TWI639373B - Processing method of case clearance zone, case, and mobile terminal - Google Patents

Processing method of case clearance zone, case, and mobile terminal Download PDF

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Publication number
TWI639373B
TWI639373B TW106109046A TW106109046A TWI639373B TW I639373 B TWI639373 B TW I639373B TW 106109046 A TW106109046 A TW 106109046A TW 106109046 A TW106109046 A TW 106109046A TW I639373 B TWI639373 B TW I639373B
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Taiwan
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housing
micro
casing
shielding material
signal shielding
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TW106109046A
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Chinese (zh)
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TW201735757A (en
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李靜
楊光明
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廣東歐珀移動通信有限公司
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Priority claimed from CN201610157104.2A external-priority patent/CN105657101B/en
Priority claimed from CN201610250522.6A external-priority patent/CN105855127A/en
Application filed by 廣東歐珀移動通信有限公司 filed Critical 廣東歐珀移動通信有限公司
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Publication of TWI639373B publication Critical patent/TWI639373B/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本發明公開了一種殼體的淨空區域的加工方法,包括提供殼體,殼體由信號屏蔽材料製成且具有預設區域,預設區域包括相背設置的第一表面和第二表面;在預設區域的第一表面加工出至少一個支撐結構;將雷射切割機對準預設區域的第二表面,並將預設區域切割出預設數量的微縫,預設數量的微縫彼此間隔並列設置;在每個微縫中填充非信號屏蔽材料,以獲得淨空區域;將支撐結構切除。本發明實施例提供的方法通過雷射在殼體上切割出了預設數量的微縫,並且通過在微縫中填充材料形成了淨空區域,以獲得特定形狀的淨空區域,同時由於微縫較窄,降低了殼體的非信號屏蔽材料的占比,保證了殼體的外觀整體性。本發明還提供了一種殼體和移動終端。 The invention discloses a method for processing a clearance area of a casing, comprising providing a casing made of a signal shielding material and having a predetermined area, the preset area comprising a first surface and a second surface disposed opposite to each other; The first surface of the preset area is machined with at least one support structure; the laser cutting machine is aligned with the second surface of the preset area, and the preset area is cut out by a preset number of micro slits, and the preset number of micro slits are mutually The spacing is arranged side by side; the non-signal shielding material is filled in each micro slit to obtain a clearance area; the support structure is cut off. The method provided by the embodiment of the invention cuts a preset number of micro slits on the shell by laser, and forms a clearance area by filling the material in the micro slit to obtain a clearance area of a specific shape, and at the same time, The narrowness reduces the proportion of the non-signal shielding material of the housing and ensures the appearance integrity of the housing. The present invention also provides a housing and a mobile terminal.

Description

一種殼體的淨空區域的加工方法、殼體和移動終端 Processing method, housing and mobile terminal of clearance area of housing

本發明涉及電子設備領域,尤其涉及一種殼體的淨空區域的加工方法、殼體和移動終端。 The present invention relates to the field of electronic devices, and in particular, to a method, a housing, and a mobile terminal for processing a clearance area of a casing.

隨著科技的發展和市場的需求,全金屬的手機的需求愈來愈大。全金屬手機雖然美觀,但其金屬外殼會對天線的射頻信號產生一定的阻擋。 With the development of technology and the needs of the market, the demand for all-metal mobile phones is growing. Although the all-metal mobile phone is beautiful, its metal casing will block the RF signal of the antenna.

現有技術中在金屬手機的背面一般通過數控機床加工出一定的淨空區域,以供射頻信號通過,但是發明人在加工上述工藝時發現,該淨空區域由於數控機床的刀具或者控制方式的限制,其無法加工出特定形狀的淨空區域,或者淨空區域面積往往較大,影響手機的整體感。 In the prior art, a certain clearance area is generally processed by a numerical control machine tool on the back side of the metal mobile phone for the RF signal to pass, but the inventor found in the processing of the above process that the clearance area is limited by the tool or control mode of the numerical control machine tool. It is impossible to process a clearance area of a specific shape, or the clearance area is often large, which affects the overall feeling of the mobile phone.

本發明的目的在於提供一種殼體的淨空區域的加工方法,其能够加工出特定形狀的淨空區域的殼體並保證殼體的外觀整體性。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of machining a clearance area of a casing that is capable of machining a casing of a specific shape of the clearance area and ensuring the overall appearance of the casing.

為了解決上述技術問題,本發明實施例提供了一種殼體的淨空區域的加工方法,包括: 提供殼體,所述殼體由信號屏蔽材料製成且具有預設區域,所述預設區域包括相背設置的第一表面和第二表面;在所述預設區域的第一表面加工出至少一個支撐結構,以使所述支撐結構凸設於所述第一表面上;將雷射切割機對準所述預設區域的第二表面,並將所述預設區域切割出預設數量的微縫,所述預設數量的微縫彼此間隔並列設置,每個所述支撐結構橫跨所述預設數量的微縫,以將所述殼體連接成為一個整體;在每個所述微縫中填充非信號屏蔽材料以獲得淨空區域;將所述支撐結構切除。 In order to solve the above technical problem, an embodiment of the present invention provides a processing method for a clearance area of a housing, including: Providing a housing made of a signal shielding material and having a predetermined area, the predetermined area including a first surface and a second surface disposed opposite each other; and processing on the first surface of the predetermined area At least one support structure for causing the support structure to protrude from the first surface; aligning the laser cutting machine with the second surface of the predetermined area, and cutting the preset area by a preset number a micro slit, the predetermined number of micro slits being spaced apart from each other, each of the support structures spanning the predetermined number of micro slits to join the shells as a whole; The non-signal shielding material is filled in the micro slit to obtain a clearance area; the support structure is cut off.

本發明實施例還提供了一種殼體,所述殼體由信號屏蔽材料製成且具有預設區域;所述預設區域設置有預設數量的微縫,所述預設數量的微縫彼此間隔並列設置,每個所述微縫中填充有非信號屏蔽材料形成淨空區域,所述淨空區域用於通過射頻信號。 An embodiment of the present invention further provides a housing made of a signal shielding material and having a preset area; the preset area is provided with a preset number of micro slits, and the preset number of micro slits are mutually The spacers are arranged side by side, each of the micro slits being filled with a non-signal shielding material to form a clearance area for passing a radio frequency signal.

本發明實施例還提供了一種移動終端,包括殼體。 The embodiment of the invention further provides a mobile terminal, including a housing.

本發明實施例提供的殼體的淨空區域的加工方法通過雷射在殼體上切割出了預設數量的微縫,並且通過在微縫中填充材料形成了淨空區域,以獲得特定形狀的淨空區域,同時由於微縫較窄,降低了殼體的非信號屏蔽材料的使用,保證了殼體的外觀整體性。 The processing method of the clearance area of the casing provided by the embodiment of the invention cuts a preset number of micro slits on the casing by laser, and forms a clearance area by filling the material in the micro slit to obtain a clearance of a specific shape. The area, meanwhile, due to the narrower micro-slit, reduces the use of the non-signal shielding material of the housing, ensuring the overall appearance of the housing.

本發明實施例提供的殼體和移動終端具有特定形狀且面積較小的淨空區域,保證了殼體的外觀整體性。 The housing and the mobile terminal provided by the embodiments of the present invention have a clear area with a specific shape and a small area, which ensures the appearance integrity of the housing.

S101、S103、S105、S107、S109、S110、S120、S201、S203、S205、S207、S209、S210、S211、S220、S230、S240、S250‧‧‧步驟 S101, S103, S105, S107, S109, S110, S120, S201, S203, S205, S207, S209, S210, S211, S220, S230, S240, S250‧‧

1‧‧‧微縫 1‧‧‧Micro-seam

2‧‧‧非信號屏蔽材料 2‧‧‧Non-signal shielding materials

10‧‧‧淨空區域 10‧‧‧ clearance area

100‧‧‧殼體 100‧‧‧shell

圖1是本發明實施例提供的一種殼體的淨空區域的加工方法的流程示意圖;圖2是圖1的加工方法的步驟S107的流程示意圖;圖3是本發明實施例提供的另一種殼體的淨空區域的加工方法的流程示意圖;圖4是圖3的加工方法的步驟S207的流程示意圖;圖5是本發明實施例提供的殼體的示意圖。 1 is a schematic flow chart of a method for processing a clearance area of a casing according to an embodiment of the present invention; FIG. 2 is a schematic flow chart of step S107 of the processing method of FIG. 1; and FIG. 3 is another housing provided by an embodiment of the present invention. FIG. 4 is a schematic flow chart of the step S207 of the processing method of FIG. 3; and FIG. 5 is a schematic view of the housing provided by the embodiment of the present invention.

下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,在所屬技術領域具有通常知識者在沒有付出創造性勞動前提下所獲得的所有其他實施例,都屬本發明保護的範圍。 The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without departing from the inventive scope are the scope of the present invention.

本發明實施例的描述中,需要理解的是,術語“橫向”、“縱向”、“長度”、“寬度”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是暗示或指示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。 In the description of the embodiments of the present invention, it is to be understood that the orientation or positional relationship indicated by the terms "lateral", "longitudinal", "length", "width", etc. is based on the orientation or positional relationship shown in the drawings, only The present invention and the simplification of the description are not to be construed as limiting or limiting the invention.

下面將結合圖1-圖4,對本發明實施例提供的殼體的淨空區域的加工方法進行詳細介紹。 A method for processing a clearance area of a casing provided by an embodiment of the present invention will be described in detail below with reference to FIGS.

請參見圖1,是本發明實施例提供的一種殼體的淨空區域的加工方法的流程示意圖。如圖1所示,本發明實施例的方法可以包括以下步驟S101、步驟S103、步驟S105、步驟S107以及步驟S109。 1 is a schematic flow chart of a method for processing a clearance area of a casing according to an embodiment of the present invention. As shown in FIG. 1, the method of the embodiment of the present invention may include the following steps S101, S103, S105, S107, and S109.

步驟S101:提供殼體,所述殼體由信號屏蔽材料製成且具有預設區域,所述預設區域包括相背設置的第一表面和第二表面。 Step S101: providing a housing made of a signal shielding material and having a preset area, the preset area including a first surface and a second surface disposed opposite to each other.

具體的,根據實際需求製作殼體,可以理解的,殼體可以為移動終端的背蓋。預設區域根據實際需求設置在殼體的某個區域,預設區域為殼體上需要通過射頻信號的某個區域。其中,第一表面為背蓋的內側表面,第二表面為背蓋的外側表面,外側表面暴露於空氣中即用戶可以直接接觸到的表面。當然,在其它實施例中,殼體還可以為移動終端的前殼或者具有邊框的後蓋。 Specifically, the housing is made according to actual needs. It can be understood that the housing can be a back cover of the mobile terminal. The preset area is set in a certain area of the housing according to actual needs, and the preset area is an area on the housing that needs to pass the radio frequency signal. Wherein, the first surface is the inner side surface of the back cover, the second surface is the outer side surface of the back cover, and the outer side surface is exposed to the air, that is, the surface that the user can directly contact. Of course, in other embodiments, the housing may also be a front case of the mobile terminal or a back cover with a bezel.

優選的,通過以下方式製作殼體:將金屬板材放入模具中衝壓成預設形狀的金屬板;在數控機床上對所述預設形狀的金屬板進行內部結構和外部造型的加工,以獲得殼體。其中,金屬板材為鋁板材,將大塊的鋁板材切割成小塊的鋁板材,將裁切好的小塊鋁板材放入模具中進行衝壓形成預設形狀的金屬板,可以理解的,鋁板材的衝壓次數可以為一次,也可以為多次連續衝壓;將金屬板在數控機床上進行加工,形成所需的殼體。 Preferably, the housing is fabricated by placing a metal sheet into a mold and punching it into a metal plate of a predetermined shape; and processing the internal structure and the external shape of the predetermined shape of the metal plate on a numerically controlled machine tool to obtain case. Among them, the metal plate is an aluminum plate, the large aluminum plate is cut into small pieces of aluminum plate, and the cut small piece of aluminum plate is put into a mold to be stamped to form a metal plate of a predetermined shape. It is understandable that aluminum The number of stampings of the sheet may be one time or multiple times of continuous stamping; the metal sheet is machined on a numerically controlled machine tool to form a desired shell.

步驟S103:在所述預設區域的第一表面加工出至少一個支撐結構,以使所述支撐結構凸設於所述第一表面上。 Step S103: processing at least one supporting structure on the first surface of the preset area, so that the supporting structure protrudes from the first surface.

具體的,支撐結構為三個,其沿著殼體的橫向即寬度方向依次間隔排列於淨空區域的第一表面上,即內側表面上,以使得後續支撐結構進行切割去除時,第一表面上留下的痕迹處於移動終端的內部,需拆開移動終端方可觀察到,不會影響移動終端外觀的整體性。可以理解的,支撐結構為橋墩狀,以防止殼體在進行雷射切割過程中變形。當然,在其它實施例中,支撐結構可 以為其它結構,只要起到支撑作用即可,比如說支撐結構為加强筋或者肋板。當然,在其它實施例中,支撐結構的數量還可以為其它。 Specifically, the support structure is three, which are sequentially arranged on the first surface of the clearance area, that is, on the inner side surface, along the lateral direction, that is, the width direction of the housing, so that when the subsequent support structure is cut and removed, the first surface is The traces left are inside the mobile terminal, and the mobile terminal needs to be disassembled to observe, and does not affect the overall appearance of the mobile terminal. It can be understood that the support structure is a pier-like shape to prevent the casing from being deformed during the laser cutting process. Of course, in other embodiments, the support structure can It is thought that other structures can be used as support, for example, the support structure is a rib or a rib. Of course, in other embodiments, the number of support structures may be other.

步驟S105:將雷射切割機對準所述預設區域的第二表面切割出預設數量的微縫,所述預設數量的微縫間隔並列設置,每個所述支撐結構橫跨所述預設數量的微縫,以將所述殼體連接成為一個整體。 Step S105: aligning the laser cutting machine with the second surface of the preset area to cut out a preset number of micro slits, the preset number of micro slits are arranged side by side, and each of the support structures spans the A predetermined number of micro slits are used to join the housings as a single unit.

具體的,採用較大功率的光纖雷射切割機的雷射從第一表面穿透第二表面切割出微縫,預設數量為三條,三條微縫沿著殼體的縱向即其長度方向依次間隔排列。可以理解的,微縫的縫寬小於0.3mm,其微縫較小,更適用於該方法。其中,發明入經過大量的實驗研究出通過本發明實施例中的加工方法,能够使得微縫的縫寬為0.05mm~0.15mm,本實施例中,微縫的縫寬為0.06mm,肉眼幾乎不可視,保證移動終端中的天線的射頻信號能够通過的同時亦提高殼體的外觀的整體性。每個支撐結構橫跨三條微縫,即遮擋住三條微縫,形成良好的支撐結構。當然,在其它實施例中,微縫的數量還可以為其它。 Specifically, the laser of the high-power optical fiber laser cutting machine cuts the micro-seam from the first surface through the second surface, the preset number is three, and the three micro-slits are sequentially along the longitudinal direction of the casing, that is, the length direction thereof. Arranged at intervals. It can be understood that the slit width of the micro slit is less than 0.3 mm, and the micro slit is small, which is more suitable for the method. Among them, the invention has been studied through a large number of experiments, and the slit width of the micro slit can be made 0.05 mm to 0.15 mm by the processing method in the embodiment of the present invention. In this embodiment, the slit width of the micro slit is 0.06 mm, and the naked eye is almost It is invisible to ensure that the radio frequency signal of the antenna in the mobile terminal can pass and also improve the overall appearance of the casing. Each support structure spans three micro slits, that is, blocks three micro slits to form a good support structure. Of course, in other embodiments, the number of micro slits may be other.

優選的,同時在雷射切割過程中進行輔助降溫處理,以降低雷射切割過程中的溫度,形成所需的微縫。可以理解的,所述輔助降溫處理為高壓氮氣輔助降溫處理。 Preferably, the auxiliary cooling process is simultaneously performed during the laser cutting process to reduce the temperature during the laser cutting process to form the desired micro slit. It can be understood that the auxiliary cooling treatment is a high pressure nitrogen assisted cooling treatment.

步驟S107:在每個所述微縫中填充非信號屏蔽材料以獲得淨空區域。 Step S107: filling the non-signal shielding material in each of the micro slits to obtain a clearance area.

具體的,對具有淨空區域的殼體進行蝕刻處理。其中,非信號屏蔽材料為可以通過射頻信號的材料。可以理解的,非信號屏蔽材料可以為膠水。每條填充有非信號屏蔽材料的微縫皆能够通過天線的射頻信號,即多條微縫形成天線的淨空區域。當然,在其他實施方式中,非信號屏蔽材料還可以為塑料,每個所述微縫進行奈米(NMT)注塑填充以獲得淨空區域。 Specifically, the casing having the clearance area is etched. Among them, the non-signal shielding material is a material that can pass the radio frequency signal. It will be appreciated that the non-signal shielding material can be glue. Each micro slit filled with a non-signal shielding material can form a clearing area of the antenna through the RF signal of the antenna, that is, a plurality of micro slits. Of course, in other embodiments, the non-signal shielding material may also be plastic, and each of the micro slits is subjected to nano (NMT) injection molding to obtain a clearance area.

步驟S109:將所述支撐結構切除。 Step S109: cutting the support structure.

具體的,通過數控機床將所述支撐結構切除,同時完成殼體的其它部分的結構。 Specifically, the support structure is cut by a numerically controlled machine tool while completing the structure of other parts of the housing.

如圖2所示,步驟S107包括以下步驟S110-步驟S120。 As shown in FIG. 2, step S107 includes the following steps S110 to S120.

步驟S110:將殼體放於點膠機和吸氣治具之間,點膠機對微縫點膠的同時通過吸氣治具對微縫中的膠水吸氣。 Step S110: placing the shell between the dispenser and the suction jig, and the dispenser dispenses the glue in the micro slit through the suction fixture while dispensing the micro slit.

其中,將殼體放置於點膠機和吸氣治具之間,殼體的第一表面正對點膠機的點膠頭,第二表面朝向吸氣治具,通過點膠機對預設數量的微縫進行填充非信號屏蔽材料,同時吸氣治具對微縫中的非信號屏蔽材料進行吸氣。具體的,將殼體放置於點膠機的定位治具上,保證點膠機的點膠頭與微縫的對位及公差。同時在定位夾具上開設多個通孔形成吸氣夾具,當殼體放置於定位治具上時,即能够位於點膠機的點膠頭和吸氣夾具之間,點膠頭對微縫進行填充非信號屏蔽材料,吸氣夾具上的多個通孔對應的微縫中的非信號屏蔽材料進行吸氣以在殼體和吸氣夾具之間形成負壓,使得微縫中的非信號屏蔽材料具有流動性,能够從第一面流動至第二面,且均勻填充於微縫中,實現微縫中非信號屏蔽材料的完全填充。 Wherein, the housing is placed between the dispenser and the suction jig, the first surface of the housing faces the dispensing head of the dispenser, and the second surface faces the suction fixture, and is preset by the dispenser The number of micro slits is filled with a non-signal shielding material while the getter jig inhales the non-signal shielding material in the micro slit. Specifically, the housing is placed on the positioning fixture of the dispenser to ensure the alignment and tolerance of the dispensing head and the micro slit of the dispenser. At the same time, a plurality of through holes are formed in the positioning fixture to form a suction clamp. When the housing is placed on the positioning fixture, it can be located between the dispensing head of the dispenser and the suction clamp, and the dispensing head performs the micro slit. Filling the non-signal shielding material, the non-signal shielding material in the micro slit corresponding to the plurality of through holes on the suction jig is inhaled to form a negative pressure between the casing and the suction jig, so that the non-signal shielding in the micro slit The material has fluidity and can flow from the first side to the second side and is uniformly filled in the micro slit to achieve complete filling of the non-signal shielding material in the micro slit.

步驟S120:固化非信號屏蔽材料。 Step S120: curing the non-signal shielding material.

具體的,對預設數量的微縫內非信號屏蔽材料進行固化。其中,在非信號屏蔽材料完全填充於微縫後,需要對非信號屏蔽材料進行固化。可以理解的,所述微縫中的非信號屏蔽材料的固化方式可以為紫外線固化,還可以為烘烤固化。 Specifically, the predetermined number of non-signal shielding materials in the micro slits are cured. Among them, after the non-signal shielding material is completely filled in the micro slit, it is necessary to cure the non-signal shielding material. It can be understood that the non-signal shielding material in the micro slit can be cured by ultraviolet curing or baking.

本發明實施例提供的殼體的微縫填充方法一邊通過點膠機對殼體的第一面進行點膠,同時在殼體的第二面利用吸氣治具對微縫中的膠水吸氣形成負壓,提高膠水的流動性,使得點膠機中的膠水能够均勻填充於殼體中,提高殼體的外觀整體性。 The micro-seam filling method of the shell provided by the embodiment of the invention dispenses the first side of the shell by the dispenser, and simultaneously sucks the glue in the micro-slit by the suction jig on the second side of the shell. The negative pressure is formed to improve the fluidity of the glue, so that the glue in the dispenser can be uniformly filled in the casing, thereby improving the appearance integrity of the casing.

本發明實施例提供的殼體的淨空區域的加工方法通過雷射在殼體上切割出了預設數量的微縫,並且通過在微縫中填充材料形成了淨空區域,以獲得特定形狀的淨空區域,同時由於微縫較窄,降低了殼體的非信號屏蔽材料的使用,保證了殼體的外觀整體性。 The processing method of the clearance area of the casing provided by the embodiment of the invention cuts a preset number of micro slits on the casing by laser, and forms a clearance area by filling the material in the micro slit to obtain a clearance of a specific shape. The area, meanwhile, due to the narrower micro-slit, reduces the use of the non-signal shielding material of the housing, ensuring the overall appearance of the housing.

請參見圖3,是本發明實施例提供的另一種殼體的淨空區域的加工方法的流程示意圖。如圖3所示,本發明實施例的方法可以包括以下步驟S201、步驟S203、步驟S205、步驟S207、步驟S209以及步驟S211。 FIG. 3 is a schematic flow chart of a method for processing a clearance area of another housing according to an embodiment of the present invention. As shown in FIG. 3, the method of the embodiment of the present invention may include the following steps S201, S203, S205, S207, S209, and S211.

步驟S201:提供殼體,所述殼體由信號屏蔽材料製成且具有預設區域,所述預設區域包括相背設置的第一表面和第二表面。具體的,根據實際需求製作殼體,可以理解的,殼體可以為移動終端的背蓋。預設區域根據實際需求設置在殼體的某個區域,預設區域為殼體上需要通過射頻信號的某個區域。其中,第一表面為背蓋的內側表面,第二表面為背蓋的外側表面,外側表面暴露於空氣中即用戶可以直接接觸到的表面。當然,在其它實施例中,殼體還可以為移動終端的前殼或者具有邊框的後蓋。 Step S201: providing a housing made of a signal shielding material and having a predetermined area, the preset area including a first surface and a second surface disposed opposite to each other. Specifically, the housing is made according to actual needs. It can be understood that the housing can be a back cover of the mobile terminal. The preset area is set in a certain area of the housing according to actual needs, and the preset area is an area on the housing that needs to pass the radio frequency signal. Wherein, the first surface is the inner side surface of the back cover, the second surface is the outer side surface of the back cover, and the outer side surface is exposed to the air, that is, the surface that the user can directly contact. Of course, in other embodiments, the housing may also be a front case of the mobile terminal or a back cover with a bezel.

優選的,通過以下方式製作殼體:將金屬板材放入模具中衝壓成預設形狀的金屬板;在數控機床上對所述預設形狀的金屬板進行內部結構和外部造型的加工,以獲得殼體。其中,金屬板材為鋁板材,將大塊的鋁板材切割成小塊的鋁板材,將裁切好的小塊鋁板材放入模具中進行衝壓形成預設形狀的金屬板,可以理解的,鋁板材的衝壓次數可以為一次,也可以為多次連續衝壓;將金屬板在數控機床上進行加工,形成所需的殼體。 Preferably, the housing is fabricated by placing a metal sheet into a mold and punching it into a metal plate of a predetermined shape; and processing the internal structure and the external shape of the predetermined shape of the metal plate on a numerically controlled machine tool to obtain case. Among them, the metal plate is an aluminum plate, the large aluminum plate is cut into small pieces of aluminum plate, and the cut small piece of aluminum plate is put into a mold to be stamped to form a metal plate of a predetermined shape. It is understandable that aluminum The number of stampings of the sheet may be one time or multiple times of continuous stamping; the metal sheet is machined on a numerically controlled machine tool to form a desired shell.

步驟S203:在所述預設區域的第一表面加工出至少一個支撐結構,以使所述支撐結構凸設於所述第一表面上。 Step S203: processing at least one supporting structure on the first surface of the preset area, so that the supporting structure protrudes from the first surface.

具體的,支撐結構為三個,其沿著殼體的橫向即寬度方向依次間隔排列於淨空區域的第一表面上,即內側表面上,以使得後續支撐結構進行切割去除時,第一表面上留下的痕迹處於移動終端的內部,需拆開移動終端方可觀察到,不會影響移動終端外觀的整體性。可以理解的,支撐結構為橋墩狀,以防止殼體在進行雷射切割過程中變形。當然,在其它實施例中,支撐結構可以為其它結構,只要起到支撑作用即可,比如說支撐結構為加强筋或者肋板當然,在其它實施例中,支撐結構的數量還可以為其它。 Specifically, the support structure is three, which are sequentially arranged on the first surface of the clearance area, that is, on the inner side surface, along the lateral direction, that is, the width direction of the housing, so that when the subsequent support structure is cut and removed, the first surface is The traces left are inside the mobile terminal, and the mobile terminal needs to be disassembled to observe, and does not affect the overall appearance of the mobile terminal. It can be understood that the support structure is a pier-like shape to prevent the casing from being deformed during the laser cutting process. Of course, in other embodiments, the support structure may be other structures as long as it supports, for example, the support structure is a rib or a rib. Of course, in other embodiments, the number of support structures may be other.

步驟S205:將雷射切割機對準所述預設區域的第二表面切割出預設數量的微縫,所述預設數量的微縫間隔並列設置,每個所述支撐結構橫跨所述預設數量的微縫,以將所述殼體連接成為一個整體。 Step S205: aligning the laser cutter with the second surface of the preset area to cut out a preset number of micro slits, the preset number of micro slits being juxtaposed, each of the support structures spanning the A predetermined number of micro slits are used to join the housings as a single unit.

具體的,採用較大功率的光纖雷射切割機的雷射從第一表面穿透第二表面切割出微縫,預設數量為三條,三條微縫沿著殼體的縱向即其長度方向依次間隔排列,其中,發明人經過大量的實驗研究出通過本發明實施例中的加工方法,能够使得微縫的縫寬為0.05mm~0.15mm,本實施例中,微縫的縫寬為0.06mm,肉眼幾乎不可視,保證移動終端中的天線的射頻信號能够通過的同時亦提高殼體的外觀的整體性。每個支撐結構橫跨三條微縫,即遮擋住三條微縫,形成良好的支撐結構。當然,在其它實施例中,微縫的數量還可以為其它。 Specifically, the laser of the high-power optical fiber laser cutting machine cuts the micro-seam from the first surface through the second surface, the preset number is three, and the three micro-slits are sequentially along the longitudinal direction of the casing, that is, the length direction thereof. The arrangement of the spacers, wherein the inventors have conducted a large number of experiments to study that the slit width of the micro slits is 0.05 mm to 0.15 mm by the processing method in the embodiment of the present invention. In the present embodiment, the slit width of the micro slits is 0.06 mm. The naked eye is almost invisible, ensuring that the radio frequency signal of the antenna in the mobile terminal can pass while also improving the overall appearance of the casing. Each support structure spans three micro slits, that is, blocks three micro slits to form a good support structure. Of course, in other embodiments, the number of micro slits may be other.

優選的,同時在雷射切割過程中進行輔助降溫處理,以降低雷射切割過程中的溫度,形成所需的微縫。可以理解的,所述輔助降溫處理為高壓氮氣輔助降溫處理。 Preferably, the auxiliary cooling process is simultaneously performed during the laser cutting process to reduce the temperature during the laser cutting process to form the desired micro slit. It can be understood that the auxiliary cooling treatment is a high pressure nitrogen assisted cooling treatment.

步驟S207:在每個所述微縫中填充非信號屏蔽材料以獲得淨空區域。 Step S207: filling the non-signal shielding material in each of the micro slits to obtain a clearance area.

具體的,對具有淨空區域的殼體進行蝕刻處理。其中,非信號屏蔽材料為可以通過射頻信號的材料,可以理解的,非信號屏蔽材料可以為塑料, 其中,每個所述微縫進行奈米(NMT)注塑填充以獲得淨空區域。每條填充有非信號屏蔽材料的微縫皆能够通過天線的射頻信號,即多條微縫形成天線的淨空區域。 Specifically, the casing having the clearance area is etched. Among them, the non-signal shielding material is a material that can pass the radio frequency signal. It can be understood that the non-signal shielding material can be plastic. Wherein each of the micro slits is subjected to nano (NMT) injection molding to obtain a clearance area. Each micro slit filled with a non-signal shielding material can form a clearing area of the antenna through the RF signal of the antenna, that is, a plurality of micro slits.

S209:將具有所述淨空區域的殼體進行表面處理。 S209: Surface treating the casing having the clearance area.

具體的,將具有淨空區域的殼體進行表面抛光、噴砂、陽極氧化形成多種顏色的外觀效果,進一步提高殼體的性能。 Specifically, the shell having the clearance area is subjected to surface polishing, sand blasting, anodizing to form a multi-color appearance effect, and the performance of the housing is further improved.

步驟S211:將所述支撐結構切除。 Step S211: cutting the support structure.

具體的,通過數控機床將所述支撐結構切除,同時完成殼體的其它部分的結構。 Specifically, the support structure is cut by a numerically controlled machine tool while completing the structure of other parts of the housing.

如圖4所示,本發明第二實施例的步驟S207可以包括以下步驟S210、步驟S220、步驟S230、步驟S240以及步驟S250。 As shown in FIG. 4, step S207 of the second embodiment of the present invention may include the following steps S210, S220, S230, S240, and S250.

步驟S210:清洗殼體。 Step S210: cleaning the casing.

具體的,殼體在加工出微縫後,微縫的內部、外部或者周面可能存在毛刺或者髒污,為了利於對殼體的微縫進行填充,對殼體的表面進行處理。可以理解的,去除殼體的毛刺和髒污,以利於殼體的微縫的後續填充,進一步提高殼體的外觀整體性。 Specifically, after the micro-seam is processed in the casing, there may be burrs or dirt on the inner, outer or circumferential surface of the micro-slit, and the surface of the casing is processed in order to facilitate filling the micro-slit of the casing. It can be understood that the burrs and dirt of the casing are removed to facilitate subsequent filling of the micro slits of the casing, thereby further improving the appearance integrity of the casing.

步驟S220:將殼體放於點膠機和吸氣治具之間,點膠機對微縫點膠的同時通過吸氣治具對微縫中的膠水吸氣。 Step S220: placing the shell between the dispenser and the suction jig, and the dispenser dispenses the glue in the micro slit through the suction fixture while dispensing the micro slit.

其中,將殼體放置於點膠機和吸氣治具之間,殼體的第一表面正對點膠機的點膠頭,第二表面朝向吸氣治具,通過點膠機對預設數量的微縫進行填充非信號屏蔽材料,同時吸氣治具對微縫中的非信號屏蔽材料進行吸氣。具體的,將殼體放置於點膠機的定位治具上,保證點膠機的點膠頭與微縫的對位及公差。同時在定位夾具上開設多個通孔形成吸氣夾具,當殼體放置於定位治具上時,即能够位於點膠機的點膠頭和吸氣夾具之間,點膠頭對微縫進行填 充非信號屏蔽材料,吸氣夾具上的多個通孔對應的微縫中的非信號屏蔽材料進行吸氣以在殼體和吸氣夾具之間形成負壓,使得微縫中的非信號屏蔽材料具有流動性,能够從第一面流動至第二面,且均勻填充於微縫中,實現微縫中非信號屏蔽材料的完全填充。 Wherein, the housing is placed between the dispenser and the suction jig, the first surface of the housing faces the dispensing head of the dispenser, and the second surface faces the suction fixture, and is preset by the dispenser The number of micro slits is filled with a non-signal shielding material while the getter jig inhales the non-signal shielding material in the micro slit. Specifically, the housing is placed on the positioning fixture of the dispenser to ensure the alignment and tolerance of the dispensing head and the micro slit of the dispenser. At the same time, a plurality of through holes are formed in the positioning fixture to form a suction clamp. When the housing is placed on the positioning fixture, it can be located between the dispensing head of the dispenser and the suction clamp, and the dispensing head performs the micro slit. fill Filling the non-signal shielding material, the non-signal shielding material in the micro slit corresponding to the plurality of through holes on the suction jig is inhaled to form a negative pressure between the casing and the suction jig, so that the non-signal shielding in the micro slit The material has fluidity and can flow from the first side to the second side and is uniformly filled in the micro slit to achieve complete filling of the non-signal shielding material in the micro slit.

步驟S230:固化非信號屏蔽材料。 Step S230: curing the non-signal shielding material.

具體的,對預設數量的微縫內非信號屏蔽材料進行固化。其中,在非信號屏蔽材料完全填充於微縫後,需要對非信號屏蔽材料進行固化。可以理解的,所述微縫中的非信號屏蔽材料的固化方式可以為紫外線固化,還可以為烘烤固化。 Specifically, the predetermined number of non-signal shielding materials in the micro slits are cured. Among them, after the non-signal shielding material is completely filled in the micro slit, it is necessary to cure the non-signal shielding material. It can be understood that the non-signal shielding material in the micro slit can be cured by ultraviolet curing or baking.

步驟S240:去除殼體上的非信號屏蔽材料。 Step S240: removing the non-signal shielding material on the casing.

具體的,微縫中非信號屏蔽材料進行填充固化後,可能會溢出微縫,粘接在殼體的表面,影響殼體的外觀整體性,故利用數控機床去除殼體上的非信號屏蔽材料。優選的,通過數控機床取出殼體的一定厚度的料厚來完全取出殼體表面上的非信號屏蔽材料。 Specifically, after the non-signal shielding material in the micro-seam is filled and solidified, it may overflow the micro-seam and adhere to the surface of the casing, which affects the overall appearance of the casing, so the non-signal shielding material on the casing is removed by a numerically controlled machine tool. . Preferably, the non-signal shielding material on the surface of the casing is completely taken out by taking out a thickness of the casing of the casing by a numerically controlled machine tool.

步驟S250:對殼體進行表面處理。對殼體進行表面拋光、噴砂或陽極氧化的至少一種表面處理。 Step S250: Surface treatment of the casing. The housing is subjected to at least one surface treatment of surface polishing, sand blasting or anodizing.

具體的,對殼體進行表面拋光、噴砂或陽極氧化的至少一種表面處理。其中,採用陽極氧化的方式對殼體進行表面處理,進一步提高殼體的外觀整體性。 Specifically, the housing is subjected to at least one surface treatment of surface polishing, sand blasting or anodizing. Among them, the shell is surface treated by anodization to further improve the appearance of the shell.

本發明實施例提供的殼體的淨空區域的加工方法通過雷射在殼體上切割出了預設數量的微縫,並且通過在微縫中填充材料形成了淨空區域,以獲得特定形狀的淨空區域,同時由於微縫較窄,降低了殼體的非信號屏蔽材料的占比,保證了殼體的外觀整體性。 The processing method of the clearance area of the casing provided by the embodiment of the invention cuts a preset number of micro slits on the casing by laser, and forms a clearance area by filling the material in the micro slit to obtain a clearance of a specific shape. The area, at the same time, because the micro slits are narrow, the proportion of the non-signal shielding material of the casing is reduced, and the appearance integrity of the casing is ensured.

下面將結合圖5,對本發明實施例提供的殼體進行詳細介紹。需要說明的是,圖5所示的移動終端,通過圖1-圖4所示實施例的方法製造而成,為了便於說明,僅示出了與本發明實施例相關的部分,具體技術細節未揭示的,請參照圖1-圖4所示的實施例。 The housing provided by the embodiment of the present invention will be described in detail below with reference to FIG. It should be noted that the mobile terminal shown in FIG. 5 is manufactured by the method of the embodiment shown in FIG. 1 to FIG. 4. For the convenience of description, only parts related to the embodiment of the present invention are shown, and the specific technical details are not provided. For the disclosure, please refer to the embodiment shown in FIGS. 1-4.

在本實施例中,移動終端包括通過圖1-圖4所示實施例的方法製造而成的殼體100,其中,本發明實施例涉及的移動終端可以是任何具備通信和存儲功能的設備,例如:平板電腦、手機、電子閱讀器、遙控器、個人電腦(Personal Computer,PC)、筆記型電腦、車載設備、網路電視、可穿戴設備等具有網路功能的智慧設備。 In this embodiment, the mobile terminal includes the housing 100 manufactured by the method of the embodiment shown in FIG. 1 to FIG. 4, wherein the mobile terminal according to the embodiment of the present invention may be any device having communication and storage functions. For example: tablet computers, mobile phones, e-readers, remote controls, personal computers (PCs), notebook computers, car devices, Internet TVs, wearable devices and other smart devices with network capabilities.

在本實施例中,殼體100為移動終端的背蓋。殼體100由信號屏蔽材料製成,可以理解的,信號屏蔽材料為金屬,本實施例中,殼體的材質為鋁。殼體100具有預設區域,預設區域設置有預設數量的微縫1,預設數量的微縫1彼此間隔並列設置,,每個微縫1中填充有非信號屏蔽材料2形成用於給天線的射頻信號通過的淨空區域10,可以理解的,非信號屏蔽材料2為塑料或橡膠,本實施例中,非信號屏蔽材料2為膠水,進一步利於射頻信號的傳輸。當然,在其它實施例中,殼體100還可以為前蓋或者具有邊框的後蓋。 In this embodiment, the housing 100 is a back cover of the mobile terminal. The housing 100 is made of a signal shielding material. It can be understood that the signal shielding material is metal. In this embodiment, the material of the housing is aluminum. The housing 100 has a preset area, the preset area is provided with a preset number of micro slits 1, and a preset number of micro slits 1 are arranged side by side, and each of the micro slits 1 is filled with a non-signal shielding material 2 for forming The non-signal shielding material 2 is plastic or rubber. In this embodiment, the non-signal shielding material 2 is glue, which further facilitates the transmission of the radio frequency signal. Of course, in other embodiments, the housing 100 can also be a front cover or a back cover with a bezel.

其中,微縫1為三條,微縫1沿著殼體的縱向L1即其長度方向依次間隔設置於殼體100上。 The micro slits 1 are three, and the micro slits 1 are sequentially disposed on the casing 100 along the longitudinal direction L1 of the casing, that is, the longitudinal direction thereof.

可以理解的,為了保證殼體100外觀的整體性,微縫1的縫寬為0.05~0.15mm,在本實施例中,微縫1的縫寬為0.06mm,相鄰兩條所述微縫1之間的間距大於所述微縫1的縫寬,進一步提高殼體100外觀的整體性。本發明實施例提供的殼體100和移動終端具有特定形狀且面積較小的淨空區域,保證了殼體的外觀整體性。 It can be understood that, in order to ensure the integrity of the appearance of the housing 100, the slit width of the micro slit 1 is 0.05 to 0.15 mm. In the embodiment, the slit width of the micro slit 1 is 0.06 mm, and the two adjacent micro slits are adjacent. The spacing between 1 is greater than the slit width of the micro slit 1, further improving the overall appearance of the housing 100. The housing 100 and the mobile terminal provided by the embodiments of the present invention have a clearance area with a specific shape and a small area, which ensures the appearance integrity of the housing.

本發明實施例的模塊或單元可以根據實際需求組合或拆分。以上是本發明實施例的實施方式,應當指出,對於在所屬技術領域具有通常知識者來說,在不脫離本發明實施例原理的前提下,還可以做出若干改進和潤飾,這些改進和潤飾也視為本發明的保護範圍。 The modules or units of the embodiments of the present invention may be combined or split according to actual needs. The above is an embodiment of the present invention, and it should be noted that those skilled in the art can make several improvements and refinements without departing from the principles of the embodiments of the present invention. It is also considered to be the scope of protection of the present invention.

Claims (16)

一種殼體的淨空區域的加工方法,其特徵在於,包括:提供一殼體,所述殼體由信號屏蔽材料製成且具有一預設區域,所述預設區域包括相背設置的一第一表面和一第二表面;在所述預設區域的所述第一表面加工出至少一個支撐結構,以使所述支撐結構凸設於所述第一表面上;將一雷射切割機對準所述預設區域的所述第二表面,並將所述預設區域切割出預設數量的微縫,所述預設數量的微縫彼此間隔並列設置,每個所述支撐結構橫跨所述預設數量的微縫,以將所述殼體連接成為一個整體;將所述殼體放置於一點膠機和一吸氣治具之間,所述殼體的所述第一表面正對所述點膠機的一點膠頭,所述第二表面朝向所述吸氣治具,所述點膠機對所述預設數量的微縫進行點膠,同時所述吸氣治具對所述預設數量的微縫內非信號屏蔽材料進行吸氣,所述非信號屏蔽材料為膠水;以及對所述預設數量的微縫內非信號屏蔽材料進行固化;以及將所述支撐結構切除。 A method for processing a clearance area of a casing, comprising: providing a casing, the casing being made of a signal shielding material and having a predetermined area, wherein the predetermined area comprises a first a surface and a second surface; at least one support structure is formed on the first surface of the predetermined area such that the support structure protrudes from the first surface; and a laser cutting machine pair is Locating the second surface of the preset area and cutting the preset area into a preset number of micro slits, the preset number of micro slits being spaced apart from each other, each of the support structures spanning The preset number of micro slits to connect the housing as a whole; placing the housing between a dispenser and a suction fixture, the first surface of the housing a pair of plastic heads facing the dispenser, the second surface facing the suction jig, the dispenser dispensing the predetermined number of micro slits, and the suction treatment Having aspiration to the predetermined number of non-signal shielding materials within the micro-slit, the non-signal Shielding material is a glue; and said predetermined number of slits signal non-shielding material is cured; and removal of the support structure. 根據申請專利範圍第1項所述的方法,其中,在所述將所述殼體放置於點膠機和吸氣治具之間的步驟之前,還包括:一清洗所述殼體的步驟。 The method of claim 1, wherein before the step of placing the casing between the dispenser and the suction jig, the method further comprises the step of cleaning the casing. 根據申請專利範圍第2項所述的方法,其中,在所述將所述殼體放置於點膠機和吸氣治具之間的步驟之前,還包括:一去除所述殼體的毛刺和髒污的步驟。 The method of claim 2, wherein before the step of placing the casing between the dispenser and the suction jig, the method further comprises: removing a burr of the casing and Dirty steps. 根據申請專利範圍第3項所述的方法,其中,在所述對所述預設數量的微縫內非信號屏蔽材料進行固化的步驟後,還包括: 一利用數控機床去除所述殼體上的非信號屏蔽材料的步驟。 The method of claim 3, wherein after the step of curing the non-signal shielding material in the predetermined number of micro slits, the method further comprises: A step of removing a non-signal shielding material on the housing using a numerically controlled machine tool. 根據申請專利範圍第4項所述的方法,其中,通過數控機床去除所述殼體的預設厚度的料厚來去除所述殼體上的非信號屏蔽材料。 The method of claim 4, wherein the non-signal shielding material on the housing is removed by removing a predetermined thickness of the housing by a numerically controlled machine tool. 根據申請專利範圍第4項所述的方法,其中,在所述利用數控機床去除所述殼體上的非信號屏蔽材料的步驟後,還包括:一對所述殼體進行表面拋光、噴砂或陽極氧化的至少一種表面處理的步驟。 The method of claim 4, wherein after the step of removing the non-signal shielding material on the casing by the numerically controlled machine tool, the method further comprises: surface polishing, sandblasting or At least one surface treatment step of anodizing. 根據申請專利範圍第1~6項的任意一項所述的方法,其中,所述微縫的縫寬小於0.3mm。 The method according to any one of claims 1 to 6, wherein the slit width of the micro slit is less than 0.3 mm. 根據申請專利範圍第1~6項的任意一項所述的方法,其中,所述殼體為移動終端的背蓋。 The method of any one of claims 1 to 6, wherein the housing is a back cover of the mobile terminal. 根據申請專利範圍第8項所述的方法,其中,所述第一表面為所述殼體的內側表面,所述第二表面為所述殼體的外側表面。 The method of claim 8, wherein the first surface is an inner side surface of the housing, and the second surface is an outer side surface of the housing. 根據申請專利範圍第9項所述的方法,其中,在製作所述殼體的步驟中,包括:一將金屬板材放入模具中衝壓成預設形狀的金屬板的步驟;以及一在數控機床上對所述預設形狀的金屬板進行內部結構和外部造型的加工以獲得殼體的步驟。 The method of claim 9, wherein the step of fabricating the casing comprises: a step of placing a metal sheet into a mold and stamping into a metal plate of a predetermined shape; and The step of processing the internal structure and the external shape of the predetermined shape of the metal plate on the bed to obtain a casing. 根據申請專利範圍第1~6項的任意一項所述的方法,其中,在所述將雷射切割機對準所述預設區域的第二表面切割出預設數量的微縫,所述預設數量的微縫間隔並列設置,所述支撐結構遮擋所述預設數量的微縫的步驟中,包括:一在雷射切割過程中進行輔助降溫處理的步驟。 The method of any one of clauses 1 to 6, wherein the cutting the laser cutting machine to align a second surface of the predetermined area to cut a predetermined number of micro slits, The preset number of micro slit spacings are juxtaposed, and the step of blocking the predetermined number of micro slits by the supporting structure comprises: a step of performing an auxiliary cooling process during the laser cutting process. 根據申請專利範圍第11項所述的方法,其中,所述輔助降溫處理為高壓氮氣輔助降溫處理。 The method of claim 11, wherein the auxiliary cooling treatment is a high pressure nitrogen assisted cooling treatment. 根據申請專利範圍第1~6項的任意一項所述的方法,其中,在所述將所述支撐結構切除的步驟中,更包括:一通過數控機床將所述支撐結構切除的步驟。 The method of any one of clauses 1 to 6, wherein the step of cutting the support structure further comprises: a step of cutting the support structure by a numerically controlled machine tool. 一種殼體,其特徵在於,所述殼體由信號屏蔽材料製成且具有預設區域;所述預設區域設置有預設數量的微縫,所述預設數量的微縫彼此間隔並列設置,每個所述微縫中填充有非信號屏蔽材料形成淨空區域,所述淨空區域用於通過射頻信號,所述非信號屏蔽材料為膠水,所述非信號屏蔽材料經點膠機和一吸氣治具填充于所述微縫內,并經固化工藝成型。 A housing, wherein the housing is made of a signal shielding material and has a preset area; the preset area is provided with a preset number of micro slits, and the preset number of micro slits are arranged side by side with each other Each of the micro slits is filled with a non-signal shielding material for forming a clearance area, the clearance area is for passing a radio frequency signal, the non-signal shielding material is glue, and the non-signal shielding material is passed through a dispenser and a suction The gas jig is filled in the micro slit and formed by a curing process. 根據申請專利範圍第14項所述的殼體,其中所述微縫的縫寬小於0.3mm。 The casing of claim 14, wherein the slit has a slit width of less than 0.3 mm. 一種移動終端,其特徵在於,包括如申請專利範圍第14~15項任意一項所述的殼體。 A mobile terminal, comprising the housing according to any one of claims 14 to 15.
TW106109046A 2016-03-18 2017-03-17 Processing method of case clearance zone, case, and mobile terminal TWI639373B (en)

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