TWI619849B - Rinse solution for silica thin film, silica thin film and method of producing the same - Google Patents

Rinse solution for silica thin film, silica thin film and method of producing the same Download PDF

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TWI619849B
TWI619849B TW104125161A TW104125161A TWI619849B TW I619849 B TWI619849 B TW I619849B TW 104125161 A TW104125161 A TW 104125161A TW 104125161 A TW104125161 A TW 104125161A TW I619849 B TWI619849 B TW I619849B
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cerium oxide
oxide film
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任浣熙
鄭日
高尙蘭
金佑翰
金哈娜
尹熙燦
李漢松
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三星Sdi 股份有限公司
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Abstract

本發明涉及一種二氧化矽薄膜用的沖洗溶液、二氧化矽薄膜及其生產方法。所述二氧化矽薄膜用的沖洗溶液包含:三甲基苯、二乙基苯、茚滿、茚、叔丁基甲苯、甲基萘、包含具有12個或12個以上的碳的芳香烴的混合物、包含具有12個或12個以上的碳的脂肪烴的混合物、包含含有苯基和氧原子的雜烴化合物的混合物、或其組合。本發明的用於二氧化矽薄膜的沖洗溶液能夠徹底剝離二氧化矽薄膜的界面區域。 The present invention relates to a rinsing solution for a cerium oxide film, a cerium oxide film, and a method for producing the same. The rinsing solution for the cerium oxide film comprises: trimethylbenzene, diethylbenzene, indane, fluorene, tert-butyltoluene, methylnaphthalene, and an aromatic hydrocarbon having 12 or more carbons. A mixture, a mixture comprising an aliphatic hydrocarbon having 12 or more carbons, a mixture comprising a heterohydrocarbon compound containing a phenyl group and an oxygen atom, or a combination thereof. The rinsing solution for the cerium oxide film of the present invention can completely peel off the interface region of the cerium oxide film.

Description

二氧化矽薄膜用的沖洗溶液及其生產方法 Flushing solution for ruthenium dioxide film and production method thereof

本申請案主張在2014年12月16日在韓國智慧財產局提出申請的韓國專利申請第10-2014-0181864號的優先權及權利和在2015年6月4日在韓國智慧財產局提出申請的韓國專利申請第10-2015-0079441號的優先權及權利,所述韓國專利申請的全部內容併入本案供參考。 This application claims the priority and rights of Korean Patent Application No. 10-2014-0181864 filed on December 16, 2014 in the Korea Intellectual Property Office and filed with the Korea Intellectual Property Office on June 4, 2015. The priority and the rights of the Korean Patent Application No. 10-2015-0079441, the entire contents of which are hereby incorporated by reference.

本發明涉及一種用於二氧化矽薄膜的沖洗溶液、一種形成二氧化矽薄膜的方法和一種二氧化矽薄膜。 The present invention relates to a rinsing solution for a cerium oxide film, a method of forming a cerium oxide film, and a cerium oxide film.

二氧化矽被用作在具有凹凸表面的基板上進行塗佈的材料,並且經過加熱後對基板上的凹槽進行縫隙填充並由此使表面平坦化。由此種二氧化矽材料形成的二氧化矽薄膜廣泛用作例如半導體裝置(例如LSI、TFT液晶顯示器(liquid crystal display,LCD)等)的層間絕緣層、平坦化層、鈍化膜、裝置絕緣夾層等。 具體而言,二氧化矽薄膜作為絕緣層用於STI、ILD和IMD層等。淺溝槽隔離(Shallow Trench Isolation,STI)層用於恰當地分離集成電路(integrated circuit,IC)中的諸如晶體管等裝置,並且是藉由在半導體基板上形成溝槽之後用絕緣材料填充溝槽來形成。此種被填充的溝槽會調節主動區域(active region)的大小和設置。另外,二氧化矽薄膜包括在ILD和IMD區域中形成的層間絕緣層。為形成這些STI、ILD和IMD絕緣層,可藉由以矽類塗層的組成填充集成電路(IC)中的間隙和層來形成二氧化矽膜。當在半導體裝置等中形成二氧化矽膜時,通常藉由以下方法來形成二氧化矽膜。在基板上旋轉塗佈氫化聚矽氧氮烷溶液,其中必要時所述基板上形成有半導體、導線和電極等,且其具有階差(step difference)或無階差,並且加熱經塗佈的基板以除去溶劑,且接著在大於或等於特定溫度下進行烘烤以使氫化聚矽氧氮烷轉化成二氧化矽膜,且使用此二氧化矽膜作為層間絕緣層、平坦化層、鈍化膜、裝置絕緣夾層等。一般而言,藉由旋轉塗佈或狹縫塗佈方法在基板上塗佈含矽(Si)溶液來形成二氧化矽薄膜,而且在本文中,可在基板周圍形成珠粒,或可將含矽溶液塗敷到基板的背面上。因此,可使用沖洗溶液來剝離塗敷在無意區域(unintentional region)中的二氧化矽,但存在未徹底除去界面上的二氧化矽或在剝離區域(stripped region)周圍留下少量二氧化矽的問題。已提出了對於此問題的解決方案(韓國專利公開公報第2004-0068989號),但二氧化矽被剝離的一個區域以及二氧化矽未被剝離的另一區域之間的階差仍需改善。 Cerium dioxide is used as a material for coating on a substrate having a concave-convex surface, and after heating, gaps are filled in the grooves on the substrate and thereby planarize the surface. The ceria film formed from such a ceria material is widely used as an interlayer insulating layer, a planarization layer, a passivation film, and an insulating interlayer of a device such as a semiconductor device (for example, an LSI, a TFT liquid crystal display, or the like). Wait. Specifically, a ceria film is used as an insulating layer for STI, ILD, IMD layers, and the like. A shallow trench isolation (STI) layer is used to properly separate devices such as transistors in an integrated circuit (IC), and the trench is filled with an insulating material after forming a trench on the semiconductor substrate. To form. This filled trench adjusts the size and settings of the active region. In addition, the ruthenium dioxide film includes an interlayer insulating layer formed in the ILD and IMD regions. To form these STI, ILD, and IMD insulating layers, the hafnium oxide film can be formed by filling the gaps and layers in the integrated circuit (IC) with a composition of the hafnium coating. When a hafnium oxide film is formed in a semiconductor device or the like, a hafnium oxide film is usually formed by the following method. Rotating a hydrogenated polyoxazane solution on a substrate, wherein a semiconductor, a wire, an electrode, and the like are formed on the substrate as necessary, and it has a step difference or no step, and heats the coated Substrate to remove solvent, and then baked at a temperature greater than or equal to a specific temperature to convert the hydrogenated polyoxazane to a ruthenium dioxide film, and use the ruthenium dioxide film as an interlayer insulating layer, a planarization layer, a passivation film , device insulation interlayer, etc. In general, a ruthenium (Si)-containing solution is coated on a substrate by a spin coating or a slit coating method to form a ruthenium dioxide film, and in this case, beads may be formed around the substrate, or may be included The ruthenium solution is applied to the back side of the substrate. Therefore, a rinsing solution can be used to peel off the cerium oxide coated in the unintentional region, but there is a possibility that the cerium oxide at the interface is not completely removed or a small amount of cerium oxide is left around the stripped region. problem. A solution to this problem has been proposed (Korean Patent Publication No. 2004-0068989), but the step between the region in which the cerium oxide is peeled off and the other region in which the cerium oxide is not peeled off still needs to be improved.

一個實施例提供一種用於二氧化矽薄膜的沖洗溶液,其能夠徹底剝離二氧化矽薄膜的界面區域。 One embodiment provides a rinsing solution for a ruthenium dioxide film that is capable of completely stripping the interface region of the ruthenium dioxide film.

另一個實施例提供一種使用所述用於二氧化矽薄膜的沖洗溶液生產二氧化矽薄膜的方法。 Another embodiment provides a method of producing a ruthenium dioxide film using the rinsing solution for a ruthenium dioxide film.

又一個實施例提供一種使用所述用於二氧化矽薄膜的沖洗溶液生產而成的二氧化矽薄膜。 Yet another embodiment provides a cerium oxide film produced using the rinsing solution for a cerium oxide film.

根據一個實施例,用於二氧化矽薄膜的沖洗溶液包含三甲基苯(trimethylbenzene)、二乙基苯、茚滿(indane)、茚(indene)、甲基苯甲醚(methylanisole)、叔丁基甲苯(tert-butyl toluene)、含有具有12個或12個以上的碳的芳香烴的混合物、含有具有12個或12個以上的碳的脂肪烴的混合物、包含含有苯基和氧原子的雜烴化合物的混合物、或其組合。 According to one embodiment, the rinsing solution for the cerium oxide film comprises trimethylbenzene, diethylbenzene, indane, indene, methylanisole, tert-butyl Tert-butyl toluene, a mixture containing aromatic hydrocarbons having 12 or more carbons, a mixture containing aliphatic hydrocarbons having 12 or more carbons, containing impurities containing phenyl and oxygen atoms a mixture of hydrocarbon compounds, or a combination thereof.

所述二氧化矽薄膜可包括氫化聚矽氮烷(hydrogenated polysilazane)、氫化聚矽氧氮烷(hydrogenated polysiloxazane)、或其組合。 The cerium oxide film may include hydrogenated polysilazane, hydrogenated polysiloxazane, or a combination thereof.

所述用於二氧化矽薄膜的沖洗溶液可包含含有C12至C30芳香烴的混合物、含有C12至C30脂肪烴的混合物、或其組合。 The rinsing solution for the cerium oxide film may comprise a mixture comprising a C12 to C30 aromatic hydrocarbon, a mixture comprising a C12 to C30 aliphatic hydrocarbon, or a combination thereof.

包括雜烴化合物的混合物可包括大於或等於約10wt%且小於或等於約70wt%的包括苯基和氧原子的雜烴化合物。 The mixture including the heterohydrocarbon compound may include greater than or equal to about 10% by weight and less than or equal to about 70% by weight of a heterohydrocarbon compound including a phenyl group and an oxygen atom.

所述含有苯基和氧原子的雜烴化合物的結構中可包含醚、醛、醇、酮、或其組合。 The structure of the hetero hydrocarbon compound containing a phenyl group and an oxygen atom may include an ether, an aldehyde, an alcohol, a ketone, or a combination thereof.

所述含有苯基和氧原子的雜烴化合物可包含甲基苯甲醚、 二苯基醚、苯甲酸丁酯、丁基苯基醚、烯丙基甲基苯酚、異丁基苯基丙醛(isobutylphenyl propionaldehyde)、苯基環己酮、或其組合。 The hetero hydrocarbon compound containing a phenyl group and an oxygen atom may comprise methyl anisole, Diphenyl ether, butyl benzoate, butyl phenyl ether, allyl methyl phenol, isobutyl phenyl propionaldehyde, phenylcyclohexanone, or a combination thereof.

根據另一實施例,一種生產二氧化矽薄膜的方法包括:在基板上塗佈含矽溶液;且在塗佈有所述含矽溶液的基板上局部地噴射所述用於二氧化矽薄膜的沖洗溶液。 According to another embodiment, a method of producing a ruthenium dioxide film includes: coating a ruthenium-containing solution on a substrate; and locally spraying the ruthenium dioxide film on the substrate coated with the ruthenium-containing solution Rinse the solution.

根據又一個實施例,提供一種使用所述用於二氧化矽薄膜的沖洗溶液生產而成的二氧化矽薄膜。 According to still another embodiment, a ruthenium dioxide film produced using the rinsing solution for a ruthenium dioxide film is provided.

所述二氧化矽薄膜可具有根據以下計算公式1測量的小於或等於約400nm的階差(ΔT)。 The ruthenium dioxide film may have a step (ΔT) of less than or equal to about 400 nm measured according to the following calculation formula 1.

[計算公式1]階差(ΔT)=(在二氧化矽薄膜的一末端與距此10mm處的點之間測量的所述二氧化矽薄膜的最大厚度)-(在距離所述二氧化矽薄膜的所述末端10mm處的點測量的二氧化矽薄膜的厚度)。 [Calculation Formula 1] Step difference (ΔT) = (maximum thickness of the ceria film measured between one end of the ceria film and a point at 10 mm therefrom) - (at a distance from the ceria The thickness of the cerium oxide film measured at a point of 10 mm at the end of the film).

所述用於二氧化矽薄膜的沖洗溶液可藉由減少沖洗溶液中包含的水分和雜質來徹底地剝離二氧化矽薄膜的界面區域,而不影響其薄膜特性。 The rinsing solution for the cerium oxide film can completely peel off the interface region of the cerium oxide film by reducing the moisture and impurities contained in the rinsing solution without affecting the film characteristics.

ΔT‧‧‧階差 ΔT‧‧‧ step

圖1顯示一種評估用於二氧化矽薄膜的沖洗溶液的剝離特性的方法。 Figure 1 shows a method for evaluating the peeling characteristics of a rinsing solution for a cerium oxide film.

下文詳細描述本發明的實施例。然而,這些實施例是實例 性的,而不限制本發明,且本發明由後述申請專利範圍的範疇來界定。 Embodiments of the invention are described in detail below. However, these embodiments are examples The invention is not limited by the scope of the invention, and the invention is defined by the scope of the appended claims.

如本文所用,當未另外提供定義時,術語“經取代”指的是經選自鹵素原子(F、Cl、Br或I)、羥基、硝基、氰基、亞氨基(=NH、=NR,R是C1至C10烷基)、氨基(-NH2、-NH(R')、-N(R”)(R”'),其中R'至R”'獨立地是C1至C10烷基)、脒基、肼或腙基、羧基、C1至C10烷基、C6至C20芳基、C3至C20環烷基、C1至C10雜烷基、C3至20雜芳基和C2至C20雜環烷基中的至少一個取代基取代以代替官能基中的一個氫原子,經選自=O、=S、=NR(R是C1至C10烷基)、=PR(R是C1至C10烷基)和=SiRR'(R和R'獨立地是C1至C10烷基)中的至少一個取代基取代以代替官能基中的兩個氫原子,或經選自≡N、≡P和≡SiR(R是C1至C10烷基)中的至少一個取代基取代以代替官能基中的三個氫原子。 As used herein, when a definition is not otherwise provided, the term "substituted" means selected from a halogen atom (F, Cl, Br or I), a hydroxyl group, a nitro group, a cyano group, an imino group (=NH, =NR). , R is a C1 to C10 alkyl group, an amino group (-NH 2 , -NH(R'), -N(R")(R"'), wherein R' to R"' are independently a C1 to C10 alkyl group , fluorenyl, hydrazine or fluorenyl, carboxy, C1 to C10 alkyl, C6 to C20 aryl, C3 to C20 cycloalkyl, C1 to C10 heteroalkyl, C3 to 20 heteroaryl and C2 to C20 heterocycle At least one substituent in the alkyl group is substituted in place of one hydrogen atom in the functional group, selected from =O, =S, =NR (R is a C1 to C10 alkyl group), =PR (R is a C1 to C10 alkyl group) And at least one substituent of =SiRR' (R and R' are independently a C1 to C10 alkyl group) substituted in place of two hydrogen atoms in the functional group, or selected from the group consisting of ≡N, ≡P and ≡SiR ( R is substituted with at least one substituent in the C1 to C10 alkyl group to replace three hydrogen atoms in the functional group.

如本文所用,應理解,當提到諸如層、膜、區域或基板等元件在另一元件“上”時,其可以是直接位於另一元件上,或者也可以存在中間元件。 As used herein, when an element such as a layer, a film, a region or a substrate is referred to as being "on" another element, it may be directly on the other element or the intermediate element may be present.

下文描述根據一個實施例的一種用於二氧化矽薄膜的沖洗溶液。 A rinsing solution for a cerium oxide film according to one embodiment is described below.

根據一個實施例的一種用於二氧化矽薄膜的沖洗溶液包含三甲基苯、二乙基苯、茚滿、茚、叔丁基甲苯、甲基萘(methylnaphthalene)、包含具有12個或12個以上的碳的芳香烴的混合物、包含具有12個或12個以上的碳的脂肪烴的混合物、和包含含有苯基和氧原子的雜烴化合物的混合物、或其組合。 A rinsing solution for a cerium oxide film according to an embodiment comprises trimethylbenzene, diethylbenzene, indane, hydrazine, tert-butyltoluene, methylnaphthalene, and has 12 or 12 A mixture of the above aromatic hydrocarbons of carbon, a mixture comprising aliphatic hydrocarbons having 12 or more carbons, and a mixture comprising a heterohydrocarbon compound containing a phenyl group and an oxygen atom, or a combination thereof.

所述化合物可具有經取代或未經取代的結構。 The compound may have a substituted or unsubstituted structure.

此處,術語“混合物”指的是兩個或大於兩個化合物的組合,且所述兩個或大於兩個化合物可以是相同或不同的。 Here, the term "mixture" refers to a combination of two or more than two compounds, and the two or more than two compounds may be the same or different.

所述二氧化矽薄膜可包含氫化聚矽氮烷、氫化聚矽氧氮烷、或其組合,例如可藉由在基板上塗佈含有全氫聚矽氮烷的溶液並使其固化來形成。 The ceria film may comprise a hydrogenated polyazane, a hydrogenated polyoxazane, or a combination thereof, for example, by coating a solution containing perhydropolyazane on a substrate and curing it.

然而,在二氧化矽薄膜形成期間需要從基板剝離局部地且不必要地形成的二氧化矽膜,而且在本文中,沖洗溶液對二氧化矽膜具有令人滿意的溶解和切邊(edge-cutting)性質,且因此在塗敷至二氧化矽膜時可使二氧化矽膜被剝離的一個區域與二氧化矽膜未被剝離的另一區域之間的階差急劇減小。 However, it is necessary to peel off the locally and unnecessarily formed ceria film from the substrate during the formation of the ceria film, and here, the rinsing solution has satisfactory dissolution and trimming of the ceria film (edge- The nature of the cutting, and thus the step between the one region where the ceria film is peeled off and the other region where the ceria film is not peeled off, is sharply reduced when applied to the ceria film.

包含具有12個或12個以上的碳的芳香烴的混合物可例如包括C12至C30芳香烴,且包含具有12個或12個以上的碳的脂肪烴的混合物可包括C12至C30脂肪烴,但不限於此。 A mixture comprising an aromatic hydrocarbon having 12 or more carbons may, for example, comprise a C12 to C30 aromatic hydrocarbon, and a mixture comprising an aliphatic hydrocarbon having 12 or more carbons may include a C12 to C30 aliphatic hydrocarbon, but not Limited to this.

包括雜烴化合物的混合物可包括大於或等於約10wt%且小於或等於約70wt%的包括苯基和氧原子的雜烴化合物。 The mixture including the heterohydrocarbon compound may include greater than or equal to about 10% by weight and less than or equal to about 70% by weight of a heterohydrocarbon compound including a phenyl group and an oxygen atom.

含有苯基和氧原子的雜烴化合物的結構中可含有苯基和含氧部分(oxygen-containing moiety),例如醚、醛、醇、酮、或其組合。 The heterohydrocarbon compound containing a phenyl group and an oxygen atom may have a structure including a phenyl group and an oxygen-containing moiety such as an ether, an aldehyde, an alcohol, a ketone, or a combination thereof.

舉例而言,含有苯基和氧原子的雜烴化合物可包含甲基苯甲醚、二苯基醚、苯甲酸丁酯、丁基苯基醚、烯丙基甲基苯酚、異丁基苯基丙醛、苯基環己酮、或其組合,但不限於此。 For example, a heterohydrocarbon compound containing a phenyl group and an oxygen atom may include methyl anisole, diphenyl ether, butyl benzoate, butyl phenyl ether, allyl methyl phenol, isobutyl phenyl. Propionaldehyde, phenylcyclohexanone, or a combination thereof, but is not limited thereto.

在用於二氧化矽薄膜的沖洗溶液中,基於沖洗溶液混合物的總量計,可以大於或等於約10wt%且小於或等於約70wt%的 量包含含有苯基和氧原子的雜烴化合物。在此情形中,可改善二氧化矽薄膜的階差特性。 In the rinsing solution for the cerium oxide film, based on the total amount of the rinsing solution mixture, it may be greater than or equal to about 10% by weight and less than or equal to about 70% by weight. The amount includes a heterohydrocarbon compound containing a phenyl group and an oxygen atom. In this case, the step characteristics of the ruthenium dioxide film can be improved.

根據一個實施例,所述用於二氧化矽薄膜的沖洗溶液以慢的速度膠凝,且因此顯示出令人滿意的存儲穩定性以及最小化對薄膜特性的影響,並且徹底地剝離二氧化矽薄膜的界面。 According to one embodiment, the rinsing solution for the cerium oxide film is gelled at a slow rate, and thus exhibits satisfactory storage stability and minimizes the influence on the film characteristics, and thoroughly strips the cerium oxide. The interface of the film.

所述用於二氧化矽薄膜的沖洗溶液的水分含量可例如小於或等於約150ppm,且特別是小於或等於約100ppm。 The rinsing solution for the cerium oxide film may have a moisture content of, for example, less than or equal to about 150 ppm, and particularly less than or equal to about 100 ppm.

根據另一實施例,一種生產二氧化矽薄膜的方法包括:製備基板;在基板上塗佈含矽溶液;且在塗佈有含矽溶液的基板上局部地噴射所述用於二氧化矽薄膜的沖洗溶液。 According to another embodiment, a method of producing a ruthenium dioxide film includes: preparing a substrate; coating a ruthenium-containing solution on the substrate; and locally spraying the ruthenium dioxide film on the substrate coated with the ruthenium-containing solution Flushing solution.

基板的材料不受特別限制,且例如可為矽晶圓。另外,基板在形狀方面無特別限制,且可具有諸如板、膜等形狀以及各種表面,諸如平坦表面、凹凸表面或彎曲表面而不受特別限制。 The material of the substrate is not particularly limited, and may be, for example, a germanium wafer. In addition, the substrate is not particularly limited in shape, and may have a shape such as a plate, a film, or the like, and various surfaces such as a flat surface, a concave-convex surface, or a curved surface without being particularly limited.

含矽溶液可包含含矽化合物和溶劑,所述含矽化合物例如氫化聚矽氮烷、氫化聚矽氧氮烷、或其組合。含矽化合物的性質不受特別限制,且可具有例如約1,000至約200,000的重量平均分子量、約0.2wt%至約3wt%的氧含量、SiH3基團相對於總SiH基團的比率為15mol%至35mol%,且氯含量小於或等於約1ppm。 The cerium-containing solution may comprise a cerium-containing compound such as a hydrogenated polyazane, a hydrogenated polyoxazane, or a combination thereof, and a solvent. The nature of the cerium-containing compound is not particularly limited, and may have, for example, a weight average molecular weight of from about 1,000 to about 200,000, an oxygen content of from about 0.2% by weight to about 3% by weight, and a ratio of SiH 3 groups to total SiH groups of 15 moles. % to 35 mol% and a chlorine content of less than or equal to about 1 ppm.

可藉由任何熟知的方法來塗佈含矽溶液,例如旋轉塗佈、噴塗(spray coating)、流塗(flow coating)、輥塗(roller coating)、浸塗(dip coating)、擦拭(wiping)、海綿擦拭等,但本發明不限於此。 The cerium-containing solution can be applied by any well-known method, such as spin coating, spray coating, flow coating, roller coating, dip coating, wiping. , sponge wiping, etc., but the invention is not limited thereto.

可在以約500rpm至4,000rpm的速度旋轉塗佈有含矽溶液的基板的同時,在存在欲去除沖洗溶液的組件的區域(例如基板 的邊緣和背面)進行用於二氧化矽薄膜的沖洗溶液的噴射。 The substrate coated with the ruthenium-containing solution may be rotated at a speed of about 500 rpm to 4,000 rpm, in the region where the component to be removed the rinsing solution is present (for example, the substrate The edges and the back side are sprayed with a rinsing solution for the cerium oxide film.

根據一個實施例,提供一種使用所述用於二氧化矽薄膜的沖洗溶液生產而成的二氧化矽薄膜。所述二氧化矽薄膜可用於半導體裝置、顯示裝置等的絕緣層、平坦化層、鈍化層、裝置絕緣夾層。 According to one embodiment, a ruthenium dioxide film produced using the rinsing solution for a ruthenium dioxide film is provided. The ceria film can be used for an insulating layer, a planarization layer, a passivation layer, and a device insulating interlayer of a semiconductor device, a display device, or the like.

所述二氧化矽薄膜在其界面上具有優良的剝離特性,且可具有例如根據以下計算公式1測量的小於或等於約400nm的階差(ΔT)。 The ceria film has excellent peeling characteristics at its interface, and may have a step (ΔT) of less than or equal to about 400 nm measured, for example, according to the following calculation formula 1.

[計算公式1]階差(ΔT)=(在二氧化矽薄膜的一末端與距此10mm處的點之間測量的所述二氧化矽薄膜的最大厚度)-(在距離所述二氧化矽薄膜的一末端10mm處的點測量的所述二氧化矽薄膜的厚度)。 [Calculation Formula 1] Step difference (ΔT) = (maximum thickness of the ceria film measured between one end of the ceria film and a point at 10 mm therefrom) - (at a distance from the ceria The thickness of the ruthenium dioxide film was measured at a point at 10 mm from one end of the film).

下文將參考實例更詳細地說明本發明。然而,這些實例只是實例性的,且本發明不限於此。 The invention will be explained in more detail below with reference to examples. However, these examples are merely exemplary, and the invention is not limited thereto.

合成實例:合成含矽化合物Synthesis example: synthesis of ruthenium containing compounds

以乾燥的氮氣置換配備有2L攪拌器和溫度控制器的反應器的內部氣氛。將1,500g乾吡啶放入反應器中,且隨後在20℃下對反應器進行加溫。接著經一小時向其中緩慢注入100g二氯矽烷。接著,經3小時向其中緩慢注入70g氨,同時攪拌反應器。隨後,經30分鐘向其中注入乾燥氮氣,並除去反應器中剩餘的氨。在乾燥氮氣氣氛下藉由1μm的特氟龍(Teflon)過濾器過濾所獲得的白色漿料相(slurry-phased)產物,從而獲得1,000g的過濾溶液。隨後,向其中加入1,000g乾二甲苯,藉由使用旋轉式蒸發器將混合物的溶劑從吡啶替代為二甲苯三次來將其濃度調整至20 wt%,並藉由孔徑為0.03μm的特氟龍過濾器過濾濃縮產物。所獲得的全氫聚矽氮烷的氧含量為3.8%,SiH3/SiH(總)為0.22、重量平均分子量為4,000,且氯含量為0.9ppm。 The internal atmosphere of the reactor equipped with a 2 L stirrer and a temperature controller was replaced with dry nitrogen. 1,500 g of dry pyridine was placed in the reactor, and then the reactor was warmed at 20 °C. Then, 100 g of dichlorosilane was slowly injected thereto over one hour. Next, 70 g of ammonia was slowly injected thereto over 3 hours while stirring the reactor. Subsequently, dry nitrogen gas was injected thereto over 30 minutes, and the remaining ammonia in the reactor was removed. The obtained white-slurry-phased product was filtered through a 1 μm Teflon filter under a dry nitrogen atmosphere to obtain 1,000 g of a filtered solution. Subsequently, 1,000 g of dry xylene was added thereto, and the concentration of the mixture was adjusted to 20 wt% by substituting the solvent of the mixture from pyridine to xylene using a rotary evaporator, and Teflon was passed through a pore size of 0.03 μm. The filter was filtered to concentrate the product. The perhydropolyazane obtained had an oxygen content of 3.8%, SiH 3 /SiH (total) of 0.22, a weight average molecular weight of 4,000, and a chlorine content of 0.9 ppm.

實例1至實例11和對照實例1至對照實例4:用於二氧化矽薄膜的沖洗溶液Examples 1 to 11 and Comparative Example 1 to Comparative Example 4: a rinsing solution for a cerium oxide film

製備具有下表1中的組成的用於二氧化矽薄膜的沖洗溶液。 A rinsing solution for a cerium oxide film having the composition in Table 1 below was prepared.

評估1:評估殘留膜和階差特性Assessment 1: Evaluation of residual film and step characteristics

將根據合成實例的化合物與二正丁基醚(di-n-butylether)溶劑混合,從而製備含矽溶液(20wt%)。將3cc的含矽溶液置於旋轉塗佈機中並以1500rpm的旋轉速度在具有8英寸直徑的裸矽晶圓中心塗佈20秒鐘,從而形成約500nm厚的膜。接著,將根據實例1至實例11和對照實例1至對照實例4的每種用於二氧化矽薄膜的沖洗溶液以10ml/min的流動速率從距離晶圓外圓周約3mm的上方位置噴射5秒鐘。隨後,將經塗佈的晶圓在150℃的熱板上加熱並乾燥3分鐘。 A hydrazine-containing solution (20% by weight) was prepared by mixing a compound according to the synthesis example with a di-n-butylether solvent. A 3 cc cerium-containing solution was placed in a spin coater and coated at a center of a bare enamel wafer having an 8 inch diameter at a rotational speed of 1500 rpm for 20 seconds to form a film of about 500 nm thick. Next, each of the rinsing solutions for the cerium oxide film according to Examples 1 to 11 and Comparative Example 1 to Comparative Example 4 was sprayed at a flow rate of 10 ml/min from an upper position of about 3 mm from the outer circumference of the wafer for 5 seconds. bell. Subsequently, the coated wafer was heated on a hot plate at 150 ° C and dried for 3 minutes.

評估由以上過程獲得的二氧化矽薄膜的剝離特性。 The peeling characteristics of the ceria film obtained by the above process were evaluated.

圖1是顯示在矽晶圓上的二氧化矽薄膜上噴射沖洗溶液後,二氧化矽薄膜的狀態的視圖,將參考圖1來說明一種評估所述用於二氧化矽薄膜的沖洗溶液的剝離特性的方法。 1 is a view showing a state of a ruthenium dioxide film after spraying a rinsing solution on a ruthenium dioxide film on a ruthenium wafer, and an evaluation of the delamination of the rinsing solution for a ruthenium dioxide film will be described with reference to FIG. The method of the feature.

參見圖1,二氧化矽薄膜的末端變成凸的且產生階差(ΔT),並除去了用於剝落的部分(即距離晶圓外圓周區域3mm的膜)來檢查是否有殘留的膜。 Referring to Fig. 1, the end of the ceria film becomes convex and produces a step (ΔT), and the portion for peeling off (i.e., a film 3 mm from the outer circumferential area of the wafer) is removed to check whether there is a residual film.

使用XE300(帕克系統公司(PARK Systems))和SEM S- 4800(2型(Type-2),日立股份有限公司(Hitachi Ltd.))作為光譜反射膜測厚儀並從晶圓外圓周區域掃描至約10mm處來測量階差(ΔT)(在ΔT周圍使用SEM),並且使用光學顯微鏡LV100D(尼康股份有限公司(Nikon Inc.))和光譜反射膜測厚儀ST-4000(K-MAC)來檢查在用於剝落的部分中是否存在膜殘留。 Use XE300 (PARK Systems) and SEM S- 4800 (Type-2), Hitachi Ltd.) as a spectral reflection film thickness gauge and scanned from the outer circumferential area of the wafer to approximately 10 mm to measure the step (ΔT) (around ΔT) SEM) was used, and an optical microscope LV100D (Nikon Inc.) and a spectral reflection film thickness gauge ST-4000 (K-MAC) were used to check whether or not film residue was present in the portion for peeling.

評估2:膠凝天數Assessment 2: Gelation days

在100g的玻璃瓶中放入2.3g的含矽溶液和23g的在評估1中所用的根據實例1至實例11和對照實例1至對照實例4的每種用於二氧化矽薄膜的沖洗溶液並將其混合,隨後使其在瓶蓋開啟的狀態下在22℃、50%的相對濕度(RH)下靜置,並藉由裸眼檢查混合物開始膠凝的天數。 2.3 g of a ruthenium-containing solution and 23 g of each of the rinsing solutions for the cerium oxide film according to Examples 1 to 11 and Comparative Example 1 to Comparative Example 4 used in Evaluation 1 were placed in a 100 g glass bottle. They were mixed, and then allowed to stand at 22 ° C, 50% relative humidity (RH) with the cap open, and the number of days from which the mixture began to gel by the naked eye.

下表1中提供評估1至評估2的結果。 The results of Evaluation 1 to Evaluation 2 are provided in Table 1 below.

* D110(東成高化學股份有限公司(Dongsung Highchem Co.,Ltd.)):包含大於或等於C12脂肪族化合物的混合物 * D110 (Dongsung Highchem Co., Ltd.): a mixture containing greater than or equal to C12 aliphatic compound

* ISOLEC(硫石油公司(S-oil Corp.)):包含大於或等於C12芳香族化合物的混合物 * ISOLEC (S-oil Corp.): a mixture containing greater than or equal to C12 aromatic compounds

* K600ND(SKC公司(SKC Inc.)):(i)大於或等於C11芳香族化合物與(ii)含有苯基和醚/醛的化合物的混合物。K600ND包含大於或等於約10wt%且小於或等於約70wt%的含有苯基和醚/醛的化合物。 * K600ND (SKC Inc.): (i) a mixture of greater than or equal to the C11 aromatic compound and (ii) a compound containing a phenyl group and an ether/aldehyde. K600ND comprises greater than or equal to about 10% by weight and less than or equal to about 70% by weight of a compound comprising a phenyl group and an ether/aldehyde.

參考表1,與對照實例相比,使用根據本發明一個實施例的沖洗溶液的實例顯示出減小的膜階差,而且當在外圓周區域切割時,不存在膜殘留。另外,使用根據本發明一個實施例的沖洗溶液的實例顯示出優良的存儲穩定性。 Referring to Table 1, an example of using a rinsing solution according to an embodiment of the present invention showed a reduced film step difference as compared with the comparative example, and when dicing in the outer circumferential region, there was no film residue. In addition, an example of using a rinsing solution according to an embodiment of the present invention shows excellent storage stability.

儘管已結合目前被認為可行的實例性實施例描述了本發明,但應理解,本發明不限於所公開的實施例,而是相反,本發明旨在涵蓋在隨附申請專利範圍的精神和範疇內所包含的各種修改和等效配置。 Although the present invention has been described in connection with the exemplary embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, but rather, the invention is intended to cover the spirit and scope of the appended claims Various modifications and equivalent configurations included.

Claims (5)

一種用於二氧化矽薄膜的沖洗溶液,包含:茚滿、茚、叔丁基甲苯、包含具有12個或12個以上的碳的脂肪烴的混合物、包含含有苯基和氧原子的雜烴化合物的混合物、或其組合,其中含有苯基和氧原子的所述雜烴化合物包含甲基苯甲醚、二苯基醚、丁基苯基醚、烯丙基甲基苯酚、異丁基苯基丙醛、苯基環己酮或其組合。 A rinsing solution for a cerium oxide film, comprising: indane, cerium, tert-butyltoluene, a mixture comprising an aliphatic hydrocarbon having 12 or more carbons, and a heterohydrocarbon compound containing a phenyl group and an oxygen atom Mixture, or a combination thereof, wherein the heterohydrocarbon compound containing a phenyl group and an oxygen atom comprises methyl anisole, diphenyl ether, butyl phenyl ether, allyl methyl phenol, isobutyl phenyl Propionaldehyde, phenylcyclohexanone or a combination thereof. 如申請專利範圍第1項所述的用於二氧化矽薄膜的沖洗溶液,其中二氧化矽薄膜包含氫化聚矽氮烷、氫化聚矽氧氮烷或其組合。 The rinsing solution for a cerium oxide film according to claim 1, wherein the cerium oxide film comprises hydrogenated polyazane, hydrogenated polyoxazane or a combination thereof. 如申請專利範圍第1項所述的用於二氧化矽薄膜的沖洗溶液,其中用於二氧化矽薄膜的所述沖洗溶液包含含有C12至C30芳香烴的混合物、含有C12至C30脂肪烴的混合物或其組合。 The rinsing solution for a cerium oxide film according to claim 1, wherein the rinsing solution for the cerium oxide film comprises a mixture containing a C12 to C30 aromatic hydrocarbon, and a mixture containing a C12 to C30 aliphatic hydrocarbon. Or a combination thereof. 如申請專利範圍第1項所述的用於二氧化矽薄膜的沖洗溶液,其中包含雜烴化合物的所述混合物包含大於或等於10wt%且小於或等於70wt%的含有苯基和氧原子的所述雜烴化合物。 A rinsing solution for a cerium oxide film according to claim 1, wherein the mixture comprising a heterohydrocarbon compound comprises greater than or equal to 10% by weight and less than or equal to 70% by weight of a phenyl group and an oxygen atom. Said heterohydrocarbon compound. 一種生產二氧化矽薄膜的方法,包括:製備基板;在所述基板上塗佈含矽溶液;以及在塗佈有所述含矽溶液的所述基板上局部地噴射如申請專利範圍第1至4項中任一項所述的用於二氧化矽薄膜的沖洗溶液。 A method for producing a ruthenium dioxide film, comprising: preparing a substrate; coating a ruthenium-containing solution on the substrate; and locally spraying the substrate coated with the ruthenium-containing solution as claimed in the first to A rinsing solution for a cerium oxide film according to any one of the items 4.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679923A (en) * 2007-07-05 2010-03-24 日本曹达株式会社 Solvent for cleaning of organic thin film
CN101111575B (en) * 2005-02-02 2010-06-23 Az电子材料(日本)株式会社 Polysilazane-treating solvent and method for treating polysilazane by using such solvent
TW201441365A (en) * 2013-04-18 2014-11-01 Cheil Ind Inc Rinse liquid for insulating layer and method of rinsing insulating layer

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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101111575B (en) * 2005-02-02 2010-06-23 Az电子材料(日本)株式会社 Polysilazane-treating solvent and method for treating polysilazane by using such solvent
CN101679923A (en) * 2007-07-05 2010-03-24 日本曹达株式会社 Solvent for cleaning of organic thin film
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