TWI645012B - Bendable structure - Google Patents
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- TWI645012B TWI645012B TW106128635A TW106128635A TWI645012B TW I645012 B TWI645012 B TW I645012B TW 106128635 A TW106128635 A TW 106128635A TW 106128635 A TW106128635 A TW 106128635A TW I645012 B TWI645012 B TW I645012B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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Abstract
一種可撓曲結構能達到撓曲內半徑小於或等於1毫米且可撓折超過5萬次。可撓曲結構包含二基板以及光學膠。光學膠位於二基板之間以黏合彼此。二基板以光學膠黏合後的總厚度小於或等於100微米且光學膠之儲存模數小於或等於90kPa,或者總厚度小於或等於75微米且光學膠之儲存模數小於或等於250kPa。 A flexible structure can achieve an internal radius of flexure less than or equal to 1 mm and can be flexed more than 50,000 times. The flexible structure includes two substrates and an optical glue. Optical glue is located between the two substrates to adhere to each other. After the two substrates are bonded with the optical glue, the total thickness is less than or equal to 100 microns and the storage modulus of the optical glue is less than or equal to 90 kPa, or the total thickness is less than or equal to 75 microns and the storage modulus of the optical glue is less than or equal to 250 kPa.
Description
本發明是有關於一種可撓曲結構,且特別是有關於一種顯示器的可撓曲結構。 The present invention relates to a flexible structure, and more particularly, to a flexible structure of a display.
近年來,市場上各品牌大廠陸續推出可撓式電子裝置產品,而目前評估可撓式裝置的技術開發上,聚醯亞胺(polyimide)已被初步證明為最適用之基材種類,但是其他材料的研究或是疊構/電性等等的研究,尚未完全落實,因此對於整體結構的可撓次數尚無評估數據。 In recent years, major brand manufacturers in the market have successively launched flexible electronic device products. At present, in evaluating the technical development of flexible devices, polyimide has been initially proved to be the most suitable substrate type, but Studies of other materials or studies of stacking / electrical properties have not been fully implemented, so there is no evaluation data on the number of times the whole structure is flexible.
當可撓式裝置需包含顯示器及其觸控模組時,就需要光學膠黏合不同模組。光學膠黏合後的整體結構之可撓性質是否受到不同種類光學膠的影響,目前尚無評估數據。 When a flexible device needs to include a display and its touch module, different modules need to be bonded with optical glue. Whether the flexible properties of the overall structure of the optical adhesive is affected by different types of optical adhesives has not been evaluated.
如何使包含顯示器及其觸控模組的可撓式裝置具有更可靠的信賴性,需要更多努力投注於此。 How to make the flexible device including the display and its touch module more reliable and reliable requires more efforts.
因此,本發明之一態樣是在提供一種可撓曲結構,其能達到撓曲內半徑小於或等於1毫米且可撓折超過5萬次。可撓曲結構包含二基板以及光學膠。光學膠位於二基板之 間以黏合彼此。二基板以光學膠黏合後的總厚度小於或等於100微米且光學膠之儲存模數小於或等於90kPa。 Therefore, one aspect of the present invention is to provide a flexible structure capable of achieving an inner radius of deflection of less than or equal to 1 millimeter and capable of being bent more than 50,000 times. The flexible structure includes two substrates and an optical glue. Optical glue is located on the two substrates In order to adhere to each other. The total thickness of the two substrates after being bonded with the optical adhesive is less than or equal to 100 microns and the storage modulus of the optical adhesive is less than or equal to 90 kPa.
依據本發明之一實施例,上述光學膠之材料包含矽膠、壓克力膠或聚氨酯膠,上述基板之材料包含聚醯亞胺、聚對苯二甲二乙酯、聚碳酸脂、環烯烴共聚物、聚萘二甲酸乙二醇酯或可撓折玻璃。 According to an embodiment of the present invention, the material of the optical adhesive includes silicon, acrylic or polyurethane adhesive, and the material of the substrate includes polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin copolymerization. Materials, polyethylene naphthalate or flexible glass.
本發明之另一態樣是在提供一種可撓曲結構,其能達到撓曲內半徑小於或等於1毫米且可撓折超過5萬次。可撓曲結構包含二基板以及光學膠。光學膠位於二基板之間以黏合彼此。二基板以光學膠黏合後的總厚度小於或等於75微米且光學膠之儲存模數小於或等於250kPa。 Another aspect of the present invention is to provide a flexible structure capable of achieving an inner radius of deflection less than or equal to 1 mm and capable of being flexed more than 50,000 times. The flexible structure includes two substrates and an optical glue. Optical glue is located between the two substrates to adhere to each other. The total thickness of the two substrates after being bonded with the optical adhesive is less than or equal to 75 microns and the storage modulus of the optical adhesive is less than or equal to 250 kPa.
依據本發明之一實施例,上述光學膠之儲存模數大於或等於90kPa。 According to an embodiment of the present invention, the storage modulus of the optical adhesive is greater than or equal to 90 kPa.
依據本發明之一實施例,上述光學膠之材料包含矽膠、壓克力膠或聚氨酯膠,上述基板之材料包含聚醯亞胺、聚對苯二甲二乙酯、聚碳酸脂、環烯烴共聚物、聚萘二甲酸乙二醇酯或可撓折玻璃。 According to an embodiment of the present invention, the material of the optical adhesive includes silicon, acrylic or polyurethane adhesive, and the material of the substrate includes polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin copolymerization. Materials, polyethylene naphthalate or flexible glass.
本發明之另一態樣是在提供一種可撓曲結構,其能達到撓曲內半徑小於或等於1毫米且可撓折超過2萬次。可撓曲結構包含二基板以及光學膠。光學膠位於二基板之間以黏合彼此。二基板以光學膠黏合後的總厚度小於或等於150微米且光學膠之儲存模數小於或等於90kPa。 Another aspect of the present invention is to provide a flexible structure, which can achieve an inner radius of deflection of less than or equal to 1 mm and can be flexed more than 20,000 times. The flexible structure includes two substrates and an optical glue. Optical glue is located between the two substrates to adhere to each other. The total thickness of the two substrates after being bonded with the optical adhesive is less than or equal to 150 microns and the storage modulus of the optical adhesive is less than or equal to 90 kPa.
依據本發明之一實施例,上述光學膠之材料包含矽膠、壓克力膠或聚氨酯膠,上述基板之材料包含聚醯亞胺、 聚對苯二甲二乙酯、聚碳酸脂、環烯烴共聚物、聚萘二甲酸乙二醇酯或可撓折玻璃。 According to an embodiment of the present invention, the material of the optical adhesive includes silicon, acrylic, or polyurethane adhesive, and the material of the substrate includes polyimide, Polyethylene terephthalate, polycarbonate, cyclic olefin copolymer, polyethylene naphthalate or flexible glass.
本發明之另一態樣是在提供一種可撓曲結構,其能達到撓曲內半徑小於或等於1毫米且可撓折超過2萬次。可撓曲結構包含二基板以及光學膠。光學膠位於二基板之間以黏合彼此。二基板以光學膠黏合後的總厚度小於或等於100微米且光學膠之儲存模數小於或等於250kPa。 Another aspect of the present invention is to provide a flexible structure, which can achieve an inner radius of deflection of less than or equal to 1 mm and can be flexed more than 20,000 times. The flexible structure includes two substrates and an optical glue. Optical glue is located between the two substrates to adhere to each other. The total thickness of the two substrates after being bonded with the optical adhesive is less than or equal to 100 microns and the storage modulus of the optical adhesive is less than or equal to 250 kPa.
依據本發明之一實施例,上述光學膠之儲存模數大於或等於90kPa。 According to an embodiment of the present invention, the storage modulus of the optical adhesive is greater than or equal to 90 kPa.
依據本發明之一實施例,上述光學膠之材料包含矽膠、壓克力膠或聚氨酯膠,上述基板之材料包含聚醯亞胺、聚對苯二甲二乙酯、聚碳酸脂、環烯烴共聚物、聚萘二甲酸乙二醇酯或可撓折玻璃。 According to an embodiment of the present invention, the material of the optical adhesive includes silicon, acrylic or polyurethane adhesive, and the material of the substrate includes polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin copolymerization. Materials, polyethylene naphthalate or flexible glass.
綜合以上,本發明所總結之可撓性結構的基板及光學膠的規格數據,可供該領域中通常知識者能迅速的選擇適當的材料而達到所需的撓曲次數信賴性。 To sum up, the specification data of the flexible structure substrate and the optical adhesive summarized by the present invention can be used by those skilled in the art to quickly select an appropriate material to achieve the required reliability of the number of flexures.
100‧‧‧可撓曲結構 100‧‧‧ flexible structure
102‧‧‧光學膠 102‧‧‧Optical glue
104a‧‧‧聚醯亞胺基板 104a‧‧‧Polyimide substrate
104b‧‧‧聚醯亞胺基板 104b‧‧‧Polyimide substrate
106a‧‧‧觸控模組 106a‧‧‧Touch Module
106b‧‧‧顯示模組 106b‧‧‧Display Module
T‧‧‧總厚度 T‧‧‧Total thickness
R1‧‧‧半徑 R1‧‧‧ radius
R2‧‧‧半徑 R2‧‧‧radius
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之詳細說明如下:第1圖係繪示根據本發明之一實施例所述之可撓曲結構的局部剖面圖;第2圖係繪示根據本發明之一實施例所述之可撓曲結構的彎折示意圖;以及 第3圖係繪示根據本發明之一實施例所述之可撓曲結構使用之光學膠的儲存模數的性能圖。 In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the detailed description of the drawings is as follows: FIG. 1 is a diagram illustrating the flexibility according to an embodiment of the present invention. A partial cross-sectional view of a structure; FIG. 2 is a schematic diagram showing a bending of a flexible structure according to an embodiment of the present invention; and FIG. 3 is a performance diagram of a storage modulus of an optical adhesive used in a flexible structure according to an embodiment of the present invention.
本發明之一態樣是提供電子裝置一種具有觸控顯示器之可撓性結構,藉以使電子裝置彎折或撓曲功能的信賴性能有效提高。 One aspect of the present invention is to provide an electronic device with a flexible structure with a touch display, so that the trust performance of the electronic device's bending or flexing function can be effectively improved.
請同時參照第1、2圖,第1圖係繪示根據本發明之一實施例所述之可撓曲結構100的局部剖面圖;第2圖係繪示根據本發明之一實施例所述之可撓曲結構的彎折示意圖。目前可撓性的電子裝置其內的基板材料選擇,已初步確認聚醯亞胺(polyimide)是較適合的基材,經本案撓曲內半徑為1毫米的撓曲測試,僅聚醯亞胺基板能通過20萬次,其餘材質基板皆不及10萬次即破損。當電子裝置內具有觸控顯示器,必然會需要光學膠(Optical Clear Adhesive)以黏合基材,例如在第1圖之可撓曲結構100以光學膠102黏合上方的觸控模組106a及下方的顯示模組106b。由於上述模組通常需要基板,而目前的可撓性基材最佳選擇是聚醯亞胺基板,因此本案以光學膠102黏合二聚醯亞胺基板(104a、104b)作為測試的結構,以因應目前多數可撓性電子裝置的需求。 Please refer to FIGS. 1 and 2 at the same time. FIG. 1 is a partial cross-sectional view of the flexible structure 100 according to an embodiment of the present invention; FIG. 2 is a diagram according to an embodiment of the present invention. Bending diagram of the flexible structure. At present, the selection of substrate materials in flexible electronic devices has initially confirmed that polyimide is a more suitable substrate. After the flexural test with a radius of 1 mm in this case, only polyimide was used. The substrate can pass 200,000 times, and the other substrates are damaged less than 100,000 times. When a touch display is included in an electronic device, an optical adhesive (Optical Clear Adhesive) is necessary to adhere the substrate, for example, the flexible structure 100 in FIG. 1 is adhered to the upper touch module 106a and the lower touch module 106a with an optical adhesive 102. Display module 106b. Since the above-mentioned modules usually require a substrate, and the best flexible substrate is currently a polyimide substrate, this case uses an optical glue 102 to adhere to a diimide substrate (104a, 104b) as the test structure. To meet the needs of most current flexible electronic devices.
請參照第2圖,本案之可撓性結構包含三層結構,光學膠102位於二聚醯亞胺基板(104a、104b)之間以黏合彼此。當本案以上述可撓性結構進行撓折測試時,發現光學膠102的軟硬程度是影響撓折測試結果的因素之一。具體而 言,以較軟的光學膠在可撓性結構總厚度T等於100微米(μm)時,可以通過撓曲內半徑1毫米20萬次之撓折測試,但使用較硬光學膠的可撓性結構則無法通過。 Please refer to FIG. 2, the flexible structure of the present case includes a three-layer structure, and the optical glue 102 is located between the dimerimine substrates (104 a and 104 b) to adhere to each other. When the flexural test was performed with the above-mentioned flexible structure in this case, it was found that the degree of softness and hardness of the optical adhesive 102 was one of the factors affecting the result of the flexural test. Specifically and In other words, with a softer optical adhesive, when the total thickness T of the flexible structure is equal to 100 micrometers (μm), it can pass the deflection test with an inner radius of 1 mm and 200,000 times, but the flexibility of the harder optical adhesive is used. The structure cannot pass.
此外,在上述撓折測試結果的破損皆在外層結構,例如以第2圖為例,撓折測試結果的破損處均在聚醯亞胺基板104a上。經分析,在撓折測試中,撓折造成的內弧(即聚醯亞胺基板104b的內緣)的長度為半徑R1*π,而撓折造成的外弧(即聚醯亞胺基板104a的外緣)的長度為半徑R2*π,亦即(R1+T)*π,內、外弧的差距為總厚度T*π。測試結果顯示內、外弧的差距越大,外弧之聚醯亞胺基板104a的破損率越高。因此,內、外弧的差距亦是影響撓折測試結果的因素之一,撓曲產品因為作動時會有內外弧的差異,其差距為總厚度T*π,所以產品總厚度上要有所限制,以避免過大的差異導致斷裂。 In addition, the damages in the above-mentioned bending test results are all in the outer layer structure. For example, as shown in FIG. 2, the damages in the bending test results are all on the polyimide substrate 104 a. After analysis, in the flexure test, the length of the inner arc caused by the flexure (that is, the inner edge of the polyimide substrate 104b) is a radius R1 * π, and the outer arc caused by the flexure (that is, the polyimide substrate 104a) The length of the outer edge) is the radius R2 * π, that is, (R1 + T) * π, and the difference between the inner and outer arcs is the total thickness T * π. The test results show that the larger the difference between the inner and outer arcs, the higher the damage rate of the polyimide substrate 104a of the outer arcs. Therefore, the gap between the inner and outer arcs is also one of the factors affecting the bending test results. Because the flexed product has a difference between the inner and outer arcs when it is actuated, the gap is the total thickness T * π, so the total thickness of the product must be somewhat different. Limit to avoid excessive differences that cause breaks.
關於光學膠102的軟硬程度,本案經測試分析選擇以-20℃以上的儲存模數(Storage Modulus),作為判斷軟硬程度判斷的依據,並使用以下Model A、B、C、D四種材質作測試。請同時參照第3圖及以下表1,經測試比較,以壓克力為主的Model C、D在較低溫度下,其儲存模數均超過250kPa,在目前測試結果中,一旦光學膠-20℃以上的儲存模數超過250kPa,即使總厚度縮減(例如縮減至75微米以下),撓曲次數仍然達不到2萬次的低標(撓曲內半徑為1毫米)。另,Model A、B分別以矽膠(silicone)及壓克力修改配方為主的光學膠,其-20℃以上的儲存模數均小於250kPa,則能通過 測試的要求。 Regarding the degree of softness and hardness of the optical gel 102, after testing and analysis in this case, the storage modulus (Storage Modulus) above -20 ° C was selected as the basis for judging the degree of softness and hardness, and the following four models A, B, C, and D were used Material for testing. Please also refer to Figure 3 and Table 1 below. After testing and comparison, at low temperatures, the storage modulus of Models C and D, which are mainly acrylic, exceeds 250 kPa. In the current test results, once the optical adhesive- The storage modulus above 20 ° C exceeds 250kPa. Even if the total thickness is reduced (for example, to less than 75 microns), the number of deflections is still less than 20,000 (the inner radius of deflection is 1 mm). In addition, Model A and B are optical adhesives mainly based on silicone and modified acrylic formulations. If the storage modulus above -20 ℃ is less than 250kPa, they can pass. Requirements for testing.
經測試比較,除上述膠材外,光學膠102之材料亦可為矽膠(silicone)、壓克力膠(Acrylic)或聚氨酯膠(Polyurethane),但並不以此為限,只要光學膠之-20℃以上的儲存模數小於250kPa應能符合本案對膠材的初步要求。 After testing and comparison, in addition to the above-mentioned materials, the material of the optical glue 102 can also be silicone, acrylic, or polyurethane, but it is not limited to this, as long as the optical glue- Storage modulus above 20 ° C less than 250kPa should be able to meet the preliminary requirements for the glue in this case.
本案再針對光學膠之-20℃以上的儲存模數小於或等於250kPa的多種「儲存模數」及「總厚度」的組合狀況作測試,所得的結果如下。 In this case, tests were performed on various combinations of "storage modulus" and "total thickness" of a storage modulus of -20 ° C or higher of less than or equal to 250 kPa, and the results obtained are as follows.
當光學膠之-20℃以上的儲存模數小於或等於90kPa且總厚度T為100微米時(例如光學膠厚度為50微米,二基板厚度各為25微米),撓曲內半徑為1毫米的撓曲次數可超過20萬次。 When the storage modulus of -20 ° C or higher of the optical glue is less than or equal to 90kPa and the total thickness T is 100 microns (for example, the thickness of the optical glue is 50 microns, the thickness of the two substrates are each 25 microns), the inner radius of the deflection is 1 mm The number of deflections can exceed 200,000 times.
當光學膠之-20℃以上的儲存模數小於或等於90kPa且總厚度T為150微米時(例如光學膠厚度為50微米,二基板厚度各為50微米),撓曲內半徑為1毫米的撓曲次數則不達5萬次。 When the storage modulus of the optical adhesive is lower than or equal to 90kPa and the total thickness T is 150 micrometers (for example, the optical adhesive thickness is 50 micrometers, and the thickness of the two substrates is 50 micrometers each), the inner radius of the deflection is 1 millimeter. The number of deflections is less than 50,000.
當光學膠之-20℃以上的儲存模數大於90kPa且 小於或等於250kPa,且總厚度T為75微米時(例如光學膠厚度為25微米,二基板厚度各為25微米),撓曲內半徑為1毫米的撓曲次數可超過20萬次。 When the storage modulus of the optical adhesive above -20 ℃ is greater than 90kPa and When the total thickness T is less than or equal to 250 kPa and the total thickness T is 75 micrometers (for example, the thickness of the optical adhesive is 25 micrometers, and the thickness of the two substrates is 25 micrometers each), the number of flexures with a radius of 1 mm can exceed 200,000 times.
當光學膠之-20℃以上的儲存模數大於90kPa且小於或等於250kPa,且總厚度T為100微米時(例如光學膠厚度為50微米,二基板厚度各為25微米),撓曲內半徑為1毫米的撓曲次數則不達5萬次。 When the storage modulus of the optical adhesive above -20 ° C is greater than 90kPa and less than or equal to 250kPa, and the total thickness T is 100 microns (for example, the thickness of the optical adhesive is 50 microns, and the thickness of the two substrates is 25 microns each), the inner radius of the deflection The number of deflections for 1 mm is less than 50,000.
若就產品信賴性的角度較保守的考量上述數據,可以總結出以下設計產品時參考的規格。 If the above data is considered conservatively from the perspective of product reliability, the following specifications can be summarized when designing products.
當光學膠之-20℃以上的儲存模數小於或等於90kPa且總厚度T小於或等於100微米時(例如光學膠厚度小於或等於50微米,二基板厚度各小於或等於25微米),撓曲內半徑小於或等於1毫米的撓曲次數可超過5萬次。 When the storage modulus of the optical adhesive above -20 ° C is less than or equal to 90kPa and the total thickness T is less than or equal to 100 microns (for example, the thickness of the optical adhesive is less than or equal to 50 microns, and the thickness of each of the two substrates is less than or equal to 25 microns), the deflection The number of deflections with an inner radius of 1 mm or less can exceed 50,000.
當光學膠之-20℃以上的儲存模數大於90kPa且小於或等於250kPa,且總厚度T小於或等於75微米時(例如光學膠厚度小於或等於25微米,二基板厚度各小於或等於25微米),撓曲內半徑小於或等於1毫米的撓曲次數亦可超過5萬次。 When the storage modulus of the optical glue is higher than 90kPa and less than or equal to 250kPa, and the total thickness T is less than or equal to 75 microns (for example, the thickness of the optical glue is less than or equal to 25 microns, and the thickness of the two substrates is less than or equal to 25 microns) ), The number of deflections within a deflection radius of 1 mm or less can also exceed 50,000 times.
當光學膠之-20℃以上的儲存模數小於或等於90kPa且總厚度T小於或等於150微米時(例如光學膠厚度小於或等於50微米,二基板厚度各小於或等於50微米),撓曲內半徑小於或等於1毫米的撓曲次數可超過2萬次。 When the storage modulus of the optical adhesive above -20 ° C is less than or equal to 90kPa and the total thickness T is less than or equal to 150 microns (for example, the thickness of the optical adhesive is less than or equal to 50 microns, and the thickness of each of the two substrates is less than or equal to 50 microns), the deflection The number of deflections with an inner radius less than or equal to 1 mm can exceed 20,000 times.
當光學膠之-20℃以上的儲存模數大於90kPa且小於或等於250kPa,且總厚度T小於或等於100微米時(例如 光學膠厚度小於或等於50微米,二基板厚度各小於或等於25微米),撓曲內半徑小於或等於1毫米的撓曲次數可超過2萬次。 When the storage modulus of the optical adhesive above -20 ° C is greater than 90kPa and less than or equal to 250kPa, and the total thickness T is less than or equal to 100 microns (for example The thickness of the optical adhesive is less than or equal to 50 micrometers, and the thickness of the two substrates is less than or equal to 25 micrometers each.
上述二組撓曲次數超過2萬次及二組撓曲次數超過5萬次的規格數據,可供該領域中通常知識者能迅速的選擇適當的材料而達到所需的撓曲次數信賴性。 The specification data of the above two sets of deflection times is more than 20,000 times and the second set of deflection times is more than 50,000 times, which can be used by ordinary knowledgeable persons in this field to quickly select appropriate materials to achieve the required deflection times reliability.
上述的可撓性結構可搭配的面版,例如可以是有機發光二極體(Organic Light-Emitting Diode)、電子紙或電泳顯示面板等的各類軟性可撓折面板。 The aforementioned faceplates with which the flexible structure can be matched can be, for example, various flexible flexible panels such as Organic Light-Emitting Diode, electronic paper, or electrophoretic display panel.
上述測試雖然是以聚醯亞胺基板為主所作的測試且僅聚醯亞胺基板能通過20萬次的測試,但就超過2萬或5萬次撓曲次數的信賴性而言,其他的材質的基材亦可適用。經本案撓曲內半徑1毫米的撓曲次數測試,能超過2萬或5萬次信賴性的基板材質包含聚對苯二甲二乙酯(Polyethylene terephthalate,PET)、聚碳酸脂(Polycarbonate,PC)、環烯烴共聚物(Cyclo Olefin Polymers,COP)、聚萘二甲酸乙二醇酯(Polythy-lene Naphtalate,PEN)或可撓折玻璃,但仍不以此為限。 Although the above tests are mainly based on polyimide substrates, and only the polyimide substrates can pass the 200,000 tests, but in terms of the reliability of more than 20,000 or 50,000 deflections, other The base material can also be used. According to the test of the number of deflections of the inner radius of 1 mm in this case, the reliability of the substrate material can be more than 20,000 or 50,000 times. ), Cyclic olefin copolymers (Cyclo Olefin Polymers, COP), polyethylene naphthalate (Polythy-lene Naphtalate, PEN) or flexible glass, but it is not limited to this.
綜合以上,本發明所總結之可撓性結構的基板及光學膠的規格數據,可供該領域中通常知識者能迅速的選擇適當的材料而達到所需的撓曲次數信賴性。 To sum up, the specification data of the flexible structure substrate and the optical adhesive summarized by the present invention can be used by those skilled in the art to quickly select an appropriate material to achieve the required reliability of the number of flexures.
雖然本發明已以數個實施例揭露如上,然其並非用以限定本發明,在本發明所屬技術領域中任何具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 Although the present invention has been disclosed as above with several embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field to which the present invention pertains can make various modifications without departing from the spirit and scope of the present invention. Changes and retouching, so the scope of protection of the present invention should be defined by the scope of the attached patent application Prevail.
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