本揭露的一實施例提供一種電連接裝置,包括:一基座,包括:一基座本體;以及一支撐部,與該基座本體於一第一方向上及垂直該第一方向之一第二方向上相結合;一柔性電路板,包括:一第一對接部,沿該第一方向與該支撐部相結合,該第一對接部具有一第一對接面,該第一對接面上具有複數個第一焊墊;一第二對接部,沿該第一方向與該支撐部相結合,該第二對接部具有一第二對接面,該第二對接面上具有複數個第二焊墊,該第一對接部與該第二對接部沿該第二方向排列;一安裝部,沿該第二方向與該支撐部相結合,該安裝部具有一安裝面,該安裝面上具有複數個第一錫球及複數個第二錫球;複數個第一導電跡線,連接該等第一焊墊與該等第一錫球;以及複數個第二導電跡線,連接該等第二焊墊與該等第二錫球;一第一連接器,沿該第一方向與該第一對接部相結合,該第一連接器包括:一第一絕緣殼;以及複數個第一端子固設於該第一絕緣殼,各第一端子包括:一第一插接部;以及一第一焊接部,連接於該等第一焊墊;一第二連接器,沿該第一方向與該第二對接部相結合,該第二連接器包括:一第二絕緣殼;以及複數個第二端子固設於該第二絕緣殼,各第二端子包括:一第二插接部;以及一第二焊接部,連接於該等第二焊墊;一蓋體,該蓋體沿該第一方向與該基座相結合,該蓋體界定有至少一開口以暴露該第一插接部與該第二插接部;以及一固定件,固定該基座以及該蓋體之組合。 在一些實施例中,該電連接裝置更包括一基板,具有複數個第三焊墊與複數個第四焊墊,該等第三焊墊連接該等第一錫球,該等第四焊墊連接該等第二錫球,其中該固定件固定該基座、該蓋體以及該基板之組合。 在一些實施例中,該基板為一硬式電路板。 在一些實施例中,該第一插接部與該第二插接部用以連接外部電路。 在一些實施例中,該至少一開口包括一第一開口及一第二開口,該第一開口暴露該第一插接部,該第二開口暴露該第二插接部。 在一些實施例中,該基座本體與該支撐部為相互獨立。 在一些實施例中,該基座本體與該支撐部為一體成形。 在一些實施例中,該基座更包括一第一插孔,該蓋體更包括一第二插孔,該基板更包括兩第三插孔,該固定件之兩端部分別穿過該第一插孔與該第二插孔,並分別插入且固定於該兩第三插孔。 在一些實施例中,該基座更包括一凸塊,該蓋體更包括一扣合部,該扣合部界定有一扣合開口,該凸塊扣合且固定於該扣合開口。 在一些實施例中,該基座本體更包括沿一第三方向排列且於該第二方向上延伸的兩第二凸柱,該安裝部更包括位於該第三方向上的兩第三穿孔,該兩第二凸柱分別穿過該兩第三穿孔而定位。 在一些實施例中,該兩第三穿孔比該兩第二凸柱稍大。 在一些實施例中,該柔性電路板更包括一連接部連接該第一對接部與該安裝部,該第一對接部以及該第二對接部位於該柔性電路板之一第一端,該安裝部位於該柔性電路板之相對於該第一端之一第二端,且該柔性電路板藉由該連接部圍繞包覆該基座。 在一些實施例中,該柔性電路板之該第一對接部以及該第二對接部位於該柔性電路板之一第一端,該安裝部位於該柔性電路板之相對於該第一端之一第二端,該安裝部是先連接到第二對接部再連接到第一對接部,且該柔性電路板之側視為一L型。 在一些實施例中,該柔性電路板更包括一連接部連接該第一對接部與該安裝部,該第一對接部位於該柔性電路板之一第一端,該第二對接部位於該柔性電路板之相對於該第一端之一第二端,該安裝部位於該第一對接部與該第二對接部之間,且該柔性電路板藉由該連接部圍繞包覆該基座。 在一些實施例中,該柔性電路板更包括兩導光管,用以導引安裝於該柔性電路板上之一發光二極體元件所發出的光,該蓋體更包括兩導光孔,該兩導光管穿過該兩導光孔而外露。 在本揭露之一實施例中,該電連接裝置之該等連接器之該等端子並無直接與該基板相連接,該等端子是藉由該柔性電路板之該等對接部、該等導電跡線以及該等安裝部與該基板相連接。相較於傳統利用接地端子以降低訊號端子間串擾的作法,該實施例中由於該柔性電路板中有接地層可提供較好的接地參考以及屏蔽,以更大範圍地吸收該等導電跡線傳輸訊號時所發出的例如電磁波等干擾,可較佳地降低該等導電跡線之間的串擾。此外,利用該柔性電路板以降低串擾的效果不受該等連接器的堆疊數目影響,因此該電連接裝置之設計可更有彈性,例如可進一步擴充以包含更多連接器。 在本揭露之一實施例中,該電連接裝置之該柔性電路板是藉由該等錫球與該基板做連接。相較於利用端子直接與電路板連接的做法,該實施例中的該等錫球可在藉由例如表面黏著技術與該基板連接時提供較好的共面性,使該等錫球能確實地安裝到該基板上之正確位置。 在本揭露之一實施例中,該電連接裝置之該基座、該蓋體以及該基板是藉由該固定件以強化該組合之固定。 上文已相當廣泛地概述本揭露的技術特徵及優點,俾使下文的本揭露詳細描述得以獲得較佳瞭解。構成本揭露的申請專利範圍標的的其它技術特徵及優點將描述於下文。本揭露所屬技術領域中具有通常知識者應瞭解,可相當容易地利用下文揭示的概念與特定實施例可作為修改或設計其它結構或製程而實現與本揭露相同的目的。本揭露所屬技術領域中具有通常知識者亦應瞭解,這類等效建構無法脫離後附的申請專利範圍所界定的本揭露的精神和範圍。An embodiment of the present disclosure provides an electrical connection device, including: a base, including: a base body; and a support portion, and the base body is in a first direction and perpendicular to the first direction a flexible circuit board comprising: a first abutting portion coupled to the supporting portion along the first direction, the first butting portion having a first abutting surface, the first mating surface having a plurality of first pads; a second abutting portion coupled to the supporting portion along the first direction, the second abutting portion having a second abutting surface, the second mating surface having a plurality of second pads The first abutting portion and the second abutting portion are arranged along the second direction; a mounting portion is coupled to the supporting portion along the second direction, the mounting portion has a mounting surface, and the mounting surface has a plurality of a first solder ball and a plurality of second solder balls; a plurality of first conductive traces connecting the first solder pads and the first solder balls; and a plurality of second conductive traces connected to the second solder a pad and the second solder ball; a first connector along the first side The first connector includes: a first insulative housing; and a plurality of first terminals are fixed to the first insulative housing, each of the first terminals includes: a first plug portion; And a first soldering portion connected to the first solder pads; a second connector coupled to the second butting portion along the first direction, the second connector comprising: a second insulating shell; a plurality of second terminals are fixed to the second insulating shell, each of the second terminals includes: a second plug portion; and a second soldering portion connected to the second solder pads; a cover body, the cover body In combination with the base in the first direction, the cover defines at least one opening to expose the first plug portion and the second plug portion; and a fixing member for fixing the base and the cover body combination. In some embodiments, the electrical connection device further includes a substrate having a plurality of third pads and a plurality of fourth pads, the third pads connecting the first solder balls, the fourth pads The second solder balls are connected, wherein the fixing member fixes the base, the cover and the combination of the substrates. In some embodiments, the substrate is a rigid circuit board. In some embodiments, the first plug portion and the second plug portion are used to connect an external circuit. In some embodiments, the at least one opening includes a first opening and a second opening, the first opening exposing the first plug portion, and the second opening exposing the second plug portion. In some embodiments, the base body and the support portion are independent of one another. In some embodiments, the base body is integrally formed with the support portion. In some embodiments, the pedestal further includes a first insertion hole, the cover further includes a second insertion hole, the substrate further includes two third insertion holes, and the two ends of the fixing member respectively pass through the first insertion hole a jack and the second jack are respectively inserted and fixed to the two third jacks. In some embodiments, the base further includes a protrusion, and the cover further includes a fastening portion, the fastening portion defines a fastening opening, and the protrusion is fastened and fixed to the fastening opening. In some embodiments, the base body further includes two second protrusions arranged in a third direction and extending in the second direction, the mounting portion further comprising two third perforations in the third direction, the Two second protrusions are respectively positioned through the two third through holes. In some embodiments, the two third perforations are slightly larger than the two second studs. In some embodiments, the flexible circuit board further includes a connecting portion connecting the first butting portion and the mounting portion, the first butting portion and the second butting portion are located at a first end of the flexible circuit board, the mounting The portion is located at a second end of the flexible circuit board opposite to the first end, and the flexible circuit board surrounds the base by the connecting portion. In some embodiments, the first abutting portion and the second abutting portion of the flexible circuit board are located at one of the first ends of the flexible circuit board, and the mounting portion is located at one of the flexible circuit boards opposite to the first end The second end, the mounting portion is first connected to the second mating portion and then connected to the first mating portion, and the side of the flexible circuit board is regarded as an L-shape. In some embodiments, the flexible circuit board further includes a connecting portion connecting the first butting portion and the mounting portion, the first butting portion is located at one of the first ends of the flexible circuit board, and the second butting portion is located at the flexible portion The mounting portion is located between the first mating portion and the second mating portion with respect to the second end of the first end, and the flexible circuit board surrounds the base by the connecting portion. In some embodiments, the flexible circuit board further includes two light pipes for guiding light emitted by one of the light emitting diode elements mounted on the flexible circuit board, and the cover body further includes two light guiding holes. The two light pipes are exposed through the two light guiding holes. In an embodiment of the present disclosure, the terminals of the connectors of the electrical connection device are not directly connected to the substrate, and the terminals are the opposite portions through the flexible circuit board, and the conductive Traces and the mounting portions are coupled to the substrate. Compared with the conventional use of the grounding terminal to reduce the crosstalk between the signal terminals, in this embodiment, the grounding layer in the flexible circuit board can provide a better ground reference and shielding to absorb the conductive traces in a wider range. Interference such as electromagnetic waves emitted when the signal is transmitted can preferably reduce crosstalk between the conductive traces. Moreover, the effect of using the flexible circuit board to reduce crosstalk is not affected by the number of stacks of such connectors, so the design of the electrical connection device can be more flexible, for example, can be further expanded to include more connectors. In an embodiment of the present disclosure, the flexible circuit board of the electrical connection device is connected to the substrate by the solder balls. Compared with the method of directly connecting to the circuit board by using the terminal, the solder balls in this embodiment can provide better coplanarity when connected to the substrate by, for example, surface adhesion technology, so that the solder balls can be sure Ground to the correct position on the substrate. In an embodiment of the present disclosure, the base, the cover, and the substrate of the electrical connection device are secured by the fixing member to strengthen the combination. The technical features and advantages of the present disclosure are summarized broadly, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those of ordinary skill in the art that the present invention may be practiced otherwise. It is to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure as defined by the appended claims.
以下揭示內容提供許多不同的實施例或範例,用於實施本申請案的不同特徵。元件與配置的特定範例的描述如下,以簡化本申請案的揭示內容。當然,這些僅為範例,並非用於限制本申請案。例如,以下描述在第二特徵上或上方形成第一特徵可包含形成直接接觸的第一與第二特徵的實施例,亦可包含在該第一與第二特徵之間形成其他特徵的實施例,因而該第一與第二特徵並非直接接觸。此外,本申請案可在不同範例中重複元件符號與/或字母。此重複係為了簡化與清楚的目的,而非支配不同實施例與/或所討論架構之間的關係。 再者,本申請案可使用空間對應語詞,例如「之下」、「低於」、「較低」、「高於」、「較高」等類似語詞的簡單說明,以描述圖式中一元件或特徵與另一元件或特徵的關係。空間對應語詞係用以包含除了圖式中描述的位向之外,裝置於使用或操作中的不同位向。裝置或可被定位(旋轉90度或是其他位向),並且可相應解釋本申請案使用的空間對應描述。可理解當一特徵係形成於另一特徵或基板上方時,可有其他特徵存在於其間。 圖1係本揭露之一實施例之一電連接裝置100之組合立體示意圖。圖2係圖1之電連接裝置100之分解立體示意圖。圖3係圖1之電連接裝置100之另一視角的分解立體示意圖。圖4係圖1之電連接裝置100之部分分解立體示意圖,其中電連接裝置100的一基板800將省略在本圖中。圖5係圖1之電連接裝置100之另一視角的部分分解立體示意圖,其中電連接裝置100的基板800將省略在本圖中。圖6係圖1之電連接裝置之部分分解立體示意圖,其中電連接裝置100的基板800及一蓋體600將省略在本圖中。圖7係圖1之電連接裝置之另一視角的部分分解立體示意圖,其中電連接裝置100的基板800及蓋體600將省略在本圖中。 參照圖1至圖7,電連接裝置100包括一基座200、一柔性電路板300、一第一連接器400、一第二連接器500、一蓋體600、兩固定件700以及一基板800。兩固定件700經配置以固定基座200、蓋體600以及基板800之組合,其將詳細描述於下方。 基座200包括一基座本體220以及一支撐部240。基座本體220與支撐部240結合。 支撐部240包括一第一支撐部244以及一第二支撐部242。第一支撐部244沿一第一方向D1與基座本體220結合,第二支撐部242沿垂直於第一方向D1之一第二方向D2與基座本體220結合。 基座本體220包括沿一第三方向D3排列且於第一方向D1上延伸的兩第一凸柱222以及沿一第三方向D3排列且於第二方向D2上延伸的兩第二凸柱224。在一實施例中,第三方向D3垂直於第一方向D1以及第二方向D2。第一支撐部244包括沿第三方向D3設置之兩第一穿孔2442,第二支撐部242包括沿第三方向D3設置的兩第二穿孔2422。基座本體220與第一支撐部244之結合是藉由第一凸柱222穿過第一穿孔2442而定位固定,基座本體220與第二支撐部242之結合是藉由第二凸柱224穿過第二穿孔2422而定位固定。 在本實施例中,基座本體220、第一支撐部244、第二支撐部242為互相獨立,因此可各別包含不同材料,例如基座本體220包含塑化材料,而第一支撐部244或第二支撐部242包含金屬材料。在一些實施例中,第一支撐部244、第二支撐部242可為一體。在其他實施例中,基座200之基座本體220以及支撐部240也可為一體成形(如圖9、圖10所示)。 柔性電路板300可為一片狀或薄板狀。柔性電路板300包括一第一對接部310、一第二對接部330、一連接部350以及一安裝部320。連接部350連接第一對接部310與安裝部320。第一對接部310包括一第一對接面312,第二對接部330包括一第二對接面332,在本實施例中,第一對接部310與第二對接部330沿第二方向D2排列,第一對接面312與第二對接面332位於同一平面且亦沿第二方向D2排列。第一對接面312上配置有複數個第一焊墊314,第二對接面332上配置有複數個第二焊墊334。連接部350經配置以連接第一對接部310及安裝部320。安裝部320包括一安裝面322,安裝面322上配置有複數個第一錫球324以及第二錫球326。導電跡線的配置將詳細圖式說明於圖13。 在本實施例中,柔性電路板300與基座200之組合為藉由將柔性電路板300圍繞包覆於基座200,其中柔性電路板300之第一對接部310與第二對接部330沿第一方向D1與基座200之支撐部240之第一支撐部244相結合並被第一支撐部244所支撐;而柔性電路板300之安裝部320沿第二方向D2與基座200之支撐部240之第二支撐部242相結合並被第二支撐部242所支撐。安裝部320更包括位於第三方向D3上的兩第三穿孔3202,安裝部320與第二支撐部242結合時,基座200之基座本體220之第二凸柱224穿過第三穿孔3202以協助定位固定。 雖然柔性電路板300本身較柔軟,但藉由支撐部240之支撐,使柔性電路板300之第一對接部310、第二對接部330以及安裝部320等在後續與第一連接器400、第二連接器500以及基板800等結合時,能保持平整而不會變形,避免藉由例如表面黏著技術等結合時產生空焊等結合不良的情形。 第一連接器400沿第一方向D1與柔性電路板300之第一對接部310相結合。第一連接器400包括一第一絕緣殼420以及複數個第一端子440固設於第一絕緣殼420。各第一端子440包括一第一插接部442以及一第一焊接部444。電連接裝置100藉由第一插接部442連接外部電路端(未圖示),第一焊接部444是藉由例如表面黏著等技術連接到柔性電路板300之第一對接部310之第一對接面312之第一焊墊314。此外,第一連接器400更包括沿第三方向D3排列之兩第一定位柱405以及沿第三方向D3排列之兩第一固定件407,第一對接面312更包括沿第三方向D3排列之兩第一定位孔3105以及沿第三方向D3排列之兩第一固定墊3107,第一支撐部244更包括沿第三方向D3排列之兩第三定位孔2051,當第一連接器400與第一對接部310結合時,兩第一定位柱405分別穿過第一對接面312之兩第一定位孔3105以及第一支撐部244之兩第三定位孔2051以定位,而兩第一固定件407藉由表面黏著等技術連接到兩第一固定墊3107,藉此達成第一連接器400與第一對接部310、第一支撐部244之結合。 第二連接器500沿第一方向D1與柔性電路板300之第二對接部330相結合。第二連接器500包括一第二絕緣殼520,以及複數個第二端子540固設於第二絕緣殼520。各第二端子540包括一第二插接部542以及一第二焊接部544。電連接裝置100藉由第二插接部542以連接外部電路端(未圖示),第二焊接部544是藉由例如表面黏著等技術連接到柔性電路板300之第二對接部330之第二對接面332之第二焊墊334。此外,第二連接器500更包括沿第三方向D3排列之兩第二定位柱505以及沿第三方向D3排列之兩第二固定件507,第二對接面332更包括沿第三方向D3排列之兩第二定位孔3305以及沿第三方向D3排列之兩第二固定墊3307,第一支撐部244更包括沿第三方向D3排列之兩第四定位孔2052,當第二連接器500與第二對接部330結合時,兩第二定位柱505分別穿過第二對接面332之兩第二定位孔3305以及第二支撐部244之兩第四定位孔2052以定位,而兩第二固定件507藉由表面黏著等技術連接到兩第二固定墊3307,藉此達成第二連接器500與第二對接部330、第一支撐部244之結合。在一實施例中,第一連接器400或第二連接器500可為SAS連接器或高頻連接器。 蓋體600沿第一方向D1與基座200相結合。蓋體600界定有一第一開口610以及一第二開口620,蓋體600包括位於第三方向D3上之兩扣合部630,兩扣合部630各自界定有一扣合開口632。基座200更包括位於第三方向D3上之兩凸塊230。當蓋體600與基座200相結合時,是藉由扣合開口632與凸塊230之扣合而結合。第一開口610與第二開口620各自暴露第一連接器400之第一插接部442與第二連接器500之第二插接部542。在其他實施例中,蓋體600包括一個開口,並可只利用該一個開口暴露多個連接器之插接部,例如,一個開口可同時暴露第一插接部442與第二插接部542。 蓋體600可加強電連接裝置100之機械強度,並且保護第一連接器400之第一焊接部444、第二連接器500之第二焊接部544、以及柔性電路板300之第一焊墊314與第二焊墊334等結構。蓋體600亦可防止第一連接器400與第二連接器500脫離柔性電路板300的情形,其機制如下:蓋體600包括一按壓面670(如圖5所示),第一連接器400包括沿第三方向D3排列之兩肩部470(如圖4所示),第二連接器500包括沿第三方向D3排列之兩肩部570,當蓋體600與基座200結合時,按壓面670會按壓肩部470與肩部570,藉此防止第一連接器400與第二連接器500脫離柔性電路板300的情形。 基板800沿第三方向D3與基座200、柔性電路板300、第一連接器400、第二連接器500以及蓋體600之組合相結合。基板800具有複數個第三焊墊810與複數個第四焊墊820,分別藉由例如表面黏著等技術與柔性電路板300之安裝部320之複數個第一錫球324與複數個第二錫球326相連接。由於第一錫球324透過柔性電路板300之第一導電跡線380(參見圖13)、第一焊墊314、以及第一連接器400之第一焊接部444連接至第一連接器400之第一插接部442,基板800之第三焊墊810亦連接至第一連接器400之第一插接部442,並藉由第一插接部442連接至外部電路。同樣地,由於第二錫球326透過柔性電路板300之第二導電跡線390(參見圖13)、第二焊墊334、以及第二連接器500之第二焊接部544連接至第二連接器500之第二插接部542,基板800之第四焊墊820亦連接至第二連接器500之第二插接部542,並藉由第二插接部542連接至外部電路。 基板800更包括位於第三方向D3上之兩第四穿孔824,其被基座200之兩第二凸柱224穿過而加強定位與固定。此外,柔性電路板300之安裝部320之第三穿孔3202之設計可比第二凸柱224大,使得第二凸柱224穿過第三穿孔3202時,安裝部320尚有移動的空間。此設計可使安裝部320之複數個第一錫球324與第二錫球326在跟基板800之複數個第三焊墊810與第四焊墊820透過表面黏著等技術焊接時,能有空間進行自動校準(self alignment),使安裝部320與基板800能更精確地組合。在一些實施例中,基板800可為硬性電路板。 兩固定件700位於第三方向D3上,用以固定基座200、蓋體600以及基板800之組合。各固定件700包括兩端部710。基座200更包括位於第三方向D3上之兩第一插孔250。蓋體600更包括位於第三方向D3上之兩第二插孔650。基板800在第三方向D3上之兩端各更包括兩第三插孔850。各固定件700之兩端部710分別穿過第一插孔250與第二插孔650,再分別插入且固定於兩第三插孔850,藉此加強蓋體600與基座200結合的強度,並將蓋體600與基座200一起安裝固定到基板800上。在其他實施例中,各固定件700之兩端部710插入第三插孔850後可再藉由焊接等技術加強固定。 圖8A、8B、8C係本揭露之不同實施例之電連接裝置之連接器與柔性電路板之組合的側視圖。參照圖8A,其所示之柔性電路板300為圖1至圖7之實施例之柔性電路板300。詳細來說,第一對接部310與第二對接部330皆位於柔性電路板300之一第一端351,安裝部320位於柔性電路板300之相對於第一端351之一第二端352,連接部350連接第一對接部310與安裝部320且用以圍繞包覆基座200(參照圖1至圖7)。參照圖8B,其顯示在另一實施例之柔性電路板300A中,第一對接部310與第二對接部330皆位於柔性電路板300之一第一端351,安裝部320位於柔性電路板300之相對於第一端351之一第二端352。在本實施例中,柔性電路板300不包括圖8A顯示的圍繞包覆基座200之連接部350,安裝部320則是先連接到第二對接部330再連接到第一對接部310,且該柔性電路板300A之側視為一L型。參照圖8C,其顯示在另一實施例之柔性電路板300B中,第一對接部310位於柔性電路板300B之第一端351,第二對接部330位於柔性電路板300B之第二端352,安裝部320則配置於第一對接部310與第二對接部330之間,並具有用以圍繞包覆基座200且連接第一對接部310與安裝部320之連接部350。 相較於柔性電路板300A或柔性電路板300B,柔性電路板300由於不具備直接連接第二對接部330與安裝部320之L型構造,其在第二方向D2上之高度可較低,具備整體結構可較小之優點。 另,在柔性電路板300B之設計中,第一對接部310至安裝部320的佈線與第二對接部330至安裝部320的佈線由於是走不同方向不會重疊,因此可設計在柔性電路板300B中的同一層中,亦即,連接第一連接器400之訊號至安裝部320之第一導電跡線與連接第二連接器500之訊號至安裝部320之第二導電跡線可配置於柔性電路板300B中的同一層。相較之下,柔性電路板300或柔性電路板300A中,由於第一對接部310至安裝部320的佈線與第二對接部330至安裝部320的佈線會重疊,因此需要比柔性電路板300B多一層的電路板。 圖11係本揭露之一實施例之電連接裝置100之部分立體示意圖。圖12係圖11之電連接裝置100之部分分解立體示意圖。參照圖11及圖12,此實施例之電連接裝置100中,柔性電路板300更包括兩導光管900,用以導引並集中安裝於柔性電路板300上之發光二極體元件(未圖示)所發出的代表訊號傳輸狀態的光,蓋體600更包括兩導光孔901,當蓋體600與柔性電路板300、基座200等組合時,兩導光管900將穿過兩導光孔901而外露,進而可觀察兩導光管900的發光狀態以偵測電連接器是否在工作中。 圖13係本揭露之一實施例之柔性電路板300展開狀態之俯視示意圖。參照圖13,複數個第一焊墊314與複數個第一錫球324是藉由複數個第一導電跡線380相連接,複數個第二焊墊334與複數個第二錫球326是藉由複數個第二導電跡線390相連接。更具體來說,各第一導電跡線380具有一第一線本體3801、一第一表面焊接端3802以及一第一轉接焊接端3803。第一線本體3801配置於柔性電路板300中,第一表面焊接端3802連接第一焊墊314,第一轉接焊接端3803連接第一錫球324,藉此達成各第一焊墊314與各第一錫球324之連接。同樣地,各第二導電跡線390具有一第二線本體3901、一第二表面焊接端3902以及一第二轉接焊接端3903。第二線本體3901配置於柔性電路板300中,第二表面焊接端3902連接第二焊墊334,第二轉接焊接端3903連接第二錫球326,藉此達成各第二焊墊334與各第二錫球326之連接。請注意,本實施例之圖示中,第一焊墊314、第二焊墊334、第一錫球324以及第二錫球326所標號之數量及位置僅為示例,其相對的連接關係可跟據實際需求配置,本揭露並不限於此,例如在其他實施例中,第一焊墊314也可能連接至本實施例中標示324之錫球。 在本揭露之一實施例中,電連接裝置100之第一連接器400之第一端子440與第二連接器500之第二端子540並無直接與基板800相連接,而是藉由柔性電路板300之第一對接部310、第二對接部330、第一與第二導電跡線以及安裝部與基板800相連接。相較於傳統利用接地端子以降低訊號端子間串擾的作法,在本揭露的該實施例中,由於柔性電路板300中固有接地層可提供較好的接地參考以及屏蔽,以更大範圍地吸收第一與第二導電跡線傳輸訊號時所發出的例如電磁波等干擾,因此可較佳地降低第一與第二導電跡線之間的串擾。此外,利用柔性電路板300以降低串擾的效果不受連接器的堆疊數目影響,因此電連接裝置100之設計可更有彈性,例如可進一步擴充以包含更多連接器。 在本揭露之一實施例中,電連接裝置100之柔性電路板300是藉由複數個第一錫球324以及第二錫球326與基板800做連接。相較於傳統利用端子直接與電路板連接的做法,該實施例中複數個第一錫球324以及第二錫球326可在藉由例如表面黏著技術與基板800連接時提供較好的共面性,使複數個第一錫球324以及第二錫球326能確實地安裝到基板800上之正確位置。 在本揭露之一實施例中,電連接裝置100之基座200、蓋體600以及基板800是藉由固定件700以強化該組合之固定。 前述內容概述一些實施方式的特徵,因而熟知此技藝的人士可更加理解本申請案揭示內容的各方面。熟知此技藝的人士應理解可輕易使用本申請案揭示內容作為基礎,經配置設計或修飾其他製程與結構而實現與本申請案所述的實施方式具有相同目的與/或達到相同優點。熟知此技藝的人士亦應理解此均等架構並不脫離本申請案揭示內容的精神與範圍,以及熟知此技藝的人士可進行各種變化、取代與替換,而不脫離本申請案揭示內容的精神與範圍。The following disclosure provides many different embodiments or examples for implementing different features of the present application. The specific examples of components and configurations are described below to simplify the disclosure of the present application. Of course, these are merely examples and are not intended to limit the application. For example, the following description describes an embodiment in which forming a first feature on or over a second feature can include forming first and second features of direct contact, and can also include embodiments for forming other features between the first and second features Thus, the first and second features are not in direct contact. Furthermore, the application may repeat the component symbols and/or letters in different examples. This repetition is for the purpose of simplicity and clarity, and is not intended to govern the relationship between the various embodiments and/or the structures discussed. Furthermore, this application may use spatially equivalent words, such as "lower", "lower", "lower", "higher", "higher" and the like, to describe one of the patterns. The relationship of an element or feature to another element or feature. Spatially corresponding words are used to encompass different orientations of the device in use or operation in addition to the orientations depicted in the drawings. The device may be positioned (rotated 90 degrees or other orientations) and the spatially corresponding description used in this application may be interpreted accordingly. It will be appreciated that when a feature is formed over another feature or substrate, other features may be present therebetween. 1 is a perspective view showing the combination of an electrical connection device 100 according to an embodiment of the present disclosure. 2 is an exploded perspective view of the electrical connection device 100 of FIG. 1. 3 is an exploded perspective view of another perspective view of the electrical connection device 100 of FIG. 1. 4 is a partially exploded perspective view of the electrical connection device 100 of FIG. 1, in which a substrate 800 of the electrical connection device 100 will be omitted from the figure. 5 is a partially exploded perspective view of another perspective view of the electrical connection device 100 of FIG. 1, in which the substrate 800 of the electrical connection device 100 will be omitted in the figure. 6 is a partially exploded perspective view of the electrical connection device of FIG. 1, wherein the substrate 800 and a cover 600 of the electrical connection device 100 will be omitted from the figure. FIG. 7 is a partially exploded perspective view showing another perspective of the electrical connection device of FIG. 1, wherein the substrate 800 and the cover 600 of the electrical connection device 100 will be omitted in the figure. Referring to FIG. 1 to FIG. 7 , the electrical connection device 100 includes a base 200 , a flexible circuit board 300 , a first connector 400 , a second connector 500 , a cover 600 , two fixing members 700 , and a substrate 800 . . The two fasteners 700 are configured to secure the combination of the base 200, the cover 600, and the substrate 800, which will be described in detail below. The base 200 includes a base body 220 and a support portion 240. The base body 220 is coupled to the support portion 240. The support portion 240 includes a first support portion 244 and a second support portion 242. The first support portion 244 is coupled to the base body 220 in a first direction D1, and the second support portion 242 is coupled to the base body 220 in a second direction D2 perpendicular to the first direction D1. The base body 220 includes two first protrusions 222 arranged along a third direction D3 and extending in the first direction D1, and two second protrusions 224 arranged along a third direction D3 and extending in the second direction D2. . In an embodiment, the third direction D3 is perpendicular to the first direction D1 and the second direction D2. The first support portion 244 includes two first through holes 2442 disposed along the third direction D3, and the second support portion 242 includes two second through holes 2422 disposed along the third direction D3. The combination of the base body 220 and the first support portion 244 is fixed by the first protrusion 222 passing through the first through hole 2442. The combination of the base body 220 and the second support portion 242 is by the second protrusion 224. Positioning is fixed through the second perforation 2422. In this embodiment, the base body 220, the first support portion 244, and the second support portion 242 are independent of each other, and thus may each comprise different materials. For example, the base body 220 includes a plasticized material, and the first support portion 244 Or the second support portion 242 contains a metal material. In some embodiments, the first support portion 244 and the second support portion 242 can be integrated. In other embodiments, the base body 220 of the base 200 and the support portion 240 may also be integrally formed (as shown in FIGS. 9 and 10). The flexible circuit board 300 may be in the form of a sheet or a thin plate. The flexible circuit board 300 includes a first butting portion 310 , a second mating portion 330 , a connecting portion 350 , and a mounting portion 320 . The connecting portion 350 connects the first butting portion 310 and the mounting portion 320. The first abutting portion 310 includes a first abutting surface 312, and the second abutting portion 330 includes a second abutting surface 332. In the embodiment, the first butting portion 310 and the second butting portion 330 are arranged along the second direction D2. The first mating surface 312 and the second mating surface 332 are in the same plane and are also arranged in the second direction D2. A plurality of first pads 314 are disposed on the first mating surface 312, and a plurality of second pads 334 are disposed on the second mating surface 332. The connecting portion 350 is configured to connect the first docking portion 310 and the mounting portion 320. The mounting portion 320 includes a mounting surface 322 on which a plurality of first solder balls 324 and a second solder ball 326 are disposed. The configuration of the conductive traces will be illustrated in detail in Figure 13. In this embodiment, the combination of the flexible circuit board 300 and the susceptor 200 is formed by wrapping the flexible circuit board 300 around the susceptor 200, wherein the first abutting portion 310 and the second abutting portion 330 of the flexible circuit board 300 are along The first direction D1 is combined with the first support portion 244 of the support portion 240 of the base 200 and supported by the first support portion 244; and the mounting portion 320 of the flexible circuit board 300 is supported by the base 200 along the second direction D2. The second support portion 242 of the portion 240 is combined and supported by the second support portion 242. The mounting portion 320 further includes two third through holes 3202 in the third direction D3. When the mounting portion 320 is combined with the second supporting portion 242, the second protrusion 224 of the base body 220 of the base 200 passes through the third through hole 3202. To assist in positioning and fixing. Although the flexible circuit board 300 itself is relatively soft, the first butting portion 310, the second butting portion 330, and the mounting portion 320 of the flexible circuit board 300 are subsequently connected to the first connector 400 by the support of the support portion 240. When the two connectors 500 and the substrate 800 are combined, they can be kept flat without being deformed, and it is possible to avoid a problem of poor bonding such as air welding when combined by a surface adhesion technique or the like. The first connector 400 is coupled to the first butt portion 310 of the flexible circuit board 300 in the first direction D1. The first connector 400 includes a first insulating case 420 and a plurality of first terminals 440 fixed to the first insulating case 420. Each of the first terminals 440 includes a first plug portion 442 and a first solder portion 444. The electrical connection device 100 is connected to an external circuit end (not shown) by a first plug portion 442. The first solder portion 444 is first connected to the first butt portion 310 of the flexible circuit board 300 by a technique such as surface adhesion. The first pad 314 of the abutting surface 312. In addition, the first connector 400 further includes two first positioning posts 405 arranged along the third direction D3 and two first fixing members 407 arranged along the third direction D3. The first docking faces 312 further include the third direction D3. The two first positioning holes 3105 and the two first fixing pads 3107 arranged along the third direction D3, the first supporting portion 244 further includes two third positioning holes 2051 arranged along the third direction D3, when the first connector 400 and When the first abutting portion 310 is coupled, the two first positioning posts 405 respectively pass through the two first positioning holes 3105 of the first abutting surface 312 and the two third positioning holes 2051 of the first supporting portion 244 to be positioned, and the two first fixings are fixed. The member 407 is coupled to the two first fixing pads 3107 by surface adhesion or the like, thereby achieving the combination of the first connector 400 with the first butting portion 310 and the first supporting portion 244. The second connector 500 is coupled to the second butt portion 330 of the flexible circuit board 300 in the first direction D1. The second connector 500 includes a second insulative housing 520 and a plurality of second terminals 540 are fixed to the second insulative housing 520. Each of the second terminals 540 includes a second insertion portion 542 and a second solder portion 544. The electrical connection device 100 is connected to an external circuit end (not shown) by a second plug portion 542, and the second solder portion 544 is connected to the second butt portion 330 of the flexible circuit board 300 by a technique such as surface adhesion. The second pad 334 of the two abutting faces 332. In addition, the second connector 500 further includes two second positioning posts 505 arranged along the third direction D3 and two second fixing members 507 arranged along the third direction D3. The second abutting faces 332 further include the third direction D3. The two second positioning holes 3305 and the two second fixing pads 3307 arranged along the third direction D3, the first supporting portion 244 further includes two fourth positioning holes 2052 arranged along the third direction D3, when the second connector 500 is When the second abutting portion 330 is coupled, the two second positioning posts 505 respectively pass through the two second positioning holes 3305 of the second abutting surface 332 and the two fourth positioning holes 2052 of the second supporting portion 244 for positioning, and the two second fixings are respectively fixed. The member 507 is connected to the two second fixing pads 3307 by a surface adhesion technique or the like, thereby achieving the combination of the second connector 500 and the second butting portion 330 and the first supporting portion 244. In an embodiment, the first connector 400 or the second connector 500 can be a SAS connector or a high frequency connector. The cover 600 is coupled to the base 200 in the first direction D1. The cover body 600 defines a first opening 610 and a second opening 620. The cover body 600 includes two fastening portions 630 in the third direction D3. The two fastening portions 630 each define a fastening opening 632. The susceptor 200 further includes two bumps 230 located in the third direction D3. When the cover 600 is combined with the base 200, it is coupled by the fastening of the fastening opening 632 and the protrusion 230. The first opening 610 and the second opening 620 respectively expose the first plug portion 442 of the first connector 400 and the second plug portion 542 of the second connector 500. In other embodiments, the cover 600 includes an opening, and the connector of the plurality of connectors can be exposed only by the one opening. For example, one opening can simultaneously expose the first insertion portion 442 and the second insertion portion 542. . The cover 600 can strengthen the mechanical strength of the electrical connection device 100 and protect the first solder portion 444 of the first connector 400, the second solder portion 544 of the second connector 500, and the first pad 314 of the flexible circuit board 300. And the second pad 334 and the like. The cover 600 can also prevent the first connector 400 and the second connector 500 from being detached from the flexible circuit board 300. The mechanism is as follows: the cover 600 includes a pressing surface 670 (shown in FIG. 5), and the first connector 400 The two shoulders 470 are arranged along the third direction D3 (as shown in FIG. 4), and the second connector 500 includes two shoulders 570 arranged along the third direction D3. When the cover 600 is combined with the base 200, the pressing is performed. The face 670 will press the shoulder 470 and the shoulder 570, thereby preventing the first connector 400 from disengaging the flexible connector board 300 from the second connector 500. The substrate 800 is combined with the combination of the susceptor 200, the flexible circuit board 300, the first connector 400, the second connector 500, and the cover 600 in the third direction D3. The substrate 800 has a plurality of third pads 810 and a plurality of fourth pads 820 respectively, and a plurality of first solder balls 324 and a plurality of second tins respectively mounted on the mounting portion 320 of the flexible circuit board 300 by a technique such as surface adhesion. The balls 326 are connected. Since the first solder ball 324 passes through the first conductive trace 380 (see FIG. 13) of the flexible circuit board 300, the first pad 314, and the first soldering portion 444 of the first connector 400 are connected to the first connector 400. The first plug portion 442, the third pad 810 of the substrate 800 is also connected to the first plug portion 442 of the first connector 400, and is connected to the external circuit by the first plug portion 442. Similarly, since the second solder ball 326 passes through the second conductive trace 390 of the flexible circuit board 300 (see FIG. 13), the second pad 334, and the second solder portion 544 of the second connector 500 are connected to the second connection. The second plug portion 542 of the substrate 500 is also connected to the second plug portion 542 of the second connector 500, and is connected to the external circuit by the second plug portion 542. The substrate 800 further includes two fourth through holes 824 located in the third direction D3, which are penetrated by the two second protrusions 224 of the base 200 to enhance positioning and fixing. In addition, the design of the third through hole 3202 of the mounting portion 320 of the flexible circuit board 300 may be larger than the second protrusion 224, so that when the second protrusion 224 passes through the third through hole 3202, the mounting portion 320 still has a moving space. This design allows the plurality of first solder balls 324 and the second solder balls 326 of the mounting portion 320 to have space when soldering through the surface of the plurality of third pads 810 and the fourth pads 820 of the substrate 800. Self alignment is performed to enable the mounting portion 320 and the substrate 800 to be combined more accurately. In some embodiments, substrate 800 can be a rigid circuit board. The two fixing members 700 are located in the third direction D3 for fixing the combination of the base 200, the cover 600 and the substrate 800. Each of the fixing members 700 includes both end portions 710. The susceptor 200 further includes two first insertion holes 250 in the third direction D3. The cover 600 further includes two second insertion holes 650 located in the third direction D3. The substrate 800 further includes two third insertion holes 850 at both ends of the third direction D3. The two ends 710 of each fixing member 700 pass through the first insertion hole 250 and the second insertion hole 650 respectively, and are respectively inserted and fixed to the two third insertion holes 850, thereby reinforcing the strength of the combination of the cover 600 and the base 200. And the cover 600 is mounted and fixed to the substrate 800 together with the base 200. In other embodiments, the two ends 710 of each fixing member 700 are inserted into the third insertion hole 850 and can be further fixed by welding or the like. 8A, 8B, and 8C are side views of a combination of a connector and a flexible circuit board of an electrical connection device of different embodiments of the present disclosure. Referring to FIG. 8A, the flexible circuit board 300 shown therein is the flexible circuit board 300 of the embodiment of FIGS. 1 through 7. In detail, the first abutting portion 310 and the second abutting portion 330 are both located at a first end 351 of the flexible circuit board 300 , and the mounting portion 320 is located at a second end 352 of the flexible circuit board 300 opposite to the first end 351 . The connecting portion 350 connects the first butting portion 310 and the mounting portion 320 and surrounds the covering base 200 (refer to FIGS. 1 to 7). Referring to FIG. 8B , in the flexible circuit board 300A of another embodiment, the first butt joint 310 and the second butt joint 330 are located at one of the first ends 351 of the flexible circuit board 300 , and the mounting portion 320 is located on the flexible circuit board 300 . The second end 352 is opposite to the first end 351. In the present embodiment, the flexible circuit board 300 does not include the connecting portion 350 surrounding the covering base 200 shown in FIG. 8A, and the mounting portion 320 is first connected to the second butting portion 330 and then connected to the first butting portion 310, and The side of the flexible circuit board 300A is regarded as an L-shape. Referring to FIG. 8C, in another embodiment of the flexible circuit board 300B, the first butting portion 310 is located at the first end 351 of the flexible circuit board 300B, and the second butting portion 330 is located at the second end 352 of the flexible circuit board 300B. The mounting portion 320 is disposed between the first mating portion 310 and the second mating portion 330 and has a connecting portion 350 for surrounding the covering base 200 and connecting the first mating portion 310 and the mounting portion 320. Compared with the flexible circuit board 300A or the flexible circuit board 300B, the flexible circuit board 300 has a lower height in the second direction D2 because it does not have an L-shaped configuration in which the second butting portion 330 and the mounting portion 320 are directly connected. The overall structure can have smaller advantages. In addition, in the design of the flexible circuit board 300B, the wiring of the first abutting portion 310 to the mounting portion 320 and the wiring of the second abutting portion 330 to the mounting portion 320 do not overlap because they are in different directions, and thus can be designed on the flexible circuit board. In the same layer of the 300B, that is, the signal connecting the first connector 400 to the first conductive trace of the mounting portion 320 and the signal connecting the second connector 500 to the second conductive trace of the mounting portion 320 can be configured. The same layer in the flexible circuit board 300B. In the flexible circuit board 300 or the flexible circuit board 300A, since the wiring of the first butting portion 310 to the mounting portion 320 and the wiring of the second butting portion 330 to the mounting portion 320 overlap, it is required to be more than the flexible circuit board 300B. One more layer of board. 11 is a partial perspective view of an electrical connection device 100 in accordance with an embodiment of the present disclosure. 12 is a partially exploded perspective view of the electrical connection device 100 of FIG. Referring to FIG. 11 and FIG. 12, in the electrical connection device 100 of this embodiment, the flexible circuit board 300 further includes two light pipes 900 for guiding and centrally mounting the LED components on the flexible circuit board 300 (not The cover 600 further includes two light guiding holes 901. When the cover 600 is combined with the flexible circuit board 300, the base 200, etc., the two light pipes 900 will pass through the two. The light guiding hole 901 is exposed, and the light emitting state of the two light pipes 900 can be observed to detect whether the electrical connector is in operation. FIG. 13 is a top plan view showing the unfolded state of the flexible circuit board 300 according to an embodiment of the present disclosure. Referring to FIG. 13, a plurality of first pads 314 and a plurality of first solder balls 324 are connected by a plurality of first conductive traces 380, and a plurality of second pads 334 and a plurality of second solder balls 326 are borrowed. A plurality of second conductive traces 390 are connected. More specifically, each of the first conductive traces 380 has a first wire body 3801, a first surface soldering end 3802, and a first adapter soldering end 3803. The first wire body 3801 is disposed in the flexible circuit board 300. The first surface soldering end 3802 is connected to the first solder pad 314, and the first soldering soldering end 3803 is connected to the first solder ball 324, thereby achieving the first solder pads 314 and The connection of each of the first solder balls 324. Similarly, each of the second conductive traces 390 has a second wire body 3901, a second surface soldering end 3902, and a second adapter soldering end 3903. The second wire body 3901 is disposed in the flexible circuit board 300, the second surface soldering end 3902 is connected to the second solder pad 334, and the second soldering soldering end 3903 is connected to the second solder ball 326, thereby achieving the second solder pads 334 and The connection of each of the second solder balls 326. Please note that in the illustration of the embodiment, the number and position of the first pad 314, the second pad 334, the first solder ball 324, and the second solder ball 326 are only examples, and the relative connection relationship may be The present disclosure is not limited thereto, and for example, in other embodiments, the first pad 314 may also be connected to the solder ball of the numeral 324 in this embodiment. In one embodiment of the present disclosure, the first terminal 440 of the first connector 400 of the electrical connection device 100 and the second terminal 540 of the second connector 500 are not directly connected to the substrate 800, but by a flexible circuit. The first butt portion 310, the second butt portion 330, the first and second conductive traces, and the mounting portion of the board 300 are coupled to the substrate 800. Compared with the conventional use of the grounding terminal to reduce the crosstalk between the signal terminals, in the embodiment of the present disclosure, since the inherent ground layer in the flexible circuit board 300 can provide a better ground reference and shielding, it can be absorbed in a wider range. The first and second conductive traces emit interference such as electromagnetic waves when the signal is transmitted, so that crosstalk between the first and second conductive traces can be preferably reduced. Moreover, the effect of using the flexible circuit board 300 to reduce crosstalk is not affected by the number of stacks of connectors, so the design of the electrical connection device 100 can be more flexible, for example, can be further expanded to include more connectors. In one embodiment of the present disclosure, the flexible circuit board 300 of the electrical connection device 100 is connected to the substrate 800 by a plurality of first solder balls 324 and second solder balls 326. The plurality of first solder balls 324 and the second solder balls 326 in this embodiment can provide better coplanarity when connected to the substrate 800 by, for example, surface adhesion techniques, as compared to conventional methods of directly connecting the terminals to the circuit board. The plurality of first solder balls 324 and the second solder balls 326 can be securely mounted to the correct position on the substrate 800. In one embodiment of the present disclosure, the base 200, the cover 600, and the substrate 800 of the electrical connection device 100 are secured by the fixture 700 to enhance the combination. The foregoing is a summary of the features of the embodiments, and those skilled in the art can understand the various aspects of the disclosure. Those skilled in the art will appreciate that the disclosure of the present application can be readily utilized as a basis for designing or modifying other processes and structures to achieve the same objectives and/or the same advantages as the embodiments described herein. It should be understood by those skilled in the art that the present invention is not limited to the spirit and scope of the present disclosure, and that various changes, substitutions and substitutions can be made by those skilled in the art without departing from the spirit of the disclosure. range.