TWI619888B - Heat-dissipating fan device and volume adjustment method - Google Patents

Heat-dissipating fan device and volume adjustment method Download PDF

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TWI619888B
TWI619888B TW105141100A TW105141100A TWI619888B TW I619888 B TWI619888 B TW I619888B TW 105141100 A TW105141100 A TW 105141100A TW 105141100 A TW105141100 A TW 105141100A TW I619888 B TWI619888 B TW I619888B
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resonant cavity
unit
fan unit
standing wave
fan
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TW105141100A
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TW201821700A (en
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丁國基
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英業達股份有限公司
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Abstract

本案揭示一種應用於電腦裝置中的散熱風扇裝置,且此散熱風扇裝置包含風扇單元、共振腔體以及發聲單元。共振腔體與風扇單元結合,且發聲單元整合於共振腔體。風扇單元用以進風以為電腦裝置進行散熱。共振腔體用以依據風扇單元的運作而產生駐波,並依據駐波而放大發聲單元之聲音音量。共振腔體包含亥姆霍茲(Helmholtz)共振腔。The present disclosure discloses a cooling fan device for use in a computer device, and the cooling fan device includes a fan unit, a resonant cavity, and a sounding unit. The resonant cavity is combined with the fan unit, and the sounding unit is integrated into the resonant cavity. The fan unit is used for air intake to dissipate heat from the computer device. The resonant cavity is configured to generate a standing wave according to the operation of the fan unit, and amplify the sound volume of the sounding unit according to the standing wave. The resonant cavity contains a Helmholtz resonant cavity.

Description

散熱風扇裝置及音量調整方法Cooling fan device and volume adjustment method

本案係關於一種散熱裝置及調整方法,特別係關於一種散熱風扇裝置及音量調整方法。The present invention relates to a heat dissipating device and an adjusting method, and particularly relates to a cooling fan device and a volume adjusting method.

隨著散熱技術的快速發展,風扇單元係廣泛地運用於電腦裝置中以為電腦裝置進行散熱。舉例而言,當電腦裝置的運作頻率依據效能需求而提高時,電腦裝置的內部溫度將相應地提高,因此,為了不讓電腦裝置的內部溫度對其運作造成影響,甚至導致電腦裝置的毀損,風扇單元係應用以調節電腦裝置的內部溫度。然而,目前而言,風扇單元的設計仍以散熱效能為主要考量,並未考量如何降低風扇單元的運作噪音。舉例而言,當風扇單元運作於高轉速模式時,風扇單元的散熱效果佳但運作噪音大,當風扇單元運作於低轉速模式時,風扇單元的散熱效果差但運作噪音小。With the rapid development of heat dissipation technology, fan units are widely used in computer devices to dissipate heat for computer devices. For example, when the operating frequency of a computer device is increased according to performance requirements, the internal temperature of the computer device will be correspondingly increased. Therefore, in order to prevent the internal temperature of the computer device from affecting its operation, or even causing damage to the computer device, The fan unit is used to adjust the internal temperature of the computer device. However, at present, the design of the fan unit is still mainly based on the heat dissipation performance, and it is not considered how to reduce the operating noise of the fan unit. For example, when the fan unit operates in the high-speed mode, the fan unit has good heat dissipation effect but high operation noise. When the fan unit operates in the low-speed mode, the fan unit has poor heat dissipation performance but low operation noise.

因此,如何有效地維持風扇單元的散熱效能並降低風扇單元的運作噪音來進行散熱風扇裝置及音量調整方法的設計,可是一大挑戰。Therefore, how to effectively maintain the heat dissipation performance of the fan unit and reduce the operating noise of the fan unit to design the cooling fan device and the volume adjustment method is a big challenge.

本案揭示的一態樣係關於一種應用於一電腦裝置中的散熱風扇裝置,且此散熱風扇裝置包含風扇單元、共振腔體以及發聲單元。共振腔體與風扇單元整合,且發聲單元整合於共振腔體。風扇單元用以進風以為電腦裝置進行散熱。共振腔體用以依據風扇單元的運作而產生駐波,並依據駐波而放大發聲單元之聲音音量。共振腔體包含亥姆霍茲(Helmholtz)共振腔。One aspect disclosed in the present disclosure relates to a cooling fan device applied to a computer device, and the cooling fan device includes a fan unit, a resonant cavity, and a sounding unit. The resonant cavity is integrated with the fan unit, and the sounding unit is integrated into the resonant cavity. The fan unit is used for air intake to dissipate heat from the computer device. The resonant cavity is configured to generate a standing wave according to the operation of the fan unit, and amplify the sound volume of the sounding unit according to the standing wave. The resonant cavity contains a Helmholtz resonant cavity.

本案揭示的另一態樣係關於一種應用於散熱風扇裝置的音量調整方法。此散熱風扇裝置包含風扇單元、共振腔體以及發聲單元,且共振腔體包含亥姆霍茲共振腔。共振腔體與風扇單元結合,且發聲單元整合於共振腔體。此音量調整方法包含以下步驟:透過共振腔體依據風扇單元的運作而產生駐波;以及透過共振腔體依據駐波而放大發聲單元之聲音音量。Another aspect disclosed in the present disclosure relates to a volume adjustment method applied to a cooling fan device. The cooling fan device comprises a fan unit, a resonant cavity and a sounding unit, and the resonant cavity comprises a Helmholtz resonant cavity. The resonant cavity is combined with the fan unit, and the sounding unit is integrated into the resonant cavity. The volume adjustment method includes the steps of: generating a standing wave according to the operation of the fan unit through the resonant cavity; and amplifying the sound volume of the sounding unit according to the standing wave through the resonant cavity.

綜上所述,本案之技術方案與現有技術相比具有明顯的優點和有益效果。藉由上述技術方案,可達到相當的技術進步,並具有□業上的廣泛利用價值,本案所揭示之散熱風扇裝置及音量調整方法係運用亥姆霍茲共振腔可以將聲音消減或放大的特性,從而為風扇單元與發聲單元所產生的聲音分別進行消減與放大。舉例而言,當發聲單元未運作時,亥姆霍茲共振腔可用以降低風扇單元的運作噪音;當發聲單元運作時,亥姆霍茲共振腔可以作為發聲單元的音箱元件,並用以放大發聲單元之聲音音量,從而提升使用者於聽覺上的體驗品質。因此,本案所揭示之散熱風扇裝置及音量調整方法不僅可以有效地維持風扇單元的散熱效能並降低風扇單元的運作噪音,更可以透過放大發聲單元之聲音音量以提升使用者的體驗品質。In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the above technical solutions, considerable technological progress can be achieved, and the utility value is widely used. The cooling fan device and the volume adjustment method disclosed in the present invention can reduce or amplify the sound by using the Helmholtz resonant cavity. Therefore, the sound generated by the fan unit and the sounding unit is respectively reduced and enlarged. For example, when the sounding unit is not operating, the Helmholtz resonant cavity can be used to reduce the operating noise of the fan unit; when the sounding unit is operating, the Helmholtz resonant cavity can be used as a speaker component of the sounding unit and used to amplify the sound. The sound volume of the unit enhances the user's auditory experience quality. Therefore, the cooling fan device and the volume adjusting method disclosed in the present invention can not only effectively maintain the heat dissipation performance of the fan unit and reduce the operating noise of the fan unit, but also enhance the user's experience quality by amplifying the sound volume of the sounding unit.

下文是舉實施例配合所附圖式作詳細說明,以更好地理解本案的態樣,但所提供的實施例並非用以限制本揭示所涵蓋的範圍,而結構操作的描述非用以限制其執行的順序,任何由元件重新組合的結構,所產生具有均等功效的裝置,皆為本揭示所涵蓋的範圍。此外,根據業界的標準及慣常做法,圖式僅以輔助說明為目的,並未依照原尺寸作圖,實際上各種特徵的尺寸可任意地增加或減少以便於說明。下述說明中相同元件將以相同的符號標示來進行說明以便於理解。The following is a detailed description of the embodiments in order to provide a better understanding of the scope of the present invention, but the embodiments are not intended to limit the scope of the disclosure, and the description of the structural operation is not limited. The order in which they are performed, any structure that is recombined by the elements, produces equal means of function, and is covered by the disclosure. In addition, according to industry standards and practices, the drawings are only for the purpose of assisting the description, and are not drawn according to the original size. In fact, the dimensions of the various features may be arbitrarily increased or decreased for convenience of explanation. In the following description, the same elements will be denoted by the same reference numerals for convenience of understanding.

在全篇說明書與申請專利範圍所使用的用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭示的內容中與特殊內容中的平常意義。某些用以描述本案揭示的用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本案揭示的描述上額外的引導。The terms used in the entire specification and the scope of the patent application, unless otherwise specified, generally have the ordinary meaning of each term used in the field, the content disclosed herein, and the particular content. Certain terms used to describe the present disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.

此外,在本案中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指『包含但不限於』。In addition, the terms "including", "including", "having", "containing", etc., which are used in this case are all open terms, meaning "including but not limited to".

於本案中,當一元件被稱為『連接』或『耦接』時,可指『電性連接』或『電性耦接』。『連接』或『耦接』亦可用以表示二或多個元件間相互搭配操作或互動。In this case, when an element is referred to as "connected" or "coupled", it may mean "electrically connected" or "electrically coupled". "Connected" or "coupled" can also be used to indicate that two or more components operate or interact with each other.

第1A圖為依據本案揭示的實施例所繪製的散熱風扇裝置100的架構示意圖。如第1A圖所示,散熱風扇裝置100包含風扇單元110、共振腔體120以及發聲單元130。於此實施例中,共振腔體120可以與風扇單元110結合,發聲單元130可以整合於共振腔體120之頂端或側邊。舉例而言,散熱風扇裝置100可以應用於電腦裝置中,且電腦裝置可以為桌上型電腦、筆記型電腦、平板電腦或任何可用以執行運算功能之電腦模組。FIG. 1A is a schematic structural view of a cooling fan device 100 according to an embodiment disclosed in the present disclosure. As shown in FIG. 1A, the cooling fan device 100 includes a fan unit 110, a resonant cavity 120, and a sounding unit 130. In this embodiment, the resonant cavity 120 can be combined with the fan unit 110, and the sounding unit 130 can be integrated on the top or side of the resonant cavity 120. For example, the cooling fan device 100 can be applied to a computer device, and the computer device can be a desktop computer, a notebook computer, a tablet computer, or any computer module that can be used to perform computing functions.

於一實施例中,散熱風扇裝置100更包含通風腔體140,且通風腔體140與風扇單元110及共振腔體120結合。舉例而言,風扇單元110用以進風以為電腦裝置進行散熱,並透過通風腔體140以進行出風。如第1A圖所示,由通風腔體140之部分剖面圖可得知通風腔體140為中空腔體,因此,風扇單元110可以透過中空的通風腔體140以進行出風。共振腔體120用以依據風扇單元110的運作而產生駐波,並依據駐波而放大發聲單元130之聲音音量,且共振腔體120為亥姆霍茲(Helmholtz)共振腔。於另一實施例中,散熱風扇裝置100更包含散熱鰭片150,且散熱鰭片150整合於通風腔體140之出風口以增加散熱面積,從而可以有效地提升散熱風扇裝置100的散熱效能。In one embodiment, the cooling fan device 100 further includes a ventilation cavity 140, and the ventilation cavity 140 is combined with the fan unit 110 and the resonant cavity 120. For example, the fan unit 110 is used for air intake to dissipate heat from the computer device and through the ventilation cavity 140 for air outlet. As shown in FIG. 1A, it can be seen from a partial cross-sectional view of the venting cavity 140 that the venting cavity 140 is a hollow cavity. Therefore, the fan unit 110 can pass through the hollow venting cavity 140 for air outlet. The resonant cavity 120 is configured to generate a standing wave according to the operation of the fan unit 110, and amplify the sound volume of the sounding unit 130 according to the standing wave, and the resonant cavity 120 is a Helmholtz resonant cavity. In another embodiment, the heat dissipation fan device 100 further includes a heat dissipation fin 150 , and the heat dissipation fins 150 are integrated into the air outlet of the ventilation cavity 140 to increase the heat dissipation area, so that the heat dissipation performance of the heat dissipation fan device 100 can be effectively improved.

於一實施例中,當風扇單元110透過通風腔體140以進行出風時,共振腔體120用以依據風扇單元110出風時所產生的空氣振動能量而產生駐波。於另一實施例中,如第1B圖所示,第1B圖為依據本案揭示的實施例所繪製的散熱風扇裝置100的架構示意圖。共振腔體120包含共振膜160,且共振膜160用以將風扇單元110出風時所產生的空氣振動能量傳入共振腔體120中。如此,共振腔體120即可以依據空氣振動能量而產生駐波。於此實施例中,共振腔體120除共振膜160外均可以為剛體結構。舉例而言,共振腔體120可以由金屬材質、陶瓷材質、塑料材質、木材材質或任何可忽略明顯形變的固體材質所組成。此外,共振膜160可以由紙漿振膜、塑料振膜、金屬振膜或合成纖維振膜或任何可用以傳送空氣振動能量的振膜所組成。In one embodiment, when the fan unit 110 passes through the ventilation chamber 140 to perform the air discharge, the resonant cavity 120 is configured to generate a standing wave according to the vibration energy of the air generated when the fan unit 110 is out of the air. In another embodiment, as shown in FIG. 1B, FIG. 1B is a schematic structural view of a cooling fan device 100 according to an embodiment disclosed in the present disclosure. The resonant cavity 120 includes a resonant film 160, and the resonant film 160 is used to introduce air vibration energy generated when the fan unit 110 is out of the air into the resonant cavity 120. In this way, the resonant cavity 120 can generate standing waves according to the vibration energy of the air. In this embodiment, the resonant cavity 120 may be a rigid body structure except for the resonant film 160. For example, the resonant cavity 120 may be made of a metal material, a ceramic material, a plastic material, a wood material, or any solid material that neglects significant deformation. Further, the resonance film 160 may be composed of a pulp diaphragm, a plastic diaphragm, a metal diaphragm or a synthetic fiber diaphragm or any diaphragm that can transmit air vibration energy.

於另一實施例中,共振腔體120用以依據駐波之頻率而放大發聲單元130之相應頻率區段的聲音音量。舉例而言,當發聲元件130未啟動時,共振腔體120可藉由亥姆霍茲共振腔之特性(即,將聲音消減的特性)以降低風扇單元110的運作噪音;當發聲元件130啟動時,共振腔體120可以作為發聲元件130的音箱元件使用。當風扇元件110透過通風腔體140以進行出風時,共振膜160將風扇單元110出風時所產生的空氣振動能量傳入共振腔體120中。隨後,共振腔體120依據空氣振動能量而產生具有特定頻率的駐波,並依據此具有特定頻率的駐波而放大發聲單元130之相應頻率區段的聲音音量。In another embodiment, the resonant cavity 120 is configured to amplify the sound volume of the corresponding frequency segment of the sounding unit 130 according to the frequency of the standing wave. For example, when the sounding element 130 is not activated, the resonant cavity 120 can reduce the operating noise of the fan unit 110 by the characteristics of the Helmholtz resonant cavity (ie, the characteristic of the sound reduction); when the sounding element 130 is activated The resonant cavity 120 can be used as a speaker component of the sounding element 130. When the fan element 110 passes through the ventilation cavity 140 to perform the air discharge, the resonance film 160 introduces the air vibration energy generated when the fan unit 110 is out of the air into the resonance cavity 120. Subsequently, the resonant cavity 120 generates a standing wave having a specific frequency according to the air vibration energy, and amplifies the sound volume of the corresponding frequency section of the sounding unit 130 according to the standing wave having the specific frequency.

於一實施例中,當共振腔體120為亥姆霍茲共振腔時,共振腔體120可以依據下述關係式以進行設計: In one embodiment, when the resonant cavity 120 is a Helmholtz resonant cavity, the resonant cavity 120 can be designed according to the following relationship:

舉例而言, f 0表示亥姆霍茲共振腔的共振頻率, c表示聲音速度, S表示共振膜160的截面積, d表示共振膜160的直徑長度, V表示共振腔體120的內部容積, L表示共振腔體120與共振膜160之間的接合處上所對應的共振腔體120的厚度。藉由預先設定符合實際需求的共振頻率 f 0,如此,即可得到上述所有的參數之間的數值對應關係,從而得以建構共振腔體120。於此實施例中,可以依據風扇單元110的運作噪音之頻率以設定共振頻率 f 0,如此,共振腔體120即可以藉由亥姆霍茲共振腔之特性(即,將聲音消減的特性)而有效地降低風扇單元110的運作噪音。 For example, f 0 represents the resonance frequency of the Helmholtz resonator, c represents the sound velocity, S represents the cross-sectional area of the resonance film 160, d represents the diameter length of the resonance film 160, and V represents the internal volume of the resonance cavity 120, L represents the thickness of the resonant cavity 120 corresponding to the joint between the resonant cavity 120 and the resonant film 160. By setting the resonance frequency f 0 in accordance with the actual demand in advance, the numerical correspondence between all the above parameters can be obtained, thereby constructing the resonant cavity 120. In this embodiment, the resonant frequency f 0 can be set according to the frequency of the operating noise of the fan unit 110. Thus, the resonant cavity 120 can be characterized by the Helmholtz resonant cavity (ie, the characteristic of the sound reduction). The operating noise of the fan unit 110 is effectively reduced.

第2圖為依據本案揭示的實施例所繪製的音量調整方法200的流程圖。於一實施例中,音量調整方法200可以應用於上述的散熱風扇裝置100,但本案並不以此為限。為了易於理解音量調整方法200,後文將以散熱風扇裝置100作為實施音量調整方法200的示範標的。如第2圖所示,音量調整方法200包含以下步驟: S201:透過共振腔體120依據風扇單元110的運作而產生駐波;以及 S202:透過共振腔體120依據駐波而放大發聲單元130之聲音音量。2 is a flow chart of a volume adjustment method 200 drawn in accordance with an embodiment disclosed herein. In one embodiment, the volume adjustment method 200 can be applied to the above-described cooling fan device 100, but the present invention is not limited thereto. In order to facilitate understanding of the volume adjustment method 200, the cooling fan device 100 will be exemplified as an exemplary implementation of the volume adjustment method 200. As shown in FIG. 2, the volume adjustment method 200 includes the following steps: S201: generating a standing wave according to the operation of the fan unit 110 through the resonant cavity 120; and S202: amplifying the sounding unit 130 according to the standing wave through the resonant cavity 120. Sound volume.

於一實施例中,請參閱步驟S201,當散熱風扇裝置100透過風扇單元110以進行出風時,音量調整方法200可以透過共振腔體120來加以執行並依據風扇單元110出風時所產生的空氣振動能量而產生駐波。於另一實施例中,當散熱風扇裝置100透過風扇單元110以進行出風時,音量調整方法200可以透過共振腔體120中的共振膜160來加以執行並將風扇單元110出風時所產生的空氣振動能量傳入共振腔體120中,如此,共振腔體120即可以依據共振膜160所傳入的空氣振動能量而產生駐波。In an embodiment, referring to step S201, when the cooling fan device 100 passes through the fan unit 110 to perform air blowing, the volume adjustment method 200 can be executed through the resonant cavity 120 and generated according to the fan unit 110 when the air is discharged. The air vibrates energy to generate standing waves. In another embodiment, when the cooling fan device 100 passes through the fan unit 110 to perform air blowing, the volume adjustment method 200 can be executed by the resonant film 160 in the resonant cavity 120 and generated when the fan unit 110 is ventilated. The air vibration energy is introduced into the resonant cavity 120. Thus, the resonant cavity 120 can generate standing waves according to the vibrational energy of the air introduced by the resonant film 160.

於又一實施例中,請參閱步驟S202,當透過共振腔體120依據風扇單元110出風時所產生的空氣振動能量而產生駐波後,音量調整方法200可以透過共振腔體120來加以執行並依據駐波之頻率而放大發聲單元130之相應頻率區段的聲音音量。舉例而言,當發聲元件130未啟動時,可以透過共振腔體120以降低風扇單元110的運作噪音(即,藉由亥姆霍茲共振腔之特性);當發聲元件130啟動時,共振腔體120可以作為發聲元件130的音箱元件使用。當散熱風扇裝置100透過風扇單元110以進行出風時,透過共振膜160將風扇單元110出風時所產生的空氣振動能量傳入共振腔體120中。隨後,透過共振腔體120依據空氣振動能量而產生具有特定頻率的駐波,並依據此具有特定頻率的駐波而放大發聲單元130之相應頻率區段的聲音音量。In another embodiment, referring to step S202, after the standing wave is generated by the vibration energy generated by the fan cavity 110 according to the air generated by the fan unit 110, the volume adjustment method 200 can be performed through the resonant cavity 120. And the sound volume of the corresponding frequency section of the sounding unit 130 is amplified according to the frequency of the standing wave. For example, when the sounding element 130 is not activated, the resonant cavity 120 can be transmitted to reduce the operating noise of the fan unit 110 (ie, by the characteristics of the Helmholtz resonant cavity); when the sounding element 130 is activated, the resonant cavity The body 120 can be used as a speaker component of the sounding element 130. When the cooling fan device 100 passes through the fan unit 110 to perform the air discharge, the air vibration energy generated when the fan unit 110 is ventilated through the resonance film 160 is transmitted to the resonance cavity 120. Subsequently, a standing wave having a specific frequency is generated by the resonant cavity 120 according to the air vibration energy, and the sound volume of the corresponding frequency section of the sounding unit 130 is amplified according to the standing wave having the specific frequency.

於上述實施例中,本案所揭示之散熱風扇裝置及音量調整方法係運用亥姆霍茲共振腔可以將聲音消減或放大的特性,從而為風扇單元與發聲單元所產生的聲音分別進行消減與放大。舉例而言,當發聲單元未運作時,亥姆霍茲共振腔可用以降低風扇單元的運作噪音;當發聲單元運作時,亥姆霍茲共振腔可以作為發聲單元的音箱元件,並用以放大發聲單元之聲音音量,從而提升使用者於聽覺上的體驗品質。因此,本案所揭示之散熱風扇裝置及音量調整方法不僅可以有效地維持風扇單元的散熱效能並降低風扇單元的運作噪音,更可以透過放大發聲單元之聲音音量以提升使用者的體驗品質。In the above embodiment, the cooling fan device and the volume adjusting method disclosed in the present invention use the Helmholtz resonant cavity to reduce or amplify the sound, thereby respectively reducing and amplifying the sound generated by the fan unit and the sounding unit. . For example, when the sounding unit is not operating, the Helmholtz resonant cavity can be used to reduce the operating noise of the fan unit; when the sounding unit is operating, the Helmholtz resonant cavity can be used as a speaker component of the sounding unit and used to amplify the sound. The sound volume of the unit enhances the user's auditory experience quality. Therefore, the cooling fan device and the volume adjusting method disclosed in the present invention can not only effectively maintain the heat dissipation performance of the fan unit and reduce the operating noise of the fan unit, but also enhance the user's experience quality by amplifying the sound volume of the sounding unit.

技術領域通常知識者可以容易理解到揭示的實施例實現一或多個前述舉例的優點。閱讀前述說明書之後,技術領域通常知識者將有能力對如同此處揭示內容作多種類的更動、置換、等效物以及多種其他實施例。因此本案之保護範圍當視申請專利範圍所界定者與其均等範圍為主。Those skilled in the art will readily appreciate that the disclosed embodiments achieve the advantages of one or more of the foregoing examples. After reading the foregoing description, those skilled in the art will be able to make various modifications, substitutions, equivalents, and various other embodiments. Therefore, the scope of protection of this case is mainly based on the scope of the patent application and its equal scope.

100‧‧‧散熱風扇裝置100‧‧‧Distribution fan unit

110‧‧‧風扇單元110‧‧‧Fan unit

120‧‧‧共振腔體120‧‧‧Resonant cavity

130‧‧‧發聲單元130‧‧‧ Sounding unit

140‧‧‧進風腔體140‧‧‧Inlet air chamber

150‧‧‧散熱鰭片150‧‧‧ Heat sink fins

160‧‧‧共振膜160‧‧‧Resonance film

200‧‧‧音量調整方法200‧‧‧Volume adjustment method

S201、S202‧‧‧步驟S201, S202‧‧‧ steps

第1A、1B圖為依據本案揭示的實施例所繪製的散熱風扇裝置的架構示意圖;以及 第2圖為依據本案揭示的實施例所繪製的音量調整方法的流程圖。1A and 1B are schematic diagrams showing the structure of a heat dissipation fan device according to an embodiment disclosed in the present disclosure; and FIG. 2 is a flow chart showing a volume adjustment method according to an embodiment disclosed in the present disclosure.

Claims (6)

一種散熱風扇裝置,應用於一電腦裝置中,包含:一風扇單元,用以進風以為該電腦裝置進行散熱;一共振腔體,與該風扇單元結合,用以依據該風扇單元的運作而產生一駐波,且該共振腔體包含一亥姆霍茲(Helmholtz)共振腔以及一共振膜;一通風腔體,與該風扇單元及該共振腔體結合,其中當該風扇單元透過該通風腔體以進行出風時,該共振腔體的該共振膜用以將該風扇單元出風時所產生的空氣振動能量傳入該共振腔體中而產生該駐波;以及一發聲單元,整合於該共振腔體,其中該共振腔體用以依據該駐波而放大該發聲單元之聲音音量。 A cooling fan device is applied to a computer device, comprising: a fan unit for introducing air to dissipate heat for the computer device; and a resonant cavity body combined with the fan unit for generating according to the operation of the fan unit a standing wave, and the resonant cavity includes a Helmholtz resonant cavity and a resonant film; a venting cavity is coupled to the fan unit and the resonant cavity, wherein the fan unit passes through the venting cavity When the body is in the air, the resonant film of the resonant cavity is used to generate the standing wave when the air vibration energy generated by the fan unit is discharged into the resonant cavity; and a sounding unit is integrated The resonant cavity, wherein the resonant cavity is configured to amplify the sound volume of the sounding unit according to the standing wave. 如請求項1所述之散熱風扇裝置,其中該共振腔體用以依據該駐波之頻率而放大該發聲單元之相應頻率區段的聲音音量。 The heat dissipation fan device of claim 1, wherein the resonant cavity is configured to amplify a sound volume of a corresponding frequency section of the sounding unit according to a frequency of the standing wave. 如請求項1所述之散熱風扇裝置,其中該共振腔體包含一剛體結構。 The cooling fan device of claim 1, wherein the resonant cavity comprises a rigid body structure. 如請求項3所述之散熱風扇裝置,其中該共振腔體包含金屬材質、陶瓷材質、塑料材質以及木材材質其中之一者。 The cooling fan device of claim 3, wherein the resonant cavity comprises one of a metal material, a ceramic material, a plastic material, and a wood material. 一種音量調整方法,應用於一散熱風扇裝置,其中該散熱風扇裝置包含一風扇單元、一共振腔體以及一發聲單元,且該共振腔體包含一亥姆霍茲共振腔以及一共振膜,其中該共振腔體與該風扇單元結合,該發聲單元整合於該共振腔體,該音量調節方法包含:當透過該風扇單元以進行出風時,透過該共振腔體中的該共振膜以將該風扇單元出風時所產生的空氣振動能量傳入該共振腔體中而產生一駐波;以及透過該共振腔體依據該駐波而放大該發聲單元之聲音音量。 A volume adjustment method is applied to a cooling fan device, wherein the cooling fan device comprises a fan unit, a resonant cavity and a sounding unit, and the resonant cavity comprises a Helmholtz resonant cavity and a resonant film, wherein The resonant cavity is coupled to the fan unit, and the sounding unit is integrated in the resonant cavity. The volume adjustment method includes: when the fan unit is ventilated to transmit air, the resonant film in the resonant cavity is passed to The air vibration energy generated when the fan unit is out of the air is transmitted into the resonant cavity to generate a standing wave; and the sound volume of the sounding unit is amplified according to the standing wave through the resonant cavity. 如請求項5所述之音量調整方法,其中透過該共振腔體依據該駐波而放大該發聲單元之聲音音量包含:透過該共振腔體依據該駐波之頻率而放大該發聲單元之相應頻率區段的聲音音量。 The volume adjustment method of claim 5, wherein amplifying the sound volume of the sounding unit according to the standing wave through the resonant cavity comprises: amplifying, by the resonant cavity, a corresponding frequency of the sounding unit according to a frequency of the standing wave The volume of the sound of the section.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714014A (en) * 2008-10-08 2010-05-26 英业达股份有限公司 Computer system and method for reducing computer system noise
TWM509272U (en) * 2015-05-08 2015-09-21 Acer Inc Fan module
TWM531989U (en) * 2016-06-01 2016-11-11 宏碁股份有限公司 Fan module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714014A (en) * 2008-10-08 2010-05-26 英业达股份有限公司 Computer system and method for reducing computer system noise
TWM509272U (en) * 2015-05-08 2015-09-21 Acer Inc Fan module
TWM531989U (en) * 2016-06-01 2016-11-11 宏碁股份有限公司 Fan module

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