axis R may have a first separation distance H1 of less than 2 millimeters (mm), and the second light-emitting structure 52 The light emitting surface 521S and the reference axis R may have a second separation distance H2 of less than 2 mm. Preferably, the first separation distance H1 may be less than 1.3 mm, and more preferably, the first separation distance H1 may be less than 0.5 mm. In addition, preferably, the second separation distance H2 may be less than 1.64 mm, and more preferably, the second separation distance H2 may be less than 0.82 mm. However, it should be noted that the above embodiment can also be applied to the light projection device U having the lens unit 6.

Further, referring to FIG. 1 and FIG. 2, in the embodiment having the lens unit 6, the first light emitting structure 51 may have a first light emitting surface 511S and a reference axis R of less than 10 mm. The separation distance H1, the light-emitting surface 521S of the second light-emitting structure 52 and the reference axis R may have a second separation distance H2 of less than 2 mm. Preferably, the first separation distance H1 may be less than 8 mm, and more preferably, the first separation distance H1 may be less than 2 mm. In addition, preferably, the second separation distance H2 may be less than 1.64 mm, and more preferably, the second separation distance H2 may be less than 0.82 mm.

In addition, it should be noted that, please refer to FIG. 5 to FIG. 7 , preferably, The thickness of the portion of the carrying unit 3 adjacent to the lens unit 6 may be within 4 times of the distance between the light emitting surface 511S of the first light emitting structure 51 to the light emitting surface 521S of the second light emitting structure 52, and more preferably, the carrying unit The thickness dimension of the portion of the adjacent lens unit 6 in 3 may be within 2 times of the distance between the light emitting surface 511S of the first light emitting structure 51 to the light emitting surface 521S of the second light emitting structure 52, and more preferably, the carrying unit 3 The thickness of the portion of the adjacent adjacent lens unit 6 is the same as the distance between the light emitting surface 511S of the first light emitting structure 51 to the light emitting surface 521S of the second light emitting structure 52. Further, the thickness dimension of the portion of the carrier unit 3 adjacent to the lens unit 6 may be smaller than the distance between the light emitting surface 511S of the first light emitting structure 51 to the light emitting surface 521S of the second light emitting structure 52.

Further, as shown in FIG. 11 to FIG. 14, the first light emitting structure 51 and the second light emitting structure 52 may be packaged by a plurality of light emitting wafers, and in other embodiments, two adjacent light emitting layers may be used. A colloid is disposed between the wafers such that light is projected from the top light emitting surface 511S of the first light emitting structure 51 and the top light emitting surface 521S of the second light emitting structure 52.

[Third embodiment]

First, referring to FIG. 15, FIG. 15 is a schematic diagram of light projection of a ray casting device according to a third embodiment of the present invention. It can be seen from the comparison between FIG. 15 and FIG. 9 that the maximum difference between the third embodiment and the foregoing embodiment is that the arrangement position of the second light-emitting structure 52 in the ray-projecting device U provided by the third embodiment is different from that of the foregoing embodiment. . Further, as shown in FIG. 15, the light projection device U can include a thermal interface unit 2, a light emitting unit 5, a first reflecting unit 4, and a lens unit 6. It should be noted that only the main elements are shown in Fig. 15 in order to make the drawings easy to understand. That is, the light projection device U provided by the third embodiment may further include a heat dissipation unit 1, a carrier unit 3 and/or a base unit 7 as described in the foregoing embodiments, but the present invention does not This is limited. In addition, the shutter member 34 shown in FIG. 15 is presented in a schematic manner, however, in other embodiments, the shutter member 34 can also be directly disposed. On the thermal interface unit 2. It should be noted that other elements in the third embodiment are similar to the foregoing embodiments, and are not described herein again. Meanwhile, the embodiment provided by the third embodiment can also be applied to the foregoing embodiment.

It should be noted that although the actual architecture of the bearer unit 3 is not shown in FIG. 15, the architecture of the bearer unit 3 may be similar to that of the foregoing embodiment. Meanwhile, in other embodiments, the bearer unit 3 may also have a similar The stepped shape of the thermal interface body 21 is disposed along the outer shape of the thermal interface body 21 such that the first reflective unit 4 can be disposed on the carrier body 31 of the carrier unit 3 such that the first illumination structure 51 It can correspond to the first focus 4a of the first reflecting unit 4. In addition, the heat-transfer interface unit 2 can be disposed on the heat-dissipating unit 1 , and the load-bearing unit 3 can be disposed on the heat-dissipating unit 1 . The load-bearing unit 3 can include a carrier body 31 , and is disposed on the carrier body 31 and connected to the heat-dissipating unit. A support member 32 of 1 and a lens carrier 33 disposed on the carrier body 31. The first reflecting unit 4 may be disposed on the carrier body 31, and the lens unit 6 may be disposed on the lens carrier 33. Thereby, the heat conducting interface unit 2 and the carrying unit 3 are respectively disposed on the heat dissipating unit 1. It should be noted that, in the third embodiment, the carrying unit 3 may also be disposed indirectly on the heat dissipating unit 1 through the heat conducting interface unit 2, that is, the carrying unit 3 is first disposed on the heat conducting interface unit 2, and the heat conducting interface unit 2 is further disposed on the heat dissipation unit 1, in other words, the first reflection unit 4 can be disposed on the heat conduction interface unit 2, but the invention is not limited thereto.

In the above, the thermal interface unit 2 can include a first surface 2a and a second surface 2b relative to the first surface 2a. In the embodiment of FIG. 15, the thermal interface unit 2 can include a thermal interface. The main body 21, the thermal interface body 21 can include a first plate body 21a, a second plate body 21b, and a connecting plate body 21c connected between the first plate body 21a and the second plate body 21b, and the first surface 2a It may be located on the upper surface of the first plate body 21a, and the second surface 2b may be located on the lower surface of the first plate body 21a. For example, as shown in FIG. 15, the first surface 2a and the second surface 2b may be disposed substantially in parallel, but the invention is not limited thereto. In addition, the first surface 2a may be disposed obliquely with respect to a lens optical axis A of the lens unit 6, and the second surface 2b is relatively transparent The mirror axis A can be tilted. The light emitting unit 5 may include a first light emitting structure 51 disposed on the first surface 2a and a second light emitting structure 52 disposed on the second surface 2b. Further, the first reflecting unit 4 may be disposed corresponding to the first light emitting structure 51, and the lens unit 6 can correspond to the first reflecting unit 4.

In view of the above, it should be noted that although the heat conducting interface body 21 shown in the drawings has the first plate body 21a, the second plate body 21b, and the connecting plate body 21c, and is connected (fixed) to the second plate body 21b. The connecting portion 12 of the heat dissipating unit 1 is indirectly connected to the first plate body 21a via the connecting plate body 21c to carry the first light emitting structure 51 and the second light emitting structure 52. However, in other embodiments, the manner in which the second plate body 21b is connected to the connecting portion 12 may also be inclined. In addition, only the first plate body 21a for carrying the first light-emitting structure 51 and the second light-emitting structure 52 may be provided, and the invention is not limited thereto. In other words, in other embodiments, the thermal interface body 21 may include only a first plate 21a, and the first plate 21a may be directly connected to the connecting portion 12 of the heat dissipation unit 1, and the first plate 21a remains It is inclined as shown in FIG. Furthermore, in other embodiments (as shown in FIG. 20), the thermal interface body 21 may include only a first plate body 21a and a connection plate body 21c, and the connection plate body 21c is disposed at the connection portion of the heat dissipation unit 1. 12 on. In other words, the present invention is not limited to the manner in which the thermally conductive interface body 21 is fixed.

Therefore, the first light emitting structure 51 and the second light emitting structure 52 of the third embodiment are upper and lower surfaces respectively disposed on the first board body 21a of the heat conductive interface unit 2 (in comparison with the foregoing embodiment of FIG. 9). The first surface 2a and the second surface 2b). In other words, a light emitting surface 511S of the first light emitting structure 51 may be disposed obliquely with respect to the lens optical axis A of the lens unit 6, and a light emitting surface 521S of the second light emitting structure 52 may be inclined with respect to the lens optical axis A. . That is, a light-emitting surface 511S of the first light-emitting structure 51 and a light-emitting surface 521S of the second light-emitting structure 52 are disposed obliquely with respect to a horizontal plane (not shown in the drawing, the horizontal plane is parallel to the lens optical axis A). Preferably, the light emitting surface 511S of the first light emitting structure 51 and the lens optical axis A may have a first tilt angle β1 between 1 degree and 45 degrees, and the light emitting surface 521S of the second light emitting structure 52 is transparent. The mirror optical axis A may have a second tilt angle β2 between 1 and 45 degrees. More preferably, the first tilt angle β1 may be between 1 and 30 degrees, and the second tilt angle β2 may be between 1 and 30 degrees, but the invention is not limited thereto. In other words, in other embodiments, the first surface 2a and the lens optical axis A may have an angle between 1 and 45 degrees, and the second surface 2b may have an interval between the optical axis A and the lens. An angle between 1 and 45 degrees.

In the above, further, the position of the light emitting surface of the first light emitting structure 51 may correspond to the first focus 4a of the first reflecting unit 4, and preferably, the light emitting surface of the first light emitting structure 51 is extended to be adjacent to the first reflection. The second focus 4b of the unit 4 coincides with the second focus 4b. Furthermore, the first reflecting unit 4 can include a first reflecting surface 411 and a second reflecting surface 412 connected to the first reflecting surface 411 as described in the foregoing embodiments. The first reflective surface 411 may be located between a lens optical axis A of the lens unit 6 and the first surface 2a, and the second reflective surface 412 may be located above the optical axis A of the lens, and the curvature of the first reflective surface 411 and the second reflection The curvature of the face 412 may be the same or different, and the invention is not limited thereto.

In addition, it should be particularly noted that, in the embodiment shown in FIG. 15, the light emitting unit 5 further includes a second light emitting structure 52, but in other embodiments, only the first surface 2a of the heat conducting interface unit 2 may be The first light emitting structure 51 is disposed thereon, and further, the first surface 2a may be disposed obliquely with respect to a lens optical axis A of the lens unit 6. In other words, the present invention is not limited by the setting of the second light emitting structure 52.

[Fourth embodiment]

First, referring to FIG. 16 and FIG. 17, FIG. 16 is a schematic diagram of light projection of a ray projection apparatus according to a fourth embodiment of the present invention, and FIG. 17 is a partially enlarged schematic view of a portion XVII of FIG. It can be seen from the comparison between Fig. 16 and Fig. 8 that the maximum difference between the fourth embodiment and the foregoing embodiment is that the ray projection device U provided by the fourth embodiment further includes a second reflecting unit 4'. Further, the light projection device U A heat conducting interface unit 2, a light emitting unit 5, a first reflecting unit 4, a second reflecting unit 4', and a lens unit 6 may be included. Further, the light emitting unit 5, the first reflecting unit 4, and the second reflecting unit 4' may be disposed along a lens optical axis A of the lens unit 6. It should be noted that only the main elements are shown in Fig. 16 in order to make the drawings easy to understand. In other words, the light projection device U provided by the fourth embodiment may further include a heat dissipation unit 1, a carrier unit 3 and/or a base unit 7 as described in the foregoing embodiments, but the present invention does not This is limited. In addition, the shutter member 34 shown in FIG. 16 is shown in a schematic manner, however, in other embodiments, the shutter member 34 may also be disposed directly on the heat conductive interface unit 2. Furthermore, although the actual architecture of the carrier unit 3 is not shown in FIG. 16, the architecture of the carrier unit 3 may be similar to the previous embodiment. It should be noted that other elements in the fourth embodiment are similar to the foregoing embodiments, and are not described herein again. Meanwhile, the embodiment provided by the fourth embodiment can also be applied to the foregoing embodiment.

In the above, as shown in FIG. 16 and FIG. 17, the thermal interface unit 2 may include a first surface 2a and a second surface 2b opposite to the first surface 2a. The light emitting unit 5 may include a first surface disposed on the first surface. The first light emitting structure 51 on 2a and the second light emitting structure 52 disposed on the second surface 2b. The first reflective unit 4 may be disposed corresponding to the first light emitting structure 51, and the second reflective unit 4' may be disposed corresponding to the second light emitting structure 52, while the lens unit 6 may correspond to the first reflective unit 4 and the second reflective unit 4'.

For example, as described in the foregoing embodiment, the first reflecting unit 4 can be disposed on the carrying body 31 of the carrying unit 3, and therefore, the second reflecting unit 4' can also be disposed on the carrying body 31 of the carrying unit 3, The load of the first reflecting unit 4 and the second reflecting unit 4' can be carried by the carrying unit 3. In other words, the first reflecting unit 4 may be disposed on the upper surface of the carrying unit 3, and the second reflecting unit 4' may be disposed on the lower surface of the carrying unit 3. However, it should be noted that in other embodiments, the second reflective unit 4' may also be disposed on the thermal interface unit 2, and the invention is not limited thereto. In other words, in other embodiments, the first reflective unit 4 and the second reflective unit The element 4' and the lens unit 6 may both be disposed on the thermally conductive interface unit 2.

In addition, the first reflective unit 4 may have a first reflective surface 41, wherein some or all of the first reflective surface 41 may face the lens unit 6, and the second reflective unit 4' may have a second reflective surface. 41', some or all of the second reflective surface 41' may be opposite the lens unit 6. In other words, the directions in which both the first reflecting unit 4 and the second reflecting unit 4' face each other are opposite to each other (e.g., the positive Z direction and the negative Z direction).

Furthermore, referring to FIG. 16 and FIG. 17, the first reflecting unit 4 may have a first focus 4a and a second focus 4b corresponding to the first focus 4a of the first reflecting unit 4. The lens unit 6 may have a lens optical axis A and a lens focus 6a on the optical axis A of the lens, and the first light emitting structure 51 may correspond to the first focus 4a of the first reflecting unit 4. Preferably, the first light emitting structure 51 may be disposed on or adjacent to the first focus 4a of the first reflective unit 4. Further, the second reflecting unit 4' may have at least one focus 4a' (or may be referred to as a first focus 4a' of the second reflecting unit 4'), and the second lighting structure 52 may correspond to the second reflecting unit 4' At least one focus 4a'. Preferably, the second light emitting structure 52 may be disposed on or adjacent to at least one focus 4a' of the second reflecting unit 4'.

It should be noted that in other embodiments, the second reflection unit 4 ′ may have a first focus 4 a ′′ and a second focus 4 b ′ corresponding to the first focus 4 a ′ of the second reflection unit 4 ′ (see 18 and 19), the second reflective unit 4' may not have any focus but only a reflective arc surface, and the invention is not limited thereto. In other words, when the second reflecting unit 4' has only one focus 4a' (first focus 4a'), the second reflecting surface 41' of the second reflecting unit 4' may be a perfect circular curved surface or a parabolic curvature The curved surface, in addition, when the second reflective unit 4' has the first focus 4a' and the second focus 4b', the second reflective surface 41' of the second reflective unit 4' may be an elliptical curvature surface.

In view of the above, please refer to FIG. 16 and FIG. 17, which will be further explained below. The light projection state of the two light emitting structures 52. In detail, a first light ray L1 generated by the first light-emitting structure 51 may include a first projected light ray L11 projected toward the first reflective unit 4, and the first projected light ray L11 is reflected by the first reflective unit 4. The first reflected light ray L12 that passes through the second focus 4a of the first reflective unit 4 is formed, and the first reflected light ray L12 generated by the first light emitting structure 51 can be projected to the lens unit 6 through the shutter member 34 to Form a low beam type that meets the vehicle headlamp regulations.

Then, as shown in FIG. 16 and FIG. 17, the ray projection device U can be disposed corresponding to a reflective structure P in a light-emitting device, and a second light ray L2 generated by the second illuminating structure 52 can include a a second projected light L21' projected toward the second reflecting unit 4', and the second projected light L21' is reflected by the second reflecting unit 4' to form a second light emitting structure 52 and/or a second surface 2b The second reflected light L22' projected in the direction. The second reflected light L22' is reflected by the second light emitting structure 52 and/or the second surface 2b to form a third reflected light L23' projected toward the direction of the reflective structure P, and the third reflected light L23' passes through the reflective structure P The reflection is to form a fourth reflected light L24'. In addition, when the first reflected light L12 and the fourth reflected light L24' are superposed on each other, a high beam type conforming to the vehicle headlight regulations can be formed.

In view of the above, further, the following description will be first made with an embodiment in which the second reflecting unit 4' may have at least one focus 4a' (or may be referred to as a first focus 4a' of the second reflecting unit 4'), however, In other embodiments, the second reflecting unit 4 ′ may also have the first focus 4 a ′ and the second focus 4 b ′, or have no focus and only a reflective curved surface, and the invention is not limited thereto. In detail, the light emitting surface 521S of the second light emitting structure 52 may be disposed on at least one focus 4a' of the second reflecting unit 4', whereby the second reflecting unit 4' may be a circular curved surface. Then, after the second projected light L21' is projected onto the second reflective unit 4', the second projected light L21' is projected onto the at least one focus 4a' of the second reflective unit 4' by reflection of the second reflective unit 4'. . And due to the internal structure of the LED structure of the LED (usually silver plated or easy to reverse) The multi-layered film structure can have a reflective effect. Therefore, the second reflected light L22' projected onto the second light-emitting structure 52 can be projected by the second light-emitting structure 52 to form a direction toward the reflective structure P. The third reflected light L23'. Further, the third reflected light L23' is reflected by the reflective structure P to form a fourth reflected light L24'. It should be noted that, in other embodiments, since a portion of the second reflected light L22' is projected onto the second surface 2b, a reflective layer having a reflective effect may also be disposed on the second surface 2b to increase The reflection efficiency of the second reflected light L22' projected onto the second surface 2b. For example, the reflective layer may be formed on the second surface 2b by metal plating or plastic plating, and the reflective layer may be composed of a gold-containing metal, a nickel metal or a mixture of a gold metal and a nickel metal, but the reflection of the present invention. The layer setting method is not limited to this.

In addition, it should be particularly noted that, in principle, the second reflected light L22' may coincide or substantially coincide with the second projected light L21', and pass through or near at least one focus 4a' of the second reflective unit 4', but To avoid confusion, the second reflected light L22' shown in FIGS. 16 and 17 is presented in such a manner that it does not pass through at least one focus 4a' of the second reflecting unit 4'.

[Fifth Embodiment]

First, referring to FIG. 18 and FIG. 19, FIG. 18 is a schematic diagram of light projection of a ray projection apparatus according to a fifth embodiment of the present invention, and FIG. 19 is a partially enlarged schematic view of a portion XIX of FIG. 18, FIG. 16 and FIG. 15, it is understood that in the embodiment of FIG. 18, the technical means of FIGS. 16 and 15 are integrated. That is, the greatest difference between the fifth embodiment and the foregoing embodiment is that the ray projection device U further includes a second reflection unit 4', and the first surface 2a and the second surface 2b of the thermal interface unit 2 are relative to The lens optical axis A of the lens unit 6 is disposed obliquely. It should be noted that only the main elements are shown in Fig. 18 in order to make the drawings easy to understand. In other words, the light projection device U provided by the fifth embodiment may further include a heat dissipation unit 1, a carrier unit 3 and/or a base unit 7 as described in the foregoing embodiments. However, the invention is not limited thereto. In addition, the shutter member 34 shown in FIG. 18 is shown in a schematic manner, however, in other embodiments, the shutter member 34 may also be disposed directly on the heat conductive interface unit 2. Furthermore, although the actual architecture of the carrier unit 3 is not shown in FIG. 18, the architecture of the carrier unit 3 may be similar to the previous embodiment. It is to be noted that the other elements in the fifth embodiment are similar to those of the foregoing embodiment, and are not described herein again. Meanwhile, the embodiment provided by the fifth embodiment can also be applied to the foregoing embodiment.

In the above, as shown in FIG. 18, the light projection device U can include a thermal interface unit 2, a light emitting unit 5, a first reflecting unit 4, a second reflecting unit 4', and a lens unit 6. In addition, the thermal interface unit 2 can include a first surface 2a and a second surface 2b relative to the first surface 2a. The first surface 2a is disposed obliquely with respect to a lens optical axis A of the lens unit 6, and the second surface 2b is disposed obliquely with respect to the optical axis A of the lens.

It should be noted that, compared to the embodiment of FIG. 16, although the embodiment of FIG. 18 is that the first surface 2a is disposed obliquely with respect to the lens optical axis A of the lens unit 6, and the second surface 2b is opposed to the lens light. Axis A is tilted. However, a second light L2 ′ generated by the second light emitting structure 52 may further include a second projected light L21 ′ projected toward the second reflective unit 4 ′, and the second projected light L21 ′ passes through the second reflective unit 4 . The reflection of 'to form a second reflected ray L22' projected toward the second luminescent structure 52 and/or the second surface 2b. The second reflected light L22' is reflected by the second light emitting structure 52 and/or the second surface 2b to form a third reflected light L23' projected toward the direction of the reflective structure P, and the third reflected light L23' passes through the reflective structure P The reflection is to form a fourth reflected light L24'.

Next, referring to FIG. 19, the following description will be made with an embodiment in which the second reflection unit 4' may have the first focus 4a' and the second focus 4b'. However, the present invention does not use the second reflection unit 4'. The aspect is limited, that is, regardless of the curved surface of the second reflecting unit 4', it can be applied to the light projection device U provided by the embodiment of the present invention.

For example, the second reflecting unit 4' may have a first focus 4a' and a second focus 4b', whereby the second reflecting unit 4' can be an elliptical curvature curved surface. Preferably, the first focus 4a' of the second reflective unit 4' may be located on the light emitting surface 521S of the second light emitting structure 52, and the second focus 4b' of the second reflecting unit 4' may be located on the second light emitting structure 52 or It is on the second surface 2b, but the invention is not limited thereto.

For example, the first focus 4a' and the second focus 4b' of the second reflecting unit 4' will be described below on the second light emitting structure 52. In detail, the light emitting surface 521S of the second light emitting structure 52 may be disposed on the first focus 4a' of the second reflecting unit 4', and then, after the second projected light L21' is projected to the second reflecting unit 4', the second The projected light beam L21' is projected onto the second focus 4b' of the second reflection unit 4' by reflection of the second reflection unit 4'. And because the internal structure of the light-emitting diode (LED) under the existing structure has a reflective coating, the second reflected light L22' projected onto the second light-emitting structure 52 or the second surface 2b can The third reflected light L23' projected toward the direction of the reflective structure P is formed by the reflection of the second light emitting structure 52 or the second surface 2b. Further, the third reflected light L23' is reflected by the reflective structure P to form a fourth reflected light L24'. In addition, it should be noted that in other embodiments, only the first plate body 21a and the connection plate body 21c may be provided as described above, or only the first plate body 21a may be provided.

[Sixth embodiment]

First, referring to FIG. 20, FIG. 20 is a schematic diagram of a light projection of a ray casting device according to a sixth embodiment of the present invention. As can be seen from the comparison between FIG. 20 and FIG. 18, the greatest difference between the sixth embodiment and the foregoing embodiment is that the thermal interface unit 2 of the sixth embodiment can be fixed to the connecting portion 12 by a positioning member 13 of the heat dissipating unit 1. In other words, the foregoing embodiment places a part of the thermal interface unit 2 between the first connection portion 121 and the second connection portion 122 such that the thermal interface unit 2 transfers heat to the heat dissipation unit 1. However, the sixth embodiment uses the positioning member 13 to dispose the thermal interface unit 2 on the heat dissipating unit 1 so that the thermal interface unit 2 transfers heat to the heat dissipating unit 1.

Next, referring to FIG. 20, it should be noted that only the main elements are shown in FIG. 20 in order to make the drawings easy to understand. In addition, the shutter member 34 shown in FIG. 20 is shown in a schematic manner, however, in other embodiments, the shutter member 34 may also be disposed directly on the heat conductive interface unit 2. Furthermore, although the actual architecture of the carrier unit 3 is not shown in FIG. 20, the architecture of the carrier unit 3 may be similar to the previous embodiment. It is to be noted that the other elements in the sixth embodiment are similar to those of the foregoing embodiment, and are not described herein again. Meanwhile, the embodiment provided by the sixth embodiment can also be applied to the foregoing embodiment.

In addition, it should be noted that other path paths of the partial second light ray L2" projected by the second light emitting structure 52 will be described below using the embodiment of FIG. 20. However, it should be noted that the second embodiment described in the foregoing embodiment The path of the light (L2') can also be applied to the sixth embodiment, and other path paths of the partial second light L2" described later can also be applied to the foregoing embodiment.

In the above, in detail, a second light L2" generated by the second light emitting structure 52 may include a second projected light L21" projected toward the second reflecting unit 4', and the second projected light L21" passes through The reflection of the two reflection units 4' forms a third reflected light L23" projected toward the direction of the reflective structure P, and the third reflected light L23" is reflected by the reflective structure P to form a fourth reflected light L24". In addition, when the first reflected light L12 and the fourth reflected light L24" are superposed on each other, a high beam type conforming to the vehicle headlight regulations can be formed.

[Advantageous Effects of Embodiments]

One of the advantageous effects of the present invention is that the light projection device U provided by the embodiment of the present invention can improve the light collection by utilizing the technical solution that the second reflection unit 4 is disposed corresponding to the second illumination structure 52. The effect of efficiency. Further, it is also possible to achieve the effect of improving the light collecting efficiency by utilizing the technical solution that "the first surface 2a is inclined with respect to a lens optical axis A of the lens unit 6".

Further, it is also possible to utilize "the second surface 2b with respect to the lens unit 6 A lens optical axis A is disposed obliquely, and the effect of improving the light collecting efficiency can be achieved.

Further, it is also possible to utilize "the first reflecting unit 4 has a first reflecting surface 41, wherein a part of the first reflecting surface 41 faces the lens unit 6, and the second reflecting unit 4' has a second reflecting surface 41', wherein A part of the second reflective surface 41' faces away from the lens unit 6", and the effect of improving the light collecting efficiency can be achieved.

In addition, the present invention can also utilize the technical solution of "the heat conducting interface unit 2 and the carrying unit 3 are respectively disposed on the heat dissipating unit 1", and can achieve the technical effect of "the heat conducting path member and the load bearing structure are separated". Further, compared with the prior art, the present invention can simultaneously achieve the effects of improving load carrying capacity and heat dissipation efficiency.

In addition, the light-emitting chip 511S of the first light-emitting structure 51 is electrically connected to the conductive layer 23 on one side of the heat-conductive interface body 21, and the light-emitting chip 521S of the second light-emitting structure 52 is electrically connected to the heat-conductive interface body 21. The technical solution of the conductive layer 23" on the other side can achieve the technical effect of "increasing luminous efficiency and heat dissipation efficiency". Further, the above-mentioned structural design can be used to make the light-emitting pattern close to the tungsten halogen lamp, the halogen lamp or the HID lamp of the existing structure.

The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.

Claims (22)

A light projection device includes: a thermal interface unit, the thermal interface unit including a first surface and a second surface opposite to the first surface; a light emitting unit, wherein the light emitting unit comprises a a first light emitting structure on the first surface and a second light emitting structure disposed on the second surface; a first reflecting unit, wherein the first reflecting unit is disposed corresponding to the first light emitting structure, wherein The first reflective unit has a first reflective surface; a second reflective unit, the second reflective unit is disposed corresponding to the second light emitting structure, wherein the second reflective unit has a second reflective surface, a portion of the second reflective surface is opposite the lens unit; and a lens unit corresponding to the first reflective unit and the second reflective unit. The ray-projecting device of claim 1, wherein the first surface is disposed obliquely with respect to a lens optical axis of the lens unit. The ray-projecting device of claim 1, wherein the second surface is disposed obliquely with respect to the optical axis of the lens. The ray-projecting device of claim 1, wherein a portion of the first reflective surface faces the lens unit. The ray-projecting device of claim 1, wherein the first reflecting unit has a first focus and a second focus corresponding to the first focus, the lens unit has a lens optical axis and a a lens focus on an optical axis of the lens; wherein the first illumination structure corresponds to the first focus of the first reflective unit. The ray-casting device of claim 1, wherein the second reflecting unit has at least one focus, and the second illuminating structure corresponds to at least one of the focal points of the second reflecting unit. The ray-projecting device of claim 1, wherein the first ray generated by the first illuminating structure comprises a first projected ray projected in a direction toward the first reflecting unit, the first projected ray Reflecting by the first reflecting unit to form a first reflected light. The ray-projecting device of claim 1 or 7, wherein the ray-projecting device is disposed corresponding to a reflective structure in a light-emitting device, and the second ray generated by the second illuminating structure includes an orientation a second projected ray projected in a direction of the second reflecting unit, the second projected ray being reflected by the second reflecting unit to form a direction toward the second illuminating structure or the second surface a second reflected ray, the second reflected ray being reflected by the second illuminating structure or the second surface to form a third reflected ray projected in a direction toward the reflective structure, the third reflection Light is reflected by the reflective structure to form a fourth reflected light. The ray-projecting device of claim 7, wherein the first reflected ray generated by the first illuminating structure is projected to the lens unit to form a light pattern conforming to vehicle headlight regulations. The ray-projecting device of claim 1, wherein the first surface and the second surface are disposed substantially in parallel. The light projection device of claim 1, further comprising: a heat dissipation unit, wherein the heat conduction interface unit is disposed on the heat dissipation unit. The ray-casting device of claim 11, further comprising: a carrying unit, wherein the carrying unit is disposed on the heat dissipating unit, the first reflecting unit, the second reflecting unit, and the lens The unit is disposed on the carrying unit; wherein the heat conducting interface unit and the carrying unit are respectively disposed on the heat dissipating unit. The light projection device of claim 12, wherein the carrying unit further comprises a carrying body and a shutter member disposed on the carrying body, the first light generated by the first light emitting structure Through the shutter member Blocking and projecting a light pattern with a contour of a cut-off line segment. The light projection device of claim 12, wherein the carrying unit comprises a carrier body, a support member disposed on the carrier body and connected to the heat dissipation unit, and a support member disposed on the carrier body a lens carrier; wherein the first reflective unit and the second reflective unit are disposed on the carrier body, and the lens unit is disposed on the lens carrier. The light projection device of claim 12, wherein the material of the heat conducting interface unit is different from the material of the carrying unit. The ray-projecting device of claim 11 or 12, further comprising: a base unit, the base unit being disposed on the heat dissipation unit, wherein the base unit has a reference axis, the reference The axis is adjacent to a lens optical axis of the lens unit, and the reference axis and the lens optical axis coincide with each other or are separated from each other by a predetermined distance of less than 10 mm. The light projection device of claim 11 or 12, wherein the thermal conductivity of the thermally conductive interface unit is better than the thermal conductivity of the heat dissipation unit. The ray-projecting device of claim 1, wherein the first reflecting unit comprises a first reflecting surface and a second reflecting surface connected to the first reflecting surface, wherein the first reflecting surface is located at the a lens optical axis of the lens unit and the first surface, the second reflective surface being located above the optical axis of the lens; wherein a curvature of the first reflective surface and a curvature of the second reflective surface Same or different. A light projection device includes: a thermal interface unit, the thermal interface unit including a first surface and a second surface opposite to the first surface; a light emitting unit, wherein the light emitting unit comprises a a first light emitting structure on the first surface and a second light emitting structure disposed on the second surface; a first reflecting unit, wherein the first reflecting unit is disposed corresponding to the first light emitting structure, wherein The first reflective unit has a first reflective surface, wherein a portion of the first reflective surface faces the lens unit; a second reflective unit, the second reflective unit is disposed corresponding to the second light emitting structure, wherein the second reflective unit has a second reflective surface a part of the second reflective surface facing away from the lens unit; and a lens unit corresponding to the first reflective unit; wherein the first surface is opposite to the lens unit The optical axis of the lens is tilted. The ray-projecting device of claim 19, wherein the second surface is disposed obliquely with respect to the optical axis of the lens. The ray-projecting device of claim 19, wherein the first ray generated by the first illuminating structure comprises a first projected ray projected in a direction toward the first reflecting unit, the first projected ray Reflecting by the first reflecting unit to form a first reflected light; wherein the light projection device is disposed corresponding to a reflective structure in a light device, and the second light emitting structure generates a first The second ray includes a second projected ray projected toward the second reflecting unit, and the second projected ray is reflected by the second reflecting unit to form a second illuminating structure or the first a second reflected ray projected in a direction of the two surfaces, the second reflected ray being reflected by the second illuminating structure or the second surface to form a third reflected ray projected in a direction toward the reflective structure, The third reflected light is reflected by the reflective structure to form a fourth reflected light. The ray-casting device of claim 19, further comprising: a heat dissipating unit and a carrying unit, wherein the heat conducting interface unit is disposed on the heat dissipating unit, and the carrying unit is disposed on the heat dissipating unit The first reflecting unit, the second reflecting unit and the lens unit are disposed on the carrying unit, and the heat conducting interface unit and the carrying unit are respectively disposed on the heat dissipating unit.