TWI631459B - Memory device and method of operation - Google Patents

Memory device and method of operation Download PDF

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TWI631459B
TWI631459B TW100140374A TW100140374A TWI631459B TW I631459 B TWI631459 B TW I631459B TW 100140374 A TW100140374 A TW 100140374A TW 100140374 A TW100140374 A TW 100140374A TW I631459 B TWI631459 B TW I631459B
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memory
unit
memory device
command
signal
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TW201319804A (en
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曾銘松
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曾銘松
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Abstract

本發明提供一種記憶體裝置,包含一指令解碼單元、一控制邏輯單元、一第一記憶體單元、以及一第二記憶體單元。指令解碼單元,解碼一輸入指令,並產生一解碼訊號;控制邏輯單元,依據解碼訊號輸出一控制訊號;第一記憶體單元,具有一第一記憶體陣列與一第一頁碼緩衝器;以及,一第二記憶體單元,具有一第二記憶體陣列與一第二頁碼緩衝器。其中,當輸入指令為一預定指令時,預定指令係對同一資料在同一時間,在第一記憶體單元存取資料且在第二記憶體單元存取備份資料。 The present invention provides a memory device including an instruction decoding unit, a control logic unit, a first memory unit, and a second memory unit. The instruction decoding unit decodes an input command and generates a decoded signal; the control logic unit outputs a control signal according to the decoded signal; the first memory unit has a first memory array and a first page buffer; A second memory unit has a second memory array and a second page buffer. Wherein, when the input command is a predetermined command, the predetermined command accesses the data in the first memory unit and the backup data in the second memory unit at the same time.

Description

記憶體裝置與其運作方法 Memory device and its operation method

本發明係關於一種記憶體裝置,特別是關於一種具有高速讀寫與抹除,並兼具高可靠度之記憶體裝置。 The present invention relates to a memory device, and more particularly to a memory device having high-speed read/write and erase, and having high reliability.

隨著記憶體裝置的發展,記憶體裝置所能儲存的容量也隨之增加,而記憶體裝置之每單位儲存空間的成本也相對應的降低,故提升記憶體裝置之處理效率與可靠度,使資料能正確、安全、以及快速的進行運作為主要目標。 With the development of the memory device, the capacity that the memory device can store is also increased, and the cost per unit storage space of the memory device is correspondingly reduced, thereby improving the processing efficiency and reliability of the memory device. The main goal is to make the data work correctly, safely, and quickly.

請同時參考第1A圖,第1A圖顯示先前技術之記憶體裝置分別讀取(Read)一個記憶體陣列其中一頁(Page)之示意圖。由第1A圖可以了解,由於先前技術之記憶體裝置11之輸入指令IS使用一個指令碼(Command Code)11a、一個位址碼(Address)11b、以及一個確認碼(Confirm Code)C。並由位址碼11b致能記憶體陣列11c的頁緩衝器(Page Buffer),以讀取記憶體陣列11c資料流,並由確認碼C確認進行讀取程序。 Please refer to FIG. 1A at the same time. FIG. 1A shows a schematic diagram of a memory device in the prior art reading (Read) one page of a memory array. As can be understood from FIG. 1A, since the input command IS of the prior art memory device 11 uses a command code 11a, an address 11b, and a confirm code C. The page buffer (Page Buffer) of the memory array 11c is enabled by the address code 11b to read the data stream of the memory array 11c, and the reading process is confirmed by the confirmation code C.

請同時參考第1B圖,第1B圖顯示先前技術之記憶體裝置11分別讀取兩個記憶體陣列之其中一頁之示意圖。由第1B圖可以了解,當使用者需要讀取兩個體陣列11c與12c時,輸入指令需分別利用兩組指令碼(Command Code)11a與12a、以及兩組位址碼(Address)11b與12b,並由位址碼11b與12b分別致能記憶體陣列11c與12c的頁緩衝器11d與12d,以讀取 記憶體陣列11c與12c內的資料流。故記憶體裝置11處理其輸入指令的時間需相對應的増加。 Please refer to FIG. 1B at the same time. FIG. 1B shows a schematic diagram of reading one of the two memory arrays by the memory device 11 of the prior art. It can be understood from FIG. 1B that when the user needs to read the two body arrays 11c and 12c, the input command needs to use two sets of Command Codes 11a and 12a and two sets of Address Codes 11b respectively. 12b, and the page buffers 11d and 12d of the memory arrays 11c and 12c are enabled by the address codes 11b and 12b, respectively, for reading Data streams within memory arrays 11c and 12c. Therefore, the time at which the memory device 11 processes its input command needs to be correspondingly increased.

同理,請同時參考第1C、1D、1E、1F圖,第1C顯示先前技術之記憶體裝置將資料寫入(Program)一個記憶體陣列之其中一頁之示意圖,第1D圖顯示先前技術之記憶體裝置將資料寫入兩個記憶體陣列其中一頁之示意圖,第1E顯示先前技術之記憶體裝置抹除(Erase)一個記憶體陣列內資料之示意圖,第1F圖顯示先前技術抹除兩個記憶體陣列內資料之示意圖。其操作原理與前述相同,不另行贅述。故,現有的記憶體裝置無法在單一筆輸入指令時,同時在複數個記憶體單元資料之讀取、或儲存、或抹除之程序。如此一來,資料在讀寫過程中若有遺漏或錯誤產生時,則無法確保其資料於記憶體單元之正確性,例如:現有的快閃記憶體裝置不具高可靠度。 Similarly, please refer to the 1C, 1D, 1E, and 1F diagrams at the same time. The 1C shows a schematic diagram of the prior art memory device writing data to one of the memory arrays. The 1D figure shows the prior art. The memory device writes the data into one of the two memory arrays. FIG. 1E shows a schematic diagram of the prior art memory device erase (Erase) data in a memory array, and FIG. 1F shows the prior art erase two. A schematic diagram of the data in a memory array. The operation principle is the same as the above, and will not be described again. Therefore, the existing memory device cannot simultaneously read, store, or erase a plurality of memory unit data in a single input command. In this way, if there is any omission or error in the data reading and writing process, the correctness of the data in the memory unit cannot be ensured. For example, the existing flash memory device does not have high reliability.

故,現有的記憶體裝置若需在複數個記憶體單元進行資料之讀取、或儲存、或抹除之程序,則需透過複數筆輸入指令進行,如此一來,記憶體裝置需花更多時間處理該些輸入指令,而降低記憶體裝置之處理速度。 Therefore, if the existing memory device needs to read, store, or erase the data in a plurality of memory cells, it is necessary to input the command through a plurality of pens, so that the memory device needs to spend more. Time processing the input commands reduces the processing speed of the memory device.

本發明之目的之一,是在提供一種記憶體裝置,可同時在複數個記憶體單元資料之讀取、或儲存、或抹除之程序。 One of the objects of the present invention is to provide a memory device that can simultaneously read, store, or erase data of a plurality of memory cells.

本發明之目的之一,是在提供一種記憶體裝置, 具有高速處理速度。 One of the objects of the present invention is to provide a memory device, With high speed processing speed.

本發明之目的之一,是在提供一種記憶體裝置,具有高可靠度。 One of the objects of the present invention is to provide a memory device with high reliability.

本發明一實施例提供一種記憶體裝置,包含一指令解碼單元、一控制邏輯單元、一第一記憶體單元、以及一第二記憶體單元。指令解碼單元,解碼一輸入指令,並產生一解碼訊號;控制邏輯單元,依據解碼訊號輸出一控制訊號;第一記憶體單元,具有一第一記憶體陣列與一第一頁碼緩衝器;以及,一第二記憶體單元,具有一第二記憶體陣列與一第二頁碼緩衝器。其中,當輸入指令為一預定指令時,預定指令係對同一資料在同一時間,在第一記憶體單元存取資料且在第二記憶體單元備份資料。 An embodiment of the present invention provides a memory device including an instruction decoding unit, a control logic unit, a first memory unit, and a second memory unit. The instruction decoding unit decodes an input command and generates a decoded signal; the control logic unit outputs a control signal according to the decoded signal; the first memory unit has a first memory array and a first page buffer; A second memory unit has a second memory array and a second page buffer. Wherein, when the input command is a predetermined command, the predetermined command accesses the data in the first memory unit and backs up the data in the second memory unit at the same time.

本發明一實施例提供一種記憶體運作方法,包含:解碼一輸入指令,並產生一解碼訊號;依據解碼訊號輸出一控制訊號;其中,當輸入指令為一預定指令時,預定指令係對同一資料在同一時間,在一第一記憶體單元存取一資料且在一第二記憶體單元備份該資料。 An embodiment of the present invention provides a memory operating method, including: decoding an input command and generating a decoded signal; and outputting a control signal according to the decoded signal; wherein, when the input command is a predetermined command, the predetermined command is for the same data At the same time, a material is accessed in a first memory unit and the data is backed up in a second memory unit.

請參考第2A圖,第2A圖顯示本發明一種記憶體裝置之一實施例示意圖。記憶體裝置200包含一指令解碼單元101、一控制邏輯單元102、一第一記憶體單元103、以及一第二記憶體單元104。 Please refer to FIG. 2A. FIG. 2A is a schematic diagram showing an embodiment of a memory device of the present invention. The memory device 200 includes an instruction decoding unit 101, a control logic unit 102, a first memory unit 103, and a second memory unit 104.

請注意,本發明一實施例之記憶體裝置200為NAND快閃記憶體所實現,在另一實施例中,記憶體 裝置200可為固態硬碟(Solid State Disk,SSD)及/或、及/或記憶卡、及/或隨身碟所實現。 Please note that the memory device 200 according to an embodiment of the present invention is implemented by a NAND flash memory. In another embodiment, the memory is The device 200 can be implemented as a Solid State Disk (SSD) and/or, and/or a memory card, and/or a flash drive.

記憶體單元103,具有第一記憶體陣列103a與第一頁碼緩衝器(Page buffer)103b;第二記憶體單元104,具有第二記憶體陣列104a與一第二頁碼緩衝器104b。其中,第一頁碼緩衝器103b耦接至控制邏輯單元102與第一記憶體陣列103a,第二頁碼緩衝器104b耦接至控制邏輯單元102與第二記憶體陣列104a。 The memory unit 103 has a first memory array 103a and a first page buffer 103b. The second memory unit 104 has a second memory array 104a and a second page buffer 104b. The first page buffer 103b is coupled to the control logic unit 102 and the first memory array 103a, and the second page buffer 104b is coupled to the control logic unit 102 and the second memory array 104a.

當指令解碼單元101接收一輸入指令IS時,由指令解碼單元101解碼輸入指令IS,換言之,指令解碼單元101依據輸入指令IS產生一解碼訊號DS。控制邏輯單元102依據解碼訊號DS輸出一控制訊號CS,控制邏輯單元102透過控制訊號CS使記憶體陣列103a與103b進行讀取(Read)、寫入(Program)、抹除(Erase)等處理程序。 When the instruction decoding unit 101 receives an input instruction IS, the instruction decoding unit 101 decodes the input instruction IS. In other words, the instruction decoding unit 101 generates a decoded signal DS according to the input instruction IS. The control logic unit 102 outputs a control signal CS according to the decoded signal DS, and the control logic unit 102 causes the memory arrays 103a and 103b to read (read), write (program), erase (Erase) and the like through the control signal CS. .

其中,當輸入指令IS為一預定指令PS時,預定指PS令係對同一資料在同一時間,在第一記憶體單元103存取資料且在第二記憶體單元104備份資料;其中,本發明之存取係定義為進行讀取、寫入、以及抹除等資料處理程序,備份之定義係指在第二記憶體單元104進行與第一記憶體單元103進行相同之動作。 換言之,當輸入指令IS為一預定指令PS時,解碼單元101解碼預定指令PS並產生解碼訊號DS,控制邏輯單元102依據解碼訊號DS輸出控制訊號CS同時致能(Enable)第一記憶體陣列103a、第一頁碼緩衝器103b、第二記憶體陣列104a、以及第二頁碼緩衝器 104b進行讀取、寫入、以及抹除等處理程序。 Wherein, when the input command IS is a predetermined command PS, the predetermined reference PS command accesses the data in the first memory unit 103 and backs up the data in the second memory unit 104 at the same time for the same data; wherein the present invention The access system is defined as a data processing program for reading, writing, and erasing. The definition of the backup means that the second memory unit 104 performs the same operation as the first memory unit 103. In other words, when the input command IS is a predetermined command PS, the decoding unit 101 decodes the predetermined command PS and generates the decoded signal DS, and the control logic unit 102 outputs the control signal CS according to the decoded signal DS while enabling the first memory array 103a. First page buffer 103b, second memory array 104a, and second page buffer 104b performs processing procedures such as reading, writing, and erasing.

在一實施例中,預定指令PS可視為一存取備份指令,且存取備份指令包含一驅動第一記憶體單元指令與一驅動第二記憶體單元指令,故存取備份指令可用來致能第一記憶體單元103與第二記憶體單元104,使第一記憶體單元103與第二記憶體單元104用來進行存取與備份之動作。 In an embodiment, the predetermined instruction PS can be regarded as an access backup instruction, and the access backup instruction includes a driving the first memory unit instruction and a driving the second memory unit instruction, so the access backup instruction can be used to enable The first memory unit 103 and the second memory unit 104 cause the first memory unit 103 and the second memory unit 104 to perform an operation of accessing and backing up.

在此請注意,於一實施例中,當輸入指令IS非為預定指令PS時,意即當輸入指令IS為一般指令NS時,則控制邏輯單元102依據解碼訊號DS輸出控制訊號CS僅致能第一記憶體陣列103a與第一頁碼緩衝器103b進行讀取、寫入、以及抹除等處理程序,而未致能第二記憶體陣列104a、以及第二頁碼緩衝器104b進行讀取、寫入、以及抹除等處理程序。 Please note that in an embodiment, when the input command IS is not the predetermined command PS, that is, when the input command IS is the general command NS, the control logic unit 102 outputs the control signal CS according to the decoded signal DS. The first memory array 103a and the first page buffer 103b perform processing procedures such as reading, writing, and erasing, and the second memory array 104a and the second page buffer 104b are not enabled for reading and writing. Processing procedures such as entering and erasing.

請同時參考第2B圖,第2B圖顯示本發明一種記憶體裝置之一實施例示意圖,其中,控制邏輯單元102包含一判斷單元102a。判斷單元102a耦接至指令解碼單元101,判斷單元102a可用以判斷輸入指令IS為預定指令PS或一般指令NS。 Please refer to FIG. 2B at the same time. FIG. 2B is a schematic diagram showing an embodiment of a memory device according to the present invention, wherein the control logic unit 102 includes a determining unit 102a. The determining unit 102a is coupled to the instruction decoding unit 101, and the determining unit 102a can be used to determine that the input command IS is a predetermined command PS or a general command NS.

請注意,當輸入指令IS為預定指令PS時,則解碼訊號DS包含致能訊號ES1與ES2。 Please note that when the input command IS is the predetermined command PS, the decoded signal DS includes the enable signals ES1 and ES2.

在本發明一實施例中,判斷單元102a更包含第一AND閘21與第二AND閘22。第一AND閘21之第一端耦接至指令解碼單元101,並接收位址碼(Address)A,第一AND閘21之第二端耦接至致能訊號ES1。第二AND閘22之第一端耦接至指令解碼單 元101,並接收位址碼A,第二AND閘之第二端耦接至致能訊號ES2。 In an embodiment of the invention, the determining unit 102a further includes a first AND gate 21 and a second AND gate 22. The first end of the first AND gate 21 is coupled to the instruction decoding unit 101, and receives an address code (Address) A. The second end of the first AND gate 21 is coupled to the enable signal ES1. The first end of the second AND gate 22 is coupled to the instruction decode list The element 101 receives the address code A, and the second end of the second AND gate is coupled to the enable signal ES2.

請同時參考第3A圖,第3A圖顯示本發明一實施例之記憶體裝置200透過預定指令同時讀取兩個記憶體陣列之其中一頁(Page)之示意圖。本實施例之判斷單元102a係利用第一AND閘21與第二AND閘22進行邏輯判斷以決定是否為預定指令PS。 Please refer to FIG. 3A at the same time. FIG. 3A shows a schematic diagram of a memory device 200 according to an embodiment of the present invention simultaneously reading one page of two memory arrays through a predetermined command. The judging unit 102a of the present embodiment performs logical judgment using the first AND gate 21 and the second AND gate 22 to determine whether it is the predetermined command PS.

在一實施例中,若輸入指令IS為預定指令PS時,則預定指令PS透過指令解碼單元101解碼後,致能訊號ES1與ES2則分別為邏輯1之訊號。如此一來,則第一AND閘21與第二AND閘22可由解碼訊號DS內的位址碼A,選擇並致能記憶體陣列103a與104a之其中一頁,換言之,記憶體裝置200再透過位址碼(Address)11b選定欲讀取的頁碼,並由位址碼A使第一記憶體陣列103a、第一頁緩衝器103b、第二記憶體陣列104a、以及第二頁緩衝器104b同時被致能,換言之,第二記憶體單元104進行與第一記憶體單元103於同時間進行讀取之程序,並由確認碼C確認進行讀取程序。 In an embodiment, if the input command IS is the predetermined command PS, the predetermined command PS is decoded by the command decoding unit 101, and the enable signals ES1 and ES2 are respectively signals of logic 1. In this way, the first AND gate 21 and the second AND gate 22 can select and enable one of the memory arrays 103a and 104a by the address code A in the decoded signal DS. In other words, the memory device 200 is re-transmitted. The address code 11b selects the page number to be read, and the first memory array 103a, the first page buffer 103b, the second memory array 104a, and the second page buffer 104b are simultaneously made by the address code A. It is enabled, in other words, the second memory unit 104 performs a program for reading with the first memory unit 103 at the same time, and confirms the reading process by the confirmation code C.

相反地,若輸入指令IS為一般指令NS時,本實施例,致能訊號ES1為邏輯1之訊號,而致能訊號ES2為邏輯0之訊號,第一AND閘21再由位址碼A使第一記憶體陣列103a與第一頁緩衝器103b被致能。 Conversely, if the input command IS is the general command NS, in this embodiment, the enable signal ES1 is a logic 1 signal, and the enable signal ES2 is a logic 0 signal, and the first AND gate 21 is further caused by the address code A. The first memory array 103a and the first page buffer 103b are enabled.

故,當輸入指令IS為預定指令PS時,由位址碼A選定其讀取之記憶體陣列103a與104a之頁碼,而第一AND閘21與第二AND閘22被致能訊號ES1、 以及ES2致能,換言之,控制訊號CS同時致能第一記憶體陣列103a、第一頁緩衝器103b、第二記憶體陣列104a、以及第二頁緩衝器104b。相反地,輸入指令為IS為一般指令NS時,由於致能訊號ES2為邏輯0,則第二AND閘22被禁能,此時由位址碼A選定其讀取之記憶體陣列103a之頁碼,控制訊號CS致能第一記憶體陣列103a與第一頁碼緩衝器103b。 Therefore, when the input command IS is the predetermined command PS, the page numbers of the read memory arrays 103a and 104a are selected by the address code A, and the first AND gate 21 and the second AND gate 22 are enabled signals ES1. And the ES2 enable, in other words, the control signal CS simultaneously enables the first memory array 103a, the first page buffer 103b, the second memory array 104a, and the second page buffer 104b. Conversely, when the input command is IS for the general command NS, since the enable signal ES2 is logic 0, the second AND gate 22 is disabled, and the page number of the memory array 103a read by the address code A is selected by the address code A. The control signal CS enables the first memory array 103a and the first page buffer 103b.

另外,在本發明一實施例中,第一記憶體單元103更包含第一行解碼單元103c、以及第一列解碼單元103d;第二記憶體單元104包含第二行解碼單元104c、以及第二列解碼單元104d。其中,第一行解碼單元103c耦接至控制邏輯單元102;第一列解碼單元103d耦接至控制邏輯單元102;以及,第二行解碼單元104c耦接至控制邏輯單元102;第二列解碼單元104d耦接至控制邏輯單元102。 In addition, in an embodiment of the present invention, the first memory unit 103 further includes a first row decoding unit 103c and a first column decoding unit 103d; the second memory unit 104 includes a second row decoding unit 104c, and a second Column decoding unit 104d. The first row decoding unit 103c is coupled to the control logic unit 102; the first column decoding unit 103d is coupled to the control logic unit 102; and the second row decoding unit 104c is coupled to the control logic unit 102; Unit 104d is coupled to control logic unit 102.

同前所述,在一實施例中,當輸入指令IS為預定指令PS時,控制邏輯單元102之控制訊號CS則同時致能第一行解碼單元103c、第一列解碼單元103d、第二行解碼單元104c、以及第二列解碼單元104d。如此一來,記憶體裝置200可讀取第一記憶體陣列103a與第二記憶體陣列104a內的資料流。 As described above, in an embodiment, when the input command IS is the predetermined command PS, the control signal CS of the control logic unit 102 simultaneously enables the first row decoding unit 103c, the first column decoding unit 103d, and the second row. The decoding unit 104c and the second column decoding unit 104d. In this way, the memory device 200 can read the data stream in the first memory array 103a and the second memory array 104a.

在此請注意,由於在先前技術之記憶體裝置11中,若需讀取兩個記憶體陣列103a與104a時,則所需的輸入指令IS之指令長度會較本發明之指令長度來得長,故在先前技術中,記憶體裝置11處理輸入指令IS所需的時間會相對於本發明之記憶體裝置200相 對的長,故透過本發明之預定指令PS進行操做記憶體裝置200,則可提升憶體裝置200讀取速度。 Please note that, in the prior art memory device 11, if two memory arrays 103a and 104a are to be read, the required instruction length of the input command IS is longer than the instruction length of the present invention. Therefore, in the prior art, the time required for the memory device 11 to process the input command IS is relative to the memory device 200 of the present invention. The pair is long, so that the memory device 200 is operated by the predetermined command PS of the present invention, and the reading speed of the memory device 200 can be improved.

請同時參考第3B圖,第3B圖顯示本發明一實施例之記憶體裝置200透過預定指令同時將資料寫入兩個記憶體陣列之其中一頁之示意圖。同前所述,若輸入指令IS為預定指令PS時,則預定指令PS透過指令解碼單元101解碼後,則致能訊號ES1與ES2則分別為邏輯1之訊號。如此一來,則第一AND閘21與第二AND閘22可由解碼訊號DS內的位址碼A,選擇並致能記憶體陣列103a與104a之其中一頁,換言之,記憶體裝置200再透過位址碼11b選定欲寫入的頁碼,並由位址碼A使第一記憶體陣列103a、第一頁緩衝器103b、第二記憶體陣列104a、以及第二頁緩衝器104b同時被致能,使輸入資料IN寫入記憶體陣列103a與104a。故第二記憶體單元104進行與第一記憶體單元103於同時間寫入輸入資料D1,並由確認碼C確認進行寫入程序。 Please refer to FIG. 3B at the same time. FIG. 3B is a schematic diagram showing that the memory device 200 according to an embodiment of the present invention simultaneously writes data into one of two memory arrays through a predetermined instruction. As described above, when the input command IS is the predetermined command PS, after the predetermined command PS is decoded by the command decoding unit 101, the enable signals ES1 and ES2 are respectively signals of logic 1. In this way, the first AND gate 21 and the second AND gate 22 can select and enable one of the memory arrays 103a and 104a by the address code A in the decoded signal DS. In other words, the memory device 200 is re-transmitted. The address code 11b selects the page number to be written, and the first memory array 103a, the first page buffer 103b, the second memory array 104a, and the second page buffer 104b are simultaneously enabled by the address code A. The input data IN is written to the memory arrays 103a and 104a. Therefore, the second memory unit 104 writes the input data D1 at the same time as the first memory unit 103, and confirms the writing process by the confirmation code C.

故,相較於先前技術之記憶體裝置11若需寫入兩個記憶體陣列103a與104a時,則所需的輸入指令IS之指令長度會較本發明之指令長度來得長,故在先前技術中,記憶體裝置11處理輸入指令IS所需的時間會相對於本發明之記憶體裝置200相對的長,透過本發明之預定指令PS進行操做記憶體裝置200,則可提升憶體裝置200寫入速度。除此之外,以較短的指令長度達到多重備份的效果,可以提升記憶體裝置200的可靠度。 Therefore, if the memory device 11 of the prior art needs to write two memory arrays 103a and 104a, the required instruction length of the input command IS is longer than the instruction length of the present invention, so in the prior art The time required for the memory device 11 to process the input command IS is relatively long relative to the memory device 200 of the present invention. When the memory device 200 is operated by the predetermined command PS of the present invention, the memory device 200 can be upgraded. Write speed. In addition, the reliability of the memory device 200 can be improved by achieving the effect of multiple backups with a short command length.

請同時參考第3C圖,第3C圖顯示本發明一實施例之記憶體裝置200透過預定指令同時將兩個記憶體陣列進行抹除之示意圖。當輸入指令IS為預定指令PS時,預定指令PS透過指令解碼單元101解碼後,則致能訊號ES1與ES2分別為邏輯1之訊號。如此一來,則第一AND閘21與第二AND閘22可由解碼訊號DS內的位址碼A,並致能記憶體陣列103a與104a之所有頁碼,換言之,記憶體裝置200透過位址碼11b選擇欲抹除之記憶體區塊(Block),並由位址碼A使第一記憶體陣列103a、第一頁緩衝器103b、第二記憶體陣列104a、以及第二頁緩衝器104b同時被致能,並進行抹除,並由確認碼C確認進行抹除程序。 Please refer to FIG. 3C at the same time. FIG. 3C is a schematic diagram showing the memory device 200 according to an embodiment of the present invention erasing two memory arrays simultaneously by a predetermined command. When the input command IS is the predetermined command PS, after the predetermined command PS is decoded by the command decoding unit 101, the enable signals ES1 and ES2 are respectively signals of logic 1. In this way, the first AND gate 21 and the second AND gate 22 can decode the address code A in the signal DS and enable all page numbers of the memory arrays 103a and 104a, in other words, the memory device 200 transmits the address code. 11b selects a memory block to be erased, and the first memory array 103a, the first page buffer 103b, the second memory array 104a, and the second page buffer 104b are simultaneously made by the address code A It is enabled and erased, and the erase code is confirmed by the confirmation code C.

請同時參考第4圖之流程圖,第4圖顯示本發明一種記憶體運作方法流程圖,且記憶體運作方法於一實施例中係使用於非揮發性記憶體(Non-volatile memory)之運作,方法包含以下步驟:步驟S401:開始;步驟S402:解碼一輸入指令,並產生一解碼訊號;步驟S403:依據該解碼訊號輸出一控制訊號;步驟S404:當輸入指令為預定指令時,預定指令PS係對同一資料在同一時間,在一第一記憶體單元存取一資料且在一第二記憶體單元備份該資料;步驟S405:控制訊號同時致能一第一記憶體陣列、一第一頁碼緩衝器、一第二記憶體陣列、以及一第二頁碼緩衝器;以及步驟S406:結束。 Please refer to the flowchart of FIG. 4 at the same time. FIG. 4 is a flow chart showing a method for operating a memory according to the present invention, and the method for operating the memory is used in the operation of a non-volatile memory in one embodiment. The method includes the following steps: Step S401: Start; Step S402: Decode an input command and generate a decoded signal; Step S403: Output a control signal according to the decoded signal; Step S404: When the input command is a predetermined command, the predetermined command The PS system accesses a data in a first memory unit and backs up the data in a second memory unit at the same time; the step S405: the control signal simultaneously enables a first memory array, a first a page buffer, a second memory array, and a second page buffer; and step S406: ending.

綜上所述,本發明之記憶體裝置與記憶體運作方法,係透過預定指令PS,使第一記憶體陣列與第二記憶體陣列同時進行讀取、寫入、以及抹除等處理程序。 本發明之記憶體裝置透過預定指令進行運作,可直接同時處理第一記憶體陣列與第二記憶體陣列,解決先前技術需要分兩次在兩個不同時間使用兩個一般指令,達到第一記憶體陣列與第二記憶體陣列批次處理的效果。除此之外,預定指令之指令長度較先前技術的一般指令來得短,故可以節省記憶體裝置運作處理的時間。又,預定指令可於同時間讓第一記憶體陣列與第二記憶體陣列同時進行讀取、寫入、以及抹除等程序,更可提升記憶體裝置的可靠度。 In summary, the memory device and the memory operating method of the present invention perform a processing procedure of reading, writing, and erasing the first memory array and the second memory array simultaneously through a predetermined command PS. The memory device of the present invention operates through a predetermined instruction, and can directly process the first memory array and the second memory array at the same time, and solves the prior art requirement to use two general instructions at two different times to achieve the first memory. The effect of batch processing of the volume array and the second memory array. In addition, the command length of the predetermined command is shorter than that of the prior art, so that the time for processing the memory device can be saved. Moreover, the predetermined command can simultaneously read, write, and erase the first memory array and the second memory array at the same time, thereby improving the reliability of the memory device.

200、11‧‧‧記憶體裝置 200, 11‧‧‧ memory devices

11a‧‧‧指令碼 11a‧‧‧ instruction code

11b‧‧‧位址碼 11b‧‧‧ address code

101‧‧‧指令解碼單元 101‧‧‧ instruction decoding unit

102‧‧‧控制邏輯單元 102‧‧‧Control logic unit

102a‧‧‧判斷單元 102a‧‧‧judging unit

103‧‧‧第一記憶體單元 103‧‧‧First memory unit

103a、11c‧‧‧第一記憶體陣列 103a, 11c‧‧‧ first memory array

103b、11d‧‧‧第一頁碼緩衝器 103b, 11d‧‧‧ first page buffer

103c‧‧‧第一行解碼單元 103c‧‧‧first line decoding unit

103d‧‧‧第一列解碼單元 103d‧‧‧First column decoding unit

104‧‧‧第二記憶體單元 104‧‧‧Second memory unit

104a、12c‧‧‧第二記憶體陣列 104a, 12c‧‧‧ second memory array

104b、12d‧‧‧第二頁碼緩衝器 104b, 12d‧‧‧ second page buffer

104c‧‧‧第二行解碼單元 104c‧‧‧second line decoding unit

104d‧‧‧第二列解碼單元 104d‧‧‧Second column decoding unit

21‧‧‧第一AND閘 21‧‧‧First AND gate

22‧‧‧第二AND閘 22‧‧‧Second AND gate

IS‧‧‧輸入指令 IS‧‧‧ input instructions

DS‧‧‧解碼訊號 DS‧‧‧ decoding signal

CS‧‧‧控制訊號 CS‧‧‧Control signal

PS‧‧‧預定指令 PS‧‧‧Scheduled order

ES1、ES2‧‧‧致能訊號 ES1, ES2‧‧‧ enable signal

C‧‧‧確認碼 C‧‧‧Confirmation code

D1‧‧‧輸入資料 D1‧‧‧ Input data

NS‧‧‧一般指令 NS‧‧ General Instruction

A‧‧‧位址碼 A‧‧‧ address code

S401~S406‧‧‧步驟 S401~S406‧‧‧Steps

第1A圖顯示先前技術之記憶體裝置分別讀取一個記憶體陣列其中一頁之示意圖。 Figure 1A shows a schematic diagram of a prior art memory device reading one page of a memory array, respectively.

第1B圖顯示先前技術之記憶體裝置分別讀取兩個記憶體陣列之其中一頁之示意圖。 Figure 1B shows a schematic diagram of a prior art memory device reading one of two memory arrays, respectively.

第1C顯示先前技術之記憶體裝置將資料寫入一個記憶體陣列之其中一頁之示意圖。 1C shows a schematic diagram of a prior art memory device writing data to one of a memory array.

第1D圖顯示先前技術之記憶體裝置將資料寫入兩個記憶體陣列其中一頁之示意圖。 Figure 1D shows a schematic diagram of a prior art memory device writing data to one of two memory arrays.

第1E顯示先前技術之記憶體裝置抹除一個記憶體陣列內資料之示意圖。 1E shows a schematic diagram of a prior art memory device erasing data in a memory array.

第1F圖顯示先前技術抹除兩個記憶體陣列內資料之示意圖。 Figure 1F shows a schematic diagram of prior art erase data in two memory arrays.

第2A圖顯示本發明一種記憶體裝置之一實施例示意圖。 Fig. 2A is a view showing an embodiment of a memory device of the present invention.

第2B圖顯示本發明一種記憶體裝置之一實施例示意圖。 Fig. 2B is a view showing an embodiment of a memory device of the present invention.

第3A圖顯示本發明一實施例之記憶體裝置透過預定指令PS同時讀取兩個記憶體陣列之其中一頁之示意圖。 FIG. 3A is a diagram showing a memory device of an embodiment of the present invention simultaneously reading one of two memory arrays through a predetermined command PS.

第3B圖顯示本發明一實施例之記憶體裝置透過預定指令PS同時將資料寫入兩個記憶體陣列之其中一頁之示意圖。 FIG. 3B is a diagram showing the memory device of the embodiment of the present invention simultaneously writing data to one of two memory arrays through a predetermined command PS.

第3C圖顯示本發明一實施例之記憶體裝置透過預定指令PS同時將兩個記憶體陣列進行抹除之示意圖。 FIG. 3C is a schematic diagram showing the memory device of the embodiment of the present invention erasing two memory arrays simultaneously through a predetermined command PS.

第4圖顯示本發明一種記憶體運作方法流程圖。 Figure 4 is a flow chart showing a method of operating a memory of the present invention.

Claims (12)

一種記憶體裝置,包含:一指令解碼單元,解碼一輸入指令,並產生一解碼訊號;一控制邏輯單元,依據該解碼訊號輸出一控制訊號;一第一記憶體單元,具有一第一記憶體陣列與一第一頁碼緩衝器;以及一第二記憶體單元,具有一第二記憶體陣列與一第二頁碼緩衝器;其中,當該輸入指令為一預定指令時,該預定指令係對同一資料在同一時間,在該第一記憶體單元存取該資料且在該第二記憶體單元存取備份該資料,且該記憶體裝置為非揮發性記憶體。 A memory device includes: an instruction decoding unit that decodes an input command and generates a decoded signal; a control logic unit that outputs a control signal according to the decoded signal; and a first memory unit having a first memory An array and a first page buffer; and a second memory unit having a second memory array and a second page buffer; wherein, when the input command is a predetermined command, the predetermined command is the same At the same time, the data is accessed by the first memory unit and accessed in the second memory unit, and the memory device is non-volatile memory. 如申請專利範圍第1項所述之記憶體裝置,其中,該預定指令為一存取備份指令,且該存取備份指令包含一驅動第一記憶體單元指令與一驅動第二記憶體單元指令。 The memory device of claim 1, wherein the predetermined instruction is an access backup instruction, and the access backup instruction includes a driving the first memory unit instruction and a driving the second memory unit instruction. . 如申請專利範圍第1項所述之記憶體裝置,其中,該備份之定義係指在該第二記憶體單元進行與在該第一記憶體單元進行相同之動作。 The memory device according to claim 1, wherein the definition of the backup refers to performing the same operation in the second memory unit as in the first memory unit. 如申請專利範圍第1項所述之記憶體裝置,其中,在該輸入指令為該預定指令時,該控制邏輯單元之該控制訊號同時致能該第一記憶體陣列、該第一頁 碼緩衝器、該第二記憶體陣列、以及該第二頁碼緩衝器。 The memory device of claim 1, wherein the control signal of the control logic unit simultaneously enables the first memory array and the first page when the input command is the predetermined command A code buffer, the second memory array, and the second page buffer. 如申請專利範圍第4項所述之記憶體裝置,其中,當該輸入指令為一一般指令時,該控制邏輯單元之該控制訊號同時致能該第一記憶體陣列與該第一頁碼緩衝器。 The memory device of claim 4, wherein, when the input command is a general command, the control signal of the control logic unit simultaneously enables the first memory array and the first page buffer . 如申請專利範圍第5項所述之記憶體裝置,其中,該控制邏輯單元包含一判斷單元,該判斷單元用以判斷該輸入指令為該預定指令或該一般指令;以及,該解碼訊號包含一第一致能訊號與一第二致能訊號。 The memory device of claim 5, wherein the control logic unit comprises a determining unit, the determining unit is configured to determine that the input command is the predetermined command or the general command; and the decoded signal includes a The first consistent signal and the second enable signal. 如申請專利範圍第6項所述之記憶體裝置,其中,該判斷單元包含:一第一AND閘,一第一端耦接至一定址訊號,一第二端耦接至該第一致能訊號;以及一第二AND閘,一第三端耦接至該定址訊號與該第一端,一第四端耦接至該第二致能訊號;其中,當該輸入指令為該預定指令時,該第一AND閘與該第二AND閘被該第一致能訊號、以及該第二致能訊號致能,使該控制訊號同時致能該第一記憶體陣列、該第一頁碼緩衝器、該第二記憶體陣列、以及該第二頁碼緩衝器;以及,當該輸入指令為該一般指令時,該第一AND閘被致能,而該第二AND閘被禁能,使該控制訊號同時致能該第一記憶體陣列與該第一頁碼緩衝器。 The memory device of claim 6, wherein the determining unit comprises: a first AND gate, a first end coupled to the address signal, and a second end coupled to the first enabler And a second AND gate, a third end coupled to the address signal and the first end, and a fourth end coupled to the second enable signal; wherein, when the input command is the predetermined command The first AND gate and the second AND gate are enabled by the first enable signal and the second enable signal, so that the control signal simultaneously enables the first memory array and the first page buffer The second memory array and the second page buffer; and, when the input command is the general command, the first AND gate is enabled, and the second AND gate is disabled, the control is enabled The signal simultaneously enables the first memory array and the first page buffer. 如申請專利範圍第7項所述之記憶體裝置,其中,該第一記憶體單元包含:一第一行解碼單元,耦接至該控制邏輯單元;以及一第一列解碼單元,耦接至該控制邏輯單元,以及;該第二記憶體單元包含:一第二行解碼單元,耦接至該控制邏輯單元;以及一第二列解碼單元,耦接至該控制邏輯單元;其中,當該輸入指令為該預定指令時,該控制邏輯單元之該控制訊號同時致能該第一行解碼單元、該第一列解碼單元、該第二行解碼單元、以及該第二列解碼單元。 The memory device of claim 7, wherein the first memory unit comprises: a first row decoding unit coupled to the control logic unit; and a first column decoding unit coupled to The control logic unit, and the second memory unit includes: a second row decoding unit coupled to the control logic unit; and a second column decoding unit coupled to the control logic unit; When the input command is the predetermined command, the control signal of the control logic unit simultaneously enables the first row decoding unit, the first column decoding unit, the second row decoding unit, and the second column decoding unit. 如申請專利範圍第7項所述之記憶體裝置,其中,該預定指令可使用於讀取程序、寫入程序、以及抹除程序。 The memory device of claim 7, wherein the predetermined instruction is for reading a program, writing a program, and erasing a program. 如申請專利範圍第8項所述之記憶體裝置,其中,該記憶體裝置為NAND快閃記憶體。 The memory device of claim 8, wherein the memory device is a NAND flash memory. 如申請專利範圍第9項所述之記憶體裝置,其中,該記憶體裝置可為固態硬碟及/或、及/或記憶卡、及/或隨身碟。 The memory device of claim 9, wherein the memory device is a solid state drive and/or a memory card and/or a flash drive. 一種記憶體運作方法,包含:解碼一輸入指令,並產生一解碼訊號;依據該解碼訊號輸出一控制訊號;其中,當該輸入指令為一預定指令時,該預定指令係對同一資料在同一時間,在一第一記憶體單元 存取一資料且在一第二記憶體單元存取備份該資料,該記憶體運作方法使用於非揮發性記憶體之運作。 A method for operating a memory, comprising: decoding an input command and generating a decoded signal; and outputting a control signal according to the decoded signal; wherein, when the input command is a predetermined command, the predetermined command is for the same data at the same time In a first memory unit Accessing a data and accessing the data in a second memory unit is used to operate the non-volatile memory.
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TWI230332B (en) * 2002-11-08 2005-04-01 Intel Corp Memory controllers with interleaved mirrored memory modes
TW201137628A (en) * 2009-10-21 2011-11-01 Micron Technology Inc Memory having internal processors and methods of controlling memory access

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI230332B (en) * 2002-11-08 2005-04-01 Intel Corp Memory controllers with interleaved mirrored memory modes
TW201137628A (en) * 2009-10-21 2011-11-01 Micron Technology Inc Memory having internal processors and methods of controlling memory access

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