TWI619921B - Loop heat pipe structure - Google Patents

Loop heat pipe structure Download PDF

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TWI619921B
TWI619921B TW106100953A TW106100953A TWI619921B TW I619921 B TWI619921 B TW I619921B TW 106100953 A TW106100953 A TW 106100953A TW 106100953 A TW106100953 A TW 106100953A TW I619921 B TWI619921 B TW I619921B
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working fluid
evaporation chamber
outlet
capillary structure
inlet
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TW106100953A
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TW201825849A (en
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Bor-Bin Tsai
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Asia Vital Components Co Ltd
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Abstract

一種環路熱管結構,係包含:一蒸發腔體、一管體、一冷凝單元;該蒸發腔體具有一出口及一入口與一容置空間,該容置空間內具有一毛細結構及一補償腔與至少一蒸氣通道,所述蒸氣通道一端與該出口連通;該管體具有一第一端及一第二端分別與前述蒸發腔體之該出、入口連接,該第二端與該毛細結構相鄰設置冷凝單元設於該第一、二端之間外部;透過本發明將該管體第二端設置緊鄰該毛細結構係可增加工作流體之回流效率者。 A loop heat pipe structure comprises: an evaporation chamber, a tube body and a condensing unit; the evaporation chamber has an outlet and an inlet and an accommodating space, wherein the accommodating space has a capillary structure and a compensation a cavity and at least one vapor passage, wherein one end of the vapor passage is in communication with the outlet; the tubular body has a first end and a second end respectively connected to the outlet and the inlet of the evaporation chamber, the second end and the capillary The condensing unit disposed adjacent to the structure is disposed outside the first end and the second end; and the second end of the tube body is disposed adjacent to the capillary structure to increase the return efficiency of the working fluid.

Description

環路熱管結構 Loop heat pipe structure

一種環路熱管結構,尤指一種可提升環路熱管汽液循環效率的環路熱管結構。 A loop heat pipe structure, especially a loop heat pipe structure capable of improving the vapor-liquid circulation efficiency of a loop heat pipe.

現行電子設備隨著效能提高,其中作為處理訊號及運算的電子元件相對的也較以前的電子元件產生較高的熱量,最常被使用的一般散熱元件包含熱管、散熱器、均溫板等元件,並透過直接與會發熱之電子元件接觸後進一步增加散熱效能,防止電子元件溫度過高而燒毀等情事。 With the improvement of the performance of current electronic devices, the electronic components that process signals and calculations are relatively hotter than the previous electronic components. The most commonly used heat dissipation components include heat pipes, heat sinks, temperature equalization plates, and the like. And by directly contacting the electronic components that will heat up, further increase the heat dissipation performance, and prevent the electronic components from being overheated and burned.

更進一步亦有設置具有強制散熱效果的風扇對該等散熱元件進行解熱,風扇確實具有提升散熱之效能,但在有限的空間裡並非皆可設置風扇,故空間問題亦為一需要考量之重點之一。 Furthermore, a fan with a forced heat dissipation effect is provided to dissipate the heat dissipating components, and the fan does have the effect of improving heat dissipation. However, in a limited space, not all fans can be provided, so the space problem is also a key point to consider. One.

另該項業者提供一種以熱管汽液循環概念用一蒸發腔體結合一冷凝裝置並兩者間由一管體進行連接進而組成一環路模組的環路熱管結構,其優點係自行提供一具有較佳蒸發冷凝循環效果的散熱裝置,該蒸發腔體裡設置有可供工作液體回流儲存的毛細結構,並該毛細結構設置有供蒸氣流動的複數溝槽,蒸發腔體主要係至少一面與發熱源接觸傳導熱量,並該蒸發腔體的毛細結構中的工作液體受熱蒸發後,由該等溝槽向外流動並透過連接該蒸發腔體與冷凝裝置之管體 向冷凝裝置流動擴散,最後經過冷凝裝置冷凝呈液態後回流至該蒸發腔體繼續循環。 Another manufacturer provides a loop heat pipe structure in which a vapor-liquid circulation concept is combined with a condensing device and a tube body is connected to form a loop module. The advantage is that one has its own a heat dissipating device having an effect of evaporating and condensing circulation, wherein the evaporating cavity is provided with a capillary structure for reflowing the working liquid, and the capillary structure is provided with a plurality of grooves for vapor flow, and the evaporation chamber is mainly composed of at least one side and heat The source contacts the heat transfer, and the working liquid in the capillary structure of the evaporation chamber is evaporated by the heat, flows outward from the grooves and passes through the tube connecting the evaporation chamber and the condensing device The flow is diffused to the condensing device, and finally condensed in a liquid state by the condensing device, and then returned to the evaporation chamber to continue to circulate.

目前平板式蒸發器裡面的補償腔與蒸氣芯(毛細結構含蒸汽通道)之間的相對位置有兩種,一種為上、下相疊合設置,另一種則為水平放置。 At present, there are two kinds of relative positions between the compensation chamber and the vapor core (the capillary structure containing the steam passage) in the flat evaporator, one for the upper and lower phases and the other for the horizontal placement.

習知上、下相疊的平板式蒸發器其高度、厚度大,並不適合輕薄短小及設置空間有限的地方。 It is known that the upper and lower stacked flat evaporators are large in height and thickness, and are not suitable for places where the thickness is short, and the installation space is limited.

另一習知水平設置的平板式蒸發器則需將原本相互重疊設置的補償腔與蒸氣芯改為水平並列設置,造成補償腔的工作流體距離蒸氣芯的蒸發面遠,會有工作流體補償不及造成乾燒的問題。 Another conventionally arranged flat plate evaporator requires the compensation chambers and the vapor cores which are originally arranged to overlap each other to be horizontally juxtaposed, so that the working fluid of the compensation chamber is far from the evaporation surface of the vapor core, and the working fluid is not compensated by the working fluid. Causes dry burning problems.

故如何改善上述習知環路熱管中的平板式蒸發器缺失則為首要之目標。 Therefore, how to improve the missing of the flat evaporator in the conventional loop heat pipe is the primary goal.

爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種解決水平設置的平板式蒸發器工作流體補償不及造成乾燒的環路熱管結構。 為達上述之目的,本發明係提供一種環路熱管結構,係包含:一蒸發腔體、一管體、一冷凝單元;所述蒸發腔體具有一出口及一入口與一容置空間,該容置空間內具有一毛細結構及一補償腔與至少一蒸氣通道,所述蒸氣通道一端與該出口連通;該管體具有一第一端及一第二端分別與前述蒸發腔體之該出、入口連接,該第二端與該毛細結構相鄰對應設置。 Accordingly, in order to solve the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a loop heat pipe structure that solves the problem that the working fluid compensation of the flat plate evaporator is less than that caused by dry burning. In order to achieve the above object, the present invention provides a loop heat pipe structure, comprising: an evaporation chamber, a tube body, and a condensation unit; the evaporation chamber has an outlet and an inlet and an accommodation space, The accommodating space has a capillary structure and a compensation cavity and at least one vapor passage, and one end of the vapor passage communicates with the outlet; the tubular body has a first end and a second end respectively corresponding to the evaporation chamber And an inlet connection, wherein the second end is disposed adjacent to the capillary structure.

所述冷凝單元具有複數散熱鰭片設於該管體之第一、二端之外部。 The condensing unit has a plurality of heat dissipating fins disposed outside the first and second ends of the tube body.

透過將所述蒸發腔體之該入口或管體之一端與該毛細結構鄰近設置,係可加速該冷凝後之工作流體回流之效率,該善習知蒸發腔體中工作流體補償不及,造成乾燒的問題。 By arranging one end of the inlet or the tube body of the evaporation chamber adjacent to the capillary structure, the efficiency of the backflow of the condensed working fluid can be accelerated, and the working fluid in the evaporation chamber can not be compensated for, so that the dry The problem of burning.

1‧‧‧環路熱管結構 1‧‧‧Circular heat pipe structure

11‧‧‧蒸發腔體 11‧‧‧Evaporation chamber

111‧‧‧出口 111‧‧‧Export

112‧‧‧入口 112‧‧‧ entrance

113‧‧‧容置空間 113‧‧‧ accommodating space

114‧‧‧毛細結構 114‧‧‧Capillary structure

1141‧‧‧蒸氣通道 1141‧‧‧Vapor channel

115‧‧‧補償腔 115‧‧‧Compensation chamber

116‧‧‧液體通道 116‧‧‧Liquid channel

12‧‧‧管體 12‧‧‧ tube body

121‧‧‧第一端 121‧‧‧ first end

122‧‧‧第二端 122‧‧‧ second end

2‧‧‧工作流體 2‧‧‧Working fluid

21‧‧‧汽態之工作流體 21‧‧‧Vaporous working fluid

22‧‧‧液態之工作流體 22‧‧‧Liquid working fluid

3‧‧‧熱源 3‧‧‧heat source

13‧‧‧冷凝單元 13‧‧‧Condensation unit

131‧‧‧散熱鰭片 131‧‧‧heat fins

第1圖係為本發明環路熱管結構之第一實施例立體分解圖;第2圖係為本發明環路熱管結構之第一實施例組合剖視圖;第3圖係為本發明環路熱管結構之第二實施例組合剖視圖;第4圖係為本發明環路熱管結構作動示意圖。 1 is a perspective exploded view of a first embodiment of a loop heat pipe structure of the present invention; FIG. 2 is a cross-sectional view showing a first embodiment of the loop heat pipe structure of the present invention; and FIG. 3 is a loop heat pipe structure of the present invention. The second embodiment is a sectional view of the combination; and the fourth embodiment is a schematic diagram of the operation of the loop heat pipe structure of the present invention.

請參閱第1、2圖,係為本發明環路熱管結構之第一實施例立體分解及組合剖視圖,如圖所示,本發明環路熱管結構1,係包含:一蒸發腔體11、一管體12、一冷凝單元13;所述蒸發腔體11係為一平板式蒸發腔體,具有一出口111及一入口112與一容置空間113,該容置空間113內具有一毛細結構114及一補償腔115與至少一蒸氣通道1141,所述蒸氣通道1141一端與該出口111連通,並該入口112及該出口111並非需設置於同一側當然亦可設置於不同側,該補償腔115由該容置空間113與該毛細結構114共同界定,該蒸發腔體11更具有一殼體11a及一底板11b,並對應蓋合組成該蒸發腔體11,所述補償腔115係與該毛細結構114呈水平對應設置。 1 and 2 are a perspective exploded view and a combined cross-sectional view of a first embodiment of a loop heat pipe structure according to the present invention. As shown, the loop heat pipe structure 1 of the present invention comprises: an evaporation chamber 11 and a The tube body 12 and a condensing unit 13; the evaporation chamber body 11 is a flat plate evaporation chamber having an outlet 111 and an inlet 112 and an accommodating space 113. The accommodating space 113 has a capillary structure 114 therein. And a compensation chamber 115 and at least one vapor channel 1141, one end of the vapor channel 1141 is in communication with the outlet 111, and the inlet 112 and the outlet 111 are not necessarily disposed on the same side, and may be disposed on different sides. The accommodating space 113 is defined by the accommodating space 113. The evaporation chamber 11 further has a housing 11a and a bottom plate 11b, and correspondingly covers the evaporation chamber 11. The compensation chamber 115 is connected to the capillary. Structure 114 is horizontally corresponding.

所述蒸氣通道1141係選擇設於前述蒸發腔體11相對該毛細結構114之壁面(底板11b)或設置於該毛細結構114相對該蒸發腔體11之一側(與熱源3接觸的受熱面)處其中任一,本實施例係以設置於該毛細結構114相對於該蒸發腔體11之一側(與熱源接觸的受熱面)作為說明實施例,但並不引以為限。 The vapor passage 1141 is selectively disposed on the wall surface of the evaporation chamber 11 relative to the capillary structure 114 (the bottom plate 11b) or on the side of the capillary structure 114 opposite to the evaporation chamber 11 (the heating surface in contact with the heat source 3) In any of the embodiments, the present embodiment is provided on the side of the capillary structure 114 with respect to one side of the evaporation chamber 11 (heat receiving surface in contact with the heat source), but is not limited thereto.

所述毛細結構114設置於該蒸發腔體11之容置空間113內,並與該容置空間113共同界定前述補償腔115,而該入口112與該出口111與該毛細結構114對應設置,該毛細結構114設置於該入口112與該出口111兩者之間,並且該入口112相對設置於該出口111之上方,即表示該工作流體2由該入口112進入該蒸發腔體11後,又因重力驅使下可快速落入該毛細結構114中,則可進一步提升工作流體2回流之效率,並該毛細結構114吸附工作流體2飽和後,多餘之工作流體2則流入補償腔115中,當然該出、入口111、112亦可設置等高或該出口111高於入口112,僅需入口112可直接與該毛細結構114接觸即可。 The capillary structure 114 is disposed in the accommodating space 113 of the evaporation chamber 11 and defines the compensation cavity 115 together with the accommodating space 113. The inlet 112 and the outlet 111 are corresponding to the capillary structure 114. The capillary structure 114 is disposed between the inlet 112 and the outlet 111, and the inlet 112 is disposed opposite to the outlet 111, that is, after the working fluid 2 enters the evaporation chamber 11 from the inlet 112, The gravity can be quickly dropped into the capillary structure 114, and the efficiency of the return of the working fluid 2 can be further improved. After the capillary structure 114 is saturated with the working fluid 2, the excess working fluid 2 flows into the compensation chamber 115. The outlets 111, 112 may also be contoured or the outlet 111 may be higher than the inlet 112, and only the inlet 112 may be in direct contact with the capillary structure 114.

更具有一液體通道116,該液體通道116一端與該入口112連接,所述液體通道116設於該毛細結構114一側,並該液體通道116係與蒸汽通道1141分別對應設於該毛細結構114上、下兩側。 Further, a liquid passage 116 is connected to one end of the liquid passage 116. The liquid passage 116 is disposed on one side of the capillary structure 114, and the liquid passage 116 is respectively disposed on the capillary structure 114 corresponding to the steam passage 1141. Upper and lower sides.

所述管體12具有一第一端121及一第二端122分別與前述蒸發腔體11之該出、入口111、112連接,該第二端122與該毛細結構114相鄰設置。 The tube body 12 has a first end 121 and a second end 122 respectively connected to the outlet and the inlets 111 and 112 of the evaporation chamber 11. The second end 122 is disposed adjacent to the capillary structure 114.

所述冷凝單元13具有複數散熱鰭片131,該等散熱鰭片131串套於前述管體12之第一、二端121、122之間。 The condensing unit 13 has a plurality of heat dissipating fins 131 that are sleeved between the first and second ends 121 and 122 of the tube body 12 .

所述蒸氣通道1141主要係可提供該呈汽態之工作流體21流動進行擴散冷凝循環。更具有一工作流體2係填充於前述蒸發腔體11或該管體12內,所述工作流體2係具有一汽態及一液態之型態,該汽態之工作流體21與該液態工作流體22循環於該環路熱管結構1整體內部。 The vapor passage 1141 is mainly capable of providing the vaporous working fluid 21 to flow for a diffusion condensation cycle. Further, a working fluid 2 is filled in the evaporation chamber 11 or the tube body 12. The working fluid 2 has a vapor state and a liquid state, and the vapor working fluid 21 and the liquid working fluid 22 It circulates inside the entire heat pipe structure 1 of the loop.

所述冷凝單元13設置於該管體12之第一、二端121、122之間,該冷凝單元13係選擇以複數散熱鰭片或複數冷卻管體其中任一所構成。 The condensing unit 13 is disposed between the first and second ends 121 and 122 of the tubular body 12. The condensing unit 13 is configured by any one of a plurality of heat radiating fins or a plurality of cooling tubes.

請參閱第3圖係為本發明環路熱管結構之第二實施例組合剖視圖,如圖所示,本實施例部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例不同處在於所述入口111與該出口112係採左、右對應設置,即設置於該蒸發腔體11不同側,並且該管體12之第二端122由該入口111進入該蒸氣腔體11後該第二端122延伸至該蒸氣腔體11中遠離補償腔115的一側,即設置有毛細結構114之上方處,令呈液態之工作流體22直接導向該毛細結構114,待毛細結構114吸附呈液態之工作流體22飽和後,多餘之液態之工作流體22導向至補償腔115進行儲存,藉此有助於該液態之工作流體22可快速回流進入該毛細結構114中,並改善習知毛細結構含水不足乾燒等問題。 FIG. 3 is a cross-sectional view showing a second embodiment of the loop heat pipe structure of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the implementation is omitted. The difference from the first embodiment is that the inlet 111 and the outlet 112 are disposed correspondingly to the left and right, that is, disposed on different sides of the evaporation chamber 11, and the second end 122 of the tube 12 is from the inlet. After entering the vapor chamber 11, the second end 122 extends to a side of the vapor chamber 11 away from the compensation chamber 115, that is, above the capillary structure 114, so that the liquid working fluid 22 is directly directed to the capillary Structure 114, after the capillary structure 114 is saturated with the liquid working fluid 22, the excess liquid working fluid 22 is directed to the compensation chamber 115 for storage, thereby facilitating rapid reflow of the liquid working fluid 22 into the capillary structure. 114, and improve the conventional capillary structure water shortage and dry burning and other issues.

請參閱第4圖,係為本發明環路熱管結構作動示意圖,如圖所示,本發明環路熱管結構1主要係透過蒸發腔體11一側(熱接觸面)接觸熱源3,並該蒸發腔體11對應接觸熱源3之處內部對應設有該毛細結構114,該毛細結構114內含有呈液態之工作流體22,當該蒸發腔體11接觸該熱源3並吸收該熱源3所產生之熱量時,而內部之毛細結構114受熱後其內部所含的液態之工作流體22產生蒸發汽化由該毛細結構114所設置之蒸氣通道1141擴散離開該毛細結構114,並因該蒸氣通道1141一端直接連接該蒸發腔體11之出口111,則該汽態之工作流體21由該出口111直接向該蒸發腔體11外擴散,透過該管體12之第一端121與該出口111連接,令該汽態之工作流體21進入該管體12,該汽態之工作流體21經由該管體12設置(串套)有冷凝單元13之處進行冷卻冷凝後再由該管體12之第二端122與該蒸發腔體11之入口112連接將該液態之工作流體22引導回流至該蒸發腔體11內,該液態之工作流體22除本身汽液現象所產生之壓力差以及毛細現象可被引導回流至毛細結構 114中外,更因該入口112對應設置於該毛細結構114之上方增加透過重力直接落入該毛細結構114中持續進行汽液循環。 Referring to FIG. 4, it is a schematic diagram of the operation of the loop heat pipe structure of the present invention. As shown in the figure, the loop heat pipe structure 1 of the present invention mainly contacts the heat source 3 through the evaporation chamber 11 side (thermal contact surface), and the evaporation The capillary 11 is correspondingly disposed inside the cavity 11 corresponding to the heat source 3, and the capillary structure 114 contains a working fluid 22 in a liquid state. When the evaporation cavity 11 contacts the heat source 3 and absorbs heat generated by the heat source 3 When the inner capillary structure 114 is heated, the liquid working fluid 22 contained therein is vaporized and vaporized. The vapor channel 1141 provided by the capillary structure 114 diffuses away from the capillary structure 114, and is directly connected by one end of the vapor channel 1141. The outlet 111 of the evaporation chamber 11 is directly diffused from the outlet 111 to the evaporation chamber 11. The first end 121 of the tube 12 is connected to the outlet 111 to make the steam. The working fluid 21 enters the tubular body 12, and the vaporous working fluid 21 is disposed (sleeve) through the tubular body 12 with the condensing unit 13 for cooling and condensation, and then the second end 122 of the tubular body 12 is The inlet 11 of the evaporation chamber 11 2 connecting the liquid working fluid 22 to the evaporation chamber 11, the pressure difference and capillary phenomenon of the liquid working fluid 22 in addition to its own vapor-liquid phenomenon can be guided back to the capillary structure In the middle and outer 114, the inlet 112 is correspondingly disposed above the capillary structure 114 to increase the direct flow into the capillary structure 114 by gravity to continue the vapor-liquid circulation.

前述管體12外部亦可接設具有提升冷凝效果的任何散熱元件(圖中未示)進而可增進冷凝之效率。 Any heat dissipating component (not shown) having a lifting condensation effect may be connected to the outside of the pipe body 12 to further improve the efficiency of condensation.

本發明主要係改變蒸發腔體11出口111及入口112以及毛細結構114間之對應關係,當液態工作流體22回流至蒸發腔體11主要透過先導入做為蒸氣芯使用的毛細結構114後,即回流的液態工作流體22因毛細結構114直接設置於入口112的下方,故回流後首先進入毛細結構114中儲存,當毛細結構114含水量飽和後多餘的液態之工作流體22才進而儲存於補償腔115中,即解決了習知平板式蒸發器水平放置造成補償腔的工作流體2距離蒸發面過遠產生之乾燒的缺失者。 The present invention mainly changes the correspondence between the outlet 111 of the evaporation chamber 11 and the inlet 112 and the capillary structure 114. When the liquid working fluid 22 is returned to the evaporation chamber 11 mainly through the first introduction of the capillary structure 114 used as the vapor core, The reflowed liquid working fluid 22 is disposed directly below the inlet 112 due to the capillary structure 114, so that it is first stored in the capillary structure 114 after reflow, and the excess liquid working fluid 22 is stored in the compensation chamber after the capillary structure 114 has saturated water content. In 115, the lack of dry burning of the working fluid 2 caused by the horizontal displacement of the conventional flat evaporator caused by the horizontal distance from the evaporation surface is solved.

Claims (10)

一種環路熱管結構,係包含:一蒸發腔體,具有一出口及一入口與一容置空間,該容置空間內具有一毛細結構及一補償腔與至少一蒸氣通道,所述蒸氣通道一端與該出口連通,所述毛細結構設置於該入口與該出口兩者之間且緊鄰該入口,該補償腔係與該毛細結構呈水平對應設置,該補償腔遠離該出口;一管體,具有一第一端及一第二端分別與前述蒸發腔體之出、入口連接;一工作流體,係填充於前述蒸發腔體或該管體內;一冷凝單元,設於前述管體之第一、二端之間。 A loop heat pipe structure comprises: an evaporation chamber having an outlet and an inlet and an accommodating space, the accommodating space having a capillary structure and a compensation chamber and at least one vapor passage, the vapor passage end Communicating with the outlet, the capillary structure is disposed between the inlet and the outlet and adjacent to the inlet, the compensation cavity is horizontally corresponding to the capillary structure, the compensation cavity is away from the outlet; a tube body having a first end and a second end are respectively connected to the outlet and the inlet of the evaporation chamber; a working fluid is filled in the evaporation chamber or the tube body; and a condensing unit is disposed in the first body of the tube body, Between the two ends. 如申請專利範圍第1項所述環路熱管結構,其中所述蒸氣通道係選擇設於前述蒸發腔體相對該毛細結構之壁面或設置於該毛細結構相對該蒸發腔體之一側處其中任一,並該蒸氣通道一端與該出口對應連接。 The loop heat pipe structure according to claim 1, wherein the vapor channel is selected from the wall surface of the evaporation chamber relative to the capillary structure or at a side of the capillary structure opposite to the evaporation chamber. First, one end of the vapor channel is correspondingly connected to the outlet. 如申請專利範圍第1項所述環路熱管結構,其中所述工作流體係具有一汽態及一液態之型態,該汽態之工作流體與該液態工作流體循環於該環路熱管結構整體內部。 The loop heat pipe structure according to claim 1, wherein the working fluid system has a vapor state and a liquid state, and the vapor working fluid and the liquid working fluid circulate inside the loop heat pipe structure as a whole. . 如申請專利範圍第1項所述環路熱管結構,其中該蒸發腔體更具有一殼體及一底板並對應蓋合構形該蒸發腔體。 The loop heat pipe structure according to claim 1, wherein the evaporation chamber further has a casing and a bottom plate and correspondingly forms the evaporation cavity. 如申請專利範圍第1項所述環路熱管結構,其中該蒸發腔體之該出口及該入口可選擇設置於該蒸發腔體同一側或不同一側其中任一,該出口及該入口可為相同或不同水平高度。 The loop heat pipe structure of claim 1, wherein the outlet and the inlet of the evaporation chamber are optionally disposed on the same side or different sides of the evaporation chamber, and the outlet and the inlet may be Same or different levels. 如申請專利範圍第1項所述環路熱管結構,其中所述出口與該入口係設置於該蒸發腔體不同側,該管體之第二端由該蒸發腔體之入口進入該容置空間並延伸至遠離該補償腔的一側,該入口位置高於該出口。 The loop heat pipe structure according to claim 1, wherein the outlet and the inlet are disposed on different sides of the evaporation cavity, and the second end of the pipe body enters the accommodating space by the inlet of the evaporation cavity And extending to a side away from the compensation chamber, the inlet position being higher than the outlet. 如申請專利範圍第4項所述環路熱管結構,其中該蒸發腔體接觸一熱源並吸收該熱源所產生之熱量,該毛細結構受熱後其內部所含之液態之工作流體產生蒸發汽化由該毛細結構所設置之蒸氣通道擴散離開該毛細結構,並因該蒸氣通道一端直接連接該蒸發腔體之出口,則該汽態之工作流體由該出口直接向該蒸發腔體外擴散,透過該管體之第一端與該出口連接,令該汽態之工作流體進入該管體,該汽態之工作流體經由該管體外部串套之冷凝單元進行冷卻冷凝成液態之工作流體後再由該管體之第二端與該蒸發腔體之入口連接將該液態之工作流體引導回流至該蒸發腔體內,並由於該第二端延伸進入蒸發腔體直接延伸至該毛細結構之上方處,令該液態之工作流體直接導向該毛細結構,待毛細結構吸附呈液態之工作流體飽和後,多餘之液態之工作流體導向至補償腔進行儲存。 The loop heat pipe structure according to claim 4, wherein the evaporation cavity contacts a heat source and absorbs heat generated by the heat source, and the capillary structure is heated to generate vaporization vaporization of the liquid working fluid contained therein. The vapor passage provided by the capillary structure diffuses away from the capillary structure, and since one end of the vapor passage is directly connected to the outlet of the evaporation chamber, the vaporous working fluid is directly diffused from the outlet to the outside of the evaporation chamber, and is passed through the tube body. The first end is connected to the outlet, and the working fluid of the vapor state enters the tubular body, and the working fluid of the vapor state is cooled and condensed into a liquid working fluid through a condensing unit of the outer casing of the tubular body, and then the tubular working fluid is The second end of the body is connected to the inlet of the evaporation chamber to direct the liquid working fluid back into the evaporation chamber, and since the second end extends into the evaporation chamber and directly extends above the capillary structure, The liquid working fluid is directly directed to the capillary structure, and after the capillary structure is saturated with the liquid working fluid, the excess liquid working fluid is directed to the compensation. The cavity is stored. 如申請專利範圍第1項所述環路熱管結構,其中所述蒸發腔體係為一平板式蒸發腔體,所述補償腔係與該毛細結構呈水平對應設置。 The loop heat pipe structure according to claim 1, wherein the evaporation chamber system is a flat plate evaporation chamber, and the compensation chamber is horizontally disposed corresponding to the capillary structure. 如申請專利範圍第1項所述環路熱管結構,其中更具有一液體通道一端與該入口連接,所述的液體通道設於該毛細結構一側,並該液體通道係與蒸汽通道分別對應設於該毛細結構上、下兩側。 The loop heat pipe structure according to claim 1, wherein one end of the liquid passage is connected to the inlet, the liquid passage is disposed on one side of the capillary structure, and the liquid passage system and the steam passage are respectively corresponding to each other. On the upper and lower sides of the capillary structure. 如申請專利範圍第1項所述環路熱管結構,其中所述冷凝單元係選擇以複數散熱鰭片或複數冷卻管體其中任一所構成。 The loop heat pipe structure according to claim 1, wherein the condensing unit is configured by any one of a plurality of heat radiating fins or a plurality of cooling tubes.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
TW535891U (en) * 2002-01-29 2003-06-01 Memsfuel Internat Corp Micro loop type heat pipe device
TWI522593B (en) * 2011-03-29 2016-02-21 Asia Vital Components Co Ltd Loop heat pipe structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
TW535891U (en) * 2002-01-29 2003-06-01 Memsfuel Internat Corp Micro loop type heat pipe device
TWI522593B (en) * 2011-03-29 2016-02-21 Asia Vital Components Co Ltd Loop heat pipe structure

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