TWI646871B - Multi-layer circuit board - Google Patents

Abstract

A multilayer circuit board comprising a lower circuit layer, an upper circuit layer, and an intermediate layer. The lower circuit layer has a substrate mounting surface and a base circuit, and the base circuit is disposed on the substrate mounting surface. The base circuit has a plurality of wires and a stacked structure, and the stacked structure is a stacked structure in which at least two wires are alternately stacked. The thickness of the laminated structure is greater than the thickness of other portions of the substrate circuit. The upper circuit layer has an upper layer setting surface and an upper layer circuit, the upper layer circuit is disposed on the upper layer setting surface, and the upper circuit layer upper layer setting surface is disposed toward the substrate setting surface. The intermediate layer is disposed between the substrate setting surface and the upper layer setting surface; the intermediate layer further has an accommodating space, and the position of the accommodating space corresponds to the overlapping structure. The staggered overlap of the wires in the laminated structure is located in the accommodating space, so that the intermediate layer is not directly overlapped on the stacked structure.

Description

Multi-layer circuit board

The present invention relates to a layer structure of a circuit board, and more particularly to a multilayer circuit board.

As shown in FIG. 1, a multi-layer circuit board, such as a multi-layer circuit board for a notebook computer keyboard module, is separated by an insulating intermediate layer 2 to separate two different circuit layers 4, 6 so that the two circuit layers 4, 6 The wires on the wires are routed without unnecessary short circuits. Taking the circuit layer 6 in the lower layer of FIG. 1 as an example, due to the arrangement of the lines, sometimes the wires 1 and 1a need to be staggered but not electrically connected to each other, and a jumper structure needs to be provided. The jumper structure is a laminated structure in which the wires 1, the electrically insulating layer 3, and the wires 1a overlap each other, and finally the circuit layer 4 of the upper layer is overlaid on the laminated structure. As shown in Fig. 1, under the influence of the laminated structure, a convex portion having a local thickness increase occurs on the multilayer circuit board, which affects the flatness of the multilayer circuit board.

The situation in which the laminated structure causes an increase in local thickness also occurs in other parts of the multilayer circuit board.

As shown in FIG. 2 and FIG. 3, the circuit layer 6 located on the lower layer of the multi-layer circuit board has a cable segment 7 extending outwardly. The wire segment 7 is connected to all the wires 1 to be externally connected, and is respectively connected to the contact pads 5. In addition to the contact pad 5, the wire segment 7 needs to be protected by the protective film 8. Wire 1. In general, the protective film 8 touches the outside of the wiring section 7, and is partially overlapped on the upper circuit layer 4 or partially inserted between the upper circuit layer 4 and the intermediate layer 2. In the above-described situation, a superposed structure in which the protective film 8, the upper circuit layer 4, the intermediate layer 2, and the lower circuit layer 6 are sequentially laminated is formed. The aforementioned over-stacked superposed structure also causes a local thickness increase condition and affects the flatness of the multilayer circuit board.

In view of the above problems, the present invention proposes a multilayer circuit board that avoids forming an over-stacked stacked structure while maintaining the flatness of the multilayer circuit board.

To achieve the above object, the present invention provides a multilayer circuit board comprising a lower circuit layer, an upper circuit layer and an intermediate layer. The lower circuit layer has a substrate mounting surface and a base circuit, the base circuit is disposed on the substrate mounting surface, the base circuit has a plurality of wires and a stacked structure, and the stacked structure is composed of at least two wires alternately stacked, wherein the laminated structure The thickness is greater than the thickness of other portions of the substrate circuit. The upper circuit layer has an upper layer setting surface and an upper layer circuit, the upper layer circuit is disposed on the upper layer setting surface, and the upper circuit layer upper layer setting surface faces the substrate setting surface. The intermediate layer is disposed between the substrate setting surface and the upper layer setting surface. The intermediate layer has an accommodating space, and the position of the accommodating space corresponds to the merging structure, and the staggered overlapping of the wires in the merging structure is located in the accommodating space. By staggering the overlapping portions of the wires in the overlapping structure in the accommodating space, the stacked structure is further stacked on the overlapping structure, thereby avoiding the situation in which the local bulging increases the thickness.

In at least one embodiment of the present invention, the multilayer circuit board further includes an electrically insulating layer disposed in the stacked structure to isolate the interleaved wires.

In at least one embodiment of the invention, the intermediate layer has at least one perforation, and the base circuit and the upper circuit respectively have a switch contact pad, and the positions of the two switch contact pads correspond to the positions of the perforations.

In at least one embodiment of the present invention, the staggered overlap of the wires in the stacked structure has a separation distance from the upper set surface.

The invention further proposes a multilayer circuit board comprising a lower circuit layer, an upper circuit layer, an intermediate layer and a protective layer. The lower circuit layer has a substrate mounting surface and a base circuit. The base circuit is disposed on the substrate mounting surface. The base circuit has a plurality of wires, and one side edge of the substrate mounting surface extends outward to form a connecting portion, and the base circuit extends to the connecting portion. . The upper circuit layer has an upper layer setting surface and an upper layer circuit, the upper layer circuit is disposed on the upper layer setting surface, and the upper circuit layer upper layer setting surface is disposed toward the substrate setting surface. The intermediate layer is disposed between the substrate setting surface and the upper layer setting surface. The protective layer covers the base circuit on the connection portion. The protective layer and the upper circuit layer are not repeatedly overlapped on the intermediate layer, thereby avoiding a situation in which the local protrusions are increased in thickness.

In at least one embodiment of the invention, the intermediate layer has a retraction zone that maintains a spacing between the edges of the intermediate layer 130 and the connection.

In at least one embodiment of the present invention, the connecting portion has a connecting end end away from the end of the substrate receiving surface, and the connecting portion end is provided with a plurality of conductive contact pads connected to the portion of the base circuit extending from the connecting portion, and the protective layer is exposed. Conductive contact pads.

In at least one embodiment of the invention, the protective layer is integrally formed with the intermediate layer and extends outwardly from the intermediate layer.

In at least one embodiment of the present invention, the connecting portion includes a connecting portion root portion that connects the base mounting surface and the connecting portion, and the upper circuit layer has an extending portion that extends over the portion of the connecting portion that is close to the root portion of the connecting portion, and the connecting portion is protected Layer coverage.

In at least one embodiment of the invention, the protective layer extends outwardly from the upper circuit layer.

In at least one embodiment of the invention, the intermediate layer forms a recessed region such that the edges of the intermediate layer are spaced apart from the connecting portion.

The invention further provides a multilayer circuit board comprising an intermediate layer, a first circuit layer and a second circuit layer. The intermediate layer has an accommodating space and a perforation. The first circuit layer is disposed on the first side of the intermediate layer, the first circuit layer has a first wire, a second wire, and an electrically insulating layer. The first wire and the electrically insulating layer are in a vertical projection area of the accommodating space. And stacking a second wire to form a stacked structure, the second wire extends across the electrically insulating layer on opposite sides of the first wire, and is blocked by the electrically insulating layer to make the first wire and the second wire Maintain electrical isolation. The second circuit layer is disposed on the second side of the intermediate layer, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer has a third wire, and the multilayer circuit board can be pressed and deformed, so that The third wire passes through the through hole and is electrically connected to one of the first wire and the second wire. The height of the laminated structure is greater than the height of the first wire, and in the vertical direction, the overlapping structure portion enters the accommodating space. Further stacking of the layer structure on the laminated structure is avoided, thereby avoiding the situation in which the local protrusions are increased in thickness.

In at least one embodiment of the present invention, the superposed structure has a first dimension in a horizontal direction, and the accommodating space has a second dimension in a horizontal direction, and the first dimension is smaller than the second dimension, so that the periphery of the superposed structure is The intermediate layer remains separated in the horizontal direction.

The invention further provides a multilayer circuit board comprising an intermediate layer, a first circuit layer and a second circuit layer. The first circuit layer is disposed on the first side of the intermediate layer, the first circuit layer has a first wire, a conductive contact pad, a first body portion, and a connecting portion, the connecting portion has an opposite connecting portion and a connecting portion The end of the connecting portion is connected to the first body portion, and the conductive contact pad is located at the end of the connecting portion. The first wire extends from the first body portion to the connecting portion and is electrically coupled to the conductive contact pad. The second circuit layer is disposed on the second side of the intermediate layer, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer extends only in the vertical projection area of the first body portion, but is not extended Go to the vertical projection area of the connection. The protective layer has an opposite protective layer root and a protective layer end, and the protective layer root partially overlaps the second circuit layer, but the protective layer root does not extend into the vertical projection area of the intermediate layer, and the protective layer covers the connection other than the conductive contact pad. Surface.

The invention further provides a multilayer circuit board comprising an intermediate layer, a first circuit layer and a second circuit layer. The first circuit layer is disposed on the first side of the intermediate layer, the first circuit layer has a first wire, a conductive contact pad, a first body portion, and a connecting portion, the connecting portion has an opposite connecting portion root and a The connecting portion has a root portion connected to the first body portion, and the conductive contact pad is located at the end of the connecting portion. The first wire extends from the first body portion to the connecting portion to be electrically coupled to the conductive contact pad. The second circuit layer is disposed on the second side of the intermediate layer, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer extends only in the vertical projection area of the first body portion, but is not extended Go to the vertical projection area of the connection. The intermediate layer extends from the vertical projection area of the first body portion to the vertical projection area of the connection portion, and the intermediate layer covers the surface of the connection portion other than the conductive contact pads.

The invention further provides a multilayer circuit board comprising an intermediate layer, a first circuit layer and a second circuit layer. The first circuit layer is disposed on the first side of the intermediate layer, the first circuit layer has a first wire, a conductive contact pad, a first body portion, and a connecting portion, the connecting portion has an opposite connecting portion root and a The connecting portion has a root portion connected to the first body portion, and the conductive contact pad is located at the end of the connecting portion. The first wire extends from the first body portion to the connecting portion to be electrically coupled to the conductive contact pad. The second circuit layer is disposed on the second side of the intermediate layer, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer extends from the vertical projection area of the first body portion to the vertical projection area of the connection portion And the second circuit layer covers the surface of the connection other than the conductive contact pads.

The present invention is mainly directed to a portion of a multi-layer circuit board in which excessive layer stacking may occur, and the partial layer structure is removed, thereby avoiding excessive layer structure stacking and causing excessive local thickness, maintaining the flatness of the multilayer circuit board and The average thickness.

1‧‧‧ wire

1a‧‧‧Wire

2‧‧‧Intermediate

3‧‧‧Electrical insulation

4‧‧‧ circuit layer

5‧‧‧Contact pads

6‧‧‧ circuit layer

7‧‧‧Line segment

8‧‧‧Protective film

10‧‧‧Note Computer Keyboard Module

13‧‧‧Keypad

14‧‧‧ button cap

16‧‧‧Flexible device

18‧‧‧floor

100‧‧‧Multilayer circuit board

110‧‧‧lower circuit layer

111‧‧‧Base setting surface

112‧‧‧Base circuit

112a‧‧‧Wire

112b‧‧‧Switch contact pad

112c‧‧‧Electrical contact pads

116‧‧‧Electrical insulation

117‧‧‧ Body Department

118‧‧‧Multilayer structure

120‧‧‧Upper circuit layer

121‧‧‧Upper setting surface

122‧‧‧Upper Circuit

122a‧‧‧Switch contact pad

122b‧‧‧Switch contact pad

128‧‧‧Extension

130‧‧‧Intermediate

132‧‧‧Perforation

134‧‧‧ accommodating space

138‧‧‧Retraction zone

140‧‧‧Connecting Department

140a‧‧‧Connector root

140b‧‧‧End of the joint

150‧‧‧protection layer

200‧‧‧Multilayer circuit board

210‧‧‧First circuit layer

211‧‧‧First Body Department

212‧‧‧First wire

213‧‧‧Connecting Department

213a‧‧‧Connecting root

213b‧‧‧End of the joint

214‧‧‧second wire

216‧‧‧Electrical insulation

217‧‧‧Electrical contact pads

218‧‧ ‧ superposed structure

220‧‧‧Second circuit layer

222‧‧‧ Third wire

230‧‧‧Intermediate

230a‧‧‧ first side

230b‧‧‧ second side

232‧‧‧Perforation

234‧‧‧ accommodating space

250‧‧‧protective layer

250a‧‧‧protection root

250b‧‧‧End of protective layer

W1‧‧‧ first size

W2‧‧‧ second size

1 is a cross-sectional view of a prior art multilayer circuit board, revealing that the layer structure is directly stacked on the stacked structure; FIGS. 2 and 3 are cross-sectional views of the prior art multilayer circuit board, revealing the protective layer and other layer structures. FIG. 4 is an exploded perspective view of a notebook computer keyboard module according to an embodiment of the present invention; FIG. 5 is an exploded perspective view of the first embodiment of the present invention; Stereogram Figure 7 is a perspective view of a multilayer circuit board in a first embodiment of the present invention; Figure 8 is an enlarged perspective view of a laminated structure in a first embodiment of the present invention; Figure 9 is a multilayer circuit board in a first embodiment of the present invention; FIG. 10 is an enlarged perspective view of a laminated structure according to a second embodiment of the present invention; FIG. 11 is a cross-sectional exploded view of a multilayer circuit board according to a second embodiment of the present invention; FIG. 13 and FIG. 14 are cross-sectional views showing a stacked state of a protective layer and other layer structures according to a third embodiment of the present invention; FIG. 15 is an exploded perspective view showing a multilayer circuit board according to a fourth embodiment of the present invention; 16 is an exploded perspective view of a fifth embodiment of the present invention; FIG. 17 is an exploded perspective view of a sixth embodiment of the present invention; FIG. 18 is a perspective view of a multilayer circuit board according to a sixth embodiment of the present invention; FIG. 20 is a cross-sectional exploded view of a multilayer circuit board in accordance with a seventh embodiment of the present invention; FIG. 21 is an exploded perspective view of the eighth embodiment of the present invention; FIG. For the present invention Sectional view of the eighth embodiment, the protective layer is disclosed in a stacked state with other layers of the structure; the ninth embodiment, the cross section of the multilayer circuit board 23 is an exploded view of the present disclosure.

The present invention will be described in detail with reference to the accompanying drawings, in which FIG. It is to be understood that the proportions shown in the drawings are not intended to be a

Please refer to FIG. 4, which illustrates a multilayer circuit board 100 according to a first embodiment of the present invention. The multi-layer circuit board 100 can be a flexible printed circuit (FPC) and can be used as a switch circuit layer of the notebook computer keyboard module 10. The keyboard module 10 shown in the foregoing figures is a simplified schematic description and does not limit the configuration form to which the present invention is applicable. The keyboard module 10 includes a plurality of button caps 14, a plurality of elastic devices 16, and a bottom plate 18. The bottom surface of the button cap 14 has a contact structure 15. The plurality of elastic devices 16 are disposed on the multilayer circuit board 100 and respectively abut against a touch structure 15 . The multilayer circuit board 100 is disposed between the plurality of button caps 14 and the bottom plate 18.

As shown in FIGS. 5, 6, and 7, the multilayer circuit board 100 includes a lower circuit layer 110, an upper circuit layer 120, and an intermediate layer 130. The lower circuit layer 110, the intermediate layer 130, and the upper circuit layer 120 are laminated to form a multilayer circuit board 100, and the intermediate layer 130 is located between the lower circuit layer 110 and the upper circuit layer 120.

As shown in FIG. 5, the lower circuit layer 110 has a substrate mounting surface 111 and a base circuit 112, and the base circuit 112 is disposed on the substrate mounting surface 111. The base circuit 112 has a plurality of wires 112a and a stacking structure 118, and the stacked structure 118 is composed of at least two wires 112a alternately stacked. The thickness of the laminated structure 118 is greater than the thickness of other portions of the substrate circuit 112. The laminated structure 118 may be one in which one wire 112a is alternately laminated on the other wire 112a, one wire 112a is alternately laminated on the plurality of wires 112a, or a plurality of wires 112a are interlaced with the plurality of wires 112a.

As shown in FIG. 8 and FIG. 9, the multilayer circuit board 100 further includes an electrically insulating layer 116 disposed in the laminated structure 118 to isolate the interleaved wires 112a. The electrically insulating layer 116 may be formed by curing an adhesive such as a UV adhesive or a film made of an insulating material attached to the lower wire 112a. The electrically insulating layer 116 prevents the two wires 112a from being shorted to each other.

As shown in FIG. 8, the lower wire 112a is disposed on the substrate mounting surface 111 in a printed circuit process, and then the electrically insulating layer 116 is covered on the wire 112a. The foregoing electrically insulating layer 116 extends over the wire 112a and also extends over the substrate mounting surface 111 on both sides of the wire 112a. Finally, another wire 112a interleaved thereon is fabricated such that the upper wire 112a extends over opposite sides of the lower wire 112a. The maximum thickness of the laminated structure 118 is the thickness of the two wires 112a plus the thickness of the electrically insulating layer 116. The thickness of the remainder of the laminated structure 118 is the thickness of the wires 112a plus the thickness of the electrically insulating layer 116. Therefore, the thickness of the laminated structure 118 is greater than the thickness of other portions of the base circuit 112, and a region partially raised on the substrate seating surface 111 is formed in the laminated structure 118 and the peripheral portion. It should be noted that the thickness ratio in the drawings is intended to highlight and illustrate the thickness variation in the laminated structure 118, not the actual thickness ratio.

As shown in FIG. 5, the upper circuit layer 120 has an upper layer mounting surface 121 and an upper layer circuit 122, and the upper layer circuit 122 is disposed on the upper layer mounting surface 121. The upper circuit layer 120 above the layer installation surface 121 faces the substrate installation surface 111 and is disposed above the substrate installation surface 111.

As shown in FIG. 5, FIG. 6, and FIG. 7, the intermediate layer 130 is made of an insulating material, and is disposed between the substrate installation surface 111 and the upper layer installation surface 121, and is bonded to the base of the lower circuit layer 110 through an insulating glue such as ultraviolet glue. The surface 111 and the upper layer of the upper circuit layer 120 are provided with a surface 121. The isolation between the lower circuit layer 110 and the upper circuit layer 120 is maintained by the isolation of the intermediate layer 130. The distance and the base circuit 112 and the upper layer circuit 122 are normally insulated from each other without arbitrarily short-circuiting.

As shown in FIG. 5, FIG. 6, and FIG. 7, in an embodiment, the intermediate layer 130 has a plurality of through holes 132, and the multilayer circuit board 100 has a plurality of pairs of switch contact pads 112b, 122b, each pair of switch contact pads 112b, 122b is disposed on the base circuit 112 and the upper circuit 122, respectively, and the positions of the pair of switch contact pads 112b, 122b correspond to the position of one of the plurality of through holes 132.

As shown in FIG. 4, the aforementioned switch contact pads 112b, 122a can be used as trigger switches, for example, as trigger switches for the keyboard module 10. When the button cap 14 is pressed down by the user, the bumping structure 15 moves downward and compresses the elastic means 16. After the touch structure 15 contacts the switch contact pad 122b of the upper circuit layer 120, the upper circuit layer 120 is deformed, and the switch contact pads 112b, 122a are brought into contact with each other to conduct, and a corresponding electrical signal is emitted.

As shown in FIG. 5 , FIG. 6 , FIG. 8 and FIG. 9 , the intermediate layer 130 has an accommodating space 134 , and the position of the accommodating space 134 corresponds to the overlapping structure 118 .

As shown in FIG. 5, FIG. 8 and FIG. 9, when the intermediate layer 130 is bonded to the substrate setting surface 111, the overlapping structure 118 where the wires 112a are alternately overlapped is located in the accommodating space 134. In addition, the height of the accommodating space 134 is preferably slightly larger than the thickness of the laminated structure 118 in the thickness arrangement. When the upper circuit layer 122 and the intermediate layer 130 are coupled to each other, the overlapping structure 118 and the upper circuit layer 122 have a separation distance, so that the overlapping structure 118 is prevented from abutting the upper circuit layer 122, and the upper circuit layer 122 is convex upward. The situation. Under this configuration, the portion of the multilayer circuit board 100 corresponding to the laminated structure 118 does not have a local thickness due to the presence of the laminated structure 118, contributing to maintaining the flatness of the multilayer circuit board 100.

In other words, in the present invention, for the laminated structure 118, the corresponding intermediate layer 130 is removed to form the accommodating space 134, so that the multilayer circuit board 100 does not change the flatness due to the local excessive stacking to increase the thickness.

As shown in FIGS. 10 and 11, the multilayer circuit board of the first embodiment can be further simplified as in the second embodiment without distinguishing the layer structures above and below.

The multilayer circuit board 200 of the second embodiment includes an intermediate layer 230, a first circuit layer 210, and a second circuit layer 220.

The intermediate layer 230 has an accommodating space 234 and a through hole 232, and the intermediate layer 230 has an opposite first side 230a and a second side 230b.

As shown in FIG. 11, the first circuit layer 210 is disposed on the first side 230a of the intermediate layer 230. The first circuit layer 210 has a first wire 212, a second wire 214, and an electrically insulating layer 216. In the vertical projection area of the accommodating space 234, the first wire 212, the electrically insulating layer 216 and the second wire 214 are sequentially stacked to form a stacked structure 218.

As shown in FIGS. 10 and 11, the second wire 214 extends across the electrically insulating layer 216 on opposite sides of the first wire 212 and is blocked by the electrically insulating layer 216 to cause the first wire 212 and the second wire 214 to be interposed. Maintain electrical isolation.

As shown in FIG. 11, the second circuit layer 220 is disposed on the second side 230b of the intermediate layer 230, and the first circuit layer 210 and the second circuit layer 220 are respectively located on opposite sides of the intermediate layer 230. The second circuit layer 220 has a third wire 222. When the button cap 14 is pressed downward by the user, the multilayer circuit board 200 is also deformed correspondingly, so that the third wire 222 passes through the through hole 232 to be electrically connected to one of the first wire 212 and the second wire 214. In addition, the height of the laminated structure 218 is the sum of the heights of the first wire 212, the electrically insulating layer 216 and the second wire 214; Upward, the height of the accommodating space 234 is slightly larger than the height of the overlapping structure 218, so that the overlapping structure 218 enters the accommodating space 234, and does not contact the second circuit layer 220, and the second circuit layer 220 is convex upward. It helps to maintain the flatness of the multilayer circuit board 100. On the other hand, the superposed structure 218 has a first dimension W1 in the horizontal direction, and the accommodating space 234 has a second dimension W2 in the horizontal direction, and the first dimension W1 is smaller than the second dimension W2 such that the periphery of the superposed structure 218 The separation from the intermediate layer 230 in the horizontal direction is maintained so that no stacking condition occurs between the two.

The structural design of removing the partial layer structure and reducing the number of laminations between the multilayer structures can also be applied to other portions of the multilayer circuit board, avoiding the local thickness increasing due to excessive stacking.

As shown in FIG. 12, a multilayer circuit board 100 according to a third embodiment of the present invention includes a lower circuit layer 110, an upper circuit layer 120, and an intermediate layer 130. The lower circuit layer 110, the intermediate layer 130, and the upper circuit layer 120 are sequentially laminated and combined to form the multilayer circuit board 100.

As shown in FIG. 12, the lower circuit layer 110 has a substrate mounting surface 111 and a base circuit 112, and the base circuit 112 is disposed on the substrate mounting surface 111. The base circuit 112 has a plurality of wires 112a, and the substrate mounting surface 111 has a body portion 117 and a connecting portion 140. The connecting portion 140 is formed to extend outward from a side edge of the body portion 117, and the wire 112a of the base circuit 112 It extends to the connecting portion 140. Here, the body portion 117 refers to a portion of the base circuit 112 that is vertically projected within the bottom plate 18, and the connection portion 140 refers to a portion of the base circuit 112 that extends beyond the vertical projection of the bottom plate 18. The connecting portion 140 has a connecting portion root portion 140a and a connecting portion end 140b. The joint root portion 140 is located at the joint of the joint portion 140 and the base installation surface 111, and the joint end 140b is away from the end of the base installation surface 111. The connecting end 140b is provided with a plurality of conductive connections The plurality of conductive contact pads 112c are electrically connected to the portion of the base circuit 112 extending from the connecting portion 140.

As shown in FIG. 12, the upper circuit layer 120 has an upper layer mounting surface 121 and an upper layer circuit 122. The upper layer mounting surface 121 is the lower surface of the circuit layer 120, that is, the upper layer mounting surface 121 is opposite to the substrate mounting surface 111, and the upper layer circuit 122 is disposed on the upper layer mounting surface 121; the upper circuit layer 120 extends over the portion of the lower circuit layer 110, but The upper circuit layer 120 does not extend over the connection portion 140 of the lower circuit layer 110.

As shown in FIG. 12, FIG. 13, and FIG. 14, the intermediate layer 130 is provided between the base installation surface 111 and the upper layer installation surface 121, and is bonded to the lower circuit layer 110 and the upper circuit layer 120 through an insulating material such as ultraviolet glue. By the isolation of the intermediate layer 130, the lower circuit layer 110 and the upper circuit layer 120 are spaced apart from each other, and the base circuit 112 and the upper layer circuit 122 are normally insulated from each other without arbitrarily short-circuiting. The intermediate layer 130 has a recessed region 138 that corresponds to the portion of the root portion 140a of the joint, and the recessed region 138 maintains a spacing between the edges of the intermediate layer 130 and the connecting portion 140. In this recessed region 138, there is no structure in which the lower circuit layer 110, the intermediate layer 130, and the upper circuit layer 120 are sequentially stacked.

As shown in FIGS. 12 and 13 and 14, the multilayer circuit board 100 of the third embodiment further includes a protective layer 150. The protective layer 150 is bonded to the connection portion 140 to cover the base circuit 112 on the connection portion 140, but the protective layer 150 does not cover the conductive contact pads 112c and exposes the conductive contact pads 112c. Therefore, the protective layer 150 can protect the base circuit 112 disposed on the connecting portion 140, and the conductive contact pads 112c can still be exposed for the external electrical connection, so that the connecting portion 140 serves as the signal wiring of the multilayer circuit board 100.

13 and 14 show two different layer structure stacking patterns in the third embodiment. Since the intermediate layer 130 has the retraction region 138, at the position of the connection portion root portion 140a, the protective layer 150 overlaps at most only the upper circuit layer 120 and the lower circuit layer 110, and the protective layer 150 and the intermediate layer 130 do not overlap. Therefore, when the structure of the second embodiment is observed from the cross-sectional structure, at most only the laminated structure of the lower circuit layer 110, the upper circuit layer 120, and the protective layer 150, the lower circuit layer 110, the intermediate layer 130, and the upper circuit do not have local regions. The situation in which the layer 120 and the protective layer 150 are simultaneously laminated. The multilayer circuit board 100 does not cause a problem of excessive local thickness due to excessive layer structure stacking. Since the setting of the retracting area 138 is retained, even if the protective layer 150 is adhered and skewed, the case where the protective layer 150 and the intermediate layer 130 are laminated can be avoided; in the case where the correctness of the protective layer can be ensured, only the edge of the protective layer 150 is allowed It is true that the alignment is continued to the edge of the upper circuit layer 120, and the setting of the retraction region 138 may be omitted.

As shown in Fig. 15, the multilayer circuit board of the fourth embodiment can be further simplified as in the fourth embodiment without distinguishing the layer structures above and below.

As shown in FIG. 15, the multilayer circuit board 200 of the fourth embodiment includes an intermediate layer 230, a first circuit layer 210, a second circuit layer 220, and a protective layer 250.

As shown in FIG. 15, the intermediate layer 230 has a first side 230a and a second side 230b. The first circuit layer 210 is disposed on the first side 230a of the intermediate layer. The first circuit layer 210 has a first wire 212 and a first The conductive contact pad 217, a first body portion 211 (see the body portion 117 in the embodiment of FIG. 12 for a three-dimensional illustration), and a connecting portion 213. The connecting portion 213 is formed to extend outward from a side edge of the first body portion 211, and the first wire 212 extends to the connecting portion 213. Here, the first body portion 211 is for carrying a portion of the first wire 212 located in the vertical projection of the bottom plate 18, and the connecting portion 213 is for carrying the first wire 212 beyond the vertical projection portion of the bottom plate 18. Connection The 213 has an opposite connecting portion root portion 213a and a connecting portion end portion 213b (see the connecting portion root portion 140a and the connecting portion end 140b in the embodiment of FIG. 12 for a perspective view). The connecting portion root portion 213a is located at a joint of the connecting portion 213 and the first body portion 211, and the connecting portion end 213b is away from the end of the first body portion 211. The conductive contact pad 217 is located at the end 213b of the connecting portion. The first wire 212 extends from the first body portion 211 to the connecting portion 213 and is electrically coupled to the conductive contact pad 217.

As shown in FIG. 15, the second circuit layer 220 is disposed on the second side 230b of the intermediate layer 230. The first circuit layer 210 and the second circuit layer 220 are respectively located on opposite sides of the intermediate layer 230. The second circuit layer 220 extends only in the vertical projection area of the first body portion 211, but does not extend into the vertical projection area of the connecting portion 213. .

As shown in FIG. 15, the protective layer 250 has an opposite protective layer root 250a and a protective layer end 250b. The second circuit layer 250b of the protective layer root portion 250a partially overlaps, but the protective layer root portion 250a does not extend into the vertical projection region of the intermediate layer 230, and the protective layer 250 covers the surface of the connecting portion 213 other than the conductive contact pads 217. Therefore, when the structure of the fourth embodiment is viewed from the cross-sectional structure, at most only the laminated structure of the first circuit layer 210, the second circuit layer 220, and the protective layer 250, the first circuit layer 210 and the second circuit do not occur in a local region. The state in which the layer 220, the intermediate layer 230, and the protective layer 250 are simultaneously laminated.

As shown in FIG. 16, a multilayer circuit board 100 according to a fifth embodiment of the present invention is shown. In this embodiment, the retraction zone 138 is not provided, but the upper circuit layer 120 additionally has an extension portion 128 extending outward from the body portion, but only partially extending to cover the connection portion 140 and approaching the connection portion root portion 140a. The remaining portion is still covered by the protective layer 150; at the same time, the protective layer 150 is appropriately reduced in length, and the problem that the protective layer 150 is stacked above the intermediate layer 130 can also be avoided.

As shown in FIG. 17, FIG. 18 and FIG. 19, a multilayer circuit board 100 according to a sixth embodiment of the present invention includes a lower circuit layer 110, an upper circuit layer 120, and an intermediate layer 130. The arrangement of the lower circuit layer 110 and the upper circuit layer 120 is substantially the same as that of the third and fourth embodiments, and will not be described below. The following only describes the differences.

As shown in FIGS. 17, 18, and 19, the protective layer 150 and the intermediate layer 130 are integrally formed, and extend outward from one side edge of the intermediate layer 130. The protective layer 150 covers the base circuit 112 on the connection portion 140, but exposes the conductive contact pads 112c. Therefore, the base circuit 112 at the connection portion 140 can be completely covered and protected. The conductive contact pads 112c at the end 140b of the connection can serve as signal terminals for connecting electrical connectors or solder joints for other external circuits.

As shown in FIG. 19, therefore, the structure of the sixth embodiment is observed from the cross-sectional structure, and at most only the laminated structure of the lower circuit layer 110, the intermediate layer 130, and the upper circuit layer 120, and even the intermediate layer is even at the portion of the connecting portion 140. 130 is laminated with the connecting portion 140. This structure also causes the protective layer 150 and the upper circuit layer 120 to overlap without overlapping the intermediate layer 130. The multilayer circuit board 100 does not cause stacking due to excessive layer structure, resulting in a problem of excessive local thickness.

As shown in Fig. 20, the multilayer circuit board of the sixth embodiment can be further simplified as in the seventh embodiment without distinguishing the layer structures above and below.

The multilayer circuit board 200 of the seventh embodiment includes an intermediate layer 230, a first circuit layer 210, and a second circuit layer 220.

As shown in FIG. 20, the intermediate layer 230 has a first side 230a and a second side 230b. The first circuit layer 210 is disposed on the first side 230a of the intermediate layer 230. The first circuit layer 210 has a first wire 212, a conductive contact pad 217, and a first body portion 211. Referring to the body portion 117) in the embodiment of Fig. 12, and a connecting portion 213. The connecting portion 213 is formed to extend outward from a side edge of the first body portion 211, and the first wire 212 extends to the connecting portion 213. Here, the first body portion 211 is for carrying a portion of the first wire 212 located in the vertical projection of the bottom plate 18, and the connecting portion 213 is for carrying the first wire 212 beyond the vertical projection portion of the bottom plate 18. The connecting portion 213 has an opposite connecting portion root portion 213a and a connecting portion end portion 213b (see the connecting portion root portion 140a and the connecting portion end 140b in the embodiment of FIG. 12 for a perspective view). The connecting portion root portion 213a is located at a joint of the first body portion 211 and the connecting portion 213, and the connecting portion end 213b is away from the end of the first body portion 211. The conductive contact pad 217 is located at the end 213b of the connecting portion. The first wire 212 extends from the first body portion 211 to the connecting portion 213 and is electrically coupled to the conductive contact pad 217.

As shown in FIG. 20, the second circuit layer 220 is disposed on the second side 230b of the intermediate layer 230. The first circuit layer 210 and the second circuit layer 220 are respectively located on opposite sides of the intermediate layer 230. The second circuit layer 210 extends only in the vertical projection area of the first body portion 211, but does not extend into the vertical projection area of the connecting portion 213. . At the same time, the intermediate layer 230 extends from the vertical projection area of the first body portion 211 to the vertical projection area of the connection portion 213, and the intermediate layer 230 covers the surface of the connection portion 213 other than the conductive contact pads.

The sixth and seventh embodiments substantially extend the intermediate layers 130, 230 instead of additionally adding a protective layer, thereby avoiding excessive layer structure stacking, resulting in a problem of excessive local thickness.

Referring to FIG. 21 and FIG. 22, a multilayer circuit board 100 according to an eighth embodiment of the present invention includes a lower circuit layer 110, an upper circuit layer 120, and an intermediate layer 130. The lower circuit layer 110 is substantially the same as the third and fourth embodiments, and will not be described below.

In the eighth embodiment, the protective layer 150 extends outward from one edge of the upper circuit layer 120 to cover the base circuit 112 on the connection portion 140, but exposes the conductive contact pads 112c, and the protective layer 150 and the connection portion 140 The intermediate layer 130 is not provided between. Therefore, the protective layer 150 does not repeatedly overlap the intermediate layer 130, so that the multilayer circuit board 100 corresponds to the portion of the connecting portion 140 without an additional thickness. In addition, in order to make the connecting portion root portion 140a and the protective layer 150 fit snugly without creating an unattached gap at the edge, the intermediate layer 130 may further form a retracting region 138 at a portion corresponding to the connecting portion root portion 140a. The edge of the intermediate layer 130 is kept at a spaced distance from the connecting portion 140. Thereby, the base portion 140a of the joint portion and the base portion of the protective layer 150 can be closely fitted.

As shown in Fig. 23, the multilayer circuit board of the eighth embodiment can be further simplified as in the ninth embodiment without distinguishing the layer structures above and below.

The multilayer circuit board 200 of the ninth embodiment includes an intermediate layer 230, a first circuit layer 210, and a second circuit layer 220.

As shown in FIG. 23, the intermediate layer 230 has a first side 230a and a second side 230b. The first circuit layer 210 is disposed on the first side 230a of the intermediate layer 230. The first circuit layer 210 has a first wire 212, a conductive contact pad 217, a first body portion 211 (see the body portion 117 in the embodiment of FIG. 12 for a perspective view), and a connecting portion 213. The connecting portion 213 is formed to extend outward from a side edge of the first body portion 211, and the first wire 212 extends to the connecting portion 213. Here, the first body portion 211 is for carrying a portion of the first wire 212 located in the vertical projection of the bottom plate 18, and the connecting portion 213 is for carrying the first wire 212 beyond the vertical projection portion of the bottom plate 18. The connecting portion 213 has an opposite connecting portion root portion 213a and a connecting portion end portion 213b (see the connecting portion root portion 140a and the connecting portion end 140b in the embodiment of FIG. 12 for a perspective view). Connection root 213a The connecting portion 213 is coupled to the first body portion 211, and the connecting portion end 213b is away from the end of the first body portion 211. The conductive contact pad 217 is located at the end 231b of the connecting portion. The first conductive line 212 extends from the first body portion 211 to the connecting portion 213 and is electrically coupled to the conductive contact pad 217.

The second circuit layer 220 is disposed on the second side 230b of the intermediate layer 230. The first circuit layer 210 and the second circuit layer 220 are respectively located on opposite sides of the intermediate layer 230. The second circuit layer 220 extends from the vertical projection area of the first body portion 211 to the vertical projection area of the connection portion 213, and the second circuit layer 220 The surface of the connection portion 213 other than the conductive contact pad 217 is covered. The second circuit layer 220 extending over the surface of the connection portion 213 is extended instead of the additionally provided protective layer, thereby avoiding a situation in which the layer structure is excessively stacked.

The eighth and ninth embodiments substantially extend the upper circuit layer 120 or the second circuit layer 220 instead of additionally adding a protective layer, thereby avoiding excessive layer structure stacking, resulting in a problem of excessive local thickness.

In addition, the accommodating spaces 134, 234 applied in the first embodiment and the second embodiment can still be applied to the third to ninth embodiments to solve the laminated structures 118, 218 to cause the multilayer circuit boards 100, 200. The problem of increased local thickness.

The present invention is mainly directed to a portion of the multilayer circuit board 100, 200 in which excessive layer stacking may occur, and the partial layer structure is removed, thereby avoiding excessive layer structure stacking and causing excessive local thickness, maintaining the multilayer circuit board. Flatness and average thickness.

The invention may be embodied in a variety of other various modifications and changes in the present invention without departing from the spirit and scope of the invention. All should fall within the scope of protection of the appended claims.

Claims (16)

A multi-layer circuit board comprising: a lower circuit layer having a substrate mounting surface and a base circuit disposed on the substrate mounting surface, the base circuit having a plurality of wires and a stacked structure, the laminated structure being at least The two wires are alternately stacked, wherein the thickness of the laminated structure is greater than the thickness of other portions of the base circuit; an upper circuit layer having an upper layer disposed surface and an upper layer circuit, the upper layer circuit being disposed on the upper layer setting surface, and The upper circuit layer is disposed with the upper layer setting surface facing the substrate setting surface; and an intermediate layer disposed between the substrate setting surface and the upper layer setting surface; wherein the intermediate layer has an accommodating space, the accommodating space The position corresponds to the overlapping structure; wherein the wires in the overlapping structure are alternately overlapped in the accommodating space. The multi-layer circuit board of claim 1, further comprising an electrically insulating layer disposed in the laminated structure to isolate the interleaved wires. The multi-layer circuit board of claim 1, wherein the intermediate layer has at least one through hole, and the base circuit and the upper layer circuit respectively have a switch contact pad, and the positions of the two switch contact pads correspond to the through hole s position. The multi-layer circuit board of claim 1, wherein the overlapping staggered portions of the wires in the superposed structure have a separation distance from the upper layer disposed surface. A multi-layer circuit board comprising: a lower circuit layer having a substrate mounting surface and a substrate circuit disposed on a substrate mounting surface, the substrate circuit having a plurality of wires, and a side edge of the substrate mounting surface extending outward Forming a connection portion, the base circuit extending to the connection portion; An upper circuit layer having an upper layer setting surface and an upper layer circuit, wherein the upper layer circuit is disposed on the upper layer setting surface, the upper circuit layer is disposed with the upper layer setting surface facing the substrate setting surface; and an intermediate layer is disposed on the substrate setting surface And a protective layer covering the base circuit on the connecting portion; wherein the protective layer and the upper circuit layer are not repeatedly overlapped on the intermediate layer. The multilayer circuit board of claim 5, wherein the intermediate layer has a retraction zone that maintains a separation distance between the edge of the intermediate layer and the connection. The multi-layer circuit board of claim 5, wherein the connecting portion has a connecting end, away from an end of the substrate receiving surface, the connecting end is provided with a plurality of conductive contact pads connected to the base circuit for extension And a portion of the connecting portion, and the protective layer exposes the conductive contact pads. The multilayer circuit board of claim 5, wherein the protective layer is integrally formed with the intermediate layer and extends outwardly from the intermediate layer. The multilayer circuit board of claim 5, wherein the connecting portion includes a connecting portion root connecting the base mounting surface and the connecting portion, and the upper circuit layer has an extending portion extending to cover the connecting portion. a portion of the root of the connecting portion, and the connecting portion is covered by the protective layer. The multilayer circuit board of claim 5, wherein the protective layer extends outward from the upper circuit layer. The multilayer circuit board of claim 10, wherein the intermediate layer forms a retraction zone such that an edge of the intermediate layer maintains a separation distance from the connection. A multi-layer circuit board comprising: an intermediate layer having an accommodating space and a through hole; a first circuit layer disposed on the first side of the intermediate layer, the first circuit layer having a first wire, a second wire, and an electrically insulating layer, in the vertical projection area of the accommodating space, the first a wire, the electrically insulating layer and the second wire are sequentially stacked to form a stacked structure, the second wire extends across the electrically insulating layer on opposite sides of the first wire, and the electricity is The insulating layer is electrically isolated from the first wire and the second wire; and a second circuit layer is disposed on the second side of the intermediate layer, wherein the first circuit layer and the second circuit layer are respectively located Two opposite sides of the intermediate layer, the second circuit layer has a third wire, the multilayer circuit board can be pressed and deformed, so that the third wire passes through the through hole and one of the first wire and the second wire Turning on; wherein the height of the stacked structure is greater than the height of the first wire, and in the vertical direction, the overlapping structure portion enters the accommodating space. The multi-layer circuit board of claim 12, wherein the superposed structure has a first dimension in a horizontal direction, and the accommodating space has a second dimension in a horizontal direction, the first dimension being smaller than the first dimension The second dimension is such that the periphery of the laminated structure and the intermediate layer remain separated in the horizontal direction. A multi-layer circuit board comprising: an intermediate layer; a first circuit layer disposed on a first side of the intermediate layer, the first circuit layer having a first wire, a conductive contact pad, a first body portion, and a first circuit layer The connecting portion has an opposite connecting portion root portion and a connecting portion end, the connecting portion root portion is coupled to the first body portion, the conductive contact pad is located at the end of the connecting portion, and the first wire is from the first portion The body portion extends to the connecting portion and is electrically coupled to the conductive contact pad; a second circuit layer is disposed on the second side of the intermediate layer, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer extends only in the first body portion a vertical projection area, but not extending into the vertical projection area of the connecting portion; and a protective layer having an opposite protective layer root and a protective layer end, the protective layer root partially overlapping the second circuit layer, but the The root of the protective layer does not extend into the vertical projection area of the intermediate layer, the protective layer covering the surface of the joint other than the conductive contact pad. A multilayer circuit board comprising: an intermediate layer; a first circuit layer disposed on a first side of the intermediate layer, the first circuit layer having a first wire, a conductive contact pad, a first body portion, and a connecting portion having an opposite connecting portion root portion and a connecting portion end, the connecting portion root portion and the first body portion are coupled, the conductive contact pad is located at an end of the connecting portion, the first wire is from the first portion a body portion extending to the connecting portion and electrically coupled to the conductive contact pad; and a second circuit layer disposed on the second side of the intermediate layer, wherein the first circuit layer and the second circuit layer are respectively located Two opposite sides of the intermediate layer, the second circuit layer extending only in the vertical projection area of the first body portion, but not extending into the vertical projection area of the connecting portion; wherein the intermediate layer is vertically projected from the first body portion The region extends to the vertical projection area of the connection portion, and the intermediate layer covers the surface of the connection other than the conductive contact pad. A multilayer circuit board comprising: an intermediate layer; a first circuit layer disposed on a first side of the intermediate layer, the first circuit layer having a first wire, a conductive contact pad, a first body portion, and a connecting portion having an opposite connecting portion root portion and a connecting portion end, the connecting portion root portion and the first body portion being coupled to each other, The conductive contact pad is located at the end of the connecting portion, the first wire extends from the first body portion to the connecting portion and is electrically coupled to the conductive contact pad; and a second circuit layer is disposed on the middle layer On the two sides, the first circuit layer and the second circuit layer are respectively located on opposite sides of the intermediate layer, and the second circuit layer extends from the vertical projection area of the first body portion to the vertical projection area of the connection portion, and the first The two circuit layers cover the surface of the connection other than the conductive contact pads.