TWI629772B - Camera module - Google Patents

Abstract

A photographic module includes: a circuit substrate, a photographic device, and an image processing chip-a circuit substrate; the present invention directly integrates an image sensing chip of the photographic device directly onto the circuit substrate through a COB (Chip On Board) process. Reduce the overall size, so that the camera module can be set in a narrow space.

Description

Photography module

A photographic module, in particular, a photographic module that integrates an image sensing wafer directly on a circuit substrate through a COB (Chip On Board) process to reduce the overall volume.

With the changes of the times, the action or display device is light, thin, small, and portable, but the display screen must be maximized, so the trend of narrow frame and thinning is derived. This description will be accompanied by the evolution of new technologies. The thinner, narrower, and higher-resolution photographic module is suitable for display devices with narrow bezels. Generally, conventional camera devices are limited by the bottleneck of the process technology, so the board width and height are limited, and the image processing chip is additionally processed. And the size of the optical lens is also one of the bottlenecks, so that the overall width and height of the device cannot meet the design requirements of a thin display device.

Since the conventional photographic camera module is mainly composed of a separate photographic lens unit and a circuit substrate, the photographic lens unit itself includes an image sensing chip and a filter, a lens base and a lens mutual The superimposed package is configured to have a high height. If the height is limited and the setting is not possible, the current camera module structure cannot be configured for a space that requires a narrow bezel and a height-limited position. .

Accordingly, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a photographic module that can be used in a space-constrained portion.

In order to achieve the above object, the present invention provides a photographic module comprising: a circuit substrate and a photographic device; The photographic device has an image sensing chip and a filter, a lens base and a lens, and is sequentially stacked and assembled. The image sensing chip is electrically connected to the circuit substrate through a plurality of gold wires; The image processing wafer is disposed on one side of the circuit substrate and covered by a metal cover.

The invention adopts a COB (Chip On Board) process to directly integrate an image sensing chip of the photographic device on the circuit substrate to reduce the overall volume, so that the photographic module can be disposed in a narrow space, and further enables photography. The module as a whole has more flexibility in setting.

1‧‧‧Photography module

11‧‧‧ circuit board

111‧‧‧ first side

112‧‧‧ second side

12‧‧‧Photographing device

121‧‧‧Image sensing wafer

122‧‧‧Filter

123‧‧‧Lens base

124‧‧‧ lens

13‧‧‧Image Processing Wafer

14‧‧‧Metal cover

15‧‧‧ microphone

16‧‧‧Connector

2‧‧‧ Gold Line

Figure 1 is a perspective exploded view of a first embodiment of the photographic module of the present invention.

Figure 2 is a perspective assembled view of the first embodiment of the photographic module of the present invention.

1 and 2 are a perspective exploded view and a combined view of a first embodiment of the photographic module of the present invention. As shown in the figure, the photographic module 1 of the present invention comprises: a circuit substrate 11 and a photographic device 12 An image processing chip 13; the circuit substrate 11 further has a first side 111 and a second side 112. The first and second sides 111 and 112 are correspondingly disposed on the upper and lower sides of the circuit substrate 11, and the foregoing photography is performed. The device 12 is disposed on the first side 111.

The photographic device 12 has an image sensing chip 121 and a filter 122, a lens base 123 and a lens 124, and is sequentially stacked and assembled. The image sensing chip 121 and the circuit substrate 11 are multiplexed. Gold wire 2 is electrically connected.

The image processing chip 13 is disposed on the side of the circuit substrate 11 and is covered and protected by a metal cover 14 which is a U-shaped hollow structure and covers the image processing chip. 13 above.

A microphone 15 and a connector 16 are further disposed on the first side 111 of the circuit board 11 and adjacent to the left and right sides of the photographic device 12, and are electrically connected to the circuit board 11.

The microphone 15 can receive external audio such as voice, and the camera module 1 can further electrically transmit image signal data to other external electronic components through the connector 16 .

The circuit board 11 is a multi-layer circuit board, and the circuit board 11 and the image sensing chip 121 have a nickel-palladium-gold layer.

The main purpose of the present invention is to improve the integration of the conventional image sensing chip 121 with the circuit substrate 11. If the installation space is too narrow or the height cannot be too high, the image sensing wafer 121 is directly integrated through the COB (Chip On Board) process. The wire is disposed on the circuit board 11, which can greatly reduce the overall height of the photographic module, and the invention is mainly applied to an ultra-thin and ultra-narrow photographic process with a width between 2-3.1 mm and a height between 2-2.5 mm. Module 1, this ultra-thin ultra-narrow camera module 1 makes the applicable mobile device smaller and lighter. The screen of the applicable image display device can be maximized, and the thickness is thinned to make it more beautiful and lighter, and conforms to the trend of the times.

The thinned photographic module 1 uses a miniaturized lens 124, a lens base 123, a filter 122, and an image sensing chip 121, and is completed by the aforementioned (Chip On Board) precision process technology using metal. The structural design of the lid 14 image sensor chip 121 and other related components within the metal cap 14 covering its performance primitives and remain free and provided on a narrow base.

Claims (4)

A photographic module includes: a circuit substrate; a photographic device having an image sensing chip and a filter, a lens base and a lens, and sequentially stacking each other, the circuit substrate is more than one And a layer of the nickel-palladium-gold layer of the circuit-sensing chip and the nickel-palladium layer of the circuit substrate are electrically connected through the plurality of gold wires; at least one image is formed on the circuit board. The processing chip is disposed on one side of the circuit substrate and covered and protected by a metal cover. The photographic module of claim 1 further includes a microphone disposed on a side of the circuit substrate and electrically connected to the circuit substrate. The photographic module of claim 1, wherein a connector is further disposed on a side of the circuit substrate and electrically connected to the circuit substrate. The photographic module of claim 1, wherein the image sensing chip and the circuit substrate are combined by a COB (Chip On Board) process.