TWI617854B - 光收發器 - Google Patents

光收發器 Download PDF

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Publication number
TWI617854B
TWI617854B TW106107126A TW106107126A TWI617854B TW I617854 B TWI617854 B TW I617854B TW 106107126 A TW106107126 A TW 106107126A TW 106107126 A TW106107126 A TW 106107126A TW I617854 B TWI617854 B TW I617854B
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Taiwan
Prior art keywords
conductive member
photoelectric conversion
circuit board
conversion module
optical transceiver
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TW106107126A
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English (en)
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TW201833611A (zh
Inventor
林建德
林昌省
賴明佑
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英屬維京群島商祥茂光電科技股份有限公司
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Priority to TW106107126A priority Critical patent/TWI617854B/zh
Priority to US15/880,051 priority patent/US10429600B2/en
Application granted granted Critical
Publication of TWI617854B publication Critical patent/TWI617854B/zh
Publication of TW201833611A publication Critical patent/TW201833611A/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一種光收發器，包含光電轉換模組、中介層板以及電路板。中介層板設置於光電轉換模組。中介層板包含板體以及撓性導電件。撓性導電件設置於板體，且光電轉換模組電性連接於撓性導電件。電路板設置於中介層板的一側，撓性導電件可脫離地抵壓電路板，且撓性導電件與電路板電性連接。

Description

光收發器
本發明係關於一種光收發器，特別是一種具有撓性導電件的光收發器。
在現代高速通訊網路中，一般設有光收發器，而為了界定光收發模組件與對應的插座之間的電氣及機械介面，已提出各種不同的光收發器標準，例如用於10 GB/s通訊速率的XFP(10 Gigabit Small Form Factor Pluggable)標準以及QSFP(Quad Small Form-factor Pluggable)標準等。光收發器一般包含光發射次模組(TOSA，Transmitter of Optical Subassembly)、光接收次模組(ROSA，Receiver Optical Subassembly)與電路板。光發射次模組包含雷射驅動晶片與雷射二極體(LD，Laser Diode)，並且光接收次模組包含轉阻放大器與寬頻檢光二極體(Photo Detector)。
在習知的封裝過程中，光發射次模組、光接收次模組等光電轉換模組能透過多種方式與光收發器的電路板接合，這些方式例如是打線接合、引腳插入、撓性電路軟板轉接或表面黏著技術。然而，上述方式皆有組裝耗時、佔據過多光收發器的內部空間以及不易拆卸等缺點。
鑒於以上的問題，本發明揭露一種光收發器，有助於解決習知接合光電轉換模組與電路板的方式有組裝耗時、佔據過多光收發器的內部空間以及不易拆卸的問題。
本發明所揭露的光收發器包含一光電轉換模組、一中介層板以及一電路板。中介層板設置於光電轉換模組。中介層板包含一板體以及一撓性導電件。撓性導電件設置於板體，且光電轉換模組電性連接於撓性導電件。電路板設置於中介層板的一側，撓性導電件可脫離地抵壓電路板，且撓性導電件與電路板電性連接。
根據本發明所揭露的光收發器，光電轉換模組經由中介層板與撓性導電件電性連接於電路板。由於光電轉換模組沒有焊接或黏合於電路板上，因此光電轉換模組能夠與電路板快速組裝，同時也能夠快速拆卸。此外，由於只需經由中介層板電性連接，因此不需要額外設置撓性電路板等轉接元件。藉此，有助於減少組裝工時，同時達到方便拆卸、避免佔據過多光收發器內部空間的目的。本發明所揭露的光收發器簡化組裝步驟，可提升生產及維修效益。
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理，並且提供本發明之專利申請範圍更進一步之解釋。
以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。
請同時參照圖1和圖2。圖1為根據本發明一實施例之光收發器的立體示意圖。圖2為圖1之光收發器之電子組件的分解示意圖。在本實施例中，光收發器1包含一外殼10以及設置於外殼10內部的一電子組件20。電子組件20包含一光電轉換模組210、至少一中介層板220以及一電路板230。
光電轉換模組210例如為光收發器1的一光發射次模組，但本發明並不以此為限。在其他實施例中，光電轉換模組210可以是光收發器1的光接收次模組。在本實施例中，光電轉換模組210包含一殼體211以及設置於殼體211內的多個光元件212。這些光元件212例如包含多個雷射二極體，或是包含多個透鏡與多個雷射二極體。此外，光電轉換模組210的殼體211具有一第一組裝部211a。
接著請同時參照圖2至圖4。圖3為圖2之電子組件之光電轉換模組的剖切示意圖。圖4為圖1之光收發器之電子組件的剖切示意圖。
中介層板220設置於光電轉換模組210之殼體211。中介層板220包含一板體221、一撓性導電件222以及一導電結構223。中介層板220的板體221具有相對的一頂面221a、一底面221b以及至少一穿孔221c。穿孔221c的相對二端分別連接於頂面221a與底面221b。板體221設置於殼體211內的一容置空間213，且頂面221a面向容置空間213。光元件212電性連接於板體221的頂面221a，且撓性導電件222自殼體211突出於外。
撓性導電件222設置於板體221，且光電轉換模組210經由導電結構223電性連接於撓性導電件222。詳細來說，導電結構223包含一第一水平導電段223a、一第二水平導電段223b以及一垂直導電段223c。第一水平導電段223a設置於板體221的頂面221a，第二水平導電段223b設置於底面221b，並且垂直導電段223c設置於穿孔221c的內壁面。第一水平導電段223a、第二水平導電段223b以及垂直導電段223c相互電性連接。光電轉換模組210的光元件212例如透過打線接合方式電性連接於導電結構223的第一水平導電段223a。
撓性導電件222設置於板體221的底面221b，並且電性連接於導電結構223的第二水平導電段223b。在本實施例中，撓性導電件222包含多個彈片222a。進一步來說，彈片222a皆設置於底面221b，並且未設置於頂面221a。藉此，有助於在中介層板220的上方區域提供充足的容置空間，避免中介層板220組裝於與光電轉換模組210時與光電轉換模組210內部的零件產生干涉。
電路板230設置於中介層板220的一側。在本實施例中，電路板230係為光收發器1中用於連接多個光電轉換模組210的印刷電路板，並且電路板230上設有一個或多個驅動積體晶片。電路板230面向中介層板220的底面221b。此外，電路板230具有對應光電轉換模組210之第一組裝部211a的一第二組裝部231。在本實施例中，第一組裝部211a與第二組裝部231皆為鎖孔。
撓性導電件222可脫離地抵壓電路板230，而使光電轉換模組210與電路板230電性連接。詳細來說，當光電轉換模組210組裝於電路板230時，撓性導電件222抵靠於電路板230的導電結構(例如金屬墊)而彼此電性連接，同時第一組裝部211a對準於第二組裝部231。接著，將一螺絲30鎖固於第一組裝部211a與第二組裝部231，而使第一組裝部211a緊固於第二組裝部231。此時，撓性導電件222抵壓電路板230而緊密接觸電路板230的導電結構。當要拆卸光電轉換模組210時，只需鬆開螺絲30，即能分開光電轉換模組210與電路板230。
本實施例以第一組裝部211a與第二組裝部231經由螺絲30鎖固為例，但本發明並不以此為限。在其他實施例中，第一組裝部211a與第二組裝部231可以透過卡扣方式或黏貼方式相互固定。
綜上所述，本發明所揭露的光收發器中，光電轉換模組經由中介層板與撓性導電件電性連接於電路板。由於光電轉換模組沒有焊接或黏合於電路板上，因此光電轉換模組能夠與電路板快速組裝，同時也能夠快速拆卸。此外，由於只需經由中介層板電性連接，因此不需要額外設置撓性電路板等轉接元件。藉此，有助於減少組裝工時，同時達到方便拆卸、避免佔據過多光收發器內部空間的目的。本發明所揭露的光收發器簡化組裝步驟，可提升生產及維修效益。
雖然本發明以前述之實施例揭露如上，然其並非用以限定本發明。在不脫離本發明之精神和範圍內，所為之更動與潤飾，均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。
1‧‧‧光收發器
10‧‧‧外殼
20‧‧‧電子組件
30‧‧‧螺絲
210‧‧‧光電轉換模組
211‧‧‧殼體
212‧‧‧光元件
213‧‧‧容置空間
211a‧‧‧第一組裝部
220‧‧‧中介層板
221‧‧‧板體
221a‧‧‧頂面
221b‧‧‧底面
221c‧‧‧穿孔
222‧‧‧撓性導電件
222a‧‧‧彈片
223‧‧‧導電結構
223a‧‧‧第一水平導電段
223b‧‧‧第二水平導電段
223c‧‧‧垂直導電段
230‧‧‧電路板
231‧‧‧第二組裝部
圖1為根據本發明一實施例之光收發器的立體示意圖。 圖2為圖1之光收發器之電子組件的分解示意圖。 圖3為圖2之電子組件之光電轉換模組的剖切示意圖。 圖4為圖1之光收發器之電子組件的剖切示意圖。
30‧‧‧螺絲
211‧‧‧殼體
212‧‧‧光元件
213‧‧‧容置空間
211a‧‧‧第一組裝部
220‧‧‧中介層板
221‧‧‧板體
221a‧‧‧頂面
221b‧‧‧底面
221c‧‧‧穿孔
222‧‧‧撓性導電件
222a‧‧‧彈片
223‧‧‧導電結構
223a‧‧‧第一水平導電段
223b‧‧‧第二水平導電段
223c‧‧‧垂直導電段
230‧‧‧電路板
231‧‧‧第二組裝部

Claims (8)

  1. 一種光收發器，包含：一光電轉換模組；一中介層板，設置於該光電轉換模組，該中介層板包含一板體以及一撓性導電件，該撓性導電件設置於該板體，且該光電轉換模組電性連接於該撓性導電件；以及一電路板，設置於該中介層板的一側，該撓性導電件可脫離地抵壓該電路板，且該撓性導電件與該電路板電性連接。
  2. 如申請專利範圍第1項所述之光收發器，其中該撓性導電件包含多個彈片。
  3. 如申請專利範圍第1項所述之光收發器，其中該光電轉換模組具有一容置空間，該中介層板的該板體設置於該容置空間，該中介層板的該板體具有相對的一頂面以及一底面，該頂面面向該容置空間，該底面面向該電路板，且該撓性導電件設置於該底面。
  4. 如申請專利範圍第3項所述之光收發器，其中該撓性導電件未設置於該板體的該頂面。
  5. 如申請專利範圍第3項所述之光收發器，其中該中介層板更包含一導電結構，該板體具有一穿孔，該穿孔的相對二端分別位於該頂面與該底面，該導電結構設置於該頂面、該穿孔的內壁面與該底面，該撓性導電件經由該導電結構電性連接於該光電轉換模組。
  6. 如申請專利範圍第3項所述之光收發器，其中該光電轉換模組包含一殼體以及一光元件，該殼體具有該容置空間，該光元件設置於該容置空間，且該光元件電性連接於該中介層板之該板體的該頂面，該光電轉換模組之該光元件電性連接於該撓性導電件。
  7. 如申請專利範圍第1項所述之光收發器，其中該光電轉換模組具有一第一組裝部，該電路板具有對應該第一組裝部的一第二組裝部，該第一組裝部緊固於該第二組裝部，而使該撓性導電件與該電路板緊密接觸。
  8. 如申請專利範圍第1項所述之光收發器，其中該光電轉換模組與該電路板分別具有一鎖孔，該撓性導電件經由該二鎖孔與該電路板緊密接觸。
TW106107126A 2017-03-03 2017-03-03 光收發器 TWI617854B (zh)

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TW106107126A TWI617854B (zh) 2017-03-03 2017-03-03 光收發器
US15/880,051 US10429600B2 (en) 2017-03-03 2018-01-25 Optical transceiver

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160039B2 (en) * 2004-01-26 2007-01-09 Jds Uniphase Corporation Compact optical sub-assembly with integrated flexible circuit
TWI297787B (zh) * 2005-07-29 2008-06-11 Ind Tech Res Inst
US8057109B2 (en) * 2008-05-20 2011-11-15 Finisar Corporation Transceiver module with dual printed circuit boards
TW201333570A (zh) * 2012-02-13 2013-08-16 Hon Hai Prec Ind Co Ltd 光電連接器及光電傳輸方法
CN205941986U (zh) * 2016-04-27 2017-02-08 富士康(昆山)电脑接插件有限公司 光电收发器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8355259B2 (en) * 2009-12-04 2013-01-15 International Business Machines Corporation Demountable dry connection for flexible circuits to circuit boards
US8274798B2 (en) * 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same
JP2017050261A (ja) * 2015-09-04 2017-03-09 富士通株式会社 光モジュールコネクタ及びプリント基板アセンブリ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160039B2 (en) * 2004-01-26 2007-01-09 Jds Uniphase Corporation Compact optical sub-assembly with integrated flexible circuit
TWI297787B (zh) * 2005-07-29 2008-06-11 Ind Tech Res Inst
US8057109B2 (en) * 2008-05-20 2011-11-15 Finisar Corporation Transceiver module with dual printed circuit boards
TW201333570A (zh) * 2012-02-13 2013-08-16 Hon Hai Prec Ind Co Ltd 光電連接器及光電傳輸方法
CN205941986U (zh) * 2016-04-27 2017-02-08 富士康(昆山)电脑接插件有限公司 光电收发器

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US10429600B2 (en) 2019-10-01
TW201833611A (zh) 2018-09-16

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