TWI641263B - Electronic device and its photography module - Google Patents

Electronic device and its photography module Download PDF

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TWI641263B
TWI641263B TW105141360A TW105141360A TWI641263B TW I641263 B TWI641263 B TW I641263B TW 105141360 A TW105141360 A TW 105141360A TW 105141360 A TW105141360 A TW 105141360A TW I641263 B TWI641263 B TW I641263B
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image capturing
light
axis
control unit
electronic device
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TW105141360A
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Chinese (zh)
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TW201717604A (en
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徐辰二
翁智偉
胡朝彰
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台灣東電化股份有限公司
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Abstract

本揭露提供一種攝影模組。攝影模組包括複數個影像擷取組件配置用於接收並感測通過多個光導入孔之光線。每一影像擷取組件包括一鏡頭單元及一電磁控制單元。電磁控制單元內具有磁性元件以控制鏡頭單元之位移。二個相異影像擷取組件間最相鄰之二個磁性元件之距離,係大於上述二個相異影像擷取組件分別對應之光導入孔間之距離。 The present disclosure provides a photography module. The photographic module includes a plurality of image capture assemblies configured to receive and sense light passing through the plurality of light introduction apertures. Each image capturing component includes a lens unit and an electromagnetic control unit. The electromagnetic control unit has magnetic elements therein to control the displacement of the lens unit. The distance between the two adjacent magnetic elements of the two different image capturing components is greater than the distance between the light introducing holes respectively corresponding to the two different image capturing components.

Description

電子裝置及其攝影模組 Electronic device and its photography module

本揭露係關於一種攝影模組,特別係關於一種具有多個鏡頭單元之攝影模組。 The present disclosure relates to a photographic module, and more particularly to a photographic module having a plurality of lens units.

傳統的3D攝影/立體攝影是透過雙鏡頭間以特定之間距、平行度、以及相同之旋轉/傾斜角度(即相同之光軸方向)的情況下進行拍攝,並將拍攝所得之影像以特殊顯示裝置(例如3D眼鏡)分別傳導至人的左右眼以獲得立體感的一種技術。 Traditional 3D photography/stereo photography is performed by using a specific distance, parallelism, and the same rotation/tilt angle (ie, the same optical axis direction) between the two lenses, and the captured image is displayed in a special display. A technique in which devices (for example, 3D glasses) are respectively conducted to the left and right eyes of a person to obtain a stereoscopic effect.

一般而言,當雙鏡頭兩者間的相對距離增加時,由於二個鏡頭各自拍攝的影像存有較大差異,後端系統需花費較常的時間進行處理影像,且較無法獲得理想的成像品質。相反地,當雙鏡頭之間的相對距離減少時,由於二個鏡頭各自拍攝的影像將越相似,在不同影像間進行對焦的時間將隨之減少,也可藉此獲得較清晰的影像。然而,對於搭配有雙鏡頭的攝影模組而言,過度降低雙鏡頭間的間距,將導致雙鏡頭間因磁力干擾而無法正常作動(例如:防手震功能失效)。因此,如何維持雙鏡頭間理想的間距且不造成設計失效,即成為目前業界亟需解決的課題之一。 In general, when the relative distance between the two lenses increases, because the images captured by the two lenses are greatly different, the back-end system takes more time to process the image, and the ideal image is not obtained. quality. Conversely, when the relative distance between the two lenses is reduced, the more similar the images will be captured by the two lenses, the less time will be spent focusing between the different images, and the clearer images will be obtained. However, for a camera module with a dual lens, excessively reducing the spacing between the two lenses will cause the two lenses to malfunction due to magnetic interference (for example, the anti-shake function is disabled). Therefore, how to maintain the ideal spacing between the two lenses without causing design failure is one of the problems that the industry needs to solve.

有鑑於上述習知技藝之問題,本發明之目的在於提供一種具有至少二個影像擷取組件之攝影模組。影像擷取組件在適當的間距下正常運作,並具有快速合成3D影像/立體影像的能力,以解決習知3D攝影/立體攝影模組的問題。 In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a photographic module having at least two image capture assemblies. The image capture component operates normally at appropriate intervals and has the ability to quickly synthesize 3D images/stereoscopic images to solve the problems of conventional 3D photography/stereo photography modules.

根據本揭露之部分實施例,攝影模組係適用於接收並感測通過複數個光導入孔之光線。攝影模組包括複數個影像擷取組件。影像擷取組件分別配置用於接收並感測通過光導入孔之一之光線,且分別包括一鏡頭單元及一感光元件。其中,前述影像擷組件包含一第一影像擷取組件以及一第二影像擷取組件,且第一影像擷取組件之感光元件所位於之平面與該第二影像擷取組件之感光元件所位於之平面不平行。 According to some embodiments of the present disclosure, the photographic module is adapted to receive and sense light rays passing through a plurality of light introduction holes. The photography module includes a plurality of image capturing components. The image capturing components are respectively configured to receive and sense light passing through one of the light introducing holes, and respectively comprise a lens unit and a photosensitive element. The image capturing unit includes a first image capturing component and a second image capturing component, and the photosensitive element of the first image capturing component is located on a plane and the photosensitive component of the second image capturing component is located. The planes are not parallel.

又,於一實施例中,前述第一、第二影像擷取組件之感光元件係配置為面朝相反方向且位於該等光導入孔的相反側。 Moreover, in an embodiment, the photosensitive elements of the first and second image capturing assemblies are disposed to face in opposite directions and on opposite sides of the light introducing holes.

1a、1b、1c‧‧‧電子裝置 1a, 1b, 1c‧‧‧ electronic devices

10a、10b、10c‧‧‧攝影模組 10a, 10b, 10c‧‧‧ photography module

20‧‧‧影像擷取組件(第一影像擷取組件) 20‧‧‧Image capture component (first image capture component)

21‧‧‧殼體 21‧‧‧ housing

211‧‧‧開口 211‧‧‧ openings

22‧‧‧鏡頭承載單元 22‧‧‧Lens carrier unit

23‧‧‧鏡頭單元(第一鏡頭單元) 23‧‧‧Lens unit (first lens unit)

24‧‧‧感光元件(第一感光元件) 24‧‧‧Photosensitive element (first photosensitive element)

25‧‧‧防震電磁控制單元(第一電磁控制單元) 25‧‧‧Anti-seismic electromagnetic control unit (first electromagnetic control unit)

261、263‧‧‧Y軸磁鐵驅動線圈(第一線圈) 261, 263‧‧‧Y-axis magnet drive coil (first coil)

262、264‧‧‧Z軸磁鐵驅動線圈 262, 264‧‧‧Z-axis magnet drive coil

271、273‧‧‧Y軸磁性元件(第一磁性元件) 271, 273‧‧‧Y-axis magnetic components (first magnetic components)

272、274‧‧‧Z軸磁性元件 272, 274‧‧‧Z-axis magnetic components

30‧‧‧影像擷取組件(第二影像擷取組件) 30‧‧‧Image capture component (second image capture component)

31‧‧‧殼體 31‧‧‧Shell

311‧‧‧開口 311‧‧‧ openings

313‧‧‧上殼件 313‧‧‧Upper case

315‧‧‧下殼件 315‧‧‧ Lower case

32‧‧‧鏡頭承載單元 32‧‧‧Lens carrier unit

33‧‧‧鏡頭單元(第二鏡頭單元) 33‧‧‧Lens unit (second lens unit)

34‧‧‧感光元件(第二感光元件) 34‧‧‧Photosensitive element (second photosensitive element)

35‧‧‧電磁控制單元(第二電磁控制單元) 35‧‧‧Electromagnetic control unit (second electromagnetic control unit)

351‧‧‧線圈(第二線圈) 351‧‧‧ coil (second coil)

352‧‧‧磁性元件(第二磁性元件) 352‧‧‧Magnetic components (second magnetic components)

40a、40b‧‧‧光導引組件 40a, 40b‧‧‧Light guiding components

401a‧‧‧反射/折射表面 401a‧‧‧Reflective/refractive surface

41b‧‧‧基座 41b‧‧‧Base

411b‧‧‧第一側邊 411b‧‧‧ first side

412b‧‧‧第二側邊 412b‧‧‧ second side

42b‧‧‧光路控制單元 42b‧‧‧Light path control unit

421b‧‧‧第一光導引元件 421b‧‧‧First light guiding element

422b‧‧‧第二光導引元件 422b‧‧‧Second light guiding element

43b‧‧‧切換單元 43b‧‧‧Switch unit

5a、5b、5c‧‧‧殼體 5a, 5b, 5c‧‧‧ shell

51a、51b、51c‧‧‧第一表面 51a, 51b, 51c‧‧‧ first surface

511a、511b、511c‧‧‧光導入孔(第一光導引孔) 511a, 511b, 511c‧‧‧ light introduction hole (first light guiding hole)

512a、512b、512c‧‧‧光導入孔(第二光導引孔) 512a, 512b, 512c‧‧‧ light introduction hole (second light guiding hole)

52a、52b、52c‧‧‧第二表面 52a, 52b, 52c‧‧‧ second surface

521b、521c‧‧‧光導入孔 521b, 521c‧‧‧ light introduction hole

522c‧‧‧光導入孔 522c‧‧‧Light introduction hole

L1、L2、L3、L4‧‧‧光線 L1, L2, L3, L4‧‧‧ rays

O1‧‧‧光軸 O1‧‧‧ optical axis

O2‧‧‧光軸 O2‧‧‧ optical axis

P‧‧‧轉軸 P‧‧‧ shaft

D1、D2、D2、D4、D5、D6‧‧‧距離 D1, D2, D2, D4, D5, D6‧‧‧ distance

第1圖顯示本揭露之部分實施例之電子裝置之示意圖。 FIG. 1 is a schematic diagram showing an electronic device of some embodiments of the present disclosure.

第2圖顯示本揭露之部分實施例之攝影模組之示意圖。 Figure 2 is a schematic view showing a photographic module of some embodiments of the present disclosure.

第3圖顯示本揭露之部分實施例之攝影模組之部分元件之示意圖。 Figure 3 is a block diagram showing some of the components of the photographic module of some embodiments of the present disclosure.

第4圖顯示本揭露之部分實施例之攝影模組之部分元件之示意圖。 Figure 4 is a block diagram showing some of the components of the photographic module of some embodiments of the present disclosure.

第5圖顯示本揭露之部分實施例之攝影模組之部分元件相對光導入孔之示意圖。 FIG. 5 is a schematic view showing a part of components of the photographic module of the embodiment of the present disclosure with respect to the light introduction hole.

第6圖顯示本揭露之部分實施例之電子裝置之示意圖。 Figure 6 is a diagram showing an electronic device of some embodiments of the present disclosure.

第7圖顯示本揭露之部分實施例之攝影模組之示意圖。 Figure 7 is a schematic view showing a photographic module of some embodiments of the present disclosure.

第8圖顯示本揭露之部分實施例之攝影模組之部分元件相對光導入孔之示意圖。 FIG. 8 is a schematic view showing a part of components of the photographic module of the embodiment of the present disclosure with respect to the light introduction hole.

第9圖顯示本揭露之部分實施例之電子裝置之示意圖。 Figure 9 is a diagram showing an electronic device of some embodiments of the present disclosure.

第10圖顯示本揭露之部分實施例之攝影模組之示意圖。 Figure 10 is a schematic illustration of a photographic module of some embodiments of the present disclosure.

第11圖顯示本揭露之部分實施例之攝影模組之部分元件相對光導入孔之示意圖。 FIG. 11 is a schematic view showing a part of components of the photographic module of the embodiment of the present disclosure with respect to the light introduction hole.

第12圖顯示本揭露之部分實施例之防震電磁控制單元於不同動作位置時受另一影像擷取組件之磁性元件之干擾程度之圖表。 Figure 12 is a graph showing the degree of interference of the anti-vibration electromagnetic control unit of the embodiment of the present disclosure with the magnetic components of another image capturing component at different operating positions.

為了讓本揭露之目的、特徵、及優點能更明顯易懂,下文特舉實施例,並配合所附圖示做詳細說明。其中,實施例中的各元件之配置係為說明之用,並非用以限制本揭露。且實施例中圖式標號之部分重複,係為了簡化說明,並非意指不同實施例之間的關聯性。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本揭露。 In order to make the objects, features, and advantages of the present disclosure more apparent, the embodiments are described in detail below. The configuration of the components in the embodiments is for illustrative purposes, and is not intended to limit the disclosure. The overlapping portions of the drawings in the embodiments are for the purpose of simplifying the description and are not intended to be related to the different embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional term used is used to describe that it is not intended to limit the disclosure.

必需了解的是,為特別描述或圖示之元件可以此技術人士所熟知之各種形式存在。此外,當某層在其它層或基板「上」 時,有可能是指「直接」在其它層或基板上,或指某層在其它層或基板上,或指其它層或基板之間夾設其它層。 It is to be understood that the elements specifically described or illustrated may be in various forms well known to those skilled in the art. In addition, when a layer is "on" another layer or substrate It may be referred to as being "directly" on another layer or substrate, or by referring to a layer on another layer or substrate, or by interposing other layers between other layers or substrates.

此外,實施例中可能使用相對性的用語,例如「較低」或「底部」及「較高」或「頂部」,以描述圖示的一個元件對於另一元件的相對關係。能理解的是,如果將圖示的裝置翻轉使其上下顛倒,則所敘述在「較低」側的元件將會成為在「較高」側的元件。 In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another. It will be understood that if the illustrated device is flipped upside down, the component described on the "lower" side will be the component on the "higher" side.

在此,「約」、「大約」之用語通常表示在一給定值或範圍的20%之內,較佳是10%之內,且更佳是5%之內。在此給定的數量為大約的數量,意即在沒有特定說明的情況下,仍可隱含「約」、「大約」之含義。 Here, the terms "about" and "about" are usually expressed within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, meaning that the meaning of "about" or "about" may be implied without specific explanation.

第1圖顯示本揭露之部分實施例之攝影模組10a應用於一電子裝置1a之示意圖。電子裝置1a可為一手持式電子裝置(例如:手機、平板電腦、筆記型電腦)。或者,電子裝置1a可為一穿戴式電子裝置(例如:手錶)。或者,電子裝置1a可為一車用型電子裝置(例如:行車記錄器)。 FIG. 1 is a schematic diagram showing the application of the camera module 10a of some embodiments of the present disclosure to an electronic device 1a. The electronic device 1a can be a handheld electronic device (for example, a mobile phone, a tablet computer, a notebook computer). Alternatively, the electronic device 1a may be a wearable electronic device (for example, a watch). Alternatively, the electronic device 1a may be a vehicle type electronic device (for example, a driving recorder).

根據本發明之部分實施例,電子裝置1a包括一殼體5a及攝影模組10a。攝影模組10a相對形成於殼體5a上之光導入孔設置於殼體5a內部,以執行3D攝影/立體攝影。舉例而言,如第1圖所示,殼體5a具有一第一表面51a及一相對第一表面51a的第二表面52a。二個光導入孔,例如:光導入孔511a、512a(第一、第二光導入孔),形成於第一表面51a上。二個光導入孔511a、512a定義二 個通道以允許光線L1、L2進入殼體5a。攝影模組10a相對形成於殼體5a上之光導入孔511a、512a設置於殼體5a內部,以接收並感測光線L1、L2。 According to some embodiments of the present invention, the electronic device 1a includes a housing 5a and a camera module 10a. The photo module 10a is disposed inside the casing 5a with respect to the light introduction hole formed in the casing 5a to perform 3D photography/stereo photography. For example, as shown in FIG. 1, the housing 5a has a first surface 51a and a second surface 52a opposite to the first surface 51a. Two light introducing holes, for example, light introducing holes 511a and 512a (first and second light introducing holes), are formed on the first surface 51a. Two light introduction holes 511a, 512a define two The channels allow the light rays L1, L2 to enter the housing 5a. The photo module 10a is disposed inside the casing 5a with respect to the light introducing holes 511a, 512a formed on the casing 5a to receive and sense the light rays L1, L2.

在部分實施例中,二個光導入孔511a、512a皆為圓形之穿孔且具有相同的孔徑,但本揭露並不僅此為限。二個光導入孔511a、512a之孔徑及形狀可依照需求進行改變。在部分實施例中,二個光導入孔511a、512a具有相異的孔徑及形狀。在部分實施例中,二個光導入孔511a、512a彼此相隔一間距並不連通。在部分實施例中,二個光導入孔511a、512a之實質中心之間距小於10mm。 In some embodiments, the two light-introducing holes 511a, 512a are circular perforations and have the same aperture, but the disclosure is not limited thereto. The apertures and shapes of the two light introducing holes 511a, 512a can be changed as needed. In some embodiments, the two light introducing holes 511a, 512a have different apertures and shapes. In some embodiments, the two light introducing holes 511a, 512a are not connected to each other at a pitch. In some embodiments, the distance between the substantial centers of the two light introducing holes 511a, 512a is less than 10 mm.

應當理解的是,形成在殼體5a上之光導入孔的數量不應受上述實施例所限制。在部分實施例中,殼體5a單一表面上具有三個(或三個以上)光導入孔,以獲得期望之特定影像。在部分實施例中,殼體5a省略設置,並且攝影模組10a上定義有多個光導入孔,攝影模組10a接收並感測通過該等光導入孔之光線。關於此特徵將於後方內容進一步進行說明。 It should be understood that the number of light introducing holes formed in the casing 5a should not be limited by the above embodiment. In some embodiments, the housing 5a has three (or more than three) light directing apertures on a single surface to achieve a particular image desired. In some embodiments, the housing 5a is omitted, and a plurality of light-introducing holes are defined in the camera module 10a, and the camera module 10a receives and senses light passing through the light-introducing holes. This feature will be further explained in the following.

參照第2圖,根據本發明之部分實施例,攝影模組10a包括複數個影像擷取組件,用於接收並感測通過殼體5a上對應之光導入孔之光線。舉例而言,攝影模組10a包括二個影像擷取組件,例如影像擷取組件20、30。影像擷取組件20係配置用於接收並感測通過殼體5a之光導入孔511a(第1圖)之光線L1。並且,影像擷取組件30係配置用於接收並感測通過殼體5a之光導入孔512a (第1圖)之光線L2。為方便說明,在第1-5圖的實施例中,影像擷取組件20稱作第一影像擷取組件,且影像擷取組件30稱作第二影像擷取組件。 Referring to FIG. 2, in accordance with some embodiments of the present invention, the camera module 10a includes a plurality of image capture assemblies for receiving and sensing light rays passing through corresponding light introduction holes in the housing 5a. For example, the camera module 10a includes two image capturing components, such as image capturing components 20, 30. The image capturing unit 20 is configured to receive and sense the light L1 passing through the light introducing hole 511a (Fig. 1) of the casing 5a. Moreover, the image capturing component 30 is configured to receive and sense the light introduction hole 512a through the housing 5a. (Fig. 1) Light L2. For convenience of description, in the embodiment of FIGS. 1-5, the image capturing component 20 is referred to as a first image capturing component, and the image capturing component 30 is referred to as a second image capturing component.

參照第3圖,在部分實施例中,第一影像擷取組件20包括一殼體21、一鏡頭承載單元22、一鏡頭單元23(第一鏡頭單元)、一感光元件24(第一感光元件)、及至少一電磁控制單元。殼體21定義一容置空間,且具有一開口211(第2圖)形成於其前端表面。在部分實施例中,鏡頭承載單元22、鏡頭單元23、感光元件24、及電磁控制單元皆設置於殼體21所定義之容置空間內。 Referring to FIG. 3, in some embodiments, the first image capturing assembly 20 includes a housing 21, a lens carrying unit 22, a lens unit 23 (first lens unit), and a photosensitive element 24 (first photosensitive element). And at least one electromagnetic control unit. The housing 21 defines an accommodation space and has an opening 211 (Fig. 2) formed on the front end surface thereof. In some embodiments, the lens carrying unit 22, the lens unit 23, the photosensitive element 24, and the electromagnetic control unit are all disposed in the accommodating space defined by the housing 21.

在部分實施例中,鏡頭承載單元22係以可相對感光元件24移動的方式設置於殼體21內部。舉例而言,鏡頭承載單元22係透過可撓的鋼絲(圖未示)懸吊於殼體21內部。 In some embodiments, the lens carrying unit 22 is disposed inside the housing 21 in such a manner as to be movable relative to the photosensitive member 24. For example, the lens carrying unit 22 is suspended inside the casing 21 through a flexible steel wire (not shown).

鏡頭承載單元22係配置用於承載鏡頭單元23。在部分實施例中,鏡頭承載單元22相對開口211(第2圖)定義一通道。鏡頭單元23設置於鏡頭承載單元22之通道內,使鏡頭單元23的光軸O1平行第2、3圖所示之X軸(第一軸)並通過開口211。感光元件24設置於鏡頭單元23後方。在第一影像擷取組件20擷取影像時,來自開口211的光線首先由鏡頭單元23所接收,並沿鏡頭單元23的光軸O1前進,隨後射向感光元件24。感光元件24感測光線後發出電子訊號,以產生影像。感光元件24可包含由例如電荷耦合元件(CCD)或是互補金屬氧化物半導體(CMOS)所構成的影像感測器。 The lens carrying unit 22 is configured to carry the lens unit 23. In some embodiments, lens carrier unit 22 defines a channel relative to opening 211 (Fig. 2). The lens unit 23 is disposed in the passage of the lens carrying unit 22 such that the optical axis O1 of the lens unit 23 is parallel to the X-axis (first axis) shown in FIGS. 2 and 3 and passes through the opening 211. The photosensitive element 24 is disposed behind the lens unit 23. When the first image capturing component 20 captures the image, the light from the opening 211 is first received by the lens unit 23, and proceeds along the optical axis O1 of the lens unit 23, and then is directed toward the photosensitive element 24. The photosensitive element 24 senses the light and emits an electronic signal to generate an image. The photosensitive element 24 may include an image sensor composed of, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

在部分實施例中,第一影像擷取組件20的電磁控制單元之一者為一防震電磁控制單元25(第一電磁控制單元)。防震電磁控制單元25配置用於控制鏡頭承載單元22在垂直光軸O1方向(第3圖所示Y軸及Z軸方向)上之位移,以達到防手震且獲取較佳影像之目的。 In some embodiments, one of the electromagnetic control units of the first image capturing assembly 20 is a shockproof electromagnetic control unit 25 (first electromagnetic control unit). The anti-vibration electromagnetic control unit 25 is configured to control the displacement of the lens carrying unit 22 in the direction of the vertical optical axis O1 (the Y-axis and the Z-axis direction shown in FIG. 3) to achieve anti-shake and obtain a better image.

在部分實施例中,防震電磁控制單元25包括一光學影像穩定(OIS)致動器、及位移感測器(圖未示)。光學影像穩定致動器由二個Y軸磁性元件271、273(第一磁性元件)、二個Z軸磁性元件272、274、二個Y軸磁鐵驅動線圈261、263(第一線圈)、及二個Z軸磁鐵驅動線圈262、264所構成。在部分實施例中,如第3圖所示,二個Y軸磁性元件271、273設置於殼體21之內側表面,且彼此相對。二個Y軸磁鐵驅動線圈261、263分別相對二個Y軸磁性元件271、273設置於鏡頭承載單元22之相對二側。另一方面,二個Z軸磁性元件272、274設置於殼體21之內側表面,且彼此相對。二個Z軸磁鐵驅動線圈262、264分別相對二個Z軸磁性元件272、274設置於鏡頭承載單元22之相對二側。 In some embodiments, the anti-vibration electromagnetic control unit 25 includes an optical image stabilization (OIS) actuator and a displacement sensor (not shown). The optical image stabilization actuator comprises two Y-axis magnetic elements 271, 273 (first magnetic element), two Z-axis magnetic elements 272, 274, two Y-axis magnet drive coils 261, 263 (first coil), and Two Z-axis magnet drive coils 262, 264 are formed. In some embodiments, as shown in FIG. 3, the two Y-axis magnetic members 271, 273 are disposed on the inner side surface of the casing 21 and opposed to each other. The two Y-axis magnet drive coils 261 and 263 are respectively disposed on opposite sides of the lens carrying unit 22 with respect to the two Y-axis magnetic elements 271 and 273. On the other hand, the two Z-axis magnetic members 272, 274 are disposed on the inner side surface of the casing 21 and opposed to each other. The two Z-axis magnet drive coils 262 and 264 are respectively disposed on opposite sides of the lens carrying unit 22 with respect to the two Z-axis magnetic elements 272 and 274.

在部分實施例中,防震電磁控制單元25之位移感測器設置於承載單元22上且相對二個Y軸磁性元件271、273、二個Z軸磁性元件272、274。位移感測器藉由偵測磁場變化判斷承載單元22於Y軸(第二軸)與Z軸上的偏移量,並根據偵測結果發出電子訊號。攝影模組10a之控制器(圖未示)根據位移感測器提供之電子訊號,提供二個Y軸磁鐵驅動線圈261、263、及二個Z軸磁鐵驅 動線圈262、264電流,以驅動一相對應之補償運動。二個Y軸磁性元件271、273與二個Z軸磁性元件272、274可為磁鐵或軛鐵。 In some embodiments, the displacement sensor of the anti-vibration electromagnetic control unit 25 is disposed on the carrier unit 22 and opposite to the two Y-axis magnetic elements 271, 273 and the two Z-axis magnetic elements 272, 274. The displacement sensor determines the offset of the carrier unit 22 on the Y-axis (second axis) from the Z-axis by detecting the change of the magnetic field, and sends an electronic signal according to the detection result. The controller (not shown) of the photography module 10a provides two Y-axis magnet drive coils 261, 263 and two Z-axis magnet drives according to the electronic signals provided by the displacement sensor. The coils 262, 264 are energized to drive a corresponding compensation motion. The two Y-axis magnetic elements 271, 273 and the two Z-axis magnetic elements 272, 274 can be magnets or yokes.

在部分實施例中,第一影像擷取組件20的電磁控制單元之一者為一變焦電磁控制單元(圖未示)。變焦電磁控制單元包括一馬達與鏡頭承載單元22共構配置,以驅動鏡頭單元23沿光軸O1方向的線性移動。於是,鏡頭單元23相對於感光元件24之位置可以進行變動,進而達到變焦與對焦之目的。變焦電磁控制單元之馬達可為音圈馬達(Voice Coil Motor)或步進馬達。 In some embodiments, one of the electromagnetic control units of the first image capturing component 20 is a zoom electromagnetic control unit (not shown). The zoom electromagnetic control unit includes a motor co-configured with the lens carrying unit 22 to drive linear movement of the lens unit 23 in the optical axis O1 direction. Thus, the position of the lens unit 23 relative to the photosensitive element 24 can be varied to achieve the purpose of zooming and focusing. The motor of the zoom electromagnetic control unit can be a voice coil motor (Voice Coil Motor) or a stepping motor.

參照第4圖,根據本發明的部份實施例,第二影像擷取組件30包括一殼體31、一鏡頭承載單元32、一鏡頭單元33(第二鏡頭單元)、一感光元件34(第二感光元件)、及一電磁控制單元35(第二電磁控制單元)。殼體31定義一容置空間,且具有一開口311形成於其前端表面。在部分實施例中,鏡頭承載單元32、鏡頭單元33、感光元件34、及電磁控制單元35皆設置於殼體31所定義之容置空間內。 Referring to FIG. 4, in accordance with some embodiments of the present invention, the second image capturing assembly 30 includes a housing 31, a lens carrying unit 32, a lens unit 33 (second lens unit), and a photosensitive element 34. Two photosensitive elements), and an electromagnetic control unit 35 (second electromagnetic control unit). The housing 31 defines an accommodation space and has an opening 311 formed on a front end surface thereof. In some embodiments, the lens carrying unit 32, the lens unit 33, the photosensitive element 34, and the electromagnetic control unit 35 are all disposed in the accommodating space defined by the housing 31.

在部分實施例中,鏡頭承載單元32係以可相對感光元件34移動的方式設置於殼體31內部。舉例而言,鏡頭承載單元32利用二個彈片36、37固定於殼體31內。 In some embodiments, the lens carrying unit 32 is disposed inside the housing 31 in such a manner as to be movable relative to the photosensitive member 34. For example, the lens carrying unit 32 is fixed in the housing 31 by using two elastic pieces 36, 37.

鏡頭承載單元32係配置用於承載鏡頭單元33。在部分實施例中,鏡頭承載單元32相對開口311(第2圖)定義一通道。鏡頭單元33設置於鏡頭承載單元32之通道內,使鏡頭單元33的光軸O2平行第2、4圖所示之Y軸並通過開口311。感光元件34設置於 鏡頭單元33後方。在第二影像擷取組件30擷取影像時,來自開口311的光線首先由鏡頭單元33所接收,並沿鏡頭單元33的光軸O2前進,隨後射向感光元件34。感光元件34感測光線後發出電子訊號,以產生影像。感光元件34可包含由例如電荷耦合元件(CCD)或是互補金屬氧化物半導體(CMOS)等感光元件所構成的影像感測器。 The lens carrying unit 32 is configured to carry the lens unit 33. In some embodiments, lens carrier unit 32 defines a channel relative to opening 311 (Fig. 2). The lens unit 33 is disposed in the passage of the lens carrying unit 32 such that the optical axis O2 of the lens unit 33 is parallel to the Y-axis shown in FIGS. 2 and 4 and passes through the opening 311. Photosensitive element 34 is disposed at The rear of the lens unit 33. When the second image capturing unit 30 captures the image, the light from the opening 311 is first received by the lens unit 33, and proceeds along the optical axis O2 of the lens unit 33, and then is directed toward the photosensitive element 34. The photosensitive element 34 senses the light and emits an electronic signal to generate an image. The photosensitive element 34 may include an image sensor composed of a photosensitive element such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

值得注意的是,在部分實施例中,第一影像擷取組件20之感光元件24與第二影像擷取組件30之感光元件34係設置於相異平面。舉例而言,如第5圖所示,第一影像擷取組件20之感光元件24所位於之平面係垂直於第二影像擷取組件30之感光元件34所位於之平面。 It should be noted that in some embodiments, the photosensitive element 24 of the first image capturing component 20 and the photosensitive element 34 of the second image capturing component 30 are disposed on different planes. For example, as shown in FIG. 5, the plane of the photosensitive element 24 of the first image capturing component 20 is perpendicular to the plane of the photosensitive element 34 of the second image capturing component 30.

再次參照第4圖,在部分實施例中,第二影像擷取組件30的電磁控制單元35為一音圈馬達(Voice Coil Motor)。音圈馬達包括一線圈351(第二線圈)及一磁性元件352(第二磁性元件)。一線圈351設置於殼體31之上殼件313。磁性元件352相對線圈351設置於鏡頭承載單元32之上側面321。第二影像擷取組件30作動時,攝影模組10a之控制器(圖未示)發出電流至線圈351,以驅動鏡頭單元33沿光軸O2方向的線性移動。於是,鏡頭單元33相對於感光元件34之位置可以進行變動,進而達到變焦與對焦之目的。磁性元件352可為磁鐵或或軛鐵。 Referring again to FIG. 4, in some embodiments, the electromagnetic control unit 35 of the second image capture assembly 30 is a voice coil motor (Voice Coil Motor). The voice coil motor includes a coil 351 (second coil) and a magnetic element 352 (second magnetic element). A coil 351 is disposed on the housing member 313 above the housing 31. The magnetic element 352 is disposed on the upper side 321 of the lens carrying unit 32 with respect to the coil 351. When the second image capturing unit 30 is actuated, the controller (not shown) of the camera module 10a sends a current to the coil 351 to drive the linear movement of the lens unit 33 in the optical axis O2 direction. Thus, the position of the lens unit 33 relative to the photosensitive element 34 can be varied to achieve the purpose of zooming and focusing. Magnetic element 352 can be a magnet or a yoke.

參照第2圖,在部分實施例中,攝影模組10a更包括一光導引組件40a。光導引組件40a相鄰影像擷取組件30並設置於影 像擷取組件20、30之間。光導引組件40a係配置用於導引通過光導入孔512a之光線進入影像擷取組件30中。在部分實施例中,光導引組件40a具有一反射/折射表面401a相對光導入孔512a呈一夾角(例如:45度)並直接面向光導入孔512a,上述反射/折射表面401a係配置用於將沿第2圖所示之X軸方向行進之光線L2導向平行於鏡頭單元33之光軸O2(第4圖)方向前進。光導引組件40a可為稜鏡、反射鏡、或折射鏡。 Referring to FIG. 2, in some embodiments, the camera module 10a further includes a light guiding assembly 40a. The light guiding component 40a is adjacent to the image capturing component 30 and disposed in the shadow Like between the capture components 20, 30. The light guiding component 40a is configured to guide light entering through the light introducing hole 512a into the image capturing assembly 30. In some embodiments, the light guiding component 40a has a reflecting/refractive surface 401a at an angle (for example, 45 degrees) with respect to the light introducing hole 512a and directly facing the light introducing hole 512a, and the reflecting/refractive surface 401a is configured for The light ray L2 traveling in the X-axis direction shown in Fig. 2 is guided in a direction parallel to the optical axis O2 (Fig. 4) of the lens unit 33. The light guiding assembly 40a can be a cymbal, a mirror, or a refractor.

在部分實施例中,光導引組件40a省略設置,影像擷取組件30包括一或多個光學元件(例如:稜鏡、反射鏡)。上述光學元件配置用於將沿第2圖所示之X軸方向行進之光線L2導向平行於鏡頭單元33之光軸O2(第4圖)方向前進。上述光學元件可設置於影像擷取組件的殼體內。在此情況下,第二影像擷取組件的殼體的開口所位於之平面係平行於殼體21的開口211所位於之平面。於是,第一影像擷取組件20的開口211以及第二影像擷取組件30的開口作為光導入孔。攝影模組接收並感測通過該二個光導入孔之光線。 In some embodiments, the light guiding assembly 40a is omitted from arrangement, and the image capturing assembly 30 includes one or more optical elements (eg, 稜鏡, mirrors). The optical element is arranged to guide the light ray L2 traveling in the X-axis direction shown in Fig. 2 to be parallel to the optical axis O2 (Fig. 4) of the lens unit 33. The optical component can be disposed in a housing of the image capture assembly. In this case, the plane in which the opening of the housing of the second image capturing assembly is located is parallel to the plane in which the opening 211 of the housing 21 is located. Thus, the opening 211 of the first image capturing unit 20 and the opening of the second image capturing unit 30 serve as light introducing holes. The photographic module receives and senses light passing through the two light introduction holes.

如第5圖所示,在部分實施例中,第一、二影像擷取組件20、30間之最相鄰之二個磁性元件271、352間之距離D2,係大於第一、二影像擷取組件20、30所分別對應之光導入孔511a、512a間之距離D1。如此一來,在維持第一影像擷取組件20的防震電磁控制單元25正常作動的情況下,二個光導入孔511a、512a間的間距可進一步減少,進而提升攝影模組10a在3D攝影/立體攝影 的影像品質及影像處理速度。 As shown in FIG. 5, in some embodiments, the distance D2 between the two adjacent magnetic elements 271 and 352 between the first and second image capturing components 20 and 30 is greater than the first and second images. The distance D1 between the light-introducing holes 511a and 512a corresponding to the components 20 and 30 is taken. In this way, when the anti-vibration electromagnetic control unit 25 of the first image capturing unit 20 is normally operated, the spacing between the two light-introducing holes 511a and 512a can be further reduced, thereby improving the photography module 10a in 3D photography/ Stereo photography Image quality and image processing speed.

表(一)顯示根據本揭露之部分實施例在二個光導入孔511a、512a之距離小於10mm之情況下,且防震電磁控制單元25維持正常作動,防震電磁控制單元25之各磁性元件271、272、273、274之中心與第二影像擷取組件30之磁性元件352之中心間之配置距離。表(一)中距離單位為公釐(mm)。應當理解的是,表(一)僅為一示範性實施例,本揭露並不僅此為限。 Table (1) shows that in the case where the distance between the two light introducing holes 511a, 512a is less than 10 mm according to some embodiments of the present disclosure, and the anti-vibration electromagnetic control unit 25 maintains normal operation, the magnetic elements 271 of the anti-vibration electromagnetic control unit 25, The arrangement distance between the center of 272, 273, 274 and the center of the magnetic element 352 of the second image capture assembly 30. The distance unit in Table (1) is mm (mm). It should be understood that Table (1) is merely an exemplary embodiment, and the disclosure is not limited thereto.

第6圖顯示本揭露之部分實施例之攝影模組10b應用於一電子裝置1b之示意圖。電子裝置1b可為一手持式電子裝置(例如:手機、平板電腦、筆記型電腦)。或者,電子裝置1b可為一穿戴式電子裝置(例如:手錶)。或者,電子裝置1a可為一車用型電子裝置(例如:行車記錄器)。 FIG. 6 is a schematic diagram showing the application of the camera module 10b of some embodiments of the present disclosure to an electronic device 1b. The electronic device 1b can be a handheld electronic device (for example, a mobile phone, a tablet computer, a notebook computer). Alternatively, the electronic device 1b can be a wearable electronic device (eg, a watch). Alternatively, the electronic device 1a may be a vehicle type electronic device (for example, a driving recorder).

根據本發明之部分實施例,電子裝置1b包括一殼體5b及攝影模組10b。攝影模組10b相對形成於殼體5b上之光導入孔設置於殼體5b內部,以執行3D攝影/立體攝影或2D攝影。舉例而言,如第6圖所示,殼體5b具有一第一表面51b及一相對第一表面51b 的第二表面52b。二個光導入孔,例如:光導入孔511b、512b(第一、第二光導入孔),形成於第一表面51b上。並且,一個光導入孔,例如:光導入孔521b,形成於第二表面52b上。光導入孔511b、512b、521b定義三個通道以允許光線L1、L2、L3進入殼體5b。攝影模組10b相對形成於殼體5b上之光導入孔511b、512b、521b設置於殼體5b內部,以接收並感測光線L1、L2、L3。 According to some embodiments of the present invention, the electronic device 1b includes a housing 5b and a camera module 10b. The photo module 10b is disposed inside the casing 5b with respect to the light introducing hole formed in the casing 5b to perform 3D photography/stereo photography or 2D photography. For example, as shown in FIG. 6, the housing 5b has a first surface 51b and an opposite first surface 51b. The second surface 52b. Two light introducing holes, for example, light introducing holes 511b and 512b (first and second light introducing holes), are formed on the first surface 51b. Further, a light introducing hole, for example, a light introducing hole 521b, is formed on the second surface 52b. The light introducing holes 511b, 512b, 521b define three passages to allow the light rays L1, L2, L3 to enter the casing 5b. The photo module 10b is disposed inside the casing 5b with respect to the light introducing holes 511b, 512b, and 521b formed on the casing 5b to receive and sense the light beams L1, L2, and L3.

在部分實施例中,光導入孔511b、512b、521b皆為圓形之穿孔且具有相同的孔徑,但本揭露並不僅此為限。光導入孔511b、512b、521b之孔徑及形狀可依照需求進行改變。在部分實施例中,光導入孔511b、512b與光導入孔521b間具有相異的孔徑及形狀。在部分實施例中,二個光導入孔511b、512b彼此相隔一間距並不連通。在部分實施例中,二個光導入孔511b、512b之實質中心之間距小於10mm。 In some embodiments, the light introducing holes 511b, 512b, and 521b are all circular through holes and have the same aperture, but the disclosure is not limited thereto. The apertures and shapes of the light introducing holes 511b, 512b, and 521b can be changed as needed. In some embodiments, the light introduction holes 511b and 512b and the light introduction holes 521b have different apertures and shapes. In some embodiments, the two light introducing holes 511b, 512b are not connected to each other at a pitch. In some embodiments, the distance between the substantial centers of the two light introducing holes 511b, 512b is less than 10 mm.

第7圖顯示攝影模組10b之示意圖。在第7圖中,與第2圖之攝影模組10a相同或相似之元件將施予相同之標號,且其特徵將不再重複,以簡化說明。攝影模組10b與攝影模組10a之差異包括,攝影模組10a之光導引組件40a由光導引組件40b取代。 Fig. 7 shows a schematic view of the photographing module 10b. In the seventh embodiment, the same or similar elements as those of the photographic module 10a of Fig. 2 will be given the same reference numerals, and their features will not be repeated to simplify the description. The difference between the photography module 10b and the camera module 10a includes that the light guiding component 40a of the camera module 10a is replaced by the light guiding component 40b.

影像擷取組件20、30係配置用於接收並感測通過殼體5b上對應之光導入孔之光線。舉例而言,影像擷取組件20係配置用於接收並感測通過殼體5b之光導入孔511b(第6圖)之光線L1。並且,影像擷取組件30係配置用於接收並感測通過殼體5b之光導入孔512b(第6圖)之光線L2。或者,影像擷取組件30係配置用於 接收並感測通過殼體5b之光導入孔521b(第6圖)之光線L3。為方便說明,在第6-8圖的實施例中,影像擷取組件20稱作第一影像擷取組件,且影像擷取組件30稱作第二影像擷取組件。 The image capture assemblies 20, 30 are configured to receive and sense light rays passing through corresponding light introduction apertures in the housing 5b. For example, the image capturing component 20 is configured to receive and sense the light L1 passing through the light introduction hole 511b (FIG. 6) of the housing 5b. Further, the image capturing unit 30 is configured to receive and sense the light L2 passing through the light introducing hole 512b (Fig. 6) of the casing 5b. Alternatively, the image capture component 30 is configured for The light L3 passing through the light introduction hole 521b (Fig. 6) of the casing 5b is received and sensed. For convenience of description, in the embodiment of FIGS. 6-8, the image capturing component 20 is referred to as a first image capturing component, and the image capturing component 30 is referred to as a second image capturing component.

光導引組件40b係配置用於選擇性導引通過二個相對設置之光導入孔512b及光導入孔521b之光線L2、L3進入影像擷取組件30中。在部分實施例中,光導引組件40b包括一基座41b、一光路控制單元42b、及一切換單元43b。基座41b自一第一側邊411b延伸至一第二側邊412b。第一影像擷取組件20相鄰基座41b之第一側邊411b配置。第一影像擷取組件20可連結基座41b之第一側邊411b或與基座41b之第一側邊411b間隔一間距。第二影像擷取組件30係相鄰基座41b之第二側邊401b,並且第二影像擷取組件30透過下殼件315設置於基座41b之上。下殼件315與上殼件313分別位於第二影像擷取組件30之相反二側。 The light guiding component 40b is configured to selectively guide the light rays L2, L3 passing through the two oppositely disposed light introducing holes 512b and the light introducing holes 521b into the image capturing assembly 30. In some embodiments, the light guiding component 40b includes a base 41b, an optical path control unit 42b, and a switching unit 43b. The base 41b extends from a first side 411b to a second side 412b. The first image capturing assembly 20 is disposed adjacent to the first side 411b of the base 41b. The first image capturing assembly 20 can be coupled to the first side 411b of the base 41b or spaced apart from the first side 411b of the base 41b by a distance. The second image capturing component 30 is disposed on the second side 401b of the adjacent base 41b, and the second image capturing component 30 is disposed on the base 41b through the lower casing 315. The lower shell member 315 and the upper shell member 313 are respectively located on opposite sides of the second image capturing assembly 30.

光路控制單元42b位於第一影像擷取組件20與第二影像擷取組件30之間並設置於基座41b之上。光路控制單元42b係以可繞一轉軸P轉動的方式設置於基座41b之上。光路控制單元42b包括一第一光導引元件421b及一第二光導引元件422b。在部分實施例中,第一光導引元件421b與第二光導引元件422b各自包括一反射/折射表面彼此夾設一夾角。第一、二光導引元件421b、422b可為稜鏡、反射鏡、或折射鏡。 The optical path control unit 42b is located between the first image capturing component 20 and the second image capturing component 30 and disposed on the base 41b. The optical path control unit 42b is disposed above the base 41b so as to be rotatable about a rotation axis P. The optical path control unit 42b includes a first light guiding element 421b and a second light guiding element 422b. In some embodiments, the first light guiding element 421b and the second light guiding element 422b each include a reflection/refraction surface at an angle to each other. The first and second light guiding elements 421b, 422b may be turns, mirrors, or refractors.

切換單元43b設置於基座41b內部並配置用以驅動光路控制單元42b繞轉軸P轉動,以調整光路控制單元42b相對於光導 入孔512b、521b的旋轉角度。在部分實施例中,切換單元43b為一包括磁性元件(第三磁性元件)的電磁閥,但本揭露並不僅此為限。切換單元43b亦可為包括步進馬達、DC馬達等。 The switching unit 43b is disposed inside the base 41b and configured to drive the optical path control unit 42b to rotate about the rotation axis P to adjust the optical path control unit 42b relative to the light guide The angle of rotation of the entrance holes 512b, 521b. In some embodiments, the switching unit 43b is a solenoid valve including a magnetic element (third magnetic element), but the disclosure is not limited thereto. The switching unit 43b may also include a stepping motor, a DC motor, or the like.

切換單元43b可至少切換於二種狀態之下,以透過電磁感應來驅動光路控制單元42b繞轉軸P轉動。舉例而言,當切換單元43b在第一狀態下時,光路控制單元42b之第一光導引元件421b係直接面向光導入孔512b並與通過光導入孔512b之光線L2呈一夾角(例如:45度)。此時,第一光導引元件421b將通過光導入孔512b之光線L2導引至第二影像擷取組件30。攝影模組10b可利用第一影像擷取組件20與第二影像擷取組件30同時擷取影像,而執行3D攝影/立體攝影。 The switching unit 43b can be switched under at least two states to drive the optical path control unit 42b to rotate about the rotation axis P by electromagnetic induction. For example, when the switching unit 43b is in the first state, the first light guiding element 421b of the optical path control unit 42b directly faces the light introducing hole 512b and is at an angle with the light L2 passing through the light introducing hole 512b (for example: 45 degree). At this time, the first light guiding element 421b guides the light L2 passing through the light introducing hole 512b to the second image capturing unit 30. The photographic module 10b can capture images by using the first image capturing component 20 and the second image capturing component 30 to perform 3D photography/stereo photography.

當切換單元43b在第二狀態下時,光路控制單元42b之第二光導引元件422b係直接面向光導入孔521b並與通過光導入孔521b之光線L3呈一夾角(例如:45度)。此時,第二光導引元件422b將通過光導入孔521b之光線L3導引至第二影像擷取組件30。攝影模組10b可利用第一影像擷取組件20以及/或者第二影像擷取組件30執行2D攝影。 When the switching unit 43b is in the second state, the second light guiding member 422b of the optical path control unit 42b directly faces the light introducing hole 521b and is at an angle (for example, 45 degrees) with the light beam L3 passing through the light introducing hole 521b. At this time, the second light guiding member 422b guides the light L3 passing through the light introducing hole 521b to the second image capturing unit 30. The photography module 10b can perform 2D photography using the first image capturing component 20 and/or the second image capturing component 30.

如第8圖所示,在部分實施例中,第一影像擷取組件20之磁性元件271與切換單元43b之磁性元件(第三磁性元件)間之距離D3,係大於第一、二影像擷取組件20、30所分別對應之光導入孔511b、512b間之距離D1。如此一來,在維持第一影像擷取組件20的防震電磁控制單元25正常作動的情況下,二個光導入孔 511b、512b間的間距可進一步減少,進而提升攝影模組10b在3D攝影/立體攝影的影像品質及影像處理速度。同時,攝影模組10b亦可單獨利用通過光導入孔512b之光線執行2D攝影。在前述光導入孔511b、512b中心的連線方向(Y軸方向)上,光導入孔512b係位在分別包含於第一、二影像擷取組件20、30中且最接近的兩個磁性元件271、352之間。 As shown in FIG. 8, in some embodiments, the distance D3 between the magnetic component 271 of the first image capturing component 20 and the magnetic component (third magnetic component) of the switching unit 43b is greater than the first and second images. The distance D1 between the light-introducing holes 511b and 512b corresponding to the components 20 and 30 is taken. In this way, in the case of maintaining the anti-vibration electromagnetic control unit 25 of the first image capturing assembly 20 to operate normally, the two light-introducing holes The spacing between 511b and 512b can be further reduced, thereby improving the image quality and image processing speed of the camera module 10b in 3D photography/stereo photography. At the same time, the photographing module 10b can also perform 2D photography using the light passing through the light introducing hole 512b alone. In the wiring direction (Y-axis direction) at the center of the light introducing holes 511b, 512b, the light introducing hole 512b is tied to the two magnetic elements respectively included in the first and second image capturing members 20, 30 and closest to each other. Between 271 and 352.

表(二)顯示根據本揭露之部分實施例在二個光導入孔511b、512b之距離小於10mm之情況下,且防震電磁控制單元25維持正常作動,防震電磁控制單元25之各磁性元件271、272、273、274之中心與切換單元43b之磁性元件之中心間之配置距離。表(二)中距離單位為公釐(mm)。應當理解的是,表(二)僅為一示範性實施例,本揭露並不僅此為限。 Table (2) shows that in the case where the distance between the two light introducing holes 511b, 512b is less than 10 mm according to some embodiments of the present disclosure, and the anti-vibration electromagnetic control unit 25 maintains normal operation, the magnetic elements 271 of the anti-vibration electromagnetic control unit 25, The arrangement distance between the center of 272, 273, 274 and the center of the magnetic element of the switching unit 43b. The distance unit in Table (2) is mm (mm). It should be understood that Table (2) is merely an exemplary embodiment, and the disclosure is not limited thereto.

第9圖顯示本揭露之部分實施例之攝影模組10c應用於一電子裝置1c之示意圖。電子裝置1c可為一手持式電子裝置(例如:手機、平板電腦、筆記型電腦)。或者,電子裝置1c可為一穿戴式電子裝置(例如:手錶)。或者,電子裝置1c可為一車用型電 子裝置(例如:行車記錄器)。 FIG. 9 is a schematic diagram showing the application of the camera module 10c of some embodiments of the present disclosure to an electronic device 1c. The electronic device 1c can be a handheld electronic device (for example, a mobile phone, a tablet computer, a notebook computer). Alternatively, the electronic device 1c may be a wearable electronic device (for example, a watch). Alternatively, the electronic device 1c can be a vehicle type power Sub-device (for example: driving recorder).

根據本發明之部分實施例,電子裝置1c包括一殼體5c及攝影模組10c。攝影模組10c相對形成於殼體5c上之光導入孔設置於殼體5c內部,以執行3D攝影/立體攝影或2D攝影。舉例而言,如第9圖所示,殼體5c具有一第一表面51c及一相對第一表面51c的第二表面52c。二個光導入孔,例如:光導入孔511c、512c(第一、第二光導引孔),形成於第一表面51c上。並且,二個光導入孔,例如:光導入孔521c、522c,形成於第二表面52c上。光導入孔511c、512c、521c、522c定義四個通道以允許光線L1、L2、L3、L4進入殼體5c。攝影模組10c相對形成於殼體5c上之光導入孔511c、512c、521c、522c設置於殼體5c內部,以接收並感測光線L1、L2、L3、L4。 According to some embodiments of the present invention, the electronic device 1c includes a housing 5c and a camera module 10c. The photo module 10c is disposed inside the casing 5c with respect to the light introducing hole formed in the casing 5c to perform 3D photography/stereo photography or 2D photography. For example, as shown in FIG. 9, the housing 5c has a first surface 51c and a second surface 52c opposite to the first surface 51c. Two light introducing holes, for example, light introducing holes 511c and 512c (first and second light guiding holes), are formed on the first surface 51c. Further, two light introducing holes, for example, light introducing holes 521c and 522c, are formed on the second surface 52c. The light introducing holes 511c, 512c, 521c, 522c define four passages to allow the light rays L1, L2, L3, L4 to enter the casing 5c. The photo module 10c is disposed inside the casing 5c with respect to the light introducing holes 511c, 512c, 521c, and 522c formed on the casing 5c to receive and sense the light beams L1, L2, L3, and L4.

在部分實施例中,光導入孔511c、512c、521c、522c皆為圓形之穿孔且具有相同的孔徑,但本揭露並不僅此為限。光導入孔511c、512c、521c、522c之孔徑及形狀可依照需求進行改變。在部分實施例中,光導入孔511c、512c與光導入孔521c、522c間具有相異的孔徑及形狀。在部分實施例中,二個光導入孔511c、512c彼此相隔一間距並不連通,且二個光導入孔521c、522c彼此相隔一間距並不連通。二個光導入孔511c、512c之實質中心之間距小於10mm,且二個光導入孔521c、522c之實質中心之間距小於10mm。 In some embodiments, the light introducing holes 511c, 512c, 521c, 522c are all circular perforations and have the same aperture, but the disclosure is not limited thereto. The apertures and shapes of the light introducing holes 511c, 512c, 521c, and 522c can be changed as needed. In some embodiments, the light introducing holes 511c and 512c and the light introducing holes 521c and 522c have different apertures and shapes. In some embodiments, the two light introducing holes 511c, 512c are not connected to each other at a pitch, and the two light introducing holes 521c, 522c are not connected to each other at a pitch. The distance between the substantial centers of the two light introducing holes 511c, 512c is less than 10 mm, and the distance between the substantial centers of the two light introducing holes 521c, 522c is less than 10 mm.

第10圖顯示攝影模組10c之示意圖。在第10圖中,與 第7圖之攝影模組10b相同或相似之元件將施予相同之標號,且其特徵將不再重複,以簡化說明。攝影模組10c與攝影模組10b之差異包括,攝影模組10c省略設置影像擷取組件30,且包括二個影像擷取組件20及二個光導引組件40b。 Fig. 10 is a view showing the photographing module 10c. In Figure 10, The same or similar components of the photographic module 10b of Fig. 7 will be given the same reference numerals, and their features will not be repeated to simplify the description. The difference between the photographic module 10c and the photographic module 10b includes that the photographic module 10c omits the image capturing component 30 and includes two image capturing components 20 and two light guiding components 40b.

二個影像擷取組件20係配置用於接收並感測通過殼體5c上對應之光導入孔之光線。舉例而言,位於第10圖左側之影像擷取組件20係配置用於接收並感測通過殼體5c之光導入孔511c(第9圖)之光線L1,或者係配置用於接收並感測通過殼體5c之光導入孔521c(第9圖)之光線L3。位於第10圖右側之影像擷取組件20係配置用於接收並感測通過殼體5c之光導入孔512c(第9圖)之光線L2,或者係配置用於接收並感測通過殼體5c之光導入孔522c(第9圖)之光線L4。 The two image capturing assemblies 20 are configured to receive and sense light rays passing through corresponding light introducing holes in the housing 5c. For example, the image capturing component 20 located on the left side of FIG. 10 is configured to receive and sense the light L1 passing through the light introducing hole 511c (FIG. 9) of the housing 5c, or configured to receive and sense. The light L3 of the light introducing hole 521c (Fig. 9) through the light of the casing 5c. The image capturing assembly 20 located on the right side of FIG. 10 is configured to receive and sense the light L2 passing through the light introduction hole 512c (FIG. 9) of the housing 5c, or is configured to receive and sense through the housing 5c. The light is introduced into the light ray L4 of the hole 522c (Fig. 9).

二個光導引組件40b係配置用於選擇性導引通過二個相對設置之光導入孔之光線進入對應之影像擷取組件20中。舉例而言,位於第10圖左側之光導引組件40b係配置用於選擇性導引通過二個相對設置之光導入孔511b及光導入孔521b之光線L1、L3進入第10圖左側之影像擷取組件20。位於第10圖右側之光導引組件40b係配置用於選擇性導引通過二個相對設置之光導入孔512b及光導入孔522b之光線L2、L4進入第10圖右側之影像擷取組件20。 The two light guiding components 40b are configured to selectively guide the light passing through the two oppositely disposed light introducing holes into the corresponding image capturing assembly 20. For example, the light guiding component 40b located on the left side of FIG. 10 is configured to selectively guide the light rays L1 and L3 passing through the two oppositely disposed light introducing holes 511b and the light introducing holes 521b into the image on the left side of FIG. Capture component 20. The light guiding component 40b located on the right side of FIG. 10 is configured to selectively guide the light-collecting components 20 passing through the two oppositely disposed light-introducing holes 512b and the light-introducing holes 522b into the right side of FIG. .

為方便說明,在第9-11圖的實施例中,位於第10圖左側之影像擷取組件20稱作第一影像擷取組件,且位於第10圖右側之影像擷取組件20稱作第二影像擷取組件。並且,位於第10圖左 側之光導引組件40b稱作第一影像擷取組件,且位於第10圖右側之之光導引組件40b稱作第二影像擷取組件。 For convenience of description, in the embodiment of FIGS. 9-11, the image capturing component 20 located on the left side of FIG. 10 is referred to as a first image capturing component, and the image capturing component 20 located on the right side of FIG. 10 is referred to as a Two image capture components. And, located at the left of Figure 10 The side light guiding component 40b is referred to as a first image capturing component, and the light guiding component 40b located on the right side of FIG. 10 is referred to as a second image capturing component.

第一、二光導引組件40b之第二側邊412b彼此並接。第一、二影像擷取組件20分別相鄰二個基座41b之第二側邊411b並且設置於基座41b之上。在部分實施例中,第一、二光導引組件40b可分別作動,且攝影模組10c可利用第一、二影像擷取組件20同時擷取影像,而執行或2D攝影或3D攝影/立體攝影。 The second side edges 412b of the first and second light guiding assemblies 40b are connected to each other. The first and second image capturing assemblies 20 are respectively adjacent to the second side 411b of the two bases 41b and disposed on the base 41b. In some embodiments, the first and second light guiding components 40b can be respectively activated, and the camera module 10c can simultaneously capture images by using the first and second image capturing components 20, and perform 2D photography or 3D photography/stereoscopic photography.

如第11圖所示,在部分實施例中,第一、二影像擷取組件20之光軸O1共同位於相同直線上。並且,第一影像擷取組件20之感光元件24所位於之平面係平行於第二影像擷取組件20之感光元件24所位於之平面。 As shown in FIG. 11, in some embodiments, the optical axes O1 of the first and second image capturing assemblies 20 are co-located on the same straight line. Moreover, the plane of the photosensitive element 24 of the first image capturing component 20 is parallel to the plane of the photosensitive element 24 of the second image capturing component 20.

在部分實施例中,第一影像擷取組件20之磁性元件271與第二影像擷取組件20之磁性元件271間之距離D4,係大於第一、二影像擷取組件20所分別對應之光導入孔511c、512c間之距離D1。如此一來,在維持第一影像擷取組件20的防震電磁控制單元25正常作動的情況下,二個光導入孔511c、512c間的間距可進一步減少,進而提升攝影模組10c在3D攝影/立體攝影的影像品質及影像處理速度。同時,攝影模組10c可選擇性採用位於殼體5c第一表面51c上之複數個光導入孔執行3D攝影/立體攝影,或者採用位於殼體5c第二表面52c上之複數個光導入孔執行3D攝影/立體攝影。 In some embodiments, the distance D4 between the magnetic component 271 of the first image capturing component 20 and the magnetic component 271 of the second image capturing component 20 is greater than the light corresponding to the first and second image capturing components 20 respectively. The distance D1 between the holes 511c and 512c is introduced. In this way, when the anti-vibration electromagnetic control unit 25 of the first image capturing unit 20 is normally operated, the spacing between the two light-introducing holes 511c and 512c can be further reduced, thereby improving the photography module 10c in 3D photography/ Image quality and image processing speed for stereo photography. At the same time, the photographic module 10c can selectively perform 3D photographic/stereoscopic photography using a plurality of light-introducing holes on the first surface 51c of the casing 5c, or can be performed by using a plurality of light-introducing holes on the second surface 52c of the casing 5c. 3D photography / stereo photography.

在部分實施例中,在二個光導入孔511c、512c之距離 小於10mm之情況下,且防震電磁控制單元25維持正常作動,第一、二影像擷取組件20之二個磁性元件271之間距D4為27.36mm。第一、二光導引組件40b之切換單元43c之磁性元件之間距D5為8.20mm。切換單元43c與磁性元件271在Y軸上之間距D6為9.58mm,然本揭露並不僅此為限。 In some embodiments, the distance between the two light introducing holes 511c, 512c In the case of less than 10 mm, and the anti-vibration electromagnetic control unit 25 maintains normal operation, the distance D4 between the two magnetic elements 271 of the first and second image capturing assemblies 20 is 27.36 mm. The distance D5 between the magnetic elements of the switching unit 43c of the first and second light guiding members 40b is 8.20 mm. The distance between the switching unit 43c and the magnetic element 271 on the Y-axis is 9.58 mm, which is not limited thereto.

第12圖顯示本揭露之部分實施例之防震電磁控制單元於不同動作位置時受另一影像擷取組件之電磁控制單元之干擾程度之圖表,其中縱軸顯示防震電磁控制單元25干擾程度。其計算方法為,另一影像擷取組件之電磁控制單元對防震電磁控制單元25的干擾力(A)相對防震電磁控制單元25本身作用力(B)之比例(A/B)。觀察此圖表可以明白的是,在防震電磁控制單元25位移距離小於120um的情況下,防震電磁控制單元25受另一影像擷取組件之磁性元件之干擾程度皆小於5%。因此,在一定程度的偏移範圍內,防震電磁控制單元25皆可正常運作。 Figure 12 is a graph showing the degree of interference of the anti-vibration electromagnetic control unit of the embodiment of the present disclosure with the electromagnetic control unit of another image capturing unit at different operating positions, wherein the vertical axis shows the degree of interference of the anti-vibration electromagnetic control unit 25. The calculation method is the ratio (A/B) of the interference force (A) of the electromagnetic control unit of the other image capturing component to the anti-vibration electromagnetic control unit 25 relative to the force (B) of the anti-vibration electromagnetic control unit 25 itself. Observing this chart, it can be understood that in the case where the displacement distance of the anti-vibration electromagnetic control unit 25 is less than 120 um, the degree of interference of the anti-vibration electromagnetic control unit 25 by the magnetic elements of the other image capturing assembly is less than 5%. Therefore, the anti-vibration electromagnetic control unit 25 can operate normally within a certain degree of offset.

本揭露之攝影模組在相異影像擷取組件的磁性元件之間設置非磁性材料,在不增加光導入孔間距的情況下,有效防止防震電磁控制單元因磁力干擾而無法正常作動的問題。如此一來,攝影模組在產生3D攝影/立體攝影時的曝光時間可以因此延長,以強化在暗處拍照的影像品質。另外,用於產生3D攝影/立體攝影的光線係通過多個彼此相隔一相對小的距離的光導入孔射入攝影模組內,因此攝影模組在3D攝影/立體攝影的影像品質及影像處理速度可以獲得提升。 The photographic module of the present disclosure provides a non-magnetic material between the magnetic elements of the different image capturing components, and effectively prevents the anti-vibration electromagnetic control unit from being able to operate normally due to magnetic interference without increasing the pitch of the light-introducing holes. In this way, the exposure time of the photographic module in generating 3D photography/stereo photography can be extended to enhance the image quality of taking pictures in the dark. In addition, the light for generating 3D photography/stereoscopic imaging is incident into the photographic module through a plurality of light-introducing holes that are separated by a relatively small distance, so that the image quality and image processing of the photographic module in 3D photography/stereo photography Speed can be improved.

雖然本揭露的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作更動、替代與潤飾。此外,本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此,本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments of the present disclosure and its advantages are disclosed above, it should be understood that those skilled in the art can make changes, substitutions, and refinements without departing from the spirit and scope of the disclosure. In addition, the scope of the disclosure is not limited to the processes, machines, manufactures, compositions, devices, methods, and steps in the specific embodiments described in the specification, and those of ordinary skill in the art may disclose the disclosure It is understood that the processes, machines, manufactures, compositions, devices, methods, and procedures that are presently or in the future may be used in accordance with the present disclosure as long as they can perform substantially the same function or achieve substantially the same results in the embodiments described herein. Accordingly, the scope of protection of the present disclosure includes the above-described processes, machines, manufacturing, material compositions, devices, methods, and procedures. In addition, each patent application scope constitutes an individual embodiment, and the scope of protection of the disclosure also includes a combination of the scope of the patent application and the embodiments.

Claims (10)

一種攝影模組,設置於一電子裝置(1b)內部,其中該攝影模組包括:一第一影像擷取組件(20),具有一第一感光元件(24),其中該第一感光元件(24)垂直於一第一軸(X),用以接收進入該第一影像擷取組件(20)之光線;一第二影像擷取組件(30),具有一第二感光元件(34),用以接收進入該第一影像擷取組件(20)之光線,其中該第二感光元件(34)垂直於一第二軸(Y),該第一影像擷取組件(20)以及該第二影像擷取組件(30)沿該第二軸(Y)排列,且該第二軸(Y)垂直於該第一軸(X);一光路控制單元(42b),設置於第一影像擷取組件(20)與第二影像擷取組件(30)之間,用以導引兩個相反方向之光線(L2、L3)的其中之一者沿該第二軸(Y)進入該第二影像擷取組件(30);以及一切換單元(43b),驅動該光路控制單元(42b)繞一轉軸(P)旋轉,以切換該兩個相反方向之光線(L2、L3)進入該第二影像擷取組件(30)之路徑,其中該轉軸(P)垂直於該第一軸(X)以及該第二軸(Y)。A photographic module is disposed inside an electronic device (1b), wherein the photographic module includes: a first image capturing assembly (20) having a first photosensitive element (24), wherein the first photosensitive element ( 24) perpendicular to a first axis (X) for receiving light entering the first image capturing component (20); a second image capturing component (30) having a second photosensitive element (34), For receiving light entering the first image capturing component (20), wherein the second photosensitive element (34) is perpendicular to a second axis (Y), the first image capturing component (20) and the second The image capturing component (30) is arranged along the second axis (Y), and the second axis (Y) is perpendicular to the first axis (X); an optical path control unit (42b) is disposed in the first image capturing group Between the member (20) and the second image capturing component (30), for guiding one of the two opposite directions of light (L2, L3) to enter the second image along the second axis (Y) The capturing component (30); and a switching unit (43b) driving the optical path control unit (42b) to rotate about a rotating shaft (P) to switch the two opposite directions of light (L2, L3) into the second image Capture component (3 A path of 0), wherein the axis of rotation (P) is perpendicular to the first axis (X) and the second axis (Y). 如申請專利範圍第1項所述之攝影模組,其中該第一影像擷取組件(20)具有一第一鏡頭單元(23)以及一第一電磁控制單元(25),且該第一電磁控制單元(25)具有至少一第一線圈(261)及至少一第一磁性元件(271),用以驅使該第一鏡頭單元(23)沿著垂直於該第一軸(X)之方向運動。The photographic module of claim 1, wherein the first image capturing component (20) has a first lens unit (23) and a first electromagnetic control unit (25), and the first electromagnetic component The control unit (25) has at least one first coil (261) and at least one first magnetic element (271) for driving the first lens unit (23) to move in a direction perpendicular to the first axis (X) . 如申請專利範圍第2項所述之攝影模組,其中該第二影像擷取組件(30)具有一第二鏡頭單元(33)以及一第二電磁控制單元(35),且該第二電磁控制單元(35)具有至少一第二線圈(351)以及至少一第二磁性元件(352),用以驅使該第二鏡頭單元(33)沿著平行於該第一軸(X)之方向運動。The photographic module of claim 2, wherein the second image capturing component (30) has a second lens unit (33) and a second electromagnetic control unit (35), and the second electromagnetic The control unit (35) has at least one second coil (351) and at least one second magnetic element (352) for driving the second lens unit (33) to move in a direction parallel to the first axis (X) . 一種電子裝置,包括如申請專利範圍第1項所述之攝影模組,其中該電子裝置具有一殼體(5b),且該殼體(5b)形成有一第一光導入孔(511b)以及一第二光導入孔(512b),其中該第一光導入孔(511b)以及該第二光導入孔(512b)於該第二軸(Y)上相隔一間距且不相連通,光線分別經由該第一光導入孔(511b)以及該第二光導入孔(512b)進入該第一影像擷取組件(20)以及該第二影像擷取組件(30)。An electronic device comprising the photographic module according to claim 1, wherein the electronic device has a casing (5b), and the casing (5b) is formed with a first light introducing hole (511b) and a a second light introducing hole (512b), wherein the first light introducing hole (511b) and the second light introducing hole (512b) are spaced apart from each other on the second axis (Y) and are not in communication with each other The first light introducing hole (511b) and the second light introducing hole (512b) enter the first image capturing assembly (20) and the second image capturing assembly (30). 如申請專利範圍第4項所述之電子裝置,其中該第一影像擷取組件(20)更具有一第一鏡頭單元(23)以及一第一電磁控制單元(25),且該第一電磁控制單元(25)具有至少一第一線圈(261)及至少一第一磁性元件(271),用以驅使該第一鏡頭單元(23)沿著垂直於該第一軸(X)之方向運動。The electronic device of claim 4, wherein the first image capturing component (20) further has a first lens unit (23) and a first electromagnetic control unit (25), and the first electromagnetic The control unit (25) has at least one first coil (261) and at least one first magnetic element (271) for driving the first lens unit (23) to move in a direction perpendicular to the first axis (X) . 如申請專利範圍第5項所述之電子裝置,其中該第二影像擷取組件(30)更具有一第二鏡頭單元(33)以及一第二電磁控制單元(35),且該第二電磁控制單元(35)具有至少一第二線圈(351)以及至少一第二磁性元件(352),用以驅使該第二鏡頭單元(33)沿著平行於該第一軸(X)之方向運動。The electronic device of claim 5, wherein the second image capturing component (30) further has a second lens unit (33) and a second electromagnetic control unit (35), and the second electromagnetic component The control unit (35) has at least one second coil (351) and at least one second magnetic element (352) for driving the second lens unit (33) to move in a direction parallel to the first axis (X) . 如申請專利範圍第6項所述之電子裝置,其中該第一磁性元件與該第二磁性元件(271、352)中心之距離大於該第一、第二光導入孔(511b、512b)中心之距離(D1)。The electronic device of claim 6, wherein a distance between the first magnetic element and the center of the second magnetic element (271, 352) is greater than a center of the first and second light introducing holes (511b, 512b) Distance (D1). 如申請專利範圍第5項所述之電子裝置,其中該切換單元(43b)具有一第三磁性元件,以透過電磁感應之方式驅動該光路控制單元(42b)繞該轉軸(P)旋轉,其中該第一磁性元件(271)與該第三磁性元件(43b)間之距離(D3)大於該第一、第二光導入孔(511b、512b)中心之距離(D1)。The electronic device of claim 5, wherein the switching unit (43b) has a third magnetic element for driving the optical path control unit (42b) to rotate about the rotating shaft (P) by electromagnetic induction, wherein A distance (D3) between the first magnetic element (271) and the third magnetic element (43b) is greater than a distance (D1) between the centers of the first and second light introducing holes (511b, 512b). 如申請專利範圍第4項所述之電子裝置,其中該第一、第二光導入孔(511b、512b)具有相異的孔徑。The electronic device of claim 4, wherein the first and second light introducing holes (511b, 512b) have different apertures. 如申請專利範圍第4項所述之電子裝置,其中該第一、第二光導入孔(511b、512b)中心之距離(D1)小於10mm。The electronic device of claim 4, wherein a distance (D1) between the centers of the first and second light introducing holes (511b, 512b) is less than 10 mm.
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