TWI626789B - Antenna structure and wireless communication device with same - Google Patents
Antenna structure and wireless communication device with same Download PDFInfo
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Abstract
本發明提供一種天線結構,包括金屬件,所述金屬件上開設有至少一開槽,所述至少一開槽將所述金屬件至少劃分為間隔設置之第一結合部及第二結合部;饋入部,所述饋入部饋入電流訊號至所述第一結合部;接地部,所述接地部為所述第一結合部提供接地;以及輻射體,所述輻射體用以饋入電流訊號至所述第二結合部;其中,所述第一結合部、饋入部以及接地部構成所述天線結構之第一天線,用以激發第一模態以產生第一頻段之輻射訊號,所述第二結合部及所述輻射體構成所述天線結構之第二天線,用以激發第二模態以產生第二頻段之輻射訊號。 The present invention provides an antenna structure, including a metal member, the metal member is provided with at least one slot, and the at least one slot divides the metal member into at least a first joint portion and a second joint portion; a feeding portion, the feeding portion feeding a current signal to the first joint portion; a ground portion, the ground portion providing a ground for the first joint portion; and a radiator for feeding a current signal The first bonding portion, the feeding portion and the ground portion constitute a first antenna of the antenna structure for exciting the first mode to generate a radiation signal of the first frequency band, The second combining portion and the radiator form a second antenna of the antenna structure for exciting the second mode to generate a radiation signal of the second frequency band.
Description
本發明涉及一種天線結構及應用該天線結構之無線通訊裝置。 The invention relates to an antenna structure and a wireless communication device using the same.
隨著無線通訊技術之進步,無線通訊裝置不斷朝向輕薄趨勢發展,消費者對於產品外觀之要求亦越來越高。由於金屬殼體於外觀、機構強度、散熱效果等方面具有優勢,因此越來越多之廠商設計出具有金屬殼體之無線通訊裝置來滿足消費者之需求。然,金屬殼體容易干擾遮蔽設置於其內之天線所輻射之訊號,不容易達到寬頻設計,導致內置天線之輻射性能不佳。且隨著長期演進(Long Term Evolution,LTE)技術之不斷發展,天線之頻寬不斷增加。因此,如何利用金屬殼體設計出具有較寬頻寬之天線,是天線設計面臨之一項重要課題。 With the advancement of wireless communication technology, wireless communication devices are constantly moving toward a thin and light trend, and consumers are increasingly demanding the appearance of products. Due to the advantages of metal casing in terms of appearance, mechanism strength, and heat dissipation effect, more and more manufacturers have designed wireless communication devices with metal casings to meet the needs of consumers. However, the metal casing easily interferes with the signal radiated by the antenna disposed therein, and the broadband design is not easily achieved, resulting in poor radiation performance of the built-in antenna. And with the continuous development of Long Term Evolution (LTE) technology, the bandwidth of the antenna continues to increase. Therefore, how to design an antenna with a wider bandwidth by using a metal casing is an important issue in antenna design.
有鑑於此,有必要提供一種結合金屬殼體設計之天線結構。 In view of this, it is necessary to provide an antenna structure that incorporates a metal housing design.
另,有必要提供一種應用該天線結構之無線通訊裝置。 In addition, it is necessary to provide a wireless communication device to which the antenna structure is applied.
一種天線結構,包括:金屬件,所述金屬件上開設有至少一開槽,所述至少一開槽將所述金屬件至少劃分為間隔設置之第一結合部及第二結合部; 饋入部,所述饋入部電連接至所述第一結合部,並饋入電流訊號至所述第一結台部;接地部,所述接地部電連接至所述第一結合部,並為所述第一結合部提供接地;以及輻射體,所述輻射體用以與所述第二結合部電連接,並饋入電流訊號至所述第二結合部;其中,所述第一結合部、饋入部以及接地部構成所述天線結構之第一天線,用以激發第一模態以產生第一頻段之輻射訊號,所述第二結合部及所述輻射體構成所述天線結構之第二天線,用以激發第二模態以產生第二頻段之輻射訊號。 An antenna structure includes: a metal member, the metal member is provided with at least one slot, and the at least one slot divides the metal member into at least a first joint portion and a second joint portion; a feeding portion electrically connected to the first bonding portion and feeding a current signal to the first junction portion; a ground portion electrically connected to the first bonding portion and The first bonding portion provides a ground; and a radiator for electrically connecting to the second bonding portion and feeding a current signal to the second bonding portion; wherein the first bonding portion The feed portion and the ground portion constitute a first antenna of the antenna structure for exciting the first mode to generate a radiation signal of the first frequency band, and the second combining portion and the radiator form the antenna structure The second antenna is configured to excite the second mode to generate a radiation signal of the second frequency band.
一種無線通訊裝置,包括上述天線結構。 A wireless communication device includes the above antenna structure.
上述天線結構藉由於所述金屬件上設置二個開槽,以將所述金屬件劃分為三個結合部,其中一個結合部構成天線結構之第一天線,以產生多頻段之操作頻寬,並藉由所述第一切換電路之設置,使得低頻頻段之頻率可調整,進而涵蓋至GSM/WCDMA/LTE系統多頻帶之操作。另外,所述天線結構還將另外一個結合部作為第二天線,以達到LTE載波聚合之需求。 The antenna structure is configured to divide the metal member into three joints by using two slots on the metal member, and one of the joint portions constitutes a first antenna of the antenna structure to generate a multi-band operation bandwidth. And by setting the first switching circuit, the frequency of the low frequency band can be adjusted to cover the operation of the multi-band of the GSM/WCDMA/LTE system. In addition, the antenna structure also has another combining portion as the second antenna to meet the requirements of LTE carrier aggregation.
100、300‧‧‧天線結構 100, 300‧‧‧ antenna structure
11‧‧‧金屬件 11‧‧‧Metal parts
111‧‧‧第一邊框 111‧‧‧First border
1111‧‧‧第一結合部 1111‧‧‧ first joint
1113‧‧‧第二結合部 1113‧‧‧Second junction
1115‧‧‧第三結合部 1115‧‧‧ Third Joint Department
111‧‧‧第一邊框 111‧‧‧First border
112‧‧‧第二邊框 112‧‧‧second border
113‧‧‧第三邊框 113‧‧‧ third border
114‧‧‧第四邊框 114‧‧‧fourth border
116‧‧‧第一開槽 116‧‧‧First slotting
117‧‧‧第二開槽 117‧‧‧Second slotting
12‧‧‧饋入部 12‧‧‧Feeding Department
13‧‧‧接地部 13‧‧‧ Grounding Department
15‧‧‧第一切換電路 15‧‧‧First switching circuit
151‧‧‧切換單元 151‧‧‧Switch unit
153‧‧‧切換元件 153‧‧‧Switching components
16‧‧‧輻射體 16‧‧‧ radiator
161‧‧‧饋入段 161‧‧‧Feeding section
163‧‧‧輻射部 163‧‧‧ Radiation Department
165‧‧‧接地段 165‧‧‧ Grounding section
166‧‧‧第一輻射段 166‧‧‧First radiant section
167‧‧‧第二輻射段 167‧‧‧second radiant section
168‧‧‧第三輻射段 168‧‧‧the third radiant section
169‧‧‧第四輻射段 169‧‧‧fourth radiant section
A1‧‧‧第一天線 A1‧‧‧first antenna
A2‧‧‧第二天線 A2‧‧‧second antenna
A3‧‧‧第三天線 A3‧‧‧ third antenna
A4‧‧‧第四天線 A4‧‧‧fourth antenna
200/400‧‧‧無線通訊裝置 200/400‧‧‧Wireless communication device
21‧‧‧基板 21‧‧‧Substrate
211‧‧‧第一饋入點 211‧‧‧ first feed point
212‧‧‧第二饋入點 212‧‧‧second feed point
213‧‧‧接地點 213‧‧‧ Grounding point
215‧‧‧淨空區 215‧‧‧ clearance area
23‧‧‧第一匹配電路 23‧‧‧First matching circuit
231‧‧‧第一匹配元件 231‧‧‧First matching component
233‧‧‧第二匹配元件 233‧‧‧Second matching component
25‧‧‧第二匹配電路 25‧‧‧Second matching circuit
251‧‧‧第三匹配元件 251‧‧‧ third matching component
253‧‧‧第四匹配元件 253‧‧‧fourth matching component
圖1為本發明第一較佳實施例具有天線結構之無線通訊裝置之示意圖。 1 is a schematic diagram of a wireless communication device having an antenna structure according to a first preferred embodiment of the present invention.
圖2為圖1無線通訊裝置另一角度下之示意圖。 2 is a schematic diagram of the wireless communication device of FIG. 1 from another angle.
圖3為圖1所示天線結構中第一切換電路之電路圖。 3 is a circuit diagram of a first switching circuit in the antenna structure shown in FIG. 1.
圖4為圖1所示天線結構中第一匹配電路之電路圖。 4 is a circuit diagram of a first matching circuit in the antenna structure shown in FIG. 1.
圖5為圖1所示天線結構中第二匹配電路之電路圖。 FIG. 5 is a circuit diagram of a second matching circuit in the antenna structure shown in FIG. 1. FIG.
圖6為圖1所示天線結構之S參數(散射參數)曲線圖。 Fig. 6 is a graph showing S parameters (scattering parameters) of the antenna structure shown in Fig. 1.
圖7為圖1所示天線結構之輻射效率曲線圖。 Figure 7 is a graph showing the radiation efficiency of the antenna structure shown in Figure 1.
圖8為圖1所示天線結構利用載波聚合技術工作於LTE Band5頻段及Band7頻段之S參數(散射參數)曲線圖。 FIG. 8 is a graph showing S-parameters (scattering parameters) of the antenna structure shown in FIG. 1 operating in the LTE Band 5 band and the Band 7 band using carrier aggregation technology.
圖9為本發明第二較佳實施例具有天線結構之無線通訊裝置之示意圖。 FIG. 9 is a schematic diagram of a wireless communication device having an antenna structure according to a second preferred embodiment of the present invention.
圖10-12為圖9所示天線結構利用載波聚合技術工作於LTE Band5頻段及Band7頻段之S參數(散射參數)曲線圖。 10-12 are graphs of S parameters (scattering parameters) of the antenna structure shown in FIG. 9 operating in the LTE Band 5 band and the Band 7 band using carrier aggregation technology.
下面將結合本發明實施例中之附圖,對本發明實施例中之技術方案進行清楚、完整地描述,顯然,所描述之實施例僅僅是本發明一部分實施例,而不是全部之實施例。基於本發明中之實施例,所屬領域具有通常知識者於沒有做出創造性勞動前提下所獲得之所有其他實施例,均屬於本發明保護之範圍。 The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without the creative work are all within the scope of the present invention.
需要說明之是,當一個元件被稱為“電連接”另一個元件,它可直接於另一個元件上或者亦可存在居中之元件。當一個元件被認為是“電連接”另一個元件,它可是接觸連接,例如,可是導線連接之方式,亦可是非接觸式連接,例如,可是非接觸式耦合之方式。 It should be noted that when an element is referred to as "electrically connected" to another element, it can be directly on the other element or the element can be present. When an element is considered to be "electrically connected" to another element, it can be a contact connection, for example, a wire connection or a non-contact connection, for example, a non-contact coupling.
除非另有定義,本文所使用之所有之技術與科學術語與屬於所屬領域具有通常知識者通常理解之含義相同。本文中於本發明之說明書中所使用之術語僅是為描述具體之實施例之目不是旨在於限制本發明。本文所使用之術語“及/或”包括一個或多個相關之所列項目的任意之與所有之組合。 Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art. The terminology used in the description of the invention herein is for the purpose of describing the particular embodiments. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.
下面結合附圖,對本發明之一些實施方式作詳細說明。於不衝突之情況下,下述之實施例及實施例中之特徵可相互組合。 Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below may be combined with each other without conflict.
請參閱圖1及圖2,本發明第一較佳實施方式提供一種天線結構100,其應用於行動電話、個人數位助理等無線通訊裝置200中,用以發射、接收無線電波以傳遞、交換無線訊號。 Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the present invention provides an antenna structure 100 for use in a wireless communication device 200 such as a mobile phone or a personal digital assistant for transmitting and receiving radio waves for transmitting and exchanging wireless signals. Signal.
該無線通訊裝置200還包括基板21。該基板21可採用環氧樹脂玻璃纖維(FR4)等介電材質製成。所述基板21上設置有第一饋入點211、第二饋入點212以及接地點213。該第一饋入點211及第二饋入點212間隔設置於所述基板21上,用於為天線結構100饋入電流。該接地點213設置於所述第一饋入點211與第二饋入點212之間,用於為天線結構100提供接地。所述基板21上還設置有淨空區215。該淨空區215設置於所述基板21之一側。所述淨空區215是指基板21上無導體存於之區域,用以防止外於環境中之電子元件如電池、振動器、喇叭、電荷耦合器件(Charge Coupled Device,CCD)等對天線結構100產生干擾,造成其工作頻率偏移或輻射效率變低。於本實施例中,所述淨空區215之尺寸大致為74*5mm2。 The wireless communication device 200 also includes a substrate 21. The substrate 21 can be made of a dielectric material such as epoxy glass fiber (FR4). The substrate 21 is provided with a first feed point 211, a second feed point 212, and a ground point 213. The first feed point 211 and the second feed point 212 are spaced apart from each other on the substrate 21 for feeding current to the antenna structure 100. The grounding point 213 is disposed between the first feeding point 211 and the second feeding point 212 for providing grounding for the antenna structure 100. A clearance area 215 is further disposed on the substrate 21. The clearance area 215 is disposed on one side of the substrate 21. The clearing area 215 refers to a region on the substrate 21 where no conductor is stored, so as to prevent external components such as a battery, a vibrator, a horn, a charge coupled device (CCD), and the like in the environment. Interference occurs, causing its operating frequency to shift or the radiation efficiency to be low. In the embodiment, the size of the clearance area 215 is approximately 74*5 mm 2 .
所述天線結構100包括金屬件11、饋入部12、接地部13、第一切換電路15以及輻射體16。該金屬件11為無線通訊裝置200之外觀件,如金 屬邊框。於本實施例中,該金屬件11為一框體結構,包括第一邊框111、第二邊框112、第三邊框113以及第四邊框114。該第一邊框111與第四邊框114相對且相互平行設置。所述第二邊框112與第三邊框113相對且相互平行設置,且分別連接至該第一邊框111及第四邊框114之兩端。所述第一邊框111、第二邊框112、第三邊框113以及第四邊框114共同圍繞所述基板21設置,且所述第一邊框111臨近所述淨空區215設置。 The antenna structure 100 includes a metal member 11, a feeding portion 12, a ground portion 13, a first switching circuit 15, and a radiator 16. The metal member 11 is an appearance component of the wireless communication device 200, such as gold. Belongs to the border. In the embodiment, the metal member 11 is a frame structure, and includes a first frame 111, a second frame 112, a third frame 113, and a fourth frame 114. The first frame 111 is opposite to the fourth frame 114 and disposed parallel to each other. The second frame 112 is opposite to the third frame 113 and parallel to each other, and is respectively connected to both ends of the first frame 111 and the fourth frame 114. The first frame 111 , the second frame 112 , the third frame 113 , and the fourth frame 114 are disposed together around the substrate 21 , and the first frame 111 is disposed adjacent to the clearance area 215 .
該第一邊框111上開設有二個開槽,即第一開槽116及第二開槽117。該第一開槽116與第二開槽117之寬度可為0.8-2.0mm。於本實施例中,該第一開槽116及第二開槽117之寬度均為1.5mm。該第一開槽116與第二開槽117將所述金屬件11劃分為相互間隔設置之三個結合部。其中所述第一開槽116與第二開槽117之間之金屬件11構成第一結合部1111。所述第二開槽117遠離所述第一結合部1111一側之金屬件11構成第二結合部1113。所述第一開槽116遠離所述第一結合部1111一側之金屬件11構成第三結合部1115。於本實施例中,所述第二結合部1113及第三結合部1115分別藉由至少一個接地點電連接至所述基板21之接地面,進而為所述天線結構100提供接地。 The first frame 111 is provided with two slots, that is, a first slot 116 and a second slot 117. The width of the first slot 116 and the second slot 117 may be 0.8-2.0 mm. In this embodiment, the first slot 116 and the second slot 117 have a width of 1.5 mm. The first slot 116 and the second slot 117 divide the metal member 11 into three joint portions that are spaced apart from each other. The metal member 11 between the first slot 116 and the second slot 117 constitutes a first joint portion 1111. The metal member 11 on the side of the second slot 117 away from the first joint portion 1111 constitutes a second joint portion 1113. The metal member 11 of the first slot 116 away from the first joint portion 1111 forms a third joint portion 1115. In the embodiment, the second bonding portion 1113 and the third bonding portion 1115 are electrically connected to the ground plane of the substrate 21 by at least one grounding point, thereby providing grounding for the antenna structure 100.
所述饋入部12臨近所述第一開槽116設置。所述饋入部12之一端可藉由一天線分離濾波器(圖未示)電連接至所述第一饋入點211,另一端電連接至所述第一結合部1111。所述接地部13之一端電連接至所述接地點213,另一端電連接至所述第一結合部1111。如此,當電流從所述第一饋入點211饋入後,將藉由所述饋入部12流入所述第一結合部1111,再藉由所述接地部13流入所述接地點213,進而使得所述第一結合部1111構成所述天線結構100之第一天線A1,進而激發一第一模態以產生第一頻段之輻射訊號。 本實施例中,所述第一模態為一低頻模態。請一併參閱圖3,所述第一切換電路15包括切換單元151及至少一切換元件153。於本實施例中,所述第一切換電路15包括三個切換元件153。所述三個切換元件153均為電感,且電感值分別為9nH、12nH、22nH。所述切換單元151電連接至所述接地部13。所述切換元件153之間相互並聯,且其一端電連接至所述切換單元151,另一端接地。如此,藉由控制所述切換單元151之切換,可使得所述第一結合部1111切換至不同之切換元件153。由於每一個切換元件153具有不同之電感,因此藉由所述切換單元151之切換,可調整所述第一天線A1之第一模態之第一頻段。 The feeding portion 12 is disposed adjacent to the first slot 116. One end of the feeding portion 12 is electrically connected to the first feeding point 211 by an antenna separating filter (not shown), and the other end is electrically connected to the first bonding portion 1111. One end of the grounding portion 13 is electrically connected to the grounding point 213, and the other end is electrically connected to the first bonding portion 1111. In this way, when the current is fed from the first feed point 211, the feed portion 12 flows into the first joint portion 1111, and then flows into the ground point 213 through the ground portion 13, thereby further The first bonding portion 1111 is configured to form the first antenna A1 of the antenna structure 100, thereby exciting a first mode to generate a radiation signal of the first frequency band. In this embodiment, the first mode is a low frequency mode. Referring to FIG. 3 together, the first switching circuit 15 includes a switching unit 151 and at least one switching element 153. In the embodiment, the first switching circuit 15 includes three switching elements 153. The three switching elements 153 are all inductive, and the inductance values are 9nH, 12nH, and 22nH, respectively. The switching unit 151 is electrically connected to the ground portion 13. The switching elements 153 are connected in parallel with each other, and one end thereof is electrically connected to the switching unit 151, and the other end is grounded. As such, by controlling the switching of the switching unit 151, the first combining portion 1111 can be switched to a different switching element 153. Since each switching element 153 has a different inductance, the first frequency band of the first mode of the first antenna A1 can be adjusted by the switching of the switching unit 151.
例如,當所述切換單元151切換至電感值為9nH之切換元件153時,所述天線結構100可工作於Band8頻段(880-960MHz)。當所述切換單元151切換至電感值為12nH之切換元件153時,所述天線結構100可工作於LTE Band5頻段(824-894MHz)。當所述切換單元151切換至電感值為22nH之切換元件153時,所述天線結構100可工作於Band17頻段(704-746MHz)。 For example, when the switching unit 151 is switched to the switching element 153 having an inductance value of 9 nH, the antenna structure 100 can operate in the Band 8 band (880-960 MHz). When the switching unit 151 is switched to the switching element 153 having an inductance value of 12 nH, the antenna structure 100 can operate in the LTE Band 5 band (824-894 MHz). When the switching unit 151 is switched to the switching element 153 having an inductance value of 22 nH, the antenna structure 100 can operate in the Band 17 band (704-746 MHz).
當然,可理解之是,所述切換元件153不局限於上述項所述之電感,其還可為電容或者電感與電容之組合。另外,所述切換元件153之數量亦不局限為三個,其數量可根據實際情況進行調整。 Of course, it can be understood that the switching element 153 is not limited to the inductance described in the above item, and may also be a capacitor or a combination of an inductor and a capacitor. In addition, the number of the switching elements 153 is not limited to three, and the number thereof can be adjusted according to actual conditions.
請再次參閱圖2,所述輻射體16臨近所述第二結合部1113設置,且設置於所述淨空區215上方。所述輻射體16包括饋入段161、輻射部163及接地段165。所述饋入段161大致呈矩形條狀,其設置於與所述基板21相垂直之平面內。所述饋入段161之一端可藉由饋線、金屬彈片、探針等連接元件電連接至所述第二饋入點212,另一端電連接至所述輻射部163,用以饋 入電流至所述輻射部163。所述輻射部163整體設置於與所述基板21相平行之平面內。所述輻射部163包括第一輻射段166、第二輻射段167、第三輻射段168以及第四輻射段169。所述第一輻射段166大致呈矩形條狀。所述第一輻射段166之一端垂直連接至所述饋入段161。所述第一輻射段161之另一端沿平行所述第一邊框111且朝向所述第二邊框112之方向延伸,直至與所述第二邊框112連接。所述第二輻射段167大致呈矩形條狀。所述第二輻射段167垂直連接至所述第一輻射段166靠近所述第二邊框112之一側。所述第二輻射段167之另一端沿平行所述第二邊框112且靠近所述第一邊框111之方向延伸。所述第三輻射段168之一端垂直連接至所述第二輻射段167遠離所述第一輻射段166之端部,另一端沿平行所述第一輻射段166且靠近所述第三邊框113之方向延伸。所述第四輻射段169大致呈矩形條狀。所述第四輻射段169之一端垂直連接至所述第三輻射段168遠離所述第二輻射段167之一端,另一端沿平行所述第二輻射段167且靠近所述第一邊框111之方向延伸,直至與所述第一邊框111靠近所述第二開槽117之一端電連接。 Referring to FIG. 2 again, the radiator 16 is disposed adjacent to the second joint portion 1113 and disposed above the clearance portion 215. The radiator 16 includes a feeding section 161, a radiating portion 163, and a grounding portion 165. The feeding section 161 has a substantially rectangular strip shape and is disposed in a plane perpendicular to the substrate 21. One end of the feeding section 161 can be electrically connected to the second feeding point 212 by a connecting element such as a feed line, a metal dome, a probe, etc., and the other end is electrically connected to the radiating part 163 for feeding An electric current is supplied to the radiation portion 163. The radiation portion 163 is entirely disposed in a plane parallel to the substrate 21. The radiating portion 163 includes a first radiating section 166, a second radiating section 167, a third radiating section 168, and a fourth radiating section 169. The first radiant section 166 is substantially rectangular strip-shaped. One end of the first radiant section 166 is vertically connected to the feed section 161. The other end of the first radiating section 161 extends in a direction parallel to the first frame 111 and toward the second frame 112 until it is connected to the second frame 112. The second radiant section 167 is substantially rectangular strip-shaped. The second radiating section 167 is vertically connected to the first radiating section 166 near one side of the second bezel 112. The other end of the second radiating section 167 extends in a direction parallel to the second frame 112 and adjacent to the first frame 111. One end of the third radiating section 168 is perpendicularly connected to the end of the second radiating section 167 away from the first radiating section 166, and the other end is parallel to the first radiating section 166 and adjacent to the third bezel 113. The direction extends. The fourth radiant section 169 is substantially rectangular strip-shaped. One end of the fourth radiating section 169 is perpendicularly connected to the third radiating section 168 away from one end of the second radiating section 167, and the other end is parallel to the second radiating section 167 and adjacent to the first frame 111 The direction extends until it is electrically connected to one end of the first bezel 111 adjacent to the second slot 117.
所述接地段165設置於與所述基板21相垂直之平面內。所述接地段165之一端電連接至所述第一輻射段166靠近所述第二邊框112之一端,另一端可藉由一匹配電路(圖未示)接地。如此,當電流從所述第二饋入點212饋入後,將藉由所述饋入段161流入所述輻射部163,再藉由所述接地段165接地,進而使得所述第二結合部1113及所述輻射體16構成所述天線結構100之第二天線A2,並激發一第二模態以產生第二頻段之輻射訊號。本實施例中,所述第二模態為一高頻模態。可理解,所述匹配電路用於調整所述天線結構100之阻抗匹配。 The grounding segment 165 is disposed in a plane perpendicular to the substrate 21. One end of the grounding section 165 is electrically connected to one end of the first radiating section 166 near the second frame 112, and the other end is grounded by a matching circuit (not shown). As such, when the current is fed from the second feed point 212, the feed portion 161 flows into the radiating portion 163, and then the ground portion 165 is grounded, thereby enabling the second combination. The portion 1113 and the radiator 16 form a second antenna A2 of the antenna structure 100 and excite a second mode to generate a radiation signal of the second frequency band. In this embodiment, the second mode is a high frequency mode. It can be understood that the matching circuit is used to adjust the impedance matching of the antenna structure 100.
可理解,於其他實施例中,所述第一饋入點211還可藉由第一匹配電路23電連接至所述饋入部12。所述第二饋入點212可藉由第二匹配電路25電連接至所述輻射體16。 It can be understood that in other embodiments, the first feed point 211 can also be electrically connected to the feed portion 12 by the first matching circuit 23 . The second feed point 212 can be electrically connected to the radiator 16 by a second matching circuit 25.
其中,請一併參閱圖4,於本實施例中,所述第一匹配電路23包括第一匹配元件231及第二匹配元件233。其中所述第一匹配元件231之一端電連接至所述第一饋入點211,另一端電連接至所述第二匹配元件233之一端及所述饋入部12。所述第二匹配元件233之另一端接地。於本實施例中,所述第一匹配元件231為一電容,其電容值為1.5pF。所述第二匹配元件233為一電感,其電感值為16nH。當然,於其他實施例中,所述第一匹配元件231不局限於上述項所述之電容,其還可為電感或者電感與電容之組合。同樣,所述第二匹配元件233不局限於上述項所述之電感,其還可為電容或者電感與電容之組合。 Referring to FIG. 4 , in the embodiment, the first matching circuit 23 includes a first matching component 231 and a second matching component 233 . One end of the first matching component 231 is electrically connected to the first feeding point 211, and the other end is electrically connected to one end of the second matching component 233 and the feeding portion 12. The other end of the second matching element 233 is grounded. In this embodiment, the first matching component 231 is a capacitor having a capacitance value of 1.5 pF. The second matching component 233 is an inductor having an inductance value of 16 nH. Of course, in other embodiments, the first matching component 231 is not limited to the capacitor described in the above item, and may also be an inductor or a combination of an inductor and a capacitor. Similarly, the second matching component 233 is not limited to the inductance described in the above item, and may also be a capacitor or a combination of an inductor and a capacitor.
請一併參閱圖5,於本實施例中,所述第二匹配電路25包括第三匹配元件251及第四匹配元件253。其中所述第三匹配元件251之一端電連接至所述第二饋入點212,另一端電連接至所述第四匹配元件253之一端及所述輻射體16。所述第四匹配元件253之另一端接地。於本實施例中,所述第三匹配元件251為一電感,其電感值為8nH。所述第四匹配元件253為一電容,其電容值為500fF。當然,於其他實施例中,所述第三匹配元件251不局限於上述項所述之電感,其還可為電容或者電感與電容之組合。同樣,所述第四匹配元件253不局限於上述項所述之電容,其還可為電感或者電感與電容之組合。 Referring to FIG. 5 , in the embodiment, the second matching circuit 25 includes a third matching component 251 and a fourth matching component 253 . One end of the third matching component 251 is electrically connected to the second feed point 212, and the other end is electrically connected to one end of the fourth matching component 253 and the radiator 16. The other end of the fourth matching element 253 is grounded. In this embodiment, the third matching component 251 is an inductor having an inductance value of 8 nH. The fourth matching component 253 is a capacitor having a capacitance value of 500 fF. Of course, in other embodiments, the third matching component 251 is not limited to the inductance described in the above item, and may also be a capacitor or a combination of an inductor and a capacitor. Similarly, the fourth matching component 253 is not limited to the capacitance described in the above item, and may also be an inductor or a combination of an inductor and a capacitor.
請一併參閱圖6,為所述天線結構100之S參數(散射參數)曲線圖。其中曲線S41為所述天線結構100中第一切換電路15切換至電感值為9nH之切換元件153時之S11值。曲線S42為所述天線結構100中第一切換電路15切換至電感值為12nH之切換元件153時之S11值。曲線S43為所述天線結構100中第一切換電路15切換至電感值為22nH之切換元件153時之S11值。顯然,當所述第一切換電路15切換至不同之切換元件153時,所述天線結構100可工作於不同之低頻頻段,例如Band8頻段(880-960MHz,對應於GSM900)、LTE Band5頻段(824-894MHz,對應於GSM850)、Band17頻段(704-746MHz,BTE band17)。另外,所述天線結構100於相應之高頻頻段,例如GSM1800/1900、UMTS 2100、LTE Band7,亦可滿足天線設計要求。 Please refer to FIG. 6 as a graph of S parameters (scattering parameters) of the antenna structure 100. The curve S41 is the S11 value when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 9 nH. The curve S42 is the S11 value when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 12 nH. A curve S43 is an S11 value when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 22 nH. Obviously, when the first switching circuit 15 is switched to different switching elements 153, the antenna structure 100 can operate in different low frequency bands, such as Band8 frequency band (880-960 MHz, corresponding to GSM900), LTE Band 5 frequency band (824). -894MHz, corresponding to GSM850), Band17 band (704-746MHz, BTE band17). In addition, the antenna structure 100 can also meet antenna design requirements in corresponding high frequency bands, such as GSM1800/1900, UMTS 2100, and LTE Band7.
請一併參閱圖7,為所述天線結構100之輻射效率曲線圖。其中曲線S51為所述天線結構100中第一切換電路15切換至電感值為9nH之切換元件153時之輻射效率。曲線S52為所述天線結構100中第一切換電路15切換至電感值為12nH之切換元件153時之輻射效率。曲線S53為所述天線結構100中第一切換電路15切換至電感值為22nH之切換元件153時之輻射效率。顯然,所述天線結構100可藉由所述第一切換電路15之切換,而完整涵蓋目前常用之GSM/WCDMA/LTE等通訊系統所需要之系統頻寬,符合天線設計需求,且具有較佳之輻射效率,例如天線輻射效率均於45%以上。 Please refer to FIG. 7 for a graph of the radiation efficiency of the antenna structure 100. The curve S51 is the radiation efficiency when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 9 nH. The curve S52 is the radiation efficiency when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 12 nH. The curve S53 is the radiation efficiency when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 22 nH. Obviously, the antenna structure 100 can be completely switched to cover the system bandwidth required by the currently used communication systems such as GSM/WCDMA/LTE by the switching of the first switching circuit 15, and meets the antenna design requirements, and has better performance. Radiation efficiency, such as antenna radiation efficiency, is above 45%.
如上述所述,所述天線結構100藉由所述第一饋入點211饋入電流訊號至所述第一結合部1111,以構成第一天線A1,進而產生多頻段之操作頻寬,並藉由所述第一切換電路15之切換,使得所述天線結構100涵蓋至GSM/WCDMA/LTE系統。再者,所述天線結構100藉由所述第二天線A2 之設置,可達到長期演進技術升級版(LTE-Advanced)之載波聚合(CA,Carrier Aggregation)之需求,例如Band3+Band7頻段、Band20+Band7頻段等。即所述無線通訊裝置200可使用所述載波聚合技術並使用第一天線A1及第二天線A2同時於多個不同頻段接收或發送無線訊號。 As described above, the antenna structure 100 feeds a current signal to the first combining portion 1111 through the first feeding point 211 to form a first antenna A1, thereby generating an operation bandwidth of a multi-band. And by the switching of the first switching circuit 15, the antenna structure 100 is covered to a GSM/WCDMA/LTE system. Furthermore, the antenna structure 100 is provided by the second antenna A2 The setting can meet the requirements of Carrier Aggregation (CA) of LTE-Advanced, such as Band3+Band7 band and Band20+Band7 band. That is, the wireless communication device 200 can use the carrier aggregation technology and use the first antenna A1 and the second antenna A2 to simultaneously receive or transmit wireless signals in a plurality of different frequency bands.
請一併參閱圖8,為所述天線結構100利用所述載波聚合技術工作於LTE Band5頻段及Band7頻段之S參數(散射參數)曲線圖。其中曲線S61為所述天線結構100中第一切換電路15切換至電感值為12nH之切換元件153時所述第一天線A1之S11值。曲線S62為所述天線結構100中所述接地段165藉由一電容值為0.8pf之電容接地時所述第二天線A2之S11值。曲線S63為所述天線結構100同時工作於LTE Band5頻段及Band7頻段時之隔離度。顯然,當所述無線通訊裝置200使用所述載波聚合技術同時於兩個不同頻段(LTE Band5頻段及Band7頻段)接收或發送無線訊號時,其隔離度低於-10dB,符合天線之設計要求。 Please refer to FIG. 8 for the S-parameter (scattering parameter) graph of the antenna structure 100 operating in the LTE Band 5 band and the Band 7 band by using the carrier aggregation technology. The curve S61 is the S11 value of the first antenna A1 when the first switching circuit 15 in the antenna structure 100 is switched to the switching element 153 having an inductance value of 12nH. The curve S62 is the S11 value of the second antenna A2 when the grounding segment 165 of the antenna structure 100 is grounded by a capacitor having a capacitance value of 0.8 pf. The curve S63 is the isolation of the antenna structure 100 when operating in the LTE Band 5 band and the Band 7 band simultaneously. Obviously, when the wireless communication device 200 uses the carrier aggregation technology to simultaneously receive or transmit wireless signals in two different frequency bands (LTE Band 5 band and Band 7 band), the isolation is lower than -10 dB, which is in accordance with the antenna design requirements.
可理解,於其他實施例中,所述第二天線A2中之接地段165還可接入相應之第二切換電路(圖未示)。所述第二切換電路之結構及功能可與所述第一切換電路15一致,於此不再贅述。如此,藉由所述第二切換電路之切換,可使得所述第二天線A2工作於不同之頻段,並實現不同頻段之組合。例如,藉由所述第二切換電路之切換,可使得所述第二天線A2僅工作於GPS頻段。藉由所述第二切換電路之切換,可使得所述第二天線A2僅工作於BT頻段或WIFI頻段。藉由所述第二切換電路之切換,可調整所述第二模態之第二頻段,使得所述第二天線A2工作於GPS頻段及Band7頻段。 藉由所述第二切換電路之切換,可使得所述第二天線A2工作於GPS頻段及BT頻段或GPS頻段及WIFI頻段。 It can be understood that in other embodiments, the ground segment 165 of the second antenna A2 can also be connected to a corresponding second switching circuit (not shown). The structure and function of the second switching circuit may be the same as the first switching circuit 15, and details are not described herein again. Thus, by switching the second switching circuit, the second antenna A2 can be operated in different frequency bands and realize a combination of different frequency bands. For example, by switching the second switching circuit, the second antenna A2 can be operated only in the GPS band. By switching the second switching circuit, the second antenna A2 can be operated only in the BT band or the WIFI band. The second frequency band of the second mode can be adjusted by the switching of the second switching circuit, so that the second antenna A2 operates in the GPS band and the Band7 band. The second antenna A2 can be operated in the GPS frequency band and the BT frequency band or the GPS frequency band and the WIFI frequency band by switching the second switching circuit.
請一併參閱圖9,為本發明第二較佳實施方式提供之無線通訊裝置400,其與所述無線通訊裝置200之區別在於,所述無線通訊裝置400還包括第三天線A3及第四天線A4。所述第三天線A3及第四天線A4與所述第一天線A1及第二天線A2相對設置,即所述第三天線A3及第四天線A4設置於所述無線通訊裝置400之另一端。於本實施例中,所述第三天線A3之結構與所述第一天線A1之結構一致,所述第四天線A4之結構與第二天線A2之結構一致,於此不再贅述。 Referring to FIG. 9 , a wireless communication device 400 according to a second preferred embodiment of the present invention is different from the wireless communication device 200 in that the wireless communication device 400 further includes a third antenna A3 and a fourth Antenna A4. The third antenna A3 and the fourth antenna A4 are disposed opposite to the first antenna A1 and the second antenna A2, that is, the third antenna A3 and the fourth antenna A4 are disposed on the wireless communication device 400. One end. In this embodiment, the structure of the third antenna A3 is consistent with the structure of the first antenna A1, and the structure of the fourth antenna A4 is consistent with the structure of the second antenna A2, and details are not described herein.
於本實施例中,所述第一天線A1為主天線,所述第三天線A3為分集(diversity)天線。請一併參閱圖10-12,為所述天線結構300利用所述載波聚合技術工作於LTE Band5頻段及LTE Band7頻段之S參數(散射參數)曲線圖。其中曲線S81、S91、S101為所述天線結構300中第三天線A3切換至LTE Band5頻段時之S11值。曲線S82、S92、S102為所述天線結構300中第四天線A4工作於LTE Band7頻段時之S11值。曲線S83、S93、S103為所述天線結構300中第一天線A1切換至LTE Band5頻段時之S11值。曲線S84、S94、S104為所述天線結構300中第二天線A2工作於LTE Band7頻段時之S11值。曲線S85為所述天線結構300中第一天線A1與第三天線A3之間之隔離度。曲線S86為所述天線結構300中第三天線A3與第四天線A4之間之隔離度。曲線S87為所述天線結構300中第二天線A2與第三天線A3之間之隔離度。曲線S95為所述天線結構300中第一天線A1與第二天線A2之間之隔離度。曲線 S96為所述天線結構300中第一天線A1與第四天線A4之間之隔離度。曲線S105為所述天線結構300中第二天線A2與第四天線A4之間之隔離度。 In this embodiment, the first antenna A1 is a main antenna, and the third antenna A3 is a diversity antenna. Please refer to FIG. 10-12 for the S-parameter (scattering parameter) graph of the LTE Band 5 band and the LTE Band 7 band for the antenna structure 300 using the carrier aggregation technology. The curves S81, S91, and S101 are S11 values when the third antenna A3 in the antenna structure 300 is switched to the LTE Band5 frequency band. Curves S82, S92, and S102 are S11 values when the fourth antenna A4 in the antenna structure 300 operates in the LTE Band 7 band. Curves S83, S93, and S103 are S11 values when the first antenna A1 in the antenna structure 300 is switched to the LTE Band 5 band. Curves S84, S94, and S104 are S11 values when the second antenna A2 in the antenna structure 300 operates in the LTE Band 7 band. Curve S85 is the isolation between the first antenna A1 and the third antenna A3 in the antenna structure 300. Curve S86 is the isolation between the third antenna A3 and the fourth antenna A4 in the antenna structure 300. Curve S87 is the isolation between the second antenna A2 and the third antenna A3 in the antenna structure 300. Curve S95 is the isolation between the first antenna A1 and the second antenna A2 in the antenna structure 300. curve S96 is the isolation between the first antenna A1 and the fourth antenna A4 in the antenna structure 300. Curve S105 is the isolation between the second antenna A2 and the fourth antenna A4 in the antenna structure 300.
顯然,當所述無線通訊裝置400使用所述載波聚合技術同時於兩個不同之頻段(LTE Band5頻段及Band7頻段)接收或發送無線訊號時,每兩個不同之天線之間之隔離度均低於-10dB,符合天線之設計要求。 Obviously, when the wireless communication device 400 uses the carrier aggregation technology to simultaneously receive or transmit wireless signals in two different frequency bands (LTE Band 5 band and Band 7 band), the isolation between each two different antennas is low. At -10dB, in line with the design requirements of the antenna.
可理解,於其他實施例中,還可將所述第三天線A3設置為分集天線,而所述第四天線A4設置為GPS天線,並藉由設置一雙工器(圖未示)來實現訊號之分離。 It can be understood that in other embodiments, the third antenna A3 can also be configured as a diversity antenna, and the fourth antenna A4 is configured as a GPS antenna, and is implemented by setting a duplexer (not shown). The separation of signals.
本發明之天線結構100/300藉由於所述金屬件11上設置二個開槽,以將所述金屬件11劃分為三個結合部,其中一個結合部構成天線結構100之第一天線,以產生多頻段之操作頻寬,並藉由所述第一切換電路15之設置,使得低頻頻段之頻率可調整,進而涵蓋至GSM/WCDMA/LTE系統多頻帶之操作。另外,所述天線結構100/300還將另外一個結合部作為第二天線,以達到LTE載波聚合之需求。 The antenna structure 100/300 of the present invention divides the metal member 11 into three joints by providing two slots on the metal member 11, and one of the joint portions constitutes a first antenna of the antenna structure 100. To generate the operating bandwidth of the multi-band, and by the setting of the first switching circuit 15, the frequency of the low-frequency band can be adjusted to cover the operation of the multi-band of the GSM/WCDMA/LTE system. In addition, the antenna structure 100/300 also has another combining portion as the second antenna to meet the requirements of LTE carrier aggregation.
以上所述,僅為本發明的較佳實施例,並非是對本發明作任何形式上的限定。另外,本領域技術人員還可在本發明精神內做其它變化,當然,這些依據本發明精神所做的變化,都應包含在本發明所要求保護的範圍之內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.
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