TWI631290B - Non-contact bearing manufacturing method - Google Patents

Abstract

A non-contact bearing manufacturing method comprising the steps of: providing a bearing body including a guiding surface; and forming a microelectromechanical layer on the guiding surface, wherein the microelectromechanical layer comprises at least one micro sensor And/or at least one microactuator.

Description

Non-contact bearing manufacturing method

The present invention relates to a method of manufacturing a bearing, and more particularly to a method of manufacturing a non-contact bearing, wherein the non-contact bearing surface is provided with at least one micro-sensor and/or at least one micro-actuator.

Bearing is a device used on a rotating mechanism or a moving mechanism to support, reduce friction, and withstand loads, such as a spindle motor. With the advancement of technology, the relative parts are getting smaller and more precise, but the relative requirements of the bearings are getting higher and higher. Generally speaking, the bearings that require precision are the most common, but the ball bearings, but There are some problems, including high noise, insufficient rotation accuracy, and high cost of miniaturization, which cannot meet the requirements of small and precise. In order to achieve the above requirements, and to further reduce the friction of rotation, fluid bearings or magnetic bearings have also come out, not only high precision, low noise and strong seismic resistance.

There are two types of fluid bearings: hydrostatic bearings and hydrodynamic bearings. Hydrostatic bearings have fluid lubrication medium inside the bearing. When rotating, the pressure can be used to support the shaft. Shifting, the pressure is applied to the offset side to return the shaft to the correct position; and the fluid dynamic bearing has a fine groove in the inner bore portion of the bearing, and the groove has a lubricating medium inside, and the groove is rotated when the shaft is rotated. The lubricating medium inside is subjected to traction and squeezing, and a dynamic pressure is established, and the shaft center is supported at a central position. The hydrostatic bearing can be divided into a gas hydrostatic bearing and a hydrostatic bearing, and the hydrodynamic bearing can be divided into a gas dynamic pressure bearing and a hydrodynamic bearing.

However, taking hydrostatic bearings as an example, in the prior art measurement techniques, the conventional sensors are all disposed independently of the hydrostatic bearing. The measuring component can only perform in-situ measurement indirectly outside the bearing, and it is impossible to obtain correct and sufficient data for monitoring and analysis immediately and directly from the bearing surface, and provide an adjustment strategy for feedback control.

In view of this, it is therefore necessary to provide a non-contact bearing to solve the aforementioned problems.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of manufacturing a non-contact bearing wherein the non-contact bearing surface is provided with at least one micro-sensor and/or at least one micro-actuator.

In order to achieve the above object, the present invention provides a non-contact bearing manufacturing method comprising the steps of: providing a bearing body including a guiding surface; and forming a microelectromechanical layer on the guiding surface, wherein the microelectromechanical The layer includes at least one microsensor and/or at least one microactuator.

In the measurement, since the plurality of micro sensors and/or the plurality of microactuators of the present invention are disposed on the surface of the non-contact bearing (ie, the guiding surface), the micro sensors can be used instantaneously and Correct and sufficient data is directly obtained from the surface of the non-contact bearing for monitoring and analysis, and the adjustment mechanism of the feedback control is performed on the surface of the non-contact bearing by the microactuators.

The above and other objects, features, and advantages of the present invention will become more apparent from the accompanying drawings.

1‧‧‧ Non-contact bearings

10‧‧‧ bearing body

101‧‧‧Porosive material layer

1011‧‧‧Micropores

102‧‧‧Regular channel substrate

1021‧‧‧Microchannel

11‧‧‧Second guiding surface

12‧‧‧Microelectromechanical layer

12a‧‧‧Microsensor

12b‧‧‧Micro Actuator

121‧‧‧temperature sensor

1211‧‧‧Insulation

1212‧‧‧First metal layer

1213‧‧‧Second metal layer

1214‧‧‧Light resistance

1215a‧‧‧Connected channel

1215b‧‧‧ Connection channel

1216‧‧‧Photosensitive overlay

1217‧‧‧Electrical couples

1218‧‧‧ hot end temperature sensing area

1219‧‧‧ Cold end sensing area

122‧‧‧pressure sensor

1221‧‧‧Substrate

1222‧‧‧Micro-sensing components

1223‧‧‧Sensing film

1224‧‧‧welding line

1225‧‧‧ Cover

1226‧‧ ‧ chamber

1227‧‧‧ openings

123‧‧‧Micropump

123a‧‧ Entrance Channel

123b‧‧‧Export channel

1231‧‧‧ valve seat

1232‧‧‧ valve body

1233‧‧‧ valve body film

1234‧‧‧ Piezoelectric actuator

1235‧‧‧ cover

1236‧‧‧ inlet valve

1237‧‧‧Export valve

1238‧‧‧pressure chamber

124‧‧‧Microvalve

124a‧‧ Entrance Channel

124b‧‧‧Export channel

1241‧‧‧ valve seat

1242‧‧‧ valve body

1243‧‧‧ valve body film

1244‧‧‧ Piezoelectric actuator

1245‧‧‧ cover

125‧‧‧ Displacement Sensor

1251‧‧‧ coil

1252‧‧‧Test object

1253‧‧‧Metal surface

1254‧‧‧ eddy current

126‧‧ ‧ Acceleration regulations

1261‧‧‧Quality

1262‧‧‧Piezoelectric materials

13‧‧‧Gap support

2‧‧‧Gas Static Bearings

20‧‧‧ bearing body

201‧‧‧ porous material layer

2011‧‧‧Micropores

202‧‧‧ cavity

203‧‧‧ gas inlet

21‧‧‧ surface

22‧‧‧Microelectromechanical layer

2215‧‧‧Connected channel

3‧‧‧ Hydrostatic bearing

30‧‧‧ bearing body

301‧‧‧Regular channel substrate

3011‧‧‧Microchannel

302‧‧‧ cavity

303‧‧‧Liquid inlet

32‧‧‧Microelectromechanical layer

3215‧‧‧Connection channel

4‧‧‧Hydraulic pressure bearing

40‧‧‧ bearing body

401‧‧‧ porous material layer

4011‧‧‧Micropores

402‧‧‧ cavity

403‧‧‧Liquid inlet

41‧‧‧ surface

42‧‧‧Microelectromechanical layer

4215‧‧‧ Connection channel

5‧‧‧Gas dynamic pressure bearing

50‧‧‧ bearing body

501‧‧‧Regular channel substrate

5011‧‧‧Microchannel

502‧‧‧ cavity

503‧‧‧ gas inlet

52‧‧‧Microelectromechanical layer

5215‧‧‧ Connection channel

6‧‧‧Magnetic bearing

60‧‧‧ bearing body

612‧‧‧Second magnetic zone

62‧‧‧Microelectromechanical layer

7‧‧‧Devices with rail assemblies

71‧‧‧rails

711‧‧‧ Direction

712‧‧‧ surface

72‧‧‧ Slider

81‧‧‧First guiding surface

812‧‧‧First Magnetic Zone

9‧‧‧Devices with rotating members

91‧‧‧ shaft

911‧‧‧ surface

92‧‧‧Support bushing

93‧‧‧Locking components

94‧‧‧ Cover

D‧‧‧Predetermined spacing

F‧‧‧ force

Y‧‧‧ arrows

S100‧‧‧ steps

S200‧‧‧ steps

1a is a schematic cross-sectional view of a non-contact bearing according to an embodiment of the present invention; FIG. 1b is a plan view of a non-contact bearing according to an embodiment of the present invention; and FIG. 1c is a non-contact bearing according to an embodiment of the present invention; A flow chart of a manufacturing method; FIG. 2a is a schematic plan view of a first layer metal pattern line of a temperature sensor according to an embodiment of the present invention; 2b is a schematic plan view of a second layer of metal pattern lines of a temperature sensor according to an embodiment of the present invention; and FIG. 2c is a series thermocouple of a temperature sensor for completing two layers of metal layers according to an embodiment of the invention; FIG. 3 is a schematic cross-sectional view showing a method of manufacturing a temperature sensor according to an embodiment of the present invention; FIG. 3 is a cross-sectional view showing a method of manufacturing a temperature sensor according to another embodiment of the present invention; 3k is a cross-sectional view showing a method of manufacturing a temperature sensor according to still another embodiment of the present invention; FIG. 4a is a schematic cross-sectional view showing a pressure sensor according to an embodiment of the present invention; and FIG. 4b is an embodiment of the present invention; FIG. 4 is a schematic cross-sectional view of an acceleration gauge according to an embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of a micropump according to an embodiment of the present invention; FIG. 7 is a schematic cross-sectional view of a gas hydrostatic bearing according to an embodiment of the present invention; FIG. 8 is a perspective view of a device having a slide rail assembly according to the present invention; FIG. 9 is an embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a cross-sectional view showing a gas dynamic pressure bearing according to an embodiment of the present invention; FIG. 11 is a schematic cross-sectional view showing a device having a rotating member according to an embodiment of the present invention; A schematic cross-sectional view of a hydrodynamic bearing of one embodiment; Figure 13 is a cross-sectional view showing a magnetic bearing according to an embodiment of the present invention.

Referring to Figure 1a, a non-contact bearing of one embodiment of the present invention is shown. The non-contact bearing 1 is disposed at a predetermined distance D from a first guiding surface 81 when in the suspended state. The non-contact bearing 1 includes a bearing body 10 and a micro electro mechanical layer 12 . The bearing body 10 includes a second guiding surface 11 opposite to the first guiding surface 81. The microelectromechanical layer 12 is disposed on the second guiding surface 11 and includes at least one micro sensor (eg, a plurality of micro sensors 12a) and/or at least one micro actuator (eg, a plurality of microactuators) 12b). Referring to FIG. 1b, the micro-sensors 12a and the micro-actuators 12b may be arranged in a two-dimensional direction. The micro-sensors 12a can be selected from the group consisting of a temperature sensor, a pressure sensor, a displacement sensor, and an accelerometer. The microactuators 12b can be micropumps and/or microvalves. The microelectromechanical layer 12 further includes a plurality of lines and an insulating layer (not shown) for transmitting signals of the micro-sensor 12a and/or the plurality of micro-actuators 12b. In this embodiment, the non-contact bearing 1 can further include: a plurality of gap supports 13 disposed on the second guiding surface 11 for the non-contact bearing 1 to be in a non-suspended state. The gap support members 13 contact the first guiding surface 81. Since the thickness of the gap support members 13 is greater than the thickness of the microelectromechanical layer 12, the micro-sensor 12a and/or the micro-actuator 12b can be prevented from contacting the first guiding surface 81. The material of the gap support members 13 may be the same as the material of the insulating layer of the microelectromechanical layer 12. In another embodiment, the microelectromechanical layer 12 can further include: a protective layer (not shown) disposed on the outermost side of the microelectromechanical layer 12 for when the non-contact bearing 1 is in the non-contact In the floating state, the protective layer contacts the first guiding surface 81 to prevent the micro-sensor 12a and/or the micro-actuator 12b from contacting the first guiding surface 81.

Please refer to FIG. 1c, which shows the flow of a method for manufacturing a non-contact bearing according to an embodiment of the present invention. The non-contact bearing manufacturing method includes the following steps: In step S100, a bearing body 10 is provided, including a guiding surface (ie, a second guiding surface 11). In step S200, a microelectromechanical layer 12 is formed on the guiding surface, wherein the microelectromechanical layer 12 includes at least one micro sensor (eg, a plurality of micro sensors 12a) and/or at least one micro A actuator (eg, a plurality of microactuators 12b), as shown in Figure 1a.

Taking a temperature sensor as an example, a thermocouple is a commonly used temperature sensor. A thermocouple thermometer is a combination of two different metals (or wires) that are connected in series to form a loop for use. The junction of the two metal connections is at a temperature where a slight voltage is generated between them. The magnitude of the voltage depends on the type of metal and the junction, and the microamperemeter measures the weak current flowing through the metal, which is the Seebeck Effect. In other words, the thermocouple type sensing element uses two sets of resistance thermometers of different materials to obtain the voltage difference between the two sets of resistance thermometers in a differential manner.

2a is a plan view of a first layer of metal pattern lines, FIG. 2b is a plan view of a second layer of metal pattern lines, and FIG. 2c is a plan view of a series thermocouple pattern for completing two layers of metal layers. Referring to FIGS. 2a to 2c, in a thermocouple pattern in which two metal layers (first and second metal layers 1212, 1213) are connected in series, the hot end temperature sensing region 1218 is a first metal layer 1212 (eg, nickel metal) and An overlap region of the second metal layer 1213 (eg, copper metal), the cold junction sensing region 1219 is a pad portion, and the ferrule series 1217 is a first metal layer 1212 (eg, nickel metal) and a second metal layer 1213 (eg, copper) The metal) is connected in series to form a structure of a film type temperature sensor, that is, the temperature sensor 121 of the present invention.

The method for manufacturing the temperature sensor of the present invention is exemplified by copper and nickel metal. For the following, please refer to FIG. 3a to FIG. 3i.

Firstly, a bearing body 10 is provided. In this embodiment, the second guiding surface 11 of the bearing body 10 can be a surface or a regular channel of a porous material layer. The surface of the substrate. A layer of tantalum nitride is formed on the bearing body 10 by chemical vapor deposition as the insulating layer 1211, as shown in Fig. 3a. Further coating a photoresist (not shown) on the tantalum nitride layer 1211, performing a yellow light process, exposing and developing a pattern to be etched, and etching the tantalum nitride 1211 not covered by the photoresist to form a first pattern. After removing the photoresist, as shown in Figure 3b.

A first metal layer 1212 is deposited on the insulating layer 1211, which is nickel metal in this embodiment, and is a metal resistive material of the first metal material of the thermocouple, as shown in FIG. 3c. Applying a photoresist (not shown) on the first metal layer 1212 (nickel metal layer), performing a yellow light process, exposing and developing the first layer of thermocouple pattern, and etching the nickel metal to form the first layer. Thermocouple pattern, after removing the photoresist, as shown in Figure 3d.

A layer of copper metal is further vapor-deposited on the first metal layer 1212 (nickel metal layer) to form a second metal layer 1213. In this embodiment, it is copper metal, which is used as a pad material for the second metal material of the thermocouple, as shown in FIG. 3e. A layer of photoresist 1214 is further coated on the second metal layer 1213 (copper metal), as shown in FIG. 3f. Then, the second metal layer 1213 (copper metal) on the coating photoresist 1214 is subjected to a yellow light process by using a photomask containing the second pattern, and a second layer thermocouple pattern pad pattern is exposed and developed, as shown in FIG. 3g. The second metal layer 1213 (copper metal) is etched again as shown in FIG. 3h. Forming a second layer of thermocouple pad pattern, removing the photoresist 1214, thus completing a film type temperature sensor, that is, the temperature sensor 121 of the present invention (a part of the microelectromechanical layer 12), such as Figure 3i. While the film type temperature sensor is completed, a plurality of connection channels 1215 are also completed (the connection channel 1215 can be used as a gas or liquid to pass). In addition, a plurality of processes (hereinafter, referred to as an exposure and development etching process), which are mentioned in the foregoing steps, such as a photomask, a yellow light process, an exposure development, an etching, and a photoresist removal, may also be replaced by a laser direct writing process.

Therefore, the non-contact bearing manufacturing method according to the present invention is performed by an exposure and development etching process (including a plurality of exposure and development etching steps) and a film forming process (including a plurality of film forming steps), or by a laser beam Write process (including multiple laser direct writing steps) and a film forming process (including multiple films) Forming step), the microelectromechanical layer may be formed with the at least one micro sensor and/or at least one microactuator.

Referring to FIG. 3j, in another embodiment, when the bearing body 10 is a porous material layer 101, preferably, a photosensitive cover layer 1216 is formed on the second guiding surface 11 of the bearing body 10. Imageable Coverlay; PIC) is used as an interposer, and then a subsequent film formation process of the insulating layer 1211, the first metal layer 1212, and the second metal layer 1213 is performed, so that the temperature sensor 121 is attached to the porous material. The effect of layer 101. Therefore, according to the non-contact bearing manufacturing method of the present invention, a photosensitive cover layer is formed on the guide surface by an exposure and development etching process (including a plurality of exposure and development etching steps) and a film forming process (including a plurality of thin film forming steps), or by a laser direct writing process (including a plurality of laser direct writing steps) and a thin film forming process (including a plurality of thin film forming steps), at least one micro sensor and/or Or at least a microactuator is formed on the photosensitive cover layer.

Alternatively, a film forming process of the insulating layer 1211, the first metal layer 1212, and the second metal layer 1213 is performed first, and the temperature sensor 121 is formed on a photosensitive cover layer 1216, and then the photosensitive type is formed. The cover layer 1216 vacuum-attaches the temperature sensor 121 to the second guiding surface 11 of the bearing body 10 (as shown in FIG. 3j), so that the temperature sensor 121 can be attached to the porous material layer. The effect of 101. Therefore, the non-contact bearing manufacturing method according to the present invention is performed by an exposure and development etching process (including a plurality of exposure and development etching steps) and a film forming process (including a plurality of film forming steps), or by a laser beam a writing process (including a plurality of laser direct writing steps) and a film forming process (including a plurality of film forming steps), wherein the at least one micro sensor and/or at least one microactuator may be formed on the photosensitive cover On the floor. Then, the at least one micro sensor and/or the at least one microactuator and the photosensitive cover layer are vacuum-bonded to the second guiding surface.

Furthermore, the microelectromechanical layer 12 and the photosensitive cover layer 1216 are selectively formed with more connection channels by a laser puncturing process. 1215a, 1215b, the micropores 1011 of the porous material layer 101 may be sequentially connected.

Referring to FIG. 3k, in another embodiment, when the bearing body 10 is a regular channel substrate 102, the microelectromechanical layer 12 and the photosensitive cover layer 1216 may be selectively formed by a laser drilling process. There are more connection channels 1215a, 1215b to connect the plurality of microchannels 1021 of the regular channel substrate 102.

Referring to FIG. 4a and FIG. 1a , the pressure sensor 122 includes a substrate 1221 , a micro sensing element 1222 , a sensing film 1223 , a plurality of bonding wires 1224 , and a cover 1225 . . The micro sensing element 1222 is disposed on the substrate 1221. The sensing film 1223 is disposed on the micro sensing element 1222 and forms a chamber 1226 with the micro sensing element 1222. The bonding wire 1224 is used to electrically connect the sensing film 1223 to the substrate 1221. The cover 1225 is disposed on the substrate 1221 and covers the micro sensing element 1222. An opening 1227 is defined in the cover 1225 for allowing external air or hydraulic pressure to enter the cover 1225. The chamber 1226 itself has a fixed pressure, and when the external pressure presses the sensing film 1223, A pressure difference is generated between the pressure in the chamber 1226, and the signal is transmitted to the substrate 1221 through the bonding wire 1224, and the substrate 1221 is disposed to be applied. The non-contact bearing thus forms a pressure sensing circuit. In the present embodiment, the pressure sensor 122 (which is a part of the microelectromechanical layer 12) may be disposed on the second guiding surface 11 of the bearing body 10 or on the photosensitive cover layer (PIC).

Referring to FIG. 4b and FIG. 1a, taking the displacement sensor 125 as an example, the displacement sensor 125 includes a coil 1251. The displacement sensor 125 is mainly for measuring the displacement between the sensor and the metal surface 1253 (ie, the first guiding surface 81) of the object to be tested 1252, and the sensing principle is the coil of the displacement sensor 125. The magnetic field lines of 1251 induce the eddy current 1254 of the metal surface 1253 of the object to be tested 1252. When the displacement increases, the eddy current 1254 decreases: when the displacement decreases, the eddy current 1254 increases, thereby calculating the displacement. the amount. In this reality In an embodiment, the displacement sensor (which is part of the microelectromechanical layer 12) may be disposed on the second guiding surface 11 of the bearing body 10 or on the photosensitive cover layer (PIC).

Referring to FIG. 4c and FIG. 1a, taking the acceleration gauge 126 as an example, the accelerometer 126 includes a mass 1261 and a piezoelectric material 1262. The piezoelectric material 1262 is deformed to release the electric charge by the displacement of the mass 1261, and then the force F of the mass 1261 is calculated according to the charge release amount, thereby calculating the acceleration of the mass 1261. In this embodiment, the mass 1261 can be a part of the bearing body 10. The piezoelectric material 1262 can be a part of the microelectromechanical layer 12. The piezoelectric material 1262 of the accelerometer 126 can be disposed on the bearing body. On the second guiding surface 11 of 10 or on the above-mentioned photosensitive cover layer (PIC).

Referring to FIG. 5 and FIG. 1a, taking the micropump 123 as an example, the micro pump is a microfluidic piezoelectric device combining a piezoelectric actuator (Piezo Actuator) and a diaphragm (Diaphragm/Membrane) micropump technology. The micropump 123 includes a valve seat 1231, a valve body 1232, a valve body film 1233, a piezoelectric actuator 1234, a cover 1235, an inlet valve 1236 and an outlet valve 1237. The cover 1235 includes an inlet passage 123a and an outlet passage 123b. A pressure chamber 1238 is defined between the valve body 1232 and the piezoelectric actuator 1234. The valve body film 1233 is disposed between the valve seat 1231 and the valve body 1232. In this embodiment, when the non-contact bearing is a fluid bearing, the valve seat 1231 can be disposed on the second guiding surface 11 of the bearing body 10 or on the photosensitive cover layer (PIC). As the main source of supply for gases or liquids. If there is a sufficient number of micropumps, the non-contact bearing 1 can be individually made to have suspension characteristics. In another embodiment, the micropump 123 can be used as an auxiliary source of gas or liquid. The micropump 123 can be disposed at a position on the second guiding surface 11 that does not have the micro hole 1011 or a position without the micro channel 1021 so as to prevent the micro pump 123 from blocking the micro guiding surface 11 from the bearing body 10. The gas or liquid of the hole 1011 or the microchannel 1021 affects the suspension characteristics of the non-contact bearing 1.

For example, when a voltage is applied to the upper and lower poles of the piezoelectric actuator 1234, an electric field is generated, so that the piezoelectric actuator 1234 is bent by the electric field, and the piezoelectric actuator 1234 is bent and deformed in the direction indicated by the arrow Y. The volume of the pressure chamber 1238 will be increased, thereby creating a suction force that opens the inlet valve structure 1236 of the valve body membrane 1233 so that fluid can be drawn in from the inlet passage 123a on the valve seat 1231 and flow through the inlet valve. 1236 flows into the pressure chamber 1238. Conversely, when the piezoelectric actuator 1234 is bent and deformed in the opposite direction of the arrow Y due to the change of the electric field direction, the volume of the pressure chamber 1238 is compressed, so that the pressure chamber 1238 is internally fluid. A thrust is generated and the inlet valve 1236 and the outlet valve 1237 are subjected to a thrust in the opposite direction of the arrow Y, and the outlet valve 1237 is opened and fluid is passed from the pressure chamber 1238 via the outlet valve structure 1237. The outflow of the micropump 123 from the outlet passage 123b of the valve seat 1231 completes the fluid transfer process.

Taking the microvalve 124 as an example, it can be similar to the structure of a micropump. Referring to FIGS. 6 and 1a, the microvalve 124 includes a valve seat 1241, a valve body 1242, a valve body film 1243, a piezoelectric actuator 1244, and a cover 1245. The valve seat 1241 includes an inlet passage 124a that includes an outlet passage 124b. The valve body film 1243 is disposed between the valve seat 1241 and the valve body 1242. When a voltage is applied to the upper and lower poles of the piezoelectric actuator 1244, the microvalve 124 is opened to connect the inlet passage 124a to the outlet passage 124b; otherwise, when no voltage is applied to the upper and lower poles of the piezoelectric actuator 1244, the shutdown is performed. The microvalve 124 is a normally closed microvalve. The microvalve 124 must be disposed at a position corresponding to the micropore 1011 of the porous material layer 101 of the bearing body 10 or the position of the microchannel 1021 of the regular passage substrate 102 of the bearing body 10 to control the inside of the bearing body 10. Whether the gas or liquid flows out.

The non-contact bearing of the present invention may be a fluid bearing or a magnetic bearing. The fluid bearing may be selected from the group consisting of a hydrostatic bearing, a hydrostatic bearing, a gas dynamic bearing and a hydrodynamic bearing.

Referring to FIG. 7, in the first embodiment of the present invention, when the non-connected When the contact bearing is a gas static pressure bearing 2 or a gas dynamic pressure bearing, the bearing body 20 of the gas static pressure bearing 2 comprises a porous material layer 201, a cavity 202 and a gas inlet 203, the porous material layer The microholes 201 of 201, the cavity 202 and the gas inlet 203 are sequentially connected, and the micropores 2011 of the porous material layer 201 pass through the second guiding surface 11 , thereby passing gas through the gas inlet 203 and the cavity. The body 202 and the micropores 2011 of the porous material layer 201 are then passed through the plurality of connecting channels 2215 of the microelectromechanical layer 22 and flow into the gas hydrostatic bearing 2 (ie, the non-contact bearing) and the first guiding surface The predetermined spacing D between 81 is such that a floating effect is produced. In the present embodiment, one surface 21 of the porous material layer 201 is the second guiding surface 11. For example, referring to FIG. 8, the gas static pressure bearing 2 can be applied to a device 7 having a slide rail assembly, that is, the non-contact bearing (aerostatic bearing 2) is disposed on a slider 72 movable along a guide rail 71. The first guiding surface 81 is the surface 712 of the guide rail 71. The device 7 can be applied to machine tools or precision machines. Machine tools or precision machinery (for example, exposure machines in optoelectronic semiconductor equipment, ultra-precision lathes and ultra-precision machining centers for making ultra-precision molds, positioning stages in ultra-precision measuring equipment, etc.) use this guide rail 71, gas static pressure The bearing 2 and the slider 72 linearly move the work platform 73 in the direction 711 of the guide rail 71 with a very small frictional force, thereby improving the convenience in processing.

Referring to FIG. 9, in the second embodiment of the present invention, when the non-contact bearing is a hydrostatic bearing 3 or a hydrodynamic bearing, the bearing body 30 of the hydrostatic bearing 3 includes a regular passage substrate 301. a cavity 302 and a liquid inlet 303. The plurality of microchannels 3011, the cavity 302 and the liquid inlet 303 of the regular channel substrate 301 are sequentially connected, and the microchannels 3011 pass through the second guiding surface 11. Thereby, the liquid is passed through the liquid inlet 303, the cavity 302 and the microchannels 3011, and then passes through the connecting passage 3215 of the microelectromechanical layer 32 and flows into the hydrostatic bearing 3 (non-contact bearing) and the first A predetermined spacing D between the guiding faces 81 is such that a floating effect is produced. For example, the hydrostatic bearing can also be applied to the above-mentioned slide rail assembly, that is, the hydrostatic bearing (non-contact bearing) is disposed on a slider, the first guide The lead surface is the surface of a guide rail. Although the hydrostatic bearing 3 uses a liquid as a medium for generating a suspending effect, the liquid does not contaminate or deactivate the microelectromechanical layer 32 because the outer surface of the microelectromechanical layer 32 A protective layer (not shown) is provided for isolating the liquid.

Referring to FIG. 10, in a third embodiment of the present invention, when the non-contact bearing is a hydrostatic bearing or hydrodynamic bearing 4, the bearing body 40 of the hydrodynamic bearing 4 includes a porous material layer 401. a cavity 402 and a liquid inlet 403, the plurality of micropores 4011 of the porous material layer 401, the cavity 402 and the liquid inlet 403 are sequentially connected, and one surface 41 of the porous material layer 401 is the second guide Leading surface 11, and the micro holes 4011 pass through the second guiding surface 11, thereby passing liquid through the liquid inlet 403, the cavity 402 and the micro holes 4011, and then through the connection of the microelectromechanical layer 42 The passage 4215 flows into the predetermined distance D between the hydrodynamic bearing 4 (non-contact bearing) and the first guiding surface 81, so as to generate a suspension effect. For example, referring to FIG. 11, the hydrodynamic bearing 4 can be applied to a device 9 having a rotating member, that is, the hydrodynamic bearing 4 (non-contact bearing) is disposed on a supporting bushing 92. The lead surface 81 is a surface 911 of a rotating shaft 91. The support bushing 92 covers and limits the hydrodynamic bearing 4 . At least one or more of the latching elements 93 lock the plurality of corresponding outer covers 94 to secure the support bushing 92. The device 9 can rotate the shaft 92 with a very small frictional force by the support bushing 92 and the hydrodynamic bearing 4.

Referring to FIG. 12, in a fourth embodiment of the present invention, when the non-contact bearing is a gas static pressure bearing or a gas dynamic pressure bearing 5, the bearing body 50 of the gas dynamic pressure bearing 5 includes at least one regular passage substrate. 501, a cavity 502 and a gas inlet 503, the plurality of microchannels 5011 of the regular channel substrate 501, the cavity 502 and the gas inlet 503 are sequentially connected, and the microchannels 5011 pass through the second guiding surface 11 Thereby passing gas through the gas inlet 503, the cavity 502 and the microchannels 5011, and then passing through the microelectromechanical The connecting passage 5215 of the layer 52 flows into the predetermined distance D between the gas dynamic pressure bearing 5 (non-contact bearing) and the first guiding surface 81, thereby generating a suspension effect. For example, the gas dynamic pressure bearing 5 can also be applied to a device having a rotating member, that is, the gas dynamic pressure bearing 5 (non-contact bearing) is disposed on a supporting bushing, and the first guiding surface is a rotating shaft. The surface.

Referring to Fig. 13, in the fifth embodiment of the present invention, when the non-contact bearing is a magnetic bearing 6, the magnetic bearing 6 and a first guiding surface 81 are disposed at a predetermined interval D. The magnetic bearing 6 includes a bearing body 60 and a microelectromechanical layer 62. The first guiding surface 81 is provided with a first magnetic region 812. The second guiding surface 11 of the bearing body 60 is further provided with a second magnetic region 612, and the first and second magnetic regions 812 and 612 have the same magnetic property. . The first and second magnetic regions 812, 612 can be the same as the S pole or the N pole. The magnetic bearing 6 is magnetically repelled by the magnetic pole arrangement of the first and second magnetic regions 812, 612 to generate a magnetic floating effect. For example, the magnetic bearing 6 can also be applied to the above-mentioned rail assembly, that is, the magnetic bearing 6 (non-contact bearing) is disposed on a slider, and the first guiding surface 81 is a surface of a rail. For example, the magnetic bearing 6 can also be applied to a device having a rotating member, that is, the magnetic bearing 6 (non-contact bearing) is disposed on a supporting sleeve, and the first guiding surface is a surface of a rotating shaft.

In the measurement, since the plurality of micro sensors and/or the plurality of microactuators of the present invention are disposed on the surface of the non-contact bearing (ie, the guiding surface), the micro sensors can be used instantaneously and Correct and sufficient data is directly obtained from the surface of the non-contact bearing for monitoring and analysis, and the adjustment mechanism of the feedback control is performed on the surface of the non-contact bearing by the microactuators.

In the above, it is merely described that the present invention is an embodiment or an embodiment of the technical means for solving the problem, and is not intended to limit the scope of implementation of the present invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.

Claims (7)

A non-contact bearing manufacturing method comprising the steps of: providing a bearing body including a guiding surface; and forming a microelectromechanical layer on the guiding surface, wherein the microelectromechanical layer comprises at least one micro sensor And/or at least one microactuator; wherein the step of forming a microelectromechanical layer on the guiding surface comprises the steps of: forming the at least one micro sensor and/or the at least one microactuator And a photosensitive cover layer formed with the at least one micro sensor and/or the at least one microactuator is vacuum-bonded to the guiding surface. The non-contact bearing manufacturing method according to claim 1, wherein the micro sensor is selected from the group consisting of a temperature sensor, a pressure sensor, a displacement sensor, and an acceleration gauge. . The method of manufacturing a non-contact bearing according to claim 1, wherein the microactuator or micro-actuator is a micropump and/or a microvalve. The non-contact bearing manufacturing method of claim 1, wherein the microelectromechanical layer is formed with the at least one micro sensor and/or by an exposure and development etching process and a film forming process. At least one microactuator. A non-contact bearing manufacturing method comprising the steps of: providing a bearing body including a guiding surface; and forming a microelectromechanical layer on the guiding surface, wherein the microelectromechanical layer comprises at least one micro sensor And/or at least one microactuator; wherein the microelectromechanical layer is formed with the at least one microsensor and/or the at least one microactuator by a laser direct writing process and a thin film forming process . A non-contact bearing manufacturing method comprising the steps of: providing a bearing body including a guiding surface; Forming a microelectromechanical layer on the guiding surface, wherein the microelectromechanical layer comprises at least one micro sensor and/or at least one microactuator; wherein the microelectromechanical layer is formed by a laser drilling process Forming a plurality of connecting channels, when the guiding surface of the bearing body is a surface of a porous material layer or a surface of a regular channel substrate, the connecting channels are connected to the plurality of micropores of the porous material layer or A plurality of microchannels of a regular channel substrate. The non-contact bearing manufacturing method according to claim 6, wherein the non-contact bearing is a fluid bearing or a magnetic bearing, and the fluid bearing is selected from the group consisting of a gas static bearing, a hydrostatic bearing, a gas dynamic bearing and A group of hydrodynamic bearings.