TWI642695B - Polyimide precursor solution - Google Patents

Polyimide precursor solution Download PDF

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TWI642695B
TWI642695B TW103117592A TW103117592A TWI642695B TW I642695 B TWI642695 B TW I642695B TW 103117592 A TW103117592 A TW 103117592A TW 103117592 A TW103117592 A TW 103117592A TW I642695 B TWI642695 B TW I642695B
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acid
precursor solution
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polyimine
basic compound
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TW201502169A (en
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繁田朗
吉田猛
山田祐己
森北達彌
細田雅弘
越後良彰
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尤尼吉可股份有限公司
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
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    • C08K5/3442Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445Five-membered rings

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Abstract

本發明目的在於提供:能製造機械強度優異的聚醯亞胺成形體,且環境適合性優異、保存安定性與均塗性均良好的聚醯亞胺前驅體溶液。本發明所提供的聚醯亞胺前驅體溶液,係由聚醯胺酸、與酸解離常數(pKa)為8.5以下且4.5以上的弱鹼性化合物之鹽,溶解於含多元醇的溶劑中而成。 An object of the present invention is to provide a polyimide polyimide precursor which is excellent in environmental suitability and excellent in storage stability and leveling property, and which is capable of producing a polyimide body having excellent mechanical strength. The polyamidene precursor solution provided by the present invention is a salt of a polyaminic acid and a weakly basic compound having an acid dissociation constant (pKa) of 8.5 or less and 4.5 or more, and is dissolved in a solvent containing a polyol. to make.

Description

聚醯亞胺前驅體溶液 Polyimine precursor solution

本發明係關於聚醯亞胺前驅體溶液。由該聚醯亞胺前驅體溶液所獲得聚醯亞胺成形體係具有優異的機械強度與高耐熱性。 This invention relates to polythenimine precursor solutions. The polyimine imide molding system obtained from the polyimine precursor solution has excellent mechanical strength and high heat resistance.

由芳香族四羧酸二酐與芳香族二胺所獲得芳香族聚醯亞胺構成的成形體,因為耐熱性、機械強度、電氣特性、耐溶劑性等特性優異,因而廣泛被使用於電子產業領域、影印機領域、飛機領域等。該芳香族聚醯亞胺因為欠缺溶解性,因而通常將由屬於聚醯亞胺前驅體的聚醯胺酸溶解於NMP(N-甲基-2-吡咯啶酮)、DMF(N,N-二甲基甲醯胺)、DMAC(N,N-二甲基乙醯胺)等醯胺系溶劑的溶液,塗佈於基材表面上,接著使在高溫下硬化(醯亞胺化),而獲得薄膜或皮帶等聚醯亞胺成形體。當該聚醯胺酸溶液中的溶劑係使用上述醯胺系溶劑的情況,因為該醯胺系溶劑在聚醯亞胺成形時會被釋放於大氣中,因而就從環境適合性的觀點而言尚有待獲改善的空間。 A molded article composed of an aromatic polyimine obtained from an aromatic tetracarboxylic dianhydride and an aromatic diamine is widely used in the electronics industry because of its excellent properties such as heat resistance, mechanical strength, electrical properties, and solvent resistance. Fields, photocopiers, aircraft, etc. The aromatic polyimine is usually dissolved in NMP (N-methyl-2-pyrrolidone) and DMF (N, N-di) because of the lack of solubility. A solution of a guanamine solvent such as methylformamide or DMAC (N,N-dimethylacetamide) is applied to the surface of the substrate, followed by hardening at a high temperature (醯imination). A polyimine molded body such as a film or a belt is obtained. When the solvent in the polyaminic acid solution is the above-described guanamine-based solvent, since the guanamine-based solvent is released into the atmosphere during the formation of the polyimide, it is from the viewpoint of environmental suitability. There is still room for improvement.

此處提案有未使用上述醯胺系溶劑的聚醯亞胺前驅體溶液。 A polyiminoimide precursor solution in which the above amide-based solvent is not used is proposed herein.

例如專利文獻1~6提案有:使聚醯胺酸與鹼性化合物的鹽,溶解於實質未含有機溶劑的水中而獲得的聚醯亞胺前驅體溶液。 For example, Patent Documents 1 to 6 propose a polyilylimide precursor solution obtained by dissolving a salt of a polyamic acid and a basic compound in water which is substantially free of an organic solvent.

然而,如專利文獻1~6所揭示含有高濃度水的聚醯亞胺前驅體溶液,因為水特有的高表面張力,因而當塗佈於基材表面上成形時,均塗性不足,有塗膜撥彈現象、或容易發生厚度不均的問題。又,保存安定性亦有問題。 However, as disclosed in Patent Documents 1 to 6, the polyimine precursor solution containing a high concentration of water has insufficient coating properties when coated on the surface of the substrate because of the high surface tension peculiar to water. The phenomenon of film bounce, or the problem of uneven thickness. Also, there are problems with preservation stability.

再者,專利文獻7、8提案有:含有特定醇的溶劑當作反應溶劑,於三乙胺、三伸乙二胺等強鹼性化合物存在下,使四羧酸成分與二胺成分進行反應而獲得的聚醯亞胺前驅體溶液。然而,若將經摻合有三乙胺、三伸乙二胺等強鹼性化合物的醇使用為聚合溶劑,除較難獲得高聚合度的聚醯亞胺前驅體,且保存安定性亦有問題。 Further, Patent Documents 7 and 8 propose that a solvent containing a specific alcohol is used as a reaction solvent, and a tetracarboxylic acid component and a diamine component are reacted in the presence of a strong basic compound such as triethylamine or triethylenediamine. And the obtained polyamidiene precursor solution. However, if an alcohol having a strong basic compound such as triethylamine or triethylenediamine is used as a polymerization solvent, it is difficult to obtain a polyadenimine precursor having a high degree of polymerization, and storage stability is also problematic. .

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開平8-59832號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-59832

[專利文獻2]日本專利特開2002-226582號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-226582

[專利文獻3]國際公開2012/8543號 [Patent Document 3] International Publication No. 2012/8543

[專利文獻4]國際公開2013/35806號 [Patent Document 4] International Publication No. 2013/35806

[專利文獻5]國際公開2013/105610號 [Patent Document 5] International Publication No. 2013/105610

[專利文獻6]日本專利特開2013-144750號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2013-144750

[專利文獻7]日本專利特開2013-144751號公報 [Patent Document 7] Japanese Patent Laid-Open Publication No. 2013-144751

[專利文獻8]日本專利特開2014-31445號公報 [Patent Document 8] Japanese Patent Laid-Open Publication No. 2014-31445

緣是,本發明為解決上述問題,目的在於提供:能製造機械強度優異的聚醯亞胺成形體,且環境適合性優異、保存安定性與均塗性均良好的聚醯亞胺前驅體溶液。 In order to solve the above problems, an object of the present invention is to provide a polyimide polyimide precursor which is excellent in environmental suitability, good in storage stability and uniform coating property, and which is capable of producing a polyimide-imid molded article having excellent mechanical strength. .

本發明者等為解決上述問題經深入鑽研,結果發現將聚醯胺酸與特定鹼性化合物的鹽溶解於特定溶劑中,而獲得均勻的聚醯亞胺前驅體溶液,從該溶液可製造機械強度優異的聚醯亞胺成形體,遂完成本發明。 The inventors of the present invention have intensively studied in order to solve the above problems, and as a result, have found that a polyglycine and a salt of a specific basic compound are dissolved in a specific solvent to obtain a uniform polyimine precursor solution from which a machine can be produced. The present invention has been completed by a polyimine molded article having excellent strength.

即,本發明主旨係如下述。 That is, the gist of the present invention is as follows.

1)一種聚醯亞胺前驅體溶液,係由聚醯胺酸、與酸解離常數(pKa)為8.5以下且4.5以上的弱鹼性化合物之鹽,溶解於含多元醇的溶劑中而成。 1) A polyimine precursor solution obtained by dissolving a salt of a polyaminic acid, a weakly basic compound having an acid dissociation constant (pKa) of 8.5 or less and 4.5 or more, in a solvent containing a polyol.

2)如上述聚醯亞胺前驅體溶液,其中,含多元醇的溶劑係多元醇與水的混合溶劑。 2) A polyimine precursor solution as described above, wherein the polyol-containing solvent is a mixed solvent of a polyol and water.

3)如上述聚醯亞胺前驅體溶液,其中,混合溶劑係未滿70質量%的水含有量。 3) The polyimine precursor solution according to the above, wherein the mixed solvent is a water content of less than 70% by mass.

4)如上述聚醯亞胺前驅體溶液,其中,聚醯胺酸係使用經離析的固體狀聚醯胺酸。 4) A polyimine precursor solution as described above, wherein the polyamic acid is an isolated solid polyamine.

本發明的聚醯亞胺前驅體溶液,因為沒有使用醯胺系溶劑,因而環境適合性優異、保存安定性與塗膜均塗性均良好,且因為使用多元醇之類的較高沸點溶劑,因而成形時的製程控制容易,可獲得厚度均勻的塗膜。所以,本發明的聚醯亞胺前驅體溶液頗適用為聚醯亞胺前驅體溶液,從該溶液可獲得具有優異特性的聚醯亞胺成形體。 Since the polyimine precursor solution of the present invention does not use a guanamine-based solvent, it has excellent environmental suitability, good storage stability, and uniform coating property, and since a higher boiling solvent such as a polyol is used, Therefore, the process control at the time of molding is easy, and a coating film having a uniform thickness can be obtained. Therefore, the polyimine precursor solution of the present invention is quite suitable as a polyimide precursor solution from which a polyimide composition having excellent properties can be obtained.

本發明的聚醯亞胺前驅體係芳香族聚醯亞胺前驅體,具有一般式(1)所示構成單元的聚醯胺酸之同元聚合物或共聚物。從該聚醯亞胺前驅體所獲得的聚醯亞胺較佳係非熱可塑性聚醯亞胺,且玻璃轉移溫度較佳係達250℃以上。 The polyfluorene imine precursor aromatic polyimine precursor of the present invention has a homopolymer or copolymer of polyamic acid having a structural unit represented by the general formula (1). The polyimine obtained from the polyimine precursor is preferably a non-thermoplastic polyimide, and the glass transition temperature is preferably at least 250 °C.

其中,R係表示含有至少1個碳六元環的4價芳香族殘基,4價中的各2價形成配對,各一對的2價係由碳六元環內相鄰接的碳原子提供。 Wherein R is a tetravalent aromatic residue containing at least one carbon six-membered ring, and each of the four valences forms a pair, and the two-valent pair of each pair is a carbon atom adjacent to each other in the carbon six-membered ring. provide.

再者,R'係表示具有1~4個碳六元環的2價芳香族殘基。 Further, R' represents a divalent aromatic residue having 1 to 4 carbon six-membered rings.

上述聚醯胺酸係使四羧酸成分與二胺成分進行反應便可獲得。 The polyamic acid is obtained by reacting a tetracarboxylic acid component with a diamine component.

上述四羧酸成分係具有芳香族環的四羧酸類(四羧酸、其二酐或酯化物等),具體可舉例如:均苯四甲酸類、3,3',4,4'-聯苯基四羧酸類、2,3,3',4'-聯苯基四羧酸類、2,2',3,3'-聯苯基四羧酸類、4,4'-氧二酞酸類、3,3',4,4'-四羧酸二苯基酮類、3,3',4,4'-四羧酸二苯碸類、對聯三苯四羧酸類、間聯三苯四羧酸類等、及該等的混合物。 The tetracarboxylic acid component is a tetracarboxylic acid (tetracarboxylic acid, dianhydride or esterified product thereof) having an aromatic ring, and specific examples thereof include pyromellitic acid and 3,3',4,4'-linked. Phenyltetracarboxylic acid, 2,3,3',4'-biphenyltetracarboxylic acid, 2,2',3,3'-biphenyltetracarboxylic acid, 4,4'-oxydicarboxylic acid, 3,3',4,4'-tetracarboxylic acid diphenyl ketone, 3,3',4,4'-tetracarboxylic acid diphenyl hydrazine, conjugated triphenyltetracarboxylic acid, cross-linked triphenyltetracarboxylic acid Acids, etc., and mixtures of these.

該等之中,較佳係均苯四甲酸類、3,3',4,4'-聯苯基四羧酸類、3,3',4,4'-四羧酸二苯基酮類、4,4'-氧二酞酸類、及該等的混合物。 Among these, pyromellitic acid, 3,3', 4,4'-biphenyltetracarboxylic acid, 3,3',4,4'-tetracarboxylic acid diphenyl ketone are preferred. 4,4'-oxydicarboxylic acid, and mixtures thereof.

上述二胺成分係芳香族二胺,具體可舉例如:對伸苯二胺、間伸苯二胺、4,4'-二胺基二苯醚(4,4'-氧基二苯胺)、3,4'-氧基二苯胺、4,4'-二胺基二苯甲烷、2,4-甲苯二胺、2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、3,3'-二羥-4,4'-二胺基聯苯基、雙(4-胺基-3-羧苯基)甲烷、2,4-二胺基甲苯等。 Specific examples of the diamine component-based aromatic diamine include p-phenylenediamine, m-phenylenediamine, and 4,4'-diaminodiphenyl ether (4,4'-oxydiphenylamine). 3,4'-oxydiphenylamine, 4,4'-diaminodiphenylmethane, 2,4-toluenediamine, 2,2-bis[4-(4-aminophenoxy)phenyl] Propane, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 3,3'-dihydroxy-4,4'-diamine Biphenyl, bis(4-amino-3-carboxyphenyl)methane, 2,4-diaminotoluene, and the like.

該等之中,較佳係對伸苯二胺、間伸苯二胺、4,4'-二胺基二苯醚、3,4'-二胺基二苯醚、及該等的混合物。 Among these, phenylenediamine, meta-phenylenediamine, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, and mixtures thereof are preferred.

上述聚醯胺酸較佳係使用經離析的固體狀聚醯胺酸。所謂「使 用經離析的固體狀聚醯胺酸」係指在製造本發明聚醯亞胺前驅體溶液之際,使用預先由另一系統進行聚合的固體狀聚醯胺酸。固體狀聚醯胺酸較佳係可使用例如由四羧酸成分與二胺成分進行懸浮聚合而獲得的聚醯胺酸粉體。利用懸浮聚合法製造的聚醯胺酸,係例如依照日本專利第2951484號公報、第3386856號公報等所記載方法便可獲得。即,使上述四羧酸成分與二胺成分的略等莫耳,在不會溶解該聚醯胺酸的貧溶劑中進行反應便可獲得。該反應溫度係-20~60℃、特別較佳係0~30℃。依此若使在貧溶劑中進行反應,則因為屬於反應生成物的聚醯胺酸不溶解於貧溶劑中,而在溶劑中呈懸浮狀態,因而利用過濾‧乾燥等普通方法除去溶劑,便可獲得粉體狀的聚醯胺酸。此處所謂「貧溶劑」係指相對於溶劑100g,25℃聚醯胺酸的溶解度未滿1g之溶劑,具體係可使用醚類、酮類等溶劑。該等之中,較佳係使用THF(四氫呋喃)、丙酮及該等的混合物。藉由此種懸浮聚合法便可獲得高聚合度的固體狀聚醯胺酸,使用其將可獲得高聚合度的聚醯亞胺前驅體溶液。所獲得粉體狀聚醯胺酸中的貧溶劑含有量,係相對於粉體總質量較佳未滿1質量%。 The above polyamic acid is preferably an isolated solid polyamic acid. So-called The use of the isolated solid polyamic acid refers to the use of a solid polyamine which is previously polymerized by another system in the production of the polyimine precursor solution of the present invention. As the solid polyamic acid, for example, a polyamic acid powder obtained by suspension polymerization of a tetracarboxylic acid component and a diamine component can be used. The polyamic acid produced by the suspension polymerization method can be obtained, for example, according to the method described in Japanese Patent No. 2951484, No. 3386856, and the like. That is, it is obtained by reacting the above-mentioned tetracarboxylic acid component and the diamine component in a slight molar amount in a poor solvent which does not dissolve the polyamic acid. The reaction temperature is -20 to 60 ° C, particularly preferably 0 to 30 ° C. According to this, when the reaction is carried out in a poor solvent, since the polyamic acid belonging to the reaction product is not dissolved in the poor solvent and is suspended in the solvent, the solvent can be removed by an ordinary method such as filtration, drying or the like. A powdery polyamine is obtained. Here, the "poor solvent" means a solvent having a solubility of 25 ° C polyglycine of less than 1 g with respect to 100 g of the solvent, and specifically, a solvent such as an ether or a ketone can be used. Among these, THF (tetrahydrofuran), acetone, and the like are preferably used. By such a suspension polymerization method, a solid poly-proline acid having a high degree of polymerization can be obtained, and a polyadenimine precursor solution having a high degree of polymerization can be obtained by using it. The content of the poor solvent in the obtained powdery poly-proline is preferably less than 1% by mass based on the total mass of the powder.

本發明的聚醯亞胺前驅體溶液係將由上述聚醯胺酸、與酸解離常數(pKa)為8.5以下且4.5以上、較佳8.5以下且5.5以上、更佳8.5以下且7.0以上的弱鹼性化合物所構成鹽,使用為聚醯亞胺前驅體。此處所謂「鹼性化合物的pKa」係指供定量式表示鹼強度的指標之一,該鹼的共軛酸之酸解離常數值。即,依從酸中釋放出質子的解離反應平衡常數(Ka)之負常用對數表示,依測定溫度25℃施行酸鹼滴定而求得。pKa值越大表示越強鹼。pKa為8.5以下且4.5 以上的弱鹼性化合物代表例,可舉例如含氮雜環式化合物。具體可舉例如:吡啶、2-甲基吡啶、3-甲基吡啶、4-甲基吡啶等吡啶衍生物;1,2-二甲基咪唑、2-乙基-4-甲基咪唑、4-乙基-2-甲基咪唑、1-甲基-4-乙基咪唑等咪唑衍生物;喹啉、異喹啉等喹啉衍生物等等。該等之中,較佳係使用1,2-二甲基咪唑及2-乙基-4-甲基咪唑。另外,相關具有複數pKa值的鹼性化合物,係將最大值設為該鹼性化合物的pKa值。 The polyimine precursor solution of the present invention is a weak base having a poly-proline acid having a dissociation constant (pKa) of 8.5 or less and 4.5 or more, preferably 8.5 or less and 5.5 or more, more preferably 8.5 or less and 7.0 or more. The salt composed of the compound is used as a polyimide precursor. Here, the "pKa of a basic compound" means one of the indexes indicating the alkali strength in a quantitative formula, and the acid dissociation constant value of the conjugate acid of the base. That is, the negative logarithm of the equilibrium constant (Ka) of the dissociation reaction in which the proton is released from the acid is expressed by the acid-base titration at a measurement temperature of 25 °C. The greater the pKa value, the stronger the base. The pKa is 8.5 or less and 4.5 Representative examples of the above weakly basic compound include, for example, a nitrogen-containing heterocyclic compound. Specific examples thereof include a pyridine derivative such as pyridine, 2-methylpyridine, 3-methylpyridine or 4-methylpyridine; 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, and 4 An imidazole derivative such as ethyl-2-methylimidazole or 1-methyl-4-ethylimidazole; a quinoline derivative such as quinoline or isoquinoline or the like. Among these, 1,2-dimethylimidazole and 2-ethyl-4-methylimidazole are preferably used. Further, the basic compound having a complex pKa value is defined as the pKa value of the basic compound.

弱鹼性化合物對上述聚醯胺酸的摻合量係相對於聚醯胺酸的構成單元1莫耳,較佳為1~4莫耳、更佳為1.5~3莫耳。弱鹼性化合物亦可組合2種以上摻合,此情況只要該等的合計摻合量在上述範圍內便可。 The blending amount of the weakly basic compound with respect to the above polyamic acid is preferably 1 to 4 moles, more preferably 1.5 to 3 moles, per mole of the constituent unit of the polyglycolic acid. The weakly basic compound may be blended in combination of two or more kinds, and in this case, the total blending amount of the above may be within the above range.

本發明的聚醯亞胺前驅體溶液係藉由在上述聚醯胺酸中,添加含有弱鹼性化合物與多元醇的溶劑並使溶解形成溶液便可獲得。此處,所謂「多元醇」係指一分子內具有2個以上醇性羥基的有機化合物。多元醇的具體例可舉例如:乙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、1,5-戊二醇、2-丁烯-1,4-二醇、2-甲基-2,4-戊二醇、甘油、2-乙基-2-羥甲基-1,3-丙二醇、1,2,6-己三醇、二乙二醇、二丙二醇、三乙二醇、四乙二醇等。該等之中,較佳係使用乙二醇、二乙二醇。 The polyimine precursor solution of the present invention can be obtained by adding a solvent containing a weakly basic compound and a polyhydric alcohol to the above polyamic acid and dissolving it to form a solution. Here, the "polyol" means an organic compound having two or more alcoholic hydroxyl groups in one molecule. Specific examples of the polyhydric alcohol include ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, and 1 , 5-pentanediol, 2-butene-1,4-diol, 2-methyl-2,4-pentanediol, glycerin, 2-ethyl-2-hydroxymethyl-1,3-propanediol 1,2,6-hexanetriol, diethylene glycol, dipropylene glycol, triethylene glycol, tetraethylene glycol, and the like. Among these, ethylene glycol and diethylene glycol are preferably used.

含有上述多元醇的溶劑,係可使用僅由多元醇構成的溶劑,或者可使用多元醇與水的混合溶劑。任一種溶劑均係多元醇可單獨使 用1種、或組合使用1種以上。就從降低原料成本的觀點,較佳係使用多元醇與水的混合溶劑。在多元醇與水的混合溶劑中,就從保存安定性、塗膜均塗性及薄膜強度的觀點,水含有量係相對於溶劑總質量較佳未滿70質量%、更佳係未滿60質量%。 As the solvent containing the above polyol, a solvent composed only of a polyhydric alcohol or a mixed solvent of a polyhydric alcohol and water can be used. Any solvent is a polyol that can be used alone One type or a combination of one type or more may be used. From the viewpoint of lowering the raw material cost, a mixed solvent of a polyol and water is preferably used. In the mixed solvent of a polyol and water, from the viewpoints of storage stability, coating uniformity, and film strength, the water content is preferably less than 70% by mass, more preferably less than 60% by mass based on the total mass of the solvent. quality%.

含有上述多元醇的溶劑較佳係未含有除多元醇及水以外的溶劑,特別就從環境適合性的觀點,醯胺系溶劑的含有量係相對於溶劑總質量較佳未滿2質量%、更佳係未滿1質量%。所謂「醯胺系溶劑」係具有氫原子亦可被烷基取代之醯胺鍵結的有機溶劑,可例如:N-甲基-2-吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等。 The solvent containing the above-mentioned polyol preferably does not contain a solvent other than the polyol and water, and particularly preferably, the content of the guanamine-based solvent is less than 2% by mass based on the total mass of the solvent, from the viewpoint of environmental suitability. More preferably, the system is less than 1% by mass. The "melamine-based solvent" is an organic solvent having a hydrogen atom or a hydrazine-substituted amide, and may be, for example, N-methyl-2-pyrrolidone or N,N-dimethylformamide. , N, N-dimethylacetamide, and the like.

在形成溶液之際,上述聚醯亞胺前驅體的濃度較佳係0.1~60質量%、更佳係1~40質量%、特佳係10~30質量%。聚醯亞胺前驅體的濃度係計算出聚醯胺酸與弱鹼性化合物的合計質量,相對於聚醯亞胺前驅體溶液總質量的比例。 When the solution is formed, the concentration of the polyimine precursor is preferably from 0.1 to 60% by mass, more preferably from 1 to 40% by mass, and particularly preferably from 10 to 30% by mass. The concentration of the polyimine precursor is calculated as the ratio of the total mass of the polyaminic acid to the weakly basic compound relative to the total mass of the polyimide intermediate solution.

再者,上述聚醯亞胺前驅體的特有黏度[η]較佳係0.7以上、更佳係1.0以上、特佳係1.2以上。[η]值越大,則當使閉環而形成聚醯亞胺時,越容易獲得強度與彈性模數等特性呈良好者。另外,[η]係直接關聯於聚合體分子量的值,在N,N-二甲基乙醯胺溶劑中,依聚醯亞胺前驅體濃度0.5質量%、25℃進行測定。 Further, the specific viscosity [η] of the polyimine precursor is preferably 0.7 or more, more preferably 1.0 or more, and particularly preferably 1.2 or more. The larger the value of [η], the more easily the properties such as the strength and the elastic modulus are obtained when the polyimide is formed into a closed loop. Further, [η] is directly related to the molecular weight of the polymer, and is measured in a N,N-dimethylacetamide solvent at a concentration of 0.5% by mass and 25° C. based on the concentration of the polyimide precursor.

本發明的聚醯亞胺前驅體溶液係藉由在含有弱鹼性化合物共存的多元醇溶劑中,使四羧酸成分與二胺成分直接進行反應亦可獲 得。但。若依此的話,因為在聚合反應中會進行屬於單體的上述四羧酸成分之分解反應,導致不易獲得高聚合度的聚醯胺酸,因而如上述,最好藉由使經離析的固體狀聚醯胺酸與弱鹼性化合物溶解於含多元醇的溶劑中而獲得。聚醯亞胺前驅體溶液係若含有多元醇、水,則會因長期間保存而導致聚醯胺酸的分子量降低。所以,最好在剛要形成聚醯亞胺之前,便將粉末狀聚醯胺酸形成溶液。又,所獲得聚醯胺酸溶液的保存溫度較佳係設定在10℃以下、更佳係0℃以下。 The polyamidiamine precursor solution of the present invention can be obtained by directly reacting a tetracarboxylic acid component and a diamine component in a polyol solvent containing a weakly basic compound. Got it. but. According to this, since the decomposition reaction of the above-mentioned tetracarboxylic acid component belonging to the monomer proceeds in the polymerization reaction, it is difficult to obtain a polyamic acid having a high degree of polymerization, and thus, as described above, it is preferred to pass the isolated solid. The polylysine is obtained by dissolving a weakly basic compound in a solvent containing a polyol. When the polyimine precursor solution contains a polyol or water, the molecular weight of the polylysine decreases due to storage for a long period of time. Therefore, it is preferred to form the powdered polyamine into a solution just before the formation of the polyimine. Further, the storage temperature of the obtained polyaminic acid solution is preferably set to 10 ° C or lower, more preferably 0 ° C or lower.

本發明的聚醯亞胺前驅體溶液係可利用通常方法加工成為薄膜或皮帶,或者形成被膜。在加工成為薄膜時,若將聚醯亞胺前驅體的溶液利用塗膜滴流器在玻璃板等基材上澆注所需厚度,經除去溶劑,接著加熱而施行醯亞胺化,便可獲得聚醯亞胺薄膜。同樣的,若將溶液塗佈於目標基材上,經乾燥、加熱,便可在基材上被覆著聚醯亞胺。 The polyimine precursor solution of the present invention can be processed into a film or a belt by a usual method, or a film can be formed. When processing into a film, if a solution of the polyimide precursor is cast on a substrate such as a glass plate by a coating film trickle to a desired thickness, the solvent is removed, followed by heating to carry out hydrazine imidization. Polyimine film. Similarly, if the solution is applied to a target substrate, dried and heated, the substrate can be coated with polyimide.

再者,本發明的聚醯亞胺前驅體溶液係視需要可摻合例如:顏料、導電性碳黑及金屬粒子等填充材;或鋰二次電池活性物質、研磨材、介電質、潤滑劑等公知填料。又,在不致損及本發明效果之範圍內,亦可添加其他聚合物、或例如醚類、一價醇類、酮類、酯類、鹵化烴類、烴類等溶劑。 Furthermore, the polyamidene precursor solution of the present invention may be blended with, for example, a filler such as a pigment, conductive carbon black, and metal particles, or a lithium secondary battery active material, an abrasive, a dielectric, or a lubricant. A known filler such as a agent. Further, other polymers or solvents such as ethers, monovalent alcohols, ketones, esters, halogenated hydrocarbons, and hydrocarbons may be added to the extent that the effects of the present invention are not impaired.

由本發明聚醯亞胺前驅體溶液所製造的薄膜及被膜,係頗適用於例如:各種電絕緣薄膜(耐熱絕緣膠帶、耐熱黏貼帶、高密度磁 記錄座、電容器、FPC等)、影印機用中間轉印皮帶(intermediate transfer belt)、影印機用定像皮帶、鋰二次電池用電極、經填充氟樹脂、石墨等的滑動構件、經利用玻璃纖維、碳纖維等強化的構造構件、各種間隔物(功率電晶體的絕緣間隔墊片、磁頭間隔物、功率繼電器的間隔器、變壓器的間隔器等)、電線‧排線絕緣被覆、琺瑯塗佈材(太陽電池、低溫儲存槽、太空絕熱材、積體電路、槽襯等)、超過濾膜、氣體分離膜等的製造。 The film and the film produced by the polyimine precursor solution of the present invention are suitable for, for example, various electrical insulating films (heat-resistant insulating tape, heat-resistant adhesive tape, high-density magnetic film). Recording seat, capacitor, FPC, etc.), intermediate transfer belt for photocopiers, fixing belt for photocopiers, electrodes for lithium secondary batteries, sliding members filled with fluororesin, graphite, etc. Reinforced structural members such as fibers and carbon fibers, various spacers (insulation spacers for power transistors, spacer spacers, spacers for power relays, spacers for transformers, etc.), wires, insulation coatings, and coating materials (Solar cells, low temperature storage tanks, space insulation materials, integrated circuits, tank linings, etc.), ultrafiltration membranes, gas separation membranes, etc.

[實施例] [Examples]

以下,根據實施例針對本發明進行更具體說明,惟本發明並不僅侷限於該等實施例。 Hereinafter, the present invention will be more specifically described based on the examples, but the present invention is not limited to the embodiments.

<聚醯胺酸粉體之調製> <Modulation of poly-proline powder>

實施例及比較例所使用的聚醯胺酸粉體係依如下調製。 The polyamic acid powder system used in the examples and comparative examples was prepared as follows.

<聚醯胺酸粉體A> <Polyuric acid powder A>

根據日本專利第2951484號實施例1所記載方法,從均苯四甲酸二酐(PMDA)與4,4'-氧基二苯胺(ODA)獲得聚醯胺酸粉體。即,將PMDA(21.9g)溶解於THF(500ml)中,保持0℃。在其中徐緩添加ODA(20.0g)的THF溶液500ml,於0℃下進行2小時反應,而獲得含有聚醯胺酸的懸浮液。從懸浮液中離析出聚醯胺酸,便獲得聚醯胺酸的粉體。此時的聚醯胺酸之[η]係1.50。將其設為聚醯胺酸粉體A。 A poly-proline powder was obtained from pyromellitic dianhydride (PMDA) and 4,4'-oxydiphenylamine (ODA) according to the method described in Example 1 of Japanese Patent No. 2951484. That is, PMDA (21.9 g) was dissolved in THF (500 ml) and kept at 0 °C. 500 ml of a THF solution in which ODA (20.0 g) was slowly added thereto was reacted at 0 ° C for 2 hours to obtain a suspension containing poly-proline. When the poly-proline is isolated from the suspension, a powder of poly-proline is obtained. The [η] of the polyaminic acid at this time was 1.50. This was set to polyamic acid powder A.

<聚醯胺酸粉體B> <Polyuric acid powder B>

根據日本專利第2951484號實施例3所記載方法,從3,3',4,4'-聯苯基四羧酸二酐(BPDA)與4,4'-氧基二苯胺(ODA)獲得聚醯胺酸粉體。即,將BPDA(2.96g)懸浮於THF(50ml)中,保持0℃。在其中徐緩添加ODA(2.00g)的THF溶液50ml,於0℃下進行2小時反應,而獲得含有聚醯胺酸的懸浮液。從懸浮液中離析出聚醯胺酸,便獲得聚醯胺酸的粉體。此時的聚醯胺酸之[η]係2.19。將其設為聚醯胺酸粉體B。 According to the method described in Example 3 of Japanese Patent No. 2951484, polycondensation is obtained from 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 4,4'-oxydiphenylamine (ODA). Proline powder. Namely, BPDA (2.96 g) was suspended in THF (50 ml) and kept at 0 °C. 50 ml of a THF solution in which ODA (2.00 g) was slowly added thereto was reacted at 0 ° C for 2 hours to obtain a suspension containing poly-proline. When the poly-proline is isolated from the suspension, a powder of poly-proline is obtained. The [η] of the polyaminic acid at this time was 2.19. This was set to polyamic acid powder B.

<聚醯胺酸粉體C> <Polyuric acid powder C>

從3,3',4,4'-聯苯基四羧酸二酐(BPDA)與對伸苯二胺(PDA)獲得聚醯胺酸粉體。即,將BPDA(8.06g)懸浮於丙酮60ml中,保持於室溫(20℃)。在其中徐緩添加將PDA(2.91g)溶解於丙酮129ml中的溶液,於室溫下進行1小時反應,而獲得聚醯胺酸的懸浮液。從懸浮液中離析出聚醯胺酸,便獲得聚醯胺酸的粉體。此時的聚醯胺酸之[η]係1.85。將其設為聚醯胺酸粉體C。 Polylysine powder was obtained from 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA). Namely, BPDA (8.06 g) was suspended in 60 ml of acetone and kept at room temperature (20 ° C). A solution in which PDA (2.91 g) was dissolved in 129 ml of acetone was slowly added thereto, and the reaction was carried out for 1 hour at room temperature to obtain a suspension of poly-proline. When the poly-proline is isolated from the suspension, a powder of poly-proline is obtained. The [η] of the polyaminic acid at this time was 1.85. This was set to polyamic acid powder C.

下述針對實施例及比較例所獲得聚醯亞胺前驅體溶液的特性等,依照以下方法進行評價。 The properties and the like of the polyimine precursor solution obtained in the following examples and comparative examples were evaluated in accordance with the following methods.

<保存安定性> <Save stability>

將聚醯亞胺前驅體溶液在25℃下放置100小時後,測定聚醯胺酸的特有黏度,當變化率未滿10%時,將保存安定性評為「良好」,當變化率達10%以上時,將保存安定性評為「不良」。 After the polybendimimine precursor solution was allowed to stand at 25 ° C for 100 hours, the specific viscosity of the poly-proline was determined. When the rate of change was less than 10%, the storage stability was rated as "good", and the rate of change was 10 When it is more than %, the preservation stability is rated as "bad".

<均塗性> <Coating property>

將聚醯亞胺前驅體溶液使用塗膜滴流器塗佈於屬於基材的玻璃板上,對該塗膜於氮氣環境下,依50℃施行10分鐘、依80℃施行30分鐘、依120℃施行30分鐘、依200℃施行20分鐘、依300℃施行20分鐘,經著依350℃施行10分鐘的加熱處理,而形成厚度約20μm的聚醯亞胺薄膜塗膜。然後,從玻璃板上剝離聚醯亞胺薄膜,經切取10平方公分方方塊後,測定任意9處的厚度。當厚度變動幅度相對於平均值未滿±10%時,便將均塗性評為「良好」,當變動幅度達±10%以上時,便將均塗性評為「不良」。 The polyimine precursor solution was applied to a glass plate belonging to the substrate using a coating film trickle, and the coating film was applied at 50 ° C for 10 minutes, at 80 ° C for 30 minutes, according to a nitrogen atmosphere. The film was applied at ° C for 30 minutes, at 200 ° C for 20 minutes, at 300 ° C for 20 minutes, and subjected to heat treatment at 350 ° C for 10 minutes to form a polyimide film coating film having a thickness of about 20 μm. Then, the polyimide film was peeled off from the glass plate, and after cutting 10 square centimeters square, the thickness of any 9 places was measured. When the thickness variation range is less than ±10% with respect to the average value, the leveling property is rated as "good", and when the variation is ±10% or more, the leveling property is rated as "bad".

<薄膜強度特性> <Film strength characteristics>

根據ASTM D882測定上述聚醯亞胺薄膜的拉伸強度,當聚醯亞胺薄膜的拉伸強度達12kg/mm2以上時,便將機械強度評為「良好」,當聚醯亞胺薄膜的拉伸強度未滿12kg/mm2時,便將機械強度評為「不良」。 The tensile strength of the above polyimine film was measured according to ASTM D882. When the tensile strength of the polyimide film was 12 kg/mm 2 or more, the mechanical strength was rated as "good" when the polyimide film was used. When the tensile strength was less than 12 kg/mm 2 , the mechanical strength was rated as "poor".

[實施例1] [Example 1]

將聚醯胺酸粉體A與1,2-二甲基咪唑(pKa 7.7)的混合物(1,2-二甲基咪唑係相對於聚醯胺酸的構成單元1莫耳使用2.5莫耳),在25℃下溶解於乙二醇中,獲得當作聚醯亞胺前驅體用之具有15質量%濃度的聚醯亞胺前驅體溶液A-1。該前驅體溶液的特性評價結果係如表1所示。 a mixture of polyamic acid powder A and 1,2-dimethylimidazole (pKa 7.7) (1,2-dimethylimidazole relative to the constituent unit of polyglycolic acid 1 molar used 2.5 mol) It was dissolved in ethylene glycol at 25 ° C to obtain a polyamidene precursor solution A-1 having a concentration of 15% by mass as a polyimide precursor. The property evaluation results of the precursor solution are shown in Table 1.

[實施例2] [Embodiment 2]

將聚醯胺酸粉體B與1,2-二甲基咪唑(pKa 7.7)的混合物(1,2-二甲基咪唑係相對於聚醯胺酸的構成單元1莫耳使用2.5莫耳),在25℃下溶解於乙二醇中,獲得當作聚醯亞胺前驅體用之具有15質量%濃度的聚醯亞胺前驅體溶液B-1。該前驅體溶液的特性評價結果係如表1所示。 a mixture of poly-proline powder B and 1,2-dimethylimidazole (pKa 7.7) (1,2-dimethylimidazole is used in relation to the constituent unit of polyglycolic acid 1 molar 2.5 mol) It was dissolved in ethylene glycol at 25 ° C to obtain a polybendimimine precursor solution B-1 having a concentration of 15% by mass as a polyimide precursor. The property evaluation results of the precursor solution are shown in Table 1.

[實施例3] [Example 3]

除鹼性化合物係使用2-乙基-4-甲基咪唑(pKa 8.3)之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-2。該前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution B-2 was obtained in the same manner as in Example 2 except that 2-ethyl-4-methylimidazole (pKa 8.3) was used as the basic compound. The property evaluation results of the precursor solution are shown in Table 1.

[實施例4] [Example 4]

除溶劑係使用二乙二醇之外,其餘均與實施例1同樣地獲得聚醯亞胺前驅體溶液A-2。該前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution A-2 was obtained in the same manner as in Example 1 except that diethylene glycol was used as the solvent. The property evaluation results of the precursor solution are shown in Table 1.

[實施例5] [Example 5]

除溶劑係使用二乙二醇之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-3。該前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution B-3 was obtained in the same manner as in Example 2 except that diethylene glycol was used as the solvent. The property evaluation results of the precursor solution are shown in Table 1.

[實施例6] [Embodiment 6]

除溶劑係使用乙二醇與水的混合溶劑(混合質量比為乙二醇: 水=80:20)之外,其餘均與實施例1同樣地獲得聚醯亞胺前驅體溶液A-3。該前驅體溶液的特性評價結果係如表1所示。 In addition to the solvent, a mixed solvent of ethylene glycol and water is used (the mass ratio of the mixture is ethylene glycol: The polyimine precursor solution A-3 was obtained in the same manner as in Example 1 except that water = 80:20. The property evaluation results of the precursor solution are shown in Table 1.

[實施例7] [Embodiment 7]

除溶劑係使用乙二醇與水的混合溶劑(混合質量比為二醇:水=80:20)之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-4。該前驅體溶液的特性評價結果係如表1所示。 A polyimine precursor solution B-4 was obtained in the same manner as in Example 2 except that a solvent (mixing mass ratio of diol: water = 80:20) was used as the solvent. The property evaluation results of the precursor solution are shown in Table 1.

[實施例8] [Embodiment 8]

將聚醯胺酸粉體C與1,2-二甲基咪唑(pKa 7.7)的混合物(1,2-二甲基咪唑係相對於聚醯胺酸的構成單元1莫耳使用2.5莫耳),在25℃下溶解於乙二醇與水的混合溶劑(混合質量比為二醇:水=80:20)中,獲得當作聚醯亞胺前驅體用之具有15質量%濃度的聚醯亞胺前驅體溶液C-1。該前驅體溶液的特性評價結果係如表1所示。 a mixture of poly-proline powder C and 1,2-dimethylimidazole (pKa 7.7) (1,2-dimethylimidazole relative to the constituent unit of polyglycolic acid 1 molar 2.5 mol) It is dissolved in a mixed solvent of ethylene glycol and water at 25 ° C (mixing mass ratio: diol: water = 80:20) to obtain a polyfluorene having a concentration of 15% by mass as a precursor of polyimine. Imine precursor solution C-1. The property evaluation results of the precursor solution are shown in Table 1.

[實施例9] [Embodiment 9]

除溶劑係使用乙二醇與水的混合溶劑(混合質量比為二醇:水=50:50)之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-5。該前驅體溶液的特性評價結果係如表1所示。 A polyimine precursor solution B-5 was obtained in the same manner as in Example 2 except that a solvent mixture of ethylene glycol and water (mixing mass ratio: diol: water = 50:50) was used. The property evaluation results of the precursor solution are shown in Table 1.

[實施例10] [Embodiment 10]

除溶劑係使用二乙二醇與水的混合溶劑(混合質量比為二乙二醇:水=60:40)之外,其餘均與實施例8同樣地獲得聚醯亞胺前驅體溶液C-2。該前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution C- was obtained in the same manner as in Example 8 except that the solvent was a mixed solvent of diethylene glycol and water (mixing mass ratio of diethylene glycol: water = 60:40). 2. The property evaluation results of the precursor solution are shown in Table 1.

[比較例1] [Comparative Example 1]

除溶劑係使用甲醇之外,其餘均欲與實施例1同樣地獲得聚醯亞胺前驅體溶液A-4,但聚醯胺酸粉體A並未完全溶解,無法獲得均勻溶液。 The polyimine precursor solution A-4 was obtained in the same manner as in Example 1 except that methanol was used as the solvent. However, the polyamic acid powder A was not completely dissolved, and a homogeneous solution could not be obtained.

[比較例2] [Comparative Example 2]

除溶劑係使用乙醇之外,其餘均欲與實施例2同樣地獲得聚醯亞胺前驅體溶液B-6,但聚醯胺酸粉體B並未完全溶解,無法獲得均勻溶液。 The polyimine precursor solution B-6 was obtained in the same manner as in Example 2 except that the solvent was ethanol. However, the polyamic acid powder B was not completely dissolved, and a homogeneous solution could not be obtained.

[比較例3] [Comparative Example 3]

除溶劑係使用正丁醇之外,其餘均欲與實施例2同樣地獲得聚醯亞胺前驅體溶液B-7,但聚醯胺酸粉體B並未完全溶解,無法獲得均勻溶液。 The polyimine precursor solution B-7 was obtained in the same manner as in Example 2 except that n-butanol was used as the solvent, but the poly-proline powder B was not completely dissolved, and a uniform solution could not be obtained.

[比較例4] [Comparative Example 4]

除鹼性化合物係使用屬於強鹼性化合物的三乙胺(pKa 11.8)之外,其餘均與實施例1同樣地獲得聚醯亞胺前驅體溶液A-5。該等前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution A-5 was obtained in the same manner as in Example 1 except that the basic compound was triethylamine (pKa 11.8) which was a strongly basic compound. The results of the evaluation of the properties of the precursor solutions are shown in Table 1.

[比較例5] [Comparative Example 5]

除鹼性化合物係使用屬於強鹼性化合物的三伸乙二胺(pKa 8.8)之外,其餘均與實施例1同樣地獲得聚醯亞胺前驅體溶液A-6。該 等前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution A-6 was obtained in the same manner as in Example 1 except that the basic compound was a triethylenediamine (pKa 8.8) which is a strongly basic compound. The The results of the evaluation of the characteristics of the precursor solution are shown in Table 1.

[比較例6] [Comparative Example 6]

除將溶劑設為水之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-8。該等前驅體溶液的特性評價結果係如表1所示。 The polyimine precursor solution B-8 was obtained in the same manner as in Example 2 except that the solvent was changed to water. The results of the evaluation of the properties of the precursor solutions are shown in Table 1.

[比較例7] [Comparative Example 7]

除溶劑係使用水,且鹼性化合物係使用屬於強鹼性化合物的三乙胺(pKa 11.8)之外,其餘均與實施例2同樣地獲得聚醯亞胺前驅體溶液B-9。該等前驅體溶液的特性評價結果係如表1所示。 Polyimine precursor solution B-9 was obtained in the same manner as in Example 2 except that water was used as the solvent and the basic compound was triethylamine (pKa 11.8) which was a strongly basic compound. The results of the evaluation of the properties of the precursor solutions are shown in Table 1.

由上述結果得知,本發明聚醯亞胺前驅體溶液的保存安定性與均塗性均優異。又,得知由該聚醯亞胺前驅體溶液所獲得的聚醯亞 胺薄膜係具有優異的機械強度。又,因為未使用醯胺系溶劑,因而環境適合性優異。 From the above results, it was found that the polyethylenimine precursor solution of the present invention is excellent in both storage stability and leveling property. Moreover, the polyazide obtained from the solution of the polyimide precursor solution is known. The amine film has excellent mechanical strength. Moreover, since the amide-based solvent is not used, it is excellent in environmental suitability.

(產業上之可利用性) (industrial availability)

本發明的聚醯亞胺前驅體溶液係頗適用於例如:FPC等電絕緣薄膜、影印機用皮帶、鋰二次電池用電極、電線‧排線絕緣被覆、分離膜等的製造。 The polyimine precursor solution of the present invention is suitably used for, for example, an electric insulating film such as FPC, a belt for a photocopier, an electrode for a lithium secondary battery, an electric wire, a wire insulation coating, a separation film, and the like.

Claims (2)

一種聚醯亞胺前驅體溶液,係由聚醯胺酸與酸解離常數(pKa)為8.5以下且4.5以上的弱鹼性化合物之鹽,溶解於溶劑中而成者,其特徵為,聚醯胺酸之四羧酸成分為選自均苯四甲酸類、3,3',4,4'-聯苯基四羧酸類、3,3',4,4'-四羧酸二苯基酮類及4,4'-氧二酞酸類之1種或2種以上;溶劑係含有乙二醇,且水含有比率為未滿70質量%。 A polyamidene precursor solution obtained by dissolving a salt of a weakly basic compound having a polyaminic acid and an acid dissociation constant (pKa) of 8.5 or less and 4.5 or more, dissolved in a solvent, characterized in that it is a polyfluorene. The tetracarboxylic acid component of the amine acid is selected from the group consisting of pyromellitic acid, 3,3', 4,4'-biphenyltetracarboxylic acid, 3,3',4,4'-tetracarboxylic acid diphenyl ketone. One or two or more kinds of 4,4'-oxydicarboxylic acid; the solvent contains ethylene glycol, and the water content ratio is less than 70% by mass. 如申請專利範圍第1項之聚醯亞胺前驅體溶液,其中,弱鹼性化合物為1,2-二甲基咪唑及/或2-乙基-4-甲基咪唑。 The polyimine precursor solution according to claim 1, wherein the weakly basic compound is 1,2-dimethylimidazole and/or 2-ethyl-4-methylimidazole.
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Publication number Priority date Publication date Assignee Title
US4169085A (en) * 1977-01-20 1979-09-25 Dr. Beck & Co. Ag Aqueous electrically insulating varnish and a process for its production
CN103097463A (en) * 2010-07-14 2013-05-08 宇部兴产株式会社 Aqueous polyimide precursor solution composition and method for producing aqueous polyimide precursor solution composition

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JPS52108497A (en) * 1976-03-09 1977-09-10 Showa Electric Wire & Cable Co Ltd Preparation of polyimide resins
US5719253A (en) * 1994-10-07 1998-02-17 Unitika Ltd. Poly(amic acid) solution and polyimide film or polymide-coated material obtained therefrom
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169085A (en) * 1977-01-20 1979-09-25 Dr. Beck & Co. Ag Aqueous electrically insulating varnish and a process for its production
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