TWI637450B - Mounting device and mounting method - Google Patents
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- TWI637450B TWI637450B TW103141074A TW103141074A TWI637450B TW I637450 B TWI637450 B TW I637450B TW 103141074 A TW103141074 A TW 103141074A TW 103141074 A TW103141074 A TW 103141074A TW I637450 B TWI637450 B TW I637450B
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1076—Shape of the containers
- H01L2225/1088—Arrangements to limit the height of the assembly
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
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Abstract
本發明提供一種對設置於基板之複數個安裝區塊之每一個以利用焊料之方法安裝子基板時，縮短安裝週期時間而提昇生產性的安裝裝置及安裝方法。具體而言，提供一種安裝裝置及安裝方法，該安裝裝置具備：加壓機構，其於基板之安裝區塊將子基板加壓；及基板平台，其載置基板；基板平台設置有基板搬入區域與基板搬出區域，且具備將基板自基板搬入區域移動至基板搬出區域之基板移動機構，基板搬入區域與基板搬出區域係以與基板之安裝區塊對應之區劃利用區塊而劃分，各區塊包含具備可加熱至使焊料熔融之溫度之加熱機構的區塊、及保持為助焊劑不會揮發之溫度以下的區塊，且於基板搬入區域具備至少1個保持為助焊劑不會揮發之溫度以下的區塊。 The present invention provides a mounting apparatus and a mounting method for improving the productivity by shortening the mounting cycle time when mounting a sub-substrate by soldering each of a plurality of mounting blocks provided on a substrate. Specifically, a mounting device and a mounting method are provided, the mounting device includes: a pressurizing mechanism that presses a sub-substrate in a mounting block of the substrate; and a substrate platform on which the substrate is placed; and the substrate platform is provided with a substrate loading area a substrate moving mechanism that moves the substrate from the substrate loading area to the substrate carrying-out area, and the substrate loading area and the substrate carrying-out area are divided by the partitioning block corresponding to the mounting block of the substrate, and each block is divided. a block including a heating mechanism capable of heating to a temperature at which the solder is melted, and a block having a temperature at which the flux does not volatilize, and at least one temperature at which the flux is not volatilized in the substrate carrying region The following blocks.
Description
本發明係關於一種於安裝有半導體晶片之基板進而積層子基板的安裝裝置及安裝方法。 The present invention relates to a mounting apparatus and a mounting method for stacking a sub-substrate on a substrate on which a semiconductor wafer is mounted.
近年來，要求安裝有半導體晶片之基板之高密度安裝。作為高密度安裝之其中之一，存在稱為零件內置基板或零件埋設基板、嵌入式基板之基板。將零件埋設基板之一例示於圖7。圖7係零件埋設基板之概略側視圖，於基底基板50覆晶連接有半導體晶片51，於半導體晶片51之周邊，配置有可藉由焊料凸塊53與子基板52連接之電極墊54。將子基板52與基底基板50對準位置之後，利用熱壓接方法將焊料凸塊53與電極墊54焊接。於基底基板50與半導體晶片51之空隙填充樹脂55(例如專利文獻1所示之半導體封裝)。 In recent years, high-density mounting of substrates on which semiconductor wafers are mounted has been demanded. As one of the high-density mountings, there is a substrate called a component-embedded substrate, a component-embedded substrate, and an embedded substrate. An example of embedding a part of the substrate is shown in FIG. 7 is a schematic side view of the embedded substrate of the component. The semiconductor wafer 51 is flip-chip bonded to the base substrate 50, and an electrode pad 54 connectable to the sub-substrate 52 by the solder bumps 53 is disposed around the semiconductor wafer 51. After the sub-substrate 52 is aligned with the base substrate 50, the solder bumps 53 are soldered to the electrode pads 54 by a thermocompression bonding method. The resin 55 is filled in the gap between the base substrate 50 and the semiconductor wafer 51 (for example, the semiconductor package shown in Patent Document 1).
於圖8中表示基底基板50與子基板52之概略立體圖。於基底基板50，安裝有複數個半導體晶片51。又，以覆蓋複數個半導體晶片51各者之方式，安裝子基板52。例如，於圖8之基底基板50之情形時，並排安裝2片子基板52。以下，將與子基板52對應之基底基板50之安裝區域稱為安裝區塊。於圖8之情形時，於基底基板50設置有第1安裝區塊301與第2安裝區塊302。於安裝子基板52時，基底基板50係吸附保持於基板平台60。將基板平台60之概略俯視圖示於圖9。基板平台60係與子基板52之安裝區塊對應地，如第1區塊61、第2區塊63般以區塊為單位劃分，於各區塊中埋設有第1平台加熱器62、第2平台加熱器 64。 A schematic perspective view of the base substrate 50 and the sub-substrate 52 is shown in FIG. A plurality of semiconductor wafers 51 are mounted on the base substrate 50. Further, the sub-substrate 52 is mounted so as to cover each of the plurality of semiconductor wafers 51. For example, in the case of the base substrate 50 of Fig. 8, two sub-substrates 52 are mounted side by side. Hereinafter, the mounting region of the base substrate 50 corresponding to the sub-substrate 52 is referred to as a mounting block. In the case of FIG. 8, the first mounting block 301 and the second mounting block 302 are provided on the base substrate 50. When the sub-substrate 52 is mounted, the base substrate 50 is adsorbed and held on the substrate stage 60. A schematic plan view of the substrate stage 60 is shown in FIG. The substrate platform 60 is divided into blocks according to the first block 61 and the second block 63, and the first platform heater 62 is embedded in each block, corresponding to the mounting block of the sub-substrate 52. 2 platform heater 64.
於圖10中表示按照第1安裝區塊301、第2安裝區塊302之順序安裝子基板52之情形時的安裝週期。當於第1安裝區塊301安裝子基板52時，進行第1區塊61之第1平台加熱器62之升溫，以特定之時間進行加壓與加熱。其後，第1平台加熱器62成為關閉狀態而開始自然冷卻。設置於子基板52之焊料凸塊53自熔融溫度逐漸冷卻至固相溫度以下。繼而，開始埋設於與第1區塊61相鄰之第2區塊63的第2平台加熱器64之升溫。與第1安裝區塊301同樣地，於第2安裝區塊302對子基板52進行特定時間之加壓及加熱。其後，第2平台加熱器64成為關閉狀態，開始自然冷卻。將基底基板50自基板平台60送出(搬出)。於基底基板50之電極墊54，塗佈有用以於焊接時去除金屬表面之氧化膜而進行良好之焊接的助焊劑56。助焊劑56由於具有揮發性，故而於進行焊接前必須保持為不會揮發之溫度。因此，於基板平台60自然冷卻至助焊劑56不會揮發之溫度以下後，可將新的基底基板50投入(搬入)至基板平台60。如此，對一片基底基板50之安裝週期成為第1安裝區塊301之焊接時間+第2安裝區塊302之焊接時間+基板平台60之冷卻時間(直至成為助焊劑不會揮發之溫度為止之時間)的關係。再者，關閉一度加熱之平台加熱器而自然冷卻直至達到助焊劑不會揮發之溫度以下的時間、與對1個安裝區塊之安裝時間需要大致相同之時間。 The mounting cycle in the case where the sub-substrate 52 is mounted in the order of the first mounting block 301 and the second mounting block 302 is shown in FIG. When the sub-substrate 52 is mounted on the first mounting block 301, the temperature rise of the first stage heater 62 of the first block 61 is performed, and pressurization and heating are performed for a specific period of time. Thereafter, the first stage heater 62 is turned off and natural cooling is started. The solder bumps 53 provided on the sub-substrate 52 are gradually cooled from the melting temperature to below the solid phase temperature. Then, the temperature rise of the second stage heater 64 buried in the second block 63 adjacent to the first block 61 is started. Similarly to the first mounting block 301, the sub-substrate 52 is pressurized and heated for a specific time in the second mounting block 302. Thereafter, the second stage heater 64 is turned off, and natural cooling is started. The base substrate 50 is fed (lifted out) from the substrate stage 60. The electrode pad 54 of the base substrate 50 is coated with a flux 56 for performing good soldering by removing an oxide film on the metal surface during soldering. Since the flux 56 is volatile, it must be kept at a temperature that does not volatilize before soldering. Therefore, after the substrate stage 60 is naturally cooled to a temperature below which the flux 56 does not volatilize, the new base substrate 50 can be loaded (loaded) into the substrate stage 60. Thus, the mounting period of one base substrate 50 becomes the welding time of the first mounting block 301 + the soldering time of the second mounting block 302 + the cooling time of the substrate platform 60 (until the temperature at which the flux does not volatilize) )Relationship. Further, the time during which the once heated heater is turned off and naturally cooled until the temperature at which the flux does not evaporate is required to be substantially the same as the installation time for one mounting block.
專利文獻1：日本專利特開2012-9713號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-9713
因此，在基板平台60成為不使助焊劑揮發之溫度以下之前，無法投入(搬入)下一基底基板，因此存在安裝週期時間變長而生產性無 法提昇之問題。 Therefore, before the substrate stage 60 is at a temperature equal to or lower than the temperature at which the flux is not volatilized, the next base substrate cannot be loaded (loaded), so that the mounting cycle time is long and the productivity is not present. The problem of law improvement.
因此，本發明之課題在於提供一種當對設置於基板之複數個安裝區塊之每一個以利用焊料之方法安裝子基板時，縮短安裝週期時間而生產性提昇的安裝裝置及安裝方法。 Accordingly, an object of the present invention is to provide a mounting apparatus and a mounting method which are improved in productivity when a sub-substrate is mounted by soldering for each of a plurality of mounting blocks provided on a substrate.
為了解決上述問題，技術方案1之發明係一種安裝裝置，其係對設置於基板之複數個安裝區塊之每一個焊接子基板者，且具備：加壓機構，其於基板之安裝區塊將子基板加壓；及基板平台，其載置基板；基板平台設置有基板搬入區域與基板搬出區域，且具備將基板自基板搬入區域移動至基板搬出區域之基板移動機構，基板搬入區域與基板搬出區域係以與基板之安裝區塊對應之區劃利用區塊而劃分，各區塊包含具備可加熱至使焊料熔融之溫度之加熱機構的區塊、及保持為助焊劑不會揮發之溫度以下的區塊，於基板搬入區域具備至少1個保持為助焊劑不會揮發之溫度以下的區塊，且上述安裝裝置具備控制機構，該控制機構於將基板投入至基板搬入區域後，對與保持為助焊劑不會揮發之溫度之區塊以外之區塊對應的基板之安裝區塊焊接子基板後，關閉基板搬入區域之所有具備加熱機構之區塊，將基板移動至基板搬出區域，而對未安裝子基板之安裝區塊焊接子基板。 In order to solve the above problems, the invention of claim 1 is a mounting device for each of the plurality of mounting blocks disposed on the substrate, and includes: a pressurizing mechanism, which is mounted on the mounting portion of the substrate Substrate pressing; and a substrate platform on which the substrate is placed; the substrate platform is provided with a substrate loading area and a substrate carrying-out area, and a substrate moving mechanism for moving the substrate from the substrate loading area to the substrate carrying-out area, and the substrate loading area and the substrate are carried out The region is divided by the partitions corresponding to the mounting blocks of the substrate, and each of the blocks includes a block having a heating mechanism that can be heated to a temperature at which the solder is melted, and a temperature that is maintained below a temperature at which the flux does not volatilize. The block has at least one block that is kept at a temperature below the temperature at which the flux does not volatilize in the substrate loading area, and the mounting device includes a control mechanism that holds and holds the substrate after the substrate is loaded into the substrate loading area. The flux does not volatilize the temperature of the block other than the block corresponding to the mounting block of the substrate after the solder sub-substrate, the substrate is turned off All of the blocks with a heating means into the area, moving the substrate to the substrate carry-out area, and the sub-block for mounting the soldered board is not installed submount.
根據技術方案1之發明，於基板平台設置有基板搬入區域與基板搬出區域，且具備將基板自基板搬入區域移動至基板搬出區域之基板 移動機構。由於對與保持為助焊劑不會揮發之溫度之區塊以外之區塊對應的基板之安裝區塊焊接子基板，然後關閉基板搬入區域之所有具備加熱機構之區塊，並將基板移動至基板搬出區域，對未安裝子基板之安裝區塊焊接子基板，故而可將基板搬入區域之各區塊保持為助焊劑不會揮發之溫度。因此，於最後之安裝區塊之焊接後，無須等待至基板平台之區塊冷卻之時間，便可將新的基板投入至基板搬入區域。因此，可縮短安裝週期時間，而提昇生產性。再者，設為當關閉具備加熱機構之區塊時，於一次焊接時間內，冷卻至不使助焊劑揮發之溫度。 According to the invention of claim 1, the substrate loading region and the substrate carrying-out region are provided on the substrate platform, and the substrate for moving the substrate from the substrate loading region to the substrate carrying-out region is provided. Mobile agency. Since the sub-substrate is soldered to the mounting block of the substrate corresponding to the block other than the block which is maintained at a temperature at which the flux does not volatilize, then all the blocks having the heating mechanism in the substrate carrying-in area are closed, and the substrate is moved to the substrate. In the carry-out area, the sub-substrate is soldered to the mounting block in which the sub-substrate is not mounted, so that each block in the substrate carrying-in area can be maintained at a temperature at which the flux does not volatilize. Therefore, after the soldering of the last mounting block, the new substrate can be put into the substrate loading area without waiting for the time to cool the block of the substrate platform. Therefore, the installation cycle time can be shortened and productivity can be improved. Further, when the block having the heating means is turned off, it is cooled to a temperature at which the flux is not volatilized during one welding time.
技術方案2之發明係如技術方案1之安裝裝置，其中基板搬入區域與基板搬出區域係串聯配置，且於基板搬入區域與基板搬出區域之共用區域具備保持為助焊劑不會揮發之溫度以下之區塊。 According to a second aspect of the invention, in the mounting apparatus of the first aspect, the substrate loading area and the substrate carrying-out area are arranged in series, and the common area between the substrate carrying-in area and the substrate carrying-out area is maintained at a temperature below which the flux does not volatilize. Block.
根據技術方案2之發明，由於具備基板搬入區域與基板搬出區域之共用區域，故而若於在基板搬出區域對基板之最後之安裝區塊焊接子基板後，進行基板之送出，則基板搬入區域之各區塊可保持為助焊劑不會揮發之溫度，進而可藉由共用化實現設備之省空間化。 According to the invention of the second aspect of the invention, since the substrate loading region and the substrate carrying-out region are shared, when the substrate is soldered to the last mounting portion of the substrate in the substrate carrying-out region, the substrate is transferred, and the substrate loading region is Each block can be kept at a temperature at which the flux does not volatilize, and the space saving of the device can be realized by sharing.
技術方案3之發明係如技術方案1之安裝裝置，其中基板搬入區域與基板搬出區域係串聯或並聯配置，且該安裝裝置具備控制機構，該控制機構係控制於基板搬出區域將子基板焊接於基板之過程中將新的基板投入至基板搬入區域。 The invention of claim 3 is the mounting device according to claim 1, wherein the substrate loading area and the substrate carrying-out area are arranged in series or in parallel, and the mounting device includes a control mechanism that controls the sub-substrate to be soldered to the substrate carrying-out area. A new substrate is loaded into the substrate loading area during the substrate process.
根據技術方案3之發明，由於當在基板搬出區域焊接子基板時將新的基板搬入至基板搬入區域，故而可縮短對一片基板之安裝週期時間。 According to the invention of claim 3, since the new substrate is carried into the substrate loading region when the sub-substrate is soldered in the substrate carrying-out region, the mounting cycle time for one substrate can be shortened.
技術方案4之發明係如技術方案2或3之安裝裝置，其中於加壓機構具備加熱子基板之加熱機構。 The invention of claim 4 is the mounting device according to claim 2 or 3, wherein the pressurizing mechanism is provided with a heating mechanism for heating the sub-substrate.
根據技術方案4之發明，由於在加壓機構具備加熱機構，故而子 基板係由基板平台與加壓機構加熱，而可於短時間內進行子基板之焊接。 According to the invention of claim 4, since the heating mechanism is provided in the pressurizing mechanism, The substrate is heated by the substrate stage and the pressing mechanism, and the sub-substrate can be soldered in a short time.
技術方案5之發明係如技術方案4之安裝裝置，其中於基板平台之加熱機構具備冷卻機構。 The invention of claim 5 is the mounting device of claim 4, wherein the heating mechanism on the substrate platform is provided with a cooling mechanism.
根據技術方案5之發明，由於在基板平台之加熱機構具備冷卻機構，故而可藉由冷卻機構使經加熱之區塊更快地冷卻，從而可縮短一片基板之安裝週期。 According to the invention of claim 5, since the heating mechanism of the substrate stage is provided with the cooling mechanism, the heated block can be cooled more quickly by the cooling mechanism, whereby the mounting period of one substrate can be shortened.
技術方案6之發明係一種安裝方法，其係對設置於基板之複數個安裝區塊之每一個焊接子基板者，且使用安裝裝置進行安裝，該安裝裝置具備：加壓機構，其於基板之安裝區塊將子基板加壓；及基板平台，其載置基板；基板平台設置有基板搬入區域與基板搬出區域，且具備將基板自基板搬入區域移動至基板搬出區域之基板移動機構，基板搬入區域與基板搬出區域係以與基板之安裝區塊對應之區劃利用區塊而劃分，各區塊包含具備可加熱至使焊料熔融之溫度之加熱機構的區塊、及保持為助焊劑不會揮發之溫度以下的區塊，且於基板搬入區域具備至少1個保持為助焊劑不會揮發之溫度以下的區塊；且該安裝方法包含如下步驟：將基板投入至基板搬入區域；對與保持為助焊劑不會揮發之溫度之區塊以外之區塊對應的基板之安裝區塊焊接子基板；關閉基板搬入區域之所有具備加熱機構之區塊；將基板移動至基板搬出區域； 對未安裝子基板之安裝區塊焊接子基板；及將已於所有安裝區塊焊接子基板之基板自基板搬出區域送出。 The invention of claim 6 is a mounting method for each of the plurality of mounting blocks disposed on the substrate, and mounting using a mounting device, the mounting device having: a pressurizing mechanism on the substrate The mounting block presses the sub-substrate; and the substrate platform mounts the substrate; the substrate platform is provided with the substrate loading area and the substrate carrying-out area, and includes a substrate moving mechanism for moving the substrate from the substrate carrying-in area to the substrate carrying-out area, and the substrate is moved in The area and the substrate carry-out area are divided by the partitions corresponding to the mounting blocks of the substrate, and each of the blocks includes a block having a heating mechanism that can be heated to a temperature at which the solder is melted, and the flux is kept from being volatilized. a block having a temperature lower than the temperature, and at least one block having a temperature at which the flux does not volatilize is provided in the substrate carrying-in region; and the mounting method includes the steps of: loading the substrate into the substrate carrying-in region; The soldering sub-substrate of the mounting block of the substrate corresponding to the block other than the block where the flux does not volatilize; closing the substrate All the heating means includes a block of area; moving the substrate to the substrate carry-out region; The soldering sub-substrate is mounted on the mounting block in which the sub-substrate is not mounted; and the substrate on which the sub-substrate is soldered in all the mounting blocks is sent out from the substrate carrying-out area.
根據技術方案6之發明，由於基板搬入區域之各區塊於在基板搬出區域對未安裝之安裝區塊焊接子基板後，可保持為助焊劑不會揮發之溫度，故而可將新的基板投入至基板搬入區域。因此，可縮短將子基板安裝於一片基板之週期時間。 According to the invention of claim 6, since each of the blocks in the substrate loading area is soldered to the unmounted mounting block in the substrate carrying-out area, the temperature can be maintained at a temperature at which the flux does not volatilize, so that a new substrate can be put into operation. To the substrate loading area. Therefore, the cycle time for mounting the sub-substrate on one substrate can be shortened.
根據本發明，可提供一種當對設置於基板之複數個安裝區塊之每一個以利用焊料之方法安裝子基板時，縮短安裝週期時間而生產性提昇的安裝裝置及安裝方法。 According to the present invention, it is possible to provide a mounting device and a mounting method which are improved in productivity when the sub-substrate is mounted by soldering each of a plurality of mounting blocks provided on a substrate.
1‧‧‧安裝裝置 1‧‧‧Installation device
8‧‧‧鍵合頭 8‧‧‧ Bonding head
13‧‧‧雙視野相機 13‧‧‧Double-field camera
20‧‧‧控制部 20‧‧‧Control Department
25‧‧‧基板移動治具 25‧‧‧Substrate mobile fixture
26‧‧‧臂 26‧‧‧ Arm
27‧‧‧滑塊 27‧‧‧ Slider
30‧‧‧基板搬入區域 30‧‧‧Substrate loading area
40‧‧‧基板搬出區域 40‧‧‧Substrate removal area
50‧‧‧基底基板 50‧‧‧Base substrate
51‧‧‧半導體晶片 51‧‧‧Semiconductor wafer
52‧‧‧子基板 52‧‧‧Subsubstrate
53‧‧‧焊料凸塊 53‧‧‧ solder bumps
54‧‧‧電極墊 54‧‧‧electrode pad
55‧‧‧樹脂 55‧‧‧Resin
56‧‧‧助焊劑 56‧‧‧ Flux
60‧‧‧基板平台 60‧‧‧Base platform
60A‧‧‧基板搬入區域 60A‧‧‧Substrate loading area
60B‧‧‧基板搬出區域 60B‧‧‧Substrate removal area
61‧‧‧第1區塊 61‧‧‧1st block
61A‧‧‧第1區塊 Block 61A‧‧‧1
61B‧‧‧第1區塊 61B‧‧‧1st block
62‧‧‧第1平台加熱器 62‧‧‧1st platform heater
63‧‧‧第2區塊 63‧‧‧ Block 2
63A‧‧‧第2區塊 63A‧‧‧ Block 2
63B‧‧‧第2區塊 63B‧‧‧ Block 2
64‧‧‧第2平台加熱器 64‧‧‧2nd platform heater
301‧‧‧第1安裝區塊 301‧‧‧1st installation block
302‧‧‧第2安裝區塊 302‧‧‧2nd installation block
X‧‧‧軸 X‧‧‧ axis
Y‧‧‧軸 Y‧‧‧ axis
Z‧‧‧軸 Z‧‧‧ axis
圖1係本發明之安裝裝置之概略側視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic side view of a mounting device of the present invention.
圖2係對安裝區塊為2個之基底基板焊接子基板的基板平台之概略俯視圖。 2 is a schematic plan view of a substrate platform of a base substrate solder sub-substrate having two mounting blocks.
圖3係安裝裝置之動作流程圖。 Figure 3 is a flow chart showing the operation of the mounting device.
圖4係對安裝週期進行說明之圖。 Fig. 4 is a diagram for explaining the installation cycle.
圖5(a)~(c)係基板搬入區域與基板搬出區域之區塊之一部分為共用之區塊的基板平台之概略俯視圖。 5(a) to 5(c) are schematic plan views of a substrate platform in which one of the blocks in the substrate loading area and the substrate carrying-out area is a shared block.
圖6(a)~(c)係基板之安裝區塊為n個時所使用之基板平台的概略俯視圖。 6(a) to 6(c) are schematic plan views of a substrate platform used when n mounting blocks are used.
圖7係零件埋設基板之概略側視圖。 Fig. 7 is a schematic side view showing a part buried substrate.
圖8係基底基板與子基板之概略立體圖。 Fig. 8 is a schematic perspective view of a base substrate and a sub-substrate.
圖9係基板平台之概略俯視圖。 Figure 9 is a schematic plan view of a substrate platform.
圖10係對先前之安裝週期進行說明之圖。 Figure 10 is a diagram illustrating the previous installation cycle.
參照圖式對本發明之實施形態進行說明。圖1係本發明之安裝裝 置1之概略側視圖。於圖1中，朝向安裝裝置1而將左右方向設為X軸，將前後方向設為Y軸，將與由X軸與Y軸構成之XY平面正交之軸設為Z軸(上下方向)，將繞Z軸之方向設為θ軸。 Embodiments of the present invention will be described with reference to the drawings. Figure 1 is the installation of the present invention A schematic side view of the setting 1. In FIG. 1, the left-right direction is set to the X-axis, the front-back direction is set to the Y-axis, and the axis orthogonal to the XY plane formed by the X-axis and the Y-axis is set to the Z-axis (up-and-down direction) toward the mounting device 1. The direction around the Z axis is set to the θ axis.
安裝裝置1包含：基板平台60，其吸附保持基底基板50；鍵合頭8，其吸附保持子基板52；雙視野相機13，其辨識設置於子基板52與基底基板50之位置對準標記；及控制部20，其控制安裝裝置1整體。 The mounting device 1 includes a substrate platform 60 that adsorbs and holds the base substrate 50, a bonding head 8 that adsorbs and holds the sub-substrate 52, and a dual-view camera 13 that recognizes a positional alignment mark disposed on the sub-substrate 52 and the base substrate 50; And a control unit 20 that controls the entire mounting device 1.
基板平台60連接有未圖示之抽吸泵等抽吸機構與配管，從而可吸附保持基板平台60上之基底基板50。又，基板平台60可沿水平方向(XY方向)移動。 A suction mechanism such as a suction pump (not shown) and a pipe are connected to the substrate stage 60, so that the base substrate 50 on the substrate stage 60 can be adsorbed and held. Further, the substrate stage 60 is movable in the horizontal direction (XY direction).
於圖2中表示基板平台60之概略俯視圖。基板平台60分為基板搬入區域60A與基板搬出區域60B。未安裝子基板52之基底基板50係搬入至基板搬入區域60A。基底基板50自基板搬入區域60A向基板搬出區域60B之移動係使用基板移動治具25。基板移動治具25例如包含：臂26，其固持基底基板50之兩側；及滑塊27，其使臂26水平移動。基板移動治具25與本發明之基板移動機構對應。 A schematic plan view of the substrate stage 60 is shown in FIG. The substrate stage 60 is divided into a substrate loading area 60A and a substrate carrying-out area 60B. The base substrate 50 on which the sub-substrate 52 is not mounted is carried into the substrate carrying-in area 60A. The base substrate 50 moves from the substrate loading area 60A to the substrate carrying-out area 60B using the substrate moving jig 25 . The substrate moving jig 25 includes, for example, an arm 26 that holds both sides of the base substrate 50, and a slider 27 that horizontally moves the arm 26. The substrate moving jig 25 corresponds to the substrate moving mechanism of the present invention.
基板搬入區域60A與基板搬出區域60B係與基底基板50之安裝區塊對應地劃分區塊。圖2表示基底基板50之安裝區塊為2個之情形時之基板平台60之例。將基板搬入區域60A側之區塊分別設為第1區塊61A、第2區塊63A。又，將基板搬出區域60B側之安裝區塊分別設為第1區塊61B、第2區塊63B。加熱安裝區塊之平台加熱器係配置於2個部位，分別於第1區塊60A埋設有第1平台加熱器62，於第2區塊63B埋設有第2平台加熱器64。第1平台加熱器62與第2平台加熱器64於對基底基板50焊接子基板52時，能夠加熱至可使焊料熔融之溫度。於基板搬入區域60A側之第2區塊63A、與基板搬出區域60B側之第1區塊61B未埋設平台加熱器，而保持為塗佈於基底基板50之電極墊54之助焊劑56不會揮發之溫度以下。 The substrate loading area 60A and the substrate carrying-out area 60B are divided into blocks corresponding to the mounting blocks of the base substrate 50. FIG. 2 shows an example of the substrate stage 60 in the case where the mounting substrate of the base substrate 50 is two. The blocks on the substrate loading area 60A side are referred to as a first block 61A and a second block 63A, respectively. Moreover, the mounting blocks on the side of the substrate carry-out area 60B are respectively the first block 61B and the second block 63B. The platform heaters for heating the mounting blocks are disposed at two locations, and the first platform heater 62 is embedded in the first block 60A, and the second stage heater 64 is embedded in the second block 63B. When the first stage heater 62 and the second stage heater 64 are used to weld the sub-substrate 52 to the base substrate 50, the first stage heater 62 can be heated to a temperature at which the solder can be melted. The second block 63A on the substrate carrying-in area 60A side and the first block 61B on the side of the substrate carrying-out area 60B are not embedded with the stage heater, and the flux 56 applied to the electrode pad 54 of the base substrate 50 is not held. Below the temperature of volatilization.
鍵合頭8可沿Z軸方向及θ軸方向移動，且可吸附保持子基板52並於基底基板50之安裝區塊進行加壓及加熱。又，鍵合頭8連接有未圖示之抽吸泵等抽吸機構與配管而可吸附保持子基板52。鍵合頭8與本發明之加壓機構對應。 The bonding head 8 is movable in the Z-axis direction and the θ-axis direction, and can hold and hold the sub-substrate 52 and pressurize and heat the mounting block of the base substrate 50. Further, the bonding head 8 is connected to a suction mechanism such as a suction pump (not shown) and a pipe to adsorb and hold the sub-substrate 52. The bonding head 8 corresponds to the pressurizing mechanism of the present invention.
基底基板50與子基板52係如圖7所示，成為將轉印有助焊劑56之焊料凸塊53焊接於設置於基底基板50之電極墊54的構成。又，於基底基板50，如圖8所示，安裝區塊係設置有第1安裝區塊301、第2安裝區塊302。基底基板50與本發明之基板對應。 As shown in FIG. 7, the base substrate 50 and the sub-substrate 52 have a configuration in which the solder bumps 53 to which the flux 56 is transferred are soldered to the electrode pads 54 provided on the base substrate 50. Further, as shown in FIG. 8, the base substrate 50 is provided with a first mounting block 301 and a second mounting block 302. The base substrate 50 corresponds to the substrate of the present invention.
利用圖3之動作流程圖於下文對使用以此方式構成之安裝裝置1對未安裝子基板52之基底基板50安裝子基板52並投入(搬入)新的基底基板50的次序進行說明。 The procedure for mounting the sub-substrate 52 to the base substrate 50 on which the sub-substrate 52 is not mounted and loading (moving in) the new base substrate 50 will be described below using the mounting apparatus 1 configured as described above.
首先，將基底基板50投入(搬入)至基板平台60之基板搬入區域60A(步驟SP01)。 First, the base substrate 50 is loaded (loaded) into the substrate loading area 60A of the substrate stage 60 (step SP01).
繼而，以使第1區塊61A位於鍵合頭8之下側之方式使基板平台60移動(步驟SP02)。 Then, the substrate stage 60 is moved in such a manner that the first block 61A is positioned on the lower side of the bonding head 8 (step SP02).
繼而，於吸附保持有子基板52之鍵合頭8與基底基板50之間，插入雙視野相機13而進行基底基板50之第1安裝區塊301與子基板52之位置對準(步驟SP03)。 Then, the double-view camera 13 is inserted between the bonding head 8 that adsorbs and holds the sub-substrate 52 and the base substrate 50, and the first mounting block 301 of the base substrate 50 is aligned with the sub-substrate 52 (step SP03). .
繼而，使埋設於第1區塊61A之第1平台加熱器62升溫(步驟SP04)。 Then, the first stage heater 62 buried in the first block 61A is heated (step SP04).
繼而，使鍵合頭8下降，於基底基板50之第1安裝區塊301將子基板52加壓。藉由來自第1平台加熱器62之加熱，子基板52之焊料凸塊53開始熔融(步驟SP05)。 Then, the bonding head 8 is lowered, and the sub-substrate 52 is pressurized in the first mounting block 301 of the base substrate 50. The solder bumps 53 of the sub-substrate 52 start to be melted by heating from the first stage heater 62 (step SP05).
繼而，於對基底基板50進行特定時間之加壓後，解除子基板52之吸附保持，使鍵合頭8上升，並關閉第1區塊61A之第1平台加熱器62。開始焊料凸塊53之固相及第1區塊61A之自然冷卻(步驟SP06)。 Then, after the base substrate 50 is pressurized for a specific period of time, the adsorption holding of the sub-substrate 52 is released, the bonding head 8 is raised, and the first stage heater 62 of the first block 61A is closed. The solid phase of the solder bumps 53 and the natural cooling of the first block 61A are started (step SP06).
繼而，使用基板移動治具25使基底基板50自基板搬入區域60A移動至基板搬出區域60B。由於基板搬出區域60B之第1區塊61B保持為助焊劑56不會揮發之溫度以下，故而基底基板50之焊接有子基板52之第1安裝區塊301繼續冷卻(步驟SP07)。 Then, the base substrate 50 is moved from the substrate loading region 60A to the substrate carrying-out region 60B by using the substrate moving jig 25 . Since the first block 61B of the substrate carry-out area 60B is kept at a temperature below which the flux 56 does not volatilize, the first mounting block 301 of the base substrate 50 to which the sub-substrate 52 is soldered is continuously cooled (step SP07).
繼而，使基板平台60水平移動而使基板搬出區域60B之第2區塊63B來到鍵合頭8之下側(步驟SP08)。 Then, the substrate stage 60 is horizontally moved so that the second block 63B of the substrate carry-out area 60B comes to the lower side of the bonding head 8 (step SP08).
繼而，於吸附保持有子基板52之鍵合頭8與基底基板50之間，插入雙視野相機13而進行基底基板50之第2安裝區塊302與子基板52之位置對準(步驟SP09)。 Then, the double-view camera 13 is inserted between the bonding head 8 that adsorbs and holds the sub-substrate 52 and the base substrate 50, and the second mounting block 302 of the base substrate 50 is aligned with the sub-substrate 52 (step SP09). .
繼而，將埋設於第2區塊63B之第2平台加熱器64升溫(步驟SP10)。 Then, the second stage heater 64 embedded in the second block 63B is heated (step SP10).
繼而，使鍵合頭8下降，於基底基板50之第2安裝區塊302將子基板52加壓。藉由來自第2平台加熱器64之加熱，而使子基板52之焊料凸塊53開始熔融(步驟SP11)。 Then, the bonding head 8 is lowered, and the sub-substrate 52 is pressurized in the second mounting block 302 of the base substrate 50. The solder bumps 53 of the sub-substrate 52 start to be melted by heating from the second stage heater 64 (step SP11).
繼而，於對基底基板50進行特定時間之加壓後，解除子基板52之吸附保持，使鍵合頭8上升，並關閉第2區塊63B之第2平台加熱器64。開始焊料凸塊53之固相與第2區塊63B之自然冷卻(步驟SP12)。 Then, after the base substrate 50 is pressurized for a specific period of time, the adsorption holding of the sub-substrate 52 is released, the bonding head 8 is raised, and the second stage heater 64 of the second block 63B is closed. The solid phase of the solder bump 53 and the natural cooling of the second block 63B are started (step SP12).
繼而，對基板搬入區域60A投入(搬入)新的基底基板50。基板搬入區域60A之第1區塊61A及第2區塊63A於步驟SP10至步驟SP12之期間，成為不使助焊劑56揮發之溫度以下。因此，即便投入(搬入)新的基底基板50，塗佈於電極墊54之助焊劑56亦不會揮發。因此，無須等待至第2區塊63B為不使助焊劑56揮發之溫度以下便可投入(搬入)新的基底基板50，故而可縮短一片基底基板50之安裝週期(步驟SP13)。 Then, a new base substrate 50 is loaded (loaded) into the substrate loading area 60A. The first block 61A and the second block 63A of the substrate carrying-in area 60A are not more than the temperature at which the flux 56 is volatilized during the period from the step SP10 to the step SP12. Therefore, even if a new base substrate 50 is put in (loaded in), the flux 56 applied to the electrode pad 54 does not volatilize. Therefore, it is possible to shorten (in step SP13) the mounting period of one of the base substrates 50 without waiting for the second block 63B to be loaded (loaded) into the new base substrate 50 at a temperature lower than the temperature at which the flux 56 is volatilized.
繼而，自基板搬出區域60B送出(搬出)焊接有子基板52之基底基板50(步驟SP14)。 Then, the base substrate 50 to which the sub-substrate 52 is soldered is fed out (removed) from the substrate carry-out area 60B (step SP14).
之後，返回至步驟SP02，繼續將子基板52焊接於新的基底基板 50。 After that, returning to step SP02, the sub-substrate 52 is continuously soldered to the new base substrate. 50.
將進行此種安裝次序之情形時之安裝週期示於圖4。圖4於橫軸表示將子基板52安裝於基底基板50之時間，於縱軸表示各平台加熱器之升溫及冷卻之溫度分佈。一片基板之安裝時間成為第1安裝區塊301、第2安裝區塊302之總合。其原因在於，子基板52對新的基底基板50之安裝作業在上述第2安裝區塊302中之焊接結束時立即開始，因此，與先前之安裝週期相比可縮短安裝時間。 The installation cycle in the case where such an installation sequence is to be performed is shown in Fig. 4. 4 shows the time when the sub-substrate 52 is mounted on the base substrate 50, and the vertical axis represents the temperature distribution of the temperature rise and cooling of each of the stage heaters. The mounting time of one substrate becomes the sum of the first mounting block 301 and the second mounting block 302. This is because the mounting work of the sub-substrate 52 on the new base substrate 50 is started immediately after the welding in the second mounting block 302 is completed, so that the mounting time can be shortened compared to the previous mounting cycle.
圖5(a)表示基板搬入區域60A與基板搬出區域60B串聯配置且保持為助焊劑56不會揮發之溫度以下之區塊設置於基板搬入區域60A與基板搬出區域60B之共用區域的情形時之基板平台60(以一點鏈線表示基板搬入區域60A，以二點鏈線表示基板搬出區域60B)。若將與圖2中所使用之基板平台60對應之符號表示於圖5(a)，則共用區域係第2區塊63A與第1區塊61B成為同一區塊。再者，於圖5(a)中，與圖2同樣地標註設置於第1區塊61A之第1平台加熱器62、及設置於第2區塊63B之第2平台加熱器64。 (a) of FIG. 5 is a case where the substrate carrying-in area 60A and the substrate carrying-out area 60B are arranged in series and are kept at a temperature at which the temperature at which the flux 56 does not volatilize is set in a common area between the substrate carrying-in area 60A and the substrate carry-out area 60B. The substrate stage 60 (the substrate loading area 60A is indicated by a one-dot chain line, and the substrate carrying-out area 60B is indicated by a two-dot chain line). When the symbol corresponding to the substrate stage 60 used in FIG. 2 is shown in FIG. 5(a), the shared area is the same block as the second block 63A and the first block 61B. In addition, in FIG. 5(a), the first stage heater 62 provided in the first block 61A and the second stage heater 64 provided in the second block 63B are denoted in the same manner as in FIG.
於圖5(a)之基板平台60之情形時，於將基底基板50投入(搬入)至基板搬入區域60A後，對第1安裝區塊301焊接子基板52(圖5(b)所示之狀態，基底基板50係重疊於圖5(a)記載)。其後，使基底基板50移動至基板搬出區域60B，並且關閉第1區塊61A之第1平台加熱器62。於基板搬出區域60B，進行子基板52對第2安裝區塊302之焊接(圖5(c)所示之狀態，基底基板係重疊於圖5(a)記載)。於該期間，基板搬入區域60A之第1區塊61A係冷卻至不使助焊劑56揮發之溫度以下。由於基板搬入區域60A之第1區塊61A與第2區塊60B成為不使助焊劑56揮發之溫度以下，故而藉由在基板搬出區域60B焊接子基板52後送出(搬出)基底基板50，便可立即將新的基底基板50投入(搬入)至基板搬入區域60A。因此，可獲得圖4所示之每片基底基板50之安裝週期。進而， 由於在基板平台60設置基板搬入區域60A與基板搬出區域60B之共用區域，故而亦可實現裝置之省空間化。 In the case of the substrate stage 60 of FIG. 5(a), after the base substrate 50 is loaded (loaded) into the substrate loading area 60A, the sub-substrate 52 is soldered to the first mounting block 301 (shown in FIG. 5(b)). In the state, the base substrate 50 is superposed on FIG. 5(a). Thereafter, the base substrate 50 is moved to the substrate carry-out area 60B, and the first stage heater 62 of the first block 61A is closed. In the substrate carry-out area 60B, the sub-substrate 52 is soldered to the second mounting block 302 (the state shown in FIG. 5(c), and the base substrate is superimposed on FIG. 5(a)). During this period, the first block 61A of the substrate carrying-in area 60A is cooled to a temperature not lower than the temperature at which the flux 56 is volatilized. Since the first block 61A and the second block 60B of the substrate carrying-in area 60A are not lower than the temperature at which the flux 56 is volatilized, the base substrate 50 is transferred (unloaded) by the substrate substrate 52 after the substrate carrying-out region 60B is soldered. The new base substrate 50 can be immediately loaded (loaded) into the substrate loading area 60A. Therefore, the mounting period of each of the base substrates 50 shown in Fig. 4 can be obtained. and then, Since the substrate platform 60 is provided with a common area between the substrate loading area 60A and the substrate carrying-out area 60B, the space saving of the apparatus can be achieved.
圖6(a)係基底基板50之安裝區塊為n個(n>2)時所使用之基板平台60之一例。於基板平台60，設置有區塊數為n個之基板搬入區域60A及基板搬出區域60B。於基板搬入區域60A之區塊，於n-1個部位埋設有可加熱至使焊料熔融之溫度的平台加熱器，而僅於1個部位設置有保持為助焊劑56不會揮發之溫度以下的區塊。於基板搬出區域60B之區塊，在與基板搬入區域60A中保持為助焊劑56不會揮發之溫度以下之區塊對應的區塊，埋設有可加熱至使焊料熔融之溫度的平台加熱器，其他區塊係保持為助焊劑56不會揮發之溫度以下。 Fig. 6(a) shows an example of the substrate stage 60 used when the mounting block of the base substrate 50 is n (n > 2). The substrate stage 60 is provided with a substrate loading area 60A and a substrate carrying-out area 60B having n blocks. In the block of the substrate carrying-in region 60A, a terrace heater which can be heated to a temperature at which the solder is melted is embedded in n-1 portions, and the temperature is maintained at a temperature lower than the temperature at which the flux 56 does not volatilize at only one portion. Block. The block in the substrate carry-out area 60B is embedded in a block corresponding to a block having a temperature at which the flux 56 does not volatilize in the substrate carrying-in region 60A, and a stage heater which can be heated to a temperature at which the solder is melted is embedded. The other blocks are kept below the temperature at which the flux 56 does not volatilize.
基底基板50在被投入(搬入)至基板搬入區域60A後，被依序焊接子基板52。已進行焊接之區塊之平台加熱器被關閉而進行冷卻(圖6(b)所示之狀態)。使用埋設有平台加熱器之區塊，焊接子基板52至基底基板50之總安裝區塊數-1後，將基底基板50移動至基板搬出區域60B，對最後之安裝區塊焊接子基板52(圖6(c)所示之狀態)。於該期間，基板搬入區域60A之所有區塊係冷卻至不使助焊劑56揮發之溫度以下。然後，可將新的基底基板50投入(搬入)至基板搬入區域60A，因此，可獲得圖4所示之每片基底基板50之安裝週期。 After the base substrate 50 is loaded (loaded) into the substrate loading region 60A, the sub-substrate 52 is sequentially welded. The platform heater of the block that has been welded is closed and cooled (state shown in Fig. 6(b)). After the block in which the platform heater is buried is used, after the total number of mounting blocks of the sub-substrate 52 to the base substrate 50 is -1, the base substrate 50 is moved to the substrate carry-out area 60B, and the final mounting block is soldered to the sub-substrate 52 ( Figure 6 (c) shows the state). During this period, all of the blocks of the substrate loading area 60A are cooled to a temperature below which the flux 56 is not volatilized. Then, the new base substrate 50 can be loaded (loaded) into the substrate loading area 60A, so that the mounting period of each of the base substrates 50 shown in FIG. 4 can be obtained.
若如此般於基板平台60設置基板搬入區域60A與基板搬出區域60B，並於基板搬入區域60A設置至少1個保持為不使助焊劑56揮發之溫度以下的區塊，於焊接子基板52至總安裝區塊數-1個部位後，移動至基板搬出區域60B，對最後之安裝區塊(未安裝區塊)焊接子基板52，則於對所有安裝區塊焊接子基板52後，無須等待基板平台60之冷卻時間(至成為不使助焊劑56揮發之溫度以下之時間)，便可將新的基底基板50投入(搬入)至基板平台60，因此可縮短安裝週期時間。 In this manner, the substrate loading area 60A and the substrate carrying-out area 60B are provided on the substrate stage 60, and at least one block which is kept at a temperature lower than the temperature at which the flux 56 is not volatilized is provided in the substrate carrying-in area 60A, and the solder sub-substrate 52 to the total After the number of mounting blocks is -1, moving to the substrate carrying-out area 60B, and soldering the sub-substrate 52 to the last mounting block (un-installed block), after soldering the sub-substrate 52 to all the mounting blocks, there is no need to wait for the substrate The cooling time of the stage 60 (to a time below the temperature at which the flux 56 is not volatilized) allows the new base substrate 50 to be loaded (loaded) into the substrate stage 60, so that the installation cycle time can be shortened.
又，若於鍵合頭8具備陶瓷加熱器等作為加熱子基板52之加熱機 構，則可進一步縮短焊接之時間而有助於縮短安裝週期時間。 Further, when the bonding head 8 is provided with a ceramic heater or the like as a heater for heating the sub-substrate 52 The structure can further shorten the welding time and help to shorten the installation cycle time.
又，若於基板平台60之埋設有平台加熱器之區塊埋設冷卻水循環之冷水管等冷卻機構，則在焊接子基板52後，可迅速將區塊冷卻至助焊劑56不會揮發之溫度以下，因此可進一步實現安裝週期時間之縮短。 Further, if a cooling mechanism such as a cold water pipe in which the cooling water is circulated is buried in the block in which the platform heater is embedded in the substrate stage 60, after the sub-substrate 52 is welded, the block can be quickly cooled to a temperature below which the flux 56 does not volatilize. Therefore, the installation cycle time can be further shortened.
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| JP2013232575A (en) * | 2012-05-01 | 2013-11-14 | Showa Shinku:Kk | Substrate transfer and processing apparatus |
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| JPH09206932A (en) * | 1996-02-02 | 1997-08-12 | Kel Corp | Solder joining device using constant heat source |
| JP2000193988A (en) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | Production of liquid crystal display panel and apparatus for production |
| KR20080017914A (en) * | 2006-08-23 | 2008-02-27 | (주)하이시스텍 | Heating apparatus of a reflow soldering machine |
| JP2012009713A (en) | 2010-06-25 | 2012-01-12 | Shinko Electric Ind Co Ltd | Semiconductor package and method of manufacturing the same |
| JP5421863B2 (en) * | 2010-06-28 | 2014-02-19 | 新光電気工業株式会社 | Manufacturing method of semiconductor package |
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| US5927588A (en) * | 1996-02-02 | 1999-07-27 | Kel Corporation | Constant-heat type heating device and soldering method and soldering apparatus with heating device |
| WO2007052422A1 (en) * | 2005-11-01 | 2007-05-10 | Murata Manufacturing Co., Ltd. | Circuit device manufacturing method and circuit device |
| JP2013232575A (en) * | 2012-05-01 | 2013-11-14 | Showa Shinku:Kk | Substrate transfer and processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160090329A (en) | 2016-07-29 |
| KR102217826B1 (en) | 2021-02-18 |
| JP6457400B2 (en) | 2019-01-23 |
| WO2015079990A1 (en) | 2015-06-04 |
| TW201528408A (en) | 2015-07-16 |
| JPWO2015079990A1 (en) | 2017-03-16 |
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