TWI636540B - Semiconductor package and manufacturing method of semiconductor package - Google Patents

Abstract

A semiconductor package and a semiconductor package, the semiconductor package comprising a carrier, a first package component and a second package component, the first package component being disposed on the mounting surface of the carrier and comprising at least one An electronic component and a first encapsulant covering the at least one first electronic component, the second package component being disposed on the mounting surface of the carrier and including at least one second electronic component and covering the at least one second electronic component A second encapsulant of the component, the electromagnetic loss rate of the first encapsulant is greater than the electromagnetic wave loss rate of the second encapsulant, so that the semiconductor package can have both electromagnetic interference resistance and good electromagnetic radiation or induction efficiency.

Description

Semiconductor package and semiconductor package manufacturing method

The present invention relates to a method of manufacturing a semiconductor package and a semiconductor package, and more particularly to a method of manufacturing a semiconductor package and a semiconductor package which are resistant to electromagnetic interference and enhance electromagnetic radiation or induction efficiency.

Due to the booming development of the electronics industry, the development of electronic products towards miniaturization and high speed, especially the development of the wireless communication industry has been widely used in various electronic products, such as mobile phones, notebook computers, smart phones, tablets. ...etc., the aforementioned electronic products use semiconductor packages with wireless communication functions. Some semiconductor packages have an antenna or an antenna accessory circuit inside, but the antenna may be adjacent to a digital integrated circuit, a digital signal processor (DSP), a baseband (BB) chip, or a radio frequency (Radio). Frequency, RF, etc., cause electromagnetic interference, so electromagnetic shielding (Electromagnetic Shielding) must be performed.

Referring to FIG. 1 , a first electronic component 11 , a second electronic component 12 and a shielding wall 13 are disposed on a surface of a carrier 10 . The shielding wall 13 can be metal. The wall, wherein the first electronic component 11 and the second electronic component 12 are disposed separately, and the shielding wall 13 is located between the first electronic component 11 and the second electronic component 12. The first electronic component 12 can be an element that requires anti-electromagnetic interference processing, such as the aforementioned digital integrated circuit, digital signal processor, baseband chip or radio frequency chip, etc., and the second electronic component 12 can be as described above. antenna.

Referring to FIG. 2 , an encapsulant 14 is formed on the carrier 10 , and the encapsulant 14 covers the first electronic component 11 , the second electronic component 12 , and the shielding wall 13 . Referring to FIG. 3, the surface of the encapsulant 14 is grooved to form an opening 15 to expose the shielding wall 13 to the opening 15. Referring to FIG. 4, a shielding layer 16 is formed on a surface of the encapsulant 14 corresponding to the first electronic component 11. The shielding layer 16 may be a metal layer, and the shielding layer 16 is filled in the opening 15 to be connected. The shield wall 13 completes the conventional semiconductor package 100. It should be noted that the semiconductor package 100 may include more electronic components, and only the first electronic component 11 and the second electronic component 12 are exemplified herein; in addition, the carrier 10 may be a circuit board and electrically The first electronic component 11 and the second electronic component 12 are connected, and the carrier 10 is of various types and is common knowledge in the industry, and details are not described herein.

In this way, the first electronic component 11 is surrounded by the shielding layer 13 and the shielding layer 16 , so that the shielding wall 13 can shield the electromagnetic wave from the second electronic component 12 for the first electronic component 11 . The shielding layer 16 can shield electromagnetic waves from the external environment, and can avoid the problem that the first electronic component 11 is subjected to electromagnetic interference; on the other hand, the second electronic component 12 is not shielded, so the second electronic component 12 is effective. It can radiate electromagnetic waves or induce external electromagnetic waves.

In addition, the encapsulant 14 can also adopt an encapsulant having a lossy electromagnetic wave function. For example, the encapsulant 14 can include an epoxy resin and an anti-electromagnetic interference material mixed with an epoxy resin and mixed with an epoxy resin. The anti-electromagnetic interference material may be an absorbing material or a micro metal material.

However, since the first electronic component 11 and the second electronic component 12 are both encapsulated in the encapsulant 14 having the same anti-electromagnetic interference material, the encapsulation colloid 14 has a high loss of electromagnetic wave capability, which may be helpful. The first electronic component 11 is resistant to electromagnetic interference, but relatively restricts the efficiency of the second electronic component 12 to radiate electromagnetic waves or induce external electromagnetic waves; conversely, when the packaged colloid 14 has low loss of electromagnetic wave capability, it may be helpful. The function of radiating electromagnetic waves or inducing external electromagnetic waves by the second electronic component 12 is improved, but the function of the first electronic component 11 against electromagnetic interference is relatively reduced. Yes Therefore, the material of the encapsulant 14 is often unable to meet the requirements of the first electronic component 11 and the second electronic component 12 at the same time.

In view of this, the main object of the present invention is to provide a method for fabricating a semiconductor package and a semiconductor package, which enables the present semiconductor package to have both electromagnetic interference resistance and efficiency of electromagnetic radiation or induction, overcoming the problems described in the prior art.

The semiconductor package of the present invention comprises: a carrier board having a mounting surface; a first package component disposed on the mounting surface of the carrier board, the first package component comprising at least one first electronic component and covering the at least one a first encapsulant of the first electronic component; and a second package component disposed on the mounting surface of the carrier, the second package component including at least one second electronic component and the at least one second electronic component The second encapsulant colloid has an electromagnetic wave loss rate greater than an electromagnetic wave loss rate of the second encapsulant.

According to the structure of the present invention, the first encapsulant and the second encapsulant are different encapsulants respectively, so the creation can be respectively set according to the requirements of the first electronic component and the second electronic component for anti-electromagnetic interference. The electromagnetic wave loss rate of the first encapsulant and the second encapsulant further satisfy the requirements of the first electronic component and the second electronic component to achieve a win-win state. In addition, compared with the prior art, the present invention does not have a shielding wall, so the cost of the creation can be lower than that of the conventional semiconductor package.

The method for manufacturing a semiconductor package includes: disposing at least one first electronic component and at least one second electronic component on a mounting surface of a carrier; forming a first encapsulant on the mounting surface of the carrier, and The first encapsulant encapsulates the at least one first electronic component; Forming a second encapsulant on the mounting surface of the carrier, and encapsulating the second encapsulant with the at least one second electronic component, the electromagnetic entrapment loss of the first encapsulant being greater than the electromagnetic loss of the second encapsulant rate.

According to the method of the present creation, the creation does not need to be grooved in the encapsulant to form an opening, so the creation method can be simplified compared with the conventional semiconductor package.

100‧‧‧Semiconductor package

10‧‧‧ Carrier Board

11‧‧‧First electronic components

12‧‧‧Second electronic components

13‧‧‧Shield wall

14‧‧‧Package colloid

15‧‧‧ openings

16‧‧‧Shield

20‧‧‧ Carrier Board

21‧‧‧Setting surface

30‧‧‧First package assembly

31‧‧‧First electronic component

32‧‧‧First encapsulant

33, 35‧‧‧ Shielding components

34‧‧‧ solder balls

351‧‧‧Shield base

352‧‧‧Shield cover

40‧‧‧Second package assembly

41‧‧‧Second electronic components

42‧‧‧Second encapsulant

50‧‧‧Mold

51‧‧‧ first cavity

52‧‧‧Second cavity

53‧‧‧Package

FIG. 1 is a schematic view showing a conventional semiconductor package in which a first electronic component, a second electronic component, and a shield wall are disposed on a surface of a carrier.

Figure 2: Schematic diagram of the formation of an encapsulant on the carrier of Figure 1.

Figure 3: Schematic representation of the formation of an opening in the encapsulant of Figure 2.

Figure 4: Schematic diagram of a conventional semiconductor package.

Figure 5: Schematic diagram of an embodiment of the present semiconductor package.

Figure 6 is a schematic illustration of another embodiment of the present semiconductor package.

FIG. 7 is a schematic view showing the first electronic component and the second electronic component disposed on the mounting surface of the carrier board.

Figure 8 is a schematic illustration of the formation of a first encapsulant on the carrier of Figure 6.

Figure 9 is a schematic illustration of one embodiment of forming a shield member on the first encapsulant of Figure 7.

Figure 10 is a schematic illustration of another embodiment of forming a shield member on the first encapsulant of Figure 7.

Figure 11: Schematic diagram of the molding of this creation.

Referring to FIG. 5 , an embodiment of the present semiconductor package includes a carrier 20 , a first package component 30 , and a second package component 40 .

The carrier board 20 is a circuit board and has a conductive line. The type of the board 20 is a common type of common knowledge in the industry and will not be described herein. The carrier 20 has a mounting surface 21 which can be the top or bottom surface of the carrier 20.

The first package component 30 is disposed on the mounting surface 21 of the carrier 20 . The first package component 30 includes at least one first electronic component 31 and a first encapsulant 32 , or further includes a shielding component 33 . The at least one first electronic component 31 is disposed on the mounting surface 21 of the carrier 20, and can be electrically connected to the conductive line on the carrier 20 in a wire-bonding manner, or can be disposed on the carrier in a flip-chip manner. The setting surface 21 of FIG. 5 is an example of a first electronic component 31 that is flip-chip mounted on the carrier 20. The first electronic component 31 is electrically connected to the conductive layer on the carrier 20 by solder balls 34. line. The first encapsulant 32 is disposed on the mounting surface 21 of the carrier 20 and covers the first electronic component 31 . The shielding component 33 completely covers the first encapsulant 32 .

As shown in FIG. 5, an embodiment of the shielding member 33 may be an integrally formed layered metal member formed on the surface of the first encapsulant 32 and extending to the mounting surface 21 of the carrier 20. Therefore, the shielding member 33 completely covers the first encapsulant 32. As shown in FIG. 6, another embodiment of the shielding member 35 can be a non-integral component, such as a modular assembly. The shielding component 35 can include a shielding base 351 and a shielding cover 352. The shielding base 351 has The shielding base 351 is disposed on the mounting surface 21 of the carrier 20, the first encapsulant 32 and the first electronic component 31 are located in the receiving space of the shielding base 351, and the shielding cover 352 is disposed on the shielding surface 351. The shielding base 351 completely covers the first encapsulant 32 and the first electronic component 31. The shielding member 33, 35, the shielding base 351 and the shielding cover 352 may be a copper (Cu) layer, a nickel (Ni) layer, an iron layer (Fe), an aluminum (Al) layer or a stainless steel layer, etc. Made of components. As shown in FIG. 5 and FIG. 6, the shielding members 33 and 35 directly contact the top surface and the side surface of the first encapsulant 32.

The second package component 40 is disposed on the mounting surface 21 of the carrier 20, that is, the second package component 40 and the first package component 30 are disposed on the same surface of the carrier 20, and the second package component The first package component 30 can be adjacent to 40. The second package component 40 includes at least one second electronic component 41 and a second package component 42 . The at least one second electronic component 41 is disposed on the mounting surface 21 of the carrier 20 and is disposed separately from the first electronic component 31 . . The second encapsulant 42 is disposed on the mounting surface 21 of the carrier 20 and covers the at least one second electronic component 41. As shown in FIG. 5, the present embodiment uses a second electronic component 41 as an example. The side surface of the second encapsulant 42 can be adjacent to the side of the shielding member 33, 35. As shown in FIG. 5 and FIG. 6, the shielding member 33, 35 contacts the side of the second encapsulant 42.

In the present embodiment, the electromagnetic wave loss rate of the first encapsulant 32 is greater than the electromagnetic wave loss rate of the second encapsulant 42. For example, the first encapsulant 32 may comprise an epoxy resin and an anti-electromagnetic interference material mixed in the epoxy resin and mixed with the epoxy resin, or the first encapsulant 32 may comprise a polymer. A polymer material and an anti-electromagnetic interference material mixed with the polymer material and mixed with the polymer material; the second encapsulant 42 may be made of an epoxy resin or a polymer material. member. The EMI material may be an absorbing material or a micro metal material, and the micro metal material may be magnesium or aluminum, and the first encapsulant 32 and the second encapsulant 42 are still an insulator as a whole. Wherein, the anti-electromagnetic interference material is used for absorbing or reflecting electromagnetic waves, so that the electromagnetic wave loss rate of the first encapsulant 32 containing the anti-electromagnetic interference material can be greater than the electromagnetic wave loss rate of the second encapsulant 42.

According to the structure of the present invention, since the first encapsulant 32 and the second encapsulant 42 are respectively different encapsulants, the present invention can be electromagnetically resistant according to the first electronic component 31 and the second electronic component 41. The electromagnetic wave loss rate of the first encapsulant 32 and the second encapsulant 42 is set separately according to the requirement of interference. In the present embodiment, the first electronic component 31 can be an element that needs anti-electromagnetic interference processing, such as a digital integrated body. For example, a circuit, a digital signal processor, a baseband chip or a radio frequency chip, etc., the second electronic component 12 may be a receiving/transmitting electromagnetic wave component, and the receiving/transmitting electromagnetic wave component may be an antenna.

In this way, for the first electronic component 31, the first encapsulant 32 can consume electromagnetic waves from the second electronic component 41 and the external environment, and can avoid the electromagnetic interference of the first electronic component 31. On the other hand, the second encapsulant 42 may not have an anti-electromagnetic interference material, so the electromagnetic wave loss rate is low, so that the second electronic component 41 can effectively radiate electromagnetic waves or induce external electromagnetic waves. Furthermore, the present invention, by the arrangement of the shielding elements 33, 35, the shielding elements 33, 35 can further shield electromagnetic waves from the second electronic component 41 from the external environment for the first electronic component 31, The present invention is effective against electromagnetic interference of the first electronic component 31 through the first encapsulant 32 and the shielding members 33, 35.

The semiconductor package of the present invention is described in the following manner. Referring to FIG. 7, at least one first electronic component 31 and at least one second electronic component 41 are disposed on a mounting surface 21 of a carrier 20, and the at least one first electronic component is disposed. 31 is provided separately from the at least one second electronic component 41. The present embodiment is described by taking only one first electronic component 31 and one second electronic component 41 as an example, but is not limited thereto.

Referring to FIG. 8 , a first encapsulant 32 is formed on the mounting surface 21 of the carrier 20 , and the first encapsulant 32 is coated on the first electronic component 31 . Referring to FIG. 9, the present invention can further provide a shielding member 33. One embodiment of the shielding member 33 is an integrally formed layered metal member. The shielding member 33 is formed on the surface of the first encapsulant 32 and is connected to the surface. The shielding surface 33 of the carrier 20 may be a sputtering shaped member. Referring to FIG. 10 , another embodiment of the shielding component 35 can be a combined component. For example, the shielding component 35 can include a shielding base 351 disposed on the setting surface 21 of the carrier 20 and a shielding base 351 disposed on the shielding base 351 . a shielding cover 352, wherein the first encapsulant 32 and the first electronic component 31 are located in the shielding base 351, the shielding cover 352 is disposed on the shielding base 351 to completely cover the first encapsulant 32 and the first Electronic component 31. As shown in FIG. 9 and FIG. 10, the shielding members 33, 35 are in direct contact with the top surface and the side surface of the first encapsulant 32.

Referring to FIG. 5, a second encapsulant 42 is formed on the mounting surface 21 of the carrier 20, and the second encapsulant 42 is wrapped around the second electronic component 41 to complete the inventive semiconductor package. As shown in FIG. 5, the shielding member 33 contacts the side of the second encapsulant 42.

In the authoring method, the first encapsulant 32 and the second encapsulant 42 can be manufactured by molding or dispensing. For example, please refer to FIG. 11 , and a mold 50 is prepared for molding. 50 has a first cavity 51 corresponding to the first electronic component 31 and a second cavity 52 corresponding to the second electronic component 41, wherein the first cavity 51 is provided with an encapsulant 53, the second cavity 52 It is an empty cavity. The carrier 20 is bonded to the mold 50 during molding, so that the first electronic component 31 is immersed in the encapsulant 53 of the first cavity 51, and the second electronic component 41 is placed in the second cavity 52. Therefore, when the encapsulant 53 is cured and the carrier 20 and the mold 50 are separated, the encapsulant 53 becomes the first encapsulant 32 shown in FIG. When the first encapsulant 32 and the shielding members 33 and 35 shown in FIG. 9 or FIG. 10 are completed, the second encapsulant 42 shown in FIG. 5 can be formed in a dispensing manner.

In the manufacturing method of the present invention, compared with the prior art, the present invention does not need to be grooved in the encapsulant 14 shown in FIG. 3 to form the opening 15, so that the authoring method can be more simplified and the cost is lower.

It should be noted that the first electronic component 31 and the second electronic component 41 are exemplified in the present invention. The semiconductor package may include more electronic components, which is common knowledge in the industry, and will not be described herein. .

Claims (20)

A semiconductor package comprising: a carrier board having a mounting surface; a first package component disposed on the mounting surface of the carrier board, the first package component comprising at least one first electronic component, covering the at least one a first encapsulant of the first electronic component and a shielding component, the first encapsulant comprises an anti-electromagnetic interference material; and a second package component disposed on the mounting surface of the carrier, the second package component comprising at least a second electronic component and a second encapsulant covering the at least one second electronic component, wherein the first encapsulation colloid has an electromagnetic wave loss rate greater than an electromagnetic wave loss rate of the second encapsulant; wherein the shielding component is a complete package The first encapsulant is covered and directly contacts the top surface and the side surface of the first encapsulant and contacts the side surface of the second encapsulant. The semiconductor package of claim 1, wherein the first package component is adjacent to the second package component. The semiconductor package of claim 2, wherein the shielding component completely covers the first encapsulant, and a side of the second encapsulant is adjacent to a side of the shielding component. The semiconductor package of claim 3, wherein the shielding member is an integrally formed layered metal member disposed on a surface of the first encapsulant and extending to the mounting surface of the carrier. The semiconductor package of claim 3, wherein the shielding element is a non-integral component. The semiconductor package of claim 5, the shielding component comprises a shielding base and a shielding cover, the shielding base has an accommodating space, the shielding base is disposed on the setting surface of the carrier, the first encapsulant The at least one first electronic component is located in the accommodating space of the shielding base, and the shielding cover is disposed on the shielding base to cover the first encapsulant and the at least one first electronic component. The semiconductor package of any one of claims 1 to 6, wherein the EMI material is an absorbing material or a micro metal material. The semiconductor package of claim 7, wherein the micro-metal material comprises magnesium or aluminum. The semiconductor package of claim 1, wherein the at least one second electronic component is a receiving/transmitting electromagnetic wave member. The semiconductor package of claim 9, wherein the receiving/transmitting electromagnetic wave member is an antenna. A method of manufacturing a semiconductor package, comprising: disposing at least one first electronic component and at least one second electronic component on a mounting surface of a carrier; forming a first encapsulant on the mounting surface of the carrier, and The first encapsulant encapsulates the at least one first electronic component, the first encapsulant comprises an anti-electromagnetic interference material; and a shielding component is disposed, the shielding component completely covers the first encapsulant and directly contacts the first encapsulant a top surface and a side surface; and a second encapsulant formed on the mounting surface of the carrier, and the second encapsulant encapsulates the at least one second electronic component, the first encapsulant having an electromagnetic wave loss ratio greater than the The electromagnetic wave loss rate of the second encapsulant, and the shielding element contacts the side of the second encapsulant. The method of fabricating a semiconductor package according to claim 11, wherein the shielding member completely covers the first encapsulant. The method of fabricating a semiconductor package according to claim 12, wherein the shielding member is an integrally formed layered metal member formed on a surface of the first encapsulant and extending to the mounting surface of the carrier. The method of fabricating a semiconductor package according to claim 13, wherein the shielding member is a sputter-formed member. In the method of fabricating the semiconductor package of claim 12, a shield member is further provided, the shield member being a non-integral component. The method of claim 15, wherein the shielding component comprises a shielding base and a shielding cover, the shielding base has an accommodating space, and the shielding base is disposed on the setting surface of the carrier, the first The encapsulant and the at least one first electronic component are located in the accommodating space of the shielding base, and the shielding cover is disposed on the shielding base to cover the first encapsulant and the at least one first electronic component. The method of fabricating a semiconductor package according to any one of claims 11 to 16, wherein the EMI material is an absorbing material or a micro metal material. The method of fabricating the semiconductor package of claim 17, wherein the micro-metal material comprises magnesium or aluminum. The method of fabricating the semiconductor package of claim 11, wherein the at least one second electronic component is a receiving/transmitting electromagnetic wave member. The method of fabricating the semiconductor package of claim 19, wherein the receiving/transmitting electromagnetic wave member is an antenna.