TWI647703B - Memory testing method - Google Patents

Memory testing method Download PDF

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TWI647703B
TWI647703B TW107101838A TW107101838A TWI647703B TW I647703 B TWI647703 B TW I647703B TW 107101838 A TW107101838 A TW 107101838A TW 107101838 A TW107101838 A TW 107101838A TW I647703 B TWI647703 B TW I647703B
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column
block
test
address
sampling
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TW107101838A
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TW201933370A (en
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林立偉
蔡宗寰
鄭如傑
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華邦電子股份有限公司
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Abstract

一種記憶體測試方法,適用於記憶體電路。記憶體電路包括第一區塊以及第二區塊,第一區塊以及第二區塊具有列位址以及欄位址。記憶體測試方法包括:根據選取邏輯,選取列位址之一者作為測試列;根據選取邏輯,選取複數欄位址之一者作為測試欄;根據抽樣程序,選取測試列之抽樣欄位址;根據抽樣程序,選取測試欄之抽樣列位址;對第一區塊之測試列之抽樣欄位址進行讀取操作;對第一區塊之測試欄之抽樣列位址進行讀取操作;判斷第一區塊之讀取失敗率是否超過既定比例;以及當讀取失敗率超過既定比例時,標記第一區塊具有一輸入/輸出錯誤。 A memory test method for memory circuits. The memory circuit includes a first block and a second block, the first block and the second block having a column address and a column address. The memory testing method includes: selecting one of the column addresses as the test column according to the selection logic; selecting one of the plurality of column addresses as the test column according to the selection logic; and selecting the sampling column address of the test column according to the sampling procedure; According to the sampling procedure, the sampling column address of the test column is selected; the sampling column address of the test column of the first block is read; and the sampling column address of the test column of the first block is read; Whether the read failure rate of the first block exceeds a predetermined ratio; and when the read failure rate exceeds a predetermined ratio, the first block is marked with an input/output error.

Description

記憶體測試方法 Memory test method

本發明係有關於一種記憶體測試方法,特別係有關於適用於具有錯誤更正碼(Error-correcting code,ECC)之記憶體的記憶體測試方法。 The present invention relates to a memory testing method, and more particularly to a memory testing method suitable for memory having an Error-correcting Code (ECC).

一般而言,前瞻記憶體(Emerging memory)能夠允許一至數個位元的錯誤率。因此,當測試過程中發現某個記憶體電路具有一個位元以上的輸入/輸出錯誤(I/O fail)時,測試系統仍會判定該記憶體電路為正常,使得輸入/輸出錯誤無法被辨識出來。 In general, Emerging Memory can allow error rates from one to several bits. Therefore, when a memory circuit is found to have more than one bit of I/O fail during the test, the test system still determines that the memory circuit is normal, so that the input/output error cannot be recognized. come out.

輸入/輸出錯誤對於整個記憶體電路而言係為持續性錯誤,也就是每當讀取到該位元時都會發生讀取錯誤,而輸入/輸出錯誤往往來自於記憶體陣列之週邊電路。儘管利用錯誤更正碼的技術仍可將具有輸入/輸出錯誤之記憶電路儲存之資料予以還原,但是輸入/輸出錯誤仍會對記憶體電路之可靠度造成影響。 Input/output errors are persistent errors for the entire memory circuit, that is, read errors occur every time the bit is read, and input/output errors often come from peripheral circuits in the memory array. Although the technique of error correction code can still be used to restore the data stored in the memory circuit with input/output errors, the input/output error still affects the reliability of the memory circuit.

然而,目前的記憶體測試方法並無法辨識輸入/輸出錯誤,因此我們有必要針對記憶體測試方法進行改進,以利辨識前瞻記憶體中的輸入/輸出錯誤。 However, current memory test methods do not recognize input/output errors, so it is necessary to improve the memory test method to identify input/output errors in the look-ahead memory.

有鑑於此,本發明提出一種記憶體測試方法,適用於一記憶體電路,其中上述記憶體電路包括一第一區塊以及一第二區塊,其中上述第一區塊以及第二區塊具有複數列位址以及複數欄位址,上述記憶體測試方法包括:根據一選取邏輯,選取上述列位址之一者作為一測試列;根據上述選取邏輯,選取複數欄位址之一者作為一測試欄;根據一抽樣程序,選取上述測試列之複數抽樣欄位址;根據上述抽樣程序,選取上述測試欄之複數抽樣列位址;對上述第一區塊之上述測試列之上述抽樣欄位址進行一讀取操作;對上述第一區塊之上述測試欄之上述抽樣列位址進行上述讀取操作;判斷上述第一區塊之上述讀取操作之一讀取失敗率是否超過一既定比例;以及當上述讀取失敗率超過上述既定比例時,標記上述第一區塊具有一輸入/輸出錯誤。 In view of the above, the present invention provides a memory testing method, which is applicable to a memory circuit, wherein the memory circuit includes a first block and a second block, wherein the first block and the second block have The plurality of column addresses and the plurality of column addresses, the memory test method includes: selecting one of the column addresses as a test column according to a selection logic; and selecting one of the plurality of column addresses as one according to the selection logic a test column; selecting a plurality of sampled column addresses of the test column according to a sampling procedure; selecting a plurality of sampled column addresses of the test column according to the sampling procedure; and sampling the above-mentioned test columns of the first block Performing a read operation on the address; performing the above read operation on the sample column address of the test column of the first block; determining whether the read failure rate of one of the read operations of the first block exceeds a predetermined value The ratio; and when the read failure rate exceeds the predetermined ratio, marking the first block to have an input/output error.

根據本發明之一實施例,記憶體測試方法更包括:當上述讀取失敗率不超過上述既定比例時,或在上述標記上述第一區塊具有上述輸入/輸出錯誤之步驟後,對上述第二區塊之上述測試列之上述抽樣欄位址進行上述讀取測試;對上述第二區塊之上述測試欄之上述測試列位址進行上述讀取操作;判斷上述第二區塊之上述讀取操作之上述讀取失敗率是否超過上述既定比例;以及當上述讀取失敗率超過上述既定比例,標記上述第二區塊具有一輸入/輸出錯誤。 According to an embodiment of the present invention, the memory testing method further includes: when the reading failure rate does not exceed the predetermined ratio, or after the step of marking the first block having the input/output error, Performing the above-mentioned reading test on the sampling column address of the above test column of the second block; performing the above reading operation on the test column address of the test column of the second block; and determining the above reading of the second block Whether the above-mentioned read failure rate of the operation exceeds the predetermined ratio; and when the above-mentioned read failure rate exceeds the predetermined ratio, the second block is marked to have an input/output error.

根據本發明之一實施例,當上述第一區塊及/或上述第二區塊標記具有上述輸入/輸出錯誤時,代表上述第一區塊及/或上述第二區塊之週邊電路故障,使得上述讀取失敗率 過高。 According to an embodiment of the present invention, when the first block and/or the second block mark have the input/output error, the peripheral circuit of the first block and/or the second block is faulty. Making the above read failure rate Too high.

根據本發明之一實施例,上述選取邏輯係為隨機。 According to an embodiment of the invention, the selection logic is random.

根據本發明之一實施例,上述抽樣程序包括:將上述欄位址劃分為一第一數目之複數欄區段;選取上述欄區段之至少一者;將選取之上述欄區段之位址作為上述抽樣欄位址;將上述列位址劃分為一第二數目之複數列區段;選取上述列區段之至少一者;以及將選取之上述列區段之位址作為上述抽樣列位址。 According to an embodiment of the present invention, the sampling procedure includes: dividing the column address into a first number of plural column segments; selecting at least one of the column segments; and selecting the address of the column segment As the sampling column address; dividing the column address into a second number of complex column segments; selecting at least one of the column segments; and selecting the address of the selected column segment as the sampling column site.

根據本發明之一實施例,上述第一數目係等於上述第二數目。 According to an embodiment of the invention, the first number is equal to the second number.

根據本發明之另一實施例,上述第一數目係不等於上述第二數目。 According to another embodiment of the invention, the first number is not equal to the second number.

根據本發明之一實施例,上述選取上述欄區段之至少一者之步驟,更包括:選取上述第一數目之一半的上述欄區段,其中選取之上述欄區段以及未選取之上述欄區段係為相互間隔。 According to an embodiment of the present invention, the step of selecting at least one of the column segments further includes: selecting the column segment of the first number of the first number, wherein the column segment and the unselected column are selected The segments are spaced apart from one another.

根據本發明之一實施例,上述選取上述列區段之至少一者之步驟,更包括:選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 According to an embodiment of the present invention, the step of selecting at least one of the column segments further includes: selecting the column segment of the second number of the second number, wherein the column segment and the unselected column are selected The segments are spaced apart from one another.

根據本發明之一實施例,上述判斷上述第一區塊之上述讀取測試之上述讀取失敗率是否超過上述既定比例之步驟後更包括:判斷上述第一區塊之上述讀取失敗率是否為100%;當判斷上述讀取失敗率係為100%時,標記上述第一區 塊具有一確實輸入/輸出錯誤;以及當判斷上述讀取失敗率不為100%時,標記上述第一區塊具有一軟性輸入/輸出錯誤。 According to an embodiment of the present invention, the step of determining whether the read failure rate of the read test of the first block exceeds the predetermined ratio further comprises: determining whether the read failure rate of the first block is 100%; when it is judged that the above reading failure rate is 100%, the first area is marked The block has a true input/output error; and when it is judged that the above-described read failure rate is not 100%, the first block is marked with a soft input/output error.

本發明更提出一種記憶體測試方法,適用於一記憶體電路,其中上述記憶體電路包括一第一區塊以及一第二區塊,其中上述第一區塊以及第二區塊具有複數列位址以及複數欄位址,上述記憶體測試方法包括:根據一選取邏輯,選取上述列位址之一者作為一測試列;根據上述選取邏輯,選取複數欄位址之一者作為一測試欄;根據一抽樣程序,選取上述測試列之複數抽樣欄位址;根據上述抽樣程序,選取上述測試欄之複數抽樣列位址;同時對上述第一區塊以及上述第二區塊之上述測試列之上述抽樣欄位址進行一讀取操作;同時對上述第一區塊以及上述第二區塊之上述測試欄之上述抽樣列位址進行上述讀取操作;判斷上述記憶體電路之上述讀取操作之一讀取失敗率是否為零;當上述記憶體電路之上述讀取失敗率不為零時,判斷上述第一區塊及/或上述第二區塊之上述讀取失敗率是否超過一既定比例;當上述第一區塊及/或上述第二區塊之上述讀取失敗率超過上述既定比例時,標記上述第一區塊及/或上述第二區塊具有一確實輸入/輸出錯誤。 The present invention further provides a memory testing method, which is applicable to a memory circuit, wherein the memory circuit includes a first block and a second block, wherein the first block and the second block have a plurality of columns. The address and the plurality of column addresses, the memory test method includes: selecting one of the column addresses as a test column according to a selection logic; and selecting one of the plurality of column addresses as a test field according to the selection logic; Selecting a plurality of sampling column addresses of the test column according to a sampling procedure; selecting a plurality of sampling column addresses of the test column according to the sampling procedure; and simultaneously testing the first block and the second block Performing a reading operation on the sampling column address; performing the reading operation on the sampling column address of the first block and the second block in the test column; and determining the reading operation of the memory circuit Whether the read failure rate is zero; when the above read failure rate of the memory circuit is not zero, determining the first block and/or the second Whether the above-mentioned read failure rate of the block exceeds a predetermined ratio; when the read failure rate of the first block and/or the second block exceeds the predetermined ratio, marking the first block and/or the above The second block has a true input/output error.

根據本發明之一實施例,當上述第一區塊及/或上述第二區塊標記為具有上述輸入/輸出錯誤時,代表上述第一區塊及/或上述第二區塊之週邊電路故障,使得上述讀取失敗率過高。 According to an embodiment of the present invention, when the first block and/or the second block are marked as having the above input/output error, the peripheral circuit of the first block and/or the second block is faulty. So that the above read failure rate is too high.

根據本發明之一實施例,上述選取邏輯係為隨機。 According to an embodiment of the invention, the selection logic is random.

根據本發明之一實施例,上述抽樣程序包括:將 上述欄位址劃分為一第一數目之複數欄區段;選取上述欄區段之至少一者;將選取之上述欄區段之位址作為上述抽樣欄位址;將上述列位址劃分為一第二數目之複數列區段;選取上述列區段之至少一者;以及將選取之上述列區段之位址作為上述抽樣列位址。 According to an embodiment of the invention, the sampling procedure comprises: The column address is divided into a first number of plural column segments; at least one of the column segments is selected; the address of the selected column segment is used as the sampling column address; and the column address is divided into a second number of complex column segments; selecting at least one of the column segments; and selecting the address of the selected column segment as the sample column address.

根據本發明之一實施例,上述第一數目係等於上述第二數目。 According to an embodiment of the invention, the first number is equal to the second number.

根據本發明之另一實施例,上述第一數目係不等於上述第二數目。 According to another embodiment of the invention, the first number is not equal to the second number.

根據本發明之一實施例,上述選取上述列區段之至少一者之步驟,更包括:選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 According to an embodiment of the present invention, the step of selecting at least one of the column segments further includes: selecting the column segment of the second number of the second number, wherein the column segment and the unselected column are selected The segments are spaced apart from one another.

根據本發明之一實施例,上述選取上述列區段之至少一者之步驟,更包括:選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 According to an embodiment of the present invention, the step of selecting at least one of the column segments further includes: selecting the column segment of the second number of the second number, wherein the column segment and the unselected column are selected The segments are spaced apart from one another.

根據本發明之一實施例,記憶體測試方法更包括:當判斷上述第一區塊及/或上述第二區塊之上述讀取失敗率不超過上述既定比例時,標記上述第一區塊及/或上述第二區塊具有一軟性輸入/輸出錯誤。 According to an embodiment of the present invention, the memory testing method further includes: when determining that the read failure rate of the first block and/or the second block does not exceed the predetermined ratio, marking the first block and / or the second block above has a soft input/output error.

根據本發明之一實施例,上述既定比例係為100%。 According to an embodiment of the invention, the predetermined ratio is 100%.

100、200‧‧‧記憶體電路 100, 200‧‧‧ memory circuits

S41~S46‧‧‧步驟流程 S41~S46‧‧‧Step procedure

110-1、210-1‧‧‧第一區塊 110-1, 210-1‧‧‧ first block

S501~S513‧‧‧步驟流程 S501~S513‧‧‧Step procedure

110-2、210-2‧‧‧第二區塊 110-2, 210-2‧‧‧ second block

S501~S513‧‧‧步驟流程 S501~S513‧‧‧Step procedure

110-N、210-N‧‧‧第N區塊 110-N, 210-N‧‧‧ Block N

S601~S610‧‧‧步驟流程 S601~S610‧‧‧Step procedure

120-1‧‧‧第一輸入輸出電路 120-1‧‧‧First input and output circuit

120-2‧‧‧第二輸入輸出電路 120-2‧‧‧Second input and output circuit

120-N‧‧‧第N輸入輸出電路 120-N‧‧‧Nth input and output circuit

10‧‧‧測試電路 10‧‧‧Test circuit

300、600‧‧‧記憶體測試方法 300, 600‧‧‧ memory test method

X‧‧‧欄位址 X‧‧‧ column address

Y‧‧‧列位址 Y‧‧‧ column address

A‧‧‧第一欄區段 A‧‧‧First column

B‧‧‧第二欄區段 B‧‧‧Second column

C‧‧‧第三欄區段 C‧‧‧third column

D‧‧‧第四欄區段 D‧‧‧Fourth Section

E‧‧‧第一列區段 E‧‧‧first column

F‧‧‧第二列區段 F‧‧‧Second column

G‧‧‧第三列區段 G‧‧‧third column

H‧‧‧第四列區段 H‧‧‧ fourth column

S301~S311‧‧‧步驟流程 S301~S311‧‧‧Step process

第1圖顯示根據本發明之一實施例所述之記憶體電路之方塊圖;第2圖係顯示根據本發明之一實施例所述之記憶體陣列之示意圖;第3圖係顯示根據本發明之一實施例所述之記憶體測試方法之流程圖;第4圖係顯示根據本發明之一實施例所述之抽樣程序之流程圖;第5A-5B圖係顯示根據本發明之另一實施例所述之記憶體測試方法之流程圖;以及第6圖係顯示根據本發明之另一實施例所述之記憶體測試方法之流程圖。 1 is a block diagram of a memory circuit according to an embodiment of the present invention; FIG. 2 is a schematic diagram showing a memory array according to an embodiment of the present invention; and FIG. 3 is a view showing a memory array according to an embodiment of the present invention; A flowchart of a memory testing method according to one embodiment; FIG. 4 is a flow chart showing a sampling procedure according to an embodiment of the present invention; and FIG. 5A-5B is a diagram showing another implementation according to the present invention. A flowchart of a memory testing method as described in the example; and a sixth drawing showing a flow chart of a memory testing method according to another embodiment of the present invention.

以下說明為本發明的實施例。其目的是要舉例說明本發明一般性的原則,不應視為本發明之限制,本發明之範圍當以申請專利範圍所界定者為準。 The following description is an embodiment of the present invention. The intent is to exemplify the general principles of the invention and should not be construed as limiting the scope of the invention, which is defined by the scope of the claims.

值得注意的是,以下所揭露的內容可提供多個用以實踐本發明之不同特點的實施例或範例。以下所述之特殊的元件範例與安排僅用以簡單扼要地闡述本發明之精神,並非用以限定本發明之範圍。此外,以下說明書可能在多個範例中重複使用相同的元件符號或文字。然而,重複使用的目的僅為了提供簡化並清楚的說明,並非用以限定多個以下所討論之實施例以及/或配置之間的關係。此外,以下說明書所述之一個特徵連接至、耦接至以及/或形成於另一特徵之上等的描述,實 際可包含多個不同的實施例,包括該等特徵直接接觸,或者包含其它額外的特徵形成於該等特徵之間等等,使得該等特徵並非直接接觸。 It is noted that the following disclosure may provide embodiments or examples for practicing various features of the present invention. The specific elements and arrangements of the elements described below are merely illustrative of the spirit of the invention and are not intended to limit the scope of the invention. In addition, the following description may reuse the same component symbols or characters in various examples. However, the re-use is for the purpose of providing a simplified and clear description, and is not intended to limit the relationship between the various embodiments and/or configurations discussed below. In addition, a description of one of the features described in the following description is coupled to, coupled to, and/or formed on another feature, etc. A plurality of different embodiments may be included, including direct contact of the features, or other additional features being formed between the features, such that the features are not in direct contact.

第1圖顯示根據本發明之一實施例所述之記憶體電路之方塊圖。如第1圖所示,記憶體電路100包括第一區塊110-1、第二區塊110-2、......以及第N區塊110-N。第一區塊110-1、第二區塊110-2、......以及第N區塊110-N形成記憶體陣列,且第一區塊110-1、第二區塊110-2、......以及第N區塊110-N之每一者分別耦接至對應之第一輸入輸出電路120-1、第二輸入輸出電路120-2、......以及第N輸入輸出電路120-N。 1 is a block diagram of a memory circuit in accordance with an embodiment of the present invention. As shown in FIG. 1, the memory circuit 100 includes a first block 110-1, a second block 110-2, ..., and an Nth block 110-N. The first block 110-1, the second block 110-2, ... and the Nth block 110-N form a memory array, and the first block 110-1, the second block 110- 2, ... and each of the Nth block 110-N are respectively coupled to the corresponding first input/output circuit 120-1, second input/output circuit 120-2, ... And an Nth input and output circuit 120-N.

根據本發明之一實施例,記憶體電路100係為具有錯誤更正碼之前瞻記憶體,包括非及閘快閃式記憶體(NAND flash)、可變電阻式記憶體(Resistive Random Access Memory,ReRAM)、磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory,MRAM)、鐵電隨機存取記憶體(Ferro electric Random Access Memory,FeRAM)等等。 According to an embodiment of the invention, the memory circuit 100 is a forward-looking memory with an error correction code, including a NAND flash, a Resistive Random Access Memory (ReRAM). ), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FeRAM), and the like.

記憶體電路100係耦接至測試電路10,測試電路10分別透過第一輸入輸出電路120-1、第二輸入輸出電路120-2、......以及第N輸入輸出電路120-N,存取第一區塊110-1、第二區塊110-2、......以及第N區塊110-N所儲存之資料。 The memory circuit 100 is coupled to the test circuit 10, and the test circuit 10 is respectively transmitted through the first input/output circuit 120-1, the second input/output circuit 120-2, ..., and the Nth input/output circuit 120-N. Accessing the data stored in the first block 110-1, the second block 110-2, ..., and the Nth block 110-N.

根據本發明之一實施例,測試電路10係為測試機台,用以裸晶測試(chip probe,CP)或最終測試(final test,FT),其中最終測試係為封裝後測試,並且記憶體電路100與測試電路10係為實體分離。根據本發明之另一實施例,測試電路 10係為記憶體電路100之內建測試(built-in self-test,BIST)電路,因此測試電路10與記憶體電路100係位於相同晶粒或晶圓上。 According to an embodiment of the invention, the test circuit 10 is a test machine for chip probe (CP) or final test (FT), wherein the final test is post-package test, and the memory Circuit 100 and test circuit 10 are physically separated. Test circuit according to another embodiment of the present invention The 10 series is a built-in self-test (BIST) circuit of the memory circuit 100, so the test circuit 10 and the memory circuit 100 are located on the same die or wafer.

根據本發明之一實施例,測試電路10係個別對第一區塊110-1、第二區塊110-2、......以及第N區塊110-N之每一者進行讀取操作。根據本發明之另一實施例,測試電路10亦可對第一區塊110-1、第二區塊110-2、......以及第N區塊110-N同時進行讀取操作。在此並不以任何形式,限定於此。 According to an embodiment of the present invention, the test circuit 10 individually reads each of the first block 110-1, the second block 110-2, ..., and the Nth block 110-N. Take the operation. According to another embodiment of the present invention, the test circuit 10 can simultaneously perform read operations on the first block 110-1, the second block 110-2, ..., and the Nth block 110-N. . This is not limited in any way.

第2圖係顯示根據本發明之一實施例所述之記憶體陣列之示意圖。如第2圖所示,記憶體陣列200包括第一區塊210-1、第二區塊210-2、......以及第N區塊210-N,並且具有相同的欄位址X以及列位址Y。舉例來說,當選取一個欄位址X以及一個列位址Y進行讀取時,係針對第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之對應的位元進行讀取,並輸出N位元之讀取資料。 Figure 2 is a schematic diagram showing a memory array in accordance with an embodiment of the present invention. As shown in FIG. 2, the memory array 200 includes a first block 210-1, a second block 210-2, ..., and an Nth block 210-N, and has the same column address. X and column address Y. For example, when a column address X and a column address Y are selected for reading, the first block 210-1, the second block 210-2, ..., and the Nth region are used. The corresponding bit of block 210-N is read, and the read data of N bits is output.

根據本發明之一實施例,記憶體陣列200之欄位址X係為由0~15,列位址Y係為由0~15,也就是第一區塊210-1、第二區塊210-2、......以及第N區塊210-N分別具有256個記憶體單元。要注意的是,在此欄位址X以及列位址Y之個數係為說明解釋之用,並非以任何形式限定於此。 According to an embodiment of the present invention, the address X of the memory array 200 is from 0 to 15, and the column address Y is from 0 to 15, that is, the first block 210-1 and the second block 210. The -2, ..., and Nth blocks 210-N each have 256 memory cells. It should be noted that the number of the address X and the column address Y in this column is for illustrative purposes and is not limited in any way.

第3圖係顯示根據本發明之一實施例所述之記憶體測試方法之流程圖。以下針對第3圖之流程圖的敘述,將搭配第2圖,以利詳細說明。如第3圖所示,首先,根據選擇邏輯選取列位址之一者作為測試列(步驟S301),並且根據選擇邏 輯選取欄位址之一者作為測試欄(步驟S302)。 3 is a flow chart showing a memory testing method according to an embodiment of the present invention. The following description of the flowchart of FIG. 3 will be combined with FIG. 2 for detailed description. As shown in FIG. 3, first, one of the column addresses is selected as a test column according to the selection logic (step S301), and according to the selection logic One of the selection column addresses is used as a test column (step S302).

根據本發明之一實施例,選取邏輯係為隨機。根據本發明之其他實施例,可使用任何選取邏輯來選擇測試列以及測試欄。根據本發明之另一實施例,亦可分別選擇兩條以上之測試列以及測試欄,在此僅以選取一條測試列以及一條測試欄作為發明解釋之用。 According to an embodiment of the invention, the logic is selected to be random. According to other embodiments of the invention, any selection logic can be used to select the test column and the test column. According to another embodiment of the present invention, two or more test columns and a test column may be separately selected, and only one test column and one test column are selected as the invention explanation.

根據本發明之一實施例,第3圖之步驟S301係為選擇第2圖之列位址Y為0之列作為測試列,第3圖之步驟S302係為選擇第2圖欄位址X為0之欄作為測試欄。根據本發明之其他實施例,亦可選擇其他列位址Y作為測試列,或是選擇其他欄位址X作為測試欄,也可選擇複數列位址Y以及複數欄位址X作為測試列以及測試欄,在此僅以列位址Y為0之列作為測試列以及欄位址X為0之欄作為測試欄作為舉例說明,並非以任何形式限定於此。 According to an embodiment of the present invention, step S301 of FIG. 3 is to select a column in which the address Y of the second figure is 0 as a test column, and step S302 of FIG. 3 is to select the address of the second column X as The column of 0 is used as a test bar. According to other embodiments of the present invention, another column address Y may be selected as a test column, or another column address X may be selected as a test column, or a plurality of column addresses Y and a plurality of column addresses X may be selected as test columns and The test column, here only the column with the column address Y being 0 as the test column and the column address X being 0 is used as a test column as an example, and is not limited thereto in any way.

回到第3圖,接著,根據抽樣程序,選擇測試列之複數抽樣欄位址(步驟S303)。根據本發明之一實施例,如第2圖所示,列位址Y為0之列係為測試列,並根據抽樣程序選擇欄位址X為0-3以及8-11作為複數抽樣欄位址。根據抽樣程序,選擇測試欄之複數抽樣列位址(步驟S304)。根據本發明之一實施例,如第2圖所示,欄位址X為0之列係為測試欄,並根據抽樣程序選擇列位址Y為0-3以及8-11作為複數抽樣列位址。 Returning to Fig. 3, next, based on the sampling procedure, the complex sample column address of the test column is selected (step S303). According to an embodiment of the present invention, as shown in FIG. 2, the column with the address Y of 0 is a test column, and the column address X is 0-3 and 8-11 as a complex sampling field according to the sampling procedure. site. According to the sampling procedure, the complex sample column address of the test column is selected (step S304). According to an embodiment of the present invention, as shown in FIG. 2, the column address X is 0, which is a test column, and the column address Y is selected as 0-3 and 8-11 as a complex sampling column according to the sampling procedure. site.

第4圖係顯示根據本發明之一實施例所述之抽樣程序之流程圖。如第4圖所示,首先,將欄位址X劃分為第一數目之複數欄區段(步驟S41)。如第2圖之實施例所示,欄位址X 係劃分為四個欄區段,分別為第一欄區段A、第二欄區段B、第三欄區段C以及第四欄區段D。根據本發明之其他實施例,欄位址X亦可劃分為任意數個欄區段,亦不須等份劃分,在此僅作為說明解釋之用,並非以任何形式限定於此。 Figure 4 is a flow chart showing a sampling procedure according to an embodiment of the present invention. As shown in Fig. 4, first, the column address X is divided into a first number of plural column segments (step S41). As shown in the embodiment of Figure 2, the column address X The system is divided into four column sections, which are a first column section A, a second column section B, a third column section C, and a fourth column section D. According to other embodiments of the present invention, the field address X may also be divided into any number of column segments, and is not required to be equally divided, and is for illustrative purposes only, and is not limited thereto in any way.

接著,選取欄區段之至少一者(步驟S42)。如第2圖之實施例所示,選取第一欄區段A以及第三欄區段C,其中選取之第一欄區段A以及第三欄區段C與未選取之第二欄區段B以及第四欄區段D係為相互間隔。根據本發明之其他實施例,亦可只選取第一欄區段A、第二欄區段B、第三欄區段C以及第四欄區段D之任一者,或是選取第一欄區段A、第二欄區段B、第三欄區段C以及第四欄區段D之至少一者,在此僅為說明解釋之目的,並非以任何形式限定於此。 Next, at least one of the column sections is selected (step S42). As shown in the embodiment of FIG. 2, the first column segment A and the third column segment C are selected, wherein the first column segment A and the third column segment C are selected, and the second column segment is not selected. B and the fourth column section D are spaced apart from each other. According to other embodiments of the present invention, only one of the first column segment A, the second column segment B, the third column segment C, and the fourth column segment D may be selected, or the first column may be selected. At least one of the segment A, the second column segment B, the third column segment C, and the fourth column segment D is for illustrative purposes only and is not intended to be limited in any way.

回到第4圖,將選取之欄區段之位址作為抽樣欄位址(步驟S43)。如第2圖之實施例所示,抽樣欄位址係為第一欄區段A以及第三欄區段C之欄位址X,亦即0-3以及8-11。 Returning to Fig. 4, the address of the selected column section is taken as the sampling column address (step S43). As shown in the embodiment of Fig. 2, the sampling column address is the column address X of the first column section A and the third column section C, that is, 0-3 and 8-11.

接著,將列位址Y劃分為第二數目之複數列區段(步驟S44)。如第2圖之實施例所示,列位址Y係劃分為四個列區段,分別為第一列區段E、第二列區段F、第三列區段G以及第四列區段H。根據本發明之其他實施例,列位址Y亦可劃分為任意數個列區段,亦不須等份劃分。根據本發明之一實施例,第一數目係與第二數目相同。根據本發明之另一實施例,第一數目係與第二數目不同。在此僅作為說明解釋之用,並非以任何形式限定於此。 Next, the column address Y is divided into a second number of complex column segments (step S44). As shown in the embodiment of FIG. 2, the column address Y is divided into four column segments, which are a first column segment E, a second column segment F, a third column segment G, and a fourth column region. Section H. According to other embodiments of the present invention, the column address Y can also be divided into any number of column segments without aliquoting. According to an embodiment of the invention, the first number is the same as the second number. According to another embodiment of the invention, the first number is different from the second number. This is for illustrative purposes only and is not intended to be limiting in any way.

回到第4圖,選取列區段之至少一者(步驟S45)。 如第2圖之實施例所示,選取第一列區段E以及第三列區段G,其中選取之第一列區段E以及第三列區段G與未選取之第二列區段F以及第四列區段H係為相互間隔。根據本發明之其他實施例,亦可只選取第一列區段E、第二列區段F、第三列區段G以及第四列區段H之任一者,或是選取第一列區段E、第二列區段F、第三列區段G以及第四列區段H之至少一者,在此僅為說明解釋之目的,並非以任何形式限定於此。 Returning to Fig. 4, at least one of the column sections is selected (step S45). As shown in the embodiment of FIG. 2, the first column segment E and the third column segment G are selected, wherein the first column segment E and the third column segment G are selected and the second column segment is not selected. F and the fourth column segment H are spaced apart from each other. According to other embodiments of the present invention, only one of the first column segment E, the second column segment F, the third column segment G, and the fourth column segment H may be selected, or the first column may be selected. At least one of the segment E, the second column segment F, the third column segment G, and the fourth column segment H is for illustrative purposes only and is not intended to be limiting in any way.

回到第4圖,將選取之列區段之位址作為抽樣列位址(步驟S46)。如第2圖之實施例所示,抽樣列位址係為第一列區段E以及第三列區段G之列位址Y,亦即0-3以及8-11。 Returning to Fig. 4, the address of the selected column section is taken as the sampling column address (step S46). As shown in the embodiment of FIG. 2, the sample column address is the column address Y of the first column segment E and the third column segment G, that is, 0-3 and 8-11.

回到第3圖,選取一區塊(步驟S305)。設計者可首先選取第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之任一者,以下係以首先選取第一區塊210-1做說明解釋,並非以任何形式限定於此。接著,對選取之第一區塊210-1之測試列之抽樣欄位址進行讀取操作(步驟S306),並且對選取之第一區塊210-1之測試欄之抽樣列位址進行讀取操作(步驟S307)。 Returning to Fig. 3, a block is selected (step S305). The designer may first select any of the first block 210-1, the second block 210-2, ..., and the Nth block 210-N, and the first block 210 is selected first. -1 is explained in explanation and is not limited to this in any way. Next, a read operation is performed on the sampling column address of the test column of the selected first block 210-1 (step S306), and the sample column address of the test column of the selected first block 210-1 is read. The operation is taken (step S307).

當完成對第一區塊210-1之讀取操作時,判斷第一區塊210-1之讀取操作之讀取失敗率是否超過既定比例(步驟S308)。根據本發明之一實施例,既定比例係為70%。根據本發明之其他實施例,設計者可自行決定既定比例為何。 When the reading operation on the first block 210-1 is completed, it is judged whether or not the reading failure rate of the reading operation of the first block 210-1 exceeds a predetermined ratio (step S308). According to an embodiment of the invention, the predetermined ratio is 70%. According to other embodiments of the invention, the designer can decide for himself what the established ratio is.

回到步驟S308,當判斷第一區塊210-1之讀取操作之讀取失敗率不超過既定比例時,判斷是否具有下一個區塊(步驟S309)。當具有下一個區塊時,選取下一個區塊(步驟 S310),並回到步驟S306。如第2圖之實施例所示,由於第一區塊210-1以完成讀取操作,在此係為選擇第二區塊210-2、...、第N區塊210-N之任一者。設計者可依序選擇區塊,或是依據需求選擇適當的區塊,在此並非以任何形式限定於此。回到步驟S309,當不具有下一個區塊時,結束記憶體測試方法300。 Returning to step S308, when it is judged that the read failure rate of the read operation of the first block 210-1 does not exceed the predetermined ratio, it is judged whether or not there is the next block (step S309). When you have the next block, select the next block (step S310), and returns to step S306. As shown in the embodiment of FIG. 2, since the first block 210-1 completes the read operation, the second block 210-2, ..., the Nth block 210-N is selected here. One. The designer may select the blocks in order, or select the appropriate blocks according to the requirements, and is not limited thereto in any way. Returning to step S309, when there is no next block, the memory test method 300 is ended.

回到步驟S308,當判斷第一區塊210-1之讀取操作之讀取失敗率超過既定比例時,標記該區塊具有輸入/輸出錯誤(步驟S311)。根據本發明之一實施例,當某一區塊讀取任何取樣位址皆具有很高的讀取失敗率時,代表該區塊之週邊電路故障而造成讀取失敗率偏高,因此標記該區塊具有輸入/輸出錯誤。 Returning to step S308, when it is judged that the read failure rate of the read operation of the first block 210-1 exceeds a predetermined ratio, the block is marked with an input/output error (step S311). According to an embodiment of the present invention, when a certain block reads any sampling address and has a high read failure rate, the peripheral failure of the block represents a high read failure rate, so the flag is marked. The block has an input/output error.

第5A-5B圖係顯示根據本發明之另一實施例所述之記憶體測試方法之流程圖。如第5A圖所示,第5A圖之步驟S501至步驟S510係與第3圖之步驟S301至步驟S310相同,在此不再重複贅述。 5A-5B are flowcharts showing a memory testing method according to another embodiment of the present invention. As shown in FIG. 5A, steps S501 to S510 of FIG. 5A are the same as steps S301 to S310 of FIG. 3, and the details are not repeated herein.

在步驟S508中,當判斷選擇之第一區塊210-1之讀取操作之讀取失敗率不超過既定比例時,更判斷讀取失敗率是否為100%(步驟S511)。當判斷讀取失敗率係為100%時,標記選擇之第一區塊210-1具有確實輸入/輸出錯誤(步驟S512)。根據本發明之一實施例,當判斷讀取失敗率係為100%時,代表該區塊之週邊電路幾乎無法讀取該區塊內之資料,此時具有很高的信心程度能夠確認該區塊對應之輸入輸出電路發生錯誤,因此標記為確實輸入/輸出錯誤。 In step S508, when it is determined that the read failure rate of the read operation of the selected first block 210-1 does not exceed the predetermined ratio, it is further determined whether the read failure rate is 100% (step S511). When it is judged that the read failure rate is 100%, the first block 210-1 of the mark selection has a true input/output error (step S512). According to an embodiment of the present invention, when it is determined that the read failure rate is 100%, the peripheral circuit representing the block can hardly read the data in the block, and the degree of confidence can confirm the area. An error occurs in the input/output circuit corresponding to the block, so it is marked as a true input/output error.

回到步驟S511,當判斷讀取失敗率不為100%時, 標記選擇之第一區塊210-1具有軟性輸入/輸出錯誤(步驟S513)。根據本發明之一實施例,當標記為軟性輸入/輸出錯誤時,代表該區塊對應之輸入輸出電路不穩定,會造成每次讀取操作時好時壞,因此標記微軟性輸入/輸出錯誤。 Going back to step S511, when it is determined that the read failure rate is not 100%, The first block 210-1 of the mark selection has a soft input/output error (step S513). According to an embodiment of the present invention, when the soft input/output error is marked, the input/output circuit corresponding to the block is unstable, which may cause good or bad time for each read operation, thus marking a Microsoft input/output error. .

第6圖係顯示根據本發明之另一實施例所述之記憶體測試方法之流程圖。如第6圖所示,第6圖之步驟S601至步驟S604係與第3圖之步驟S301至步驟S304以及第5A圖之步驟S501至步驟S504相同,在此不再重複贅述。 Figure 6 is a flow chart showing a memory testing method according to another embodiment of the present invention. As shown in FIG. 6, steps S601 to S604 of FIG. 6 are the same as steps S301 to S304 of FIG. 3 and steps S501 to S504 of FIG. 5A, and the details are not repeated here.

步驟S605中,同時對第2圖之第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之測試列之抽樣欄位址進行讀取操作。接著,同時對第2圖之第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之測試欄之抽樣列位址進行讀取操作(步驟S606)。 In step S605, the sampling column address of the test column of the first block 210-1, the second block 210-2, ... and the Nth block 210-N of the second figure is simultaneously read. Take the operation. Next, the sampling operation of the sampling column address of the test block of the first block 210-1, the second block 210-2, ... and the Nth block 210-N of FIG. 2 is simultaneously performed. (Step S606).

當完成測試列以及測試欄之讀取操作後,判斷記憶體電路100之所有區塊的讀取操作之讀取失敗率是否為零(步驟S607)。當記憶體電路100之讀取失敗率為零時,代表記憶體電路100之所有區塊之讀取操作皆為完全正常,因此結束記憶體測試方法600。 When the test column and the read operation of the test column are completed, it is judged whether or not the read failure rate of the read operation of all the blocks of the memory circuit 100 is zero (step S607). When the read failure rate of the memory circuit 100 is zero, the read operations representing all of the blocks of the memory circuit 100 are completely normal, thus ending the memory test method 600.

當判斷記憶體電路100之讀取失敗率不為零時,更判斷第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之任一者的讀取失敗率是否超過既定比例(步驟S608)。根據本發明之一實施例,既定比例係為70%。根據本發明之另一實施例,既定比例係為100%。根據本發明之其他實施例,既定比例係由設計者自行決定。 When it is determined that the read failure rate of the memory circuit 100 is not zero, the first block 210-1, the second block 210-2, ..., and the Nth block 210-N are further judged. Whether the read failure rate of one exceeds a predetermined ratio (step S608). According to an embodiment of the invention, the predetermined ratio is 70%. According to another embodiment of the invention, the predetermined ratio is 100%. According to other embodiments of the invention, the established ratio is at the discretion of the designer.

當判斷第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之任一者的讀取失敗率超過既定比例時,標記該區塊具有確實輸入/輸出錯誤(步驟S609)。根據本發明之一實施例,當標記為確實輸入/輸出錯誤時,代表該區塊之週邊電路發生故障過高,有很高的機率會造成讀取失敗。 When it is judged that the read failure rate of any of the first block 210-1, the second block 210-2, ..., and the Nth block 210-N exceeds a predetermined ratio, the block is marked. There is a true input/output error (step S609). According to an embodiment of the present invention, when the flag is a true input/output error, the peripheral circuit representing the block is too high, and there is a high probability that the read failure will occur.

當判斷第一區塊210-1、第二區塊210-2、......以及第N區塊210-N之任一者的讀取失敗率不超過既定比例時,標記該區塊具有軟性輸入/輸出錯誤(步驟S610)。根據本發明之一實施例,當標記為軟性輸入/輸出錯誤時,代表該區塊之週邊電路不穩定,常會造成每次讀取操作時好時壞。 When it is judged that the read failure rate of any of the first block 210-1, the second block 210-2, ..., and the Nth block 210-N does not exceed a predetermined ratio, the area is marked. The block has a soft input/output error (step S610). According to an embodiment of the present invention, when the soft input/output error is marked, the peripheral circuit representing the block is unstable, which often causes good or bad for each read operation.

利用本發明提出之記憶體測試方法,能夠有效的辨識記憶體區塊之輸入/輸出錯誤,進而提昇記憶體之可靠度。 By using the memory testing method proposed by the invention, the input/output errors of the memory block can be effectively recognized, thereby improving the reliability of the memory.

以上所述為實施例的概述特徵。所屬技術領域中具有通常知識者應可以輕而易舉地利用本發明為基礎設計或調整以實行相同的目的和/或達成此處介紹的實施例的相同優點。所屬技術領域中具有通常知識者也應了解相同的配置不應背離本創作的精神與範圍,在不背離本創作的精神與範圍下他們可做出各種改變、取代和交替。說明性的方法僅表示示範性的步驟,但這些步驟並不一定要以所表示的順序執行。可另外加入、取代、改變順序和/或消除步驟以視情況而作調整,並與所揭露的實施例精神和範圍一致。 The above is an overview feature of the embodiment. Those having ordinary skill in the art should be able to use the present invention as a basis for design or adaptation to achieve the same objectives and/or achieve the same advantages of the embodiments described herein. It should be understood by those of ordinary skill in the art that the same configuration should not depart from the spirit and scope of the present invention, and various changes, substitutions and substitutions can be made without departing from the spirit and scope of the present invention. The illustrative methods are merely illustrative of the steps, but are not necessarily performed in the order presented. The steps may be additionally added, substituted, changed, and/or eliminated, as appropriate, and are consistent with the spirit and scope of the disclosed embodiments.

Claims (14)

一種記憶體測試方法,適用於一記憶體電路,其中上述記憶體電路包括一第一區塊以及一第二區塊,其中上述第一區塊以及第二區塊具有複數列位址以及複數欄位址,上述記憶體測試方法包括:根據一選取邏輯,選取上述列位址之一者作為一測試列;根據上述選取邏輯,選取複數欄位址之一者作為一測試欄;根據一抽樣程序,選取上述測試列之複數抽樣欄位址;根據上述抽樣程序,選取上述測試欄之複數抽樣列位址;對上述第一區塊之上述測試列之上述抽樣欄位址進行一讀取操作;對上述第一區塊之上述測試欄之上述抽樣列位址進行上述讀取操作;判斷上述第一區塊之上述讀取操作之一讀取失敗率是否超過一既定比例;以及當上述讀取失敗率超過上述既定比例時,標記上述第一區塊具有一輸入/輸出錯誤。 A memory testing method is applicable to a memory circuit, wherein the memory circuit includes a first block and a second block, wherein the first block and the second block have a plurality of column addresses and a plurality of columns The address test method includes: selecting one of the column addresses as a test column according to a selection logic; selecting one of the plurality of column addresses as a test field according to the selection logic; according to a sampling procedure Selecting a plurality of sampling column addresses of the test column; selecting a plurality of sampling column addresses of the test column according to the sampling procedure; and performing a reading operation on the sampling column address of the test column of the first block; Performing the above reading operation on the sampling column address of the test column of the first block; determining whether the read failure rate of one of the reading operations of the first block exceeds a predetermined ratio; and when the reading is performed When the failure rate exceeds the above-mentioned predetermined ratio, the first block is marked as having an input/output error. 如申請專利範圍第1項所述之記憶體測試方法,更包括:當上述讀取失敗率不超過上述既定比例時,或在上述標記上述第一區塊具有上述輸入/輸出錯誤之步驟後,對上述第二區塊之上述測試列之上述抽樣欄位址進行上述讀取測試;對上述第二區塊之上述測試欄之上述測試列位址進行上述讀取操作; 判斷上述第二區塊之上述讀取操作之上述讀取失敗率是否超過上述既定比例;以及當上述讀取失敗率超過上述既定比例,標記上述第二區塊具有一輸入/輸出錯誤。 The method for testing a memory according to claim 1, further comprising: when the reading failure rate does not exceed the predetermined ratio, or after the step of marking the first block having the input/output error, Performing the above-mentioned reading test on the sampling column address of the above test column of the second block; performing the above reading operation on the test column address of the test column of the second block; Determining whether the read failure rate of the read operation of the second block exceeds the predetermined ratio; and when the read failure rate exceeds the predetermined ratio, marking the second block to have an input/output error. 如申請專利範圍第2項所述之記憶體測試方法,其中當上述第一區塊及/或上述第二區塊標記具有上述輸入/輸出錯誤時,代表上述第一區塊及/或上述第二區塊之週邊電路故障,使得上述讀取失敗率過高。 The memory testing method of claim 2, wherein when the first block and/or the second block mark has the input/output error, the first block and/or the first The peripheral circuit failure of the second block causes the above read failure rate to be too high. 如申請專利範圍第1項所述之記憶體測試方法,其中上述抽樣程序包括:將上述欄位址劃分為一第一數目之複數欄區段;選取上述欄區段之至少一者;將選取之上述欄區段之位址作為上述抽樣欄位址;將上述列位址劃分為一第二數目之複數列區段;選取上述列區段之至少一者;以及將選取之上述列區段之位址作為上述抽樣列位址。 The memory testing method of claim 1, wherein the sampling procedure comprises: dividing the column address into a first number of plural column segments; selecting at least one of the column segments; The address of the column segment is used as the sampling column address; the column address is divided into a second number of complex column segments; at least one of the column segments is selected; and the column segment to be selected The address is used as the above sampling column address. 如申請專利範圍第4項所述之記憶體測試方法,其中上述第一數目係等於上述第二數目。 The memory testing method of claim 4, wherein the first number is equal to the second number. 如申請專利範圍第4項所述之記憶體測試方法,其中上述選取上述欄區段之至少一者之步驟,更包括:選取上述第一數目之一半的上述欄區段,其中選取之上述欄區段以及未選取之上述欄區段係為相互間隔。 The memory testing method of claim 4, wherein the step of selecting at least one of the column sections further comprises: selecting the one of the first number of the column segments, wherein the column is selected The segments and the unselected column segments are spaced apart from each other. 如申請專利範圍第4項所述之記憶體測試方法,其中上述選取上述列區段之至少一者之步驟,更包括: 選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 The method for testing a memory according to claim 4, wherein the step of selecting at least one of the foregoing column segments further comprises: And selecting the column segment of the second number of the second number, wherein the selected column segment and the unselected column segment are spaced apart from each other. 如申請專利範圍第1項所述之記憶體測試方法,其中上述判斷上述第一區塊之上述讀取測試之上述讀取失敗率是否超過上述既定比例之步驟後更包括:判斷上述第一區塊之上述讀取失敗率是否為100%;當判斷上述讀取失敗率係為100%時,標記上述第一區塊具有一確實輸入/輸出錯誤;以及當判斷上述讀取失敗率不為100%時,標記上述第一區塊具有一軟性輸入/輸出錯誤。 The method for testing a memory according to claim 1, wherein the step of determining whether the read failure rate of the read test of the first block exceeds the predetermined ratio further comprises: determining the first area. Whether the above read failure rate of the block is 100%; when it is determined that the read failure rate is 100%, marking the first block has a true input/output error; and when determining that the read failure rate is not 100 When %, the above first block is marked with a soft input/output error. 一種記憶體測試方法,適用於一記憶體電路,其中上述記憶體電路包括一第一區塊以及一第二區塊,其中上述第一區塊以及第二區塊具有複數列位址以及複數欄位址,上述記憶體測試方法包括:根據一選取邏輯,選取上述列位址之一者作為一測試列;根據上述選取邏輯,選取複數欄位址之一者作為一測試欄;根據一抽樣程序,選取上述測試列之複數抽樣欄位址;根據上述抽樣程序,選取上述測試欄之複數抽樣列位址;同時對上述第一區塊以及上述第二區塊之上述測試列之上述抽樣欄位址進行一讀取操作;同時對上述第一區塊以及上述第二區塊之上述測試欄之上述抽樣列位址進行上述讀取操作;判斷上述記憶體電路之上述讀取操作之一讀取失敗率是否為零; 當上述記憶體電路之上述讀取失敗率不為零時,判斷上述第一區塊及/或上述第二區塊之上述讀取失敗率是否超過一既定比例;當上述第一區塊及/或上述第二區塊之上述讀取失敗率超過上述既定比例時,標記上述第一區塊及/或上述第二區塊具有一確實輸入/輸出錯誤。 A memory testing method is applicable to a memory circuit, wherein the memory circuit includes a first block and a second block, wherein the first block and the second block have a plurality of column addresses and a plurality of columns The address test method includes: selecting one of the column addresses as a test column according to a selection logic; selecting one of the plurality of column addresses as a test field according to the selection logic; according to a sampling procedure Selecting the plurality of sampling column addresses of the above test columns; selecting the plurality of sampling column addresses of the test column according to the sampling procedure; and simultaneously sampling the sampling fields of the first block and the second block Performing a read operation on the address; performing the above read operation on the sampling column address of the first block and the second block in the test column; determining that one of the read operations of the memory circuit is read Whether the failure rate is zero; When the read failure rate of the memory circuit is not zero, determining whether the read failure rate of the first block and/or the second block exceeds a predetermined ratio; when the first block and/or Or when the read failure rate of the second block exceeds the predetermined ratio, marking the first block and/or the second block to have a true input/output error. 如申請專利範圍第9項所述之記憶體測試方法,其中當上述第一區塊及/或上述第二區塊標記為具有上述輸入/輸出錯誤時,代表上述第一區塊及/或上述第二區塊之週邊電路故障,使得上述讀取失敗率過高。 The memory testing method according to claim 9, wherein when the first block and/or the second block are marked as having the above input/output error, the first block and/or the above The peripheral circuit failure of the second block causes the above read failure rate to be too high. 如申請專利範圍第9項所述之記憶體測試方法,其中上述抽樣程序包括:將上述欄位址劃分為一第一數目之複數欄區段;選取上述欄區段之至少一者;將選取之上述欄區段之位址作為上述抽樣欄位址;將上述列位址劃分為一第二數目之複數列區段;選取上述列區段之至少一者;以及將選取之上述列區段之位址作為上述抽樣列位址。 The memory testing method of claim 9, wherein the sampling procedure comprises: dividing the column address into a first number of plural column segments; selecting at least one of the column segments; The address of the column segment is used as the sampling column address; the column address is divided into a second number of complex column segments; at least one of the column segments is selected; and the column segment to be selected The address is used as the above sampling column address. 如申請專利範圍第11項所述之記憶體測試方法,其中上述第一數目係等於上述第二數目。 The memory testing method of claim 11, wherein the first number is equal to the second number. 如申請專利範圍第11項所述之記憶體測試方法,其中上述選取上述列區段之至少一者之步驟,更包括:選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 The method for testing a memory according to claim 11, wherein the step of selecting at least one of the column segments further comprises: selecting the column segment of the second number of the second number, wherein the column is selected The segments and the unselected column segments are spaced apart from each other. 如申請專利範圍第11項所述之記憶體測試方法,其中上述選取上述列區段之至少一者之步驟,更包括:選取上述第二數目之一半的上述列區段,其中選取之上述列區段以及未選取之上述列區段係為相互間隔。 The method for testing a memory according to claim 11, wherein the step of selecting at least one of the column segments further comprises: selecting the column segment of the second number of the second number, wherein the column is selected The segments and the unselected column segments are spaced apart from each other.
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