TWI648717B - Flexible electronic device - Google Patents

Abstract

A flexible electronic device has a display area and a package area surrounding the display area. The flexible electronic device includes a substrate, a first protective film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protective film is disposed relative to the substrate. The first adhesive layer is disposed between the substrate and the first protective film and at least in the package region. The display medium layer is disposed between the substrate and the first protective film and located in the display area. The flexible auxiliary layer is disposed on the surface of the first protective film and located in the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in the thickness direction.

Description

Flexible electronic device

This invention relates to an electronic device, and more particularly to a flexible electronic device.

In recent years, due to the popularization of portable electronic devices, in order to meet the portable needs of users for portable electronic devices, the development and trend of flexible electronic devices have been driven. In the prior art, the flexible electronic device currently on the market is still manufactured by a packaging operation such as a bonding between the driving substrate and the upper protective cover via a glue.

When the flexible electronic device has a display medium in the display area, and the upper protective cover and the drive substrate are bonded to each other in the package area by way of rolling, pressing or other layer bonding, in the package area and in the display area The spacing between the drive substrate and the upper protective cover is different. At this time, the region between the two portions having the step difference in the package area for bonding the driving substrate and the upper protective cover may be subjected to additional stress along the slope direction. In this case, when the flexible electronic device is bent for a long time and repeatedly, the rubber material is subjected to the additional stress in the direction of the inclined surface and the bending stress caused by the bending process to accelerate the creep, and the peeling of the rubber material occurs. A phenomenon of delamination occurs between the drive substrate and the upper protective cover.

The present invention provides a flexible electronic device which can effectively prevent peeling of a rubber layer between protective films.

The flexible electronic device of the present invention has a display area and a package area surrounding the display area. The flexible electronic device includes a substrate, a first protective film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protective film is disposed relative to the substrate. The first adhesive layer is disposed between the substrate and the first protective film and at least in the package region. The display medium layer is disposed between the substrate and the first protective film and located in the display area. The flexible auxiliary layer is disposed on the surface of the first protective film and located in the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in the thickness direction.

In an embodiment of the invention, the first protective film is bonded to the substrate via the first adhesive layer.

In an embodiment of the invention, the substrate and the first protective film have a first pitch in the package region, the substrate and the first protective film have a second pitch in the display region, and the first pitch is smaller than the second pitch.

In an embodiment of the invention, the first protective film is located between the flexible auxiliary layer and the substrate.

In an embodiment of the invention, when the flexible electronic device is in a bent state, the bent portion of the flexible electronic device has a compressive stress band, a tensile stress band, and a compressive stress based on the bending stress. The neutral axial plane between the belt and the tensile stress zone, and the first glue layer in the bent section is located in the tensile stress zone or the neutral axial plane.

In an embodiment of the invention, the flexible auxiliary layer is located between the first protective film and the substrate.

In an embodiment of the invention, the substrate and the first protective film have a first pitch in the package region, and the substrate and the first protective film have a second pitch in the display region, and the first pitch is equal to the second pitch.

In an embodiment of the invention, both the flexible auxiliary layer and the first adhesive layer surround the display area.

In an embodiment of the present invention, the flexible auxiliary layer includes two auxiliary patterns facing each other, and the two auxiliary patterns are respectively disposed on opposite sides of the flexible electronic device, and the two auxiliary patterns respectively extend along the corresponding side edges. To define a predetermined bending section of the flexible electronic device.

In an embodiment of the invention, the length of each of the two auxiliary patterns is less than the length of the corresponding side.

In an embodiment of the invention, the Young's modulus of the flexible auxiliary layer is greater than 1500 MPa.

In an embodiment of the invention, the flexible auxiliary layer comprises a second adhesive layer and a flexible material layer, the second adhesive layer is located between the flexible material layer and the first protective film, and the flexible material layer is passed through the second adhesive The layer is bonded to the first protective film.

In an embodiment of the invention, the flexible electronic device further includes a second protective film. The substrate is disposed between the first protective film and the second protective film.

In an embodiment of the invention, the flexible auxiliary layer surrounds the display area, and the first adhesive layer continuously extends between the package area and the display area.

The flexible electronic device of the present invention has a display area and a package area surrounding the display area. The flexible electronic device includes a substrate, a first protective film, a first adhesive layer, and a display medium layer. The first protective film is disposed relative to the substrate, the first protective film having a first thickness in the package region and a second thickness in the display region, wherein the first thickness is greater than the second thickness. The first adhesive layer is disposed between the substrate and the first protective film and at least in the package region. The display medium layer is disposed between the substrate and the first protective film and located in the display area.

In an embodiment of the invention, the first protective film is bonded to the substrate via the first adhesive layer.

In an embodiment of the invention, the substrate and the first protective film have a first pitch in the package region, and the substrate and the first protective film have a second pitch in the display region, and the first pitch is smaller than the second spacing.

In an embodiment of the invention, the sum of the first pitch and the first thickness is equal to the sum of the second pitch and the second thickness.

In an embodiment of the invention, the flexible electronic device further includes a second protective film. The substrate is disposed between the first protective film and the second protective film.

Based on the above, the flexible electronic device of the present invention includes a flexible auxiliary layer located within the package area. Thereby, the peeling of the first adhesive layer between the substrate and the first protective film in the package region can be effectively avoided, and delamination between the substrate and the first protective film is caused, and the time for the first adhesive layer to undergo creep is delayed. In order to make the flexible electronic device have a good service life.

The above described features and advantages of the invention will be apparent from the following description.

1A is a top plan view of a flexible electronic device according to an embodiment of the invention. Figure 1B is a cross-sectional view of the flexible electronic device of Figure 1A taken along line A-A'. Figure 1C is a cross-sectional view of the flexible electronic device of Figure 1A taken along line B-B'. 1D is a schematic cross-sectional view of the flexible electronic device of FIG. 1C in a bent state. Referring to FIG. 1A and FIG. 1B simultaneously, the flexible electronic device 100 has a display area 104 and a package area 102 surrounding the display area 104. The flexible electronic device 100 includes a substrate 110, a first protective film 120, a first adhesive layer 130, a display dielectric layer 140, and a flexible auxiliary layer 150. The first protective film 120 is disposed relative to the substrate 110. The first adhesive layer 130 is disposed between the substrate 110 and the first protective film 120 and at least in the package region 102. The display medium layer 140 is disposed between the substrate 110 and the first protective film 120 and located in the display area 104. The flexible auxiliary layer 150 is disposed on the surface of the first protective film 120 and located in the package region 102, wherein the flexible auxiliary layer 150 overlaps the first adhesive layer 130 in the thickness direction. Here, the flexible electronic device 100 is, for example, an electronic device such as an electronic paper display, but the present invention does not limit the type of the flexible electronic device 100.

Specifically, the substrate 110 is, for example, a thin film drive substrate made of a flexible plastic or metal material, and the flexible electronic device 100 is made thinner and more portable. Plastics include polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), etc. In order to avoid damage to the internal electronic components when the flexible electronic device 100 is subjected to impact or drop, the weight of the flexible electronic device 100 can be greatly reduced. The thin film driving substrate includes an active array substrate such as a thin film transistor (TFT) array substrate, a passive array substrate, or other substrate having a working circuit, which is not limited herein. For example, the substrate 110 of the flexible electronic device 100 of the present embodiment may be a TFT driving substrate such as a PI material for electrically driving the display medium layer 140 attached thereto to realize the function of displaying an image.

The first protective film 120 may be a protective cover for providing durability of the flexible electronic device 100 and protecting soft components such as the substrate 110 or the display medium 140 of the flexible electronic device 100 from friction scratches to make flexibility. The electronic device 100 is more suitable for a use environment such as carrying or wearing, which is prone to dynamic bending deformation during use. The first protective film 120 may be pressed onto the substrate 110 by a method such as hot bonding, vacuum lamination, roller lamination, or glue lamination. The material of the first protective film 120 is, for example, polyethylene terephthalate (PET), but is not limited thereto.

The first adhesive layer 130 may be optically clear resin (OCR), optical clear adhesive (OCA) or ultraviolet light curing adhesive (UV adhesive), etc., having good processability, bonding strength and light transmittance. Adhesive material. The first adhesive layer 130 may be glued between the substrate 110 and the first protective film 120, or may be attached to the first protective film 120 at the process end of the first protective film 120. A glue layer 130 is disposed thereon, so that the first protective film 120 itself has the first adhesive layer 130 and then adheres to the substrate 110, which is not limited thereto, as long as it is glued to the two via an adhesive material or an adhesive layer. Between the substrates, the scope of the present invention is intended to be protected.

The display medium layer 140 can be an electrophoretic display film or an electrowetting display film, and the display medium layer 140 is disposed between the substrate 110 and the first protective film 120, and can be driven by the substrate 110 to display images and can be subjected to the first protective film. 120 protection. That is, the first protective film 120 can be embodied as a protective cover for the flexible electronic device 100 on the light-emitting surface, so that the flexible electronic device 100 is more durable. Here, the overall arrangement relationship of the flexible electronic device 100 is substantially completed.

Continuing to refer to FIG. 1B , the first protective film 120 is bonded to the substrate 110 via the first adhesive layer 130 in the package region 102 , so that the substrate 110 and the first protective film 120 have a first pitch D1 in the package region 102 . That is, the first pitch D1 may be the thickness of the first adhesive layer 130 in the Z-axis direction. The display medium layer 140 is disposed between the substrate 110 of the display area 104 and the first protective film 120, and the substrate 110 and the first protective film 120 have a second pitch D2 at the display area 104. In other words, the second pitch D2 may be the thickness of the display medium layer 140 in the Z-axis direction.

Specifically, when the first pitch D1 is smaller than the second pitch D2, the first protective film 120 forms a slope inclined by the display region 104 toward the package region 102 due to the bonding and packaging with the substrate 110, so that the flexible electronic device 100 is made. Formed as a packaged product having a ladder-like structure. The slope of the slope will vary depending on the height of the step between the display dielectric layer 140 and the first glue layer 130. At this time, the first adhesive layer 130 for bonding the first protective film 120 and the substrate 110 will receive additional stress in the direction of the slope here. In this case, when the flexible electronic device 100 is bent, the stress concentrates on the bent portion that has been folded or flexed during assembly, so that the first adhesive layer 130 is subjected to multiaxial stress and causes stress interference, A phenomenon such as stress creep or local deformation accelerates the creep of the first adhesive layer 130, resulting in delamination and damage between the substrate 110, the first adhesive layer 130, and the first protective film 120.

For details, please refer to FIG. 1B, FIG. 1C and FIG. 1D. When the flexible electronic device 100 is bent, the bending axis is parallel to the Y-axis direction, for example, and the first protective film 120 is opposite to the first adhesive layer 130. The substrate 110 is located inside the bent flexible electronic device 100. At this time, the first adhesive layer 130 of the package region 102 in the bent portion 106 and the first protective film 120 are simultaneously subjected to the stress in the oblique direction as shown in FIG. 1B and the bent state as shown in FIG. 1D. Bending stress.

The bent section 106 of the flexible electronic device 100 has a compressive stress band C, a tensile stress band T, and a neutral axial plane N between the compressive stress band C and the tensile stress band T based on the bending stress. Generally, when the first adhesive layer 130 and the first protective film 120 in the bent portion 106 are located in the compressive stress band C, generally the first protective film 120 will face the Z axis relatively far from the first adhesive layer 130. The direction generates a force that is detached from the first adhesive layer 130 to release the flexural stress it is subjected to, and the first adhesive layer 130 is subjected to the compressive stress in the X-axis direction generated by the flexible electronic device 100 in a bent state. The tensile stress in the Z-axis direction causes the first adhesive layer 130 to be easily damaged due to the stress exceeding the elastic limit or the cohesive force and the adhesive force limit, so that the first adhesive layer 130 is latent. The peeling of the substrate 110 or/and the first protective film 120 causes a phenomenon in which the substrate 110 or/and the first protective film 120 are delaminated. In other words, in the present embodiment, the first adhesive layer 130 in the bent section 106 is simultaneously subjected to the compressive stress and the Z-axis in the X-axis direction as shown in FIG. 1D when the flexible electronic device 100 is bent. The tensile stress in the direction and the tensile stress in the YZ direction as shown in Fig. 1B increase the speed at which the creep occurs. In addition, in order to make the flexible electronic device 100 have better flexural characteristics, a softer adhesive material is generally used for bonding the adhesive layer between the substrate and the first protective film, but such materials have poor cohesion. Therefore, it is not suitable for the region of the compressive stress band C under the bending stress. Therefore, if the position of the neutral axial plane N is moved to one side of the first protective film 120 and the first adhesive layer 130, the first adhesive layer 130 is located near the neutral axial plane N or in the stretched state. The stress band T can delay the time during which the first adhesive layer 130 undergoes latent damage.

Specifically, the compressive stress band C, the tensile stress band T, and the neutral axial plane N between the compressive stress band C and the tensile stress band T in FIGS. 1B to 1D are, for example, no flexible auxiliary layer 150 is provided. The flexible electronic device is subjected to a state of being bent, and the compressive stress band C', the tensile stress band T', and the neutral axial plane N' bounded between the compressive stress band C' and the tensile stress band T' are, for example, The state in which the flexible electronic device 100 of the flexible auxiliary layer 150 is bent is provided. As shown in FIG. 1B to FIG. 1D, in the present embodiment, the flexible auxiliary layer 150 is attached to the package region 102 on the first protective film 120. Therefore, the neutral axial plane N' of the flexible electronic device 100 can be shifted toward the side of the flexible auxiliary layer 150 with respect to the flexible electronic device in which the flexible auxiliary layer 150 is not provided. That is, when the flexible electronic device 100 is in a bent state as shown in FIG. 1D, the position of the first adhesive layer 130 for bonding the substrate 110 and the first protective film 120 may leave the compressive stress band C'. The area is lowered while the first adhesive layer 130 is stressed. In this way, the first adhesive layer 130 can be effectively prevented from being accelerated by the multiaxial stress such as the tensile stress in the oblique direction and the bending stress in the bent state, and the member is damaged.

In detail, referring to FIG. 1B and FIG. 1D , the flexible auxiliary layer 150 of the present embodiment is disposed on the outer surface of the first protective film 120 . That is, the first protective film 120 is located between the flexible auxiliary layer 150 and the substrate 110. Specifically, the flexible auxiliary layer 150 of the present embodiment may correspond to the first adhesive layer 130 being disposed only in the package region 102, and the orthographic projection area of the flexible auxiliary layer 150 on the substrate 110 may fall on the first adhesive. The orthographic area of layer 130 on substrate 110, but is not limited thereto. In other embodiments, the flexible auxiliary layer 150 may be disposed between the substrate 110 and the first protective film 120. In other embodiments not shown, the flexible auxiliary layer may also be disposed only on the side of the first adhesive layer adjacent to the inclined surface to prevent the first adhesive layer from being subjected to multiaxial stress on the side of the first adhesive layer. Accelerate creep and stripping to reduce the adverse effects of bending stress on flexible electronic devices. In addition, the present embodiment only schematically provides the flexible auxiliary layer 150 on the outer surface of the first protective film 120. However, the flexible auxiliary layer 150 may also be attached to the outer surface of the substrate 110 on the package area 102 according to actual needs. Or other adaptive places, the member or film layer having a low elastic limit in the flexible electronic device 100 is dropped on the neutral axis surface, so that the stress value felt in the bent state is lowered.

As shown in FIG. 1D, the flexible auxiliary layer 150 on the bent section 106 is located inside the flexible electronic device 100 in a bent state. That is, the radius of curvature of the flexible auxiliary layer 150 may be smaller than the radius of curvature of the substrate 110. In this bent state, the flexible electronic device 100 provided with the flexible auxiliary layer 150 has a tensile stress band T′, a compressive stress band C′ and a compressive stress in the bent section 106 based on the bending stress. The neutral axial plane N' between the belt C' and the tensile stress zone T'. Due to the provision of the flexible auxiliary layer 150, the position of the neutral axial plane N' defined by the bending stress is shifted toward the flexible auxiliary layer 150. Therefore, the neutral axial plane N' is closer to the first protective film 120 than the neutral axial plane N when the flexible auxiliary layer 150 is not disposed, and the first adhesive layer 130 in the bent section 106 is located at the neutral axis. On the surface N', the first adhesive layer 130 receives the lowest stress value in the bent state, and prevents the first adhesive layer 130 from being peeled off due to the occurrence of latent damage due to being located in the compressive stress zone C'.

It should be noted that the thickness of the flexible auxiliary layer 150 of the present embodiment may be substantially equal to the thickness of the display medium layer 140, but is not limited thereto. In other embodiments, the flexible auxiliary layer 150 can also be adjusted according to the Young's modulus or other material properties of the material as needed for the actual design. For example, when the thickness of the flexible auxiliary layer disposed on the outer surface of the first protective film is increased, the neutral axial surface is displaced more toward the flexible auxiliary layer, and the first adhesive layer is located at the tensile stress band. Thereby, the first adhesive layer is prevented from being subjected to creep stress by multiaxial stress. In addition, the flexible auxiliary layer 150 can also adjust its thickness setting according to physical parameters such as stress values of different materials selected, and is not limited thereto. For example, the Young's modulus of the flexible auxiliary layer 150 of the present embodiment may be greater than 1500 MPa. It should be noted that the position of the flexible auxiliary layer 150 can be adjusted according to actual needs, as long as the softest material of the package region 102 can be placed on the neutral axis surface N' or the tensile stress band T'. It is within the scope of the present invention to delay the time during which the member formed by the soft material or the film layer undergoes creeping and delamination due to bending, and is not limited thereto.

In the present embodiment, the flexible auxiliary layer 150 of the flexible electronic device 100 includes a second adhesive layer 152 and a flexible material layer 154 . The second adhesive layer 152 is located between the flexible material layer 154 and the first protective film 120 . The flexible material layer 154 is bonded to the first protective film 120 via the second adhesive layer 152. Herein, the material of the second adhesive layer 152 may be an adhesive material such as optical adhesive (OCA), and the flexible material layer 154 may be a soft material such as PET, but not limited thereto. .

Referring to FIG. 1A, in the present embodiment, the flexible auxiliary layer 150 may include two auxiliary patterns 156A, 156B opposite to each other. The two auxiliary patterns 156A, 156B are respectively disposed on opposite sides of the flexible electronic device 100, and the two auxiliary patterns 156A, 156B each extend along the corresponding side to define a predetermined bending area of the flexible electronic device 100. Segment 108.

Specifically, the two auxiliary patterns 156A and 156B of the present embodiment are disposed in the package area 102 corresponding to the display area 104, extend along the X axis and are located on opposite sides of the display area 104, and the two auxiliary patterns 156A, Each of the lengths of 156B is less than the length of the side of the corresponding flexible electronic device 100. Herein, the lengths of the two auxiliary patterns 156A and 156B in the X-axis direction are substantially equal, so that the flexible electronic device 100 can form the predetermined bending section 108 according to the connection between the two ends of the two auxiliary patterns 156A and 156B, and The flexible electronic device 100 can be bent in a predetermined bending section 108.

The predetermined bend section 108 defined by the two auxiliary patterns 156A, 156B of FIG. 1A is generally the bent section 106 of FIG. 1D. According to the above description, the two auxiliary patterns 156A, 156B can adjust the neutral axial plane N' of the bent section 106 of the flexible electronic device 100 in the bent state to help prevent the first adhesive layer 130 from creeping. damage. In other words, the flexible auxiliary layer 150 of the present embodiment can be attached only to the predetermined bending section 108, thereby effectively reducing the stress received by the first adhesive layer 130 in the package area 102 during bending, which is not easy. damage. However, in other embodiments, the flexible auxiliary layer 150 may have other arrangement types, which are not limited herein. For example, if there is more than one predetermined bending section 108 of the product design, the flexible auxiliary layer 150 may also be attached to the opposite two auxiliary patterns 156A, 156B in multiple stages corresponding to the predetermined bending section 108, or completely covered by the package. The region 102 and fully surrounding the display area 104 allows the flexible electronic device 100 to be twisted, bent or curled, either fully or arbitrarily.

In addition, the flexible electronic device 100 of the embodiment further includes a second protective film 160. The substrate 110 is disposed between the first protective film 120 and the second protective film 160. That is, the second protective film 160 is disposed on the opposite side of the substrate 110 with respect to the first protective film 120 for protecting the substrate 110. The material, assembly method and effect of the second protective film 160 are similar to those of the first protective film 120. For details, please refer to the description of the previous embodiment, which will not be described in detail herein. Here, the second protective film 160 and the substrate 110 may be bonded by a third adhesive layer (not shown), and the material of the third adhesive layer may be similar to the first adhesive layer 130 or the second adhesive layer previously described. The material of 152 is not described in detail here. In addition, the present embodiment only schematically provides the flexible auxiliary layer 150 on the outer surface of the first protective film 120. If necessary, the flexible auxiliary layer 150 may also be attached to the outer surface of the second protective film 160. .

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeatedly described in detail.

1E is a cross-sectional view showing another flexible electronic device according to an embodiment of the present invention. Referring to FIG. 1B and FIG. 1E, the flexible electronic device 100' of the present embodiment is similar to the flexible electronic device 100 of FIG. 1B, and thus the same or similar elements are denoted by the same or similar reference numerals. Specifically, the flexible electronic device 100' has a display area 104 and a package area 102 surrounding the display area 104. The flexible electronic device 100' includes a substrate 110, a first protective film 120', a first adhesive layer 130', The display medium layer 140, the flexible auxiliary layer 150, and the second protective film 160, wherein the arrangement relationship and efficacy of the substrate 110, the display medium layer 140, the flexible auxiliary layer 150, and the second protective film 160, and the first protective film 120' For the function of the first adhesive layer 130', reference may be made to the detailed description of the embodiment of FIG. 1B, which will not be described in detail herein. The difference between the two is that the first adhesive layer 130' of the present embodiment continuously extends over the package area 102 and the display area 104.

Specifically, the first adhesive layer 130' of the present embodiment is disposed on the entire inner surface of the first protective film 120'. That is, the first adhesive layer 130' is located between the first protective film 120' and the substrate 110 in the package region 102, and is also located between the first protective film 120' and the display medium layer 140 in the display region 104. That is, the orthographic projection area of the first adhesive layer 130' of the present embodiment on the substrate 110 may completely overlap the orthographic projection area of the first protective film 120' on the substrate 110. Here, the first adhesive layer 130' is sufficient to provide the adhesive strength between the substrate 110 and the first protective film 120', which is not limited by the scope of the present invention.

2A is a cross-sectional view showing a flexible electronic device extending in the Y-axis direction according to another embodiment of the present invention. Referring to FIG. 1B and FIG. 2A simultaneously, the flexible electronic device 200A of the present embodiment is similar to the flexible electronic device 100 of FIG. 1B, and thus the same or similar elements are denoted by the same or similar reference numerals. Specifically, the flexible electronic device 200A has a display area 104 and a package area 102 surrounding the display area 104. The flexible electronic device 200A includes a substrate 110, a first protective film 220A, a first adhesive layer 130, and a display medium layer 140. The flexible auxiliary layer 250 and the second protective film 160, wherein the substrate 110, the first adhesive layer 130, the display medium layer 140, and the second protective film 160 have an arrangement relationship and efficacy, and the flexible auxiliary structure 250 and the first protection The efficacy of the film 220A can be referred to the detailed description of the embodiment of FIG. 1B, and will not be described in detail herein.

In the present embodiment, the flexible auxiliary layer 250 is disposed on the inner surface of the first protective film 220A on the package region 102. That is, the flexible auxiliary layer 250 is located between the first protective film 220A and the substrate 110 in the package region 102. Here, the flexible material layer 254 of the flexible auxiliary layer 250 is attached to the inner surface of the first protective film 220A by the second adhesive layer 252 in the package region 102, and the first adhesive layer 130 is adhered and flexible in the package region 102. The flexible material layer 254 of the auxiliary layer 250 is bonded to the substrate 110. In other words, the flexible material layer 254 is glued between the substrate 110 and the first protective film 220A and between the substrate 110 and the first protective film 220A by the first adhesive layer 130 and the second adhesive layer 252, respectively.

The thickness of the flexible auxiliary layer 250 is substantially equal to the thickness of the display dielectric layer 140, such that the first pitch D1' of the substrate 110 and the first protective film 220A in the package region 102 and the substrate 110 and the first protective film 220A are in the display area. The second spacing D2 of 104 is substantially equal. That is, the first protective film 220A may extend substantially flat between the display region 104 and the package region 102. In this case, the stress caused by the step of the first pitch D1 and the second pitch D2 is small in the first adhesive layer 130, so that the first adhesive layer 130 is not easily creeped when the flexible electronic device 200A is bent. Or delamination.

2B is a cross-sectional view of the flexible electronic device extending in the Y-axis direction according to another embodiment of the present invention. Referring to FIG. 1B and FIG. 2B simultaneously, the flexible electronic device 200B of the present embodiment is similar to the flexible electronic device 100 of FIG. 1B, and thus the same or similar elements are denoted by the same or similar reference numerals. Specifically, the flexible electronic device 200B has a display area 104 and a package area 102 surrounding the display area 104. The flexible electronic device 200B includes a substrate 110, a first protective film 220B, a first adhesive layer 130, and a display medium layer 140. And the second protective film 160, wherein the arrangement relationship and efficacy of the substrate 110, the first adhesive layer 130, the display dielectric layer 140, and the second protective film 160, and the efficacy of the first protective film 220B can be referred to the details of the embodiment of FIG. 1B. Description, no longer detailed here. The difference between the two is that the first protective film 220B of the present embodiment has a first thickness H1 in the package region 102, and the first protective film 220B has a second thickness H2 in the display region 104, wherein the first thickness H1 is greater than the second thickness H2 is configured to effectively prevent delamination between the substrate 110 and the first protective film 220B due to peeling of the first adhesive layer 130 between the substrate 110 and the first protective film 220B in the package region 102.

Specifically, the first thickness H1 of the first protective film 220B in the package region 102 is greater than the second thickness H2 of the first protective film 220B in the display region 104, and the sum of the first thickness H1 and the first pitch D1 is approximately equal to the second The sum of the thickness H2 and the second pitch D2 is such that the extending direction of the outer surface of the first protective film 220B is substantially parallel to the extending direction of the substrate 110. In this case, the first protective film 220B can extend substantially flat between the display area 104 and the package area 102, so that the first adhesive layer 130 does not easily change or deviate when the flexible electronic device 200B is bent. Floor. That is, the first protective film 220B of the present embodiment can simultaneously have the function of the flexible auxiliary structure 150 of FIG. 1B. It should be noted that the first adhesive layer 130 of the embodiment may also extend between the package region 102 and the display region 104 as shown in FIG. 2A, or may be adjusted according to actual design requirements. The location is configured and is not limited here.

3 is a top plan view of a flexible electronic device according to another embodiment of the present invention. Referring to FIG. 1A and FIG. 3 together, the flexible electronic device 300 of the present embodiment is similar to the flexible electronic device 100 of FIG. 1A, and thus the same or similar elements are denoted by the same or similar reference numerals. Specifically, the cross-sectional structure of the flexible electronic device 300 can be referred to FIG. 1B or FIG. 2A. The flexible auxiliary layer 350 is similar in function to the flexible auxiliary layer 150 of FIG. 1B or the flexible auxiliary layer 250 of FIG. 2A for adjusting the position of the neutral axial surface (not shown) in the bent state or reducing the number The stress experienced by a glue layer. The difference between the two is that the flexible auxiliary layer 350 of the package region 102 of the flexible electronic device 300 of the present embodiment includes two auxiliary patterns 356A, 356B. The two auxiliary patterns 356A, 356B are longer in the X-axis direction than the two auxiliary patterns 156A, 156B of the flexible auxiliary layer 150 of FIG. 1A. For example, the length of the two auxiliary patterns 356A, 356B in the X-axis direction may be substantially equal to the length of the flexible electronic device 300 in the X-axis direction. In other words, the package regions 102 on the opposite sides of the flexible electronic device 300 extending in the X-axis direction are attached with two auxiliary patterns 356A, 356B, so that the flexible electronic device 300 is disposed in the auxiliary patterns 356A, 356B. The area can be bent, flexed or curled arbitrarily, and it is not easy to creep or delamination of the rubber layer.

4 is a top plan view of a flexible electronic device according to another embodiment of the present invention. Referring to FIG. 1A and FIG. 4 together, the flexible electronic device 400 of the present embodiment is similar to the flexible electronic device 100 of FIG. 1A, and thus the same or similar elements are denoted by the same or similar reference numerals. The cross-sectional structure of the flexible electronic device 400 can be referred to FIG. 1B or FIG. 2A. The flexible auxiliary layer 450 is similar in function to the flexible auxiliary layer 150 of FIG. 1B or the flexible auxiliary layer 250 of FIG. 2A for adjusting the position of the neutral axial surface (not shown) in the bent state or reducing the number The stress experienced by a glue layer. The difference between the two is that the flexible auxiliary layer 450 of the flexible electronic device 400 of the present embodiment has two auxiliary patterns 456A similar to the two auxiliary patterns 156A, 156B of the flexible auxiliary layer 150 of the flexible electronic device 100. In addition to 456B, two auxiliary patterns 458A, 458B that are parallel to each other and opposite to each other are further included.

Specifically, the two auxiliary patterns 458A, 458B are disposed in the package area 102 on opposite sides (parallel to the side in the Y direction) of the flexible electronic device 400, and the two auxiliary patterns 456A, 456B are disposed on the flexible portion. The other two opposite sides of the electronic device 400 (parallel to the sides in the X direction) are within the encapsulation area 102. Here, the length of each of the two auxiliary patterns 458A, 458B is smaller than the length of the side of the corresponding Y direction, and the two auxiliary patterns 458A, 458B are parallel to each other in the Y-axis direction and have substantially the same length, so that the flexible electronic device 400 can be A predetermined bent section 408' of the flexible electronic device 400 is defined in accordance with a line connecting the two ends of the two auxiliary patterns 458A, 458B parallel to the X axis.

In addition, the component arrangement and efficiency of the two auxiliary patterns 456A, 456B in this embodiment are the same as the two auxiliary patterns 156A, 156B shown in FIG. 1A. A predetermined bend section 408 of the flexible electronic device 400 is defined in accordance with a line connecting the two ends of the two auxiliary patterns 458A, 458B parallel to the X-axis. However, this embodiment only schematically sets two sets of auxiliary patterns 456A, 456B and 458A, 458B on the side of the flexible electronic device 400. In other embodiments not shown, the flexible auxiliary layer may also be provided with a plurality of auxiliary patterns on a single side to define a plurality of predetermined bending sections according to actual design requirements.

FIG. 5 is a top plan view of a flexible electronic device according to another embodiment of the present invention. Referring to FIG. 3 and FIG. 5 simultaneously, the flexible electronic device 500 of the present embodiment is similar to the flexible electronic device 300 of FIG. 3, and therefore the same or similar elements are denoted by the same or similar reference numerals. The difference between the two is that the flexible auxiliary layer 550 of the flexible electronic device 500 of the present embodiment constitutes a closed frame-shaped pattern that completely surrounds the display area 104 and is completely disposed corresponding to the package area 102.

Specifically, the cross-sectional structure of the flexible electronic device 500 can be referred to FIG. 1B or FIG. 2A. The flexible auxiliary layer 550 is similar in function to the flexible auxiliary layer 150 of FIG. 1B or the flexible auxiliary layer 250 of FIG. 2A for adjusting the position of the neutral axial surface (not shown) in the bent state or reducing the number The stress experienced by a glue layer. As such, the flexible auxiliary device 550 helps the first adhesive layer of the package region 102 to fall on the neutral axis regardless of the bending, flexing, twisting or curling state of the flexible electronic device 500. Or a tensile stress band (not shown) to prevent the first adhesive layer from being subjected to multiaxial stress to accelerate creep and peel.

In summary, the flexible electronic device of the present invention includes a flexible auxiliary layer located in the package region to adjust the position of the neutral axis of the package region in the bent state or reduce the stress on the first adhesive layer. . In this way, the first adhesive layer between the substrate and the first protective film in the package region can be effectively prevented from being peeled off due to the bending stress, so that the flexible electronic device is not easily damaged by the bending of the dynamic use process. Extends the life of flexible electronic devices.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 100', 200A, 200B, 300, 400, 500‧‧‧ flexible electronic devices

102‧‧‧Package area

104‧‧‧ display area

106‧‧‧Bent section

108, 408, 408’ ‧ ‧ scheduled bending section

110‧‧‧Substrate

120, 120', 220A, 220B‧‧‧ first protective film

130, 130'‧‧‧ first layer

140‧‧‧Display media layer

150, 250, 350, 450, 550‧‧‧ flexible auxiliary layer

152, 252‧‧‧ second layer

154, 254‧‧‧ flexible material layer

156A, 156B, 356A, 356B, 456A, 456B, 458A, 458B‧‧‧ auxiliary patterns

160‧‧‧Second protective film

A-A’, B-B’‧‧‧ segments

D1, D1’‧‧‧ first spacing

D2‧‧‧second spacing

C, C'‧‧‧Compressive stress zone

H1‧‧‧first thickness

H2‧‧‧second thickness

N, N’‧‧‧Neutral Axial

T, T’‧‧‧ tensile stress zone

X, Y, Z‧‧‧ axes

1A is a top plan view of a flexible electronic device according to an embodiment of the invention. Figure 1B is a cross-sectional view of the flexible electronic device of Figure 1A taken along line A-A'. Figure 1C is a cross-sectional view of the flexible electronic device of Figure 1A taken along line B-B'. 1D is a schematic view of the flexible electronic device of FIG. 1C in a bent state. 1E is a cross-sectional view showing another flexible electronic device according to an embodiment of the present invention. 2A to 2B are schematic cross-sectional views showing a flexible electronic device extending in the Y-axis direction according to another embodiment of the present invention. 3 to 5 are schematic top views of a flexible electronic device according to various embodiments of the present invention.

Claims (19)

A flexible electronic device having a display area and a package area surrounding the display area, the flexible electronic device comprising: a substrate; a first protective film disposed relative to the substrate; a first adhesive layer, Between the substrate and the first protective film and at least in the package area; a display medium layer disposed between the substrate and the first protective film and located in the display area; and a flexible auxiliary layer And disposed on a surface of the first protective film and located in the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in a thickness direction. The flexible electronic device of claim 1, wherein the first protective film is bonded to the substrate via the first adhesive layer. The flexible electronic device of claim 1, wherein the substrate and the first protective film have a first spacing between the substrate and the first protective film. The zone has a second spacing and the first spacing is less than the second spacing. The flexible electronic device of claim 1, wherein the first protective film is located between the flexible auxiliary layer and the substrate. The flexible electronic device of claim 4, wherein when the flexible electronic device is in a bent state, a bent portion of the flexible electronic device has a bending stress based on a compressive stress band, a tensile stress band, and a neutral axial plane between the compressive stress band and the tensile stress band, and the first adhesive layer in the bent portion is located in the tensile stress region Or the neutral axis. The flexible electronic device of claim 1, wherein the flexible auxiliary layer is located between the first protective film and the substrate. The flexible electronic device of claim 6, wherein the substrate and the first protective film have a first spacing between the substrate and the first protective film. The zone has a second pitch and the first pitch is equal to the second pitch. The flexible electronic device of claim 1, wherein the flexible auxiliary layer and the first adhesive layer surround the display area. The flexible electronic device of claim 1, wherein the flexible auxiliary layer comprises two auxiliary patterns facing each other, and the two auxiliary patterns are respectively disposed on opposite sides of the flexible electronic device, and the The two auxiliary patterns each extend along a corresponding side to define a predetermined bending section of the flexible electronic device. The flexible electronic device of claim 9, wherein each of the two auxiliary patterns has a length smaller than a length of the corresponding side. The flexible electronic device of claim 1, wherein the flexible auxiliary layer has a Young's modulus greater than 1500 MPa. The flexible electronic device of claim 1, wherein the flexible auxiliary layer comprises a second adhesive layer and a flexible material layer, the second adhesive layer is located on the flexible material layer and the first The film is protected between the layers of the flexible material and bonded to the first protective film via the second adhesive layer. The flexible electronic device of claim 1, further comprising: a second protective film, wherein the substrate is disposed between the first protective film and the second protective film. The flexible electronic device of claim 1, wherein the flexible auxiliary layer surrounds the display area, and the first adhesive layer extends continuously between the package area and the display area. A flexible electronic device having a display area and a package area surrounding the display area, the flexible electronic device comprising: a substrate; a first protective film, the first protective film is disposed relative to the substrate The package area has a first thickness, and the display area has a second thickness, wherein the first thickness is greater than the second thickness; a first adhesive layer is disposed between the substrate and the first protective film and At least in the package area; and a display medium layer disposed between the substrate and the first protective film and located in the display area. The flexible electronic device of claim 15, wherein the first protective film is bonded to the substrate via the first adhesive layer. The flexible electronic device of claim 15, wherein the substrate and the first protective film have a first spacing between the substrate and the first protective film. The zone has a second spacing and the first spacing is less than the second spacing. The flexible electronic device of claim 17, wherein the sum of the first pitch and the first thickness is equal to the sum of the second pitch and the second thickness. The flexible electronic device of claim 15, further comprising: a second protective film, wherein the substrate is disposed between the first protective film and the second protective film.